CN1496799A - Cutting method of prittle material base plate, its devive and processing device - Google Patents
Cutting method of prittle material base plate, its devive and processing device Download PDFInfo
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- CN1496799A CN1496799A CNA2003101006331A CN200310100633A CN1496799A CN 1496799 A CN1496799 A CN 1496799A CN A2003101006331 A CNA2003101006331 A CN A2003101006331A CN 200310100633 A CN200310100633 A CN 200310100633A CN 1496799 A CN1496799 A CN 1496799A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
To suppress the formation of an irregular form in a disruption face at the time of breaking a brittle substrate, and to prevent the formation of a crack in a laminated substrate when the brittle substrate is broken. A rubber plate 22 and a stainless plate 23 are provided on a table 21. A glass substrate 24 to be broken, having a scribe line, is arranged on their upper part. Stoppers 25 each having a height nearly equal to the glass substrate 24 are arranged at both sides of the glass substrate 24, and according to the scribe line, pressing is carried out with a breaking bar 27 from upper part. By this method, the deformation of the disruption face can be inhibited because the deformation state of the glass substrate 24 is reflected on the rubber plate 22 and the stainless plate 23.
Description
Technical field
The brittle substrates such as the glass that is used for flat pannel display, silicon, pottery that the present invention relates to form line cut off the cutting-off method and the shut-off device of usefulness and the processing unit (plant) that blocks brittle base along its line.
Background technology
In the following description, be that example describes brittle base with the glass substrate.
In the prior art.The method for cutting of monolithic glass substrate for example patent documentation 1 is described, at first, in crossed process, forms line on glass substrate.Secondly, in cutting off operation, block glass substrate along the line that is formed on the glass substrate.
Figure 11 (a) and (b) are expression synoptic diagram to monolithic glass base board cutting operation.
At first, in chalker 1, glass substrate 3 is configured on the worktable 2.Then, with respect to glass substrate 3, be that the cutting wheel 4 at obtuse angle is pressed on the glass substrate 3 with the pressure of regulation with the tip, by cutting wheel 4 being rotated applying, on the surface of glass substrate 3, form line S.
Secondly, shown in Figure 11 (b), make the pros and cons upset of glass substrate 3, the centre places glass substrate 3 on the worktable 6 of shut-off device 5 via rubber plate 7 and stainless steel plate (SUS plate) as cushion plate.With glass substrate 3 be configured in make bar-shaped cut-out bar 9 along be positioned at glass substrate 3 below the position of subtend of line S on.And, by the driving of cylinder 10, make and cut off bar 9 declines, push glass substrate 3 from the top along line S.Like this, by with cutting off bar 9 pushings, glass substrate 3 bends to the V font slightly on elastomeric rubber plate 7, and S applies bending moment along line, makes the vertical crackle elongation that is formed under the line S, and S cuts off along line.
Figure 12 is the cutting method of schematically representing the sticking glass substrate of parent base plate of liquid crystal panel etc.
1. Figure 12 (a)
In chalker 1, the glass substrate A with respect to the upside of the glass substrate 11 that two glass substrates of A, B are pasted utilizes cutting wheel 4 to form line S.
2. Figure 12 (b)
Make after the pros and cons upset of glass substrate 11 of stickup, sticking glass substrate 11 is remained on the worktable of shut-off device 5, with respect to the glass substrate B of sticking glass substrate 11, cut off bar 9 along the line S pushing that is formed on the glass substrate A, along line S the glass substrate A of downside is cut off.
3. Figure 12 (c)
Sticking glass substrate 11 is turned back to chalker 1, on glass substrate B, form line S ' with cutting wheel 4.In addition, under the situation of liquid crystal panel, owing on an end of glass substrate, form terminal, so the line of two glass substrate A and B is the formation mutually of its position with staggering.
