1344449 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種切割裂片裝置及方法，特別是一種基板切割裂片裝 置及方法。 【先前技術】 由於科技資訊產品都朝著輕、薄、短、小的目標發展，傳統的陰極射 線管螢幕受限於體積過大與消耗大量能源等問題，無法滿足使用者的實際 ^ 需求而逐漸被市場所淘汰，取而代之的是具有體積小、低耗電量等優點的 液晶顯示器（liquid crystal display, LCD )。 為了符合不同的制需求，液晶顯示面板的尺寸也隨著需求改變而有 所不同，因此，液晶顯示面板在加工過程中，需經過切割裂片的流程，亦 '即為了獲得所需之規格，將較大之玻絲板，裁切分割成符合預定尺寸 ，之板片。在切割裂片時’先以切割刀於固定於工作平台上的玻璃基板劃出 切割線，再將玻璃基板移至另—讀平台上，並利縣片棒（Β_如） 籲對玻璃基板施予適當的應力，使其因應力侧而沿著切割線分為兩半，再 重複以上步驟直到玻璃基板符合預定之尺寸。 此種切割裂片的製程，於玻璃基板切割完成後，大多為人工手動針對 面板進行裂片，再將補移除，相當耗費人力與時間。由於液晶顯示面板 的尺寸越來越大，習知製程以人工方式進行裂片勢必不可行，因此，如何 改良玻璃切難置《«置騎構，整合切縣片㈣程，藉此減少製 程人員的負擔’進而縮短切簡片的時間，係為本案之㈣人以及從事此 相關行業之技術領域者里欲改善的課題。 1344449 【發明内容】 有鑑於此，本發明提出一種基板切割裂片裝置，包含：架體、裝置台、 切割單元、至少-連接臂與至少—吸嘴。載置台係位於架體内，用以承載 基板。切割單元餘於架_，用以切割基板而於基板上形成至少一切割 痕’以將基板區分為本體與至少一額料。連接臂係包含第一端與第二端， 第-端以可旋轉方式與架體連接。吸嘴係位於連接臂之第二端，連接臂帶 動吸嘴向基板施力，吸嘴吸附額料並使額料沿切割痕斷開。 # 本發明亦提出一種基板切割裂片方法，包含下列步驟：承載基板；切 割基板而形成至少-切割痕，以將基板區分為本體與至少一額料；移動連 接臂至額料上方；鶴連射位料㈣吸嘴吸_料；及鶴連接臂施 力而使額料沿切割痕斷開。 有關本發明的較佳實施例及其功效，茲配合圖式說明如後。 【實施方式】 第1圖係繪示本發明基板切割裂片裝置之實施例。基板切割裂片裝置 ® 1包含：架體10、載置台20、切割單元30、連接臂40及吸嘴50。 架體10係概呈矩形之框體，於頂部設置有旋轉機構丨丨’其中旋轉機 構11設有旋轉單元111與支臂112，旋轉單元U1連接於架體1〇，並可帶 動支臂112旋轉。 載置台20係位於架體10内，用以承載基板90。載置台2〇上設有複 數吸附元件21 ’可經由真空方式吸附基板9〇，使基板9〇固定於載置台20 上而不會產生晃動或偏移。基板90可為玻璃材質，但不限於此，相關技藝 人士亦可依實際需求選擇適當的基板材質。 1344449 切割單元30係位於架體10内，具有龍門機構3卜並於龍門機構y .之兩側設有切割刀頭32與33，藉以切割基板9G而於基板9()上形成切割痕 9〇a，以將基板9〇區分為本體％與額料92。再者，切割單元如亦可設有 旋轉缸34,經由旋轉缸34帶動切割刀頭33旋轉而改變切割刀頭幻之切割 方向。在此’旋轉缸、切割刀頭與切割痕的數目、位置與分布僅是舉例， 但本發明不限於此，亦可依實際需求予以調整。 ;别述說月中’龍門機構31位移時可同時帶動切割刀頭％與33位移 而切割基板90，亦可經由旋轉缸34帶動切割刀頭％旋轉，使切割刀㈣ 沿龍門機構之軸向（如第3 A圓所示之箭頭方向）進行往復位移而切剖 基板90。 月J述說月之切割早疋3〇另可於龍門機構31之側邊設置清潔元件^。 田切割刀碩32與33於_基板9G時，清潔元件％可清除_基板如所 產生之粉塵，細保縣板9G之清潔。清潔元件％可為—料構造，但 不以此為限’蝴技#人士亦可依實際需求調整清潔元件之結構和位置。1344449 IX. Description of the Invention: [Technical Field] The present invention relates to a cutting and splitting device and method, and more particularly to a substrate cutting and splitting device and method. [Prior Art] As the technology information products are moving toward light, thin, short and small targets, the traditional cathode ray tube screen is limited by the problem of excessive volume and large amount of energy consumption, which cannot meet the actual needs of users. It was eliminated by the market and replaced by a liquid crystal display (LCD) with the advantages of small size and low power consumption. In order to meet the different requirements of the system, the size of the liquid crystal display panel also varies with the demand. Therefore, the liquid crystal display panel needs to go through the process of cutting and splitting during the processing, that is, in order to obtain the required specifications, The larger glass plate is cut into pieces that meet the predetermined size. When cutting the lobes, the dicing blade is used to cut the cutting line on the glass substrate fixed on the working platform, and then the glass substrate is moved to the other reading platform, and the Lixian slab rod (Β_如) calls for the glass substrate. Proper stress is divided into two halves along the cutting line due to the stress side, and the above steps are repeated until the glass substrate conforms to the predetermined size. After the cutting of the glass substrate is completed, most of the manual cutting of the panel is performed manually, and then the patch is removed, which is labor-intensive and time-consuming. As the size of the liquid crystal display panel is getting larger and larger, the conventional process is not feasible to manually perform the splitting. Therefore, how to improve the glass cut difficult to set the "« riding structure, integrate the cutting film (four) process, thereby reducing the process personnel The burden, which in turn shortens the time for cutting the film, is the subject of the (4) person in the case and the technical field in the relevant industry. 