TW200927684A - Machining method of fragile material substrate and scribing device - Google Patents

Abstract

A machining method of a bonded substrate which can be machined surely according to a prescribed procedure even if the width of an end material portion to be cut off in order to expose a terminal portion becomes small. (a) A first scribe line (S1) is formed under low permeation condition along the outside end of a region to be cut off as an end material portion for a first substrate (51), and a second scribe line (S2) is formed under high permeation condition along the other end, (b) a break is performed along the second scribe line (S2) after forming a third scribe line (S3) for a second substrate (54), or formation of the third scribe line (S3) and the break along the second scribe line (S2) are performed in a reversed order, (c) the first substrate (51) and the second substrate (54) are separated by performing break along the third scribe line (S3), and (d); the end material portion of the first substrate (51) is cut off by performing a break along the first scribe line (S1).

Description

200927684 IX. Description of the Invention: [Technical Field] The present invention relates to a method for processing a brittle material substrate which is formed by forming a plurality of scribe lines close to each other, and then performing a rupture process along each scribe line and breaking it. A scribing device for the processing. In the following description, the "dash line" is used differently from the "break line" formed by the breaking process. That is, the scribing means a crack line which is formed in advance at a predetermined breaking position on the substrate. When the cracking treatment is performed, the crack is extended in the thickness direction of the substrate to form a broken line. "Disconnected line" means the line that is actually broken. Specifically, the present invention relates to a processing method and a scribing apparatus suitable for performing scribing processing in the S-hai processing method, which is a brittle material substrate having a structure in which two sheets of brittle material substrates are bonded. (hereinafter, also referred to as a bonding substrate), the bonding substrate is broken along the end of the terminal portion formed on one substrate, and the substrate opposite to the terminal portion is cut off for the substrate on which the terminal portion is not formed. The terminal portion is exposed to be disconnected. Here, the term "brittle material substrate" means a glass substrate, a ceramic of a sintered material, a single crystal germanium, a semiconductor wafer, a sapphire substrate, a ceramic substrate, or the like. [Prior Art] A brittle material substrate such as a glass substrate is processed into an appropriate size and shape and used for various products. For example, in a liquid crystal display panel, two large-area glass substrates (mother substrates) are used, a color filter (CF) is patterned on one substrate, and a TFT for driving liquid crystals is formed on the other substrate (Thin filrn) 5 200927684

A transistor, a thin film transistor, and a terminal portion for external connection are formed by laminating the two substrates to form a bonded substrate, and then the liquid crystal display panel is manufactured by dividing the substrate into individual units. In the step of dividing the display substrate into a unit, a method of pressing the cutter wheel against the two substrates constituting the bonded substrate while moving the cutter wheel relative to each other is used. The scribe line is drawn, and then, a bending moment is applied along the scribe line to perform a cleavage process, thereby breaking the bonded substrate. ® liquid crystal display panel will be formed with a color filter