4. Figure 12 (d)
With the pros and cons upset of sticking glass substrate 11, make it to turn back to shut-off device 5 once more, cut off bar 9 along the line S ' pushing that is formed on the glass substrate B, the glass substrate B of downside is cut off along line S ' with respect to glass substrate A.
[patent documentation 1]
The spy opens the 2002-103295 communique
Yet, in utilizing the cutting-off method of this shut-off device, exist following problem.With Figure 13 these problems are described below.Figure 13 is the simple synoptic diagram of variety of issue of dissengaged positions that the shut-off device of prior art diagrammatically is described.At first, glass substrate is not plane completely, and fluctuating is to a certain degree arranged from the teeth outwards.In addition, even the plane precision of worktable is very high, owing to dispose glass substrate via stainless steel plate and rubber plate at an upper portion thereof, so the Flatness on the surface of the stainless steel plate of mounting glass substrate also becomes the state of variation.Thereby, because its Flatness of surface of the glass substrate when cutting off glass substrate is poor, and keeps the ripple substrate in the mode with fluctuating to a certain degree, so, the state of Flatness difference become.And, also have bending and fluctuating owing to cut off bar itself, so, shown in Figure 13 (a), exist the shortcoming that glass substrate blocks with being tilted.In addition, can not be pressurizeed equably owing to cutting off bar and glass substrate, so, shown in Figure 13 (b), with a plurality of position 12a, the 12b of substrate ..., 12d is starting point, vertical crack is along the line development, so, on the cross section of the glass substrate that cuts off, produce fluctuating.And then, owing to produce the position that is pressed into glass substrate with the cut-out bar partly powerfully, so, shown in Figure 13 (c), when substrate A of adhesive substrate is cut off, can be cut to uncrossed another substrate B place always, exist and produce the shortcoming that what is called is split phenomenon altogether.
The objective of the invention is, provide a kind of this brittle base can not block with being tilted, also can be not that starting point is cut off, when cutting off adhesive substrate, can not produce shut-off device and the cutting-off method that splits phenomenon altogether with a plurality of positions.
Summary of the invention
Being characterized as of the cutting-off method of the application's technical scheme 1, in the flexure strip of worktable superimposed layer ground configuration specific thickness and rigid, the configuration brittle substrate, the thickness block about equally of configuration height and aforementioned brittle substrate around brittle substrate, can side by side push aforementioned brittle substrate basically and be located at the block of its both sides with respect to the aforementioned worktable maintained cut-out bar in ground that vertically moves up and down by utilizing, cut off aforementioned brittle base.
Being characterized as of the shut-off device of the brittle substrate of the application's technical scheme 2, comprise: worktable, be arranged on the flexure strip of the specific thickness on the worktable, be located at specific thickness on the aforementioned flexure strip rigid, height be located at conduct on aforementioned rigid cut off object brittle substrate thickness about equally, and be configured in block on around the aforementioned brittle substrate aforementioned rigid, but keep with respect to aforementioned worktable easy on and off motion ground, basically side by side push aforementioned brittle substrate and the cut-out bar of being located at the aforementioned block of its both sides.
Being characterized as of the application's technical scheme 3, in the shut-off device of technical scheme 2 described brittle substrates, also comprise the lid that covers aforementioned brittle substrate and aforementioned block, and be connected on the aforementioned cover, the vacuum attraction portion of the chip of the brittle substrate after attracting to cut off.
Being characterized as of the processing unit (plant) of the brittle substrate of the application's technical scheme 4, comprise chalker, shut-off device, with the e Foerderanlage that aforementioned brittle substrate upset is carried, wherein, chalker has the worktable that keeps brittle base and to remaining on that brittle substrate on the aforementioned worktable applies the pressure of regulation and the cutting wheel that forms line, cutting unit has worktable, be arranged on the flexure strip of the specific thickness on the worktable, be located at specific thickness on the aforementioned flexure strip rigid, height be located at conduct on aforementioned rigid cut off object brittle substrate thickness about equally, and be configured in block on around the aforementioned brittle substrate aforementioned rigid, can keep with respect to aforementioned worktable easy on and off motion ground, basically push aforementioned brittle substrate simultaneously and be located at the cut-out bar of the aforementioned block around it.
