JPH03208826A - Method and jig for cutting brittle plate - Google Patents

Abstract

PURPOSE:To improve precision and yield by forming a specified kerf on one side of a brittle plate, placing a buffer plate thereon, placing a cutting jig consisting of a base plate in which a pattern groove including a specified form is formed and a sleeper on the opposite side and pressing the assembly. CONSTITUTION:A grid-shaped groove 1b, for example, is provided on one side of a brittle base plate 1a of glass, etc., having specified thickness and a columnar sleeper 1c of stainless steel, etc., is placed thereon to constitute a cutting jig 1. A first elastic film 2 of PE, etc., is placed on the jig 1, a brittle plate 3 with a kerf 3a provided thereon is placed on the film 2 so that the surface having the kerf 3a is placed on the opposite side of the surface abutting on the jig 1, and further the kerf 3a is confronted with the sleeper 1c. A second elastic film 4 of PE, etc., is placed on the surface of the plate 3 having the kerf 3a, a buffer plate 5 of acrylic resin, etc., is placed on the film 4. The brittle plate is placed between the upper and lower press jigs 6a and 6b, pressed and uniformly cut with good precision.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method and a cutting jig for cutting a brittle plate used as an IC substrate, a liquid crystal plate, a photomask, a 1-gastric sensor substrate, etc.

(Conventional technology) Conventional methods for cutting brittle plates such as sensor boards include cutting the cut points with a diamond cutter and fusing them with a laser. This not only takes time and reduces cutting efficiency, but also chips from the cutter and heat from the laser.
There were problems such as adverse effects on the sensors on the board.

JP-A-58-19402 discloses a method in which a brittle plate with grooves is sandwiched between elastic membranes and pressed on a press table having protrusions. It is difficult to manufacture a press base with high precision and at low cost, and there are problems in that it cannot accommodate arbitrary changes in the cutting shape.

JP-A No. 64-69534 discloses that a workpiece provided with striations is placed on a flat plate having a Young's modulus smaller than the Young's modulus of the workpiece. A method is disclosed in which a ribbon-shaped pressure piece is placed and a load is applied along the pressure piece to generate a bending moment and break the workpiece. It is difficult to cut both at the same time with high precision.

(Problems to be Solved by the Invention) In IC substrates, sensors, solar cells, etc., thin film products are formed on the substrate by vapor deposition or the like, so a plurality of products are formed on one substrate at the same time. Therefore, after forming these thin films, a step of separating the products into individual products is required. Therefore, a high yield is required when cutting a substrate made of this brittle plate. Furthermore, since thin film products such as sensors have ultra-precise microstructures, care must be taken to prevent them from being damaged during the process. Care must be taken to avoid damage to the product due to chips in the cutting process, damage to the product due to compression in the pressing process, and electrostatic damage due to the accumulation of static electricity during the process.

In addition, these cut products are often subjected to ultra-precise post-processing and then incorporated into ultra-precise mechanisms, so the cut shape such as undulations, surface roughness, and squareness may be affected. Electronics and optoelectronic parts require high precision and are becoming cheaper every year, so of course these parts also need to be lower in price. It has to be something. Additionally, depending on the shape of the product, such as a sensor, it may be necessary to cut into irregular shapes at the same time.

An object of the present invention is to overcome the above-mentioned drawbacks of conventional products and to provide a method and jig for cutting a large number of parts at once from -2 pieces of brittle plate substrates with high precision and high yield. .

Another object of the present invention is to provide a method and a jig for cutting irregularly shaped members simultaneously and accurately from two brittle plate substrates.

Another object of the present invention is to provide an inexpensive jig for cutting brittle plates.

Another object of the present invention is to provide a method for cutting a brittle plate and a jig for the same, which can accommodate various changes in cutting shape.

Another object of the present invention is to provide a method for cutting a brittle plate and a jig therefor, which meet the requirements for cutting a brittle plate used as a substrate for the above-mentioned TPT sensor or the like.

(Means for Solving the Problems) Therefore, the present invention provides a substrate having grooves formed on its surface with a pattern including a shape for cutting a brittle plate, and a substrate placed in the groove according to the shape of the brittle plate to be cut. Using a cutting jig made of pillow material, the brittle plate can be cut into any shape, various types, and sizes.
Or a large number of them can be cut at the same time. Here, the brittle plate refers to glass, ceramics, etc. used for substrates such as sensors.