When the first substrate (CF substrate) is bonded to the second substrate (TFT substrate) on which the TFT and the terminal portion connected to the TFt are formed, the substrate surface on which the TFT and the terminal portion are formed is formed as the first substrate The bonding surface is bonded to each other. At this time, since the terminal portion formed on the bonding surface is a region where the signal line between the TFT and the external device is connected, it is necessary to expose the terminal portion to connect the signal line. Therefore, when the bonded substrate is disconnected, the portion of the substrate (CF substrate) facing the terminal portion is along the outer side end of the terminal portion opposite to the side on which the TFT is connected (that is, the end of the unit display substrate) The part is disconnected, and is separated from the outer side end of the terminal portion by a width region sufficient to be attached to the signal line to the external machine, and is cut off as an end portion. The end portion is cut while cutting the end portion, and a scribe line is formed along both sides of the end portion, and the end portions are cut off by performing a cleavage process along the two scribe lines. At this time, originally, the one of the two scribe lines is preferentially subjected to the cleavage process, and then the other scribe line is subjected to the cleavage process, 6 200927684 , , : and if it is used for performing the cleavage process When the cracking and relocation force to the substrate is mistaken, the two scribe lines are cracked at the same time, and the crack is generated on the broken surface after the end portion is pressed laterally. Therefore, the following methods for processing a bonded substrate have been disclosed (refer to the patent document Ο, that is, the order in which the scribe lines are formed on both sides of the end portion and the order of the rupture treatment are designed, thereby causing cracking According to this document, it is disclosed that the bonded substrate can be processed in the following order (丨) to Q to suppress the occurrence of cracking failure. (1) On the first substrate (CF substrate), The first and second scribe lines are formed at intervals corresponding to the width of the side portion (referred to as the end portion) of the terminal portion of the second substrate (TFT substrate). (7) On the second substrate, and the first row After the lines are formed in parallel to form a third scribe line, the first substrate is broken along the second scribe line, or the first substrate is first etched along the second scribe line, and then on the second substrate, and The first-dash line forms a third scribe line in parallel. 〇 (3) ruptures the second substrate along the third scribe line. (4) Disconnection by the first substrate along the second scribe line Separating the first substrate from the second substrate with a second broken line along the third scribe line (5) along the first < scribe The remaining portion of the substrate on the __) removal. Patent Document 1: Japanese Patent No. 3792508 [Disclosure] According to the processing method disclosed in Patent Document i, the cracking failure can be reduced as compared with the conventional processing method. However, with the large 7 200927684 of the liquid crystal display panel being simplistic and cost-effective, it has recently been demanded that the terminal portion is also made to reduce the end portion as much as possible, specifically removed previously. The width of the end portion is greater than 5 _, and: the width is required to be 5 mm or less, preferably miniaturized to 2 to 3 mm: and it is possible to reduce the width to about 1 mm. As a result, the cracking process is performed along the scribe lines on both sides of the end portion of the end portion, and the force required for the rupture treatment is increased, as described in the above Patent Document 1, and t 'not necessarily 纟b in the predetermined order. The breaking line is formed, and the cracking of the crack at the same time on both sides of the end portion can be produced. Therefore, an object of the present invention is to provide a method for processing a brittle material substrate (attachment), which can be surely processed in a predetermined order even if the width of the portion to be removed for exposing the terminal portion is reduced. It is an object of the present invention to provide a processing apparatus suitable for carrying out the above processing method. Further, an object of the present invention is to provide a processing method in which a material substrate is not a bonded substrate but is a common single board, and when a plurality of broken lines are formed on the substrate in close proximity or in a predetermined manner, It is indeed processed. In order to solve the above problems, the present invention is a method for processing a brittle material, which is a pair of brittle materials composed of a first substrate and a second substrate which is formed on a substrate surface and a terminal portion of the force film. The brittle material substrate having a structure in which the substrate surface on which the terminal portion is formed is bonded to the first substrate is formed along the outer side end of the terminal portion opposite to the functional film connection side. The substrate and the second substrate are broken

8 200927684 2 = a predetermined width from the outer side end of the terminal portion, and the portion of the first 丞 丞 plate opposite to the end of the terminal is cut off as the end portion; (a)

