JP2000338506A - Liquid crystal display device and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent bright spot defects due to leaking of light caused by chips or defects in a color filter layer and to secure enough adhesion strength between a sealing member and a color filter substrate. SOLUTION: The light-shielding film of a color filter substrate 2A is constituted of a resin light-shielding film 8 surrounding each color filter layer 7 and a frame-like metal light-shielding film 9 arranged on the periphery of the resin light-shielding film 8 and in contact with the outer edge of the film 8, and then a sealing member 12 for joining the substrates is formed on the metal light-shielding film 9. Since the resin light-shielding film 8 is formed by the exposure on the back face using the metal light-shielding film 9 and the color filter layer 7 as a mask, even when chips or defects are produced due to a defective pattern of the color filter layer 7, these defects are filled with the resin light-shielding film 8 and bright spot defects due to leaking of light can be prevented. Moreover, since the metal light-shielding film 9 has high adhesion strength with the sealing member 12, a sufficient lamination strength of the substrates can be obtd., and the obtd. liquid crystal display device has high display quality and high reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device which prevents a bright spot defect caused by light leakage due to chipping or loss of a color filter layer of a color filter substrate.
Also, the present invention relates to a liquid crystal display device with high display quality and high reliability, which can secure sufficient substrate bonding strength, and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 6 is a sectional view showing an example of a conventional liquid crystal display device. In the figure, reference numeral 100B denotes a conventional liquid crystal display device, which includes an array substrate 1B and a color filter substrate 2B.
B. The components of the array substrate 1B are as follows. Reference numeral 1 denotes a transparent insulating substrate such as a glass substrate, on which a plurality of thin film transistors 3 serving as switching elements and a plurality of pixel electrodes 4 connected thereto are formed. Reference numeral 5 denotes a protective film made of silicon nitride or a transparent insulating resin, and reference numeral 6 denotes an alignment film made of polyimide. Next, the color filter substrate 2B
Will be described. Reference numeral 2 denotes a transparent insulating substrate such as a glass substrate, and 7 denotes a colored filter layer arranged so as to correspond to the pixel electrode 4 of the array substrate 1A.
Green and blue coloring filter layers 7R, 7G, 7B are periodically arranged at regular intervals. 9 is a metal light-shielding film made of a metal such as Cr, 10 is a transparent electrode made of a transparent conductive film such as ITO, and 11 is an alignment film made of polyimide.
Reference numeral 12 denotes an array substrate 1B and a color filter substrate 2.
A seal member provided at an outer edge portion between B and made of an epoxy resin for bonding both substrates, and is formed by printing on a predetermined non-display area of at least one transparent insulating substrate. Reference numeral 13 denotes a liquid crystal layer arranged in a space formed by the array substrate 1B, the color filter substrate 2B, and the seal member 12. In the conventional liquid crystal display device shown in FIG.
Sufficient bonding strength is ensured by being bonded to the respective substrates via the metal light-shielding film 9 formed in a frame shape on the upper outer peripheral portion and the protective film 5 formed on the opposing array substrate 1B. It had been.

[0003]

However, in the conventional liquid crystal display device configured as described above, for example, as shown in FIG. 7, when a chip or a defect occurs in the color filter layer 7 of the color filter substrate 2B. However, such a portion becomes a bright spot defect due to light leakage, which has been a major factor in lowering the display quality and lowering the yield. In FIG. 7, reference numeral 15 denotes a chip generated on the green colored filter layer 7G. As a method for solving such a problem, for example, Japanese Unexamined Patent Publication No.
Japanese Patent No. -293306 discloses that a color filter substrate has red,
A method has been proposed in which a green resist and a blue resist layer are sequentially formed, a black resist is applied, and the back surface is exposed using the colored filter layer in the display area as a mask to form a resin light-shielding film. According to this method, even if there is a chip or a defect in the colored filter layer, the portion is filled with the resin light-shielding film made of a black resist, so that a bright spot defect due to light leakage can be avoided in a self-healing manner. In addition, it is possible to prevent the display quality and the yield from lowering. However, in this structure, the sealing member is formed on the resin light-shielding film, and the bonding strength between the seal member made of epoxy resin and the resin light-shielding film is generally small, so that the bonding strength between the color filter substrate and the array substrate is reduced. Had a problem.

