CN106597703A - Cutting device for base plate and cutting method for base plate - Google Patents
Cutting device for base plate and cutting method for base plate Download PDFInfo
- Publication number
- CN106597703A CN106597703A CN201611181847.XA CN201611181847A CN106597703A CN 106597703 A CN106597703 A CN 106597703A CN 201611181847 A CN201611181847 A CN 201611181847A CN 106597703 A CN106597703 A CN 106597703A
- Authority
- CN
- China
- Prior art keywords
- cutter
- guide rail
- substrate
- group
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 70
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000011521 glass Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- OANVFVBYPNXRLD-UHFFFAOYSA-M propyromazine bromide Chemical compound [Br-].C12=CC=CC=C2SC2=CC=CC=C2N1C(=O)C(C)[N+]1(C)CCCC1 OANVFVBYPNXRLD-UHFFFAOYSA-M 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a cutting device for a base plate. The cutting device comprises a workbench, a rotating frame and a cutter, wherein the workbench is used for loading the base plate; the rotating frame is rotatably arranged above the workbench; the cutter is capable of sliding along the rotating frame; a first set of guide rail and a second set of guide rail which are vertical to each other are arranged on the rotating frame; the cutter can cut the base plate placed on the workbench by sliding on the rotating frame along the first set of guide rail and the second set of guide rail. The invention also discloses a cutting method for the base plate. According to the invention, the rotating frame capable of rotating is arranged on the workbench for loading the base plate, so that a cutting track and a base plate cutting boundary can be kept consistent in the manner of finely adjusting the direction of the rotating frame till the guide rail on the rotating frame is consistent to the base plate cutting boundary and cutting by the cutter along the corresponding guide rail when the supplied material base plate is shifted; the cutting waste caused by the shifting of the supplied material, namely, a glass base plate, can be avoided; the quality of the product is certainly increased; the product diversity is benefited; the competitiveness of the product in the market is promoted.
Description
Technical field
The present invention relates to face plate manufacturing technology field, more particularly to a kind of cutter for substrate and method for dividing substrate.
Background technology
Liquid crystal indicator (LCD, i.e. Liquid Crystal Display) has the crowd such as thin fuselage, power saving, radiationless
Many advantages, are widely used.TFT-LCD (thin film transistor-liquid crystal display,
That is Thin Film Transistor-LCD) popularize very much in daily life, such as TV, computer, mobile phone display screen, the field
Technology is constantly updated with preferably service consumer.Meanwhile, continuous product up-gradation wants the TFT-LCD to liquid crystal indicator
Ask higher, it is proposed that the requirement of higher quality.
The panel of TFT-LCD is made up of TFT substrate and CF (color filter, i.e. colored filter) substrate, in mould
Big glass sheet is cut into the panel of small pieces by composition box to carrying out cutting processing procedure after group.The cutting track of general diamant
Can only horizontally or vertically carry out, but when glass supplied materials offsets, the track of diamant is still horizontally or vertically
Carry out, thus may result in panel cutting skew it is excessive, cause cutter to switch in Display panel face, or cutting after, outside face
Remaining offal timber excessively on panel, so as to affect product yield and quality, to production serious puzzlement is caused.
The content of the invention
In view of the deficiency that prior art is present, the invention provides a kind of cutter for substrate and method for dividing substrate, can
To avoid because cutting is scrapped caused by the skew of glass substrate supplied materials.
In order to realize above-mentioned purpose, following technical scheme is present invention employs：
A kind of cutter for substrate, including the workbench for bearing substrate, is rotatably disposed within the workbench top
Rotating turret and along the slidable cutter of the rotating turret；The rotating turret be provided with orthogonal first group of guide rail and
Second group of guide rail, the cutter slide and to putting along first group of guide rail and second group of guide rail on the rotating turret
The substrate put on the workbench is cut.
Used as one of which embodiment, first group of guide rail and second group of guide rail include multiple being parallel to each other
Sub- guide rail.
As one of which embodiment, on each described sub- guide rail the cutter are slidably provided with.
Used as one of which embodiment, at least two described sub- guide rails for intersecting are interconnected, and the cutter are even
Slide on two logical sub- guide rails.
As one of which embodiment, guide groove is offered on each described sub- guide rail, on all of sub- guide rail
Guide groove is interconnected.
Used as one of which embodiment, the cutter include cutter head and the handle of a knife for fixing the cutter head, described
Handle of a knife is slidingly disposed on first group of guide rail and/or second group of guide rail.
Used as one of which embodiment, the cutter also include being connected to prolonging between the cutter head and the handle of a knife
Semi-girder, the two ends of the adjutage are hinged respectively with the cutter head and the handle of a knife.
