201207926 六、發明說明： 【發明所屬之技術領域】 本申請係基於201 0年07月05日之日本發明專利申請 第 2010-153352 號、第 2010-153350 號、第 2010-15335 1 號、 第2010-153353號主張優先權。 本發明係關於由玻璃、矽、陶瓷、化合物半導體等脆 性材料構成之基板之分斷方法。本發明特別係關於沿於基 板上形成有長方形狀或格子狀之複數條刻劃線分斷基板而 分斷為晶片等單位製品之裝置。 【先前技術】 以往’已知藉由對脆性材料基板使用切割鋸、刀輪、 雷射光束形成複數條刻劃線，之後，施加外力使基板彎曲， 而沿刻劃線折斷來取出晶片等製品之方法（例如專利文獻i 等）。 圖20係顯示使用雷射光束於平台2〇上之基板21形成 =劃線之場合之—例之立體圖。藉由沿刻劃預定線L以掃 /枝構22掃目田雷射光學系統23之光束點並跟著以緊追其 後之方式從冷卻機構24之喷嘴24a喷射冷媒利用基板内 之.,、、、應力刀布形成刻畫，】線s。於此刻劃線形成步驟之後，藉 =與&成有刻劃線之面為相反側之面將相對於刻劃線之 刀乂折斷棒或滾子等按壓而使脆性材料基板彎曲，以彎 曲力矩沿刻劃線折斷。 在對脆性材料基板沿刻劃線施加彎曲力矩以折斷時， 201207926 為了使f曲力矩有效地產生，以3點彎曲方式進行較理想。 圖2 1係顯示成形有多數電子零件之LTCC基板（低溫 燒成陶瓷基板）21以使用板狀之折斷棒之一般性之3點彎 曲方式折斷之方法者。 分斷之LTCC基板21係黏貼於具有彈性之薄黏著膜 27，此黏著膜27係以往其周圍拉伸之狀態安裝於環狀之切 割框架28。 跨LTCC基板21之應分斷之刻劃線s於其左右位置配 置一對上部折斷棒25、25,在與設有刻劃線s之面為相反 側之面於刻劃線S之下方近處配置下部折斷棒26,藉由將 上部折斷棒25、25、下部折斷棒26之任一方按壓於LTCC 基板2 1，使彎曲力矩產生以分斷。 以利用折斷棒之3點彎曲方式分斷之方法係在例如專 利文獻2揭示。另外，以利用代替折斷棒而使用滾子之按 壓之3點彎曲方式分斷之手段亦已揭示於專利文獻（之圖 3 〇 另一方面，在於吸著平台上載置基板並使吸著固定之 狀態下分斷之做法已揭示（參照專利文獻3 )。 專利文獻1 :日本特開平08-175837號公報 專利文獻2:日本實開平〇5-45032號公報 專利文獻3 :日本特開2003-170419號公報 【發明内容】 [發明欲解決之課題] 4 201207926 然而，於以3點彎曲方式折斷之手段中有如下之問題。 圖21所示，在使一對上部折斷棒25、25接觸LTCC ^ 之表面並將下部折斷棒26突起以使彎曲力矩產生 而刀斷時，# LTCC基板21之固定不充分，LTCC基板21 θ偏移而而無法沿預定之刻劃線精度良好地分斷。 於具備多數吸引孔之吸著平台上載置LTCc基板2 1並 使吸著固疋之做法在消除位置偏移方面雖為理想，但在3 點彎曲方式L Τ Γ1 Γ1就1 1 -T- c基板21下方之下部折斷棒26之存在成為201207926 VI. Description of the Invention: [Technical Field of the Invention] This application is based on Japanese Patent Application No. 2010-153352, No. 2010-153350, No. 2010-15335 No. 1, 2010, issued on July 5, 2010. No. 153353 claims priority. The present invention relates to a method of breaking a substrate composed of a brittle material such as glass, tantalum, ceramics, or a compound semiconductor. In particular, the present invention relates to a device for dividing a substrate into a unit product such as a wafer by forming a plurality of strips in a rectangular or lattice shape on a substrate. [Prior Art] Conventionally, it is known to form a plurality of scribe lines by using a dicing saw, a cutter wheel, and a laser beam on a brittle material substrate, and then apply an external force to bend the substrate, and to break along the scribe line to take out a wafer or the like. Method (for example, Patent Document i, etc.). Fig. 20 is a perspective view showing an example in which a laser beam is used on the substrate 21 on the stage 2 to form a scribe line. By scanning the beam point of the field laser optical system 23 with the sweeping/descending structure 22 along the scribed line L, and subsequently ejecting the refrigerant in the substrate from the nozzle 24a of the cooling mechanism 24 in a manner to follow closely, ,, the stress knife cloth is formed to depict,] line s. After the scribe line forming step at this time, the surface of the opposite side of the scribed line is pressed against the scribe line to break the rod or the roller to bend the brittle material substrate to bend The moment is broken along the score line. When a bending moment is applied to the brittle material substrate along the scribe line to break, 201207926 is preferably performed in a three-point bending manner in order to effectively generate the f-torque moment. Fig. 2 is a view showing a method in which a LTCC substrate (low-temperature fired ceramic substrate) 21 in which a plurality of electronic components are formed is broken by a general three-point bending method using a plate-shaped fracture bar. The divided LTCC substrate 21 is adhered to the elastic thin film 27, and the adhesive film 27 is attached to the annular cutting frame 28 in a state of being stretched around the periphery. A pair of upper broken bars 25 and 25 are disposed on the left and right positions of the LTCC substrate 21 at the left and right positions, and the surface opposite to the surface on which the scribe line s is provided is located below the scribe line S. The lower break bar 26 is disposed, and one of the upper break bars 25 and 25 and the lower break bar 26 is pressed against the LTCC substrate 2 1, and the bending moment is generated to be broken. A method of breaking by a three-point bending method using a breaking bar is disclosed, for example, in Patent Document 2. Further, a means for breaking by a three-point bending method using a roller instead of a breaking bar has also been disclosed in the patent document (Fig. 3, on the other hand, the substrate is placed on the suction platform and the suction is fixed. In the state of the art, the method of the present invention is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. [Invention] [Problems to be Solved by the Invention] 4 201207926 However, the following problems occur in the method of breaking by a three-point bending method. As shown in Fig. 21, a pair of upper breaking bars 25, 25 are brought into contact with LTCC ^ When the lower fracture bar 26 is protruded to cause the bending moment to occur and the cutter is broken, the fixing of the #LTCC substrate 21 is insufficient, and the LTCC substrate 21 is offset by θCC, and the scribe line cannot be accurately divided along the predetermined scribe line. The suction platform with a plurality of suction holes is placed on the LTCc substrate 2 1 and the method of absorbing the solid is preferable in terms of eliminating the positional deviation, but in the 3-point bending mode L Τ Γ1 Γ1 on the 1 1 -T-c substrate Below the lower part of 21 Stick it into existence 26