A method for solving this problem is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 10-170930. According to this, the seal member is shifted to the outer peripheral side of the liquid crystal display device from the resin light-shielding film, and the resin light-shielding film is present only on the inner peripheral side of the light-shielding seal member. A technique for directly bonding substrates is disclosed. However, with such a structure, the adhesive strength between the color filter substrate and the sealing member is not yet sufficient,
Further, in recent liquid crystal display devices, the size of the TFT-LCD body is becoming smaller than the panel size, and in order to improve the productivity, the number of panels can be efficiently increased with a minimum glass size. Due to the necessity of chamfering and the like, the margin outside the display area of the panel is small, and it tends to be a so-called narrow greenery. Therefore, the sealing member is formed shifted in the outer peripheral direction to secure the bonding strength. The method is not preferred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is intended to prevent a bright spot defect due to light leakage due to chipping or chipping of a color filter layer of a color filter substrate and to provide a sealing member. It is an object of the present invention to provide a liquid crystal display device with high display quality and high reliability, which can ensure a sufficient adhesive strength between the color filter substrate and a color filter substrate, and a method for manufacturing the same.

[0006]

According to the present invention, there is provided a liquid crystal display device comprising: an array substrate in which a plurality of thin film transistors and a plurality of pixel electrodes connected thereto are formed on a transparent insulating substrate; A plurality of colored filter layers corresponding to each pixel electrode on the substrate, a resin light-shielding film surrounding each colored filter layer, and a frame-shaped metal light-shielding film arranged on the outer periphery of the resin light-shielding film so as to be in contact with its outer edge. A color filter substrate formed and arranged to face the array substrate, a seal member provided at an outer edge between the array substrate and the color filter substrate, and bonding both substrates, and an array substrate, a color filter substrate, and a seal member A liquid crystal layer disposed in a space, and at least a part of the seal member is adhered to the color filter substrate via a metal light shielding film. . Further, the seal member is bonded to the color filter substrate via a metal light shielding film on the entire surface of the bonding surface with the color filter substrate.

The color filter substrate has a transparent conductive film that completely covers the color filter layer and the resin light-shielding film. The color filter substrate has a flattening film that covers the color filter layer and the resin light-shielding film.
The color filter substrate has a positioning mark formed of the same material as the metal light shielding film. Furthermore, Cr, Mo, Cr / CrO are used as metal light shielding films.
x, Mo / Mo Ox.

The method of manufacturing a liquid crystal display device according to the present invention comprises a first step of forming a frame-shaped metal light-shielding film made of a metal such as Cr on an outer peripheral portion on the surface of a transparent insulating substrate; A second step of sequentially forming a plurality of colored filter layers on the substrate surface, and after applying a negative photosensitive black resin on the substrate surface, the metal light shielding film, the colored filter layer and the metal light shielding film A third step of forming a resin light-shielding film surrounding each colored filter layer and forming a metal light-shielding film in contact with the outer edge by exposing and developing from the back side of the substrate using the peripheral mask formed on the outer peripheral portion as a mask, and A fourth step of forming a transparent conductive film on the surface so as to completely cover the colored filter layer and the resin light-shielding film; a color filter substrate formed by the first to fourth steps; Formed by The array substrate, in which at least a portion of the sealing member was made to manufacture comprises a fifth step of bonding to adhere the color filter substrate via a metal light-shielding film.

