JP5017832B2 - Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device suitable for a large plate assembling method adopting a dropping sealing method, a method for manufacturing the electro-optical device, and an electronic apparatus.

  In general, an electro-optical device, for example, a liquid crystal device that performs predetermined display using liquid crystal as an electro-optical material has a configuration in which liquid crystal is sandwiched between a pair of substrates. In an active matrix liquid crystal device, one of a pair of substrates has a pixel electrode corresponding to each intersection of a large number of scanning lines (gate lines) and data lines (source lines) arranged vertically and horizontally. And an active matrix substrate on which switching elements are arranged, and the other is a counter substrate on which a common electrode is formed.

  A switching element such as a TFT element is turned on by an on signal supplied to the gate line, and an image signal supplied via the source line is written to the pixel electrode (transparent electrode (ITO)). As a result, a voltage based on the image signal is applied to the liquid crystal layer between the pixel electrode and the common electrode to change the arrangement of the liquid crystal molecules. In this way, the transmittance of the pixel is changed, and light passing through the pixel electrode and the liquid crystal layer is changed according to the image signal to perform image display.

  The TFT substrate and the counter substrate disposed opposite to the TFT substrate are manufactured separately. Both substrates are bonded together with high accuracy in the panel assembling process, and then liquid crystal is sealed therein. In the panel assembly process, first, an alignment film is formed on the opposing surfaces of the TFT substrate and the counter substrate manufactured in each substrate process, that is, on the surface in contact with the liquid crystal layer of the counter substrate and the TFT substrate, and then the rubbing process. Is done.

  Next, a seal portion serving as an adhesive is formed on the edge of one substrate. The TFT substrate and the counter substrate are bonded together using a seal portion, and are pressure-cured and cured while being aligned.

  By the way, as a system for encapsulating liquid crystal between the TFT substrate and the counter substrate, a drop encapsulating system may be adopted. In the drop encapsulating method, for example, a seal material serving as an adhesive is formed in a frame shape on the periphery of the TFT substrate, and then a prescribed amount is placed in a region on the substrate inside the seal material (hereinafter referred to as a liquid crystal filling region). Drop the liquid crystal.

Next, under vacuum, the counter substrate is disposed opposite to the TFT substrate, and is bonded through a sealing material. Then, the TFT substrate and the counter substrate are cured by pressure and released to the atmosphere. Such a dropping enclosure method is disclosed in Patent Document 1.
JP 2005-91493 A

  By the way, as a manufacturing method of such a liquid crystal device, an array manufacturing method with excellent productivity may be adopted. In the array manufacturing method, a plurality of TFT substrates (active matrix substrates) are cut out from one mother glass substrate (element mother substrate). Furthermore, in order to obtain high productivity, as a bonding method, there is a method in which an element mother substrate on which a large number of element substrates are formed and an opposing mother substrate on which a large number of counter substrates are formed are bonded to each other. In this case, the productivity can be further improved by adopting the dropping enclosure method.

  A single liquid crystal substrate can be obtained by dividing the mother substrate after completion of the assembly process. In this case, in order to simplify the dividing step, it is desirable to cut the bonded element substrate and counter substrate to the same size. For example, the other three sides excluding one side where the terminal portion of the element substrate is formed are often formed to have the same dimensions as the corresponding three sides of the counter substrate.

  However, since the dimensions of the element substrate and the counter substrate are the same on the three sides, it is difficult to distinguish between the element substrate and the counter substrate during the manufacturing process after the assembly process, and the orientation is also difficult to understand. There was a problem of getting worse.

  In recent years, downsizing of the substrate has been promoted, and even on one side where the terminal portion is formed, the dimensional difference between the element substrate and the counter substrate is slight, and it is more difficult to determine the orientation and type of the substrate. It has become.

  An object of the present invention is to provide an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus that can easily determine the orientation and type of the upper, lower, left, and right sides of the panel.

