TW201502095A - Dicing device for laminated substrate - Google Patents

Abstract

The present invention provides a dicing device for a laminated substrate capable of dicing all scribe lines with high efficiency without having to reverse the mother substrate. A dicing device D for a laminated substrate M is provided, wherein the laminated substrate M comprises a first substrate 1 and a second substrate 2 and is formed with scribe lines on two sides, the dicing device D dices the laminated substrate M along the scribe lines and comprising: a conveying mechanism 3 for conveying the laminated substrate M; a dicing rod 4 for pressing the substrate M from the upper surface of the first substrate 1; and a support member 5 located below the dicing rod 4 and spaced apart from the substrate M for supporting the lower surface of the substrate M; by pressing the dicing rod 4 against the first substrate 1 along the scribe lines formed on the first substrate 1, and using the support member 5 to support the second substrate 2, the scribe lines of the second substrate 2 can be cut, and at the same time the scribe lines for of the first substrate 1 formed on the front and back sides of the aforementioned scribe lines can be cut.

Description

Fitting device for bonding substrates

The present invention relates to a breaking device for dividing a scribe line (cutting groove) formed on both sides of a bonded substrate formed by bonding a brittle material substrate, and more particularly to a laminated substrate having a thin plate thickness Breaking device. Moreover, the present invention relates to a breaking device for separating a terminal region for external connection when a unit substrate is obtained from a self-bonding substrate. The breaking device of the present invention is used for processing a unit display panel or the like such as a liquid crystal display panel.

In the manufacture of a liquid crystal display panel, two large-area glass substrates are used, a color filter CF (Color Filter) is formed on one substrate, and a thin film transistor TFT (Thin Film Transistor) for driving liquid crystal is formed on the other substrate. Terminal area for external connections. Then, the CF side substrate on which the color filter is formed and the TFT side substrate on which the TFT and the terminal region are formed are bonded to each other with a sealing material interposed therebetween, and the liquid crystal is sealed to form a mother substrate, which is then divided into unit display panels one by one.

Since the terminal region is a region where the signal line is connected between the TFT and the external device, it is necessary to expose the terminal region. Therefore, when the mother substrate is divided into unit display panels, the portion of the CF side substrate facing the terminal region is divided along the outer side end of the terminal region (ie, the periphery of the unit display panel), and the terminal is self-connected. The outer side of the area is cut by the width (terminal width) required to mount the signal line as the end material.

A substrate processing system or a substrate processing method in which a mother substrate is scribed and the substrate is separated from the scribe line is disclosed in Patent Document 1 or Patent Document 2 and the like.

According to Patent Document 1, first, as shown in FIG. 7(a), the TFT side substrate 11 of the mother substrate 10 is placed on the upper side, and the CF side substrate 12 is placed on the lower side of the substrate (on the outside of the drawing), and the cutter wheel 13 is used. The TFT side substrate 11 is scribed to process the scribe lines 14....

Next, as shown in FIGS. 7(b) and 7(c), the mother substrate 10 is inverted and placed on the buffer sheet 15, and the breaking bar 16 is pressed against the CF side from the position directly above the scribe line 14. The substrate 12 is separated from the scribe lines 14...

Then, as shown in FIG. 7(d), the scribe line 17 is processed by the cutter wheel 13 on the CF-side substrate 12 facing upward. Thereafter, as shown in FIG. 7(e), the mother substrate 10 is again inverted and placed on the buffer sheet 15, and as shown in FIG. 7(f), the breaking rod 16 is pressed from the position directly above the scribe line 17. The scribe lines 17 are cut off against the TFT side substrate 11. Thereafter, the end portion of the mother substrate 10 indicated by the hatching is removed, and as shown in FIG. 7(g), the unit display panel has a terminal region T in which one of the TFT-side substrates 11 is partially exposed.

Further, Patent Document 2 discloses the following breaking method as a prior art.