In the first step, a positioning mark is formed at the same time as forming the metal light-shielding film. Further, in the fourth step, a film formed by a sputtering method using a material obtained by using indium oxide, tin oxide, or zinc oxide alone or in combination as the transparent conductive film is formed. The heat treatment is performed at a high temperature.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a liquid crystal display device according to Embodiment 1 of the present invention. In the figure, reference numeral 100A denotes a liquid crystal display device according to the present embodiment, which comprises an array substrate 1A and a color filter substrate 2A. The components of the array substrate 1A are as follows. Reference numeral 1 denotes a transparent insulating substrate such as a glass substrate. On the insulating transparent substrate 1, a plurality of gate wirings (not shown) and a plurality of source wirings (not shown) crossing the gate wirings are arranged in a matrix. A plurality of thin film transistors 3 as switching elements and a plurality of pixel electrodes 4 connected to the thin film transistors 3 are formed near the intersection of the gate wiring and the source wiring. Reference numeral 5 denotes a protective film made of silicon nitride or a transparent insulating resin, and reference numeral 6 denotes an alignment film made of polyimide. Next, the components of the color filter substrate 2A that is arranged to face the array substrate 1A will be described. Reference numeral 2 denotes a transparent insulating substrate such as a glass substrate, and 7 denotes a plurality of colored filter layers arranged so as to correspond to the pixel electrodes 4 of the array substrate 1A, and red, green and blue colored filter layers 7R, 7G, 7B are periodically arranged at regular intervals. Reference numeral 8 denotes each colored filter layer 7R, 7G, 7B
Is a frame-shaped metal light-shielding film made of Cr or the like which is arranged on the outer periphery of the resin light-shielding film 8 so as to be in contact with its outer edge. Reference numeral 10 denotes an IT formed so as to completely cover the resin light-shielding film 8 and the color filter layer 7.
A transparent electrode made of a transparent conductive film such as O;
This is an alignment film made of polyimide and formed on the substrate. Reference numeral 12 denotes an array substrate 1A and a color filter substrate 2A.
A seal member, which is provided at an outer edge between the two and is made of an epoxy resin for bonding the two substrates, is a liquid crystal layer arranged in a space formed by the array substrate 1A, the color filter substrate 2A and the seal member 12. In this embodiment, the sealing member 12 is bonded to the color filter substrate 2A via the metal light-shielding film 9 on the entire surface of the bonding surface with the color filter substrate 2A.

Next, a method of manufacturing the color filter substrate 2A of the liquid crystal display device according to the present embodiment will be described with reference to FIG. First, a transparent insulating substrate 2 made of, for example, glass
100% Cr on the surface 2a of
A film having a thickness of 0 ° is formed, and a frame-shaped metal light-shielding film 9 is formed on the outer peripheral portion of the display region using a photolithography method using a resist (first step: FIG. 2A). continue,
On the substrate surface 2a, a color resist in which a red pigment is dispersed is applied so as to have a thickness of about 1 μm, exposed, developed, and post-baked to form a red colored filter layer 7R having a desired pixel shape. Form. Note that, if necessary, post-exposure may be further performed for the purpose of increasing color purity. Similarly, green and blue colored filter layers 7G and 7B are sequentially formed. Note that the color resist for forming the colored filter layer 7 may be either positive type photosensitive or negative type photosensitive (second step: FIG. 2B). Next, a black resin such as a negative photosensitive resist in which a black pigment such as carbon black is dispersed is applied on the substrate surface 2a, and then a frame-shaped metal light-shielding rubber 9, a colored filter layer 7, and a metal light-shielding film are formed. 9
Further, by using a peripheral mask 14 made of a resist formed on the outer peripheral portion of the substrate as a mask, exposure and development are performed from the rear surface 2b side of the substrate, thereby surrounding each colored filter layer 7 and forming a resin light-shielding film whose outer edge is in contact with the metal light-shielding film 9. The film 8 is formed (third step: FIGS. 2C and 2D).

Next, on the substrate surface 2a, an ITO film having a thickness of about 1500 ° is formed by a sputtering method, and a transparent electrode made of a transparent conductive film is formed so as to completely cover the colored filter layer 7 and the resin light shielding film 8. 10 is formed (fourth step). At this time, after the ITO film is formed, heat treatment is performed at a temperature higher than the substrate temperature at the time of film formation. In the present embodiment, ITO
The substrate temperature during film formation is preferably 180 ° C. to 250 ° C., the heat treatment temperature after film formation is 200 to 270 ° C., and the heat treatment time is 3 hours.
The atmosphere may be any of a vacuum, an inert gas, a nitrogen gas, and the atmosphere for 0 to 60 minutes, but the atmosphere is preferable. This is because when the substrate temperature at the time of film formation is increased, it is affected by outgassing due to thermal decomposition of the organic resin of the colored filter layer 7 or the resin light-shielding film 8, and the transmittance of ITO decreases and the sheet resistance increases. This is because the characteristics such as the above may deteriorate.
Therefore, it is desirable to set the substrate temperature at the time of film formation low and to suppress the generation of pyrolysis gas from the film formation surface. In addition,
Sputtering at a low substrate temperature causes a decrease in ITO transmittance and an increase in sheet resistance. However, by performing a heat treatment at a temperature higher than the substrate temperature at the time of sputtering after film formation, the characteristics of the ITO can be improved. Can be improved. The patterning of the transparent electrode 10 may be performed by photolithography and etching after the ITO film is formed. However, the patterning of the transparent electrode 10 is reduced by using a mask sputtering method in which the film is formed using the edge including the metal light shielding film 9 as a mask. Cost reduction is achieved.