Description of drawings
Fig. 1 is the front view of expression according to the major portion of the shut-off device of form of implementation 1 of the present invention.
Fig. 2 is the skeleton view according to the shut-off device of this form of implementation.
Fig. 3 is the substrate-placing that will be rule by right-angled intersection of expression on the worktable of the shut-off device of this form of implementation the time, the vertical view of the state when this substrate cuts off.
Fig. 4 is expression and relevant various forms of sectional views of material according to the block of this form of implementation.
Fig. 5 is expression and relevant various forms of vertical views of shape according to the block of this form of implementation.
Fig. 6 (a) is the vertical view of the state of shut-off device when cutting off of this form of implementation of expression, and Fig. 6 (b) is the synoptic diagram of the form of distortion of its rubber plate of expression and stainless steel plate.
Fig. 7 is the rubber plate of expression glass substrate according to the present invention when cutting off and the simple synoptic diagram of the deformation state of stainless steel plate.
Fig. 8 is the amount of being pressed into of bar is cut off in explanation in the shut-off device of prior art a diagram.
Fig. 9 is according to the sectional view of the shut-off device of the form of implementation of the present invention 2 that is provided with vacuum absorption device.
Figure 10 is the synoptic diagram of the manufacturing procedure of expression when utilizing chalker, shut-off device and e Foerderanlage processing adhesive substrate.
Figure 11 is the glass substrate crossed process of expression prior art and the synoptic diagram that cuts off operation.
Figure 12 is the diagram that makes use-case with respect to the chalker and the shut-off device of adhesive substrate of expression prior art.
Figure 13 is the synoptic diagram of the existing variety of issue of dissengaged positions of the shut-off device of expression prior art.
Embodiment
Fig. 1 is the front view according to the major portion of the shut-off device of form of implementation 1 of the present invention, and Fig. 2 is the skeleton view of shut-off device.As shown in these figures, the worktable 21 of shut-off device 20 is provided with rubber plate 22 and stainless steel plate 23.Rubber plate 22 for example thickness is 2～6mm, and stainless steel plate 23 for example thickness is 0.7～4mm.In addition, the open pore of a plurality of attractions and fixing glass substrate 24 is set on rubber plate 22 and stainless steel plate 23, a plurality of open pores are connected to processing on the not shown vacuum loop on the worktable 21.Simultaneously, become the glass substrate 24 that cuts off object in the top of stainless steel 23 mounting.And then, in this form of implementation, configuration block 25 on the peripheral part that becomes the glass substrate 24 that cuts off object.Shut-off device 20 as shown in Figure 2, the cross section that setting can move freely on the top of worktable 21 is the shaped as frame portion 26 of コ font.Below the top of shaped as frame portion 26, formation can be utilized the cut-out bar 27 of cylinder 28 and worktable 21 easy on and off motion abreast.Employing can freely be adjusted the lowering speed of cutting off bar 27 and cut off bar 27 in bottom stand-by time, is supplied to the structure of the air pressure etc. of the cylinder 28 that the pushing glass substrate uses.In addition, cutting off bar 27 is that the member 27b (vulcanite and NC nylon etc.) that is in the shape of the letter V with the cross section below bar-shaped hardware 27a combines formation.
In addition, worktable 21 can utilize the linear moving mechanism (not shown) to make shut-off device carry out linear reciprocation along fore-and-aft direction and move, and, can along orthogonal each line glass substrate 24 be cut off (blocking) with respect to the glass substrate 24 that forms orthogonal line (cross wire) by rotating mechanism (not shown) half-twist exactly.