Used as one of which embodiment, described cutter for substrate also includes translation mechanism, and the translation mechanism connects
It is connected between the rotating turret and the workbench, for being adjusted to the position of the rotating turret.
Used as one of which embodiment, described cutter for substrate also includes contraposition module, for capturing substrate four
The mark point in week simultaneously controls the rotating turret rotation, makes first group of guide rail and second group of guide rail corresponding with substrate respectively
Cut-boundary it is consistent.
Another object of the present invention is to provide a kind of method for dividing substrate using described cutter for substrate, wrap
Include：
The cut-boundary of identification substrate；
Rotating turret, until the cut-boundary pair of first group of guide rail and second group of guide rail and the substrate
Should；
Control cutter are cut along first group of guide rail and second group of slide to the substrate on the workbench
Cut.
The present invention by being provided with rotatable rotating turret on the workbench of bearing substrate, when the substrate of supplied materials occur it is inclined
During shifting, only need the direction of fine-adjustment rotary frame consistent with substrate cut border to guide rail thereon, cutter are by along corresponding
Guide rail cutting can ensure that cutting track is consistent with substrate cut border, can avoid due to caused by the skew of glass substrate supplied materials
Cutting is scrapped, and the quality of product is improve to a certain extent, beneficial to the multiformity of product, improving product competition in the market
Power.
Description of the drawings
Fig. 1 is a kind of use state figure of the cutter for substrate of the embodiment of the present invention.
Fig. 2 is a kind of mounting structure schematic diagram of cutter of the cutter for substrate of the embodiment of the present invention.
Fig. 3 is a kind of handle of a knife position view of cutter of the cutter for substrate of the embodiment of the present invention.
Fig. 4 is the method for dividing substrate schematic diagram of the embodiment of the present invention.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, it is right below in conjunction with drawings and Examples
The present invention is further described.It should be appreciated that specific embodiment described herein is only to explain the present invention, and without
It is of the invention in limiting.
Refering to Fig. 1, the cutter for substrate of the embodiment of the present invention includes workbench 10 for bearing substrate, rotatably
Located at the rotating turret 20 of the top of workbench 10 and along the slidable cutter 30 of rotating turret 20.Wherein, rotating turret 20 is provided with
Orthogonal first group of guide rail 21 and second group of guide rail 22, cutter 30 are turning along first group of guide rail 21 and second group of guide rail 22
In moving frame 20 slide and the substrate to being placed on workbench 10 cuts.
In addition, cutter for substrate also has contraposition module, the contraposition module includes CCD (Charge-coupled
Device, charge coupled cell) or high-resolution camera, by capturing substrate (on mother matrix or on submounts border) surrounding
Mark point simultaneously rotates according to the position control rotating turret 20 of mark point, make first group of guide rail 21 and second group of guide rail 22 respectively with base
The corresponding cut-boundary of plate is consistent.
Preferably, first group of guide rail 21 and second group of guide rail 22 include multiple sub- guide rails being parallel to each other.For example, first
The both sides on the rectangle cutting border of the adjacent sub- guide rail difference counterpart substrate 1 of each two, second group of 22 kinds of guide rail in group guide rail 21
The other both sides on the rectangle cutting border of the adjacent sub- guide rail difference counterpart substrate 1 of each two.Cutter 30 are along first group of guide rail
21 and second group of guide rail 22 cut after one piece of big mother matrix is cut into into multiple little substrates.
In the present embodiment, rotating turret 20 is hollowed-out board, first group of guide rail 21 and second group of guide rail 22 per on individual sub- guide rail
Guide groove 200 is offered, the guide groove 200 on all of sub- guide rail interconnects to form engraved structure.So, first group of He of guide rail 21
Second group of guide rail 22 is integrally formed a netted guide rail on rotating turret 20, even if only one of which cutter 30, also can complete
Cutting processing procedure in each substrate boundaries all directions.
As shown in Figures 2 and 3, cutter 30 include cutter head 31 and the handle of a knife 32 for fixing cutter head 31, and handle of a knife 32 can be slided
Dynamicly on first group of guide rail 21 and/or second group of guide rail 22.A cutter 30 are slidably provided with per individual sub- guide rail,
To improve cutting efficiency.It is understood that the hollow out construction of the rotating turret 20 due to the present embodiment so that cutter 30 also may be used
With only one of which.
In other embodiments, at least two sub- guide rails for intersecting are interconnected so that cutter 30 can be in connection
Between two sub- guide rails slidably, the quantity of cutter 30 can be reduced as far as, can be adjusted according to practical situation during making
The quantity of whole cutter, balance cost and working performance.
