JP4274096B2 - Electro-optical device manufacturing apparatus and method - Google Patents

Description

  The present invention relates to an electro-optical device manufacturing apparatus and a manufacturing method for assembling an electro-optical device using an arrayed element substrate.

  The liquid crystal device is configured by sealing liquid crystal between two substrates such as a glass substrate and a quartz substrate. In a liquid crystal device, active elements such as thin film transistors (hereinafter referred to as TFTs), for example, are arranged in a matrix on one substrate, and a counter electrode is arranged on the other substrate and sealed between the two substrates. An image can be displayed by changing the optical characteristics of the liquid crystal layer according to the image signal.

  That is, an image signal is supplied to pixel electrodes (ITO) arranged in a matrix by TFT elements, and a voltage based on the image signal is applied to the liquid crystal layer between the pixel electrode and the counter electrode to change the arrangement of liquid crystal molecules. Let As a result, the transmittance of the pixel is changed, and light passing through the pixel electrode and the liquid crystal layer is changed according to the image signal to perform image display.

  In order to define the alignment of liquid crystal molecules when no voltage is applied, an alignment film is formed on the surface of one substrate (active matrix substrate (also referred to as element substrate)) and the other substrate (counter substrate) in contact with the liquid crystal layer. The alignment film is rubbed.

  The TFT substrate on which the TFT is disposed and the counter substrate disposed to face the TFT substrate are manufactured separately. Both substrates are bonded together with high accuracy in the panel assembling process, and then liquid crystal is sealed therein.

  In the panel assembly process, first, an alignment film is formed on the opposing surfaces of the TFT substrate and the counter substrate manufactured in each substrate process, that is, on the surface in contact with the liquid crystal layer of the counter substrate and the TFT substrate, and then the rubbing process. Is done. Next, a seal portion serving as an adhesive is formed on the edge of one substrate. The TFT substrate and the counter substrate are bonded together using a seal portion, and are cured by pressure bonding while performing alignment. A part of the seal part is provided with a notch, and the liquid crystal is sealed through the notch.

  By the way, in order to improve the throughput, there is a case where an array manufacturing in which a plurality of TFT substrates are simultaneously formed on the mother glass substrate by proceeding with the size of the mother glass substrate until the end of the assembly process is sometimes employed. . In array manufacturing, a mother glass substrate on which a plurality of TFT substrates are formed is put into an assembling process, and flows from the first cleaning process to the last inspection process in the assembling process. After the completion of the inspection process after liquid crystal injection / sealing, each liquid crystal cell is divided and the process proceeds to the subsequent cell process.

Such a liquid crystal device may be employed as a light valve of a projection display device. In the projection display device, an image on the screen of the liquid crystal panel is enlarged and projected onto the screen. Therefore, when dust adheres to the screen of the liquid crystal panel, the image quality of the display image is significantly deteriorated due to the dust. Therefore, in order to reduce the influence of dust and the like, a dustproof glass is attached to at least the incident surface of the liquid crystal panel, and the influence of dust is eliminated by the defocusing action.
JP 2001-147423 A

  By the way, the dust-proof glass is bonded by hand after completion of the liquid crystal panel constituted by the TFT substrate and the counter substrate. In this case, there are problems in that a cleaning process is required to prevent dust from adhering between the liquid crystal panel and the dust-proof glass, and workability and accuracy of attaching a relatively small liquid crystal panel.

  Therefore, in Patent Document 1, a method of manufacturing a liquid crystal panel on which dust-proof glass is pasted by pasting together a large dust-proof glass in a state of a mother glass substrate (also referred to as a large plate) before splitting. Is disclosed. Since the large TFT substrate and the large dust-proof glass are bonded together, cleaning using the cleaning process during the assembly process and alignment work in the assembly process can be used, reducing the number of processes and bonding An improvement in accuracy can be expected.

  However, there is no disclosure of technology for accurately dividing the large plates together, and in Patent Document 1, the processing accuracy of the end face of the liquid crystal panel, in particular, the peripheral portion of the large plate is formed. There was a problem that the processing accuracy of the liquid crystal panel was low.

