TW201509621A - Breaking device - Google Patents
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- TW201509621A TW201509621A TW103113731A TW103113731A TW201509621A TW 201509621 A TW201509621 A TW 201509621A TW 103113731 A TW103113731 A TW 103113731A TW 103113731 A TW103113731 A TW 103113731A TW 201509621 A TW201509621 A TW 201509621A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明係關於一種分斷裝置。 The present invention relates to a breaking device.
液晶裝置包含貼合基板，上述貼合基板係由第1基板與第2基板以中間介置液晶層之方式利用密封材料貼合而成(例如專利文獻1)。關於上述貼合基板，就生產性觀點而言，首先製作大片狀態之母基板，將其分斷而製成複數個單位基板。對上述分斷方法詳細地進行說明，首先於貼合基板之第1基板側之面形成劃線，其次自第2基板側按壓貼合基板使其彎曲，而將第1基板沿著劃線分斷。繼而，於貼合基板之第2基板側之面形成劃線，然後，自第1基板側按壓貼合基板使其彎曲，而將第2基板沿著劃線分斷。 The liquid crystal device includes a bonded substrate, and the bonded substrate is bonded together by a sealing material such that the first substrate and the second substrate are interposed with a liquid crystal layer therebetween (for example, Patent Document 1). In the above-mentioned bonded substrate, from the viewpoint of productivity, a mother substrate in a large state is first produced, and this is divided into a plurality of unit substrates. The above-described breaking method will be described in detail. First, a scribe line is formed on the surface of the first substrate side of the bonded substrate, and then the bonded substrate is pressed from the second substrate side to be bent, and the first substrate is divided along the scribe line. Broken. Then, a scribe line is formed on the surface of the second substrate side of the bonded substrate, and then the bonded substrate is pressed from the first substrate side to be bent, and the second substrate is cut along the scribe line.
[專利文獻1]日本專利特開2012-203235號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-203235
於上述方法中，將第1基板分斷之後，必須使貼合基板之正面與背面翻轉後將第2基板分斷。如此，使貼合基板之正面與背面翻轉會產生生產性降低等問題，因此，期望無需使貼合基板之正面與背面翻轉便將第1基板及第2基板分斷。 In the above method, after the first substrate is separated, the front substrate and the back surface of the bonded substrate must be inverted to separate the second substrate. As described above, the front surface and the back surface of the bonded substrate are reversed, which causes problems such as reduced productivity. Therefore, it is desirable to separate the first substrate and the second substrate without inverting the front surface and the back surface of the bonded substrate.
本發明之課題在於提供一種無需使貼合基板之正面與背面翻轉 便可將第1基板及第2基板分斷之分斷裝置。 An object of the present invention is to provide a front and back surface that does not need to be flipped over a bonded substrate. The breaking device that can separate the first substrate and the second substrate.
(1)本發明之某一態樣之分斷裝置為如下分斷裝置，即，沿著形成於第1基板與第2基板貼合而成之貼合基板之第1基板側之面的第1及第2劃線與形成於第2基板側之面的第3劃線將貼合基板分斷。上述分斷裝置包括搬送單元、第1分斷單元、第2分斷單元、及第3分斷單元。搬送單元搬送貼合基板。第1分斷單元沿著第1劃線將第1基板分斷。第2分斷單元沿著第2劃線將第1基板分斷。第3分斷單元沿著第3劃線將第2基板分斷。第1分斷單元、第2分斷單元、及第3分斷單元沿著貼合基板之搬送路徑配置。 (1) A breaking device according to a certain aspect of the present invention is a cutting device that is formed along a surface on a first substrate side of a bonded substrate formed by bonding a first substrate and a second substrate 1 and the second scribe line and the third scribe line formed on the surface on the second substrate side break the bonded substrate. The breaking device includes a conveying unit, a first breaking unit, a second breaking unit, and a third breaking unit. The transport unit transports the bonded substrate. The first breaking unit divides the first substrate along the first scribe line. The second breaking unit divides the first substrate along the second scribe line. The third breaking unit divides the second substrate along the third scribe line. The first breaking unit, the second breaking unit, and the third breaking unit are disposed along the conveying path of the bonded substrate.
根據上述構成，對於由搬送單元搬送之貼合基板，利用第1及第2分斷單元將第1基板分斷，繼而，利用第3分斷單元將第2基板分斷。 如此，藉由沿著搬送路徑配置之第1~第3分斷單元，無需使貼合基板之正面與背面翻轉便可將第1基板及第2基板兩者分斷。其結果為，可使生產性提高。 According to the above configuration, the first substrate is separated by the first and second breaking means for the bonded substrate conveyed by the transport unit, and then the second substrate is cut by the third breaking means. As described above, the first to third breaking units disposed along the transport path can separate both the first substrate and the second substrate without inverting the front and back surfaces of the bonded substrate. As a result, productivity can be improved.
(2)較佳為第2基板包含端子區域。又，第1基板之於第1劃線與第2劃線之間之區域與端子區域對向。第3劃線形成於與第1劃線或第2劃線對應之位置。根據上述構成，藉由利用第1及第2分斷單元將第1基板分斷，可使第2基板之端子區域露出。 (2) Preferably, the second substrate includes a terminal region. Further, a region between the first scribe line and the second scribe line of the first substrate faces the terminal region. The third scribe line is formed at a position corresponding to the first scribe line or the second scribe line. According to the above configuration, the first substrate can be separated by the first and second breaking units, whereby the terminal region of the second substrate can be exposed.