重大限制而吸著平台之設置為困難。此外，雖亦有將LTCC 基：之周邊部亦即切割框架_上下以夾持具等夾持 口疋之手&⑮有構造複雜且並非基板全面固 定性之缺點。 針對上述問題，本發明係以提供於以3點彎曲方式將 脆性材料基板分斷時將基板確實固定而消除基板偏移，可 沿預定之刻劃線精度良好地分斷之分斷裝置為第—目的。 此外，如圖21所示’使-對上部折斷棒25、25接觸 LTCC基板21之表面並將下邻抽 〇接觸 ㈣亚肝下口斤斷棒26突起以使 產生而分斷時，LTCC基板21之 導致之彈性反作用力而往上方彈，刀會因彎曲所 分有缺口或破損產生而成為不良;，於端緣之角之部 人q个民口口之問題。 導致之微細玻璃屑（破片屑）產生 ^ ，缺口所 殘存於LTCC基板21之表面亦會成為不良附著、 必須追加以後處理除去玻璃屑之步 原因。因此， 針對上述問題，本發明係以提而有問題》 曲方式將 丨，、马以3點彎 5 201207926 脆性材料基板分斷者且於分斷時缺口或破損不易產生而可 獲得漂亮之分斷面之新賴之分斷裝置為第二目的。 進而，本發明係以提供即使微細之玻璃屬產生亦可於 與分斷同時除去之分斷裝置為第三目的。 [解決課題之手段;] 為了解決上述目的，太路於μ m 冬發月係採用如下之技術手段。 :、p本發明之为斷裝置由於表面载置形成有刻劃線之脆 性材料基板並吸著保持之吸著平台；形成於前述吸著平台 2基板載置面且前述基板之刻劃線載置於上方近處之開口 ，在前述刻劃線之上方配詈 -置為跨於其左右附近並按壓脆 f生材料基板表面之左太— 對上0卩折斷棒；配置於前述刻劃 線之下方近處且從刻則線 ^ 琛之下方近處頂脆性材料基板而將 已性材料基板分斷之下部拼齡—德> 卩折斷棒構成；下部折斷棒係形成 為可移動地收納於前述關 Φ . °卩内且於基板分斷時從開口部 犬出。在此前述開口部俜报出 糸形成為下部折斷棒可滑動較理想。 [發明之效果] 根據本發明之分斷署，+、， 、 在以下部折斷棒與上部折斷 2由：將脆性材料基板分斷時，脆性材料基板 合偏移=故下部折斷棒頂基板時基板不 曰偏移，可以刻劃線為中心左右均等地賦予推上之力，故 可沿刻劃線正確地分斷賊于推上之力故 特別疋在本發明藉由將吸著平台 之開口。卩之寬度減少’ λ 了將δ又置開口部所導致之吸著平台 之及者面積之減少抑制為 基板確實吸著㈣。 限度彳至刻劃線之附近將 201207926 另外收a於開σ部内之下部折斷棒係形成為於基板 分斷時從開口部突出不會成為於吸著平台上載置脆性 材料基板時之阻礙且有可預防載置基板時㈣框架等抵接 而傷害基板或下部折斷棒之效果。 (解決其他課題之手段及效果） 上述發θ巾ά]·具備g己置於前述刻劃線之上方近處且 在脆性材料基板分斷時彈性按壓分斷端緣部分以阻止往上 方之彈起之彈性按壓構件。 根據本發明之分斷裝置’在以下部折斷棒與上部折斷 棒之3點彎曲力矩從㈣線將脆性材料基板分斷時，藉由 彈性按壓構件彈性按壓刻劃線之上方部分，故於基板分斷 時分斷端緣不會因彎曲之反作用力而往上方彈起。 藉此，有可防止於分斷時有大衝擊作用而於分斷端緣 角部有缺口或破損產生而獲得漂亮之分斷面，且可抑制破 片屑之飛散所導致不良品之產生之優良效果。 此外’可將前述彈性按壓構件之前端形成為使具有寬 度之平面，並使以面接觸方式接觸前述刻劃線之上面附近。 藉此，於分斷時輕鬆彈接分斷端緣，可確實消除往上 方之彈起。 ”此外’前述彈性按壓構件係構成為以硬質材形成並藉 由彈簧向脆性材料基板彈壓亦可。 此外，前述彈性按壓構件係至少其—部分以具有彈性 之材料形成亦可。 藉此，可圖構成之簡略化與成本之減少化。 201207926 另外，设有配置於前述彈性按壓構件之附近且具備吸 引於脆材料基板分斷時產生之玻璃屑之吸引σ之玻璃屑 吸引手段亦可。 藉此，於基板分斷時即使微細之玻璃屑產生亦可以玻 璃屑吸引手段於與分斷同時除去，故可防止玻璃屑飛散所 導致之弊端而可獲得良率良好之良品。 在此，前述玻璃屑吸引手段之吸引口形成於前述彈性 按壓構件與前述上部折斷棒之間較理想。 藉此，在上部折斷棒之左右間之有限狹窄間隔可於接 近刻劃線之位置設置吸引口，藉此可有效地吸引除去玻璃 屑。 形成前述玻璃屑吸引手段之吸引口之覆蓋體安裝於前 述彈性按麗構件，該覆蓋體之内部空間連通於吸引泉亦可。 藉此，可將應分斷之刻劃線之上方近處部分以覆蓋體 確實覆蓋，可有效地進行玻璃屑之吸引除去。 【實施方式】 以下，基於圖面詳細說明本發明之分斷裝置之詳細。 在此係基於圖面說明將多數電子零件分配為格子狀而一體 成形之LTCC基板（低溫燒成陶瓷基板）沿刻劃線分斷為單 位要素之電子零件之例》 (實施形態1 ) 圖1〜圖6係顯示第1實施形態之圖。由本發明分斷之 LTCC基板1係黏貼於具有彈性之薄黏著膜2，黏著膜2係 201207926 以往其周圍拉伸之狀態安裝於環狀之切割框架3(參照圖 1)。於黏貼於黏著膜2之LTCC基板i 一體成形有複數電 子零件P，藉由先行之刻劃步驟形成有將電子零件p區分之 縱橫之複數刻劃線S。切割框架3係載置於後述之分斷裝置 A之吸著平台10上’可藉由搬送機構"於丫方向移動。 分斷裝置A具備於表面具有多數吸引孔…之吸著平 台1〇,藉由於吸引孔10a使吸引空氣產生而將載置於吸著 平台1〇上之LTCC基板1|%黏著膜2 一起吸著固定。 以夾吸著平台1〇配置之左右支持體12、12、於χ方向 延伸之水平之橫孝匡13構成之橋_ Η係設為跨吸著平么 10。於橫框13透過驅動機構（圖示外）可升降 ： 持構成折斷機構8之一部分 "’、 7。 ι上冲折斷棒4之保持具構件 此外，於分斷裝置Α之上部配置有攝影機15、！ 影機15、15可透過設於台板16上之導引件π、η於χ 方向移動。攝影機15、15可以手動操作上下動， Τ调整攝影之焦點。以攝 螢幕（ m 15拍攝之影像係顯示於 =圖:外）1LTCC基板【形成有定位用標記（對準 T 藉由以攝影機15、15拍攝LTCC基板丨 可參照拍攝之定位用標記進行折斷位置之定位。另2亦 位。疋位用標記而參照刻劃線本身來進行折斷位置之定 t，針對將LTCC基板丨分斷之折斷機 基於圖3〜圖6說明。 I刀 201207926 折斷機構B係由配置於應分斷之LTCC基板！之上方 對上部折斷棒4、4與配置於LTCC基板1之下方 之下部折斷棒5構成。 P折斷棒4、4與下部折斷棒5皆以於χ方向延伸之 板材形成，使刖端部較細。此外，其材質係以金屬 等硬質材製作。 場 呈左右對上部折斷棒4 ' 4係固著保持於可升降之保持 構件7其細化之前端部係隔開既定之間隔， 以随〜6.0mm之間隔配置。 心係 於吸者平台10設有朝向基板載置面開口之細長之開口 J〜此開口部9之長度方向可升降地配置有前述下部折 六杯5。下部折斷棒5係以其前端不從吸著平台之表面 突出之方式拉入開口部9内，僅將LTCC基板ι折斷時突 出。下部折斷棒5之厚度t以及將該下部折斷棒5可升降移 :肩之開口部9之較短方向之寬度D係形成為盡可能 ’:、。猎此’可將設置開口部9所導致之吸著平台10之吸著 區域之減少抑制為最小限度，使LTcc基板^與吸著平台 〇之接觸面盡可能接近刻劃線s。在本實施例係以下部折 斷棒5之厚度t為i 〇mm，開口部9之較短方向之寬度〇 為加上下部折斷棒5可滑動之間隙之尺寸來形成。 另外，下部折斷棒5之升降及保持上部折斷棒4、4之 保持具構件7之升降係以驅動機構（圖示外）進行。 於將LTCC基板1分斷時’如圖4所示，將黏貼於黏著 、2之LTCC基板ι載置於吸著平台1〇上。於基板 10 201207926 1以先行之刻劃線形成步驟 線s位於下部折斷棒$ 』-彳線s ’定位為此刻劃 定。另外，進行定 上方近處並以吸著平台10吸著固 於刻劃線S之上方°折斷棒4、4之間隔之中心位 〜工万近處D它 定位用攝影機15、1W、 之操作係使用先前已說明之 之後，如圖5 ήί·- 所不，使保持具構件7下降至左太斟 上部折斷棒4、4 了降至左右-對 u ^ m 鸲接觸於[tcc基板1 mu ^ Α 次，如圖6所子，杜τ 丄< 1：2直具It is difficult to set the platform by major restrictions. Further, there is a disadvantage that the LTCC base: the peripheral portion, that is, the cutting frame _ the upper and lower grips of the gripper, etc., have a complicated structure and are not fully fixed. In view of the above problems, the present invention provides a breaking device which is provided in a three-point bending manner when the brittle material substrate is divided, and the substrate is surely fixed to eliminate the substrate offset, and the scribe line can be accurately separated according to a predetermined scribe line. -purpose. Further, as shown in FIG. 21, the LTCC substrate is placed on the surface of the LTCC substrate 21 and the lower adjacent twitch contact (4) sub-hepatic lower stalks 26 are protruded to be generated and separated. The elastic reaction force caused by 21 is played upwards, and the knife will become bad due to the gap or breakage caused by the bending; the problem of the people's mouth at the corner of the edge. The resulting fine glass swarf (chip swarf) is generated, and the surface of the LTCC substrate 21 remaining on the surface of the LTCC substrate 21 is also poorly adhered, and it is necessary to add a subsequent process to remove the glass swarf. Therefore, in view of the above problems, the present invention is capable of obtaining a beautiful point by dividing the brittle material substrate by a three-point bend 5 201207926 on the basis of a problematic method, and the gap or breakage is not easily generated at the time of breaking. The new device of the cross section is the second purpose. Further, the present invention has a third object of providing a breaking device which can be removed at the same time as breaking even if a fine glass is produced. [Means for Solving the Problem;] In order to solve the above-mentioned objectives, the following technical means are adopted in the path of the μm winter hair. The present invention is a squeezing device which is formed by placing a sharded brittle material substrate on a surface and sucking and holding the absorbing platform; forming a substrate on the absorbing platform 2 and carrying the scribe line of the substrate The opening is placed near the top, and is arranged above the above-mentioned scribe line - placed across the left and right sides and pressing the left side of the surface of the brittle material substrate - the upper 0 卩 broken rod; Close to the bottom and close to the bottom of the engraved line ^ 琛 near the top of the brittle material substrate, the material substrate is divided into the lower part of the age-de- ; 卩 broken rod structure; the lower broken rod is formed to be movably Within the above-mentioned Φ. °卩 and when the substrate is broken, the dog is out of the opening. It is preferable that the opening portion 俜 is formed such that the lower break bar is slidable. [Effects of the Invention] According to the division of the present invention, +, , , and the lower portion of the broken rod and the upper portion of the broken portion 2 are: when the brittle material substrate is broken, the brittle material substrate is offset = so when the lower portion of the rod is broken The substrate is not offset, and the scribe line can be equally applied to the left and right sides, so that the force of pushing the thief can be correctly separated along the scribe line, so in particular, in the present invention, by absorbing the platform Opening. The width of the crucible is reduced by λ. The decrease in the area of the absorbing platform caused by the δ opening is also suppressed so that the substrate is smothered (4). The limit 彳 彳 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 