In addition, cutter 30 can also include the adjutage being connected between cutter head 31 and handle of a knife 32, the two ends of adjutage
It is hinged with cutter head 31 and handle of a knife 32 respectively.In use, can be right by controlling the rotation of the flexible and cutter head 31 of adjutage
The position of cutter head 31 is finely adjusted, and the cutting position for making cutter head 31 is aligned after cut-boundary, and cutter 30 just start along sub- guide rail
Slip is cut, and can improve the precision of cutting processing procedure.
In one embodiment, cutter for substrate also has translation mechanism, and for example, translation mechanism can be multiple
The swing arm of 360 ° of swings, the translation mechanism is connected between rotating turret 20 and workbench 10, for the position to rotating turret 20
It is finely adjusted.It is general to play a part of to be adjusted the cutting position of cutter 30.
In addition, with reference to shown in Fig. 4, present invention also offers a kind of method for dividing substrate, including：
The cut-boundary of identification substrate；
Rotating turret 20, until first group of guide rail 21 and second group of guide rail 22 are corresponding with the cut-boundary of substrate；
Control cutter 30 slide along first group of guide rail 21 and second group of guide rail 22, and the substrate on workbench 10 is cut
Cut.
Wherein, recognize the cut-boundary of substrate particular by using the contraposition module crawl para-position cut above workbench 10
To in glass master after the labelling of surrounding, corresponding diamant moves to relevant position and carries out cutting operation.
In sum, it is of the invention by being provided with rotatable rotating turret on the workbench of bearing substrate, when supplied materials
When substrate shifts, only need that the direction of fine-adjustment rotary frame is consistent with substrate cut border to guide rail thereon, cutter pass through
Can ensure that cutting track is consistent with substrate cut border, enables cutting to follow glass substrate supplied materials along the cutting of corresponding guide rail
Offset direction timely adjusted, can avoid due to glass substrate supplied materials skew caused by cutting scrap, from mechanical floor
Face improves process capability, and the problem bigger for the cutting skew caused because of advanced lines factory glass substrate length is served very well
Improvement result, the quality of product is improve to a certain extent, beneficial to the multiformity of product, improving product in the market competing
Strive power.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, on the premise of without departing from the application principle, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (10)
1. a kind of cutter for substrate, it is characterised in that include the workbench (10) for bearing substrate, be rotatably disposed within institute
State rotating turret (20) above workbench (10) and along the slidable cutter (30) of the rotating turret (20)；The rotating turret
(20) orthogonal first group of guide rail (21) and second group of guide rail (22) are provided with, the cutter (30) are along described first group
Guide rail (21) and second group of guide rail (22) are slided and to being placed on the workbench (10) on the rotating turret (20)
Substrate cut.
2. cutter for substrate according to claim 1, it is characterised in that first group of guide rail (21) and described second
Group guide rail (22) includes multiple sub- guide rails being parallel to each other.
3. cutter for substrate according to claim 2, it is characterised in that be slidably provided with each described sub- guide rail
One cutter (30).
4. cutter for substrate according to claim 2, it is characterised in that at least two described sub- guide rails for intersecting are mutual
Connection, the cutter (30) are slided on two sub- guide rails of connection.
5. cutter for substrate according to claim 2, it is characterised in that offer guide groove on each described sub- guide rail
(200), the guide groove (200) on all of sub- guide rail is interconnected.
6. cutter for substrate according to claim 1, it is characterised in that the cutter (30) including cutter head (31) and
For fixing the handle of a knife (32) of the cutter head (31), the handle of a knife (32) be slidingly disposed at first group of guide rail (21) and/
Or on second group of guide rail (22).
7. cutter for substrate according to claim 6, it is characterised in that the cutter (30) also include being connected to institute
State the adjutage between cutter head (31) and the handle of a knife (32), the two ends of the adjutage respectively with the cutter head (31) and described
Handle of a knife (32) is hinged.
8. cutter for substrate according to claim 1, it is characterised in that also including translation mechanism, the translation mechanism
It is connected between the rotating turret (20) and the workbench (10), for being adjusted to the position of the rotating turret (20).
9. according to the arbitrary described cutter for substrate of claim 1-8, it is characterised in that also including contraposition module, for grabbing
Take the mark point of substrate surrounding and control the rotating turret (20) rotation, make first group of guide rail (21) and described second group is led
Rail (22) is consistent with the corresponding cut-boundary of substrate respectively.