(3)較佳為第1分斷單元、第2分斷單元、及第3分斷單元相互同步地執行分斷動作。根據上述構成，可更有效率地分斷貼合基板。 (3) Preferably, the first breaking unit, the second breaking unit, and the third breaking unit perform the breaking operation in synchronization with each other. According to the above configuration, the bonded substrate can be more efficiently divided.
(4)較佳為搬送單元以第1基板朝向下方之方式搬送貼合基板。根據上述構成，可使第1基板之於第1劃線與第2劃線之間之區域的部分向下方落下。 (4) It is preferable that the transport unit transports the bonded substrate such that the first substrate faces downward. According to the above configuration, the portion of the first substrate in the region between the first scribe line and the second scribe line can be dropped downward.
(5)較佳為第2分斷單元配置於較第1分斷單元更靠搬送路徑之下游。又，較佳為第2分斷單元包含分斷棒及支承棒。於將貼合基板分 斷時，分斷棒自第2基板側按壓貼合基板。支承棒包含將貼合基板分斷時自第1基板側支持貼合基板之一對支持部。而且，一支持部於第1劃線與第2劃線之間支持貼合基板。 (5) Preferably, the second breaking unit is disposed downstream of the transport path than the first breaking unit. Further, it is preferable that the second breaking unit includes a breaking rod and a support rod. For the bonding substrate At the time of the break, the breaking bar presses the bonded substrate from the second substrate side. The support rod includes one of the support substrates that support the bonded substrate from the first substrate side when the bonded substrate is divided. Further, a support portion supports the bonded substrate between the first scribe line and the second scribe line.
根據上述構成，第2分斷單元可沿著第2劃線將第1基板更確實地分斷。 According to the above configuration, the second breaking unit can more reliably divide the first substrate along the second scribe line.
根據本發明之分斷裝置，無需使貼合基板之正面與背面翻轉便可將第1基板及第2基板分斷。 According to the breaking device of the present invention, the first substrate and the second substrate can be separated without turning the front surface and the back surface of the bonded substrate.
1‧‧‧第1分斷單元 1‧‧‧1st break unit
2‧‧‧第2分斷單元 2‧‧‧2nd break unit
3‧‧‧第3分斷單元 3‧‧‧3rd break unit
4a~4c‧‧‧搬送單元 4a~4c‧‧‧Transport unit
10‧‧‧母基板(貼合基板) 10‧‧‧ mother substrate (bonded substrate)
11‧‧‧分斷棒 11‧‧‧Parts
12‧‧‧支承棒 12‧‧‧Support rod
21‧‧‧分斷棒 21‧‧‧Parts
22‧‧‧支承棒 22‧‧‧Support rod
31‧‧‧分斷棒 31‧‧‧Parts
32‧‧‧支承棒 32‧‧‧Support rod
100‧‧‧分斷裝置 100‧‧‧ Breaking device
101‧‧‧第1基板 101‧‧‧1st substrate
102‧‧‧第2基板 102‧‧‧2nd substrate
111‧‧‧按壓部 111‧‧‧ Pressing Department
121a、121b‧‧‧支持部 121a, 121b‧‧‧Support Department
211‧‧‧按壓部 211‧‧‧ Pressing Department
221a、221b‧‧‧支持部 221a, 221b‧‧‧Support Department
311‧‧‧按壓部 311‧‧‧ Pressing Department
321a、321b‧‧‧支持部 321a, 321b‧‧‧ Support Department
C‧‧‧搬送路徑 C‧‧‧Transportation path
L1‧‧‧第1劃線 L1‧‧‧1st line
L2‧‧‧第2劃線 L2‧‧‧2nd line
L3‧‧‧第3劃線 L3‧‧‧3rd line
P‧‧‧單位基板 P‧‧‧unit substrate
R1‧‧‧端子區域 R1‧‧‧Terminal area
R2‧‧‧區域 R2‧‧‧ area
S1‧‧‧第1劃線組 S1‧‧‧1st line group
S2‧‧‧第2劃線組 S2‧‧‧2nd line group
S3‧‧‧第3劃線組 S3‧‧‧3rd line group
T‧‧‧端子 T‧‧‧ terminal
圖1係貼合基板之側視剖面圖。 Figure 1 is a side cross-sectional view of a bonded substrate.
圖2係分斷裝置之立體圖。 Figure 2 is a perspective view of the breaking device.
圖3係說明分斷裝置之動作之側視圖。 Fig. 3 is a side view showing the action of the breaking device.
圖4係說明分斷裝置之動作之側視圖。 Fig. 4 is a side view showing the action of the breaking device.
圖5係說明第2分斷單元之詳情之放大圖。 Fig. 5 is an enlarged view showing the details of the second breaking unit.
以下，一面參照圖式一面對本發明之分斷裝置100之實施形態進行說明。再者，於說明分斷裝置100之前，首先，對作為加工對象之母基板(貼合基板之一例)10進行說明。圖1係表示母基板10之側視剖面圖。 Hereinafter, an embodiment of the breaking device 100 of the present invention will be described with reference to the drawings. In addition, before explaining the breaking device 100, first, a mother substrate (an example of a bonding substrate) 10 to be processed will be described. FIG. 1 is a side cross-sectional view showing the mother substrate 10.
