CN106735880A - The cutting method and cutter sweep of a kind of flexible display panels - Google Patents
The cutting method and cutter sweep of a kind of flexible display panels Download PDFInfo
- Publication number
- CN106735880A CN106735880A CN201710025010.4A CN201710025010A CN106735880A CN 106735880 A CN106735880 A CN 106735880A CN 201710025010 A CN201710025010 A CN 201710025010A CN 106735880 A CN106735880 A CN 106735880A
- Authority
- CN
- China
- Prior art keywords
- motherboard
- display panels
- flexible display
- transmission film
- cutting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The present invention provides the cutting method and cutter sweep of a kind of flexible display panels, and it is comprised the following steps：Motherboard is placed in motherboard placement region with the transmission of transmission film according to prefixed time interval, motherboard is cut into multiple flexible display panels on motherboard cutting zone；And, multiple flexible display panels are transferred on predeterminated position on panel transport zone；Wherein, a viscous layer is provided with transmission film, for bonding motherboard with transmission film.The cutting method and cutter sweep of flexible display panels of the invention, the motherboard of flexible display panels is placed on a transmission film by according to prefixed time interval, and motherboard is cut by laser on the transmission film, multiple flexible display panels are transferred on predeterminated position again after the completion of cutting, wherein, a viscous layer is provided with transmission film, for bonding motherboard with transmission film, continuous, stabilization motherboard cutting processing procedure can be realized, production efficiency is improve.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of flexible display panels cutting method and cutter sweep.
Background technology
With developing rapidly for Display Technique, flexible display panels are due to slim light weight, drop resistant, flexible, power and energy saving
The advantages of obtain the favor of numerous users, it has also become the focus of research recently.
The manufacturing process of existing flexible display panels is typically to flexible display panels by the way of break bar machine cuts
Motherboard cut, but, with product specification requirement gradually step up, laser cutting gradually replace break bar machine cuts,
For being cut to motherboard.However, the technique that existing use laser is cut to motherboard, its processing procedure is unstable, and
Low production efficiency.
Therefore, it is necessary to the cutting method and cutter sweep of a kind of flexible display panels are provided, are deposited with solving prior art
Problem.
The content of the invention
It is existing to solve it is an object of the invention to provide the cutting method and cutter sweep of a kind of flexible display panels
Flexible display panels cutting technique processing procedure is unstable, and low production efficiency technical problem.
The present invention provides a kind of cutting method of flexible display panels, for being transmitted flexible display panels on film one
Motherboard is cut, wherein, the transmission film includes motherboard placement region, motherboard cutting zone and panel transport zone, institute
Cutting method is stated to comprise the following steps：
The motherboard is placed in the motherboard placement region according to prefixed time interval；
With the transmission of the transmission film, the motherboard is cut into multiple flexibilities on the motherboard cutting zone
Display panel；And,
Multiple flexible display panels are transferred on predeterminated position on the panel transport zone；Wherein,
A viscous layer is provided with the transmission film, for bonding the motherboard with the transmission film.
In the cutting method of flexible display panels of the invention, the motherboard top is provided with upper protective film, described
According to before the step that be placed on the motherboard in the motherboard placement region by prefixed time interval, also include：
Peeled off by the motherboard and for carrying the bearing substrate of the motherboard；
The diaphragm under the lower section laminating of the motherboard.
In the cutting method of flexible display panels of the invention, the motherboard and institute are peeled off by the way of laser lift-off
State bearing substrate.
In the cutting method of flexible display panels of the invention, the viscous layer is glue-line, and the thickness of the glue-line is situated between
Between 1-10 microns.
In the cutting method of flexible display panels of the invention, the thickness of the transmission film is between 50-200 microns
Between.
In the cutting method of flexible display panels of the invention, on the motherboard cutting zone, can be by least one
Group laser cuts to the motherboard.
In the cutting method of flexible display panels of the invention, cut mark, the laser are provided with the motherboard
Aligned by the cut mark.
In the cutting method of flexible display panels of the invention, it is described on the panel transport zone by described in multiple
Flexible display panels are transferred to the step on predeterminated position, including：
When a side of the flexible display panels is sent to one end of the transmission film, then by the Flexible Displays face
Plate is transferred on the predeterminated position.