1344449 SUMMARY OF THE INVENTION In view of the above, the present invention provides a substrate cutting and splitting device, comprising: a frame body, a device table, a cutting unit, at least a connecting arm and at least a suction nozzle. The mounting platform is located in the frame to carry the substrate. The cutting unit is left in the frame_ for cutting the substrate to form at least one cut mark on the substrate to divide the substrate into a body and at least one predetermined material. The connecting arm system includes a first end and a second end, and the first end is rotatably coupled to the frame. The nozzle is located at the second end of the connecting arm, and the connecting arm drives the suction nozzle to apply force to the substrate, and the suction nozzle absorbs the amount of material and breaks the amount of material along the cutting mark. The present invention also provides a substrate cutting and splitting method, comprising the steps of: carrying a substrate; cutting the substrate to form at least a cutting mark to divide the substrate into a body and at least one of the fore; moving the connecting arm to the top of the material; (4) The suction nozzle sucks the material; and the crane connecting arm applies force to break the material along the cutting mark. Preferred embodiments of the present invention and their effects are described below in conjunction with the drawings. [Embodiment] Fig. 1 is a view showing an embodiment of a substrate cutting and splitting device of the present invention. The substrate cutting and splitting device ® 1 includes a frame body 10, a mounting table 20, a cutting unit 30, a connecting arm 40, and a suction nozzle 50. The frame body 10 has a rectangular frame body, and a rotating mechanism is disposed at the top. The rotating mechanism 11 is provided with a rotating unit 111 and an arm 112. The rotating unit U1 is coupled to the frame body 1 and can drive the arm 112. Rotate. The mounting table 20 is located in the frame 10 for carrying the substrate 90. The mounting table 2 is provided with a plurality of adsorption elements 21' so that the substrate 9 is adsorbed by vacuum, and the substrate 9 is fixed to the mounting table 20 without sway or offset. The substrate 90 may be made of a glass material, but is not limited thereto, and a person skilled in the art may select an appropriate substrate material according to actual needs. 