JP2007045656A - Work dividing apparatus and display panel manufactured using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a work dividing apparatus having high scribe working efficiency. <P>SOLUTION: A work dividing apparatus is provided with a scribe block 106 having a scribe cutter 114 on a unit substrate 225 comprising a brittle material with a deposition film layer and moving back and forth along the surface of a work 23, a 1st peeling block 226a having a 1st peeling cutter 224a capable of working in a forward step and a 2nd peeling block 226b having a 2nd peeling cutter 224b capable of working in a backward step. The scribe cutter, the 1st peeling cutter and the 2nd peeling cutter are capable of selecting a working state and a non-working state independently. The scribing is carried out in the back and forth movement of the unit substrate to improve the working efficiency. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a workpiece cutting device used for cutting substrates such as glass and plastic, and a display board manufactured using the workpiece cutting device.

  When making display plates used for display parts such as various electronic equipment parts, such as liquid crystal plates, EL plates, touch panel plates, or slide glasses used for the preparation of microscope specimens, a large substrate is divided into a predetermined size. A small substrate is obtained. For cutting a large substrate, a large substrate is fixed on the surface of the cutting device by vacuum suction or the like, and the outer peripheral portion is formed of a hard member such as cemented carbide or diamond on one side of the substrate. After a linear streak called scribing is applied by the wheel-shaped cutter, the substrate is pressed along the scribe line by pressing means such as a press or a roller from the opposite surface side with a cutting device (breaker), In general, a method of cutting by causing a crack generated in a scribe groove and extending in a direction perpendicular to the substrate surface is performed.

  FIG. 5 is a side view of a workpiece cutting apparatus in the background art, FIG. 5 (a) shows a workpiece cutting apparatus for processing a workpiece without a film forming layer, and FIG. 5 (b) shows a work with a film forming layer. FIG. 6 is a perspective view showing an appearance of a substrate that is a material of a liquid crystal panel as a background technology, and FIG. 7 is a diagram showing a moving unit of the workpiece cutting device as a material of the liquid crystal panel. FIG. 8 is a perspective view showing an appearance of the substrate after operating the liquid crystal panel manufacturing apparatus as a background art, and FIG. FIG. 8B is a perspective view showing the appearance of a liquid crystal panel as a background art, and FIG. 9A is a perspective view showing the front side, FIG. b) shows the back side, and FIG. 10 shows the substrate after processing with the workpiece cutting device of the background art. Using a cross-sectional view, a diagram showing the relationship between the reciprocal process and the processing portion of the scribe cutter and peeling cutter, FIG. 11 shows a cross-sectional view of the swing type scribing cutter as background art.

First, a general configuration and operation of a conventional workpiece cutting device will be described with reference to FIG.
The moving block 1 is the entire unit straddling the U-shaped portion on the main body 9, and the main body is shown in FIG. ) Can move a predetermined amount in the vertical direction. A timing belt 4 is provided on the moving block 1, and a unit substrate 5 is fixed to the timing belt 4. The unit substrate 5 and the scribe block 6 provided on the unit substrate 5 are driven by driving means such as a motor (not shown). The required amount can be moved left and right along the guide rail 8 by the movement of the timing belt 4 accompanying the rotation of the pulley 7. The main body 9 to which the moving block 1 is attached is configured integrally with a work table 11 and a support base 12, and a work 13 can be fixed to the upper surface of the work table 11 by a fixing means such as vacuum suction. The scribe block 6 on the unit substrate 5 is provided with a scribe cutter 14 provided below the scribe block 6 against a workpiece 13 such as a glass substrate by a known pressing means such as hydraulic pressure, pneumatic pressure or spring force (not shown). A scribe line is formed on the work 13 when moving (for example, in the right direction) along the guide rail 8 made of a known ball slide or the like while being pressed with a load of. In the returning process of the scribe block 6, the scribe cutter 14 is retracted by using the pressing means and the original position of the unit substrate 5 is returned. Further, the work table 11 and the support base 12 can be rotated by 90 ° as viewed from above in FIG. With this configuration, the work 13 on the work table 11 can be scribed in a lattice shape, and small pieces can be cut out from a large work 13 such as a glass plate using this apparatus.