如圖1所示，母基板10包含第1基板101及第2基板102。第1基板101與第2基板102藉由密封材料(省略圖示)而貼合，於第1基板101與第2基板102之間構成例如液晶層。又，液晶層由密封構件包圍。藉由分斷上述母基板10而製作複數個單位基板P。 As shown in FIG. 1 , the mother substrate 10 includes a first substrate 101 and a second substrate 102 . The first substrate 101 and the second substrate 102 are bonded together by a sealing material (not shown), and a liquid crystal layer is formed between the first substrate 101 and the second substrate 102, for example. Further, the liquid crystal layer is surrounded by the sealing member. A plurality of unit substrates P are produced by dividing the mother substrate 10 described above.
例如，第1基板101為形成有複數個彩色濾光片之基板，第2基板102為形成有複數個TFT(Thin Film Transistor，薄膜電晶體)及端子區域R1之基板。端子區域R1為形成有端子T之區域，且形成於每一單位 基板P。由於要經由端子T將內部之TFT與外部機器電性連接，故而最終必須使端子區域R1露出至外部。 For example, the first substrate 101 is a substrate on which a plurality of color filters are formed, and the second substrate 102 is a substrate on which a plurality of TFTs (Thin Film Transistors) and terminal regions R1 are formed. The terminal region R1 is an area in which the terminal T is formed, and is formed in each unit Substrate P. Since the internal TFT is electrically connected to the external device via the terminal T, it is necessary to finally expose the terminal region R1 to the outside.
於單位基板P之間形成有第1~第3劃線L1~L3，以便可使端子區域R1露出至外部。詳細而言，於第2基板102僅形成有第3劃線L3，於第1基板101形成有第1劃線L1及第2劃線L2。第1基板101之由第1劃線L1及第2劃線L2劃定之區域R2與第2基板102之端子區域R1對向。又，第3劃線L3形成於與第1劃線L1對應之位置。包含該等第1~第3劃線L1~L3之劃線組S形成於每一單位基板P彼此之間。再者，於本實施形態中，僅於與搬送方向正交之方向上形成有各劃線L1~L3，但亦可於與搬送方向平行之方向上形成複數條劃線。 The first to third scribe lines L1 to L3 are formed between the unit substrates P so that the terminal region R1 can be exposed to the outside. Specifically, only the third scribe line L3 is formed on the second substrate 102, and the first scribe line L1 and the second scribe line L2 are formed on the first substrate 101. A region R2 defined by the first scribe line L1 and the second scribe line L2 of the first substrate 101 faces the terminal region R1 of the second substrate 102. Further, the third scribe line L3 is formed at a position corresponding to the first scribe line L1. The scribe group S including the first to third scribe lines L1 to L3 is formed between each unit substrate P. Further, in the present embodiment, each of the scribe lines L1 to L3 is formed only in a direction orthogonal to the conveyance direction, but a plurality of scribe lines may be formed in a direction parallel to the conveyance direction.
圖2係表示分斷裝置100之整體之立體圖。再者，將圖2之左側設為上游，將右側設為下游。又，於以下之說明中，所謂「搬送方向」係指朝向下游之方向。 2 is a perspective view showing the entirety of the breaking device 100. In addition, the left side of FIG. 2 is set to the upstream, and the right side is set to the downstream. In the following description, the "transport direction" means a direction toward the downstream.
如圖2所示，分斷裝置100係用以沿著形成於母基板10之兩面之各劃線L1~L3將母基板10分斷之裝置，且包括第1分斷單元1、第2分斷單元2、第3分斷單元3、及複數個搬送單元4a~4c。 As shown in FIG. 2, the breaking device 100 is a device for dividing the mother substrate 10 along each of the scribe lines L1 to L3 formed on both sides of the mother substrate 10, and includes the first breaking unit 1, the second point. The breaking unit 2, the third breaking unit 3, and the plurality of conveying units 4a to 4c.
各搬送單元4a~4c係用以朝向下游搬送母基板10之單元，例如可由圓筒狀之輥等構成。各搬送單元4a~4c可分別包含用以使輥旋轉之驅動源，亦可僅某一搬送單元包含驅動源，而利用該驅動源旋轉驅動其他搬送單元之輥。藉由如此使各搬送單元4a~4c之輥旋轉而將母基板10搬送至下游。再者，圖2之二點鏈線表示母基板10之搬送路徑C。 Each of the transport units 4a to 4c is a unit for transporting the mother substrate 10 downstream, and may be constituted by, for example, a cylindrical roller. Each of the transport units 4a to 4c may include a drive source for rotating the roller, or only one of the transport units may include a drive source, and the drive of the other transport unit may be rotationally driven by the drive source. By rotating the rollers of the respective transport units 4a to 4c in this manner, the mother substrate 10 is transported to the downstream. In addition, the two-dot chain line of FIG. 2 shows the conveyance path C of the mother substrate 10.