Fig. 3 is that expression will be drawn the state of glass substrate 24 mountings on worktable 21 of cross wire, at this moment, block 25 be configured in glass substrate 24 around.
Fig. 4 is the sectional view of expression according to the various forms of the block of this form of implementation.The block 25 that uses in this form of implementation is represented its cross-sectional shape as Fig. 4 (a), can adopt mechanically resistant material 25a such as stainless material or iron.In addition, shown in Fig. 4 (b), also can only will utilize stainless steel (SUS material) or iron mechanically resistant material 25a such as (SK materials) above it, form its below with soft material 25b such as rubber, plastics.And then shown in Fig. 4 (c), whole block also can form with soft material 25b, also can use soft material 25b, below to use mechanically resistant material 25a above shown in Fig. 4 (d).
Fig. 5 is the vertical view according to the various forms of the block of this form of implementation.The global shape of block 25 can be made circle and shaped as frame according to the shape and the cutting-off method of the brittle substrate that cuts off (blocking), various forms such as latticed and thin rectangle shown in Fig. 5 (a)～(d).For example, when a parent base plate of liquid crystal panel cuts out a plurality of liquid crystal panel, can use frame shape block 25A or 25B.In addition, when thin rectangle base plate of liquid crystal panel cuts out a plurality of liquid crystal panel, on stainless steel plate 23, utilize thin OBL block 25C and 25D to cut off (blocking) a plurality of thin rectangular base plate of liquid crystal panel a plurality of thin rectangle base plate of liquid crystal panel mountings.
Simultaneously, select the thickness block 25 about equally of height and glass substrate 24 in advance.When the upper surface with glass substrate 24 is reference plane, the height of block 25 for example+0.01mm～+ scope of 0.05mm in.Simultaneously, when the action of shut-off device begins, at first, cut off the location of bar 27 along ruling, determine cut-out pressure (cylinder pressure), set the fall time of cutting off bar 27 according to the thickness of glass substrate 24.Be set at this fall time cut off after the bar 27 contact glass substrates 24, finish pushing glass substrate 24, up to the time that begins to rise.This time is because of the thickness and the material of glass substrate 24 and be that the substrate of monolithic or the substrate of pasting are different.For example, under the situation of the adhesive substrate that the brittle substrate of 1.1mm is pasted, be set at about 6 seconds.After these prepare to finish, make and cut off bar 27 declines.
Fig. 6 (a) is an expression glass substrate 24 and be located at the block 25 of its side and the vertical view that is formed on the line on the glass substrate 24, and Fig. 6 (b) is an one side with the phantom view of the distortion of cutting off stainless steel plate 23 on the worktable 21 of bar 27 pushing blocks 25 when simultaneously pushing glass substrate 24 and rubber plate 22.When utilize cutting off bar 27 pushing glass substrates 24 and block 25, shown in Fig. 6 (b) like that, utilize the block 25 of the both sides that are positioned at glass substrate 24, middle via stainless steel plate 23, rubber plate 22 is pushed to the below slightly and is deformed.Accompany therewith, the stainless steel plate 23 and the glass substrate 24 on top also are out of shape slightly by the same manner.Simultaneously, because the recoverable deformation of block 25 or rubber plate 22 is cut off bar 27 and is contacted with sheet glass 24.In this state, will cut off bar 27 and further be pressed into,, whereby, glass substrate 24 can be cut off (blocking), obtain extraordinary truncation surface so glass substrate 24 bends to the V font along line by in specific time, applying certain pressure.