  In the normal workpiece cutting apparatus 10, scribing is performed in one process (for example, forward process) in the reciprocating process of the scribe block 6. However, there is a need for scribing in both the forward and backward processes due to a request for speeding up the scribe work, and one technology for realizing this is, for example, Patent Document 1 below.

Japanese Patent Application Publication No. 9-249427

  The technique disclosed in Patent Document 1 will be described with reference to FIG. The swing part 15 is supported by the cutter holder 16 so as to be swingable. A scribing cutter 14 is attached to the tip of the swinging portion 15, and when the cutter slide 17 (which constitutes the lower end portion of the scribing block in FIG. 5) moves during scribing, the swinging portion 15 is centered about the shaft 18 and the cutter holder 16. As a result, the scribe cutter 14 moves straight following the movement of the cutter slide 17.

  By the way, the small piece cut out from the large work substrate may be finished with a film-forming layer such as a phase difference plate or a polarizing plate and then finished as a finished product as a display plate. In such a case, in recent years, considering the entire process up to the completion of the product, in order to reduce the production cost as a total product, it is also possible to cut out individual products directly from the substrate on which these film formation layers have been previously provided. Increased. As shown in FIG. 5 (b), the workpiece cutting apparatus used in such a case is for stripping a film forming layer at the tip of the unit substrate 25 in addition to the scribe block 6 already described. The workpiece | work parting apparatus 20 provided with the peeling block 26 which has the peeling cutter 24 is used. In the workpiece cutting device 20, in the forward process of the unit substrate 25, the film forming layer on the surface of the workpiece 23 is scraped off by the peeling cutter 24, and the substrate is exposed in a band shape to form a band-shaped peeling region. Subsequent to this, the scribe cutter 14 moves along the strip-like peeling region while contacting the substrate to form a scribe line. In the returning process of the unit substrate 25, the peeling cutter 24 and the scribe cutter 14 are raised and returned to the workpiece 23 in a non-contact state. Thereafter, the unit substrate 25 is moved by a predetermined amount in the vertical direction of FIG. 5B with respect to the main body portion 9 by the pair of left and right ball screws 2 and the guide 3, and the above operation is repeated at the position where the scribing is sequentially desired. Next, the work 23 is rotated by 90 ° in a horizontal plane, and similarly, an orthogonal scribe line is formed.

  The manufacturing of the liquid crystal panel will be described as an example of processing the workpiece 23 with the film-forming layer. As a preparation for this, first, the configuration of the liquid crystal cell will be described, and then the manufacturing order will be described with reference to FIGS. .

  As shown in FIG. 9, the liquid crystal cell 50 is composed of a glass substrate with the outer periphery bonded, and a liquid crystal cell in which liquid crystal is sealed between the glass substrates, that is, a TFT side glass substrate 31 and a color filter side glass substrate. It consists of cells 41, and the one side surface side of the TFT side glass substrate 31 protrudes from the side surface of the color filter side glass substrate 41. A connection terminal 32 </ b> A for driving the liquid crystal panel is formed on the inner surface side of the protruding portion 32. An FPC (Flexible Printed Circuit) or COG (Chip On Glass) for receiving an electrical signal and lighting the liquid crystal cell 50 in a state where the liquid crystal cell 50 is mounted on the liquid crystal display device is connected to the connection terminal 32A. The This liquid crystal cell 50 is applied to a backlight type liquid crystal display device, and a polarizing plate (TFT side polarizing plate 33, color filter side polarizing plate 43) is provided on the outer surface of each liquid crystal cell 50 over substantially the entire area. It is pasted.