First, as shown in FIG. 8(a), a scribe line 19 is formed on the A side of the mother substrate 20 which is bonded to the A surface and the B surface by the cutter wheel 18.

Next, as shown in FIG. 8(b), the mother substrate 20 is inverted and placed on the buffer sheet 23, and the breaking bar 21 is pressed against the scribe line 19 from the B surface, and the scribe line 19 is broken.

Then, as shown in FIG. 8(c), on the side B facing upward, the scribe line 22 is formed at a position shifted only by the width of the terminal region with respect to the scribe line 19.

Then, as shown in FIG. 8(d), the mother substrate 20 is again inverted and placed on the buffer sheet 23, and the breaking bar 21 is pressed against the scribe line 22 from the A surface, and the scribe line 22 is broken. Thereafter, the mother substrate 20 is pulled apart from the above-described divided portions to form a unit display panel having a terminal region.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-131185

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-103295

As described above, in the prior art, when the scribe lines of the TFT side substrate and the CF side substrate respectively formed on the mother substrate are separated, the mother substrate must be inverted every time, so that the mother substrate needs to be inverted. The substrate flipping device. Therefore, there is a problem that not only the size of the breaking device is increased but also the equipment cost becomes high, and the time required for the breaking becomes long and the productivity is lowered.

Moreover, in recent years, it has been required to reduce the thickness of the substrate to be processed. As an example, a bonded substrate in which a substrate having a thickness of 0.2 mm is bonded is used, and a bonded substrate in which a very thin substrate having a thickness of 0.05 mm to 0.15 mm is bonded is further studied. However, since a thin laminated substrate of 0.2 mm or less is easily bent, it is difficult to invert and break off piece by piece.

Accordingly, the present invention has been made in view of the above problems, and it is an object of the invention to provide a breaking device for a bonded substrate in which all the scribe lines are efficiently cut without turning the mother substrate.

In order to achieve the above object, the present invention adopts the following technical means. In other words, the present invention relates to a cutting device for bonding a substrate, wherein the first substrate and the second substrate are bonded together, and a bonding substrate for dividing the scribe lines is formed on both surfaces, and the bonding substrate is along The scribe line includes: a transfer mechanism that transports the bonded substrate; a break bar that presses the bonded substrate from an upper surface of the first substrate; and a support member that is located across the bonded substrate The lower surface of the bonding substrate is supported under the breaking bar; the first substrate is pressed by the breaking bar along the dividing line formed on the first substrate, and the support is used The member supports the second substrate, and the division of the second substrate is separated by a scribe line, and the division of the first substrate formed on the front and back sides of the scribe line is also broken by a scribe line.

According to the present invention, when the division of each of the first substrate and the second substrate is separated by a scribe line, it is not necessary to reverse the mother substrate every time, and the mother substrate can be placed on the transport mechanism. In the posture, the break is continuously performed by using a breaking rod. Thereby, the time required for the breaking can be shortened, the productivity can be improved, and the apparatus for inverting the substrate can be eliminated, so that the breaking device can be reduced in size and the equipment cost can be reduced.

In the above invention, the bonding substrate in which the terminal region forming scribe line is formed adjacent to the dividing scribe line of the second substrate may be cut off in addition to the scribe line formed. In the device, the support member includes a pair of left and right support knives that support the left and right sides of the terminal region forming scribe line formed on the second substrate, and the support knives are formed as follows: the terminal region is formed by a scribe line When the center of the support blade is supported, the interval between the adjacent broken line and the support blade becomes smaller than the width of the terminal area.

Thereby, the terminal region forming scribe line can also be separated by pressing the breaking bar from the upper surface of the first substrate in the same manner as the dividing scribe line, so that all the scribe lines can be removed without turning the substrate over. Continuously breaking, thereby improving the productivity of the unit display panel including the terminal area.