It is possible to prevent the effect of the substrate or the lower break bar from being abutted when the substrate is placed (4). (Means and effects for solving other problems) The above-mentioned hair ά ά · 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 · 具备 具备 具备 具备 具备 具备 且 且 且 且The elastic pressing member is used. According to the breaking device of the present invention, when the three-point bending moment of the lower broken bar and the upper breaking bar breaks the brittle material substrate from the (four) line, the upper portion of the scribe line is elastically pressed by the elastic pressing member, so that the substrate is At the time of breaking, the breaking edge does not bounce upward due to the reaction force of the bending. Therefore, it is possible to prevent a large impact from being broken at the time of breaking, and to obtain a beautiful cross section at the corner of the breaking edge, and to obtain a beautiful cross section, and to suppress the occurrence of defective products caused by the scattering of the chip breaking. effect. Further, the front end of the elastic pressing member may be formed to have a flat surface having a width, and may be brought into contact with the vicinity of the upper surface of the scribe line in a surface contact manner. In this way, it is easy to elastically break the edge at the time of breaking, and the bounce of the upper side can be surely eliminated. Further, the elastic pressing member may be formed of a hard material and may be biased by a spring to the brittle material substrate. Further, the elastic pressing member may be formed at least in part by a material having elasticity. In addition, a glass smear suction means which is disposed in the vicinity of the elastic pressing member and which has suction σ which is generated when the brittle material substrate is broken is provided. Therefore, even if fine glass swarf is generated at the time of the separation of the substrate, the glass swarf suction means can be removed at the same time as the separation, so that the defects caused by the scattering of the glass swarf can be prevented, and the good quality can be obtained. Preferably, the suction port of the chip suction means is formed between the elastic pressing member and the upper breaking bar. Thereby, a finite narrow interval between the left and right sides of the upper breaking bar can be provided at a position close to the score line, whereby the suction opening is provided The glass frit can be effectively sucked and removed. The covering body forming the suction port of the glass frit attracting means is attached to the bomb According to the glazing member, the inner space of the covering body can be connected to the attraction spring. Thereby, the near portion above the scribe line to be broken can be covered with the covering body, and the suction and removal of the swarf can be effectively performed. [Embodiment] Hereinafter, the details of the breaking device of the present invention will be described in detail based on the drawings. Here, based on the drawing, an LTCC substrate (low-temperature firing ceramic substrate) in which a plurality of electronic components are distributed in a lattice shape and integrally formed is described. (Example 1) FIG. 1 to FIG. 6 are views showing a first embodiment. The LTCC substrate 1 separated by the present invention is adhered to a thin adhesive film 2 having elasticity. Adhesive film 2 is 201207926. It is attached to the annular cutting frame 3 (see Fig. 1) in the state of stretching around it. The plurality of electronic parts P are integrally formed on the LTCC substrate i adhered to the adhesive film 2, by the first moment. In the step of forming, a plurality of scribe lines S are formed which define the vertical and horizontal sides of the electronic component p. The dicing frame 3 is placed on the absorbing platform 10 of the breaking device A to be described later, and can be moved in the 丫 direction by the transport mechanism.The breaking device A is provided with a suction platform 1 having a plurality of suction holes on the surface, and the LTCC substrate 1|% adhesive film 2 placed on the suction platform 1 is sucked together by the suction hole 10a to generate suction air. The bridge is formed by sandwiching the left and right support bodies 12 and 12 arranged on the platform 1 and the horizontal filial piety 13 extending horizontally in the direction of the _ _ 设为 设为 跨 跨 跨 。 。 。 。 。 。 。 。 The mechanism (outside the figure) can be lifted and lowered: a part of the breaking mechanism 8 is held, and the holder member of the breaking bar 4 is placed on the upper part of the breaking device, and the camera 15 is mounted on the upper part of the breaking device. 15 can be moved in the direction of 透过 through the guiding members π and η provided on the platen 16. The cameras 15, 15 can be manually operated up and down to adjust the focus of the shooting. The screen is displayed on the screen (m 15 is displayed on the image of the image). 1LTCC substrate [The positioning mark is formed (alignment T) By taking the LTCC substrate with the cameras 15, 15, the position can be broken with reference to the positioning mark. Positioning. The other two are also in place. The position of the breaking position is marked with reference to the scribe line itself, and the breaking machine for breaking the LTCC substrate is described based on Fig. 3 to Fig. 6. I knife 201207926 Broken mechanism B The upper break bars 4 and 4 are disposed above the lower portion of the LTCC substrate 1 and the lower break bars 5 are disposed above the LTCC substrate to be separated. The P break bars 4 and 4 and the lower break bars 5 are both The sheet extending in the direction is formed to make the end portion of the crucible thinner. The material is made of a hard material such as metal. The field is left and right, and the upper broken rod 4'4 is fixedly held by the holding member 7 which can be lifted and lowered. The front end portions are spaced apart by a predetermined interval and are arranged at intervals of ～6.0 mm. The heart is attached to the sucker platform 10 with an elongated opening J facing