  The present invention has been made in view of such problems, and an object thereof is to provide an electro-optical device manufacturing apparatus and a manufacturing method capable of improving the processing accuracy of an end face.

  An electro-optical device manufacturing apparatus according to the present invention includes a first mother substrate that can be divided into a first substrate on which pixels that form a display area of the electro-optical device are formed, and the first mother substrate. A plurality of second substrates that are arranged to face each other for each first substrate, and a third mother substrate that is attached to a surface of the first mother substrate opposite to the second substrate arrangement surface. A holding plate in contact with the surface of the second substrate, and a peripheral edge of the first mother substrate outside the region where the second substrate is disposed on the first mother substrate. A receiving jig that is interposed between the first mother substrate and the holding plate and supports a peripheral portion of the first mother substrate, and means for dividing the first mother substrate. It is characterized by having.

  According to such a configuration, the electro-optical device substrate is configured by arranging the second substrate on one surface of the first mother substrate and bonding the third mother substrate on the other surface. When the electro-optical device substrate is placed on the holding plate, a receiving jig is interposed on the peripheral portion of the first mother substrate. Thereby, the peripheral part of the first mother substrate is supported by the receiving jig. For example, the first mother substrate is divided by applying pressure to the surface of the third mother substrate on the scribe line formed on the first mother substrate. Since the first mother substrate is supported by the second substrate and the receiving jig at the peripheral portion of the first mother substrate, the third mother substrate is positioned on the scribe line near the outermost periphery of the first mother substrate. Even when printing pressure is applied to the surface of the mother substrate, the first mother substrate can be easily divided.

  Further, the receiving jig is a flat plate member having an opening corresponding to a region where the second substrate is arranged.

  According to such a configuration, the peripheral portion of the first mother substrate is supported on the holding plate only by receiving the arrangement region of the second substrate of the first mother substrate within the opening of the jig. Can do.

  Further, the opening of the receiving jig has a shape along a region where the second substrate is disposed.

  According to such a configuration, the distance from the scribe line formed on the first mother substrate to the second substrate and the distance to the receiving jig can be made uniform, and the first mother substrate can be divided. It can be made easier.

  In addition, the holding plate has a structure that bends about a pressed portion.

  According to such a configuration, when the surface of the third mother substrate on the scribe line formed on the first mother substrate is pressed, the first mother substrate is centered around the scribe line. It becomes easy to incline in the opposite direction on the peripheral edge side, and the division can be further facilitated.

  Further, the means for dividing the first mother substrate is a break bar having a square or curved end.

  According to such a configuration, the first mother substrate is divided by the break bar. The break bar has a square or curved tip at the tip, and it is easy to concentrate the pressure and easy to cut.

  Further, there is provided means for forming a scribe for dividing the first mother substrate on the first mother substrate.

  According to such a configuration, since the scribe is formed on the first mother substrate, the first mother substrate can be easily divided by using this scribe.

  In the electro-optical device manufacturing method according to the present invention, the first mother substrate can be divided into a plurality of first substrates on which pixels constituting the display area of the electro-optical device are formed. A step of arranging and bonding a plurality of second substrates facing each other, and a third mother substrate being attached to a surface of the first mother substrate opposite to the second substrate arrangement surface. In the step of forming the electro-optical device substrate and the peripheral portion of the first mother substrate outside the region where the second substrate is disposed on the first mother substrate, the peripheral portion of the first mother substrate is A step of placing the electro-optical device substrate on the holding plate so that the second substrate is in contact with the holding plate through a receiving jig to support, and printing pressure from the surface of the third mother substrate And a step and a tool for dividing at least the first mother substrate. Characterized in that it was.