1‧‧‧First substrate

2‧‧‧second substrate

3‧‧‧Transportation agency

3a‧‧‧Support knife

3b‧‧‧Conveyor

4‧‧‧Parts

4a‧‧‧ Lifting mechanism

4b‧‧‧beam

5‧‧‧Support members

5a‧‧‧Support knife

5b‧‧‧Support knife

10‧‧‧ mother substrate

11‧‧‧TFT side substrate

12‧‧‧CF side substrate

13‧‧‧Cutter wheel

14‧‧‧dick

15‧‧‧buffer sheet

16‧‧‧Parts

17‧‧‧

D‧‧‧ breaking device

E‧‧‧End material section

L‧‧‧Width

L1‧‧‧ interval

M‧‧‧ mother substrate

M1‧‧‧Sheet mother substrate

S1, S1'‧‧‧

S2, S2'‧‧‧

S3‧‧‧Drawing of terminal area

T‧‧‧Terminal area

U‧‧‧unit display panel

W‧‧‧Bending

Fig. 1 (a) to (d) are explanatory views showing an example of a mother substrate which is divided by the apparatus of the present invention.

Fig. 2 is a plan view schematically showing an example of the breaking device of the present invention.

3(a) and 3(b) are explanatory views showing an example of the breaking device of the present invention and a breaking step.

4(a) to 4(d) are explanatory views of the same breaking device as that of Fig. 3.

5(a) to 5(c) are partially enlarged explanatory views showing the breaking bar and the supporting member.

Figure 6 is a cross-sectional view showing another embodiment of the support member.

7(a) to 7(g) are explanatory views showing the breaking device of the prior bonded substrate.

8(a) to 8(d) are explanatory views showing another example of the breaking device of the prior bonded substrate.

An embodiment of the breaking device of the bonded substrate of the present invention will be described based on the drawings. The breaking device of the present invention is used with a scoring device. In other words, the mother substrate to be processed is transferred to the current breaking device after the scribe line (cutting groove) is processed on the surface of each of the first substrate and the second substrate that are bonded together by the scribe device. Regardless of the illustration of the scribing device, a well-known scoring device using a cutter wheel or a laser beam can be utilized. Further, the device for transporting the self-engraving device to the breaking device can be carried out by using a transport device using a well-known conveyor.

Fig. 1(a) is a plan view showing an example of a mother substrate M to be processed by the breaking device of the present invention, and Fig. 1(b) is a perspective view thereof. The mother substrate M has a substrate structure in which the first substrate 1 and the second substrate 2 are bonded together. Here, the first substrate 1 is a TFT side substrate, and the second substrate 2 is a CF side substrate. Further, the thickness of each of the mother substrates M is preferably 0.05 mm to 0.2 mm, and more preferably 0.15 mm or less.

Hereinafter, a description will be given of a case where nine unit display panels U of three rows are arranged in the X direction and the Y direction from the mother substrate M, and are displayed in each unit cut out as shown in FIG. 1(d). One of the four peripherals of the panel U forms an external connection terminal region T.

On the surface of the first substrate 1 of the mother substrate M, a dividing line S1 for dividing the mother substrate M into nine X directions and a dividing line S2 for dividing the Y direction are formed. Further, as shown in FIG. 1(b), on the front surface of the second substrate 2, the X-direction dividing line S1' and the Y direction are formed on the front and back sides of the scribe lines S1 and S2 of the first substrate 1. The line is broken by S2'.

Further, on the second substrate, the terminal region forming scribe line S3 for forming the terminal region T is formed by the scribe line S1' along the X direction. The interval between the dividing line S1' and the terminal area forming line S3 and the width of the terminal area T of the unit display panel U which is finally cut out L (refer to Fig. 1 (d)) is the same. The width L of the terminal region T in this embodiment is set to 2 mm.

The mother substrate M on which the scribe lines as described above are formed is transported to the breaking device D of the present invention in the breaking step.