第1~第3分斷單元1~3沿著母基板10之搬送路徑C配置，自上游側起按照第1分斷單元1、第2分斷單元2、及第3分斷單元3之順序排列。又，複數個搬送單元4a~4c逐一配置於第1分斷單元1之上游側、第1分斷單元1與第2分斷單元2之間、及第2分斷單元2與第3分斷單元3 之間。再者，上述各單元1~4c可向上游側及下游側移動，以便可變更各單元間之間隔。 The first to third breaking units 1 to 3 are arranged along the transport path C of the mother substrate 10, and are in the order of the first breaking unit 1, the second breaking unit 2, and the third breaking unit 3 from the upstream side. arrangement. Further, the plurality of transport units 4a to 4c are disposed one by one on the upstream side of the first breaking unit 1, between the first breaking unit 1 and the second breaking unit 2, and the second breaking unit 2 and the third breaking unit. Unit 3 between. Further, each of the above units 1 to 4c can be moved to the upstream side and the downstream side so that the interval between the units can be changed.
第1分斷單元1係用以沿著形成於母基板10之第1劃線L1將母基板10之第1基板101分斷之單元。上述第1分斷單元1包含分斷棒11及支承棒12。分斷棒11與支承棒12配置於在上下方向上對向之位置。更詳細而言，分斷棒11與支承棒12配置於隔著母基板10之搬送路徑C而對向之位置，分斷棒11配置於搬送路徑C之上方，支承棒12配置於搬送路徑C之下方。 The first breaking unit 1 is a unit for dividing the first substrate 101 of the mother substrate 10 along the first scribe line L1 formed on the mother substrate 10. The first breaking unit 1 includes a breaking rod 11 and a support rod 12. The breaking rod 11 and the support rod 12 are disposed at positions facing each other in the vertical direction. More specifically, the breaking bar 11 and the support bar 12 are disposed at positions facing each other across the transport path C of the mother substrate 10, the breaking bar 11 is disposed above the transport path C, and the support bar 12 is disposed on the transport path C. Below it.
分斷棒11沿著與搬送路徑C平行且與搬送方向正交之方向延伸。分斷棒11之下部形成為沿著與搬送路徑C平行且與搬送方向正交之方向延伸之三角柱狀，且成為越靠前端(下端)越窄之前端變窄之形狀。上述分斷棒11之前端之脊線部係於分斷動作時與母基板10接觸之按壓部111。分斷棒11設置成可於動作位置與非動作位置之間升降，於動作位置，按壓部111按壓母基板10。又，於分斷棒11自動作位置上升而處於非動作位置時，按壓部111不與母基板10接觸。 The breaking rod 11 extends in a direction parallel to the conveying path C and orthogonal to the conveying direction. The lower portion of the breaking rod 11 is formed in a triangular column shape extending in a direction parallel to the conveying path C and orthogonal to the conveying direction, and has a shape in which the front end is narrower as the front end (lower end) is narrower. The ridge portion at the front end of the breaking rod 11 is a pressing portion 111 that comes into contact with the mother substrate 10 during the breaking operation. The breaking bar 11 is provided to be movable up and down between an operating position and a non-operating position, and the pressing portion 111 presses the mother substrate 10 at the operating position. Further, when the breaking bar 11 automatically rises in position and is in the non-operating position, the pressing portion 111 does not come into contact with the mother substrate 10.
支承棒12沿著分斷棒11之長邊方向延伸，即，沿著與搬送路徑C平行且與搬送方向正交之方向延伸。支承棒12包含兩個上部，各上部形成為沿著與搬送路徑C平行且與搬送方向正交之方向延伸之三角柱狀。又，支承棒12之各上部成為越靠前端(上端)越窄之前端變窄之形狀。上述支承棒12之各前端之兩個脊線部為與母基板10接觸之支持部121a、121b。上述各支持部121a、121b沿著按壓部111之長邊方向延伸。各支持部121a、121b係相互隔開特定間隔而延伸。而且，按壓部111配置於與支持部121a和支持部121b之間對向之位置。再者，各支持部121a、121b之間之距離寬於按壓部111之寬度。 The support rod 12 extends in the longitudinal direction of the breaking rod 11, that is, in a direction parallel to the transport path C and orthogonal to the transport direction. The support rod 12 includes two upper portions, and each upper portion is formed in a triangular column shape extending in a direction parallel to the transport path C and orthogonal to the transport direction. Further, each of the upper portions of the support rods 12 has a shape in which the front end is narrower as the front end (upper end) is narrower. The two ridge portions of the respective tips of the support bars 12 are support portions 121a and 121b that are in contact with the mother substrate 10. Each of the support portions 121a and 121b extends along the longitudinal direction of the pressing portion 111. Each of the support portions 121a and 121b extends at a predetermined interval from each other. Further, the pressing portion 111 is disposed at a position opposed to the support portion 121a and the support portion 121b. Furthermore, the distance between the support portions 121a and 121b is wider than the width of the pressing portion 111.
第2分斷單元2係用以沿著形成於母基板10之第2劃線L2將母基板10之第1基板101分斷之單元。上述第2分斷單元2包含分斷棒21及支承 棒22。分斷棒21於前端(下端)包含按壓部211，支承棒22於前端(上端)包含兩個支持部221a、221b。上述第2分斷單元2為與上述第1分斷單元1相同之構成，因此省略詳細之說明。 The second breaking unit 2 is a unit for dividing the first substrate 101 of the mother substrate 10 along the second scribe line L2 formed on the mother substrate 10. The second breaking unit 2 includes a breaking rod 21 and a support Stick 22. The breaking rod 21 includes a pressing portion 211 at the front end (lower end), and the supporting rod 22 includes two supporting portions 221a, 221b at the front end (upper end). Since the second breaking unit 2 has the same configuration as the first breaking unit 1, the detailed description thereof will be omitted.