Further, an alignment film 11 made of polyimide is formed on the substrate surface 2a to obtain the color filter substrate 2A in the present embodiment (FIG. 2E). Thereafter, a sealing member 12 made of an epoxy resin is formed in a frame shape on the metal light shielding film 9 of the color filter substrate 2A using a printing method, and the color filter substrate 2A and the array substrate 1A formed by another process are formed. Then, the sealing member 12 is bonded to the color filter substrate 2A via the metal light shielding film 9 (fifth step). Further, liquid crystal is injected from an injection port (not shown) provided at a predetermined position and sealed with a sealing material (not shown), whereby liquid crystal display device 100A in the present embodiment is formed. .

In this embodiment, the color filter substrate 2
The light-shielding film A is composed of a resin light-shielding film 8 surrounding each colored filter layer 7, and a frame-shaped metal light-shielding film 9 arranged on the outer periphery of the resin light-shielding film 8 so as to be in contact with its outer edge. The sealing member 12 is bonded to the color filter substrate 2A via the metal light shielding film 9. Since the resin light-shielding film 8 is formed by back surface exposure using the already formed metal light-shielding film 9 and the colored filter layer 7 as a mask, the colored filter layer 7 is shown in FIGS. 3A and 3B. Even if the chip 15 or loss due to such a pattern defect occurs, the resin light-shielding film 8 buries the chip 15 in a self-healing manner, so that a bright spot defect due to light leakage can be prevented. Furthermore, since the metal light-shielding film 9 has a high adhesive strength to the seal member 12, sufficient bonding strength of the substrate can be ensured, and light leakage from the periphery of the liquid crystal display device 100A can be prevented.

In this embodiment, the transparent electrode 10 made of ITO is formed on the colored filter layer 7 and the resin light-shielding film 8 so as to completely cover them, and the transparent electrode 10 does not overlap with the sealing member 12. I did it. This allows
Since the transparent electrode 10 is not interposed between the sealing member 12 and the metal light shielding film 9, the color filter substrate 2A and the sealing member 1
The adhesive strength of No. 2 is sufficiently large. However, the outer edge of the transparent electrode 10 may be formed so as to be located between the inner peripheral end and the outer peripheral end of the seal member 12. Also in this case, since at least a part of the seal member 12 adheres to the metal light shielding film 9, there is no practical problem in the adhesive strength. Also, the transparent electrode 1
0 is formed on the colored filter layer 7 and the resin light-shielding film 8 so as to completely cover them.
Further, an effect of preventing the components of the resin light-shielding film 8 from dissolving into the liquid crystal layer 13 can be obtained.

Embodiment 2 FIG. 4 is a sectional view showing a liquid crystal display device according to Embodiment 2 of the present invention. In the figure, reference numeral 16 denotes a flattening film formed on the color filter layer 7 and the resin light shielding film 8. In the first embodiment, the transparent electrode 10 is formed directly on the color filter layer 7 and the resin light-shielding film 8. However, in the present embodiment, the color filter layer 7 and the resin light-shield film 8 are The transparent electrode 10 is formed by covering with a flattening film 16 of about 3 μm. In the drawings, the same or corresponding parts have the same reference characters allotted, and description thereof will not be repeated.

Next, a method of manufacturing the color filter substrate 2A of the liquid crystal display device according to the present embodiment will be described. However, the formation of the resin light-shielding film 8 by backside exposure (FIGS.
Steps up to FIG. 2D are the same as those in the first embodiment, and a description thereof will not be repeated. After the formation of the resin light-shielding film 8, a 3 μm-thick flattening film 16 made of an acrylic resin is formed by spin coating. Subsequently, ITO is deposited by a sputtering method to form a transparent electrode 10 having a thickness of about 1500 °. Further, an alignment film 11 made of polyimide is formed to obtain the color filter substrate 2A in the present embodiment.