As shown in FIGS. 2 to 5, the breaking device D includes a conveying mechanism 3 that conveys the mother substrate M from upstream to downstream (in the direction of the arrow in FIG. 3), and the breaking bar 4 disposed in the middle of the conveying mechanism 3. And pressing the surface of the first substrate 1 of the mother substrate M; and the supporting member 5 supporting the lower surface of the second substrate 2 of the mother substrate M at a position below the breaking bar 4.

The transport mechanism 3 transports the mother substrate M in a state in which the scribe lines to be divided are orthogonal to the traveling direction, and includes the conveyors 3a and 3b before and after. The breaking rod 4 and the supporting member 5 are disposed between the conveyors 3a and 3b before and after the above.

The breaking bar 4 is formed of a plate material extending in the extending direction of the scribe line of the mother substrate M to be divided, and is held by the beam 4b via a lifting mechanism 4a such as a hydraulic cylinder. Further, by controlling the elevating mechanism 4a by means of a computer (not shown), the elevating stroke of the breaking bar 4 can be controlled to adjust the pressing force to the mother substrate M.

As shown in the enlarged view of Fig. 5, the support member 5 includes a pair of left and right support knives 5a, 5a disposed below the breaking bar 4. The support blades 5a and 5a are formed in such a manner that any one of the scribe lines S1', S2', and S3 to be separated from the mother substrate M by the conveyor 3a to be transferred to the second substrate 2 is located at the breaking bar. When it is directly below 4, it supports the vicinity of the left and right sides of the above-mentioned line. Further, it is formed in a manner that a line is to be cut under the second substrate 2, for example, the terminal region shown in FIG. 5(b) is formed by the scribe line S3 to the center of the left and right support knives 5a, 5a. The interval L1 between the scribe line S3 and a support blade is smaller than the width L of the terminal region. Thereby, the left and right support blades 5a and 5a can be supported while being reliably abutted on the second substrate 2 on both sides. In the present embodiment, the interval between the support knives 5a and 5a is set to 3 mm.

Next, the breaking sequence of the mother substrate M using the breaking device D of the present invention will be described.

First, the mother substrate M shown in FIG. 1 is divided into the upper side and the Y direction of the first substrate 1. The cutting lines S2 and S2' are placed on the conveying mechanism 3 in a state of being orthogonal to the conveying direction of the conveying mechanism 3. Then, the mother substrate M is transferred to the branching bar 4 by the conveying mechanism 3. When the first dividing line S2 and S2' come below the breaking bar 4 as shown in Fig. 3(a), the conveying mechanism 3 is stopped, and the breaking bar 4 is lowered and the first substrate 1 is pressed. As a result, as shown in the enlarged view of Fig. 5(a), the mother substrate M is bent downward between the right and left support blades 5a and 5a, and the second substrate 2 is separated by the scribe line S2', and Since the thickness of the plate is thin, the dividing line S2 formed on the first substrate 1 is also broken in a state where no "notch" is generated. Then, the next break line is also broken in the same order. Further, the mother substrate M is cut along the dividing lines S2 and S2' to form a rectangular strip-shaped substrate M1 in which three unit display panels U are arranged as shown in Fig. 1(c).

Further, in the above-described breaking step, since the dividing line S2' of the second substrate 2 is located on the front side of the scribe line S2 of the first substrate 1, and the thickness of each of the substrates 1 and 2 is thin, it is 0.05~ Since 0.15 mm is used, the two broken lines S2 and S2' can be simultaneously divided by pressing the breaking rod 4 from the upper surface of the first substrate 1.

Moreover, according to the experiment by the inventors and the like, when the breaking bar 4 is pressed, the bending amount W of the mother substrate M between the left and right supporting blades 5a and 5a as shown in Fig. 5(a) is 10 μm. When the pressing force of the breaking rod 4 is set in a manner of 50 μm, the breaking result becomes the most uniform sectional section in which no "notch" is generated, and the breaking can be performed efficiently.