  As shown in FIG. 6, a liquid crystal panel substrate 60 as a material for manufacturing the liquid crystal cell 50 includes a liquid crystal panel glass substrate 61 as a main component, and the liquid crystal panel glass substrate 61 is bonded to each other. The TFT side large plate glass substrate 30 and the color filter side large plate glass substrate 40 are formed. The liquid crystal panel glass substrate 61 is formed with a plurality of TFT side glass substrates 31 and a color filter side glass substrate 41 which are divided and arranged adjacent to each other in a grid pattern, and each pair of TFT side glass substrates 31. Liquid crystal is sealed between the color filter side glass substrates 41. A TFT side polarizing plate 62 and a color filter side polarizing plate 63 are attached to the outer surfaces of the TFT side large plate glass substrate 30 and the color filter side large plate glass substrate 40, respectively, so as to cover the entire surface. On each outer surface of the TFT side polarizing plate 62 and the color filter side polarizing plate 63, a protective film forming layer is laminated. (Not shown)

  The large liquid crystal panel substrate 60 is set on a bed of a glass cutting device (in this case, a liquid crystal panel manufacturing device) so that the TFT side is on the upper side. The moving unit 70 in FIG. 7 is a model obtained by extracting and modeling the functions of the peeling block 26 and the scribe block 6 of the glass cutting apparatus 20 in FIG. 5B. The moving unit 70 is adjacent to the TFT side. When the liquid crystal panel substrate 60 moves in one direction on the boundary between the glass substrate cells, the TFT side polarizing plate 62 is scraped off by the peeling cutter 24 while taking out the chips 71, so that the TFT side large plate glass substrate 30 is removed. A strip-shaped peeling region 72 is formed in a strip shape. Following this, the scribe cutter 14 moves along the strip-like peeling region 72, and a scribe line 73 is formed. Thereafter, the liquid crystal panel substrate 60 is translated in the horizontal plane, the above operations are sequentially repeated with respect to the boundary, and then the liquid crystal panel substrate 60 is rotated by 90 ° in the horizontal plane, thereby forming scribe lines 73 that are orthogonal to each other. Refer to FIG.

  Next, the liquid crystal panel substrate 60 is turned over, and the above operation is repeated on the color filter side, but this time, the operation is slightly different from the operation on the TFT side. That is, a predetermined distance is formed to form the protrusion 32 (see FIGS. 8B and 9) on the TFT side glass substrate 31 together with the boundary of the color filter side glass substrate 41 facing the boundary of the TFT side glass substrate 31. A protruding boundary is set across. Then, the liquid crystal panel substrate 60 moves in one direction from one end to the other in order alternately with the boundary 74 and the protrusion formation boundary 75 of the glass substrate 41 on the color filter side. As a result, the color filter side polarizing plate 63 is scraped off by the peeling cutter 24, the color filter side glass substrate 40 is exposed in a strip shape, and strip strip regions 72 are formed alternately, and subsequently, along the strip strip region 72. Then, the scribe cutter 14 moves and a scribe line is formed. Thereafter, the liquid crystal panel substrate 60 is rotated 90 ° in a horizontal plane, and the above operation is repeated on the boundary of the color filter side glass substrate 41 facing the boundary of the TFT side glass substrate 31 to form a scribe.

  Thereafter, a load is applied to the liquid crystal panel substrate 60 as necessary, and the liquid crystal panel substrate 60 is divided into a pair of TFT side glass substrate 31 and color filter side glass substrate 41. At this time, a portion existing between the color filter side glass substrate boundary 74 and the protrusion formation boundary 75 in the color filter side glass substrate 40 is removed as an unnecessary portion 76. Thereby, the protrusion 32 is formed on the TFT side glass substrate 31. Finally, COG and FPC are connected to the connection terminals provided on the projecting portion 32 to complete the liquid crystal cell 50 as a display panel.

  As described above, in order to increase productivity as a display panel, as a representative example of processing a large glass substrate with a film formation layer, a liquid crystal panel is manufactured from a large glass substrate to a small glass substrate using a workpiece dividing device. The manufacturing method has been described as an example.