The slab of the brother's board is the first line at the end of the area where the 蜢 u 山 山 山 :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: The other end of the cut portion is cut to be π% higher than the first cutting condition on the second substrate, and c is a second scribe line; (1) secondly, then along the second scribe line And forming a third scribe line in parallel, and then forming a third scribe line on the second substrate, and; or along the second scribe line, (1) second, forming a third scribe line in parallel along the *1: The broken line of the two-line line and the second substrate are separated; (, d°) n the broken line of the scribe line, and the first substrate is cut along the (four)-scribe line of the second substrate of the first substrate to cut: The 'functional film' is referred to as a TFT in the liquid crystal display panel, but only the terminal portion on the substrate surface is connected to the surface of the substrate to realize certain functions such as a resistive film, an optical film, and the like. For thin film components other than FT, the edge and the moving edge are used to connect the signal between the functional film and the external device. The metal medium and the transparent conductive medium are connected. The conductive film is formed of 1 = pattern (for example, since the terminal portion must be connected to an external device, = is exposed at a distance from at least the outer side end of the terminal portion (the end of the terminal portion opposite to the side on which the functional film is connected)). The required width, and the terminal "the width of the predetermined official squat from the outer end" refers to the width of the terminal portion exposed ❹ 27 200927684 degrees 'that is, the external terminal is required to be connected to the external device, and more than two widths The width is set in the thickness direction of the inert material substrate when the scribe line is formed. , can be g#„ The type of the knife edge, the load applied to the cutter wheel, and the negative cutting condition applied to the cutter wheel. The method of the load (the presence or absence of vibration) is classified as the second cutting condition of "the first cut in the low cut" and the second cut in the invention. A typical "low cut" refers to a cut-in condition in which a scribe line (crack) is formed at a depth in the range of 5 to 20% with respect to the thickness of the substrate. Typically, "high cut" means 60 to 85% with respect to the thickness of the substrate. The cutting condition of the scribe line (crack) is formed by the depth of the range. However, even if the depth of the scribe line (crack) exceeds the above range, the second plunging condition satisfies the following relationship: the scribe line (crack) is formed deeper than the first plunging condition, and the second cut is made. The relationship between the depth of the scribe line formed under the condition and the depth of the scribe line formed under the first plunging condition is as follows: when the scribe line is subsequently subjected to the cleavage treatment, the second plunging condition is formed. The scribe line can be more reliably and preferentially broken than the scribe line formed by the first plunging condition. According to the present invention, the first scribe line and the second scribe line to be formed on both sides of the end portion are formed under different cutting conditions, whereby the force required for the cleavage treatment along the scribe lines is different. That is, (a) the outer end of the terminal portion (the end of the terminal portion opposite to the side on which the functional film 200927684 is connected) in the both sides of the region which is cut off as the end portion is the first cut with a low cut The condition forms a first scribe line, and the other end of the region which is cut off along the end portion is formed, and the second scribe line is formed by cutting the second cutting condition which is cut into the first cutting condition. As a result, the second scribe line can be subjected to the cleavage treatment with a force smaller than the first scribe line. (b) Next, on the second substrate, a third scribe line is formed in parallel with the first scribe line, and then is broken along the second scribe line, or is broken along the second scribe line, and then The two substrates form a third scribe line in parallel with the first scribe line. ❹ 藉 By performing any of these sequences, the second scribe line formed by "high cut" is surely broken to form a broken line. At this time, the description of "low cut" will not be broken. (7) Secondly, the second substrate is broken along the third scribe line, and the detachment line of the first scribe line and the line along the second s!l line are A certain difficulty "separate the mother substrate and the second substrate. At this time, the first stroke force (3) formed by "low cut" may be broken. (d) Then, the line is broken to cut off the first substrate. [Effect of the Invention] According to the present invention, the force required for the first scribe line and the second scribe line which are cut into the both sides of the end portion are different, and the force required to form the crack to be formed is different. , ... to reduce the degree of the line of the edge, also & even in the terminal part of the work. ^According to the pre-order, the substrate is actually added to the above-mentioned invention (a), and there is also a not-notched knife edge (hereinafter also referred to as N-knife-in, the material substrate is relatively moved for scribing, < The first cutter wheel has a second cutter wheel pair with a notch formed by a notch (hereinafter also referred to as P: cut; under the condition of 'having a mouth) to relatively move the substrate of 200927684 brittle material for scribing. Whether or not a notch is formed, and when the same load is applied to the two different cutter wheels, a notch is formed, and the cutter wheel of the r-knife can be cut deeper than the cutter wheel of the N-knife without the notch formed. Therefore, Under all conditions, the SN knife π-the first cutter wheel is used, and the second cutter wheel of the P-knife is used under the second cutting condition, thereby forming a low-cut first scribe line and a high-cut second scribe line. .