Fig. 7 (a) is the synoptic diagram that (blocking) preceding state is cut off glass substrate 24 in expression.Though the pros and cons of glass substrate 24 is processed to very high Flatness, minimum fluctuating is arranged on its pros and cons.Fig. 7 (a) and Fig. 7 (b) represent that turgidly the pros and cons of glass substrate becomes the state of fluctuating.In addition, the tip line of glass substrate (pushing) of expressing cutter bar 27 turgidly becomes the state of fluctuating.When cut off bar 27 contact with block 25 and glass substrate 24, when they are pushed simultaneously, shown in Fig. 7 (b), rubber plate 22 and stainless steel plate 23 distortion, the fluctuating of the rear side of imitation glass substrate 24, and then glass substrate 24 becomes the state that the fluctuating of bar 27 is cut off in imitation.In addition, in the cutting-off process of the substrate of reality, be necessary the state shown in Fig. 7 (b) is kept the regular hour, on block 25 and glass substrate 24, exert pressure.Keep the time of cut-out bar 27 suitably to select by the end that descends according to the material and the thickness of substrate.
Fig. 8 is the diagram of the amount of being pressed into of the cut-out bar in the shut-off device of explanation prior art.As shown in Figure 8, in the device of existent technique, when cutting off (blocking) glass substrate etc., be necessary to set nethermost some position when cutting off bar decline, promptly from the surface of glass substrate 24 to cut off the nethermost point of bar when descending apart from p (amount of being pressed into), therefore, need electromechanical stop.On the other hand, in the present invention since set to cut off bar fall time, carry out the cut-out (blocking) of glass substrate, so need not electromechanical stop.
Utilize this method, under the situation of blocking sticking glass substrates such as parent base plate of liquid crystal panel, cut off bar 27 and relaxed its downtrending owing at first contacting with block 25, so, when cutting off bar 27 declines with the sticking glass substrate contacts, can be because of thrust pressure does not cause impact to the sticking glass substrate, thereby, can prevent to split altogether phenomenon.Particularly, under and high material is made with hardness the situation thin at glass substrate, it is effective will machine construction according to the present invention being used to block processing unit (plant).
In aforesaid form of implementation 1, owing to around glass substrate 24, dispose block 25, so, be trapped on the worktable easily by thin glass fragment (glass cullet) and the cullet that cuts off 24 generations of (blocking) glass substrate.Below the form of implementation of the present invention 2 that addresses this problem is described.
Fig. 9 is the sectional view of shut-off device that is equipped with the form of implementation of the present invention 2 of vacuum absorption device.In this form of implementation 2, as shown in Figure 9, the rectangular-shaped lid 31 that opens wide below utilizing covers the surface of stainless steel plate 23 and the member of being located at the mode constitution equipment of this lip-deep block 25, glass substrate 24.Elastic portion 32 such as rubber are set below this lid 31, hermetic keep the inside of lid.And then, connect vacuum attraction mechanism 33 on the top of lid 31.33 actions of vacuum attraction mechanism are attracted under the situation of glass cullet, as required, if the air of trace is constituted with the mode that attracts object to attract from the open pore of being located on worktable, rubber plate 22 and the stainless steel plate 23, can be with glass cullet and a large amount of the removing of the residue on the worktable after cutting off.
When the cut-out (blocking) of glass substrate 24 finishes, after cut-out, make 33 actions of vacuum attraction mechanism, the glass cullet powder and the chip that produce when utilizing vacuum attraction that glass substrate 24 is cut off (blocking) are removed.Like this, even under the situation that block 25 is set, also can from the surface of stainless steel plate 23, promptly attract to remove by glass cullet that block generation and cullet.
This shut-off device can be used as from the chalker of the last stage of blocking of glass substrate make substrate overturn, the part of processing unit (plant) that a plate base or adhesive substrate are blocked uses.This processing unit (plant) is by aforesaid shut-off device, chalker and the e Foerderanlage of glass substrate upset conveying is constituted.The kind of using in chalker and the prior art is identical, by cutting wheel being pressed against on the glass substrate that is disposed on the pedestal and make it rotation, formation line on substrate.Then, make the substrate overturn (with the pros and cons upset of glass substrate) that forms line after, utilize aforesaid shut-off device to cut off.