  As described in the background art, when a substrate without a film formation layer is processed, it is processed in a reciprocating manner in order to increase productivity. However, when the conventional workpiece cutting apparatus is used, it is impossible to scribe a large substrate having a film formation layer such as the liquid crystal panel substrate 60 even in the returning process. For this reason, when processing a large substrate with a film-forming layer with a conventional workpiece cutting apparatus, there is a limit in terms of productivity improvement. If this state is described again with reference to FIG. 10 which is a BB cross-sectional view of FIG. 8 (b), the machining is performed only in the forward process, and the return process must be returned empty (no workpiece machining). For example, the strip-like peeling region 72 is formed at the scribe locations shown (corresponding to the number of times two liquid crystal cells are cut out when viewed in the BB cross-sectional direction in FIG. 8B in a total of six locations). However, the total number of reciprocations of the unit substrate 25 for processing the scribe line 73 has reached six times, which has been an obstacle to improving productivity.

  The present invention has been made to solve the above problems. As a means for solving the problem, the invention according to claim 1 of the present invention is a work cutting apparatus for fixing a work made of a brittle material such as glass or plastic on which a film formation layer is formed to a work table and dividing the work into a plurality of parts. A unit substrate that reciprocally moves along the surface of the workpiece, and a scribe cutter that can move vertically in the unit substrate and at the same time move in the moving direction of the unit substrate is provided at the tip of the unit substrate. A scribe block having a peeling block having a vertically movable peeling cutter at the tip, and a workpiece machining state in which the scribe cutter and the peeling cutter are pressed against the workpiece, and a workpiece non-working separated from the workpiece A workpiece cutting device including a control unit that can independently select any of the states.

  The invention according to claim 2 of the present invention is the peeling cutter provided in the peeling block when the peeling block precedes the workpiece and the unit substrate operates in a direction in which the scribe block follows. In the strip-shaped peeling region produced in the film-forming layer, a first scribe line is produced using a scribe cutter provided for the scribe block, the scribe block is preceded, and the peeling block follows the direction, When the unit substrate operates with respect to the workpiece, a second scribe line is produced using a scribe cutter provided in a scribe block in the strip-like peeling region produced in the film formation layer. It is a workpiece cutting device.

  Further, the invention according to claim 3 of the present invention is a unit for reciprocating relatively along the surface of a workpiece in a glass cutting apparatus for fixing a workpiece with a film to a work table and dividing it into a plurality of pieces. A scribe block having a scribe cutter at the tip thereof, which is vertically movable and simultaneously swingable in the moving direction of the unit substrate, and is positioned vertically on one end of the scribe block. The first peeling cutter, which is movable, is mounted on the other end of the scribe block, and the second peeling cutter, which is positioned at the other end of the scribe block, is mounted on the other end of the scribe block. A second peeling block attached in a direction away from the scribe block; and the scribe cutter and the first The separation cutter and the second peeling cutter include a control unit that can independently select either a workpiece processing state pressed against the workpiece or a workpiece non-processing state separated from the workpiece. It is a workpiece cutting device.

  The invention according to claim 4 of the present invention is such that when the unit substrate moves with respect to the workpiece in a direction in which the first peeling block precedes and the scribe block follows. A first scribe line is prepared using a scribe cutter provided in a scribe block in a strip-like release region prepared in the film-forming layer by the first release cutter prepared in the step, the second release block precedes, When the unit substrate is operated with respect to the workpiece in the direction in which the scribe block follows, the scribe block is scribed in the strip-like peeling region formed in the film-forming layer by the second peeling cutter provided for the second peeling block. 4. The workpiece cutting device according to claim 3, wherein the second scribe line is produced using a scribe cutter provided in the block. It is.

  The invention according to claim 5 of the present invention is the workpiece cutting device according to any one of claims 1 to 4, wherein the workpiece is made of glass or plastic.

  The invention according to claim 6 of the present invention is a display board manufactured by the work cutting apparatus according to claim 5.

  As an effect of the invention, the workpiece cutting device of the present invention according to claim 1 can independently select a workpiece machining state in which the scribe cutter and the peeling cutter are pressed against the workpiece or a workpiece non-working state separated from the workpiece. As a result, the degree of freedom of the form that can be processed during one reciprocation process of the unit substrate is increased, and the work scribing efficiency can be increased by selecting a processing method according to the work.