At this time, in the (a) towel, the first scribing line is formed by the first scr roller (Ν77σ) to form the first scribing line, and then the second scribing wheel (9) is used to form the second scribing line. According to the first scribe line, the line, and then the second scribe line of the high cut is formed. When the second scribe line is formed, the error caused by the first scribe line being further advanced in the depth direction can be reduced. Poor breakage of the break. Alternatively, in (a), the i-th cutter wheel (N-knife edge) and the second cutter wheel (P-knife edge) can be simultaneously moved relative to the brittle material substrate, thereby forming the first line and the second line in parallel. . By forming the first scribe line and the second scribe line in parallel at the same time, it is possible to surely make the depth of cut of each scribe line (crack) different. Further, by forming the first scribe line and the second scribe line in parallel at the same time, the scribe line can be effectively formed. In particular, when the group of the H line and the second scribe line is repeatedly formed on one bonding substrate, the processing can be performed more efficiently. In the above (b) of the invention, the third scribe line can be formed under the second plunging condition. Thereby, a third cut 12 200927684 scribe line is formed at a position opposite to the first scribe line, and the crack is poor when the rupture process is performed. It can be reduced to first break the first scribe line. At this point, in (b), the dead knives _ have the second cutter wheel (p-knife) move relative to the brittle material 枓 substrate to advance the scribe line. The second plunge condition can be easily achieved by using the second cutter wheel of the P-knife. Further, according to another aspect, the scribing apparatus of the present invention includes: a substrate for placing a brittle material; a first cutter wheel having no notch on the knife edge; and a second cutter wheel having a knife edge direction arranged to be the first blade The wheels are parallel and a notch is formed in the knife edge; the cutter wheel lifting mechanism is configured to press the first cutter wheel and the second cutter wheel or to leave the brittle material substrate disposed on the work surface; and the moving mechanism is used to make The relative movement of the cutter wheel to the brittle material substrate is formed by the first cutter wheel, and the first stroke is formed by the first-cut condition of the low cut-in by the first cutter wheel to cut into the second cut-in than the first cut-in condition. The condition forms a second scribe line. According to the present invention, the first cutter wheel (the rake edge) having the notch of the knife edge and the second cutter wheel (the rake edge) formed with the notch are disposed so that the direction of the knife σ is parallel, so that the first cutter wheel can be used (knife edge), the first scribe line is formed by the first plunging condition, and the second scribe line is formed by the second cutter wheel (the boring edge), so that the dicing depth can be easily formed. The wire 'and the processing method of the present invention described above can be easily realized. In the invention of the scribing device, the scribing can be simultaneously performed by the first cutting edge (the first cutting edge) and the second cutting wheel (p the cutting edge) under different cutting conditions. By performing scribing in parallel at the same time, it is possible to surely make the cutting depths of the scribing lines (cracks) different. Further, by performing scribing at the same time, the 13 200927684 scribing can be effectively formed. In the invention of the above-mentioned scribing device, the first cutter wheel and the second cutter wheel may be formed such that the distance between the first scribing line and the second scribing line to be formed is 1 to 5 mm °. The first scribe line and the second scribe line having different plunging depths can be formed with a width of 1 mm to 5 mm. Therefore, when the end portion is cut by the above-described processing method of the present invention, the first scribe line and the second scribe line can be formed on both sides of the end portion by a width of 1 mm to 5 mm. ® At this time, the first cutter wheel and the second cutter wheel can be arranged in such a manner that the rotation axes of the cutter wheels are shifted from each other in the scribing direction. The rotation axes of the respective cutter wheels are arranged to be shifted from each other in the scribe line direction, whereby the cutter wheels can be brought close to each other without interfering with each other. Thereby, the first scribe line and the second scribe line which are close to each other and have different plunging depths can be formed in parallel at the same time. Therefore, when the end portion is cut by the above-described processing method of the present invention, the first scribe line and the second scribe line can be formed in parallel on both sides of the end portion with a width of 1 mm to 5 mm. Further, another method for processing a brittle material substrate according to another aspect of the present invention is to form a plurality of scribe lines which are close to or intersect with each other on a substrate of a brittle material, and then are broken along each scribe line; For one of the near or intersecting scribe lines, the first scribe line is formed by the first plunging condition of the low cut, and the second scribe line is cut into the second cut condition of the first cut condition to form the second line. line. Thereby, even when a plurality of broken lines are formed on the substrate in a close or overlapping manner, the processing can be surely performed in a predetermined order. [Embodiment] Embodiments of the present invention will be described with reference to the drawings. Here, a case where the glass bonded substrate A is processed will be described as an example. The method for processing a brittle material described below is to use a scribing device for forming a scribing material on a brittle material substrate, a breaking device for breaking a brittle material substrate having a scribe line, and an end material cutting device for cutting the end portion. . (Scribing device) First, the scribing device will be described. Fig. 1 is a schematic block diagram showing an embodiment of a scribing apparatus used for forming a scribe line in the method for processing a brittle material substrate of the present invention. The scribing device SM is disposed on the horizontal gantry in parallel—the guides 3 and 4' are provided with a slide table 2 that reciprocates in the rear direction (hereinafter referred to as the Y direction) in front of the sheet. A screw 5 is disposed between the two guide rails 3 and 4 in the front-rear direction, and the screw 5 is screwed to the stay 6 fixed to the slide table 2, and the screw 5 is rotated forward by a motor (not shown). Inverting, thereby causing the slide table 2 to reciprocate in the Y direction along the guide rails 3, 4. The water table base 7 is disposed on the slide table 2, and is reciprocally movable along the guide rail 8 in the left-right direction (hereinafter referred to as the X direction) of Fig. 1 . The struts 10a fixed to the pedestal 7 are inserted and screwed with the snails 1 〇 彳 10 rotated by the motor 9 for forward rotation and reverse rotation, thereby causing the pedestal 7 to follow the guide rail 8 at the X Move back and forth in the direction. The turret 7 is provided with a rotary table 12 that is rotated by a rotating mechanism 11, and a laminated substrate is placed on the rotating table 12 in a horizontal state. The bonded substrate A is used, for example, to cut out smaller units. The mother substrate of the substrate is displayed. 15 200927684 The rotating mechanism 11' can rotate the rotary table 12 about a vertical axis and can rotate to an arbitrary rotation angle with respect to the reference position. Further, the bonded substrate A is fixed to the turntable 12 by a suction cup. Above the rotary table 12, a first cutter wheel 14 and a second cutter wheel 18 are mounted, wherein the first cutter wheel 14 is supported to be movable in the up-and-down (z-direction) direction by the elevating mechanism ,, The second cutter wheel 18 is supported so as to be movable in the up and down (z direction) direction by the elevating mechanism. The lifting mechanisms 13 and 17 are adjusted in height by the lifting operation, and the cutter wheel 14 18 can be pressed against the bonding substrate a to form a scribe line, or the cutter wheels I# and 18 can be separated from the bonding substrate Αβ. The pressure contact force applied to the bonded substrate a at the time of pressure bonding is adjusted, and if necessary, the cutter wheel is pressed while being vibrated, whereby the scribe line can be cut deeper. The first cutter wheel 14 uses a knife edge (n knife edge) in which no notch is formed. The second cutter wheel 18 uses a knife edge (p-blade) formed with a notch. The directions of the cutting edges of the two cutter wheels 14, 18 are all oriented in the χ direction, so that the positions of the rotary shafts of the cutter wheels are staggered along the ^X direction, so that the cutter wheels do not physically interfere with each other. Further, an adjustment mechanism 16 for adjusting the position of the elevating mechanism 13 and the first cutter wheel 14 in the ¥ direction, and an adjustment mechanism 19 for adjusting the position of the elevating mechanism 17 and the second cutter wheel 18 in the x direction are provided. When the two cutter wheels 14 and 18 are simultaneously scribed, the distance between the two scribe lines (the distance in the γ direction) can be adjusted by the above-mentioned adjustment mechanism 16 19 so that the two scribe lines are close to each other. Or stay away. Further, the scribing device SM is equipped with a camera 2A, which can detect an alignment mark for positioning which is imprinted on the bonded substrate, and the position of the alignment mark detected by the camera 20 according to 200927684, Find the spoon, set A:. The position of the terminal portion can be - (cracking device). Next, the breaking device will be described. Fig. 2 is a schematic block diagram showing an embodiment of a breaking device used when the bonded substrate A is broken in the method for reinforcing a brittle material substrate according to the present invention. The same components as those of Fig. 1 are denoted by the same reference numerals, and a part of the description will be omitted. The breaking device BM' is arranged in parallel along the guide rails 21, 22 and is movable in the front and rear direction of the paper of Fig. 2 (hereinafter referred to as the gamma direction). The bonded substrate a is placed on the table 23 with its scribe line below. A split rod 25 is disposed above the table 23. The split rod 25 is joined to the underside with a hard rubber. The split rod 25 can be moved up and down by the pressurizing cylinder 29, whereby the desired breaking pressure can be set to the split rod 25. Further, on the table 23, a groove (not shown) is formed along the lower surface of the split bar 25 just below the split bar 25, and when the split bar 25 is lowered, the sub-base A is pressed. At this time, the bending moment is effectively applied to the bonded substrate A. Further, the camera 3 is mounted with an alignment mark 7 for marking the positioning of the bonded substrate A, and the above-mentioned crack can be made based on the position of the alignment detected by the camera 30. The rod 25 aligns the scribe lines formed on the bonded substrate A. (End material cutting device) 17 200927684 Next, the end material cutting device will be described. In the processing method of the brittle material substrate of the present invention, a schematic configuration diagram of an embodiment of the end material cutting device used for removing the end portion of the blade is shown.