1344449 The cutting unit 30 is located in the frame body 10, has a gantry mechanism 3b and is provided with cutting heads 32 and 33 on both sides of the gantry mechanism y., thereby cutting the substrate 9G to form a cutting mark on the substrate 9(). a, to divide the substrate 9 为 into the body % and the front material 92. Further, the cutting unit may be provided with a rotary cylinder 34, and the rotary cutter 34 drives the cutter head 33 to rotate to change the cutting direction of the cutter head. Here, the number, position and distribution of the rotary cylinder, the cutting bit and the cutting marks are merely examples, but the present invention is not limited thereto, and may be adjusted according to actual needs. In the middle of the month, when the displacement of the gantry mechanism 31 can simultaneously drive the cutting heads and the displacement of the cutting heads to cut the substrate 90, the rotating cutters 34 can also drive the cutting cutters to rotate by 100%, so that the cutting blades (4) are along the axial direction of the gantry mechanism ( The substrate 90 is cut by reciprocating displacement in the direction of the arrow indicated by the 3rd A circle. Month J said that the cutting of the moon is early 3 〇 and the cleaning element ^ can be set on the side of the gantry mechanism 31. When the cutting cutters 32 and 33 are on the _substrate 9G, the cleaning component % can remove the dust generated by the _ substrate, and the cleaning of the fine slab 9G. % of cleaning elements can be made of materials, but not limited to them. The person can also adjust the structure and position of the cleaning elements according to actual needs.
再者切割早疋30亦可設有第—靜電消除器％用以消除靜電；第一靜電 肖除器36可叹置於切割刀頭32與％之側邊或龍門機構μ之側邊，但不 限於此，相關技藝人士亦可依實際需求調整數量與分布位置。 此外本發明所揭露之載置台2〇可額外設置裂片棒η，用以對準基 板9〇之切割痕咖而頂持基板90。裂片棒的數目與位置在此僅是舉例，相 關技藝人士可依實際絲調整。 接’。具有第-端4Ga與第二端4册，連接臂4〇之第一端4加以可 1344449 旋轉方式與架體⑴上之支臂112連接，使連接臂4〇可以第—端伽射 心旋轉’藉以調整連接臂40與基板90之間的夾角。在較佳實施例中夹 角為45度至75度’即可使連接臂⑽之施力方向與基板9()的夾角呈衫度 至75度為較佳，但本發明不以此為限，亦可依實際需求而調整角度。再者， 連接臂40之側邊可設有第二靜電消除器42,或可於第二端設有第二靜 電消除器42 ( @未示）’藉以消除靜電，但本發明不以此為限，相關技藝人 士亦可依實際需求而調整擺設位置與使用數量。 及嘴5〇位於連接# 4〇之第一端4〇b，當連接臂⑽帶動吸嘴SO向基 板90施力’吸嘴50可以真空方式吸附額料％，並使額料％沿切割痕咖 斷開。糾，吸嘴50的吸_可以實際奴調整其位置。此處吸嘴數量與 分布僅是舉例，而本發明不限於此。 此外，前述說明之連接臂40更可設有控制汽缸4卜用α帶動吸嘴5〇 位移並控制吸嘴50下壓量或上移量，藉啸供觀％向下或向上之壓力。 如第2 Α圖與第2 Β圖所示，當載置台20承載基板9〇時，驅動龍門 機構位移以帶動切割刀頭32與33切割基板9〇(箭頭表示龍門機㈣移 動方向）’而於基板90兩側分別形成切割痕9〇ae如第26圖、第3a圖與 第3 B圖所示’旋轉缸34帶動切割刀頭33旋轉，再驅動切割刀頭刃沿龍 門機構31之轴向（第3 a圖之箭頭方向）進行位移，而於基板％上形成 另-條切割痕90a。待切割刀頭33於切割後並可沿龍門機構31之轴向歸 位，驅動龍門機構31位移至基板90尚未切割之側邊，再驅動切割刀頭33 沿龍門機構31之軸向進行位移並切板9Q ,使基板％之四側邊分別形 1344449 成有切割痕90a，而於各切割痕90a之間者為本體91，以外部分即為額料 92。此切割方式、切割範圍、切割順序、刀頭移動順序與基板本體範圍僅 是舉例’但本發明不以此為限’相關技藝人士可依實際需求來調整。本發 明可以僅需移動切割刀頭而無須移動基板來移除額料，但依實際的需求， 亦可搭配可移動基板的載置台來使用。 如第4 A圖與第4 B圖所示，當基板90完成切割時，即可由連接臂 4〇帶動吸嘴50位移至額料92之上方，再利用控制汽缸41控制吸嘴5〇下 壓，不僅可使吸嘴50吸附額料92，並可提供向下壓力，而裂片棒22對準 基板90之切割痕90a而提供向上壓力’由於額料92承受向上與向下壓力， 使額料92可沿切割痕90a斷開。再者，連接臂4〇與基板9〇之間的夾角可 視裂片條件而調整’較佳地為45度至75度，即可使連接f 4G之拖力方向 與基板90的夹角呈Μ度至7S度為較佳，但本發明不以此為限亦可依實 際需求而調整角度。 待裂片完成後，即可以吸嘴50吸起額料92並移除至額料箱（圖未示） 中。若額料92裂片不完全時，可利用控制汽缸41控制吸嘴5〇肖上位移而 提供向上拉力’藉以協助額料92完成裂片。續以旋轉機構u之旋轉單元 動支臂112賴，同時可帶動連接於支臂112之連接臂*旋轉，即 可依則述方式對未裂片之額料92進行裂片。此切割方式與移動順序僅是舉 例’但本發明不减為限，相關技藝人何依實際需求來調整。 第5圖係緣示本發明基板切割裂片裝置之架體構造。如第5圖所示，吸塵 機構6〇可與架體10連接，其中吸塵機構ό〇設有升降汽缸&與吸氣件62， 1344449 升降汽缸61可帶動吸氣件62升降，以經由吸氣件62吸取切割刀頭艾與 33於切割基板9〇所產生之粉塵。此外，架體10上可設有伺服軸15，用以 帶動吸塵機構60位移，以吸取散落於基板90上之粉塵。但本發明不以此 為限’亦可依實際需求而調整吸塵機構的擺設位置與數目。 另外’如第6圖所示，基板90可包含第一基板93與第二基板94，其 中第一基板93配置於第二基板94上方，並可依據前述方式切割第一基板 93而形成切割痕93a’續以連接臂4〇帶動吸嘴5〇位移至額料93b之上方， • 再利用控制汽缸4丨控制吸嘴50下壓，使吸嘴50吸附額料93b並搭配裂片 棒22進行裂片。於此實施例中，可僅移除上方的第一基板93之額料9儿， 而位於下方的第二基板94維持原貌。此基板之數目、堆疊方式與額料位置 僅是舉例，但本發明不以此為限，相關技藝人士可依實際需求來調整。 本發明之基板切割裂片方法，包含下列步驟： 步驟1 :承載基板％。