the substrate mounting surface, and the opening portion 9 is vertically movable in the longitudinal direction. There are the aforementioned lower folding six cups 5 The lower break bar 5 is pulled into the opening portion 9 so that the front end thereof does not protrude from the surface of the suction platform, and protrudes only when the LTCC substrate ι is broken. The thickness t of the lower break bar 5 and the lower break bar 5 can be raised and lowered Shifting: The width D of the opening portion 9 of the shoulder is formed as much as possible to minimize the reduction of the absorbing region of the absorbing platform 10 caused by the provision of the opening portion 9, The contact surface of the LTcc substrate and the suction platform 尽可能 is as close as possible to the scribe line s. In the present embodiment, the thickness t of the lower broken rod 5 is i 〇 mm, and the width of the opening portion 9 in the shorter direction is 加The upper and lower breaking bars 5 are formed by the size of the slidable gap. Further, the lifting and lowering of the lower breaking bars 5 and the raising and lowering of the holder members 7 for holding the upper breaking bars 4, 4 are performed by a driving mechanism (outside the drawing). When the LTCC substrate 1 is disconnected, as shown in FIG. 4, the LTCC substrate 1 adhered to the adhesive is placed on the adsorption platform 1〇. On the substrate 10 201207926, the step line s is formed by the preceding line. Broken bar $ 』-彳 line s 'positioning is defined for this moment. The top position is fixed and sucked by the suction platform 10 to be fixed above the score line S. The center of the gap between the break bars 4 and 4 is ~ the vicinity of the work D. It is used by the camera 15 and 1W for positioning. After the above has been explained, as shown in Fig. 5, the holder member 7 is lowered to the left of the upper portion of the upper broken rod 4, 4 to the left and right - the pair of u ^ m 鸲 is contacted with [tcc substrate 1 mu ^ Α Times, as shown in Figure 6, Du 丄 丄 < 1:2 straight
棒5與左右-二:::::棒5上升並藉由此下部折斷 a把1作亡丨击，i 4之3點f曲力矩將LTCC 基板1從刻劃線s分斷。 此刀斷時，LTCC基板Η系（透過黏著膜2)由吸著平 台1〇吸著固定’故下部折斷棒5頂ltcc基板i時ltcc 基板」不會偏移，可正確地沿賴線S分斷。此外，藉由 將吸著平台1G之開口部9減少至下部折斷棒5之移動可容 許之極限（在可滑動之範圍 之吸著平台10之吸著面積 )’可將設置開口部9所導致 之減少抑制為最小限度而可將 LTCC基板1確實吸著固定。 此外，下部折斷棒5係收納於開口部9内，且形成為 於基板分斷時從開口部9突出，故不會成為於吸著平台1〇 上載置LTCC基板1時之阻礙且可預防載置LTCC基板ι 時切割框架3等抵接而傷害LTCC基板1或下部折斷棒5。 刻劃線S之折斷結束後’使上部折斷棒4、4及下部折 斷棒5後退，使LTCC基板1移動以使下部折斷棒5到達其 次分斷之刻劃線S之下方近處，之後以同樣之過程逐一實 11 201207926 行折斷。 (實施形態2) 圖7〜圖i 3係顯示第2實施形態之圖。另外，顯示第 2實施形態之分斷裝置之全體構造之立體圖與圖1相同，側 面圖與圖2相同’故亦參照此等圊，且針對相同部分藉由 給予相同符號而將說明部分省略。 分斷裝置A具備於表面具有多數吸引孔10a之吸著平 台1 〇 ’藉由於吸引孔10a使吸引空氣產生而將載置於吸著 平台1 〇上之LTCC基板1與黏著膜2 —起吸著固定。 以失吸著平台1〇配置之左右支持體12、12、於X方向 延伸之水平之橫框1 3構成之橋部14係設為跨吸著平台 〇於撗框1 3透過驅動機構（圖示外）可升降地安裝有保 持構成折斷機構B之一部分之上部折斷棒4與彈性按壓構 件6之保持具構件7。 此外，於分斷裝置A之上部配置有攝影機15、15。此 攝影機15、1 ς -Γ *Rod 5 and left and right - 2::::: The rod 5 rises and is broken by the lower part a. 1 is a dead sniper, and the i 4's 3 point f-torque moment breaks the LTCC substrate 1 from the scribe line s. When the knife is broken, the LTCC substrate ( system (through the adhesive film 2) is sucked and fixed by the absorbing platform 1 so that the ltcc substrate when the lower rupture rod 5 top ltcc substrate i is not offset, and can be correctly along the line S Break. Further, by reducing the opening portion 9 of the suction platform 1G to the limit of the movement of the lower break bar 5 (the suction area of the suction platform 10 in the slidable range), the opening portion 9 can be provided. The reduction suppression is minimized, and the LTCC substrate 1 can be surely occluded and fixed. Further, the lower break bar 5 is housed in the opening portion 9 and is formed to protrude from the opening portion 9 when the substrate is divided. Therefore, the lower break bar 5 does not become a hindrance when the LTCC substrate 1 is placed on the suction stage 1A, and can prevent the load. When the LTCC substrate ι is placed, the cutting frame 3 or the like abuts to damage the LTCC substrate 1 or the lower break bar 5. After the breaking of the scribe line S is completed, the upper breaking bars 4, 4 and the lower breaking bar 5 are retracted, and the LTCC substrate 1 is moved so that the lower breaking bar 5 reaches the lower portion of the scribe line S at the time of the second breaking, and then The same process is broken one by one. (Embodiment 2) Fig. 7 to Fig. 3 show a second embodiment. In addition, the perspective view of the entire structure of the cutting device of the second embodiment is the same as that of Fig. 1, and the side view is the same as that of Fig. 2, and the same reference numerals will be given to the same portions, and the description will be omitted. The breaking device A is provided with a suction platform 1 having a plurality of suction holes 10a on the surface, and the LTCC substrate 1 and the adhesive film 2 placed on the suction platform 1 are sucked by the suction holes 10a to generate suction air. Fixed. The bridge portion 14 formed by the left and right support bodies 12 and 12 disposed in the X-direction and the horizontal horizontal frame 13 extending in the X direction is configured to pass through the suction platform and to transmit the drive mechanism to the frame 13 (Fig. Further, a holder member 7 that holds the upper broken rod 4 and the elastic pressing member 6 that constitute one of the upper portions of the breaking mechanism B is attached to the upper and lower sides. Further, cameras 15 and 15 are disposed above the breaking device A. This camera 15, 1 ς -Γ *
15可透過設於台板16上之導引件η、18於X 方向及 向移動。攝影機15、15可以手動操作上下動， 可調整摄步 即 螢幕 八之焦點。以攝影機15、15拍攝之影像係顯示於 护圮圖示外）。於LTCC基板1形成有定位用標記（對準 二:，藉由以攝影機15、15拍攝LTCC基板表面， σΓ參照拍播 可代替Α攝 位用標記進行斷位置之定位。另外，亦 位。<位用帛記而纟照刻劃線本身㈣行折斷位置之定 其次，針對將LTCC基板1分斷之折斷機構B之部分 12 201207926 基於圖7〜圖13說明。 第2實施形態之折斷機構B係15 is movable in the X direction by the guides η, 18 provided on the platen 16. The cameras 15, 15 can be manually operated up and down, and the focus can be adjusted. The images taken with the cameras 15, 15 are displayed outside the escort icon). A positioning mark is formed on the LTCC substrate 1. (Alignment two: By photographing the surface of the LTCC substrate with the cameras 15, 15, the σΓ reference recording can be used to position the broken position instead of the Α position mark. Also, it is also. < The position of the broken line itself is determined by the scribe line, and the part of the breaking mechanism B that breaks the LTCC substrate 1 is described later with reference to Fig. 7 to Fig. 13. The breaking mechanism B of the second embodiment system
