JP2017100924A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device capable of certainly cutting a laminated substrate along scribe lines formed on both faces of the laminated substrate without turning the substrate over, and making effective use of a raw material.SOLUTION: A laminated substrate M is composed of a first substrate 1 with a first scribe line S1 and a second substrate 2 with a second scribe line S2. One section obtained by dividing the laminated substrate M at the two scribe lines S1, S2 is referred to as a first section, while the other section is referred to as a second section. A first supporting member 5 to support the first section and a second supporting member 6 to support the second section are arranged so as to relatively move vertically. The second supporting member 6 thus takes a position to support the second section or another position not to support the second. When the second supporting member 6 takes the position not to support the second section, an impact member 8 collides with the second section from above to cut the laminated substrate M along the scribe lines S1, S2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cutting apparatus for cutting a bonded substrate obtained by bonding a first substrate made of a brittle material and a second substrate. The cutting device of the present invention is used for processing a unit display panel (hereinafter referred to as a unit substrate) of a liquid crystal display panel, for example.

When manufacturing a liquid crystal display panel, two large-area glass substrates, that is, a glass substrate on which an electronic device such as a thin film transistor TFT (Thin Film Transistor) that drives liquid crystal is formed, and a glass substrate on which a counter electrode is formed are provided. Then, a bonded substrate is formed by bonding so as to form a plurality of liquid crystal injection regions via a sealing material. The bonded substrate is divided into unit substrates each including a liquid crystal injection region in the next step (see Patent Document 1).
In the present invention, one glass substrate of the bonded substrate is referred to as a first substrate, and the other glass substrate is referred to as a second substrate.

FIGS. 13 to 15 are diagrams for explaining a conventional method for dividing a liquid crystal display panel disclosed in Patent Document 1 and the like described later. FIG. 13 is a plan view, and FIG. It is sectional drawing along a line.
The first substrate 21 on the upper side and the second substrate 22 on the lower side of the bonded substrate M ′ constituting the liquid crystal display panel are bonded so as to form a plurality of liquid crystal injection regions 24 via a seal material 23. The liquid crystal injection regions 24 are arranged in a lattice pattern, and are surrounded by the sealing material 23 with the liquid crystal injection ports 24a remaining. Spaces H1 and H2 having a constant width are formed between the liquid crystal injection regions 24 along the XY direction. Between the distances H1 and H2, the first scribe line S1 formed on the surface of the first substrate 21 and the second scribe line S2 formed on the surface of the second substrate 22 are formed at the same position in plan view. Yes. The scribe lines S1 and S2 are formed within the intervals H1 and H2 that do not have the seal material 23. If the seal material 23 exists between the scribe lines S1 and S2, the substrate M ′ is bent to cause the first substrate 21 and Even if the scribe lines S1 and S2 of the second substrate 22 are broken, the sealing material 23 has elasticity, so that it cannot be accurately separated at the portion of the sealing material 23, and individual substrates cannot be completely separated from each other. Because. In many cases, the seal material 23 is made of an epoxy resin.

  In the scribing step, scribe lines S1 and S2 are formed along the planned dividing lines on the outer surfaces of the first substrate 21 and the second substrate 22 using a cutter wheel (or laser light). Next, in the breaking step, one of the first substrate 21 and the second substrate 22, for example, the first substrate 21 is on the lower side and the breaker bar or the like is pressed from above to bend the substrate M ′, and the first substrate 21 The crack of the 21st scribe line S1 penetrates in the thickness direction and breaks. Next, in a state where the substrate M ′ is inverted and the second substrate 22 is placed on the lower side, the substrate M ′ is bent in the same manner as described above to break the second scribe line S <b> 2 of the second substrate 22. Thereby, the bonded substrate M ′ is completely separated for each unit substrate M2 ′ (see FIG. 15).

JP 2006-137441 A

In the unit substrate M2 ′ cut out in this way, as shown in FIG. 15, a frame region 25 extending outside the sealing material 23 is left around the unit substrate M2 ′. The frame region 25 is useless because it is not a part that functions as a liquid crystal display panel, and the unit substrate M2 ′ is enlarged only by that part.
In recent years, liquid crystal display panels, particularly mobile liquid crystal display panels, are required to make the frame region 25 as small as possible from the viewpoint of effective use of materials and miniaturization, but the interval H1 without the sealing material 23 described above. In the method of forming a scribe line in H2, there is a limit to the reduction of the frame region 25.
In the above-described prior art, when the second scribe line S2 of the second substrate 22 is broken after the first scribe line S1 of the first substrate 21 is broken, it is necessary to invert the bonded substrate M ′. Such a substrate reversal operation requires a mechanism for reversing the substrate, which increases the size of the apparatus and increases the cost of the apparatus. In addition, the reversing operation takes time, and there is a risk that the substrate may be damaged during the reversing operation, resulting in a decrease in productivity.