  Moreover, since the workpiece | work cutting device of this invention concerning Claim 2 can process two scribe lines with one reciprocation process of a unit board | substrate with respect to the workpiece | work with a film formation, it is in spite of simple apparatus structure. The scribing efficiency of the work with film formation can be increased.

  In addition, since the workpiece cutting apparatus according to the third aspect of the present invention has two peeling blocks, the structure of the apparatus is slightly more complicated than that of the apparatus of the first aspect. It becomes possible to incorporate more processing modes into the process, and the scribe processing efficiency is further increased.

  Moreover, since the workpiece | work parting apparatus of this invention concerning Claim 4 can process two strip | belt-shaped peeling areas and two scribe lines on the workpiece | work surface in one reciprocation process of a unit board | substrate, when scribe processing efficiency becomes high At the same time, there is no restriction on the scribing position existing in the case of the workpiece cutting device according to claim 2.

  Further, the present invention according to claim 5 is a case where the brittle material constituting the workpiece is made of glass or plastic, and particularly when the scribe processing is performed by the workpiece cutting device according to any one of claims 1 to 4. Demonstrate the effect.

  Moreover, the display board according to claim 6 can be manufactured at low cost by using the workpiece cutting device of the present invention having high scribing efficiency.

  Next, the best mode for carrying out the present invention (hereinafter abbreviated as “embodiment”) will be described with reference to FIGS. FIG. 1 is a side view of a workpiece cutting apparatus according to a first embodiment of the present invention, and FIG. 2 is a sectional view of a liquid crystal panel substrate processed by the workpiece cutting apparatus according to the first embodiment of the present invention. FIG. 3 is a side view of the workpiece cutting device of the second embodiment of the present invention, and FIG. 4 is a workpiece cutting device of the second embodiment of the present invention. FIG. 5 is an explanatory diagram showing the relationship between the reciprocation process of the scribe cutter and the peeling cutter and the processing location, using a sectional view of the processed liquid crystal panel substrate. By the way, the workpiece cutting apparatus according to the embodiment of the present invention shown in FIGS. 1 and 3 is the same as the workpiece cutting apparatus already described with reference to FIG. 5 in the background art except for the peeling block and the control unit (not shown). . Accordingly, the same components as those described in the background art are denoted by the same reference numerals, and description thereof will be omitted or will be simplified.

  The workpiece cutting apparatus according to the first embodiment of the present invention includes a scribe block 106 and a peeling block 126 on a unit substrate 125 as shown in FIG. The unit substrate 125 fixed to the timing belt 4 is movable along the guide rail 8 by the movement of the timing belt 4. The work table 11 and the support base 12 can be rotated by 90 ° as viewed from above in FIG. The moving block 1 straddling the main body 9 in a U-shape is configured to be movable by a predetermined amount in the front-rear direction of FIG. 1 relative to the main body 9 by a pair of left and right ball screws 2 and guides 3. In the first embodiment, the gate-type moving block 1 is moved with respect to the main body 9, that is, the work table 11. Conversely, the work table 11 is moved with respect to the gate-shaped moving block 1. Needless to say, the structure may be movable as long as it is relatively movable. Further, the scribe block 106 has a scribe cutter 114 (oscillation method) for scribing a workpiece at the tip, and the scribe cutter 114 can be moved in the vertical direction using means not shown. Further, the peeling block 126 has a wide peeling cutter 124 for peeling the film-forming layer in a strip shape at the tip, and the wide peeling cutter 124 can be moved in the vertical direction using a means (not shown). In general, the film-forming layer cut width using a peeling cutter is a minimum width that does not hinder the engraving of one scribe line therein, but using the wide peeling cutter 124 of this embodiment, The width necessary for providing two scribe lines is processed.