The end material cutting device BQ is provided with a table 41, which is used for placing the residual end portion Q and cutting the bonding base: a (;: display substrate). 1. The end portion of the bonded substrate A is suction-fixed and protrudes outward from the end of the table 32. An end strip 42 is mounted above the end portion. The end material cutting rod 42 is supported by the air cylinder 43 and the guides 44 and μ so as to be movable up and down. The end portion Q and the cut laminated substrate A are placed on the operation σ 41, and the end material cutting rod 42 is lowered to press the end portion q, thereby applying a shear force, and the end material is along the scribe line S1. The part q is disconnected. (Processing Method of Bonding Substrate Next, a processing procedure for processing the bonded substrate A for a liquid crystal display panel using the scribing device SM, the cracking device BM, and the end material cutting device BQ will be described. The terminal portion formed on the bonding surface is exposed, and is cut at the end of the terminal portion. Further, the substrate device SM, the cracking device BM, the substrate transfer between the end material cutting devices BQ, or the surface of the substrate is reversed. Fig. 4 is a step diagram showing a processing procedure of a bonded substrate for a liquid crystal display panel, as shown in Fig. 4(a), and a bonded substrate a is shown in Fig. 4(a). The first substrate 51 (CF substrate) on which a color filter (CF) (not shown) is formed, and the second substrate 54 (TFT substrate) on which the TFT 52 and the terminal portion 53 connected to the TFT 52 are formed. 54 is a bonding surface in which the substrate surface of the TFT 52 and the terminal portion 53 is formed as an inner side. 18 200927684 First, the first substrate 51 is formed with a lower cutting edge by the first cutter wheel 14 on which the > knife edge is attached. a line S1, and with the second knife with a p-knife 18 is formed into a second scribe line S2 which is highly cut. The first scribe line S1 and the second scribe line S2 may be formed one by one, and may be formed at the same time in order to improve the processing efficiency. When the first scribe line Sb is formed, then the second scribe line S2 is formed, and the first scribe line S2 is formed.