  According to such a configuration, the second substrate is disposed and bonded to one surface of the first mother substrate, and the third mother substrate is bonded to the other surface to form the electro-optical device substrate. The electro-optical device substrate is mounted on the holding plate at the peripheral portion of the first mother substrate outside the region where the second substrate is disposed, with a receiving jig supporting the peripheral portion of the first mother substrate interposed. Put. In this state, the surface of the third mother substrate is pressed. At the peripheral portion of the first mother substrate, the scribe line formed on the first mother substrate is formed between the second substrate and the receiving jig, and the first mother substrate can be easily formed. Divided.

  In addition, scribes are formed in advance on the first and third mother substrates, and a break bar is brought into contact with the portion corresponding to the scribes on the third mother substrate, whereby the first and third mother substrates are contacted. The mother substrate is divided.

  According to such a configuration, a scribe is formed on the first mother substrate, and the first mother substrate can be easily divided by using this scribe.

  Further, the scribe is provided on a bonding surface of the third mother substrate with the first mother substrate, and the break bar is brought into contact with a surface opposite to the bonding surface. To do.

  According to such a configuration, the first mother substrate can be easily divided by the break bar using the scribe formed on the bonding surface of the first mother substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 7 relate to a first embodiment of the present invention, and FIG. 1 is a front view showing an electro-optical device manufacturing apparatus according to the present embodiment. FIG. 2 is a plan view of an element substrate such as a TFT substrate constituting a liquid crystal device as an electro-optical device, as viewed from the counter substrate side together with each component formed thereon. FIG. 3 is a cross-sectional view of the liquid crystal device after the assembly process for sealing the liquid crystal by adhering the element substrate and the counter substrate cut along the line HH ′ in FIG. 3. FIG. 4 is a plan view showing a planar shape of the break receiving jig in FIG. FIG. 5 is an explanatory view showing another example of a break bar. FIG. 6 is a flowchart for explaining the assembly process. FIG. 7 is an explanatory diagram for explaining the bonding in the large plate state, and FIG. 8 is a process diagram showing the bonding process and the dividing process. FIG. 9 is a flowchart for explaining the bonding and dividing step in FIG. FIG. 10 is an explanatory diagram for explaining the breaking method.

  This embodiment is applied to a device for manufacturing a liquid crystal device as an electro-optical device. First, the structure of the completed liquid crystal device will be described with reference to FIGS.

  As shown in FIGS. 2 and 3, the liquid crystal panel is configured by enclosing a liquid crystal 50 between an element substrate 10 such as a TFT substrate as a first substrate and a counter substrate 20. Glass, quartz, or the like is used as the element substrate 10 and the counter substrate 20. On the element substrate 10, pixel electrodes 9a and the like constituting pixels are arranged in a matrix with switching elements (not shown). On the pixel electrode 9a, an alignment film 16 made of polyimide polymer resin is laminated and rubbed in a predetermined direction.

  On the other hand, the counter substrate 20 is provided with a light shielding film 53 as a frame for partitioning the display area. As described above, a transparent conductive film such as ITO is formed on the entire surface of the counter substrate 20 as the counter electrode 21, and a polyimide-based alignment film 22 is formed on the entire surface of the counter electrode 21. The alignment films 16 and 22 are rubbed in a predetermined direction so as to give a predetermined pretilt angle to the liquid crystal molecules.

  In a region outside the light shielding film 53, a sealing material 52 that encloses liquid crystal is formed between the TFT substrate 10 and the counter substrate 20. The sealing material 52 is disposed so as to substantially match the contour shape of the counter substrate 20, and fixes the TFT substrate 10 and the counter substrate 20 to each other. The sealing material 52 is missing in a part of one side of the TFT substrate 10, and a liquid crystal injection port 108 for injecting the liquid crystal 50 is formed. Liquid crystal is injected from the liquid crystal injection port 108 into the gap between the element substrate 10 and the counter substrate 20 bonded together. After the liquid crystal injection, the liquid crystal injection port 108 is sealed with a sealing material 109.