  This workpiece cutting device can perform the following operations under the control of a control unit (not shown). That is, while the wide peeling cutter 124 and the scribe cutter 114 are pressed against the work 23 with a predetermined load by a known pressing means such as hydraulic pressure, the left and right directions in the drawing are moved along the known guide rail 8. Move. As a result, the work 23 is engraved with a wide strip-like peeling region and a first scribe line. When this processing step is completed, the moving block 1 is fed forward (or backward) by a predetermined amount, and then the wide peeling cutter 124 is separated from the work 23 by using the pressing means, and only the scribe cutter 114 is moved to the work 23. While pressing with a predetermined load, it moves backward along the guide rail 8 from right to left in the figure. Thereby, a 2nd scribe line is carved in a wide strip | belt-shaped peeling area | region. Next, the moving block 1 is moved by a predetermined amount in the front-rear direction of FIG. 1 with respect to the main body 9, and the above operations are sequentially repeated. Next, the work 23 is rotated by 90 ° in a horizontal plane, and similarly, an orthogonal scribe line is formed.

  A case where the liquid crystal cell 50 is processed using the workpiece cutting device 120 of the first embodiment will be described with reference to FIGS. As the work 23, the liquid crystal panel substrate 60 is used as described in the background art. When processing the color filter substrate side, in the forward process, the first scribe line 173 a is formed by the scribe cutter 114 in the wide strip-shaped release region 172 produced by the wide release cutter 124. After this processing step is completed, the moving block 1 is fed a certain amount in the front-rear direction, and then the return step is started. This time, the wide peeling cutter 124 is separated from the liquid crystal panel substrate 60 and only the scribe cutter 114 is operated, A second scribe line 173b is formed in the wide strip-like peeling region 172 peeled in the process. Next, the moving block 1 is moved by a predetermined amount in the front-rear direction of FIG. 1 with respect to the main body 9, and the above operations are sequentially repeated. Next, the liquid crystal panel substrate 60 is rotated by 90 ° in a horizontal plane to similarly form orthogonal scribe lines.

  Next, when the workpiece cutting device 120 of the first embodiment scribes the TFT substrate side of the liquid crystal panel substrate 60 that is the material of the liquid crystal panel, the top surface of the work table 11 with the TFT substrate side of the liquid crystal panel substrate 60 as a table. However, in this case, as shown in FIG. 2, only the processing in the forward process at the time of processing on the color filter substrate side is used. (Return process returns in the sky)

  When processing a liquid crystal panel with a conventional workpiece cutting apparatus, as described with reference to FIG. 10, for example, a scribe portion shown in FIG. 10 is scribed (corresponding to the number of times two liquid crystal cells are cut out in a total of six locations). Therefore, the total number of reciprocations of the unit substrate 25 has reached six. However, when the liquid crystal cell 50 is processed using the workpiece cutting device 120 of the first embodiment, when the same portion is processed, four times as shown in FIG. 2 is sufficient, and the workpiece cutting device of the first embodiment. 120 is effective in improving the productivity of the liquid crystal cell 50. In the processing of the first embodiment, as is apparent from FIG. 2, the width of the wide strip-like peeling region 172 of the polarizing plate 62 on the TFT side is slightly wider than in the background art. However, optically, it is sufficient that the polarizing plate is large enough to cover the display area, that is, the same size as the color filter side. In addition, although the protrusion part 32 of the TFT side glass substrate 31 is not covered by film formation, the strength is somewhat weakened. However, this is not a problem if attention is paid to the occurrence of a defect or the like at the time of transportation or incorporation.

Next, the workpiece | work parting apparatus of 2nd Embodiment of this invention is demonstrated, using FIG. 3, FIG.
In the workpiece cutting device 220 of the second embodiment, unlike the first embodiment, the first peeling block 226a having the first peeling cutter 224a at the tip and the second peeling cutter 224b at the tip are sandwiched between the scribe blocks 106. And a second peeling block 226b. The directions of the cutting edges of the first peeling cutter 224a and the second peeling cutter 224b are different by 180 degrees, the first peeling cutter 224a can be peel-cut in the forward process, and the second peeling cutter 224b can be peel-cut in the reverse process. Both cutters can be moved up and down independently. Further, the film formation layer cut width using the first peeling cutter 224a and the second peeling cutter 224b is the minimum width to the extent that there is no problem in engraving one scribe line therein.