When the scribe line S1' is formed as the second scribe line S2_, it is difficult to cause a cracking failure which is unexpectedly caused to break due to the deeper advancement of the first scribe line S1. In the terminal portion 53, the entire surface of the terminal can be exposed, or only a minimum area required for connection to an external device can be exposed. In the present embodiment, the entire surface is exposed. Therefore, the distance d (width) between the first scribe line S1 and the second scribe line s2 is adjusted in advance by the adjustment mechanisms 16 and 19 so as to conform to the width of the terminal portion illusion, and then scribed. Next, as shown in FIG. 4(b), the bonded substrate a is reversed, and the third substrate 54 is formed at a position opposite to the first scribe line S1, and the second cutter wheel 18 forms a third cut with a high cut. Line S3. In the same manner, the bonded substrate A is transported to the rupturing device BM, and as shown in FIG. 4(c), the second scribe line S2 which is cut at the high side of the first substrate 51 formed on the lower side is cut and processed. The first substrate is disconnected. After the disconnection, a broken surface is formed at the position of the first scribe line S2, and the following figure is formed to open the person as shown in Fig. 4(d). The substrate a is reversed, and is not subjected to a cleavage process along the third scribe line S3 formed at the high cut of the second substrate 54 as shown in FIG. 4(e) to break the second substrate 54. 19 200927684 Since the rupture pressure is applied from the first substrate side, the third scribe line S3 on the second substrate side to which a larger bending moment is applied is broken. After the detachment, the third scribe line S3 is formed. As a result of the disconnection line, the result is 'as shown in Fig. 4 (f)', the bonded substrate a is broken along the disconnection line B2 and the disconnection line B3, and the terminal portion 53 is exposed. The end plate portion 55 remains on the substrate 51. Next, the bonded substrate A is transferred to the end material cut-off end portion 55 to be cut, and as shown in Fig. 4(g), along the first scribe line = shear force The end portion 55 Thereby, the break line B 1 as the break surface is formed at the position of the first scribe line. By the above processing steps, the following processing can be performed, that is, the terminal portion 53 is exposed, and along the terminal portion 53 is disconnected from the outer end (the end of the terminal portion 53 and the opposite side of the connection side). (Processing method 2 for bonding a substrate) FIG. 5 is a view showing another processing of the bonded substrate A for a liquid crystal display panel. In the above processing step, the scribe line of the first substrate, the rupture of the first substrate, the rupture of the second substrate, and the removal of the end material are processed in the order of the first substrate, but In the present embodiment, the scribe line of the first substrate, the rupture of the first substrate, the scribe line of the second substrate, the rupture of the first substrate, and the removal of the end material are processed in the order of the end material. 4, the same portions are denoted by the same reference numerals, and a part of the description is omitted. As shown in FIG. 5(a), on the first substrate 51, the first scribing line 14 is formed by the first cutter wheel 14 and is formed by the first scribing wheel 14 The second cutter wheel 18 forms a second cut line S 2 that is highly cut. 20 200927684 'The bonded substrate A is transported to the cracking device BM, and as shown in Fig. 5(b), the bonded substrate A is reversed, and the second scribe line is cut along the first substrate 形成 formed on the lower side. The breaking process is performed to break the first substrate 51. After the opening, the broken line B2 is formed at the position of the second scribe line S2. Next, the bonded substrate A is transported to the scribing device SM, as shown in Fig. 5 ( The third scribing line S3 is formed by the second cutter wheel 18 at a position opposite to the second substrate 54 facing the first scribing line S1. Next, the bonded substrate A is transported to the splitting device. BM, as shown in FIG. 5(d), is reversed again, and as shown in FIG. 5 (〇, the third scribe line formed along the high side of the second substrate 54 formed on the lower side is subjected to the cleavage process. The second substrate 54 is disconnected. After the disconnection, the break line B3 is formed at the position of the third scribe line S3. As shown in Fig. 5 (f), the bonding substrate A is disconnected along the breaking line B2 and the breaking B3, and the terminal portion 53 is exposed. At this time, the first substrate 51 has the end portion 55 left. © * "The human 胄 bonded substrate A is transported to the end material removing device BQ, and in order to cut the end portion 55, a force is applied along the first scribe line S1 as shown in Fig. 5( ) _ 圃 k gJ> The end portion 55 is removed. Thereby, the break line Β 1 is formed at the position of the first scribe line 81. By the above processing steps, the processing can be performed such that the terminal portion 53 is exposed and along the terminal portion