When cutting a brittle plate using this jig, first, a kerf is created in the shape of the brittle plate using a scribing machine or the like with an ultra-hard tip, a diamond tip, etc.
The cutting jig is placed on a cutting jig made of a substrate having a groove in which a pillow material is placed in accordance with the cutting shape, so that the surface without the groove is in contact with the cutting jig. A buffer plate such as a resin plate is brought into contact with the grooved surface of the brittle plate, and a desired cut is made by sandwiching and pressing these plates. If necessary, a first elastic film such as a resin film is placed between the brittle plate and the cutting jig, and a second elastic film such as a resin film is placed between the buffer plates of the brittle plate.
The elastic membrane may be sandwiched between the two elastic membranes.

(Function) The cutting stress of this cutting method is thought to be due to the combination of the compressive force generated inside the brittle plate at the part where it contacts the pillow material, and the bending moment with the pillow material as a fulcrum.

When cutting a brittle plate, using compressive force alone may require a large force for cutting, force may be required to cut only a portion of the desired brittle plate, or unnecessary portions of the brittle plate may be destroyed. In addition, bending moment alone not only tends to cause waviness, but also tends to cause defects such as chipping and chipping at the cut portion. In addition, the moment depends on the distance from the fulcrum and external force, so if the shape of the cut part placed in a large brittle plate is different, it may not be possible to cut it, and conventionally it was difficult to cut it at the same time. Therefore, it was difficult to deal with cases where long objects were to be cut.

Therefore, it is considered that an ideal cutting method can be obtained when compressive force and moment interact well as in this cutting method.

(Example) Next, examples of the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments shown in the drawings.

FIG. 1 shows a substrate (1a) having a groove (1b) according to the present invention.
) and a pillow material (1c) placed in the groove. The substrate (1a) is provided with a groove pattern that includes a basic pattern for cutting a brittle plate.

In Figure 1, the groove pattern is in the form of a lattice, but it goes without saying that any pattern can be used, and by creating a groove pattern with a simple shape that is easy to process, the efficiency of substrate production can be increased and the cost can be further reduced. can do.

In addition, the cross-sectional structure of the groove is also a figure 7 shape in Fig. 1, but the shape is not limited as long as the placed pillow material protrudes above the substrate as a protrusion, and from the viewpoint of substrate manufacturing efficiency, etc. It can be any shape.

FIG. 2 shows an example of a cutting device using the jig of the present invention, and a cutting method using this device will be explained.

A cutting groove in the desired shape was provided on one side of a 1.1 mm glass substrate (Corning #7059 (trade name)). 1st
As shown in the figure, among the grooves of a steel substrate with 7-shaped grooves in a lattice pattern, place them in the grooves that match the shape of the glass substrate you want to cut.
A cylindrical pillow material made of stainless steel (diameter 2 mm) was placed, a polyethylene film with a thickness of 800 pm was placed on this jig, and the glass substrate with the above-mentioned grooves was placed on top of this.
Place it so that the surface with the grooves is on the opposite side of the surface that will contact the jig, and the grooves correspond to the pillow material. Furthermore, a polyethylene film with a thickness of 3100 pm was placed on the grooved surface of this glass substrate, and an acrylic plate with a thickness of 15 mm was placed on top of this. By sandwiching these between upper and lower press jigs and pressing them, the glass substrate could be cut uniformly and accurately along the kerf.

Next, an example in which a glass plate was cut into the shape shown in FIG. 3 using the same conditions as in this example will be described. As can be seen from the figure, there are many types of shapes, ranging from nearly square shapes to extremely elongated rectangular shapes (for example, 5 mm x 228 mm). In the shape of this,
The parts that are most difficult to break are shown with dashed lines, the parts that usually crack are shown with solid lines, and the parts that are easy to break are shown with broken lines. In order to apply a large load and moment to areas that are difficult to break, a hard material is used as a pillow material, and on the other hand, a soft material is used as a pillow material for areas that are easy to break.
By using the combination of pillow materials as shown below, it was possible to cut all parts uniformly.

Pillow material: Shio ungsten (Young's modulus 24)
．． 0 cutting 03kg/mm2), places where it normally cracks: Stainless steel (Young's modulus: 2, lX
103kg/mm2), easily broken parts: Copper (Young's modulus: 1.l x 103kg
/mm2) (Both are cylindrical with a diameter of 2 mm) In this way, by changing the material of the pillow material depending on the breakability of the brittle board and combining them, the irregular shape can be stabilized.
Since it can cut with high precision, it can easily handle the production of a wide variety of substrates.

In the above-mentioned embodiment, when changing the pillow material, the material is changed, but the outer diameter may be varied to make the diameter of the pillow material slightly thicker in areas where it is difficult to break. This makes it easier to select pillow materials and to choose the optimal combination.