The electro-optical device according to the present invention is provided between the first substrate and the second substrate by a dropping encapsulation method in which an electro-optical material is dropped inside a frame-shaped sealing material formed on the first substrate. The electro-optical device is configured by interposing the electro-optical material on the inside of the sealing material on at least one of the first and second substrates so as to surround a pixel region. A light-shielding film and an identification display made of the same material as the light-shielding film at a position overlapping with the sealing material, and the identification display has an asymmetric shape for identifying the top, bottom, left, right and front and back of the electro-optical device. It is characterized by having .
The one substrate has a first side along the terminal portion, a second side facing the first side, and a third side intersecting the first side and the second side, and the identification The display is provided at a corner of the one substrate where the second side and the third side of the one substrate intersect.

  According to such a configuration, the identification unit is formed at a predetermined position of at least one of the first and second substrates. If the position of the identification means is specified, the top, bottom, left, right, and back of the first and second substrates can be determined from the positions of the identification means with respect to the first and second substrates at the time of observation. Thereby, the workability | operativity in the process after an assembly process can be improved.

  The identification display may be provided at one of the four corners of the first and second substrates.

  According to such a configuration, since the identification display is formed at specific corners of the first and second substrates, the top, bottom, left, right, and back of the first and second substrates can be easily seen by visually recognizing the identification display. Can be grasped.

  The identification display is formed of the same material as the light shielding film formed on the first or second substrate.

  According to such a configuration, the identification display can be formed simultaneously with the light shielding film, and the manufacturing process does not increase.

In addition, the electro-optical device according to the reference invention of the present application uses the dropping and sealing method in which the electro-optical material is dropped into the electro-optical material filling region partitioned by the frame-shaped sealing material formed on the first substrate. An electro-optical device configured by interposing a liquid crystal between a first substrate and a second substrate, comprising: identification means provided on at least one of the first and second substrates, The discriminating means is a discriminating portion having a predetermined shape obtained by deforming the outer shape of at least one of the first and second substrates.

  According to such a configuration, the top, bottom, left, and right sides of the first and second substrates can be determined by observing the outer shape.

  According to such a configuration, even when the identification unit is visually recognized from any one of the front and back surfaces of the first and second substrates, the first and second substrates can be easily formed depending on how the identification unit is seen. You can grasp the top, bottom, left, and right sides.

A method for manufacturing an electro-optical device according to the present invention is a method for manufacturing an electro-optical device in which a first substrate and a second substrate are bonded to each other. The light-shielding surrounds a pixel region on the first substrate. Forming a film and an identification display from the same material ; forming a frame-shaped sealing material on the outside of the light shielding film so as to overlap the identification display; and dropping an electro-optical material on the inside of the sealing material When the first substrate and the second substrate; and a step of bonding by interposing the electro-optical material, in the step of forming the light shielding film and identification, the identification is the electro-optical characterized in that it is patterned vertically and horizontally and the front and back of the device to asymmetric shape so that it can be identified.
A method of manufacturing an electro-optical device in which a first substrate separated from a first mother substrate and a second substrate separated from a second mother substrate are bonded to each other. Forming a light-shielding film and an identification display surrounding the pixel region in the region to be the first substrate from the same material , and overlapping the identification display on the outside of the light-shielding film in the region to be the first substrate A step of forming a frame-shaped sealing material, a step of dropping an electro-optical material inside the sealing material, and a step of bonding the first mother substrate and the second mother substrate together with the electro-optical material interposed And the step of separating the first and second substrates from the first and second mother substrates, and in the step of forming the light shielding film and the identification display , the identification display is provided above and below the electro-optical device. Left and right and It characterized in that it is patterned in an asymmetrical shape so as to identify the back.

  According to such a configuration, an identification display is formed on the first substrate. A frame-shaped sealing material is formed on the first substrate or the second substrate, and the electro-optical material is dropped onto the electro-optical material filling region partitioned by the sealing material. The first substrate and the second substrate are bonded together with the electro-optical material interposed. An identification display is formed on the first substrate, and the identification display can easily recognize the top, bottom, left, and right and back of the first and second substrates after the assembly process.

  An electronic apparatus according to the present invention includes the electro-optical device.

  According to such a configuration, workability is improved when the electro-optical device is manufactured, and a device that is free from errors in manufacturing is easily obtained.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing an electro-optical device according to a first embodiment of the invention. The present embodiment is applied to a liquid crystal device as an electro-optical device. FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG. 1 and shows the liquid crystal device after the assembly process in which the element substrate and the counter substrate are bonded together to enclose the liquid crystal. FIG. 3 is a perspective view for explaining the identification mark, and FIG. 4 is a flowchart for explaining the method of forming the identification mark.