Thereafter, as shown in FIG. 4(a), the strip-shaped mother substrate M1 is placed on the transport mechanism 3 and transported in the direction of the breaking bar 4. In this case, in the state in which the first substrate 1 is on the upper side, the component scribe lines S1 and S1 ′ and the terminal region formation scribe lines S3 are aligned in the direction orthogonal to the transport direction of the transport mechanism 3 . Further, as shown in FIG. 4(b), when the first terminal region forming scribe line S3 formed on the second substrate 2 is positioned below the breaking bar 4, the conveying mechanism 3 is stopped, and the breaking bar 4 is lowered. The first substrate 1 is pressed. As a result, as shown in FIG. 5(b), the mother substrate M1 is bent downward between the left and right support knives 5a and 5a, and the terminal region forming scribe line S3 formed on the second substrate 2 is divided.

In this case, since the distance L1 between the terminal region forming scribe line S3 and one of the left and right support knives 5a and 5a is smaller than the width L of the terminal region, the terminal regions can be reliably supported by the left and right support knives 5a and 5a. The left and right sides of the scribe line S3 are formed to bend the mother substrate between the left and right support knives 5a and 5a.

Then, as shown in FIG. 4(b), the mother substrate M1 is transported by the transport mechanism 3 until the next break line S1, S1' is positioned below the break bar 4, and then stopped, and the break bar 4 is lowered and pressed. The first substrate 1. As a result, as shown in the enlarged view of FIG. 5(c), the mother substrate M1 is bent downward between the left and right support blades 5a and 5a, and the second substrate 2 is separated by the scribe line S1'. The dividing line S1 formed on the first substrate 1 is divided by a scribe line S1.

In the above-mentioned breaking, as described above, the interval L1 between the scribe lines S1, S1' and one of the support knives 5a is formed to be smaller than the width L of the terminal region, so that the left and right support knives 5a, 5a are not spanned to each other. Since the terminal region forming scribe line S3 can support only the scribe lines S1 and S1' to be separated, the terminal region forming scribe line S3 is not erroneously cut at the same time.

Then, as shown in FIG. 4(c), the mother substrate M1 is transferred to the position where the terminal region forming scribe line S3 formed in the vicinity of the dividing scribe line S1' is located below the breaking bar 4, and is cut off. The rod 4 presses the surface of the first substrate 1, whereby the terminal region forming line is broken by the scribe line S3.

Further, the mother substrate M1 is sequentially transferred, and the remaining division scribe lines S1 and S1' and the terminal region formation scribe line S3 are separated.

With respect to the strip-shaped mother substrate M1 obtained by the above-described division, the unit display panel U is pulled apart along the dividing lines S1, S1', and the end material shown by the hatching of FIG. 4(d) is removed. Part E. Thereby, as shown in FIG. 1(d), the first substrate 1, that is, the unit display panel U having the terminal region T in which one of the TFT side substrates is partially exposed can be processed.

As described above, in the present embodiment, by breaking the surface of the first substrate 1 by the breaking bar 4, the division of the first substrate 1 can be separated by a scribe line, and also formed in the above-mentioned division. The division of the second substrate 2 on the front side of the scribe line is broken by a scribe line. Therefore, no need to proceed The operation of inverting the mother substrate M each time the respective scribe lines of the first substrate 1 and the second substrate 2 are separated as before. Thereby, the apparatus for inverting the substrate is not required, and the weight reduction and the cost reduction of the breaking device can be achieved. Further, since the terminal region forming scribe line formed on the second substrate 2 is also separated by pressing the breaking bar 4 from the upper surface of the first substrate 1, all the scribe lines can be continuously performed without inverting the substrate. The division. Thereby, the time required for the breaking operation can be shortened, and productivity can be improved.