  In an area outside the sealing material 52, an image signal is supplied to a data line (not shown) at a predetermined timing to drive the data line 101 and an external connection terminal 102 for connection to an external circuit. Are provided along one side of the TFT substrate 10. A scanning line driving circuit 104 that drives the gate electrode by supplying a scanning signal to the scanning line and gate electrode (not shown) at a predetermined timing is provided along two sides adjacent to the one side. The scanning line driving circuit 104 is formed on the TFT substrate 10 at a position facing the light shielding film 53 inside the sealing material 52. On the TFT substrate 10, wiring 105 connecting the data line driving circuit 101, the scanning line driving circuit 104, the external connection terminal 102, and the vertical conduction terminal 107 is provided to face the three sides of the light shielding film 53. Yes.

  The vertical conduction terminals 107 are formed on the four TFT substrates 10 at the corners of the sealing material 52. Between the TFT substrate 10 and the counter substrate 20, there is provided a vertical conductive material 106 whose lower end is in contact with the vertical conduction terminal 107 and whose upper end is in contact with the counter electrode 21. 10 and the counter substrate 20 are electrically connected.

  When the switching element of each pixel is turned on, an image signal is supplied to the pixel electrode 9a for each pixel. A voltage between the pixel electrode 9 a and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50. Depending on the potential difference between the written pixel electrode 9a and the counter electrode 21, the orientation and order of the molecular assembly of the liquid crystal 50 change, and light is modulated to enable gradation display.

  On the surface of the element substrate 10 of the liquid crystal panel 120 constituted by the element substrate 10 and the counter substrate 20, a dustproof glass 30 as a third mother substrate is attached to constitute the liquid crystal device 1. Even when the liquid crystal device 1 is used as a light valve of a projection device, the influence of dust can be avoided by the defocusing action of the dustproof glass 30.

  In the present embodiment, the manufacture of the liquid crystal device shown in FIGS. 2 and 3 employs array manufacturing in which the liquid crystal device is manufactured in a large plate state (mother substrate) until the end of the assembly process. The apparatus shown in FIG. 1 is used for a dividing step during array manufacturing.

  In FIG. 1, a holding plate 72 is provided on a table 71. The holding plate 72 is configured by a metal plate or the like. The holding plate 72 may be made of resin or rubber material. The holding plate 72 has a predetermined thickness and a predetermined hardness, and is configured to bend when pressed.

  For example, in order to secure a sufficient amount of deflection, the holding plate 72 may be configured by a three-layer structure of two relatively thin metal plates and a cushion material interposed between these metal plates.

  In the present embodiment, a large-sized liquid crystal panel (hereinafter referred to as a liquid crystal device substrate) 77 in which dustproof glass is bonded to the holding plate 72 is placed. In other words, the liquid crystal device substrate 77 as an electro-optical device substrate has one surface of a TFT mother substrate 74 as a first mother substrate on which a plurality of element substrates (corresponding to the element substrate 10 in FIGS. 2 and 3) are formed. A plurality of counter substrates 75 (corresponding to the counter substrate 20 in FIGS. 2 and 3) are bonded together, and a large plate-shaped dust-proof glass 76 is bonded to the other surface.

  The holding plate 72 has an adsorption mechanism so that the liquid crystal device substrate 77 is fixedly supported during the dividing step. For example, the holding plate 72 has a plurality of suction holes (not shown) arranged at appropriate intervals, and the liquid crystal device substrate 77 is vacuum-sucked through the suction holes.

  In order to facilitate vacuum suction, for example, a film-like sheet 80 is attached to the mounting surface of the liquid crystal device substrate 77 on the holding plate 72, that is, the surface of the counter substrate 75 as the second substrate. It has become. The sheet 80 affixed to the liquid crystal device substrate 77 is vacuum-adsorbed to the holding plate 72 so that the liquid crystal device substrate 77 is fixed.

  When the sheet 80 is not used, the suction hole of the holding plate 72 may be disposed at a position facing the counter substrate 75.