以載置台20承載基板9〇 ,其中載置台2〇以複 數吸附7C件21真空吸附基板90’使基板90固定於載置台2〇上而不會產生 ^ 晃動或偏移。 步驟2 :切割基板90而形成切割痕90a，以將基板9〇區分為本體91 與額料92。經由龍門機構31帶動切割刀頭32與33位移而切割基板9〇， 並於基板90二側分別形成切割痕90a。此後以旋轉缸34帶動切割刀頭33 旋轉，再驅動切割刀頭％沿龍門機構31之轴向進行位移，而於基板9〇上 形成另-條切割痕9心待切割刀頭33於切割後且可沿龍門機構31之轴向 歸位’龍門機構即會位移至基板9〇尚未切割之側邊，再驅動切割刀頭 1344449 33沿龍門機構31之轴向進行位移並切割基板％，使基板％之四側邊分別 形成有切割痕9〇a ’而於各切割痕撕之間者為本體％，以外部分即為額料 %。切割·與切割痕的數目、位置、次序缺舉例，但本發明不限於此， 相關技藝人士亦可依實際需其調整。此外，於切割基板％而形成切割痕9此 之步驟後，即可以裂片棒22對準基板9〇之切割痕90a。另外，驅動裂片棒 22上升以頂持切割痕9〇a的時機，可在基板％已形成切割痕咖後，隨即 驅動裂片棒22上升；亦可在吸嘴別吸_料92後並驅動連接臂施力 時(即步驟5 t)，_驅_片棒22上升，但本發明稀於此相關技藝 人士亦可錄際需求調整裂片棒上升的時機。 步驟3 :移動連接臂40至額料92上方。當基板9〇完成切割時，即可 由連接臂40帶動吸嘴50位移至額料92之上方。 步驟4 :驅動連接臂40位移而帶動吸嘴5〇吸附額料％。經由控制汽 缸41控制吸嘴50下壓，可使吸嘴5〇吸附額料％。 步驟5 :驅動連接臂40施力而使額料％沿切割痕9〇a斷開。控制汽 缸4!控制吸嘴50下壓而提供向下壓力，其中，連接臂4〇與基板％之間 的夹角可視裂片條件而調整，夾角較佳地為45度至75度，即以與基板卯 呈45度至75度之施力方向對基板9〇施力為較佳’但不限於此。再者，在 控制吸嘴5G T㈣提供向T動時，村|i]時驅純#棒22上升而提供 向上壓力’由於額料92同時承受向上與向下壓力，使額料％可沿切割痕 9〇a斷開。待裂片完成後，即可移動吸嘴5〇將其吸附的額料％移除至額料 箱（圖未示）巾’若額料92裂片不完全時，可·控制汽缸41控制吸嘴 12 (S ) 1344449 50向上位移而提供向上拉力，藉以協助額科％完成裂片。 步驟6 :清除切板90啦1片絲後可經由龍門機 構之側邊所設置之清潔元件35，清除切割基板9〇所產生之粉塵，或可 由吸屢機構60之吸氣件62吸取散落於基板9〇上之粉塵。 本發明將切割、裂片之製程合㈣_，不僅可對不同尺寸之基板進行 切割、裂片，同時可減少切割、裂片之機台耗費的設置成本與配置機台所 需之空間，並可經由自動裂片與自動額料排除功能，減少人卫裂片成本， 同時可降低製程人員的負擔，進而縮短切割、裂片的時間，此外，本發明 亦可與前後製程進行整合而達到自動化之目的，縮短整個製程所耗費人力 與時間。另外，本發明亦可適用於具有至少兩層基板的上方基板額料之移 除之應用。 雖然本發明的技_容6經峨佳實施_露如上，雜並非用以限 定本發明’任域習此技藝者，在秘縣發明之精神所作些許之更動與 潤飾’皆航胁本發_麟内，因此本發明之鐘軸當視後附之申 凊專利範圍所界定者為準。 13Further, the cutting device 30 may be provided with a first static eliminating device % for eliminating static electricity; the first static dissipator 36 may be placed on the side of the cutting head 32 and the side of the % or the side of the gantry mechanism μ, but Not limited to this, related art people can also adjust the quantity and distribution position according to actual needs. In addition, the mounting table 2 disclosed in the present invention can additionally provide a splitting bar η for aligning the cutting marks of the substrate 9 to hold the substrate 90. The number and location of the splitting bars are merely examples here, and the relevant artisan can adjust according to the actual wire. Pick up. The first end 4 of the connecting arm 4〇 is connected to the arm 112 of the frame body (1) in a rotating manner, so that the connecting arm 4〇 can rotate the first end gamma core. 'By adjusting the angle between the connecting arm 40 and the substrate 90. In the preferred embodiment, the angle between the application direction of the connecting arm (10) and the substrate 9 () is preferably from 75 degrees to 75 degrees, but the invention is not limited thereto. , can also adjust the angle according to actual needs. Furthermore, the second static eliminator 42 may be disposed on the side of the connecting arm 40, or the second static eliminator 42 (@not shown) may be disposed at the second end to eliminate static electricity, but the present invention does not Limits, related art people can also adjust the position and number of use according to actual needs. And the mouth 5〇 is located at the first end 4〇b of the connection #4〇, when the connecting arm (10) drives the suction nozzle SO to apply force to the substrate 90, the suction nozzle 50 can vacuumly absorb the % of the material, and the % of the material along the cutting mark The coffee is disconnected. Correction, the suction of the nozzle 50 can actually