Secondly, utilize accompanying drawing that the process of utilizing this processing unit (plant) to block the sticking glass substrates such as substrate of parent liquid crystal panel is described.Figure 10 is the side-view (left side) and the vertical view (right side) of this adhesive substrate, and the order of operation is blocked in expression.At first, sticking glass substrate 41 is made of glass substrate A, B.
At first, use chalker, shown in Figure 10 (a), formation line SA on upside substrate A.Secondly, utilize switching mechanism to make adhesive substrate 41 upsets (with the pros and cons upset) be transported to aforementioned shut-off device, shown in Figure 10 (b), utilize shut-off device substrate A to be cut off along line SA.At this moment, become and have only the intercepted state of substrate A.Secondly, having only under the intercepted state of substrate A, once more adhesive substrate 41 is being transported to chalker (also can be other chalker).Then, shown in Figure 10 (c), formation line SB on another substrate B of adhesive substrate 41.Secondly, utilize switching mechanism to make it to be transported to shut-off device (also can be other shut-off device) after the upset once more, shown in Figure 10 (d), the substrate B of the downside after overturning is cut off, adhesive substrate is blocked along line SB.
In this form of implementation, rubber plate 22 is set, but this rubber plate 22 is so long as get final product than the following vulcanite softish member that constitute to cut off bar on worktable 21, can constitute by flexure strip arbitrarily.In addition,, be not limited to use the stainless steel manufacturing, also can utilize than rigid formation cutting off the high various materials of bar hardness for stainless steel plate 23.
In this form of implementation, as brittle substrate glass substrate is illustrated, but, is not only a slice glass substrate as hard brittle material, also comprise sticking glass substrates such as semiconductor wafer and display panels, ceramic substrate etc.In addition, as adhesive substrate, also comprise parent base plate of liquid crystal panel and PDP (plasma display), LCOS, projector substrate etc.Thereby, can apply the present invention to blocking of described various brittle substrates.
Claims (4)
1, a kind of cutting-off method is characterized by,
In the flexure strip of worktable superimposed layer ground configuration specific thickness and rigid, the configuration brittle substrate,
The thickness block about equally of configuration height and aforementioned brittle substrate around brittle substrate,
Can side by side push aforementioned brittle substrate basically and be located at block around it with respect to the aforementioned worktable maintained cut-out bar in ground that vertically moves up and down by utilizing, cut off aforementioned brittle substrate.
2, a kind of shut-off device of brittle substrate is characterized by, and comprising:
Worktable,
Be arranged on the flexure strip of the specific thickness on the worktable,
Be located at specific thickness on the aforementioned flexure strip rigid,
Height be located at conduct on aforementioned rigid cut off object brittle substrate thickness about equally, and be configured in block on around the aforementioned brittle substrate aforementioned rigid,
But keep with respect to aforementioned worktable easy on and off motion ground, side by side push aforementioned brittle substrate and be located at the cut-out bar of the aforementioned block of its both sides basically.
3, the shut-off device of hard brittle material as claimed in claim 2 is characterized by, and also comprises:
Cover the lid of aforementioned brittle substrate and aforementioned block,
Be connected on the aforementioned cover vacuum attraction portion of the chip of the brittle substrate after attracting to cut off.