並! A L 士 丄 置於應分斷之LTCC :板之上方之左右一對上部折斷棒4、4與配置於聊 基板i之下方之下部折斷棒5與在L取基板！之上方配置 於上部折斷棒4、4之間之中心之彈性㈣構件6構成。 上部折斷棒4、4與下部折斷棒5與彈性 以於X方向延伸之帶妝夕缸从π二、 丹丨丁 υ白 帶狀之板材形成，使前端部較細。此外， 其材負係以金屬等硬質材製作。 左右一對上部折斷棒4、4係固著保持於可升降之伴持 具構件7，其細化之前 斧之保持 心引鲕冲係隔開既定之間隔，較理相係 2二Γ 6:〇_之間隔配置。此外，彈性按壓構件6係：藉 彈育8彈壓至其前端部6a比上部折斷棒4、4之前端少, 突出之狀態下彈性地保持於保持具構件7。 ^ ;〇著平。1 〇 6免有朝向基板載置面開口之細長之開口 部9(參照圖’沿此開口部9可升降地配置有下部折斷 棒5。下部折斷棒5係以其前端不從吸著平台10之表面突 出之方式拉入開口部9内’僅將LTCC基板"斤斷時突出。 ;折斷時以外係下部折斷棒5收納於吸著平自1 〇之開口 P内故不會成為於吸著平台ίο上載置LTCC基板i時 之阻礙且可預防載置LTCC基板1時切割框架3等抵接而傷 害⑽基板！或下部折斷棒5。 _ 另 夕卜 立 F折斷棒5之升降及保持上部折斷棒4、4兔 彈性按壓構件6之保持具構件7之升降係以驅動機構（圖 示外）進行。 13 201207926 於將LTCC基板！分斷時，如圖9所示，將黏貼於黏著 膜2之LTCC基板丨載置於吸著平台1()上。於me基板 1以先行之刻劃線形成步驟形成有刻劃線s，定位為此刻劃 Λ S位於下折斷棒5之上方近處並以吸著平台⑺吸著保 持另外’進<丁定位以使配置於上部折斷棒*、4之間隔之 令心之彈性按麼構件6位於刻劃線s之上方近處。定位之 操作係使用先前已說明之定位用攝影機15、15來進行。 其次’如圖10所示’使㈣具構件7下降至左右一對 上部折斷棒4、4之前端接觸於LTCC基板ι上之位置。此 夺比上°P折斷棒4、4突出之彈性按壓構件6之前端部6a 雖比亡部折斷棒4、4先接觸刻劃線S之上方近處，但因自 身之彈力而後退’成為隨時彈性按壓刻劃線S之上面部分 之狀態。 a，後’如® 11所示，使下部折斷棒5上升並藉由此下 部折斷棒5與左右-對上部折斷棒4、4之3點彎曲力矩將 LTCC基板1從刻劃線s分斷。 。此刀斷時，刻畫,j '線s之上面部分係藉由彈性按壓構件6 彈1·生按£ & LTCC基板ι之分斷端緣不會往上方彈起，可 防止於分斷端緣角部有缺口或破損產生。此外，分斷時， c基板1係由吸著平台丨〇之吸引孔i 〇a強力吸著固定， 故下4折斷棒5頂LTCC基板1時LTCC基板1不會偏移， 可正確地沿刻劃線S分斷。 另外’使彈性按壓構件6之前端為具有少許寬度之平 面6b以使以面接觸方式接觸刻劃線s之上面附近較理想。 201207926 藉此’於分斷時輕鬆彈接分斷端緣，可確實消除往上方之 彈起。另外，前述平面6b夂寬度為〇.5mm程度較理想。 刻劃線S之折斷結束後，使上部折斷棒4、4及彈性按 壓構件6及下部折斷棒5後退，使LTCC基板1移動以使下 部折斷棒5到達其次分斷之刻劃線s之下方近處，之後以 同樣之過程逐一實行折斷。 (實施形態3 ) 圖14〜圖19係顯示本發明之第3實施形態之圖。另 外，顯示第2實施形態之分斷裝置之全體構造之立體圖與 圖1相同，側面圖與圖2相同，故亦參照此等圖，且針對 相同部分藉由給予相同符號而將說明部分省略。 分斷裝置A具備於表面具有多數吸引孔1〇a之吸著平 台1〇,藉由於吸引孔10a使吸引空氣產生而將載置於吸著 平〇 1 〇上之LTCC基板1與黏著臈2 一起吸著固定。 以夾吸著平台1〇配置之左右支持體12、12、於χ方向 I伸之水平之杈框丨3構成之橋部丨4係設為跨吸著平台 1〇於杈框13透過驅動機構（圖示外）可升降地安裝有保 持構成折斷機構Β之—部分之上部折斷棒4與彈性按壓構 件6之保持具構件7。. 此外，於分斷裝置Α之上部配置有攝影機15、15。此 攝影機15、15可透過設於台板16上之導引件17、以於又 方向及Y方向移動。攝影機15、15可以手動操作上下動， 可調整攝影之焦點。以攝影機15、15拍攝之影像係顯示於 螢幕（圖不外於LTCC基板i形成有定位用標記（對準 15 201207926 標圮），藉由以攝影機15、15拍攝LTCC基板1之表面， 可參照拍攝之定位用標記進行折斷位置之定位。另外亦 可代替定位用標記而參照刻劃線本身來進行折斷位置之定 位0 其-人，針對將LTCC基板1分斷之折斷機構B之部分 基於圖14〜圖19說明。 第3實施形態之折斷機構B係由配置於應分斷之 土板1之上方之左右一對上部折斷棒4、4與配置於 基板1之下方之下部折斷棒5與在LTCC基板i之上方配置 於上。p折斷棒4、4之間之中心之彈性按壓構件6構成。 、上部折斷棒4、4與下部折斷棒5與彈性制構件6皆 甘；X方向延伸之帶狀之板材形成，使前端部較細。此外， 其材質係以金屬製作。 罝及右一對上部折斷棒4、.4係固著保持於可升降之保 具構件7，其細化之前端部係隔開既定之間@ ,較理想 由5::〜6:〇_之間隔配置。此外，彈性按壓構件6係在 黃8彈壓至其前端部^比上部折斷棒4、 突出之狀態下彈性地保持於保持具構件7。 另外，於上部折斷棒4、4與彈性按壓構件6之間形 “Μ吸料段之吸5丨口 2G。吸弓丨口則經過上部折, 間隙？與彈性按壓構件6之間隙21連通於上部空間22 斷榼/及上部空間22係如目14及圖15所示，在上部: 、4之端部以蓋板23㈣，於此蓋板23連通有連; 、引栗24之風道25。因此，藉由使吸引果24作動，ί 16 201207926 使吸引口 20產生吸引破場屑之吸引空氣。 此外，於吸菩半厶, 〇 设有朝向基板載置面開口之細長 之開口部參照圖3)，沿此開口部9可升降地配置有下 部折斷棒5。下部折斷棒5係以其前端不從吸著平台1〇之 =突出之方絲人開0部9内，僅將ltcc基板丨折斷時 突出。由於折斷時以外係下部折斷棒5收納於吸著平台ι〇 之開口 9内’故不會成為於吸著平台⑺上載置[取兵 板1時之阻礙且可預防载置LTCC基板1時切割框架3等： 接而傷害LTCC基板1或下部折斷棒5。 ' 另外，下部折斷棒5之升降及保持 彈性按壓構件6之保持且谌丛1 ^ 示外）進行。 、、構件7之升降係轉動機構（圖 於將LTCC基板1分齡口主,^ 〇 1刀斷時，如圖^所示，將黏貼於黏 、之LTCC基板夏载置於吸著平台1〇上。於ltcc美 =以先行之刻劃線形成步驟形成有刻劃線s，定位為此^ 位於下部折斷棒5之上方近處並以吸著平台ι〇吸著 '、、另外，進仃定位以使配置於上部折斷棒44之間隔 之t心之彈性按壓構件6位於刻劃線s之上方近處。定位 之知作：使用先前已說明之定位用攝影機15、"來進行。 其次’如圖17所示’使保持具構件7下降至左右 f部折斷棒4、4之前端接觸於LTCC基板丨上之位置。此 I二上部折斷棒弘4突出之彈性按壓構件6之前端部& 身 ^斷棒4、4純觸刻劃線S之上方近處，但因自 之彈力而後退，成㈣時彈性按壓刻劃線s之上面部分 17 201207926 之狀態。 之後’如圖18所示’使下部折斷棒5上升並藉由此下 部折斷棒5與左右-對上部折斷棒4、4之力矩將 LTCC基板1從刻劃線s分斷。 此分斷時，刻劃、線S之上面部分係藉由彈性按遂構件6 彈性按壓，故LTCC基板1之分斷端緣不會往上方彈起，可 防止於分斷端緣角部有缺口或破損產生。 此外，於分斷時，即使微細之玻璃屑產生亦因形成於 上部折斷棒4、4與彈性按壓構件6之間之吸引口 20開口 於分斷之刻财S之附近而迅速吸弓丨除去，玻璃屑不㈣ 著於LTCC基板1之表面。 另外，在上述實施例顯示之玻璃屑吸引手段之吸引口 20形成於上部折斷棒4、4與彈性按壓構件6之間故可在 上部折斷棒4、4間之有限狹窄間隔内於接近刻劃線S之位 置設置吸引口 20，藉此可有效地吸引除去玻璃屑。 此外刀斷時，LTCC基才反1係由吸著平台1〇之吸引 孔l〇a強力吸著固定，故下部折斷棒5頂ltcc基板】時 LTCC基板丨不會偏移，可正確地沿刻劃線§分斷。 另外，使彈性按壓構件6之前端為具有少許寬度之平 面6b 乂使以面接觸方式接觸刻劃線s之上面附近較理想。 藉此，於分斷時輕鬆彈接分斷端緣，可確實消除往上方之 彈起。另外，前述平面讣之寬度為〇 5mm程度較理想。 e d劃線S之折斷結束後，使上部折斷棒4、4及彈性按 C構件6及下部折斷棒5後退，使基板^移動以使下 18 201207926 部折斷棒5到達其次分斷之刻劃、線S之下方近處，之後以 同樣之過程逐一實行奶1斷。 在上述實施形態顯示之玻璃肩吸弓i手段雖係將其吸引 口 20形成於上部折斷棒4、4與彈性按壓構件6之間，但 於如圖19所示上部折斷棒4、4之間隔寬廣之場合，在此 間隔内於硬質材料製之彈性按壓構件6安裝覆蓋體％以使 形成玻璃屑吸引手段之吸引口 2G亦可。在此場合係構成為 覆蓋體26之内部空間27係在沿長度方向之兩端部以密封 板（圖示外）錢，貫通此任一方之密封板並以風道連通 於吸引泵（圖示外），藉由使吸引泵作動來使吸引口 2〇產 生玻璃屑吸引用空氣。 在此實施形態由於可以覆蓋體26確實覆蓋應分斷之刻 劃線S之上方近處部分，故可有效地進行玻璃屑之吸引除 去。 上述實施形態中雖係彈性按壓構件6以金屬等硬質材 料形成並以彈簧8往LTCC基板i彈壓之構成，但與圖12 同樣地省略彈菁8而將彈性按壓構件6全體以具有適度之 彈性之硬質橡膠等材質形成亦可。此外，與圖13同樣地僅 將彈性知壓構件6之下方部> 6,以具有適度之彈性之硬質 橡膠等材質形成亦可。 以上雖已針對本發明之代表性實施例說明，但本發明 亚非必須特定為上述之實施形態。例如，在上述實施例雖 係以LTCC基板為例做為加工對象之基板，但為玻璃基板或 矽基板亦可。此外’雖於吸著平台1〇設有多數吸引孔心 19 201207926 做為於吸著平台Η)上將LTCC基板】固定之手段但亦可 去除此吸引孔10a而已其他手段，例如隨基板不同而以靜電 吸著等將基板吸著保持亦可。此外，在本發明可在達成其 目的且不脫離請求之範圍之範圍内適當修正、變更。 此外，在至此已說明之分斷裝置雖係如圖丨所示，為 了將脆性材料基板載置並吸著保持而具備形成有吸引孔 l〇a之吸著平台10，但在改為不設有吸引孔之通常之平 台之場合，在第-目的即將基板確實固定而消除基板偏 移’可沿預定之刻劃線精度良好地分斷方面雖比設有吸引 L 10a之怎樣稍差’但藉由設置如以圖9等說明之彈性按壓 構件6可達成第二目的即於分斷時缺口或破損不易產生而 可獲得漂亮之分斷面。 進而，藉由设置如以圖丨6等說明之玻璃屑吸引手段之 吸引口 20，可達成第三目的即即使微細之玻璃屑產生亦可 於與分斷同時除去。 [產業上之可利用性] 本發明之分斷方法係利用於由玻璃基板、矽、陶瓷、 化0物半導體等脆性材料構成之基板之分斷。 【圖式簡單說明】 圖1係顯示本發明之分斷裝置之一實施態樣之立體圖。 圖2係顯示於圖1顯示之裝置之側面圖。 圖3係第1實施形態中之折斷機構部分之立體圖。 圖4係顯示將加工對象之LTCC基板載置於吸著平台上 20 201207926 之狀釔之第i實施形態中之折斷機構部分之剖面圖。 圖5係顯示基板之分斷步驟之擴大剖面圖。 圖6係顯示從圖5之狀態將下部折斷棒突起而將基板 y刀斷之狀態之擴大剖面圖。 圖7係第2實施形態中之上部折斷棒部分之一部分之 囷8係沿圖7之長度方向之縱剖面圖。 圖9係顯示將加工對象之LTCC基板載置於吸著平台上 之狀態之第2實施形態中之折斷機構部分之剖面圖。 圖10係顯示基板之分斷步驟之擴大剖面圖。 圖11係顯示從圖1G之狀態將下部折斷棒突起而將基 板分斷之狀態之擴大剖面圖。 圖係顯示本發明中之彈性按壓構件之其他實施例之 圖13係顯示本發明中之彈性按壓構件之再其 之剖面圖。 圖14係第3實施形態中之上部折斷棒部分之一 立體圖。 圖1 5係沿圖14之長度方向之縱剖面圖。 圖：6係顯示將加工對象之LTCC基板載置於吸著平台 上之狀態之第3實施形態中之折斷機構部分之剖面圖。 圖17係顯示基板之分斷步驟之擴大剖面圖。 圖U係顯示從圖17之狀態將下部折斷棒突起而將基 板分斷之狀態之擴大剖面圖。 21 201207926 圖19係顯示本發明尹之破璃屑吸引手段之吸引口部分 之其他實施例之剖面圖。 圖20係顯示一般之刻劃步驟之一例之立體圖。 圖2 1係顯示以以往之3點彎曲力矩將基板分斷之狀態 之說明圖。 