  As shown in FIGS. 1 and 2, the liquid crystal device 1 includes, for example, a quartz substrate, a glass substrate, an element substrate 10 using a silicon substrate, and an opposing substrate, for example, a glass substrate or a quartz substrate. A liquid crystal 50 is sealed between the substrate 20 and the substrate 20. The element substrate 10 and the counter substrate 20 that are arranged to face each other are bonded to each other by a sealing material 52.

  As shown in FIGS. 1 and 2, the planar shapes of the element substrate 10 and the counter substrate 20 are rectangular shapes having substantially the same size. A terminal portion 102 is provided on one side of the element substrate 10. The counter substrate 20 is configured to have a size smaller than that of the element substrate 10 only at a portion corresponding to the terminal portion 102 so that a portion where the terminal portion 102 is formed is exposed. That is, the element substrate 10 and the counter substrate 20 are formed to have the same dimensions on the three sides except the side where the terminal portion 102 is formed, and the side surfaces are formed flush with each other on the three sides.

  The sealing material 52 is formed on the edge portion of the counter substrate 20. A pixel region 10 a is provided at the center of the liquid crystal device 1.

  On the element substrate 10, pixel electrodes (ITO) 9a constituting pixels are arranged in a matrix. A counter electrode (ITO) 21 is provided on the entire surface of the counter substrate 20. On the pixel electrode 9 a of the element substrate 10, an alignment film 16 subjected to a rubbing process is provided in contact with the liquid crystal 50. On the other hand, on the counter substrate 20 side, an alignment film 22 that is rubbed is provided over the entire surface in contact with the liquid crystal 50. The alignment films 16 and 22 are made of a transparent organic film such as a polyimide film, for example.

  On the element substrate 10, in the pixel region 10a, a plurality of scanning lines and data lines (not shown) are wired so as to cross each other, and the pixel electrodes 9a are arranged in a matrix in the region partitioned by the scanning lines and the data lines. Be placed. A switching element (not shown) is provided corresponding to each intersection of the scanning line and the data line, and the pixel electrode 9a is connected to the switching element.

  By supplying the ON signal to the scanning line, the switching element is turned on, whereby the image signal supplied to the data line is supplied to the pixel electrode 9a via the switching element. A voltage between the pixel electrode 9 a and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50. In this way, the liquid crystal 50 is driven according to the image signal, and the light transmittance is changed for each pixel, so that image display is performed.

  As shown in FIGS. 1 and 2, the counter substrate 20 is provided with a light shielding film 53 as a frame for partitioning the pixel region 10a. On the counter substrate 20, a light shielding film 54 is formed in the pixel region 10 a so as to correspond to the data lines and scanning lines on the element substrate 10 side.

  In the present embodiment, an identification mark 55 serving as an identification display is provided in a region other than the pixel region 10a of the counter substrate 20, excluding the center in the horizontal direction or the center in the vertical direction of the counter substrate 20. ing. In the example of FIG. 1, the identification mark 55 is provided at one corner of the counter substrate 20. In the example of FIG. 1, the identification mark 55 has a quadrangular shape, but may be formed in any shape, for example, a character.

  In the present embodiment, the identification mark 55 is formed in the same layer as the light shielding films 53 and 54 by using the same material as the light shielding films 53 and 54.

  The element substrate 10 is provided with a driver (not shown) for driving the scanning lines and the data lines in the region other than the pixel region 10a, and a signal is supplied to the driver via the terminal portion 102. ing. The element substrate 10 and the counter substrate 20 are electrically connected by a vertical conductive material (not shown).

  Next, a manufacturing method of the counter substrate will be described with reference to FIGS.

  First, in step S11 of FIG. 4, a glass substrate or the like is prepared. Next, a light shielding film material is formed on the glass substrate (step S22). The light shielding film material can be obtained, for example, by sputtering metal chromium. Next, the formed light shielding film material is patterned in a photolithography and etching process.

  In the present embodiment, at the time of patterning, the light shielding films 53 and 54 are formed, and the identification mark 55 is also formed (step S23). The light shielding films 53 and 54 and the identification mark 55 do not need to have conductivity, and are made of a metal material such as Cr, Ni, or AL, or a material such as resin black in which carbon or Ti is dispersed in a photoresist. It may be formed.