  As shown in FIG. 1, the liquid crystal device substrate 77 is placed on the holding plate 72 with the counter substrate 75 side facing the holding plate 72. In this case, in the present embodiment, a break receiving jig 73 is arranged between the TFT mother substrate 74 and the holding plate 72 in order to support the peripheral portion of the TFT mother substrate 74. 4A and 4B show examples of the planar shape of the break receiving jig 73 in FIG.

  For example, as shown in FIG. 4A, the break receiving jig 73 is configured to have a rectangular outer shape, and the center is open. The central opening 85 has a shape corresponding to the arrangement region of the counter substrate 75 on the TFT mother substrate 74. With this shape, the TFT mother substrate 74 can be supported on the holding plate 72 only by arranging the arrangement region of the counter substrate 75 on the TFT mother substrate 74 in the opening 85 of the break receiving jig 73. The outer shape of the break receiving jig 73 may be a circular shape or the like.

The thickness of the break receiving jig 73 is substantially the same as the thickness of the counter substrate. If the thickness of the break receiving jig 73 is Bt and the thickness of the counter substrate 75 is Tc, for example,
−1 mm ≦ Bt−Tc <0.4 mm
Set to the range.

The meat portion 86 of the break receiving jig 73 contacts the surface of the sheet 80 on the back surface, and contacts the surface of the TFT mother substrate 74 of the liquid crystal device substrate 77 on the front surface. In this case, preferably, the entire peripheral edge portion of the TFT mother substrate 74 is in contact with the break receiving jig 73. Furthermore, the distance between the end surface of the counter substrate 75 and the dividing position (a cutting line to be described later) is L, and the distance between the end surface of the counter substrate 75 near the outermost periphery of the liquid crystal device substrate 77 and the meat portion end surface 87 of the break receiving jig 73. If LcB,
LcB <2L (1)
The shape and size of the meat portion 86 of the break receiving jig 73 are determined so as to satisfy the above.

Preferably, the distance LcB is set in the range of 0 to 3Lc, where L is the distance between the end surfaces of the adjacent counter substrates 75.
In the present embodiment, in order to satisfy the above expression (1), the shape of the meat portion 86 is made to coincide with the shape of the arrangement region of the counter substrate 75, but the entire peripheral portion of the element substrate is subjected to the break receiving. As long as it abuts against the jig 73, it is not always necessary to satisfy the expression (1), and the planar shape of the opening 85 can be circular as shown in FIG. 4B.

  Various materials can be used as the break receiving jig 73, but it is preferable to use a material softer than the TFT mother substrate 74, for example, a material having a Picker's hardness of 800 or less. This can prevent the TFT mother substrate 74 from being damaged.

  On the TFT mother substrate 74, a scribe 78 for dividing each element substrate is formed on the surface on which the counter substrate 75 is formed. Each element substrate is divided along a line in which a scribe 78 is formed (a cut line (hereinafter also referred to as a scribe line)). That is, at the time of division, as shown in FIG. 1, the break bar 79 is placed on or near the scribe line with the liquid crystal device substrate 77 placed on the holding plate 72 and the break receiving jig 73. Place on the surface and apply impact or static pressure from above. Thereby, only the liquid crystal device substrate 77 or both the liquid crystal device substrate 77 and the dust-proof glass 76 can be divided at the cutting line position at the same time.

  The break bar 79 has a tip shape that can be linearly printed along the cutting line, and the cross-sectional shape is formed in a square shape having a tip of an angle of 30 ° to 150 °, for example. Moreover, as a cross-sectional shape, as shown in FIG. 5, you may employ | adopt the break bar 81 formed in the R shape which has the R-shaped (curved surface shape) front-end | tip of about R2.5 mm-100 mm. Further, the tip does not necessarily have an acute angle as long as the pressure can be applied along the cutting line or the vicinity thereof from the upper surface of the dust-proof glass 76, and the tip has a certain area and touches the upper surface of the dust-proof glass 76. It may be like this.