adjust the position of the slave. The number and distribution of the nozzles herein are merely examples, and the present invention is not limited thereto. In addition, the connecting arm 40 of the foregoing description may further be provided with a control cylinder 4 for driving the nozzle 5 位移 displacement and controlling the pressure or the amount of upward movement of the suction nozzle 50, and the downward or upward pressure of the suction nozzle. As shown in FIG. 2 and FIG. 2, when the mounting table 20 carries the substrate 9〇, the gantry mechanism is driven to drive the cutting heads 32 and 33 to cut the substrate 9〇 (the arrow indicates the moving direction of the gantry machine (4)) Cutting marks 9〇ae are formed on both sides of the substrate 90. As shown in Fig. 26, Fig. 3a and Fig. 3B, the rotary cylinder 34 drives the cutting head 33 to rotate, and then drives the cutting blade edge along the axis of the gantry mechanism 31. The displacement is performed in the direction of the arrow (Fig. 3a), and another cut mark 90a is formed on the substrate %. After the cutting head 33 is cut and can be returned along the axial direction of the gantry mechanism 31, the driving gantry mechanism 31 is displaced to the side of the substrate 90 that has not been cut, and then the cutting cutter head 33 is driven to be displaced along the axial direction of the gantry mechanism 31. The cutting plate 9Q has four sides of the substrate, respectively, having a shape of 1344449 as a cut mark 90a, and between the respective cut marks 90a, a body 91, and the outer portion is a front material 92. The cutting mode, the cutting range, the cutting order, the bit movement order and the substrate body range are merely examples, but the invention is not limited thereto. The person skilled in the art can adjust according to actual needs. The invention can move the cutting head without moving the substrate to remove the billet, but it can also be used with the mounting table of the movable substrate according to actual needs. As shown in FIG. 4A and FIG. 4B, when the substrate 90 is cut, the nozzle 50 can be displaced by the connecting arm 4 to the upper portion of the bill 92, and then the control cylinder 41 is used to control the nozzle 5 to be pressed down. Not only can the suction nozzle 50 adsorb the weight 92, but also provide downward pressure, and the split rod 22 is aligned with the cutting mark 90a of the substrate 90 to provide upward pressure 'Because the front material 92 is subjected to upward and downward pressure, so that the material is fed. 92 can be broken along the cutting mark 90a. Furthermore, the angle between the connecting arm 4〇 and the substrate 9〇 can be adjusted by the lobing condition, preferably 45 degrees to 75 degrees, so that the angle between the pulling force of the connection f 4G and the substrate 90 is It is preferable to use the 7S degree, but the present invention is not limited thereto, and the angle can be adjusted according to actual needs. After the split is completed, the nozzle 50 can be sucked up and removed into the forehead (not shown). If the pellet 92 is incomplete, the control cylinder 41 can be used to control the displacement of the nozzle 5 to provide an upward pulling force to assist the amount 92 to complete