  Next, in step S24, the counter electrode 21 is formed by depositing a transparent conductive film of ITO or the like to a thickness of about 50 to 200 nm on the entire surface of the counter substrate 20 by sputtering or the like. Further, after applying a polyimide alignment film coating solution over the entire surface of the counter electrode 21, the alignment film 22 is formed by performing a rubbing process in a predetermined direction so as to have a predetermined pretilt angle (step) S25).

  The counter substrate 20 manufactured in this way is bonded to the element substrate 10 by the sealing material 52 in the assembly process. FIG. 3 shows the substrates 10 and 20 before bonding. As shown in FIG. 3, a light shielding film 53 and an identification mark 55 are formed on the surface (bonding surface) of the counter substrate 20 on the element substrate 10 side. The counter substrate 20 is a transparent substrate, and by observing the substrate 20 from the direction of arrow A in FIG. 3, it is possible to visually recognize the identification mark 55 formed on the bonding surface side from the surface side of the counter substrate 20. . Further, the identification mark 55 is formed in a region outside the light shielding film 53 that partitions the pixel region 10a, and does not hinder display.

  The identification mark 55 is formed at one of the four corners of the counter substrate 20, and by confirming the position of the identification mark 55, the orientation of the assembled liquid crystal device 1 can be determined. For example, for the liquid crystal device 1 after assembly, the liquid crystal device 1 is disposed so that the surface on which the identification mark 55 can be viewed is directed toward the viewer and the identification mark 55 is positioned at the upper left corner of the substrate. Thus, it can be recognized that the liquid crystal device 1 is arranged in the same state as in FIG.

  Therefore, even if the element substrate 10 and the counter substrate 20 have substantially the same dimensions as in the present embodiment and it is difficult to identify which substrate is the element substrate or the counter substrate, the identification mark 55 By confirming the position, it is possible to recognize which substrate is an element substrate or a counter substrate, and also reliably recognize the vertical and horizontal directions of the apparatus.

  By the way, in the liquid crystal device, when the liquid crystal is sealed by the liquid crystal injection method, an injection port is provided in the sealing material, and the orientation of the device can be determined using this injection port. However, when the liquid crystal is sealed by the dropping sealing method, since the sealing material is not provided with an injection port, the usefulness of such an identification mark is high.

  FIG. 5 is a perspective view for explaining an assembling process in the case of adopting a dropping sealing method, and FIG. 6 is a flowchart of the assembling process. Note that the liquid crystal device of FIGS. 1 to 3 can be manufactured by the dropping sealing method of FIGS.

  FIG. 5 shows the element mother substrate 74 and the counter mother substrate 75 manufactured by the array manufacturing method. In the array manufacturing method, the elements forming the plurality of liquid crystal substrates are simultaneously formed on the mother substrate by repeating the film forming and photolithography processes without dividing the mother substrate that is input at the time of manufacturing. Then, each liquid crystal substrate is obtained by dividing the mother substrate.

  In FIG. 5, as a bonding method, a method of bonding a mother substrate on which a large number of element substrates are formed and a mother substrate on which a large number of counter substrates are formed (hereinafter referred to as a large plate assembly method) is adopted.

  In the present embodiment, for the counter mother substrate 75, an identification mark 78 is formed at a position corresponding to, for example, a corner portion of each counter substrate 77. For example, the identification mark 78 may be the same as the identification mark 55 (see FIG. 1) formed in the same process as step S23 in FIG. That is, in this case, the identification mark 78 is formed of a light shielding material.

  In step S1 of FIG. 6, an element mother substrate 74 in which elements are formed in an array is loaded. On the other hand, in step S6, the counter mother substrate 75 on which a plurality of counter substrates are formed is loaded. On the element mother substrate 74, a plurality of element substrates similar to the element substrate 10 shown in FIGS. 2 and 3 are formed in an element substrate process which is a pre-process of the assembly process.

  An alignment film is formed on the entire surface of the element mother substrate 74 and the counter mother substrate 75 (steps S2 and S7), and a rubbing process is performed (steps S3 and S8). The cleaning processes in steps S4 and S9 are for removing dust generated by rubbing the element substrate.