  Therefore, in view of the above-described problems, the present invention can divide the first substrate and the second substrate along the scribe line at once without inverting the bonded substrate, and eliminates waste of materials. An object of the present invention is to provide a bonded substrate cutting device that can be effectively used.

  In order to achieve the above object, the present invention takes the following technical means. That is, in the cutting apparatus of the present invention, a bonded substrate formed by bonding a first substrate on the upper side and a second substrate on the lower side, a first scribe line formed on the surface of the first substrate, and the first A cutting device for cutting along the first scribe line on the surface of the two substrates and the second scribe line formed at the same position in plan view, the first scribe line and the second scribe line as a boundary A first support member that supports the first region and a second support member that supports the second region when one region of the bonded substrate is a first region and the other region is a second region. When the first support member and the second support member move relatively up and down, the second support member is displaced between a position where the second region is supported and a position where the second region is not supported. In a state where the second support member does not support the second region, the second support member is caused to collide with the second region from above, and the first scribe line and the second scribe line are moved along the first scribe line. It was set as the structure provided with the impact member which isolate | separates two area | regions from said 1st area | region.

  According to the present invention, both the first scribe line and the second scribe line formed on the first substrate and the second substrate of the bonded substrate can be divided at a stroke by collision of the impact member. It is possible to omit the complicated reversing operation of reversing the substrate after breaking the scribe line and breaking the scribe line of the other substrate, thereby shortening the working time and improving the working efficiency, Thus, the device can be made compact. Also, the risk of damaging the substrate during the reversing operation can be eliminated.

In the above invention, the collision by the impact member is preferably performed by free fall of the impact member.
Thereby, the shearing force necessary for dividing the bonded substrate can be easily obtained by the weight of the impact member without using a complicated mechanism.

In the above invention, it is preferable that a pressing member is provided that presses the first region from above to prevent the first region from being lifted when the substrate is divided by the impact member.
Thereby, when the substrate is divided by the impact member, the first region portion can be prevented from being lifted and can be divided accurately.

Moreover, in the said invention, it is set as the structure provided with the break mechanism for penetrating the crack of the 2nd scribe line of said 2nd board | substrate to the whole board thickness prior to the division | segmentation of the bonding board | substrate by the said impact member. Good.
Thereby, the bonded substrate can be divided more reliably and accurately by the impact member.

In the above invention, the first scribe line and the second scribe line may be formed immediately above and directly below a sealing material that bonds the first substrate and the second substrate.
As a result, when a bonded substrate in which a plurality of liquid crystal injection regions are formed with a sealing material as a boundary like a liquid crystal display panel is divided along each scribe line and a unit substrate is taken out, It is possible to reduce the size by eliminating the frame area protruding from the seal member, and to effectively use the material without wasting material.

The side view which shows roughly the cutting device which concerns on this invention. The perspective view which shows the principal part of the cutting device of FIG. Explanatory drawing which shows the 1st step of the cutting process by the cutting apparatus of FIG. Explanatory drawing which shows the 2nd step of the cutting process by the cutting apparatus of FIG. Explanatory drawing which shows the 3rd step of the cutting process by the cutting apparatus of FIG. Explanatory drawing which shows the 4th step of the cutting process by the cutting apparatus of FIG. The top view which shows the bonding board | substrate used as division | segmentation object. AA sectional view taken on the line in FIG. The top view which shows the strip-shaped board | substrate after parting. Sectional drawing which shows the unit board | substrate after parting. Explanatory drawing which shows another Example of this invention. Explanatory drawing which shows operation | movement of the break bar in FIG. The top view which shows the conventional bonded substrate board. BB sectional drawing in FIG. FIG. 14 is a cross-sectional view showing a state of the substrate of FIG.