第3分斷單元3係用以沿著形成於母基板10之第3劃線L3將母基板10之第2基板102分斷之單元。上述第3分斷單元3包含分斷棒31及支承棒32。分斷棒31於前端(上端)包含按壓部311，支承棒32於前端(下端)包含兩個支持部321a、321b。除分斷棒31位於搬送路徑C之下方，支承棒32位於搬送路徑C之上方之方面以外，第3分斷單元3為與上述第1分斷單元1相同之構成，因此省略詳細之說明。 The third breaking unit 3 is a unit for dividing the second substrate 102 of the mother substrate 10 along the third scribe line L3 formed on the mother substrate 10. The third breaking unit 3 includes a breaking rod 31 and a support rod 32. The breaking bar 31 includes a pressing portion 311 at the front end (upper end), and the support bar 32 includes two support portions 321a, 321b at the front end (lower end). The third breaking unit 3 has the same configuration as the first breaking unit 1 except that the breaking rod 31 is located below the conveying path C and the support rod 32 is positioned above the conveying path C. Therefore, detailed description thereof will be omitted.
其次，對以上述方式構成之分斷裝置100之動作進行說明。 Next, the operation of the breaking device 100 configured as described above will be described.
如圖2所示，首先，基於母基板10之尺寸、及各劃線L1~L3之間距而調整各單元1~4c之位置。再者，藉由刻劃裝置(省略圖示)而於母基板10形成有複數組包含第1~第3劃線L1~L3之劃線組。於以下說明中，將形成於母基板10之下游側之端部的劃線組設為第1劃線組S1，將形成於第1劃線組S1之上游側之劃線組設為第2劃線組S2，將形成於第2劃線組S2之上游側之劃線組設為第3劃線組S3。再者，除第1劃線組S1以外之各劃線組包含第1~第3劃線L1~L3。第1劃線組S1僅包含第2劃線L2及第3劃線L3，而不包含第1劃線L1。 As shown in FIG. 2, first, the positions of the respective units 1 to 4c are adjusted based on the size of the mother substrate 10 and the distance between the scribe lines L1 to L3. Further, a scribing group including the first to third scribe lines L1 to L3 in the complex array is formed on the mother substrate 10 by a scribing device (not shown). In the following description, the scribing group formed at the end portion on the downstream side of the mother substrate 10 is referred to as a first scribing group S1, and the scribing group formed on the upstream side of the first scribing group S1 is referred to as a second In the scribing group S2, the scribing group formed on the upstream side of the second scribing group S2 is referred to as the third scribing group S3. Further, each of the scribe lines other than the first scribe group S1 includes the first to third scribe lines L1 to L3. The first underlined group S1 includes only the second scribe line L2 and the third scribe line L3, and does not include the first scribe line L1.
其次，利用各搬送單元4a~4c間歇地搬送母基板10。具體而言，利用各搬送單元4a~4c將母基板10向下游側搬送，若如圖3所示般母基板10之第1劃線組S1之第2劃線L2到達第2分斷單元2，則停止上述搬送。更詳細而言，若母基板10之第1劃線組S1之第2劃線L2位於第2分斷單元2之分斷棒21之按壓部211之下方，則各搬送單元4a~4c停止母基板10之搬送。此時，第2劃線組S2之第1劃線L1位於第1分斷單元1之分斷棒11之按壓部111之下方。再者，於搬送母基板10之期間，各分斷單元1~3之分斷棒11~31處於非動作位置。 Next, the mother substrate 10 is intermittently transferred by the respective transfer units 4a to 4c. Specifically, the mother substrate 10 is transported to the downstream side by the respective transport units 4a to 4c, and as shown in FIG. 3, the second scribe line L2 of the first scribe line group S1 of the mother substrate 10 reaches the second break unit 2 Then stop the above transfer. More specifically, when the second scribe line L2 of the first scribe line group S1 of the mother substrate 10 is located below the pressing portion 211 of the breaking bar 21 of the second breaking unit 2, each of the conveying units 4a to 4c stops the mother. The substrate 10 is transported. At this time, the first scribe line L1 of the second scribe group S2 is located below the pressing portion 111 of the breaking rod 11 of the first breaking unit 1. Further, during the transfer of the mother substrate 10, the breaking bars 11 to 31 of the respective breaking units 1 to 3 are in a non-operating position.
於上述狀態下，第1及第2分斷單元1、2進行動作。具體而言，第1分斷單元1之分斷棒11下降至動作位置，按壓部111自第2基板102側沿著第2劃線組S2之第1劃線L1按壓母基板10。藉此，母基板10之第1基板101沿著第2劃線組S2之第1劃線L1被分斷。 In the above state, the first and second breaking units 1 and 2 operate. Specifically, the breaking bar 11 of the first breaking unit 1 is lowered to the operating position, and the pressing portion 111 presses the mother substrate 10 from the second substrate 102 side along the first scribe line L1 of the second scribe group S2. Thereby, the first substrate 101 of the mother substrate 10 is divided along the first scribe line L1 of the second scribe group S2.