  In step S5, a sealing material is formed on the element mother substrate 74 for each element substrate region. In the dropping enclosure method, the sealing material is formed continuously and in a frame shape. A region surrounded by each sealing material is a liquid crystal filling region.

  In the next step S10, the liquid crystal is dropped onto the liquid crystal filling region. Next, the element mother substrate 74 and the counter mother substrate 75 are bonded together in a vacuum atmosphere such as a vacuum chamber. The element mother substrate 74 and the counter mother substrate 75 are bonded together while performing alignment (steps S11 and S12). In this case, the element mother substrate 74 and the counter mother substrate 75 are pressed against each other and bonded together. The amount of pressurization is set so as to maintain the gap length at a predetermined value.

  Next, the vacuum chamber is opened to the atmosphere, and atmospheric pressure is applied to the bonded substrates 74 and 75. Then, the sealing material is cured. Finally, in step S13, the panel is divided to obtain each liquid crystal device.

  As shown in FIG. 5, scribe lines Ls for dividing each element are formed on the substrates 74 and 75. A break bar (not shown) is arranged along the scribe line Ls, and printing pressure is applied from the substrate surface. Then, due to the static pressure or impact by the break bar, both the element mother substrate 74 and the counter mother substrate 75 are cracked starting from the scribe line Ls formed below the break bar, and the element mother substrate along the scribe line Ls. 74 and the opposing mother substrate 75 are both divided.

  Since the counter substrate is slightly smaller than the element substrate, in the example of FIG. 5, one side of the counter substrate is further scribed from the divided liquid crystal device using a scribe line Ls provided on the counter substrate side.

  As described above, the liquid crystal device assembled by the dropping sealing method is not provided with a sealing port. However, by visually recognizing the identification mark 78, it is possible to recognize the top, bottom, left and right sides of the apparatus.

  As described above, in the present embodiment, even in a liquid crystal device manufactured by the dropping and encapsulating method, the position of the enemy mark provided at a predetermined position on the substrate can be easily confirmed, and the device can be easily moved up, down, left and right. And you can grasp the front and back. Thereby, the workability | operativity in the manufacturing process after an assembly process can be improved significantly.

  In the above embodiment, the example in which the identification mark is formed in the same layer as the light shielding film and made of the same material as the light shielding film has been described. However, the identification mark only needs to be visible from the front surface (or back surface) side of the substrate, and it is not always necessary to use a light shielding material, and it does not have to be formed in the same process as the light shielding film. For example, a single process for forming the identification mark may be added, or the process may be performed in the same process as the process using a material having visibility other than the light shielding material.

  Moreover, in the said embodiment, although the example which forms an identification mark in a counter substrate was shown, you may form in an element substrate side. For example, a wiring layer made of an aluminum material or the like is formed on the element substrate side, and the identification mark may be patterned in the same process as this wiring layer. Even in this case, the same effect can be obtained by providing the identification mark in a region other than the pixel region at a position other than the center in the vertical or horizontal direction. Obviously, the identification mark may be formed on both the counter substrate and the element substrate.

  Furthermore, by using a mark having a different shape or pattern for each type of liquid crystal device as an identification mark, the type of liquid crystal device can be recognized.

  By the way, in the first embodiment, the identification mark 55 and the sealing material 52 are formed in a region overlapping in plan view. Further, the element substrate 10 is also provided with wiring (not shown) at the edge portion, and the visibility of the identification mark 55 from the element substrate 10 side is poor, and whether or not the identification mark 55 can be easily visually recognized. Thus, it is possible to grasp whether the observation is performed from the element substrate 10 side or the counter substrate 20 side.

  On the other hand, depending on the configuration of the element substrate, the identification mark formed on the counter substrate side may be easily visible from the element substrate side. In this case, it is necessary to select an identification mark that can recognize whether the identification mark is observed from the element substrate side or the counter substrate side.

  FIG. 7 relates to the second embodiment, and is a plan view showing an electro-optical device that can recognize the upper, lower, left, and right front and back of the device even when the identification mark can be visually recognized from any direction. is there. In FIG. 7, the same components as those in FIG.