the split. Continuing with the rotating unit of the rotating mechanism u, the moving arm 112 is slid, and at the same time, the connecting arm* connected to the arm 112 is rotated, that is, the unsplitting material 92 can be split as described above. This cutting method and moving order are merely examples', but the present invention is not limited thereto, and the related artisan adjusts according to actual needs. Fig. 5 is a view showing the frame structure of the substrate cutting and splitting device of the present invention. As shown in FIG. 5, the dust suction mechanism 6A can be connected to the frame body 10, wherein the dust suction mechanism is provided with a lifting cylinder & and a suction member 62. The 1344449 lifting cylinder 61 can drive the suction member 62 to move up and down. The gas member 62 draws the dust generated by the cutting head Ai and 33 on the cutting substrate 9〇. In addition, the frame 10 can be provided with a servo shaft 15 for driving the dust suction mechanism 60 to absorb the dust scattered on the substrate 90. However, the present invention is not limited thereto. The position and number of the dust suction mechanism can also be adjusted according to actual needs. In addition, as shown in FIG. 6, the substrate 90 may include a first substrate 93 and a second substrate 94, wherein the first substrate 93 is disposed above the second substrate 94, and the first substrate 93 may be cut according to the foregoing manner to form a cutting mark. 93a' continues to move the nozzle 5〇 to the top of the forehead 93b by the connecting arm 4〇, • the control cylinder 4丨 is used to control the suction nozzle 50 to press down, so that the suction nozzle 50 adsorbs the raw material 93b and is split with the split rod 22 for splitting. . In this embodiment, only the top material 9 of the upper first substrate 93 can be removed, and the second substrate 94 located below remains intact. The number of the substrates, the stacking manner and the position of the bills are merely examples, but the invention is not limited thereto, and those skilled in the art can adjust according to actual needs. The substrate cutting and splitting method of the present invention comprises the following steps: Step 1: Carrying the substrate %. The substrate 9 is carried by the mounting table 20, and the mounting table 2 is vacuum-adsorbed to the substrate 90 by a plurality of suction-absorbing members 7'. The substrate 90 is fixed to the mounting table 2 without causing sway or offset. Step 2: The substrate 90 is cut to form a cut mark 90a to divide the substrate 9A into a body 91 and a front material 92. The cutting heads 32 and 33 are displaced by the gantry mechanism 31 to cut the substrate 9A, and the cutting marks 90a are formed on both sides of the substrate 90. Thereafter, the rotary cutter 34 drives the cutter head 33 to rotate, and then drives the cutter head to be displaced along the axial direction of the gantry mechanism 31, and forms another strip of cut marks on the substrate 9 to be cut. And can be homaged along the axial direction of the gantry mechanism 31, the gantry mechanism will be displaced to the side of the substrate 9 〇 not yet cut, and then the cutting head 1344449 33 is displaced along the axial direction of the gantry mechanism 