  Other configurations are the same as those of the first embodiment except for the following operation sequence controlled by a control unit (not shown). That is, the first peeling cutter 224a and the scribe cutter 114 are moved forward from the left in FIG. 3 while pressing the work 23 with a predetermined load. As a result, the work 23 is engraved with the first strip-shaped peeling region and the first scribe line. When this processing step is finished, the moving block 1 is fed forward (or backward) by a certain amount, and then the first peeling cutter 224a is separated from the work 23, and the second peeling cutter 224b and the scribe cutter 114 are moved with respect to the work 23. Then, it moves backward along the guide rail 8 from the right to the left while pressing with a predetermined load. Thereby, a 2nd scribe line is carved in the 2nd strip | belt-shaped peeling area | region. Next, the moving block 1 is moved by a predetermined amount in the front-rear direction of FIG. 3 with respect to the main body 9, and the above operations are sequentially repeated. Next, the work 23 is rotated by 90 ° in a horizontal plane, and similarly, an orthogonal scribe line is formed.

  The case where the liquid crystal cell 50 is processed by the workpiece cutting device 220 of the second embodiment will be described with reference to FIG. When the scribe line is processed on the color filter substrate side, in the forward process, the first scribe line 273a is formed using the scribe cutter 114 in the first strip-like release region 272a produced by the first release cutter 224a. When this processing step is completed, the movable block 1 is sent in a predetermined amount in the front-rear direction, and then the return step is started. Next, the first peeling cutter 224a is separated from the liquid crystal panel substrate 60, and the second peeling cutter 224b is brought into contact therewith. The second scribe line 273b is formed using the scribe cutter 114 in the second strip-shaped release region 272b produced by the second release cutter 224b. Next, the moving block 1 is moved by a predetermined amount in the front-rear direction of FIG. 3 with respect to the main body 9, and the above operations are sequentially repeated. Next, the liquid crystal panel substrate 60 is rotated by 90 ° in a horizontal plane to similarly form orthogonal scribe lines.

  The processing method in the case of scribing the TFT substrate side of the liquid crystal panel substrate 60 that is the material of the liquid crystal cell 50 with the workpiece dividing device 220 of the second embodiment is as follows. After fixing to the upper surface, as shown in FIG. 4, it is preferable to use the forward process and the reverse process during the color filter substrate side processing.

  When processing the liquid crystal cell 50 using the workpiece cutting device 220 of the second embodiment, if the same part as the liquid crystal cell 50 described in the background art using FIG. 10 is processed, three times as shown in FIG. The number of round trips is sufficient. Although the workpiece cutting device 220 of the second embodiment requires two peeling blocks, the productivity of the liquid crystal cell 50 is further improved.

  As described above, the case where the work cutting apparatus of the present invention exhibits the effect has been described using the manufacture of a liquid crystal panel. However, the work cutting apparatus of the present invention is not limited to the use for manufacturing a liquid crystal panel. The workpiece cutting device of the present invention is characterized by scribing a large brittle material plate with a film formation layer in both reciprocation steps of a unit substrate. For example, an EL plate, a touch panel plate, etc. The same effect is exhibited in the processing of a display panel provided with a work such as glass or plastic having a film forming layer such as a phase difference layer and a polarizing layer.

It is a side view of the workpiece | work parting apparatus of 1st Embodiment of this invention. It is explanatory drawing which shows the relationship between the reciprocation process of a scribe cutter and a peeling cutter, and the process location using the sectional view of the liquid crystal panel board | substrate after a process with the workpiece | work cutting device of 1st Embodiment of this invention. It is a side view of the workpiece | work parting apparatus of 2nd Embodiment of this invention. It is explanatory drawing which shows the relationship between the reciprocation process of a scribe cutter and a peeling cutter, and the process location using the sectional view of the liquid crystal panel board | substrate after a process with the workpiece | work cutting device of 2nd Embodiment of this invention. FIG. 5A is a side view of a workpiece cutting apparatus in the background art, FIG. 5A is a workpiece cutting apparatus that processes a workpiece without a film formation layer, and FIG. 5B is a workpiece that processes a workpiece with a film formation layer. It is a cutting device. It is a perspective view which shows the external appearance of the board | substrate used as the raw material of the liquid crystal panel in background art. It is a perspective view which shows the state in which the moving unit of the workpiece | work cutting device in background art is operating | moving to the D direction on the board | substrate used as the raw material of a liquid crystal panel. FIG. 8A is a perspective view showing an appearance of a substrate after operating a liquid crystal panel manufacturing apparatus in the background art, FIG. 8A shows a TFT side, and FIG. 8B shows a color filter side. It is a perspective view which shows the external appearance of the liquid crystal panel in background art, Fig.9 (a) shows the surface side, FIG.9 (b) shows the back surface side. It is explanatory drawing which shows the relationship between the reciprocation process of a scribe cutter and a peeling cutter, and a process location using sectional drawing of the board | substrate after a process with the workpiece | work parting apparatus in background art. It is sectional drawing of the rocking-type scribe cutter as background art.