Next, a panel assembly process including a bonding process and a dividing process will be described with reference to FIGS.
The TFT substrate and the counter substrate are manufactured separately. As described above, in the present embodiment, the TFT substrate is manufactured by array manufacturing in which processing is performed in the same size as when the mother glass substrate was loaded. As shown in FIG. 7, a plurality of element substrates (not shown) similar to the element substrate 10 shown in FIGS. 2 and 3 are formed on the TFT mother substrate 74. On the other hand, for the counter substrate 75, a divided substrate similar to the counter substrate 20 of FIGS.

  For the counter substrate 75, polyimide corresponding to the alignment film 22 is applied to the counter substrate 75 prepared in step S6 of FIG. 6 in the next step S7. Next, in step S8, the alignment film on the surface of the counter substrate 75 is rubbed. The cleaning process in step S9, which performs cleaning in step S9, is for removing dust generated by the rubbing process of the counter substrate 75.

  On the other hand, for the TFT mother substrate 74, polyimide corresponding to the alignment film 16 is applied to the TFT mother substrate 74 prepared in step S1 in the next step S3. Next, in step S3, a rubbing process is performed on the alignment film on the surface of the TFT mother substrate 74. Next, cleaning is performed in step S4.

  Next, the counter substrate 75 is bonded to each element substrate of the TFT mother substrate 74 in correspondence with the position of each element substrate. That is, in step S5, the sealing material 52 and the conductive material 106 (see FIG. 2) are formed. The sealing material 52 is formed by dispensing application, for example. Note that the sealing material may be formed by a screen printing method.

  After the sealing material 52 is formed, next, in step S10, the counter substrate 75 is bonded to each element position on each TFT mother substrate 74, and in step S11, pressure bonding is performed while performing alignment, and the sealing material 52 is cured. .

  Next, in step S <b> 12, liquid crystal is sealed from a notch provided in a part of the sealing material 52, and the liquid crystal is sealed by closing the notch. FIG. 8A shows a state where a plurality of counter substrates 75 are bonded to the TFT mother substrate 74. In the present embodiment, in the next step S13, each element substrate is divided after the dust-proof glass is bonded.

  FIG. 9 is a flowchart showing a specific procedure of the bonding and dividing step in FIG.

  In step S21 in FIG. 9, a large-plate-state dust-proof glass 76 is attached to the large-plate-state TFT mother substrate 74. Before and after the bonding of the TFT mother substrate 74 and the dust-proof glass 76, a scribe along the dividing position is formed only on the TFT mother substrate 74 or on both the TFT mother substrate 74 and the dust-proof glass 76.

  The example of FIG. 7 shows an example in which scribes Ls and Lp are formed on both the TFT mother substrate 74 and the dust-proof glass 76. In addition, when the scribe is formed before the bonding of the TFT mother substrate 74 and the dust-proof glass 76, a cleaning process after the scribe formation is necessary before the bonding process. Further, when the scribe Ls is formed only on the TFT mother substrate 74, the scribe Ls may be formed after the bonding step.

  Thus, the liquid crystal device substrate 77 formed by bonding the TFT mother substrate 74 and the dustproof glass 76 in a large plate state is placed on the holding plate 72 of FIG. In this case, preferably, in step S22, the sheet 80 is attached to the surface of the counter substrate 75. Next, a break receiving jig 73 is interposed between the liquid crystal device substrate 77 and the holding plate 72 (sheet 80) (step S23), and the liquid crystal device substrate 77 is placed on the holding plate 72 (step S24). .

  Next, in step S <b> 25, vacuum suction is performed to fix the liquid crystal device substrate 77 on the holding plate 72. In the next step S26, only the TFT mother substrate 74 or both the TFT mother substrate 74 and the dustproof glass 76 are broken. That is, as shown in FIG. 10, a break bar 79 is arranged on or near each scribe line on the surface of the dust-proof glass 76, and printing pressure is applied from the surface of the dust-proof glass 76.