An embodiment of a cutting device according to the present invention will be described with reference to FIGS.
In this embodiment, the bonded substrate M that constitutes the liquid crystal display panel is to be divided. As shown in FIGS. 7 and 8, the bonded substrate M is bonded so that the upper first substrate 1 and the lower second substrate 2 form a plurality of liquid crystal injection regions 4 with a sealing material 3 interposed therebetween. Configured. The liquid crystal injection regions 4 are arranged in a lattice pattern, and are surrounded by the sealing material 3 in the XY directions. A first scribe line S1 is formed on the surface of the first substrate 1, and a second scribe line S2 is formed on the surface of the second substrate 2. Both of these scribe lines S1 and S2 are formed immediately above and immediately below the intermediate position of the seal material 3 in the XY direction that separates the adjacent liquid crystal injection regions 4. The shape of the sealing material 3 is designed in advance so that the liquid crystal injection port 4a of the liquid crystal injection region 4 is opened when the substrate M is cut along the scribe line in the Y direction.

  The cutting apparatus C according to the present invention includes a first support member 5 and a second support member 6 that move relatively up and down. In the present embodiment, the first support member 5 and the second support member 6 are configured by a belt conveyor, the first support member 5 is the upstream side, the second support member 6 is the downstream side, and the first support member 5 on the upstream side. Then, the bonded substrate M to be divided is transported toward the second support member 6 on the downstream side.

  The first support member 5 and the second support member 6 are disposed at positions close to each other in the horizontal state, and the second support member 6 can be moved downward from this position by a lifting mechanism such as a cylinder 7. Yes.

  An impact member 8 is provided above the second support member 6 at a position near the first support member 5. The impact member 8 is formed long in the belt width direction, and is formed so that it can freely fall vertically by its own weight along the guide 10 from the position lifted by the index string 9. Further, above the first support member 5, a pressing member 11 is provided at a position near the second support member 6 to prevent the substrate M from being lifted at the time of division. Soft sheets 11a, 8a such as urethane for preventing scratches when contacting the surface of the substrate M are attached to the lower surfaces of the pressing member 11 and the impact member 8.

Next, the operation of the cutting device C will be described.
The bonded substrate M on which the first and second scribe lines S1 and S2 have been processed in advance in the preceding scribe process is set so that one of the scribe lines, for example, the scribe line in the X direction is along the belt width direction. It is placed on the support member 5 and conveyed toward the second support member 6 on the downstream side (see FIGS. 1 to 3). Then, as shown in FIG. 4, the transport of the bonded substrate M is stopped when the first scribe lines S <b> 1 and S <b> 2 move to a position slightly away from the first support member 5. At this time, the region supported by the first support member 5 with the scribe lines S1 and S2 of the bonded substrate M as boundaries is referred to as a first region, and the region supported by the second support member 6 is a second region. That's it.

  Next, as shown in FIGS. 5 and 6, the pressing member 11 is lowered to lightly contact the surface of the first region of the bonded substrate M. In this state, when the impact member 8 is freely dropped from the upper standby position, the upper and lower scribe lines S1 and S2 of the bonded substrate M and the sealing material 3 interposed therebetween are simultaneously caused by the shearing force generated by the collision of the free fall. It is divided and the second region is separated from the first region to form a strip-shaped substrate M1 in FIG. At this time, since the first region of the bonded substrate M is pressed by the pressing member 11, it is possible to prevent the first region portion from being lifted at the time of division.

  In this way, the bonded substrate M is sequentially divided into strip-like substrates M1 along the scribe line in the X direction, and then the first support is made so that the scribe line in the Y direction of the strip-like substrate M1 is along the belt width direction. As described above, the strip-shaped substrate M1 is sequentially cut along the scribe line by the impact member 8, and the unit substrate M2 shown in FIG.

  Depending on the material and thickness of the bonded substrate M to be divided, the descending stroke L1 of the second support member 6 at the time of dividing, the own weight of the impact member 8, and the falling stroke L2 are set to preferable values. For example, when the first substrate 1 and the second substrate 2 of the bonded substrate M are glass plates having a thickness of 0.2 to 0.4 mm, the descending stroke L1 of the second support member 6 is 4 to 10 mm, the impact. The descending stroke L2 of the member 8 is preferably 3 to 9 mm. Further, the lowering stroke L2 of the impact member 8 is set in advance so that the impact member 8 stops at a position where it does not contact the surface of the second region dropped on the second support member 6 when the impact member 8 falls to the lowest end. It is good to leave.