In this embodiment, as in the first embodiment, the sealing member 12 is formed of the color filter substrate 2A.
Is bonded to the color filter substrate 2A via the metal light-shielding film 9 on the entire surface of the adhesive
And the color filter substrate 2A have sufficient adhesive strength,
Further, even when there is a chip or a defect in a part of the colored filter layer 7, the black resin light-shielding film 8 is formed in that part, so that a bright spot defect due to light leakage can be prevented. Further, in the present embodiment, a flattening film 16 of 1 to 3 μm in thickness made of an acrylic resin is formed on the colored filter layer 7 and the resin Since the step can be flattened,
The coverage of the transparent electrode 10 made of ITO is improved,
The display quality and reliability are further improved. Also, the planarizing film 1
By forming 6, the alignment film 11 is also flattened, so that the occurrence of poor alignment can be suppressed. In addition, since the colored filter layer 7 is protected by the flattening film 16 when the transparent electrode 10 is formed by the sputtering method, the chromaticity of the colored filter layer 7 due to the plasma ions of the sputtering and the decrease in transmittance are reduced. Damage can be prevented.

Embodiment 3 In the first and second embodiments, when forming the metal light-shielding film 9 on the color filter substrate 2A, alignment marks as shown in FIGS. 5A and 5C can be formed. . In FIG. 5, reference numeral 17 denotes a positioning mark formed on the color filter substrate 2A, and reference numeral 18 denotes a positioning mark formed on the array substrate 1A. The alignment marks 17 and 18 are used for photolithography in a subsequent step or for alignment at the time of bonding the color filter substrate 2A and the array substrate 1A. FIGS. 5C and 5D respectively show FIGS.
It is an enlarged plan view of the part circled in (a) and (b).
In this embodiment, when a metal such as Cr is formed and patterned on the color filter substrate 2A to form the metal light-shielding film 9, the alignment mark 1 as shown in FIG.
7 are formed simultaneously. On the other hand, when wiring (not shown) made of metal is formed on the array substrate 1A, the wiring shown in FIG.
Are simultaneously formed as shown in FIG. This makes it possible to form a mark with high alignment accuracy without increasing the number of steps.

In the first to third embodiments,
The method of forming the red, green, and blue colored filter layers 7R, 7G, and 7B and the resin light-shielding film 8 by a spin coating method using a color resist in which red, green, blue, and black pigments are dispersed is shown. However, each color material processed into a layer on a film material may be laminated (transferred) to a substrate by a heating roll. In this case, productivity is improved, and thus cost can be reduced. Embodiment 1
In Nos. 1 to 3, Cr was used as the metal light-shielding film 9. However, the present invention is not limited to this, and other metal materials having low light reflectance, such as Mo, can be used. In addition, Cr / CrOx, Mo /
Mo Ox and the like are also preferable because they can lower the reflectance. Further, the transparent electrode 10 is not limited to ITO, and may be made of a material made of indium oxide, tin oxide, or zinc oxide alone or in combination. In any case, it is desirable to form a film by a sputtering method and to perform a heat treatment after the film formation at a temperature higher than the substrate temperature at the time of film formation.

[0021]

As described above, according to the present invention, the light-shielding film of the color filter substrate is disposed so as to be in contact with the outer periphery of the resin light-shielding film surrounding each colored filter layer and the outer edge thereof. Framed metal light-shielding film,
Since at least a part of the seal member is adhered to the color filter substrate via the metal light shielding film, even if there is a chip or a defect in the colored filter layer, the part can be filled with the resin light shielding film, and light leakage can be achieved. In addition to the above, it is possible to prevent a bright spot defect, and to secure a sufficient adhesive strength between the seal member and the color filter substrate, thereby obtaining a liquid crystal display device having high display quality and high reliability.

Further, since the color filter substrate has a transparent conductive film that completely covers the color filter layer and the resin light-shielding film, it is possible to prevent the components of the color filter layer and the resin light-shielding film from dissolving into the liquid crystal layer.

Further, since the color filter substrate has a flattening film covering the colored filter layer and the resin light-shielding film, the color filter layer is protected and the step between the colored filter layer and the resin light-shielded film is eliminated. Can be improved and the occurrence of poor alignment can be suppressed.

Further, by forming the alignment mark at the same time as the formation of the metal light-shielding film, it is possible to form a mark with high alignment accuracy without increasing the number of steps.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a liquid crystal display device according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view illustrating a method for manufacturing a color filter substrate included in the liquid crystal display device according to Embodiment 1 of the present invention.

FIGS. 3A and 3B are a plan view and a cross-sectional view illustrating an effect of preventing a bright spot defect due to light leakage of a color filter substrate according to the first embodiment of the present invention. FIGS.

FIG. 4 is a cross-sectional view illustrating a liquid crystal display device according to Embodiment 2 of the present invention.