According to above-mentioned purpose of the invention, a kind of cutter sweep is also provided, it is used for Flexible Displays on a transmission film
The motherboard of panel is cut, wherein, the transmission film includes motherboard placement region, motherboard cutting zone and panel transition range
Domain, the cutter sweep includes：
Motherboard placement unit, for the motherboard to be placed on into motherboard placement region according to prefixed time interval；
Motherboard cutter unit, for the motherboard to be cut into multiple Flexible Displays on the motherboard cutting zone
Panel；
Multiple flexible display panels are transferred to predeterminated position by panel buanch unit on the panel transport zone
On；Wherein,
A viscous layer is provided with the transmission film, for bonding the motherboard with the transmission film.
In cutter sweep of the invention, the cutter sweep also includes a stripping unit, its be used for the motherboard and
Bearing substrate for carrying the motherboard is peeled off；
The cutting method and cutter sweep of flexible display panels of the invention, by according to prefixed time interval that flexibility is aobvious
Show that the motherboard of panel is placed on a transmission film, and motherboard is cut by laser on the transmission film, after the completion of cutting again
Multiple flexible display panels are transferred on predeterminated position, wherein, transmission film on be provided with a viscous layer, for bond motherboard with
Transmission film, it is possible to achieve continuous, stabilization motherboard cutting processing procedure, improves production efficiency.
It is that the above of the invention can be become apparent, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, make
Describe in detail as follows：
Brief description of the drawings
Below in conjunction with the accompanying drawings, described in detail by specific embodiment of the invention, technical scheme will be made
And other beneficial effects are apparent.
The step of cutting method of the flexible display panels that Fig. 1 is provided for the preferred embodiment of the present invention schematic flow sheet；
Fig. 2 be flexible display panels provided in an embodiment of the present invention cutting method in transfer assembly schematic diagram；
Fig. 3 be flexible display panels provided in an embodiment of the present invention cutting method in the mistake cut to a motherboard
Journey schematic diagram.
Specific embodiment
Further to illustrate technological means and its effect that the present invention is taken, it is preferable to carry out below in conjunction with of the invention
Example and its accompanying drawing are described in detail.Obviously, described embodiment is only a part of embodiment of the invention, rather than whole
Embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art institute under the premise of creative work is not made
The every other embodiment for obtaining, belongs to the scope of protection of the invention.
Refering to Fig. 1, flow is shown the step of the cutting method of the flexible display panels that Fig. 1 is provided for the preferred embodiment of the present invention
It is intended to.
As shown in figure 1, the preferred embodiment of the present invention provides a kind of cutting method of flexible display panels, for being passed one
The motherboard of flexible display panels is cut on film feeding, wherein, the transmission film includes motherboard placement region, motherboard cutting zone
And panel transport zone, the cutting method comprises the following steps：
, be placed on motherboard in motherboard placement region according to prefixed time interval by step S101；
Step S102, with the transmission of transmission film, multiple Flexible Displays faces is cut on motherboard cutting zone by motherboard
Plate；
, be transferred to multiple flexible display panels on predeterminated position on panel transport zone by step S103.
The cutting method of flexible display panels of the invention, it cuts by transmission film to motherboard, using biography
The transmission of film feeding, realizes the cutting of the motherboard of continous way multiple flexible display panels, improves production efficiency.In addition, the transmission
A viscous layer is provided with film, for bonding motherboard with transmission film so that when being cut to motherboard, whole cutting process is more
Plus stabilization.
Refering to Fig. 2, Fig. 2 be flexible display panels provided in an embodiment of the present invention cutting method in transfer assembly illustrate
Figure.
As shown in Fig. 2 this preferred embodiment cuts on a transmission film 204 to motherboard.The transfer assembly includes the
One roller 201, the second roller 202, transmission film 203 and viscous layer 204, wherein, the transmission film 203 is arranged on the first roller
201 and second on roller 202, has certain distance between the roller 202 of the first roller more than 201 second, by the first roller 201
With the rotation of the second roller 202 so that transmission film 203 is driven, in addition, being provided with viscous layer in transmission film 203 Shanghai
204, the viscous layer 204 is used to bond motherboard with transmission film 204 when being placed on motherboard on transmission film 203.