Furthermore, the resistance to cracking can be adjusted by changing the length of the pillow material and whether it is applied to the entire cut portion or only a portion of the cut portion. In this case as well, since it is sufficient to prepare only some standard types of pillow materials, the jig can be made inexpensive and the selection of pillow materials becomes easy. Furthermore, the shape of the pillow material can be changed from cylindrical to prismatic, etc.
Depending on the shape of the groove, the protrusion can be stably formed.

Similarly, in addition to acrylic boards, the material of the cushioning material can be changed to ABS boards, urethane boards, etc. to make them less likely to break, or you can partially combine these materials, or even change the thickness. It is effective in dealing with various brittle plate materials and shapes.

Furthermore, a pillow material coated with an elastic membrane such as resin can also be effectively used. Even when such a pillow material is not used, it has the same effect as when it is used, so the number of necessary parts can be reduced and the cutting method can be simplified.

In this way, when cutting a variety of shape patterns at once, if there are differences in breakability, this can be achieved by selecting the materials, shapes, etc. of the pillow material, buffer board, etc., so a wide range of requirements can be met. can correspond to

In addition, by butting the pillow material in a "1-character" shape, cutting can be stopped mid-way, which was previously impossible (it also became possible to cut in a T-shaped J shape). This dramatically increases the flexibility of cutting shapes and increases the utilization of the device.

Furthermore, in the case of this "T-shaped and J-shaped cutting,"
By processing the pillow material (7) as shown in the figure so that they interlock as shown in FIG. 1, the smoothness of the cut portion becomes more stable and excellent.

It goes without saying that even at locations where the cutting lines intersect, by using this pillow material, a cut portion with superior smoothness can be obtained.

Of course, the shape of the end portions to be engaged is not limited to this one type, and there are various modifications such as a shape in which the top and bottom are slightly extended.

Furthermore, if there is a concern about electrostatic damage to sensors, etc. due to the accumulation of static electricity during processing, electrostatic damage can be prevented by making the first film conductive.

(Effects of the Invention) As described above, according to the method for cutting a brittle plate according to the present invention, it is possible to accurately cut a large number of members from one substrate at a time. Moreover, the substrate of the cutting jig used for this purpose has the advantage that it can be manufactured at a very low cost and with high precision, since it only requires groove machining, unlike a jig that has protrusions provided by machining or the like. Since the groove is processed to include the cutting shape of the plate, the protrusion is formed by the pillow material placed there, and the cutting shape can be changed depending on the presence or absence of the protrusion. It is possible to perform cutting in the shape of .

In addition, if a precision-processed item such as a sensor is installed on a brittle plate, inserting a scribe groove on the opposite side of the surface on which the sensor is placed will prevent the sensor from being damaged by chips during scribing. It is possible to prevent the impact on Furthermore, during pressing, part of the sensor does not come into contact with the cutting jig and is in a floating state, which prevents any adverse effects from pressure. There is no chance of accidentally touching the cutting jig, so it is less likely to get scratched. Further, as described above, since electrostatic damage can be prevented, the brittle plate can be cut without affecting the thin film on the brittle plate.

In this way, in the present invention, a large number of irregularly shaped brittle pieces can be simultaneously produced from a single large substrate with high precision and high yield.
It is now possible to cut efficiently.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a jig for cutting a brittle plate of the present invention, Fig. 2 is an example of a brittle plate cutting device using the jig for cutting a brittle plate of the present invention, and Fig. 3 is a perspective view of a glass substrate to be cut. Examples of Cutting Shapes FIG. 4 shows an example of processing the ends of pillow materials for cutting at intersections. l... Cutting jig, 1a... Substrate, 1b... Groove, 1c... Pillow material, 2... First elastic membrane, 3... Brittle plate, 3a... Cutting Groove, 41.・Second elastic membrane, 5...
, buffer plate, 6a, 6b..., breath jig, 760. Pillow material for cutting at intersections Figure 1 Figure 2

Claims (2)

[Claims] (1) A jig for cutting brittle plates, which consists of a substrate with grooves formed on its surface in a pattern that includes the shape of the brittle plate to be cut, and a pillow material placed in the grooves according to the shape of the brittle plate to be cut. . (2) Forming a cut groove in the shape to be cut on one surface of the brittle plate, placing a buffer plate such as a resin plate on the surface side, and forming the shape to cut the brittle plate on the opposite side. A cutting jig consisting of a substrate with a pattern groove formed on its surface and a pillow material placed in the groove according to the shape of the brittle plate to be cut is placed, and the cutting jig, the brittle plate, and the buffer are placed in the groove. A method for cutting brittle plates that obtains the desired cut by sandwiching the plate from both sides and pressing.