TW201720767A - Breaking device capable of efficiently and reliably breaking along a scribing line without reversing the back surface of the substrate during breaking the laminated substrate - Google Patents

Abstract

The present invention provides a breaking device capable of efficiently and reliably breaking along a scribing line without reversing the back surface of the substrate during breaking the laminated substrate. The breaking device has an impact member 8 which defines a first region and a second region, where the first region is on one side of the substrate M with the scribing lines S1 and S2 as a boundary, and the second region is on the opposite side. In the state of the first support member 5 to support the first region and the second region protrude from the first support member, the second region is hit from above along the scribing lines S1 and S2 to cut off the second region from the first region.

Description

Breaking device

The present invention relates to a breaking device for breaking a shard line of a brittle material substrate. More particularly, the present invention relates to a cutting device suitable for bonding a two-piece glass substrate such as a liquid crystal display panel, and dividing the scribe lines formed on both sides of the back surface of the substrate.

In the manufacture of a liquid crystal display panel, two large-area glass substrates, a glass substrate on which an electronic component such as a thin film transistor (TFT) for driving a liquid crystal is formed, and a glass substrate on which a counter electrode is formed are used. Bonding to form a large bonded substrate. Then, the large-sized bonded substrate is divided into individual unit display panels by a dicing step and a severing step to cut out a unit substrate as a product (see Patent Document 1 and Patent Document 2).

Fig. 9 is a view showing a method of dividing a bonded substrate disclosed in the following patent documents and the like.

First, as shown in FIG. 9(a), the cutter wheel (also referred to as a scoring wheel) K is pressed against the surface of the first substrate 1 on the upper side of the bonded substrate M while being slid along the predetermined line, thereby moving relative thereto. A first scribe line S1 is formed. Next, as shown in FIG. 9(b), the back surface of the bonded substrate M is reversed, and the substrate M is deflected downward by pressing the crack bar 20 from above, thereby causing the crack of the score line S1 to penetrate in the thickness direction. The first substrate 1 is broken along the scribe line S1. Next, as shown in FIG. 9(c), the second scribe line S2 is processed on the surface of the second substrate 2 of the bonded substrate M by the cutter wheel K. Thereafter, as shown in FIG. 9(d), the bonding base is used. The plate M is reversed again and pressed by the split bar 20, whereby the second substrate 2 is broken along the second score line S2.

Further, as another breaking method, there is a method shown in FIG. In other words, as shown in FIG. 10(a), the cutter wheels K and K are pressed against the upper and lower surfaces of the bonded substrate M while being relatively moved, whereby the surfaces of the first substrate 1 and the second substrate 2 are simultaneously processed. The first score line S1 and the second score line S2. Next, as shown in FIG. 10(b), the split bar 20 is pressed against the bonded substrate M from above to deflect the substrate M downward, thereby cracking the underline S2 of the lower second substrate 2. The second substrate 2 is immersed in the thickness direction so as to be broken along the scribe line S2. Next, as shown in FIG. 10(c), the back surface of the bonded substrate M is reversed, and the cracked rod 20 is pressed from above to deflect the substrate M, whereby the first substrate 1 is cracked along the first scribe line S1. Broken.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-103295

Patent Document 2: Japanese Laid-Open Patent Publication No. 2006-137641

In any of the above-described methods for dividing a bonded substrate, in any case, it is necessary to perform a step of inverting the substrate to break the substrate on the opposite side after the substrate is broken by a split bar or the like. Even if the back surface of the substrate is reversed.

However, as described above for the reverse operation of the substrate, it is necessary to use a mechanism for reversing the substrate to increase the size of the device and also to increase the cost of the device. In addition, since the inversion operation takes time and there is also a risk of injuring the substrate during the inversion operation, there is also a problem of reduced productivity.

Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide a first substrate and a second substrate which can be scribed once without breaking the back surface of the substrate when the bonded substrate is divided. And the breaking device is surely disconnected.

In order to achieve the above object, the following technical means are proposed in the present invention. That is, the breaking device of the present invention performs the breaking of the substrate along the scribe line formed on the surface, and includes an impact member which is one of the sides of the substrate bordered by the scribe line. a region, the other region being the second region, in a state where the first support member supports the first region and the second region protrudes from the first support member, the second region is struck from above to The scribe line dicing the second region away from the first region.