The thickness of the transmission film and the thickness of viscous layer can be configured according to actual process parameter.Preferably, the biography
Between 50-200 microns, the viscous layer can be glue-line to the thickness of film feeding, and the thickness of the glue-line is between 1-10 microns.
The transmission film 203 includes motherboard placement region 2031, motherboard cutting zone 2032 and panel transport zone 2033.
It should be noted that the motherboard placement region 2031, motherboard cutting zone 2032 and panel transport zone 2033 be not with transmission
The transmission of film 203 and move.
With reference to Fig. 3, the cutting method to flexible display panels provided in an embodiment of the present invention is described in detail.Figure
3 is the process schematic cut to a motherboard in the cutting method of flexible display panels provided in an embodiment of the present invention.
When the motherboard for carrying out flexible display panels cuts, first, by motherboard 301 and for carrying holding for motherboard 301
Carried base board (not indicated in figure) is peeled off.Specifically, motherboard 301 is irradiated from bearing substrate side using laser so that the carrying base
Plate is peeled off from motherboard 301.Then, the diaphragm (not indicated in figure) under the lower section laminating of motherboard 301.It should be noted that
Before being peeled off, motherboard top has posted upper protective film, after motherboard and bearing substrate are peeled off, then motherboard with hold
The lower diaphragm of laminating in the one side of carried base board laminating.So can be with Simplified flowsheet step, it is to avoid motherboard is cut into multiple flexibilities
After display panel, then the diaphragm under laminating in each flexible display panels.
Then, in step S101, motherboard 301 is placed on 2031 in motherboard placement region according to prefixed time interval.
Specifically, can be continual that motherboard 301 is placed in motherboard placement region 2031 by setting a prefixed time interval, need
It should be noted that the prefixed time interval is sent to motherboard cutting zone 2032 for motherboard 301 from motherboard placement region 2031
Time.In this manner it is achieved that continous way multiple production, improve production efficiency.
Then, in step s 102, with the transmission of transmission film 203, motherboard 301 is cut on motherboard cutting zone 2031
It is cut into multiple flexible display panels 302.Specifically, can be by least one set of laser to motherboard on motherboard cutting zone 2031
301 are cut, wherein, cut mark is provided with the motherboard 301, laser is aligned by cut mark and cut.
Finally, multiple flexible display panels 302 are transferred on predeterminated position on panel transport zone 2033.Specifically
Ground, when a side of flexible display panels 302 is sent to one end of transmission film 203, then flexible display panels 302 is transferred to
On predeterminated position.
A cutting for motherboard is thus completed, the present invention is by constantly repeating the above steps so that motherboard cutting technique
More stablize, it is in hgher efficiency.
The cutting method of the flexible display panels of this preferred embodiment, by according to prefixed time interval by Flexible Displays face
The motherboard of plate is placed on a transmission film, and motherboard is cut by laser on the transmission film, will be many again after the completion of cutting
Individual flexible display panels are transferred on predeterminated position, wherein, a viscous layer is provided with transmission film, for bonding motherboard with transmission
Film, it is possible to achieve continuous, stabilization motherboard cutting processing procedure, improves production efficiency.
The present invention also provides a kind of cutter sweep, and it is used to be cut the motherboard of flexible display panels on a transmission film
Cut, wherein, the transmission film includes motherboard placement region, motherboard cutting zone and panel transport zone, the cutter sweep
Including：Motherboard placement unit, motherboard cutter unit, panel buanch unit and glass unit.Motherboard placement unit, for according to
The motherboard is placed on motherboard cutter unit in motherboard placement region by prefixed time interval, in the motherboard cutting zone
On the motherboard is cut into multiple flexible display panels；Panel buanch unit, will be many on the panel transport zone
The individual flexible display panels are transferred on predeterminated position；Wherein, a viscous layer is provided with the transmission film, for bonding
Motherboard is stated with the transmission film.
The cutter sweep also includes a stripping unit, and it is used for the motherboard and carrying for carrying the motherboard
Strippable substrate.
The step of cutter sweep of the invention cuts to the motherboard of flexible display panels is in above-mentioned Flexible Displays face
It is described in detail in the cutting method of plate, specifically can refer to the preferred embodiment of the cutting method of above-mentioned flexible display panels
Description, will not be repeated here.