The $ address/疋 outer end (the end of the terminal portion 53 opposite to the TFT connection side) is turned off. (Applied to the cross-cutting and scribing process) Heretofore, the processing of the bonded substrate has been described, and the scribing device SM of the present invention 21 200927684 can be effectively utilized not only for the scribing process of the bonded substrate but also for effective use. The cross-hatching process is performed by scribing the veneers in both the vertical and horizontal directions. 6 is a view showing a state of a crack at an intersection point generated at an intersection portion during cross-hatching processing, the cross-hatching processing is first performed in the Y direction (the front and back directions of the paper) (referred to as a first underline), and then The scribe line (referred to as a back scribe line) is processed in the X direction. Here, the intersection crack refers to a crack generated in the lateral direction other than the crack which is vertically advanced.一般 The general tendency of the above-mentioned intersection crack is as follows. As shown in Fig. 6(a), when the first scribe line is set to the high-cut scribe line S1 η, the resulting intersection crack is small. As shown in Fig. 6(b), the intersection crack generated by the case where the first scribe line is set to the scribe line S 1 中 in the middle cut is large. As shown in Fig. 6 (c), when the first scribe line is set to the low-cut scribe line S 1L, the intersection crack is not easily generated. According to the above tendency, when the intersection crack is to be suppressed, it is preferable to set the first scribe line to the high cut line S1H or the low cut line S 1 l. On the other hand, when the substrate is thick and cannot form a high-cut scribe line, or if it is desired to perform a post-cut scribe line and then follow the scribe line that is slashed first, it is not possible to use high Cut into the line S1H. In this case, it is effective to set the first scribe line to the low cut line s1l and the back scribe line to the high cut line S1H. Further, it is convenient to use the scribing device SM illustrated in Fig. i. Figure 7 is a step diagram of the cross-hatch processing method 22 200927684 for which the cracks have been suppressed. (a), the first direction is toward the first direction (the x-direction using the scribing device SM shown in FIG. 1, the surface F of the board substrate 61, by the first cutter wheel 14) forms the first low cut. Line s. Next, 'rotate the turntable 12 by % Don and the first direction (X direction) orthogonal to the image - (b), toward

In the first direction (Y second line S2H β universal direction), high cut is formed. Next, the single-board substrate 61 is transported to the crack, and the single-board substrate 61 is reversed. 7(c) Performs a splitting process, thereby forming a break line B1. At the same time, the first scribe line S1 is applied, and a slightly stronger cracking pressure is applied, and the single-board substrate 61 can be bent along the high-cutting portion to form the breaking line (1), and the second line is broken. open. Or continue the splitting process in the direction. The second division of the cut-in is performed by the above sequence, as shown in Fig. 7 (opening. ^.), which can be used vertically and horizontally for the processing of the glass substrate and the like, and the processing of the substrate of the processing material. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram of a scribing apparatus used in the processing method of the present invention. FIG. 2 is a schematic configuration of a cracking apparatus used in the processing method of the present invention. FIG. Fig. 4 (a) to (g) show the steps of the processing steps of the bonded substrate for the liquid crystal display panel. Fig. 5 (a) ~ (g) is a process chart showing another processing step of the bonded substrate for a liquid crystal display panel. Fig. 6 (a) and (c) are views showing a state of intersection cracks generated at the intersection portion during cross-hatching processing.