Although the representative embodiments of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, the support member 5 disposed under the breaking bar 4 may be a pair of right and left platforms 5b and 5b disposed as a gap, as shown in Fig. 6, instead of the pair of supporting blades 5a and 5a. In this case, the interval between the left and right stages 5b, 5b is formed to be the same length as the interval between the support blades 5a, 5a as described above. Further, the transport mechanism 3 that transports the mother substrate M from the upstream to the downstream can use an adsorption robot (not shown) including an air suction disk. In addition, the present invention can be appropriately modified or changed without departing from the spirit and scope of the invention.

In addition, the method of breaking using the breaking device is summarized.

(a) A method for separating a bonded substrate, which is formed by dividing a scribe line on both surfaces of a bonded substrate in which a first substrate and a second substrate having a thickness of 0.05 to 0.2 mm are bonded, and transporting the above-mentioned a transfer mechanism that bonds the substrate, a breaking bar that presses the bonding substrate from the upper surface of the first substrate, and a supporting member that is located below the breaking bar and supports the lower surface of the bonding substrate via the bonding substrate. The first substrate is pressed along the dividing scribe line formed on the first substrate, and the second substrate is supported by the supporting member, thereby dividing the second substrate The line is divided, and the division of the first substrate formed on the front side of the scribe line is also broken by a scribe line.

(b) The method for dividing a bonded substrate according to the above aspect, wherein a scribe line for forming a terminal region is formed on the second substrate, and a pair of left and right supports formed as follows is used in addition to forming the scribe line for the division. a knife as the above supporting member, that is, a second substrate When the scribe line is located at the center between the left and right support knives, the distance between the scribe line formed by the terminal region and the distance between the support knives becomes smaller than the width of the terminal region, and the above-mentioned break bar is used directly above the scribe line for forming the terminal region. The surface of the first substrate is pressed, and the second substrate is supported by the support member, and the terminal region is formed by a scribe line.

(c) The method of dividing a bonded substrate as described above, which alternately divides the dividing scribe line and the terminal region by a scribe line.

[Industrial availability]

The breaking device of the present invention can be used as a breaking device for dividing a scribe line formed on both surfaces of a bonded substrate.

1‧‧‧First substrate

2‧‧‧second substrate

3‧‧‧Transportation agency

3a‧‧‧Conveyor

3b‧‧‧Conveyor

4‧‧‧Parts

4a‧‧‧ Lifting mechanism

4b‧‧‧beam

5‧‧‧Support members

D‧‧‧ breaking device

E‧‧‧End material section

M1‧‧‧Sheet mother substrate

S1, S1'‧‧‧

S3‧‧‧Drawing of terminal area

U‧‧‧unit display panel

Claims (3)

A cutting device for bonding a substrate, wherein the first substrate and the second substrate are bonded together, and a bonding substrate for dividing the scribe lines is formed on both surfaces, and the bonding substrate is cut along the scribe line And a transfer mechanism that transports the bonded substrate, a break bar that presses the bonded substrate from an upper surface of the first substrate, and a support member that is located at the split bar via the bonded substrate a lower surface of the bonding substrate is supported, and the first substrate is pressed by the breaking bar along the dividing line formed on the first substrate, and the second member is supported by the supporting member In the substrate, the division of the second substrate is separated by a scribe line, and the division of the first substrate formed on the front surface of the scribe line is also broken by a scribe line. In the breaking device of the bonded substrate of the first aspect, the terminal region forming scribe line is formed in addition to the dividing scribe line of the second substrate. In the case where the bonded substrate is divided, the support member includes a pair of right and left support knives that support the left and right sides of the scribe line formed on the second substrate, and the support knives are formed as follows in the terminal region formation. When the scribe line is brought to the center of the left and right support knives, the interval between the adjacent scribe line and the support knives becomes smaller than the width of the terminal area. The breaking device of the bonded substrate according to claim 1 or 2, wherein the bending amount of the second substrate when the bonded substrate is pressed by the breaking bar is 10 μm to 50 μm in the interval between the left and right supporting blades Set the pressing force of the above-mentioned breaking rod.