4, a kind of processing unit (plant) of brittle substrate is characterized by, and comprises chalker, shut-off device and the e Foerderanlage that aforementioned brittle substrate upset is carried, wherein,
Chalker has the worktable that keeps brittle base, and to remaining on that brittle substrate on the aforementioned worktable applies the pressure of regulation and the cutting wheel that forms line,
Cutting unit has worktable, be arranged on the flexure strip of the specific thickness on the worktable, be located at specific thickness on the aforementioned flexure strip rigid, height be located at conduct on aforementioned rigid cut off object brittle substrate thickness about equally and be configured in block on around the aforementioned brittle substrate aforementioned rigid, can keep with respect to aforementioned worktable easy on and off motion ground, push aforementioned brittle substrate and be located at the cut-out bar of the aforementioned block of its both sides simultaneously basically.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP298424/02 | 2002-10-11 | ||
| JP2002298424A JP4169565B2 (en) | 2002-10-11 | 2002-10-11 | Brittle material substrate break method, apparatus and processing apparatus therefor |
| JP298424/2002 | 2002-10-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1496799A true CN1496799A (en) | 2004-05-19 |
| CN100358694C CN100358694C (en) | 2008-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101006331A Expired - Fee Related CN100358694C (en) | 2002-10-11 | 2003-10-10 | Cutting method of prittle material base plate, its devive and processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4169565B2 (en) |
| KR (1) | KR100924290B1 (en) |
| CN (1) | CN100358694C (en) |
| TW (1) | TWI268206B (en) |
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| JPH03208826A (en) * | 1990-01-12 | 1991-09-12 | Fuji Xerox Co Ltd | Method and jig for cutting brittle plate |
| JP3227800B2 (en) * | 1992-06-30 | 2001-11-12 | 富士ゼロックス株式会社 | Brittle plate cutting method and apparatus |
| JPH09183627A (en) * | 1996-12-25 | 1997-07-15 | Casio Comput Co Ltd | Method for cutting glass and device therefor |
| JP4058542B2 (en) | 1997-05-30 | 2008-03-12 | 三星ダイヤモンド工業株式会社 | Substrate break device, substrate break method, substrate cutting device and substrate cutting system |
| JP4187364B2 (en) * | 1998-09-16 | 2008-11-26 | Ｈｏｙａ株式会社 | Method for cutting plate glass base material, method for producing preform, and plate glass base material cutting device |
| JP2001010834A (en) * | 1999-06-28 | 2001-01-16 | Shirai Tekkosho:Kk | Method and apparatus for folding and cracking liquid crystal panel |
| JP3787489B2 (en) | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | Method and apparatus for breaking brittle substrate |
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2002
- 2002-10-11 JP JP2002298424A patent/JP4169565B2/en not_active Expired - Fee Related
-
2003
- 2003-09-16 TW TW092125423A patent/TWI268206B/en not_active IP Right Cessation
- 2003-09-25 KR KR1020030066421A patent/KR100924290B1/en not_active IP Right Cessation
- 2003-10-10 CN CNB2003101006331A patent/CN100358694C/en not_active Expired - Fee Related
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| CN104942859A (en) * | 2014-03-28 | 2015-09-30 | 三星钻石工业股份有限公司 | Method and device for breaking resin sheet |
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| CN105500100B (en) * | 2014-10-09 | 2018-06-29 | 株式会社京浜 | The method of operation and substrate cut of substrate cut |
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| CN105040994A (en) * | 2015-07-25 | 2015-11-11 | 安徽卡塔门窗有限公司 | Fixed platform for glass window processing |
| TWI610892B (en) * | 2015-09-25 | 2018-01-11 | 三星鑽石工業股份有限公司 | Fragmentation method of brittle substrate |
| CN108687814A (en) * | 2017-03-31 | 2018-10-23 | 三星钻石工业股份有限公司 | The disconnection device and disconnection method of resin sheet |
| CN112388710A (en) * | 2019-08-19 | 2021-02-23 | 维嘉数控科技（苏州）有限公司 | Method and device for cutting edges of board separator, storage medium and board separator |
| CN112388710B (en) * | 2019-08-19 | 2021-07-06 | 苏州维嘉科技股份有限公司 | Method and device for cutting edges of board separator, storage medium and board separator |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040033245A (en) | 2004-04-21 |
| TWI268206B (en) | 2006-12-11 |
| JP2004131341A (en) | 2004-04-30 |
| JP4169565B2 (en) | 2008-10-22 |
| TW200408516A (en) | 2004-06-01 |
| KR100924290B1 (en) | 2009-10-30 |
| CN100358694C (en) | 2008-01-02 |
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