於利用上述第1分斷單元1進行分斷動作時，母基板10由支承棒12之各支持部121a、121b自下側支持。具體而言，各支持部121a、121b於橫跨第2劃線組S2之第1劃線L1之狀態下支持母基板10。即，一支持部121a於較第2劃線組S2之第1劃線L1更靠上游側與第1基板101接觸。又，另一支持部121b於較第2劃線組S2之第1劃線L1更靠下游側與第1基板101接觸。 When the breaking operation is performed by the first breaking unit 1, the mother substrate 10 is supported by the support portions 121a and 121b of the support bar 12 from the lower side. Specifically, each of the support portions 121 a and 121 b supports the mother substrate 10 in a state of crossing the first scribe line L1 of the second scribe group S 2 . In other words, the support portion 121a is in contact with the first substrate 101 on the upstream side of the first scribe line L1 of the second scribe line group S2. Further, the other support portion 121b is in contact with the first substrate 101 on the downstream side of the first scribe line L1 of the second scribe line group S2.
而且，第2分斷單元2之分斷棒21亦同樣地下降至動作位置，按壓部211自第2基板102側沿著第1劃線組S1之第2劃線L2按壓母基板10。藉此，母基板10之第1基板101沿著第1劃線組S1之第2劃線L2被分斷。 Further, the breaking bar 21 of the second breaking unit 2 is also lowered to the operating position in the same manner, and the pressing portion 211 presses the mother substrate 10 from the second substrate 102 side along the second scribe line L2 of the first scribe group S1. Thereby, the first substrate 101 of the mother substrate 10 is divided along the second scribe line L2 of the first scribe group S1.
於利用上述第2分斷單元2進行分斷動作時，母基板10由支承棒22之各支持部221a、221b自下側支持。具體而言，各支持部221a、221b於橫跨第1劃線組S1之第2劃線L2之狀態下支持母基板10。即，一支持部221a於較第1劃線組S1之第2劃線L2更靠上游側與第1基板101接觸。又，另一支持部221b於較第1劃線組S1之第2劃線L2更靠下游側與第1基板101接觸。 When the breaking operation is performed by the second breaking unit 2, the mother substrate 10 is supported by the support portions 221a and 221b of the support rod 22 from the lower side. Specifically, each of the support portions 221a and 221b supports the mother substrate 10 in a state of crossing the second scribe line L2 of the first scribe group S1. In other words, the support portion 221a is in contact with the first substrate 101 on the upstream side of the second scribe line L2 of the first scribe line group S1. Further, the other support portion 221b is in contact with the first substrate 101 on the downstream side of the second scribe line L2 of the first scribe line group S1.
於母基板10之第1基板101沿著第1劃線組S1之第2劃線L2及第2劃線組S2之第1劃線L1被分斷後，第1及第2分斷單元1、2之各分斷棒11、21返回至非動作位置。而且，各搬送單元4a~4c進行動作，將母基板10進一步向下游側搬送。 After the first substrate 101 of the mother substrate 10 is divided along the second scribe line L2 of the first scribe line group S1 and the first scribe line L1 of the second scribe line group S2, the first and second breaking units 1 are separated. Each of the split bars 11, 21 of 2 returns to the non-action position. Further, each of the transport units 4a to 4c operates to further transport the mother substrate 10 to the downstream side.
如圖4所示，若母基板10之第1劃線組S1之第3劃線L3到達第3分斷單元3，則各搬送單元4a~4c停止母基板10之搬送。詳細而言，若 母基板10之第1劃線組S1之第3劃線L3位於第3分斷單元3中之分斷棒31之按壓部311之上方，則各搬送單元4a~4c停止搬送動作。再者，於上述狀態下，母基板10之第2劃線組S2之第2劃線L2到達第2分斷單元2。詳細而言，母基板10之第2劃線組S2之第2劃線L2位於第2分斷單元2中之分斷棒21之按壓部211之下方。進而，於上述狀態下，母基板10之第3劃線組S3之第1劃線L1到達第1分斷單元1。詳細而言，母基板10之第3劃線組S3之第1劃線L1位於第1分斷單元1中之分斷棒11之按壓部111之下方。 As shown in FIG. 4, when the third scribe line L3 of the first scribe line group S1 of the mother substrate 10 reaches the third breaking unit 3, each of the transport units 4a to 4c stops the transport of the mother substrate 10. In detail, if When the third scribe line L3 of the first scribe line group S1 of the mother substrate 10 is located above the pressing portion 311 of the breaking bar 31 of the third breaking unit 3, the conveying units 4a to 4c stop the conveying operation. Further, in the above state, the second scribe line L2 of the second scribe line group S2 of the mother substrate 10 reaches the second breaking unit 2. Specifically, the second scribe line L2 of the second scribe line group S2 of the mother substrate 10 is located below the pressing portion 211 of the breaking bar 21 of the second breaking unit 2. Further, in the above state, the first scribe line L1 of the third scribe line group S3 of the mother substrate 10 reaches the first breaking unit 1. Specifically, the first scribe line L1 of the third scribe line group S3 of the mother substrate 10 is located below the pressing portion 111 of the breaking bar 11 in the first breaking unit 1.