In the breaking device of the present invention, the impact member strikes the surface of the substrate to be broken to generate a shear force on the substrate, so that the brittle material substrate or the bonded substrate of the single plate can be surely separated along the score line. In particular, in the case where the substrate to be separated is a bonded substrate composed of the first substrate and the second substrate, the first substrate and the second substrate can be separated once along the scribe line by one drop of the impact member. . Thereby, the front and back reversal operation of the substrate can be omitted, and the efficiency of the cutting operation and the simplification of the device can be simplified, and the risk of damaging the substrate in the reversing operation can be eliminated, and the front and back reversal operation of the substrate refers to After the scribe line of one of the substrates is broken, the substrate is reversed, and the scribe line of the other substrate is broken.

In the above invention, the impact by the impact member is preferably performed by free fall of the impact member. Thus, it is possible to easily obtain the shear force required for the breaking of the bonded substrate by the weight of the impact member itself without using a complicated mechanism.

Further, in the above invention, it is preferable to provide a pressing member that presses the first region from above when the impact member collides to prevent the first region from being lifted. In this way, it is possible to prevent the first region portion from being lifted up and to break with good precision when the impact member is hit.

A‧‧‧ breaking device

M‧‧‧ bonded substrate

S1‧‧‧ first line

S2‧‧‧Second line

1‧‧‧First substrate

2‧‧‧second substrate

4‧‧‧stops

5‧‧‧First support member

6‧‧‧Second support member

8‧‧‧ Impact members

11‧‧‧ Pressing members

Fig. 1 is a side view schematically showing the breaking device of the present invention.

Figure 2 is a perspective view showing the main part of the breaking device of Figure 1.

Figure 3 is an explanatory view showing the first stage of the breaking step performed by the breaking device of Figure 1.

Figure 4 is an explanatory view showing the second stage of the breaking step performed by the breaking device of Figure 1.

Figure 5 is an explanatory view showing the third stage of the breaking step performed by the breaking device of Figure 1.

Figure 6 is an explanatory view showing the fourth stage of the breaking step performed by the breaking device of Figure 1.

Fig. 7 is a plan view and a cross-sectional view showing an example of a bonded substrate as a breaking target.

Fig. 8 is a plan view showing the strip substrate and the unit substrate after the division.

Fig. 9 is an explanatory view showing an example of a conventional method of dividing a bonded substrate.

Fig. 10 is an explanatory view showing another example of a conventional method of dividing a bonded substrate.

An embodiment of the breaking device of the present invention will be described with reference to Figs. Fig. 7 is a view showing an example of a bonded substrate which is a breaking target of the breaking device of the present invention, wherein (a) is a plan view and (b) is a cross-sectional view. The bonded substrate M is formed by bonding the first substrate 1 on the upper side and the second substrate 2 on the lower side. A first scribe line S1 is formed on the surface of the first substrate 1 in the X-Y direction at the same position in plan view, and a second scribe line S2 is formed on the surface of the second substrate 2 in the X-Y direction. The regions as the plurality of unit substrates M1 are divided into a lattice shape by the scribe lines S1 and S2.

The breaking device A of the present invention includes a first support member 5 and a second support member 6 that move up and down. In the present embodiment, the first support member 5 and the second support member 6 are constituted by a conveyor belt, the first support member 5 is on the upstream side, and the second support member 6 is on the downstream side, from the first support member 5 on the upstream side. The second support member 6 on the downstream side conveys the bonded substrate M to be separated.

The first support member 5 and the second support member 6 are disposed at positions close to each other in a horizontal state, and the second support member 6 can be moved downward from this position by the elevating mechanism of the cylinder 7 or the like.

Above the second support member 6, an impact member 8 is provided at a position close to the first support member 5. The impact member 8 is formed long in the width direction of the conveyor belt, and is formed to be vertically freely fallable by the weight of the guide member 10 from the position where the rope 9 is lifted. Further, above the first support member 5, at a position close to the second support member 6, a pressing member 11 for preventing the substrate M from being lifted at the time of breaking is provided. Under the pressing member 11 and the impact member 8, a soft sheet 11a, 8a such as urethane which prevents the surface of the substrate M from being scratched when it comes into contact with the substrate M is adhered.

Further, a stopper 4 that restricts the falling stroke of the impact member 8 is provided. The stopper 4 is disposed on a left and right side portions of the second support member 6 and is fixed to a frame (not shown) of the breaking device A. Further, the abutting piece 8b which abuts against the stopper 4 is formed to be connected to the impact member 8. The stopper 4 functions to prevent the impact member 8 from contacting the substrates M1, M2 that have been cut away by the impact member 8 and dropped onto the second support member 6 in the breaking step described below.

Next, the operation of the breaking device A will be described.

