JP2002103295A - Fragile substrate breaking method and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that a fragile substrate must be inverted when breaking the scribed fragile substrate in a conventional machining system. SOLUTION: A closed space covering a region including a scribe line formed on an upper face of the fragile substrate at the center and having a predetermined width is created, and a pressure in the closed space is reduced to break the fragile substrate by curving it slightly into a reverse V shape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a breaker for cutting a brittle substrate having scribe lines formed along the scribe lines. The brittle substrate includes a semiconductor wafer, a glass substrate, a bonded glass substrate, a ceramic substrate, and the like.

[0002]

2. Description of the Related Art FIG. 1 shows a cutting system for a single brittle substrate. Table 2 with scribe device 1
By rolling the cutter wheel chip 4 while applying a predetermined cutting pressure to the upper brittle substrate 3,
A scribe line S is formed on the surface of the brittle substrate.

[0003] With the brittle substrate 3 turned upside down, it is set on a table 6 of a breaker 5 with a cushion sheet 7 interposed therebetween. Above the scribe line S on the lower surface of the brittle substrate, a bar-shaped break bar 8 extending in the scribe line direction is located, and the break bar 8 is lowered by driving the cylinder 9 to lower the brittle substrate 3 from above. By pressing, the brittle substrate 3 is slightly bent in a V-shape on the elastic cushion sheet 7, thereby extending the cracks of the scribe lines S (cracks of vertical components contributing to the division), and Divide along the scribe line S.

FIG. 2 shows a breaking method for a laminated glass substrate such as a liquid crystal panel. 1. The scribing device scribes the surface A of the bonded glass substrate 3 '(the surface A is an upper glass substrate in this figure). 2. Next, in the breaker, the break bar 8 is pressed against the inverted B surface of the bonded glass substrate to break the lower A surface. 3. The bonded glass substrate 3 'is transferred to the second scribe device (or returned to the scribe device) and scribed on the B surface (in the liquid crystal panel, a terminal is formed at one end of the glass side, so that the A surface is formed. And the scribing positions on the side B are shifted from each other.) 4. Next, the second breaking device (or the breaking device)
Then, the break bar 8 is pressed against the surface A of the laminated glass substrate 3 ′ which has been inverted again to break the lower surface B.

[0005]

However, as described above, when the scribed brittle substrate 3 is transferred from the scribe device to the break device, the step of inverting the brittle substrate 3 is indispensable. In order to perform the reversal, as shown in FIG. 3, the scribed brittle substrate is once placed on another gantry 11 or the like by the robot arm 10 or the like, and the brittle substrate 3 is lifted from below by the robot arm 10 (that is, I set it on the table 6 of the breaker. Therefore, not only such a reversing mechanism is required, but also the working efficiency is low. Conventionally, a dedicated reversing device was required for each of scribe and break, so that the system was increased in size and cost was increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and eliminates the need for a step of inverting a brittle substrate after scribing, and also allows a scribing and breaking of a brittle substrate on a single table. It is an object to provide a method and a breaking device.

[0007]

SUMMARY OF THE INVENTION According to the present invention, a closed space is formed for a scribe line formed on an upper surface of a brittle substrate so as to cover a region of a predetermined width by including the scribe line at the center, and the closed space is decompressed. Thus, the brittle substrate is slightly curved in an inverted V-shape to cause a break.

[0008]

FIG. 4 shows an assembly diagram of a break bar 25 used in the breaking method of the present invention. As shown in the above figure, a columnar rectangular parallelepiped 21 made of an aluminum material is used. The size is 300mm ~ 10mm depending on the processing object
00 mm, width 10 mm to 30 mm, thickness 10 mm to 50 mm. In the center of the upper surface of the columnar cuboid 21, a width of
A groove 21a having a depth of 0.5 mm and a depth of 0.5 mm is formed in the column direction.

Next, as shown in the middle figure, a total of four partition pieces 22 made of elastic material are embedded in both ends of the groove 21a and inside a predetermined length from each end. The thickness of each partition 22 is the same as the depth of the groove 21a. The groove 21a is divided into three sections in the column direction by these partition pieces 22. The suction holes 23 penetrating from the bottom surface of the groove in each section to the lower surface of the columnar rectangular parallelepiped 21 are formed.

Then, as shown in the figure below, the columnar rectangular solid 21
Is joined to a suction sheet 24 having a thickness of 5 mm by an elastic body. As a result, three closed sections are formed in the groove 21a. Then, cuts 24a penetrating the lower surface of the suction sheet 24 are formed corresponding to these three closed sections. Thus, the break bar 25 is obtained.
Here, the cuts 24a are set to 3 corresponding to the three closed sections.
Although it was divided into books, it could be a single continuous cut.