As shown in FIG. 10, the unit substrate M2 thus divided can be reduced in size by eliminating the frame region 25 protruding from the seal member 23 as in the conventional unit substrate M2 ′ (see FIG. 15). At the same time, the material can be effectively used without waste.
In addition, the scribe lines S1 and S2 formed on both the first substrate 1 and the second substrate 2 and the middle of the sealing material 3 that separates the adjacent liquid crystal injection regions 4 are divided at once by the impact member 8 dropping. Therefore, a complicated substrate reversing operation such as reversing the substrate after breaking the scribe line of one substrate and breaking the scribe line of the other substrate can be omitted, and the efficiency of the dividing operation can be improved.
In addition, the second region that is cut out by the impact member 8 and becomes the strip-shaped substrate M1 or the unit substrate M2 is dropped onto the second support member 6 and then sequentially transported to the downstream side by the second support member 6, thereby bonding them together. The dividing process of the substrate M can be continuously performed by a flow operation.

  In the present invention, in the above embodiment, the impact member 8 is caused to collide with the bonded substrate M by free fall due to its own weight, so that a shearing force is generated on the substrate M, but a shearing force equivalent to this is generated. If present, the impact member 8 may be lowered by mechanical means such as a press.

Another embodiment of the present invention is shown in FIG.
In this embodiment, a break mechanism 12 that breaks the second scribe line S2 of the second substrate 2 of the bonded substrate M is provided prior to the division by the impact member 8. The break mechanism 12 includes a break bar 12a that can be moved up and down and disposed between the impact member 8 and the pressing member 11 and above the bonded substrate M that is conveyed. The break bar 12a descends toward the bonded substrate M and is pressed against the surface of the first substrate 1 when the scribe lines S1 and S2 of the bonded substrate M are transported to the dividing position by the impact member 8 and stopped. . As a result, as shown in FIG. 12, the bonded substrate M is bent downward and the crack of the second scribe line S <b> 2 of the second substrate 2 reaches the seal material 3, that is, the entire thickness of the second substrate 2. The second scribe line S2 is completely broken.
In this way, by dividing the second scribe line S2 of the second substrate 2 on one side of the bonded substrate M prior to the dividing by the impact member 8, the dividing of the bonded substrate M by the impact member 8 is first performed. This can be carried out with a smaller shearing force with higher accuracy than in the embodiment. This embodiment is particularly effective when the thicknesses of the first substrate 1 and the second substrate 2 are thicker than 0.2 mm.

  While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, it can be used to cut a bonded substrate where no sealing material is interposed between the first substrate and the second substrate.

  The cutting apparatus of the present invention can be used when cutting a unit substrate by cutting a bonded substrate such as a liquid crystal display panel.

C cutting device M bonded substrate S1 first scribe line S2 second scribe line 1 first substrate 2 second substrate 3 sealing material 4 liquid crystal injection region 5 first support member 6 second support member 8 impact member 11 holding member 12 break mechanism

Claims (5)

A bonded substrate formed by bonding a first substrate on the upper side and a second substrate on the lower side, a first scribe line formed on the surface of the first substrate, and the first on the surface of the second substrate A cutting device for cutting along a scribe line and a second scribe line formed at the same position in plan view,
When one region of the bonded substrate with the first scribe line and the second scribe line as a boundary is a first region, and the other region is a second region,
A first support member that supports the first region; and a second support member that supports the second region;
When the first support member and the second support member move relatively up and down, the second support member is configured to displace between a position that supports the second region and a position that does not support the second region. And
In a state where the second support member does not support the second region, the second region is made to collide with the second region from above and the second region is moved along the first scribe line and the second scribe line. A cutting device provided with an impact member that cuts from   The cutting apparatus according to claim 1, wherein the collision by the impact member is performed by free fall of the impact member.   The cutting apparatus according to claim 1, further comprising a pressing member that presses the first region from above and prevents the first region from being lifted when the substrate is divided by the impact member.   The break mechanism for penetrating the crack of the second scribe line of the second substrate into the entire plate thickness prior to the division of the bonded substrate by the impact member is provided. Cutting device.   The cutting apparatus according to any one of claims 1 to 4, wherein the first scribe line and the second scribe line are formed immediately above and immediately below a sealing material that bonds the first substrate and the second substrate. .

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