FIG. 5 is a plan view and a partially enlarged plan view showing an array substrate and a color filter substrate constituting a liquid crystal display device according to a third embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a conventional liquid crystal display device.

FIG. 7 is a cross-sectional view illustrating a bright spot defect due to light leakage occurring in a conventional liquid crystal display device.

[Explanation of symbols]

1, 2 transparent insulating substrate, 1A, 1B array substrate, 2
A, 2B color filter substrate, 3 thin film transistor, 4 pixel electrodes, 5 protective film, 6 alignment film, 7 colored filter layer, 7R red colored filter layer, 7G green colored filter layer, 7B blue colored filter layer, 8 resin 9 light shielding film, 9 metal light shielding film, 10 transparent electrode, 11 alignment film, 12 sealing member, 13 liquid crystal layer, 14 peripheral mask, 15 chipping of color filter layer, 16 flattening film, 1
7, 18 Positioning mark, 100A, 100B
Liquid crystal display.

Continued on the front page (72) Inventor Akira Tsumura 997 Miyoshi, Nishi-Koshi-cho, Kikuchi-gun, Kumamoto Prefecture Inside Advanced Display Co., Ltd. F term (reference) 2H042 AA09 AA15 AA26 2H089 LA48 NA38 NA45 QA12 QA16 2H091 FA02Y FA35Y FB08 FC10 LA12 LA30

Claims (9)

[Claims] 1. An array substrate in which a plurality of thin film transistors and a plurality of pixel electrodes connected thereto are formed on a transparent insulating substrate, and a plurality of colored filters corresponding to the respective pixel electrodes on another transparent insulating substrate. Layer, a resin light-shielding film surrounding each of the colored filter layers, and a frame-shaped metal light-shielding film arranged on the outer periphery of the resin light-shielding film so as to be in contact with the outer edge thereof, and a color arranged to face the array substrate. A liquid crystal disposed in a space formed by the filter substrate, a seal member provided at an outer edge portion between the array substrate and the color filter substrate and bonding the two substrates together, and formed by the array substrate, the color filter substrate and the seal member A layer, and at least a part of the seal member is adhered to the color filter substrate via the metal light shielding film. A liquid crystal display device. 2. The liquid crystal display device according to claim 1, wherein the seal member is bonded to the color filter substrate via a metal light-shielding film on the entire surface of the bonding surface with the color filter substrate. 3. The liquid crystal display device according to claim 1, wherein the color filter substrate has a transparent conductive film that completely covers the color filter layer and the resin light-shielding film. 4. The liquid crystal display device according to claim 1, wherein the color filter substrate has a flattening film covering the color filter layer and the resin light shielding film. 5. The liquid crystal display device according to claim 1, wherein the color filter substrate has an alignment mark formed of the same material as the metal light shielding film. 6. The metal light-shielding film may be made of Cr, Mo, Cr /
The liquid crystal display device according to any one of claims 1 to 5, wherein one of CrOx and Mo / Mo Ox is used. 7. An outer peripheral portion on the surface of a transparent insulating substrate,
A first step of forming a frame-shaped metal light-shielding film made of a metal such as, a second step of sequentially forming a plurality of colored filter layers on the substrate surface, and a negative photosensitive black on the substrate surface. After the resin is applied, the metal light-shielding film, the colored filter layer and the peripheral mask formed on the outer peripheral portion of the substrate with respect to the metal light-shielding film are used as a mask to expose and develop from the back side of the substrate. A third step of forming a resin light-shielding film surrounding the layer and having the outer edge in contact with the metal light-shielding film; and forming a transparent conductive film on the substrate surface so as to completely cover the colored filter layer and the resin light-shielding film. Fourth step, the color filter substrate formed in the first step to the fourth step and the array substrate formed in another step, at least a part of the sealing member is interposed through the metal light shielding film. And a fifth step of bonding the color filter substrate so as to adhere to the color filter substrate. 8. The method for manufacturing a liquid crystal display device according to claim 7, wherein in the first step, a mark for positioning is formed at the same time as forming the metal light shielding film. 9. In a fourth step, a film is formed by a sputtering method using a material made of indium oxide, tin oxide, or zinc oxide alone or in combination as a transparent conductive film. 9. The method for manufacturing a liquid crystal display device according to claim 7, wherein the heat treatment is performed at a temperature higher than the temperature.