10. a kind of usage right requires the method for dividing substrate of the arbitrary described cutter for substrate of 1-9, it is characterised in that bag
Include：
The cut-boundary of identification substrate；
Rotating turret (20), until the cutting of first group of guide rail (21) and second group of guide rail (22) and the substrate
Border correspondence；
Control cutter (30) is slided along first group of guide rail (21) and second group of guide rail (22), on the workbench (10)
Substrate cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611181847.XA CN106597703B (en) | 2016-12-20 | 2016-12-20 | A kind of cutter for substrate and method for dividing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611181847.XA CN106597703B (en) | 2016-12-20 | 2016-12-20 | A kind of cutter for substrate and method for dividing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106597703A true CN106597703A (en) | 2017-04-26 |
| CN106597703B CN106597703B (en) | 2019-09-17 |
Family
ID=58601905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611181847.XA Active CN106597703B (en) | 2016-12-20 | 2016-12-20 | A kind of cutter for substrate and method for dividing substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106597703B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524003A (en) * | 2024-01-02 | 2024-02-06 | 长春希龙显示技术有限公司 | Display unit and repairing method thereof |
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|---|---|---|---|---|
| CN1856392A (en) * | 2003-09-24 | 2006-11-01 | 三星钻石工业株式会社 | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| US20070195255A1 (en) * | 2006-02-22 | 2007-08-23 | Samsung Electronics Co., Ltd. | Assembled substrate for liquid crystal panel, method of cutting the assembled substrate, and liquid crystal panel manufatured thereby |
| JP2010166003A (en) * | 2009-01-19 | 2010-07-29 | Yamaha Fine Technologies Co Ltd | Film laminating device |
| CN101985388A (en) * | 2009-07-29 | 2011-03-16 | 北京京东方光电科技有限公司 | Cutting device and cutting method for liquid crystal glass substrate after cutting of paired boxes |
| TWI344449B (en) * | 2008-02-19 | 2011-07-01 | Au Optronics Corp | Apparatus and method for scribing and breaking substrate |
| CN103353681A (en) * | 2013-06-20 | 2013-10-16 | 深圳市华星光电技术有限公司 | Device and method for cutting LCD (liquid crystal display) panel |
| CN103465294A (en) * | 2013-09-12 | 2013-12-25 | 深圳市华星光电技术有限公司 | Cutting device |
| CN103713409A (en) * | 2013-12-27 | 2014-04-09 | 合肥京东方光电科技有限公司 | Liquid crystal display panel cutting device and method |
| CN205563013U (en) * | 2016-04-12 | 2016-09-07 | 徐州纳帝电子科技有限公司 | Liquid crystal display panel's that high efficiency saved time cutting device |
-
2016
- 2016-12-20 CN CN201611181847.XA patent/CN106597703B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1856392A (en) * | 2003-09-24 | 2006-11-01 | 三星钻石工业株式会社 | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| US20070195255A1 (en) * | 2006-02-22 | 2007-08-23 | Samsung Electronics Co., Ltd. | Assembled substrate for liquid crystal panel, method of cutting the assembled substrate, and liquid crystal panel manufatured thereby |
| TWI344449B (en) * | 2008-02-19 | 2011-07-01 | Au Optronics Corp | Apparatus and method for scribing and breaking substrate |
| JP2010166003A (en) * | 2009-01-19 | 2010-07-29 | Yamaha Fine Technologies Co Ltd | Film laminating device |
| CN101985388A (en) * | 2009-07-29 | 2011-03-16 | 北京京东方光电科技有限公司 | Cutting device and cutting method for liquid crystal glass substrate after cutting of paired boxes |
| CN103353681A (en) * | 2013-06-20 | 2013-10-16 | 深圳市华星光电技术有限公司 | Device and method for cutting LCD (liquid crystal display) panel |
| CN103465294A (en) * | 2013-09-12 | 2013-12-25 | 深圳市华星光电技术有限公司 | Cutting device |
| CN103713409A (en) * | 2013-12-27 | 2014-04-09 | 合肥京东方光电科技有限公司 | Liquid crystal display panel cutting device and method |
| CN205563013U (en) * | 2016-04-12 | 2016-09-07 | 徐州纳帝电子科技有限公司 | Liquid crystal display panel's that high efficiency saved time cutting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524003A (en) * | 2024-01-02 | 2024-02-06 | 长春希龙显示技术有限公司 | Display unit and repairing method thereof |
| CN117524003B (en) * | 2024-01-02 | 2024-04-02 | 长春希龙显示技术有限公司 | Display unit and repairing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106597703B (en) | 2019-09-17 |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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