【主要元件符號說明】 t 分斷裝置 i 折斷機構 ^ 刻劃線 LTCC基板（脆性材料基板） 黏著膜 3 4 5 6 6a 6b 7 8 切割框架 上部折斷棒 下部折斷棒 彈性按壓構件 彈性按壓構件之前端部 彈性按壓構件之前端面 保持具構件 彈簧 開口部 吸著平台 玻璃屑吸引手段之吸弓丨口 覆蓋體 22 201207926 27 覆蓋體之内部空間 23And A L 士 丄 Placed on the left and right sides of the LTCC: the upper and lower pair of broken bars 4 and 4 above the board, and the lower part of the lower part i is placed below the broken board 5 and the substrate is taken at L! The upper portion is formed of an elastic (four) member 6 disposed at the center between the upper break bars 4, 4. The upper break bars 4, 4 and the lower break bars 5 and the elastic makeup sleeves extending in the X direction are formed from π-two, tantalum-white strips, and the front end portion is made thinner. In addition, the negative material is made of a hard material such as metal. The pair of left and right upper break bars 4 and 4 are fixedly held by the attachable and erectable member 7 before the refinement, and the axe of the axe is separated by a predetermined interval, which is a reasonable phase 2 2: 6: 〇 _ interval configuration. Further, the elastic pressing member 6 is elastically held by the spring member 8 until the front end portion 6a thereof is smaller than the front end portions of the upper breaking bars 4, 4, and is elastically held by the holder member 7 in a state of being protruded. ^; 〇 flat. 1 〇 6 excluding the elongated opening portion 9 that opens toward the substrate mounting surface (see FIG. 2) the lower breaking bar 5 is disposed so as to be movable up and down along the opening portion 9. The lower breaking bar 5 is such that its front end does not pass from the suction platform 10 The surface is protruded into the opening portion 9 and 'only the LTCC substrate is protruded when it is broken. When the other part is broken, the lower broken rod 5 is stored in the opening P of the suction flat, so it does not become sucked. When the LTCC substrate i is placed on the platform, the LTCC substrate i is hindered and the cutting frame 3 or the like is prevented from coming into contact with the LTCC substrate 1 to damage (10) the substrate! or the lower broken bar 5. _ The lifting and holding of the F-breaking bar 5 The lifting and lowering of the holder member 7 of the upper breaking bar 4 and the rabbit elastic pressing member 6 is performed by a driving mechanism (not shown). 13 201207926 When the LTCC substrate is broken, as shown in Fig. 9, it is adhered to the bonding. The LTCC substrate of the film 2 is placed on the absorbing platform 1 (). The scribe line s is formed on the me substrate 1 by a scribe line forming step, and the scribe S is positioned above the lower break bar 5 Near and sucking the platform (7) to keep the other 'into' position for configuration The elastic portion of the upper breaking bar *, 4 is located near the scribe line s. The positioning operation is performed using the positioning cameras 15, 15 previously described. The position of the (four) member 7 is lowered to the position where the front ends of the pair of left and right upper break bars 4, 4 are in contact with the LTCC substrate ι. This is the front end of the elastic pressing member 6 which protrudes from the upper P-breaking bars 4, 4. 6a is closer to the top of the score line S than the broken part 4, 4, but it is retracted by its own elasticity. It becomes the state of elastically pressing the upper part of the score line S. a, after '如® 11 As shown, the lower breaking bar 5 is raised, and the LTCC substrate 1 is separated from the scribe line s by the three-point bending moment of the lower breaking bar 5 and the left-right-to-upper breaking bars 4, 4. Characterized, the upper part of the j' line s is elastically pressed by the elastic pressing member 6 and the pressing edge of the LTCC substrate ι does not rise upward, which prevents the corner of the breaking edge from being nicked. Or breakage occurs. In addition, when breaking, the c substrate 1 is strongly sucked by the suction hole i 〇a of the suction platform When the LTCC substrate 1 is folded, the LTCC substrate 1 is not offset, and can be correctly cut along the scribe line S. Further, the front end of the elastic pressing member 6 is a plane 6b having a slight width so that It is ideal to contact the top of the scribe line s in a surface contact manner. 201207926 By this, it is easy to elastically break the edge at the break, which can surely eliminate the upward bounce. In addition, the width of the above plane 6b夂 is 〇. The degree of 5 mm is ideal. After the breaking of the scribe line S is completed, the upper breaking bars 4, 4 and the elastic pressing member 6 and the lower breaking bar 5 are retracted, so that the LTCC substrate 1 is moved so that the lower breaking bar 5 reaches the second breaking moment. Near the line s, and then break the same process one by one. (Embodiment 3) Figs. 14 to 19 are views showing a third embodiment of the present invention. In addition, the perspective view of the entire structure of the cutting device of the second embodiment is the same as that of Fig. 1, and the side view is the same as that of Fig. 2, and therefore, the same reference numerals will be given to the same portions, and the description will be omitted. The breaking device A is provided with a suction platform 1 具有 having a plurality of suction holes 1 〇 a on the surface, and the LTCC substrate 1 and the adhesive 臈 2 placed on the absorbing 〇 1 〇 are generated by the suction holes 10 a to generate suction air. Suck and fix together. The bridge portion 4 formed by sandwiching the left and right support bodies 12 and 12 disposed on the platform 1 、 and the horizontal frame 丨 3 extending in the χ direction I is configured to transmit the drive mechanism through the suction platform 1 to the frame 13 ( In addition to the illustration, a holder member 7 that holds the upper portion of the breaking bar 4 and the elastic pressing member 6 that constitutes the breaking mechanism is attached to the lifting mechanism. Further, cameras 15 and 15 are disposed above the breaking device Α. The cameras 15, 15 are movable in the direction of the Y and the Y direction through the guides 17 provided on the platen 16. The cameras 15, 15 can be manually operated up and down to adjust the focus of photography. The images captured by the cameras 15 and 15 are displayed on the screen (the positioning marks are formed on the LTCC substrate i (alignment 15 201207926 standard), and the surface of the LTCC substrate 1 is photographed by the cameras 15 and 15, and reference is made. The positioning of the photographing is performed by using the mark to position the break position. Alternatively, instead of the positioning mark, the position of the break position can be referred to by referring to the score line itself. The person-to-person is based on the portion of the break mechanism B that breaks the LTCC substrate 1. 