  This embodiment is different from the first embodiment in that an identification mark 65 is used instead of the identification mark 55. The identification mark 65 is different from the identification mark 55 only in the planar shape. The identification mark 65 has an asymmetric shape on the left and right and top and bottom. In the example of FIG. 7, the letter “F” is used as such an identification mark 65.

  In the embodiment configured as described above, the top, bottom, left, and right sides of the apparatus can be grasped based on the appearance of the identification mark 65. For example, in the example of FIG. 7, when the identification mark 65 is visually recognized as a letter “F” in a normal direction, the identification mark 65 is observed from the counter substrate 20 side and the terminal portion 102 is directed downward. Can be recognized.

  In addition, by defining not only the shape of the identification mark but also the arrangement position of the identification mark, it is possible to grasp the top, bottom, left, and right sides of the apparatus even in a laterally asymmetrical or vertical asymmetrical shape. For example, even when the character “C” is used instead of “F” in FIG. 7, depending on whether or not the character “C” can be observed on the upper left of the device, the upper, lower, left, and right sides of the device Can be recognized.

  Each of the above embodiments can also be applied to a counter substrate employing a microlens. FIG. 8 shows an example of this case and corresponds to FIG. In FIG. 8, the counter substrate 20 ′ is configured by disposing a resin layer 68 on a lens-shaped portion of a glass substrate 67 having a lens shape and providing a cover glass 69. Also in this case, the identification mark 70 is arranged in the vicinity of one edge of the counter substrate 20 '.

  FIG. 9 is a perspective view showing a third embodiment of the present invention.

  The element substrate 81 and the counter substrate 82 are bonded together with a liquid crystal (not shown) interposed therebetween. The configurations of the element substrate 81 and the counter substrate 82 are the same as those of the element substrate 10 and the counter substrate 20 in the first embodiment except for the identification mark.

  In the present embodiment, an identification portion 83 is formed in place of the identification mark of the first embodiment. The identification unit 83 is formed by obliquely cutting one of the four corners of the substrates 81 and 82. In addition, the identification part 83 is provided in parts other than a pixel area similarly to 1st Embodiment. Moreover, the identification part 83 should just be provided in the site | part except the center of the left-right direction or the center of an up-down direction of the display surface (observation surface) of the board | substrate 81,82.

  According to such a configuration, if the position of the identification unit 83 is defined, the top, bottom, left, and right sides of the apparatus can be recognized depending on the position of the identification unit 83 at the time of observation.

  By the way, in the embodiment of FIG. 9, the case where the planar shape of the substrates 81 and 82 is rectangular is shown. If the planar shape of the substrate is a square, it may not be possible to determine the top / bottom / left / right and front / back only by the identification unit 83 of FIG. 9.

  FIG. 10 is a perspective view showing a modification in consideration of this case. 10, the configurations of the element substrate 85 and the counter substrate 86 are the same as those of the element substrate 81 and the counter substrate 82 of FIG.

  In the example of FIG. 10, the element substrate 85 and the counter substrate 86 have different end shapes. That is, the identification part 87 provided at the end is formed by obliquely cutting one of the four corners of one of the substrates 85 and 86. In the example of FIG. 10, an example in which one corner portion of the element substrate 85 is cut out is shown, or it is obvious that the counter substrate 86 side may be cut out.

  According to such a configuration, if the position of the notch constituting the identification unit 87 is defined, the top, bottom, left, right, and back of the device is determined depending on which position of the notch that constitutes the identification unit 87 during observation. Can be recognized.

  In the embodiment of FIGS. 9 and 10, it is obvious that the shape of the notch is not limited.

(Electronics)
Next, an overall configuration, particularly an optical configuration, of an embodiment of a projection color display device as an example of an electronic apparatus using the electro-optical device described in detail as a light valve will be described. FIG. 11 is an explanatory diagram of a projection type color display device.

  In FIG. 11, a liquid crystal projector 1100, which is an example of a projection type color display device according to the present embodiment, prepares three liquid crystal modules including a liquid crystal device having a drive circuit mounted on a TFT array substrate, and each has a light bulb 100R for RGB. , 100G and 100B. In the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, the light components R, G, and R corresponding to the three primary colors of RGB are obtained by three mirrors 1106 and two dichroic mirrors 1108. The light is divided into B and led to the light valves 100R, 100G and 100B corresponding to the respective colors. In particular, the B light is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are synthesized again by the dichroic prism 1112 and then projected as a color image on the screen 1120 via the projection lens 1114.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. In addition, the manufacturing method thereof and the electronic device are also included in the technical scope of the present invention. The electro-optical device can be applied to an electrophoresis device, an EL (electroluminescence) device, and the like.