於上述狀態下，第1分斷單元1、第2分斷單元2、及第3分斷單元3相互同步地進行動作。具體而言，第1分斷單元1之分斷棒11下降至動作位置，按壓部111自第2基板102側沿著第3劃線組S3之第1劃線L1按壓母基板10。藉此，母基板10之第1基板101沿著第3劃線組S3之第1劃線L1被分斷。又，母基板10由支承棒12之各支持部121a、121b自下側支持。 In the above state, the first breaking unit 1, the second breaking unit 2, and the third breaking unit 3 operate in synchronization with each other. Specifically, the breaking bar 11 of the first breaking unit 1 is lowered to the operating position, and the pressing portion 111 presses the mother substrate 10 along the first scribe line L1 of the third scribe group S3 from the second substrate 102 side. Thereby, the first substrate 101 of the mother substrate 10 is divided along the first scribe line L1 of the third scribe group S3. Further, the mother substrate 10 is supported by the support portions 121a and 121b of the support bar 12 from the lower side.
又，第2分斷單元2之分斷棒21下降至動作位置，按壓部211自第2基板102側沿著第2劃線組S2之第2劃線L2按壓母基板10。藉此，母基板10之第1基板101沿著第2劃線組S2之第2劃線L2被分斷。此處，由於母基板10係以第1基板101朝向下方之狀態被搬送，故而第1基板101之相當於區域R2之部分向下方落下，而成為端子T露出至外部之狀態。 Further, the breaking bar 21 of the second breaking unit 2 is lowered to the operating position, and the pressing portion 211 presses the mother substrate 10 from the second substrate 102 side along the second scribe line L2 of the second scribe group S2. Thereby, the first substrate 101 of the mother substrate 10 is divided along the second scribe line L2 of the second scribe group S2. Here, since the mother substrate 10 is conveyed in a state in which the first substrate 101 faces downward, the portion of the first substrate 101 corresponding to the region R2 falls downward, and the terminal T is exposed to the outside.
於利用上述第2分斷單元2進行分斷動作時，母基板10由支承棒22之各支持部221a、221b自下側支持。更具體而言，如圖5所示，各支持部221a、221b於橫跨第2劃線組S2之第2劃線L2之狀態下支持母基板10。即，一支持部221a於較第2劃線L2更靠上游側與第1基板101接觸。又，另一支持部221b於較第2劃線L2更靠下游側與第1基板101接觸。此處，一支持部221b於第2劃線組S2中之第1劃線L1與第2劃線L2 之間與第1基板101接觸。即，一支持部221b與第1基板之區域R2接觸。 When the breaking operation is performed by the second breaking unit 2, the mother substrate 10 is supported by the support portions 221a and 221b of the support rod 22 from the lower side. More specifically, as shown in FIG. 5, each of the support portions 221a and 221b supports the mother substrate 10 in a state of crossing the second scribe line L2 of the second scribe group S2. In other words, the support portion 221a is in contact with the first substrate 101 on the upstream side of the second scribe line L2. Further, the other support portion 221b is in contact with the first substrate 101 on the downstream side of the second scribe line L2. Here, the first scribe line L1 and the second scribe line L2 in the second underline group S2 by the support portion 221b The first substrate 101 is in contact with each other. That is, one support portion 221b is in contact with the region R2 of the first substrate.
又，第3分斷單元3之分斷棒31上升至動作位置，按壓部311自第1基板101側沿著第1劃線組S1之第3劃線L3按壓母基板10。藉此，母基板10之第2基板102沿著第1劃線組S1之第3劃線L3被分斷。又，母基板10由支承棒32之各支持部321a、321b自上側支持。 Further, the breaking bar 31 of the third breaking unit 3 is raised to the operating position, and the pressing portion 311 presses the mother substrate 10 along the third scribe line L3 of the first scribe group S1 from the first substrate 101 side. Thereby, the second substrate 102 of the mother substrate 10 is divided along the third scribe line L3 of the first scribe group S1. Further, the mother substrate 10 is supported by the support portions 321a and 321b of the support bar 32 from the upper side.
藉由重複以上動作而分斷母基板10，可獲取複數個單位基板P。 By repeating the above operations and dividing the mother substrate 10, a plurality of unit substrates P can be obtained.
[變化例] [variation]
以上，已對本發明之實施形態進行了說明，但本發明並不限定於該等實施形態，於不脫離本發明之主旨之範圍內可進行各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited to the embodiments, and various modifications can be made without departing from the spirit and scope of the invention.
變化例1Change 1
於上述實施形態中係自上游側起按照第1分斷單元1、第2分斷單元2、第3分斷單元3之順序配置，但並不特別地限定於此。例如，亦可將第3分斷單元3配置於最上游側，或者交換第1分斷單元1與第2分斷單元2之配置。 In the above embodiment, the first breaking unit 1, the second breaking unit 2, and the third breaking unit 3 are arranged in this order from the upstream side, but are not particularly limited thereto. For example, the third breaking unit 3 may be disposed on the most upstream side or the first breaking unit 1 and the second breaking unit 2 may be arranged.
變化例2Change 2
於上述實施形態中，第1~第3分斷單元1~3係相互同步地執行分斷動作，但並不特別地限定於此。例如，第1~第3分斷單元1~3亦可於不同時序執行各分斷動作。 In the above-described embodiment, the first to third breaking units 1 to 3 perform the breaking operation in synchronization with each other, but are not particularly limited thereto. For example, the first to third breaking units 1 to 3 can also perform the respective breaking operations at different timings.