14 to 19, the breaking mechanism B of the third embodiment is composed of a pair of right and left upper breaking bars 4 and 4 disposed above the soil plate 1 to be separated, and a lower breaking bar 5 disposed below the lower surface of the substrate 1. The elastic pressing member 6 disposed at the center between the p-break bars 4 and 4 is disposed above the LTCC substrate i. The upper breaking bars 4, 4 and the lower breaking bars 5 and the elastic member 6 are both sweet; The strip-shaped plate is formed to make the front end portion thinner. Further, the material is made of metal. The 一对 and the right pair of upper break bars 4, .4 are fixed and held by the liftable member 7 for refining. The previous end is separated by an established @ Preferably, the elastic pressing member 6 is elastically held by the holder member 7 in a state where the yellow pressing member 6 is biased until the front end portion thereof is protruded from the upper breaking member 4 and protruded. In addition, between the upper breaking bars 4, 4 and the elastic pressing member 6, a shape of the suction port 5G 2G is formed. The suction bow mouth is folded over the upper portion, and the gap is connected to the gap 21 of the elastic pressing member 6. In the upper space 22, the break/the upper space 22 is as shown in FIG. 14 and FIG. 15, and the cover portion 23 (four) is provided at the end of the upper part: 4, and the cover plate 23 is connected to the cover plate 23; 25. Therefore, by actuating the attracting fruit 24, ί 16 201207926 causes the suction port 20 to generate suction air that attracts the breakage. In addition, the suction opening is provided with a slender opening toward the substrate mounting surface. Referring to Fig. 3), a lower break bar 5 is disposed up and down along the opening portion 9. The lower break bar 5 is opened in the zero portion 9 without the front end of the lower portion of the suction platform 1 The ltcc substrate protrudes when it is broken. The outer lower break bar 5 is housed in the opening 9 of the suction platform ι when it is broken. Therefore, it is not placed on the suction platform (7). [The obstacle is prevented when the board 1 is taken and the frame 3 can be prevented from being placed when the LTCC substrate 1 is placed: the LTCC substrate 1 or the lower broken rod 5 is damaged. The lifting and lowering of the breaking bar 5 and the holding of the elastic pressing member 6 are performed, and the truss 1 is shown outside.), the lifting mechanism of the member 7 is rotated (the figure is LTCC substrate 1 is the age of the main mouth, ^ 〇 1 knife breaking As shown in Fig. 2, the LTCC substrate adhered to the adhesive is placed on the suction platform 1〇. The ltcc is replaced by a scribe line forming step. The upper portion of the lower break bar 5 is located near the upper portion of the lower break bar 5 and is sucked by the suction platform 、, and is further positioned so that the elastic pressing member 6 disposed at the interval of the upper break bar 44 is located above the score line s Near. Knowing the positioning: using the positioning camera 15 and " previously described. Next, as shown in Fig. 17, the holder member 7 is lowered to a position where the front ends of the left and right f-breaking bars 4, 4 are in contact with the LTCC substrate. The front end of the elastic pressing member 6 of the upper portion of the first and second elastic members of the first and second members of the elastic member 4 is in the vicinity of the upper portion of the purely scribed line S, but is retracted by the elastic force, and is elastically pressed at the time of (four) The state of the upper part of the scribe line s 17 201207926. Thereafter, as shown in Fig. 18, the lower break bar 5 is raised, and the LTCC substrate 1 is separated from the score line s by the moment of the lower break bar 5 and the left and right-to-upper break bars 4, 4. At the time of the breaking, the upper portion of the scribe line S is elastically pressed by the elastic pressing member 6, so that the breaking edge of the LTCC substrate 1 does not bounce upward, thereby preventing the corner of the breaking edge from being Gaps or breakages are generated. Further, at the time of the breaking, even if fine glass swarf is generated, the suction port 20 formed between the upper break bars 4, 4 and the elastic pressing member 6 is opened in the vicinity of the break, and the suction is quickly removed. The glass swarf is not (4) on the surface of the LTCC substrate 1. Further, the suction port 20 of the glass frit suction means shown in the above embodiment is formed between the upper break bars 4, 4 and the elastic pressing member 6, so that it can be closely scribed in a limited narrow interval between the upper break bars 4, 4. The suction port 20 is provided at the position of the line S, whereby the glass cullet can be effectively sucked and removed. In addition, when the knife is broken, the LTCC base is reversed by the suction hole l〇a of the suction platform 1〇, so the LTCC substrate is not offset when the lower fracture bar 5 is ltcc substrate, and can be correctly The score line § breaks. Further, it is preferable that the front end of the elastic pressing member 6 is a flat surface 6b having a slight width so as to be in contact with the upper surface of the scribe line s in a surface contact manner. In this way, it is easy to elastically break the edge at the time of breaking, and it is possible to surely eliminate the upward bounce. Further, it is preferable that the width of the plane 讣 is 〇 5 mm. After the breaking of the ed line S is completed, the upper breaking bars 4, 4 and the elastic pressing member C and the lower breaking bar 5 are retracted, so that the substrate ^ is moved so that the lower 18 201207926 breaking bar 5 reaches the second breaking, Near the line S, the milk is broken one by one in the same process. The glass shoulder suction bow i shown in the above embodiment has the suction port 20 formed between the upper break bars 4 and 4 and the elastic pressing member 6, but is spaced apart from the upper breaking bars 4 and 4 as shown in FIG. In a wide range, the cover