31 and the substrate is cut to make the substrate The side of each of the four sides is formed with a cut mark 9〇a ', and between the respective cut marks, the body is %, and the other part is the front material %. The number, position, and order of the cutting and cutting marks are not limited, but the present invention is not limited thereto, and those skilled in the art may adjust them according to actual needs. Further, after the step of cutting the substrate % to form the cut marks 9, the split bar 22 can be aligned with the cut marks 90a of the substrate 9. In addition, the timing of driving the splitting bar 22 to rise to hold the cutting mark 9〇a can drive the splitting bar 22 to rise after the substrate has formed the cutting mark, and can also drive the connection after the suction nozzle does not suck the material 92. When the arm is applied (i.e., step 5 t), the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Step 3: Move the connecting arm 40 above the bill 92. When the substrate 9 is cut, the nozzle 50 can be displaced by the connecting arm 40 to the top of the bill 92. Step 4: The displacement of the connecting arm 40 is driven to drive the suction nozzle 5 to absorb the % of the material. By controlling the suction nozzle 50 to be depressed by the control cylinder 41, the suction nozzle 5 can be made to adsorb the % of the material. Step 5: The driving link arm 40 is biased to break the front material % along the cutting mark 9〇a. Controlling the cylinder 4! Controlling the suction nozzle 50 to press down to provide downward pressure, wherein the angle between the connecting arm 4〇 and the substrate % can be adjusted according to the splitting condition, and the angle is preferably 45 to 75 degrees, that is, It is preferable that the substrate 卯 is biased toward the substrate 9 by a biasing direction of 45 to 75 degrees, but is not limited thereto. Furthermore, when the control nozzle 5G T (4) provides the movement to the T, the village | i] time drive pure # rod 22 rises to provide upward pressure 'because the fore material 92 simultaneously withstands the upward and downward pressure, so that the amount of material can be cut along The mark 9〇a is broken. After the splitting is completed, the suction nozzle 5 can be moved to remove the amount of the adsorbed material to the forehead (not shown). If the split 92 is not complete, the control cylinder 41 can control the nozzle 12 (S) 1344449 50 provides upward pullup by upward displacement to assist the forehead to complete the split. Step 6: After the cutting board 90 is removed, the dust generated by cutting the substrate 9 can be removed by the cleaning member 35 disposed on the side of the gantry mechanism, or can be absorbed by the suction member 62 of the suction mechanism 60. The dust on the substrate 9 is on the crucible. The invention combines the cutting and splitting process (4)_, not only can cut and split the substrates of different sizes, but also can reduce the installation cost and the space required for configuring the machine of the cutting and splitting machine, and can be automatically fragmented. With the automatic material removal function, the cost of the human lobes can be reduced, and the burden on the process personnel can be reduced, thereby shortening the