  Starting from a scribe 78 (corresponding to Ls and Lp in FIG. 7) formed under the break bar 79 by static pressure or impact by the break bar 79, the TFT mother substrate 74 or both of the TFT mother substrate 74 and the dustproof glass 76 A crack is generated and the TFT mother substrate 74 or both the TFT mother substrate 74 and the dust-proof glass 76 are divided along the scribe line. FIG. 10 shows an example in which a scribe 78 is formed on both the TFT mother substrate 74 and the dust-proof glass 76. In this case, both the TFT mother substrate 74 and the dust-proof glass 76 are divided at the same time.

  Since the holding plate 72 is bent, at the time of break, the liquid crystal device substrate 77 and the break receiving jig 73 are tilted around the scribe line by the printing pressure from the surface of the dust-proof glass 76 of the break bar 79. That is, the inclination is reversed between the center side and the outer peripheral side of the liquid crystal device substrate 77 with the break line as the center, so that the division is easy.

  At this time, first, a scribe line may be formed only on the TFT mother substrate 74 and the TFT mother substrate 74 may be divided, and then the scribe line may be formed on the dust-proof glass 76 to divide the dust-proof glass 76.

  Thereafter, each liquid crystal device 1 can be separated from the liquid crystal device substrate 77 by repeating the printing pressure of the break bar along all the scribes Ls and Lp in the left and right direction and the vertical direction. FIG. 8C shows the liquid crystal device 1 after division.

  In the breaking process using the scribes Ls and Lp in the vicinity of the outermost periphery of the liquid crystal device substrate 77, the counter substrate 75 disposed on the outermost periphery on the inner peripheral side of the liquid crystal device substrate 77 is a TFT mother substrate at a position below the break bar 79. 74 and the holding plate 72, and on the outer peripheral side, a break receiving jig 73 is interposed between the TFT mother substrate 74 and the holding plate 72. Further, the end surface on the scribe line side of the outermost counter substrate 75 is parallel to the scribe line. Similarly, the break receiving jig 73 near the counter substrate 75 also has the end surface 87 parallel to the scribe line. is there. Further, the position below the break bar 79, the distance to the end surface of the counter substrate 75 disposed on the outermost periphery, and the distance to the end surface of the break receiving jig 73 near this position are substantially equal. Accordingly, for the outermost scribe Ls of the liquid crystal device substrate 77, the TFT mother substrate 74 is supported from both sides by the counter substrate 75 and the break receiving jig 73 at an appropriate distance on both sides of the line. The printing pressure of 79 is easily concentrated on the scribe line 78, and the scribe line is easily cut.

  As described above, in the present embodiment, even when the large TFT mother substrate 74 and the large dust-proof glass 76 are bonded to each other and then divided, the break receiver that supports the peripheral portion of the TFT mother substrate 74 is used. Since the jig 73 is used, even the break along the outermost scribe line can be reliably cut along the scribe line, and the processing accuracy of the end face of the element substrate can be improved. .

(Electronics)
Next, an overall configuration of an embodiment of a projection color display device as an example of an electronic apparatus using a liquid crystal device, which is an electro-optical device configured using the electro-optical device manufacturing apparatus described in detail above, as a light valve. In particular, an optical configuration will be described. FIG. 11 is an explanatory diagram of a projection type color display device.

  In FIG. 11, a liquid crystal projector 1100 as an example of a projection type color display device according to the present embodiment prepares three liquid crystal modules including a liquid crystal device in which a drive circuit is mounted on a TFT array substrate, each of which is a light valve for RGB. It is configured as a projector used as 100R, 100G, and 100B. In the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, the light components R, G, and R corresponding to the three primary colors of RGB are obtained by three mirrors 1106 and two dichroic mirrors 1108. The light is divided into B and led to the light valves 100R, 100G and 100B corresponding to the respective colors. In particular, the B light is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are synthesized again by the dichroic prism 1112 and then projected as a color image on the screen 1120 via the projection lens 1114.