The cutter sweep of flexible display panels of the invention, by according to prefixed time interval by the mother of flexible display panels
Plate is placed on a transmission film, and motherboard is cut by laser on the transmission film, again will be multiple flexible after the completion of cutting
Display panel is transferred on predeterminated position, wherein, a viscous layer is provided with transmission film, for bonding motherboard and transmission film, can
To realize that continuous, stabilization motherboard cuts processing procedure, production efficiency is improve.
To sum up, although the present invention it is disclosed above with preferred embodiment, but above preferred embodiment and be not used to limitation this
Invention, one of ordinary skill in the art without departing from the spirit and scope of the present invention, can make various changes and retouching,
Therefore protection scope of the present invention is defined by the scope that claim is defined.
Claims (10)
1. a kind of cutting method of flexible display panels, it is characterised in that on a transmission film by flexible display panels
Motherboard is cut, wherein, the transmission film includes motherboard placement region, motherboard cutting zone and panel transport zone, institute
Cutting method is stated to comprise the following steps：
The motherboard is placed in the motherboard placement region according to prefixed time interval；
With the transmission of the transmission film, the motherboard is cut into multiple Flexible Displays on the motherboard cutting zone
Panel；And,
Multiple flexible display panels are transferred on predeterminated position on the panel transport zone；Wherein,
A viscous layer is provided with the transmission film, for bonding the motherboard with the transmission film.
2. the cutting method of flexible display panels according to claim 1, it is characterised in that the motherboard top is provided with
Upper protective film, before the step being placed on the motherboard in the motherboard placement region according to prefixed time interval,
Also include：
Peeled off by the motherboard and for carrying the bearing substrate of the motherboard；
The diaphragm under the lower section laminating of the motherboard.
3. the cutting method of flexible display panels according to claim 2, it is characterised in that by the way of laser lift-off
The motherboard is peeled off with the bearing substrate.
4. the cutting method of the flexible display panels according to right 1, it is characterised in that the viscous layer is glue-line, described
The thickness of glue-line is between 1-10 microns.
5. the cutting method of flexible display panels according to claim 1, it is characterised in that the thickness of the transmission film is situated between
Between 50-200 microns.
6. the cutting method of flexible display panels according to claim 1, it is characterised in that in the motherboard cutting zone
On, the motherboard can be cut by least one set of laser.
7. the cutting method of flexible display panels according to claim 6, it is characterised in that be provided with the motherboard and cut
Mark is cut, the laser is aligned by the cut mark.
8. the cutting method of flexible display panels according to claim 1, it is characterised in that described in panel transfer
Multiple flexible display panels are transferred to the step on predeterminated position on region, including：
When a side of the flexible display panels is sent to one end of the transmission film, then the flexible display panels are turned
Move on the predeterminated position.
9. a kind of cutter sweep, it is characterised in that for being cut the motherboard of flexible display panels on a transmission film, its
In, the transmission film includes motherboard placement region, motherboard cutting zone and panel transport zone, and the cutter sweep includes：
Motherboard placement unit, for the motherboard to be placed on into motherboard placement region according to prefixed time interval；
Motherboard cutter unit, for the motherboard to be cut into multiple Flexible Displays faces on the motherboard cutting zone
Plate；
, be transferred to multiple flexible display panels on predeterminated position on the panel transport zone by panel buanch unit；
Wherein,
A viscous layer is provided with the transmission film, for bonding the motherboard with the transmission film.
10. cutter sweep according to claim 9, it is characterised in that also including a stripping unit, it is used for the mother
Plate and the bearing substrate stripping for carrying the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710025010.4A CN106735880A (en) | 2017-01-13 | 2017-01-13 | The cutting method and cutter sweep of a kind of flexible display panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710025010.4A CN106735880A (en) | 2017-01-13 | 2017-01-13 | The cutting method and cutter sweep of a kind of flexible display panels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106735880A true CN106735880A (en) | 2017-05-31 |
Family
ID=58945422
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710025010.4A Pending CN106735880A (en) | 2017-01-13 | 2017-01-13 | The cutting method and cutter sweep of a kind of flexible display panels |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110204187A (en) * | 2018-02-28 | 2019-09-06 | 鸿富准精密工业(深圳)有限公司 | Laser cutting device |
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Application publication date: 20170531 |