time of cutting and splicing. In addition, the invention can also be integrated with the front and rear processes to achieve the purpose of automation and shorten the entire process. It takes manpower and time. In addition, the present invention is also applicable to the application of the removal of the upper substrate of the at least two substrates. Although the technique of the present invention has been implemented as described above, it is not intended to limit the present invention to those skilled in the art, and some of the changes and refinements made in the spirit of the invention of the secret county are all in the air. In the case of Lin, the clock shaft of the present invention is subject to the definition of the patent application scope attached thereto. 13
c S 1344449 【圖式簡單說明】 第1圖為本發明基板切割裂片裝置示意圖。 第2 A圖為本發明切割基板之示意圖（一）。 第2 B圖為本發明切割基板之示意圖（二）。 第3 A圖為本發明切割基板之示意圖（三）。 第3 B圖為本發明切割基板之示意圖（四）。 第4 A圖為本發明吸附額料之側視圖。 第4 B圖為本發明吸附額料之俯視圖。 第5圖為本發明基板切割裂片裝置之架體構造局部示意圖。 第6圖為本發明吸附另一額料之側視圖。 【主要元件符號說明】 I ..........基板切割裂片裝置 10..........架體 II ..........旋轉機構c S 1344449 [Simplified description of the drawings] Fig. 1 is a schematic view of a substrate cutting and splitting device of the present invention. 2A is a schematic view (1) of the cutting substrate of the present invention. Figure 2B is a schematic view (2) of the dicing substrate of the present invention. Figure 3A is a schematic view (3) of the dicing substrate of the present invention. Figure 3B is a schematic view (4) of the dicing substrate of the present invention. Figure 4A is a side view of the adsorbent material of the present invention. Figure 4B is a plan view of the adsorbent material of the present invention. Fig. 5 is a partial schematic view showing the structure of the frame of the substrate cutting and splitting device of the present invention. Figure 6 is a side view of the present invention for adsorbing another feed. [Explanation of main component symbols] I .......... Substrate cutting and splitting device 10.............Rack II .......... Rotating mechanism
III .........旋轉單元 112.........支臂 15..........伺服軸 20 ..........載置台 21 ..........吸附元件 22 ..........裂片棒 30 ..........切割單元 31 ..........龍門機構 14 1344449 32/33 .........切割刀頭 34 ..........旋轉缸 35 ..........清潔元件 36 ..........第一靜電消除器 40 ..........連接臂 40a.........第一端 40b.........第二端III ......... Rotating unit 112 ......... Arm 15 ..... Servo shaft 20 .......... mounting table 21 ..........Adsorption element 22 ..... split bar 30 ..... cutting unit 31 .......... Gantry mechanism 14 1344449 32/33 ......... cutting head 34 .......... rotating cylinder 35 .......... cleaning element 36 .... ...the first static eliminator 40 ..... connecting arm 40a ... ... first end 40b ... ... second end
41 ..........控制汽缸 42 ..........第二靜電消除器 50..........吸嘴 60 ..........吸塵機構 61 ..........升降汽缸 62 ..........吸氣件 90 ..........基板41 .......... control cylinder 42 .......... second static eliminator 50........ suction nozzle 60 .... ...dusting mechanism 61 .......... lifting cylinder 62 ..... suction member 90 .......... substrate
90a.........切割痕 91 ..........本體 92 ..........額料 93 ..........第一基板 93a.........割痕 93b 94 額料 第二基板90a.........cutting marks 91 ..........body 92 ..... front material 93 .......... first Substrate 93a.........cutting 93b 94 foreshore second substrate