  The electro-optical device of the present invention is not limited to a passive matrix type liquid crystal display panel but an active matrix type liquid crystal panel (for example, a liquid crystal display panel including a TFT (thin film transistor) or a TFD (thin film diode) as a switching element). It is possible to apply to the same. In addition to liquid crystal display panels, electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron emission (such as Field Emission Display and Surface-Conduction Electron-Emitter Display), DLP ( The present invention can be similarly applied to various electro-optical devices such as Digital Light Processing (aka DMD: Digital Micromirror Device).

1 is a front view showing an electro-optical device manufacturing apparatus according to an embodiment. The top view which looked at element substrates, such as a TFT substrate which comprises the liquid crystal device as an electro-optical device, from the counter substrate side with each component formed on it. FIG. 4 is a cross-sectional view of the liquid crystal device after the assembly process in which the element substrate and the counter substrate are bonded to each other and the liquid crystal is sealed is cut along the line HH ′ in FIG. 3. The top view which shows the planar shape of the break receiving jig in FIG. Explanatory drawing which shows the other example of a break bar. The flowchart for demonstrating an assembly process. Explanatory drawing for demonstrating the bonding in a large board state. Process drawing which shows a bonding process and a cutting process. The flowchart for demonstrating the bonding and parting process in FIG. Explanatory drawing for demonstrating a break method. Explanatory drawing of a projection type color display apparatus.

Explanation of symbols

    72 ... Holding plate, 73 ... Break receiving jig, 74 ... TFT mother substrate, 75 ... Counter substrate, 76 ... Dust-proof glass, 77 ... Liquid crystal device substrate, 78 ... Scribe, 79 ... Break bar.

Claims (9)

A first mother substrate that can be divided into a first substrate on which pixels that constitute a display area of the electro-optical device are formed, and a plurality of the first mother substrates that are arranged to face each other on the first substrate. An electro-optical device substrate comprising: the second substrate; and a third mother substrate attached to a surface of the first mother substrate opposite to the second substrate arrangement surface; A holding plate in contact with the second substrate surface;
The peripheral edge of the first mother substrate outside the region where the second substrate is disposed on the first mother substrate is interposed between the first mother substrate and the holding plate. A receiving jig for supporting a peripheral portion of one mother substrate;
An electro-optical device manufacturing apparatus, comprising: means for dividing the first mother substrate.   The electro-optical device manufacturing apparatus according to claim 1, wherein the receiving jig is a flat member having an opening corresponding to a region where the second substrate is disposed.   3. The electro-optical device manufacturing apparatus according to claim 2, wherein the opening of the receiving jig has a shape along a region where the second substrate is disposed.   The electro-optical device manufacturing apparatus according to claim 1, wherein the holding plate has a structure that bends about a pressed portion.   The electro-optical device manufacturing apparatus according to claim 1, wherein the means for dividing the first mother substrate is a break bar having a square or curved tip.   The electro-optical device manufacturing apparatus according to claim 1, further comprising means for forming a scribe for dividing the first mother substrate on the first mother substrate. A plurality of second substrates are arranged to face each of the first substrates on a first mother substrate that can be divided into a plurality of first substrates each having a pixel that forms a display area of the electro-optical device. And pasting together,
Attaching a third mother substrate to a surface of the first mother substrate opposite to the second substrate arrangement surface to form an electro-optical device substrate;
At the periphery of the first mother substrate outside the region where the second substrate is disposed on the first mother substrate, a receiving jig for supporting the periphery of the first mother substrate is interposed. Placing the electro-optic device substrate on the holding plate so that the second substrate is in contact with the holding plate;
A method for manufacturing an electro-optical device, comprising: a step of cutting at least the first mother substrate by applying a printing pressure from the surface of the third mother substrate.   A scribe is formed in advance on the first and third mother substrates, and a break bar is brought into contact with the portion corresponding to the scribe in the third mother substrate, whereby the first and third mother substrates are formed. The method of manufacturing an electro-optical device according to claim 7, wherein the substrate is divided.   The scribe is provided on a bonding surface of the third mother substrate to the first mother substrate, and the break bar is brought into contact with a surface opposite to the bonding surface. Item 9. A method for manufacturing the electro-optical device according to Item 8.

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