變化例3Change 3
於上述實施形態中，母基板10係以第1基板101朝向下方、第2基板102朝向上方之狀態被搬送，但並不特別地限定於此，例如，亦可以第1基板101朝向上方、第2基板102朝向下方之狀態被搬送。於上述情形時，第1~第3分斷單元1~3之分斷棒11~31與支承棒12~32之位置相對於上述實施形態而上下顛倒。 In the above-described embodiment, the mother substrate 10 is conveyed in a state in which the first substrate 101 faces downward and the second substrate 102 faces upward. However, the mother substrate 10 is not particularly limited thereto. For example, the first substrate 101 may face upward. 2 The substrate 102 is conveyed in a state of being directed downward. In the above case, the positions of the breaking bars 11 to 31 and the support bars 12 to 32 of the first to third breaking units 1 to 3 are reversed upside down with respect to the above embodiment.
1‧‧‧第1分斷單元 1‧‧‧1st break unit
2‧‧‧第2分斷單元 2‧‧‧2nd break unit
3‧‧‧第3分斷單元 3‧‧‧3rd break unit
4a~4c‧‧‧搬送單元 4a~4c‧‧‧Transport unit
10‧‧‧母基板(貼合基板) 10‧‧‧ mother substrate (bonded substrate)
11‧‧‧分斷棒 11‧‧‧Parts
12‧‧‧支承棒 12‧‧‧Support rod
21‧‧‧分斷棒 21‧‧‧Parts
22‧‧‧支承棒 22‧‧‧Support rod
31‧‧‧分斷棒 31‧‧‧Parts
32‧‧‧支承棒 32‧‧‧Support rod
100‧‧‧分斷裝置 100‧‧‧ Breaking device
111‧‧‧按壓部 111‧‧‧ Pressing Department
121a、121b‧‧‧支持部 121a, 121b‧‧‧Support Department
211‧‧‧按壓部 211‧‧‧ Pressing Department
221a、221b‧‧‧支持部 221a, 221b‧‧‧Support Department
311‧‧‧按壓部 311‧‧‧ Pressing Department
321a、321b‧‧‧支持部 321a, 321b‧‧‧ Support Department
C‧‧‧搬送路徑 C‧‧‧Transportation path
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013182561A JP6207307B2 (en) | 2013-09-03 | 2013-09-03 | Break device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201509621A true TW201509621A (en) | 2015-03-16 |
| TWI611891B TWI611891B (en) | 2018-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103113731A TWI611891B (en) | 2013-09-03 | 2014-04-15 | Breaking device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6207307B2 (en) |
| KR (1) | KR102169532B1 (en) |
| CN (1) | CN104416615B (en) |
| TW (1) | TWI611891B (en) |
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| KR102023453B1 (en) * | 2018-03-28 | 2019-09-20 | 주식회사 카이테크 | Apparatus and method for dividing substrate |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW559620B (en) * | 2001-06-28 | 2003-11-01 | Mitsuboshi Diamond Ind Co Ltd | Device and method for breaking fragile material substrate |
| KR100817129B1 (en) * | 2002-02-07 | 2008-03-27 | 엘지.필립스 엘시디 주식회사 | Cutter of liquid crystal panel and cutting method thereof |
| KR100657197B1 (en) * | 2002-11-22 | 2006-12-14 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for dividing substrate and method for manufacturing substrate using such method |
| JP4274096B2 (en) * | 2004-09-29 | 2009-06-03 | セイコーエプソン株式会社 | Electro-optical device manufacturing apparatus and method |
| JP2007314369A (en) * | 2006-05-25 | 2007-12-06 | Rohm Co Ltd | Substrate cutting method and substrate cutting apparatus |
| KR101175105B1 (en) * | 2008-06-17 | 2012-08-21 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for processing substrate of mother board |
| CN102057314B (en) * | 2008-06-18 | 2012-03-28 | 三星钻石工业股份有限公司 | Substrate processing system |
| JP5193141B2 (en) * | 2009-07-21 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Break unit and break method |
| JP5216040B2 (en) * | 2010-03-31 | 2013-06-19 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate |
| TWI529790B (en) * | 2010-07-05 | 2016-04-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking device |
| JP5156085B2 (en) * | 2010-12-13 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | Method for dividing bonded substrates |
| JP2012203235A (en) | 2011-03-25 | 2012-10-22 | Seiko Epson Corp | Liquid crystal device and electronic appliance |
| JP5553242B2 (en) * | 2011-08-01 | 2014-07-16 | 三星ダイヤモンド工業株式会社 | Substrate cutting method |
| JP5831119B2 (en) * | 2011-10-17 | 2015-12-09 | 日本電気硝子株式会社 | Glass substrate cleaving apparatus, glass substrate cleaving method, and glass substrate manufacturing method |
| JP5824365B2 (en) * | 2012-01-16 | 2015-11-25 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
| CN203003990U (en) * | 2012-08-30 | 2013-06-19 | 苏州市五丰模具有限公司 | Side blanking cutting die |
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- 2013-09-03 JP JP2013182561A patent/JP6207307B2/en not_active Expired - Fee Related
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- 2014-04-30 KR KR1020140052502A patent/KR102169532B1/en active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20150026765A (en) | 2015-03-11 |
| TWI611891B (en) | 2018-01-21 |
| CN104416615A (en) | 2015-03-18 |
| KR102169532B1 (en) | 2020-10-23 |
| JP6207307B2 (en) | 2017-10-04 |
| CN104416615B (en) | 2018-01-30 |
| JP2015048289A (en) | 2015-03-16 |
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