  The electro-optical device of the present invention is not limited to a passive matrix type liquid crystal display panel but an active matrix type liquid crystal panel (for example, a liquid crystal display panel including a TFT (thin film transistor) or a TFD (thin film diode) as a switching element). It is possible to apply to the same. In addition to liquid crystal display panels, electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron emission (such as Field Emission Display and Surface-Conduction Electron-Emitter Display), DLP ( The present invention can be similarly applied to various electro-optical devices such as Digital Light Processing (aka DMD: Digital Micromirror Device).

  The present invention is also applicable to display devices that form elements on a semiconductor substrate, such as LCOS (Liquid Crystal On Silicon).

  In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed under the pixel electrode.

1 is a plan view showing an electro-optical device according to a first embodiment of the invention. Sectional drawing cut | disconnected and shown in the position of the HH 'line | wire of FIG. The perspective view for demonstrating an identification mark. The flowchart for demonstrating the formation method of an identification mark. The perspective view for demonstrating the assembly process in the case of employ | adopting a dripping enclosure system. The flowchart of an assembly process. FIG. 6 is a plan view showing an electro-optical device according to a second embodiment. Sectional drawing which shows the modification of 2nd Embodiment. The perspective view which shows the 3rd Embodiment of this invention. The perspective view which shows the modification of 2nd Embodiment. Explanatory drawing of a projection type color display apparatus.

Explanation of symbols

    DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 10 ... Element board | substrate, 10a ... Pixel area | region, 20 ... Opposite substrate, 52 ... Sealing material, 53 ... Light-shielding film, 55 ... Identification mark.

Claims (5)

The electro-optical material is interposed between the first substrate and the second substrate by a dropping and enclosing method in which the electro-optical material is dropped inside a frame-shaped sealing material formed on the first substrate. An electro-optical device comprising:
A light shielding film provided inside the sealing material on at least one of the first and second substrates so as to surround a pixel region;
In a position overlapping with the sealing material, comprising an identification display made of the same material as the light shielding film,
The electro-optical device is characterized in that the identification display has an asymmetric shape for identifying the top, bottom, left, right, and front and back of the electro-optical device. The one substrate has a first side along the terminal portion, a second side facing the first side, and a third side intersecting the first side and the second side,
The electro-optical device according to claim 1, wherein the identification display is provided at a corner of the one substrate where the second side and the third side of the one substrate intersect . A method for manufacturing an electro-optical device in which a first substrate and a second substrate are bonded to each other,
Forming a light-shielding film surrounding the pixel region and an identification display on the first substrate from the same material ;
Forming a frame-shaped sealing material on the outside of the light-shielding film so as to overlap the identification display ;
Dropping electro-optic material inside the sealing material;
Bonding the first substrate and the second substrate with the electro-optic material interposed therebetween,
In the light shielding film and forming the identification, the identification is a method of manufacturing an electro-optical apparatus characterized by being patterned into asymmetric shape so that it can identify the vertical and horizontal and the front and back of the electro-optical device. A method for manufacturing an electro-optical device in which a first substrate separated from a first mother substrate and a second substrate separated from a second mother substrate are bonded together,
Forming a light shielding film surrounding the pixel region and an identification display from the same material in a region to be the first substrate of the first mother substrate;
Forming a frame-shaped sealing material on the outside of the light-shielding film so as to overlap the identification display in the region to be the first substrate;
Dropping electro-optic material inside the sealing material;
Bonding the first mother substrate and the second mother substrate with the electro-optic material interposed therebetween;
Separating the first and second substrates from the first and second mother substrates,
In the light shielding film and forming the identification, the identification is a method of manufacturing an electro-optical apparatus characterized by being patterned into asymmetric shape so that it can identify the vertical and horizontal and the front and back of the electro-optical device. An electronic apparatus comprising the electro-optical device according to claim 1 .

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