Fig. 7 (a) to (d) are process diagrams showing a cross-hatching processing method in which intersection cracks have been suppressed. [Main component symbol description] 2 Slide table 12 Rotary table

13 14 16 17 18 19 Lifting mechanism first cutter wheel (low cutting edge) Adjusting mechanism lifting mechanism second cutter wheel (South cutting edge) Adjustment mechanism 25 Cracking rod 42 51 52 53 End material cutting rod first substrate ( CF substrate) Functional film (TFT) Terminal portion 54 Second substrate (TFT substrate) 24 200927684 55 End portion SI first line (low cut) S2 Second line (high cut) S3 Third line (high cut) B1 ~ B3 Disconnect line (breaking surface) SM Dashing device BM Breaking device BQ 端 End material cutting device ❹ 25

Claims (1)

200927684 X. Patent application: • A method for processing a substrate of a brittle material, which is a pair of brittle material substrates composed of a first substrate and a second substrate having a terminal portion connected to the functional film on a substrate surface. The brittle material substrate having a structure in which the substrate surface on which the terminal portion is formed is bonded to the first substrate is along the %. Disconnecting the first substrate and the second substrate from the outer side opposite to the side opposite to the function 臈 connection side, and the first substrate facing the terminal portion at a predetermined width from the outer side end of the terminal portion The portion is cut as the end portion and is characterized in that: () is formed on the first substrate, and the end portion of the terminal portion is cut along the end portion of the region where the end portion is cut, and the second end portion of the low-cut person is formed. Marking, and along the other end of the region where the end portion is cut, the second cutting condition of the knife-in mesh under the first cutting condition forms a second scribe line; (1) secondly, on the second substrate, and the first stroke The lines are opposite and parallel: a third scribe line, then along the second scribe line (4), or along the second line, the money is on the second substrate, forming a second parallel to the first line (c) Secondly, 'the third line is along the third line, and the bottom of the substrate is broken, and the line of the second line of the mouth of the mouth is disconnected from the line. Separating the first substrate from the second substrate; (d) then, along the first scribe line, the end portion. The method of cutting the first substrate by cutting into the wire. 2. In the case of (a), in the processing of the brittle material substrate of the first item, the knife having the non-notch is made. 26 200927684 The first cutter wheel of the mouth moves relative to the brittle material substrate to perform scribing, and under the second cutting condition, the second cutter wheel having the notched blade edge is relatively moved to the brittle material substrate for scribing . 3. The method for processing a brittle material substrate according to claim 2, wherein in (a), the first scribing line is formed by the first cutter wheel to form the first scribing line, and the second scissor wheel is formed by the second scissor wheel A second scribe line is formed. 4. The method for processing a substrate of a brittle material according to claim 1 of the patent application, wherein in (b), a third scribe line is formed under the second cutting condition. 5) The method for processing a brittle material substrate according to item 4 of the patent application scope, wherein in the (b), the second cutter wheel relatively moves the brittle material substrate to perform scribing. 6. A scribing device for a brittle material substrate, comprising: a table 'for placing a brittle material substrate; a first cutter wheel having no notch on the knife edge; and a second cutter wheel for arranging the blade direction a cutter wheel is parallel, and a notch is formed in the knife edge; a cutter wheel lifting mechanism is used for crimping or leaving the first cutter wheel and the second cutter wheel to the brittle material substrate disposed on the worktable; and a moving mechanism, The cutter wheel is configured to relatively move the brittle material substrate; the first scribing wheel is formed by the first cutting wheel to form a first scribing line, and the second scissor wheel is used to cut through the first cutting line. The second cut-in condition of the entry condition forms a second scribe line. 7. The scribing device for a brittle material substrate according to claim 6, wherein the first cutter wheel and the second cutter wheel are set to be the first stroke 27 to be formed, and the distance between the second line and the second scribing line is 1 mm to 5 mm. 8. A method for processing a substrate of a brittle material, which is formed by forming a plurality of scribe lines adjacent to each other or intersecting each other on a substrate of a brittle material, and is characterized in that: each scribe line is made for approaching or intersecting One of the scribe lines forms a first-dash line with a low-cut condition, and the second scribe condition of the first--cut condition for the other line forms a second scribe line. Entering the horse in the first 〇 XI, Ming: If the next page ❹ 28