member may be attached to the elastic pressing member 6 made of a hard material at this interval so that the suction port 2G for forming the glass frit suction means may be formed. In this case, the internal space 27 of the covering body 26 is sealed by a sealing plate (not shown) at both end portions in the longitudinal direction, and passes through one of the sealing plates and communicates with the suction pump by a duct (illustration In addition, the glass suction air is generated in the suction port 2 by actuating the suction pump. In this embodiment, since the covering body 26 can surely cover the portion near the upper side of the scribe line S which should be broken, the suction of the swarf can be effectively removed. In the above-described embodiment, the elastic pressing member 6 is formed of a hard material such as metal and is biased by the spring 8 to the LTCC substrate i. However, in the same manner as in FIG. 12, the elastic cyanine 8 is omitted and the elastic pressing member 6 is moderately elastic. A material such as hard rubber may be formed. Further, similarly to Fig. 13, only the lower portion > 6, of the elastic pressure member 6 may be formed of a material such as hard rubber having moderate elasticity. Although the above has been described with respect to a representative embodiment of the present invention, the present invention is not necessarily limited to the above embodiments. For example, in the above embodiment, the LTCC substrate is used as a substrate to be processed, but it may be a glass substrate or a germanium substrate. In addition, although the suction platform 1 has a plurality of suction holes 19 201207926 as a suction platform, the LTCC substrate is fixed, but the suction hole 10a can be removed, and other means, for example, depending on the substrate. It is also possible to hold the substrate by electrostatic attraction or the like. In addition, the present invention can be appropriately modified or changed within the scope of the invention without departing from the scope of the claims. Further, the breaking device described so far is provided with a suction platform 10 in which a suction hole 10a is formed in order to mount and suck the brittle material substrate as shown in FIG. In the case of a normal platform having a suction hole, the first purpose of the substrate is to fix the substrate and eliminate the substrate offset, which is somewhat worse than the provision of the attraction L 10a. By providing the elastic pressing member 6 as described with reference to Fig. 9 or the like, the second object can be attained, that is, the notch or the breakage is not easily generated at the time of breaking, and a beautiful sectional portion can be obtained. Further, by providing the suction port 20 of the glass frit suction means as described with reference to Fig. 6, etc., it is possible to achieve the third object, that is, even if fine glass swarf is generated, it can be removed simultaneously with the breakage. [Industrial Applicability] The breaking method of the present invention is used for the division of a substrate made of a brittle material such as a glass substrate, a tantalum, a ceramic or a chemical semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an embodiment of a breaking device of the present invention. Figure 2 is a side elevational view of the apparatus shown in Figure 1. Fig. 3 is a perspective view showing a portion of the breaking mechanism in the first embodiment. Fig. 4 is a cross-sectional view showing a portion of the breaking mechanism in the i-th embodiment in which the LTCC substrate to be processed is placed on the absorbing platform 20 201207926. Figure 5 is an enlarged cross-sectional view showing the breaking step of the substrate. Fig. 6 is an enlarged cross-sectional view showing a state in which the lower portion of the broken rod is protruded from the state of Fig. 5 and the substrate y is cut. Fig. 7 is a longitudinal cross-sectional view showing the 囷8 portion of a portion of the upper portion of the upper broken portion in the longitudinal direction of Fig. 7 in the second embodiment. Fig. 9 is a cross-sectional view showing a portion of the breaking mechanism in the second embodiment in which the LTCC substrate to be processed is placed on the absorbing platform. Figure 10 is an enlarged cross-sectional view showing the breaking step of the substrate. Fig. 11 is an enlarged cross-sectional view showing a state in which the lower portion is broken and the base plate is broken from the state of Fig. 1G. Fig. 13 is a cross-sectional view showing another embodiment of the elastic pressing member of the present invention. Fig. 13 is a cross-sectional view showing the elastic pressing member of the present invention. Fig. 14 is a perspective view showing one of the upper portion of the broken rod in the third embodiment. Figure 15 is a longitudinal sectional view taken along the length direction of Figure 14. Fig. 6 is a cross-sectional view showing a portion of the breaking mechanism in the third embodiment in which the LTCC substrate to be processed is placed on the suction platform. Figure 17 is an enlarged cross-sectional view showing the breaking step of the substrate. Fig. U is an enlarged cross-sectional view showing a state in which the lower portion is broken and the base plate is broken from the state of Fig. 17 . 21 201207926 Fig. 19 is a cross-sectional view showing another embodiment of the suction port portion of the Yin's glass breaking attraction means of the present invention. Figure 20 is a perspective view showing an example of a general scribing step. Fig. 2 is an explanatory view showing a state in which the substrate is cut by the conventional three-point bending moment. [Main component symbol description] t Breaking device i Folding mechanism ^ Marking LTCC substrate (brittle material substrate) Adhesive film 3 4 5 6 6a 6b 7 8 Cutting frame upper break bar lower break bar elastic pressing member elastic pressing member front end Partial elastic pressing member front end holder member spring opening portion suction platform glass chip suction means suction bow mouth covering body 22 201207926 27 inner space of the covering body 23