Explanation of symbols

11 Worktable
23 Work 106 Scribe block 114 Scribe cutter
120, 220 Work cutting device
124 Peeling cutter
125, 225 Unit substrate 126 Peeling block 172 Wide strip-like peeling region
173a, 173b Scribe line 224a First peeling cutter
224b Second peeling cutter
226a First peeling block
226b Second peeling block 272a First strip-like peeling area
272b Second strip-like peeling region 273a First scribe line
273b Second scribe line

Claims (6)

In a workpiece cutting device that fixes a workpiece made of a brittle material on which a film formation layer is formed to a work table and divides the workpiece into a plurality of units, the unit substrate includes a unit substrate that reciprocally moves along the surface of the workpiece,
On the unit substrate, a scribe block having a scribe cutter at the tip that is vertically movable and simultaneously swingable in the moving direction of the unit substrate, and a peeling block having a peel cutter that is vertically movable at the tip And the scribe cutter and the peeling cutter include a control unit that can independently select either a workpiece processing state pressed against the workpiece or a workpiece non-processing state separated from the workpiece. Characteristic workpiece cutting device. When the peeling block precedes the workpiece, and the unit substrate operates in a direction in which the scribe block follows, in the strip-like peeling region formed in the film-forming layer by the peeling cutter provided for the peeling block. The first scribe line is produced using a scribe cutter provided in the scribe block, and when the unit substrate operates with respect to the workpiece in the direction in which the scribe block precedes and the peeling block follows. The work cutting apparatus according to claim 1, wherein a second scribe line is produced in the strip-like peeling region produced in the film forming layer by using a scribe cutter provided in a scribe block. In a glass cutting apparatus that fixes a work with film formation to a work table and divides the work into a plurality, a unit substrate that relatively reciprocates along the surface of the work,
On the unit substrate, a scribe block having a scribe cutter at the tip thereof that is vertically movable and simultaneously swingable in the moving direction of the unit substrate, and a scribe block that is positioned at one end of the scribe block and is vertically movable. A first peeling block in which a cutting edge is mounted in a direction away from the scribe block, and a second peeling cutter that is positioned at the other end of the scribe block and is vertically movable. A second peeling block mounted in a direction away from the workpiece, and the workpiece processing state in which the scribe cutter, the first peeling cutter and the second peeling cutter are pressed against the workpiece, and the workpiece non-processing separated from the workpiece Work parting / separating device characterized by having a control unit that can independently select any of the states . When the unit substrate is operated with respect to the workpiece in a direction in which the first peeling block precedes and the scribe block follows, the first peeling block provided on the first peeling block is used to form the film-forming layer. A first scribe line is produced using a scribe cutter provided in a scribe block in the produced strip-like peeling region, the second peeling block precedes, and the scribe block follows the workpiece in the following direction. When the unit substrate is operated, a second scribe line is formed by using the scribe cutter provided in the scribe block in the strip-like release region prepared in the film formation layer by the second release cutter provided in the second release block. 4. The workpiece dividing device according to claim 3, wherein the workpiece dividing device is manufactured. The workpiece cutting apparatus according to any one of claims 1 to 4, wherein the workpiece is made of glass or plastic. A display board manufactured by the workpiece cutting device according to claim 5.

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