The bonded substrate M of the first and second scribe lines S1 and S2 is pre-processed in the preceding scribe step, and is carried along the width direction of the conveyor belt by any scribe line, for example, the scribe line in the X direction. It is placed in the first support member 5 and conveyed toward the second support member 6 on the downstream side (see FIGS. 1 to 3). Then, as shown in FIG. 4, when the first scribe lines S1 and S2 are moved to a position slightly apart from the first support member 5, the transfer of the bonded substrate M is stopped. At this time, the region supported by the first support member 5 is referred to as the first region by the scribe lines S1 and S2 of the bonded substrate M. The area supported by the two support members 6 is referred to as a second area.

Next, as shown in FIGS. 5 and 6, the pressing member 11 is lowered and gently touched the surface of the first region of the bonded substrate M. In this state, when the impact member 8 is freely dropped from the upper standby position, the scribing force generated by the collision of the free fall causes the scribing lines S1 and S2 of the upper and lower substrates M to be simultaneously broken. The two regions are separated from the first region to form a strip substrate M1 as shown in Fig. 8(a). At this time, since the first region of the bonded substrate M is still pressed by the pressing member 11, it is possible to prevent the lift of the first region portion at the time of the breaking.

In this way, the bonded substrate M is sequentially divided into the strip-shaped substrate M1 by the scribe line in the X direction, and the scribe line in the Y direction of the strip-shaped substrate M1 is strip-shaped along the width direction of the conveyor belt. The substrate M1 is placed on the first supporting member 5, and the strip substrate M1 is sequentially separated along the scribe line by the impact member 8 in the same manner as described above, and the unit substrate as shown in FIG. 8(b) is cut out. M2.

The lowering stroke L1 of the second supporting member 6 and the weight of the impact member 8 and the falling stroke L2 at the time of the breaking are set to appropriate values depending on the material and thickness of the bonded substrate M as the breaking target. For example, when the first substrate 1 and the second substrate 2 of the bonded substrate M are glass plates having a thickness of 0.2 to 0.4 mm, it is preferable that the lowering stroke L1 of the second supporting member 6 is 4 to 10 mm. The lowering stroke L2 of the impact member 8 is set to 3 to 9 mm. Further, it is preferable that the interval L3 between the impact member 8 and the second region on the second support member 6 when the impact member 8 is dropped to the lowermost end is set to 1 to 5 mm.

As described above, since the bonding substrate M is separated by the shear force generated by the impact member 8 being freely dropped and struck, it is possible to omit the substrate from being reversed after the scribe line of one of the substrates is broken to the other side. The substrate is scribed by a scribe line to perform a complicated substrate reversal operation, and The first substrate 1 and the second substrate 2 are once separated along the scribe lines S1 and S2 by one drop of the impact member. Thereby, it is possible to improve the efficiency of the breaking operation and the simplification of the apparatus, and also to solve the risk of injuring the substrate during the reverse operation.

Further, after the impact member 8 is cut away, the second region of the strip substrate M1 or the unit substrate M2 is dropped, and after being dropped onto the second support member 6, the second support member 6 is sequentially transported to the downstream side. Thereby, the breaking step of bonding the substrate M can be continuously performed in a smooth operation.

In the present invention, in the above embodiment, the shearing force of the impact member 8 by the free weight of the impact member 8 is generated by the impact of the substrate M, but as long as the shear force equivalent thereto can be generated, for example, The impact member 8 is lowered by mechanical means such as a punch.

Although the representative embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, in the above-described embodiment, the bonded substrate obtained by bonding the first substrate and the second substrate is described as a breaking target. However, it is of course applicable to the breaking of the brittle material substrate of the single plate.

The breaking device of the present invention can be utilized when dividing a large piece of brittle material substrate along a scribe line to cut out a unit substrate.

A‧‧‧ breaking device

M‧‧‧ bonded substrate

S1‧‧‧ first line

S2‧‧‧Second line

1‧‧‧First substrate

2‧‧‧second substrate

4‧‧‧stops

5‧‧‧First support member

6‧‧‧Second support member

7‧‧‧ cylinder

8‧‧‧ Impact members

8a‧‧‧Soft sheet

8b‧‧‧ Abutment

11‧‧‧ Pressing members

11a‧‧‧Soft sheet

Claims (3)

A breaking device is characterized in that a substrate is divided along a scribe line formed on a surface, and is characterized in that: an impact member is provided, and the impact member is first in a square region of the substrate bordered by the scribe line And when the other region is the second region, in a state where the first support member supports the first region and the second region protrudes from the first support member, the second region is impacted from above to The scribe line dicing the second region away from the first region. The breaking device of claim 1, wherein the impact of the impact member is performed by free fall of the impact member. A breaking device according to claim 1 or 2, comprising: a pressing member that presses the first region from above when the impact of the impact member is used to prevent the first region from being lifted.