As the suction sheet 24 and the partition 22, a highly foamed silicone sponge sheet (spring hardness test (Japan Rubber Association Standard: SRIS
0101-1968) of 5 to 30) was used, but any material having an appropriate elastic coefficient may be used.

At the time of a break, as shown in FIG. 5, the surface of the suction sheet 24 is used in contact with the brittle substrate 3. A tube for evacuating is connected to a plug 26 provided at the opening of the suction hole 23.

FIG. 5 shows a case where the break bar length is substantially equal to the length of the scribe line S of the brittle substrate 3. In this case, the three plugs 26 are simultaneously evacuated, but as shown in FIG. When the scribe line length of the brittle substrate 3 ″ is shorter than the break bar length, the central plug 26 is used to evacuate.

FIG. 4 shows a case in which the number of closed sections of the break bar is three. However, the number of closed sections is set to 4 to 20, and the vacuum pressure in each section is individually controlled in accordance with the cutting condition of the brittle material. Is noisy.

FIG. 7 shows the plug 26 of FIG. 5 (the same applies to FIG. 6).
FIG. The line of the notch 24a substantially matches the scribe line S of the brittle substrate 3. It should be noted here that the scribe line S is not on the lower surface of the brittle substrate 3 but on the upper surface.
A cushion sheet is not required between the brittle substrate 3 and the table 6.

Next, as shown in FIG. 8, when the plug 26 is evacuated, the suction sheet 24 is slightly deformed into an inverted V-shape, and the brittle substrate 3 is deformed following the deformation. Cracks of the scribe line S grow downward, and the brittle substrate 3 is divided. Cut 2 in suction sheet 24
The reason for forming the break bar 2a is as shown in FIG.
This is because the suction force between the two is increased by sucking air slightly remaining in the gap existing at the joint surface between the two while the member 5 is in contact with the brittle substrate 3 by its own weight. Instead of the cuts 24a, small holes may be provided in a line, and if the brittle substrate 3 and the suction sheet 24 have good adhesion, suction that can be almost expected without such cuts is provided. Power is gained.

FIG. 9 is a perspective view showing an embodiment of a breaking device 30 using the above-described break bar 25. As shown in FIG.
The table 6 moves in the Y direction,
It is rotatable, and the brittle substrate 3 is suction-fixed to the table surface. The bridge 31 is provided so as to straddle the table 6, and includes support plates on both sides and a top plate 31 a supported by the support plates and extending in the horizontal X direction.

An air cylinder 32 is provided at the center of the top plate 31a.
The lower end of a cylinder shaft 33 facing downward from the air cylinder 32 supports the break bar 25 at the center of the upper surface. By driving the air cylinder 32, the break bar 25 moves up and down. However, as shown in a partially enlarged view, the break bar 25 is moved up and down so that the break bar 25 does not collide with the brittle substrate 3 when descending. , An L-shaped stopper 35 having one end fixed to the top plate 31a
And a screw 36 screwed into a screw hole provided in the locking piece 34 and having a lower end abutting on a horizontal portion of the stopper 35 upward. The lowering position of the break bar 25 is adjusted according to the thickness of the glass plate 3 by turning the screw 36 with a screwdriver or the like through a hole Q provided in the top plate 31a. Instead of the stopper mechanism 37, a suitable braking mechanism may be provided so that the break bar 25 can be gently lowered.

The break bar 25 is provided with a guide bar 38 for moving in parallel when the break bar 25 moves up and down. Of the three plugs 26, the center plug is connected to a vacuum pump via a valve V1, and the two plugs 26 at both ends are connected to a vacuum pump via a valve V2. At the time of a break as shown in FIG. 5, both valves V1 and V2 are opened, and FIG.
In such a break, only the valve V1 is opened.

The vacuum pressure at the time of vacuum suction is -1.
33 x 102 Pa (-1 mmHg) to -8.64 x 104 Pa
(-650 mmHg), while the vacuum pressure for suction-fixing the brittle substrate 3 to the table 6 is -1.33 × 102 Pa (-1 mmHg) or less in terms of gauge pressure,
The suction hole formed in the table 6 had a diameter of 2 mm. If the vacuum pressure for fixing the glass plate is set to be lower (closer to the atmospheric pressure) than the vacuum pressure for the break, even if the suction hole is located immediately below the scribe line, there is no problem with the break.

FIG. 10 is a system diagram of processing a brittle substrate employing the above-described breaking device 30. The bonded glass substrate 3 'is scribed by a scriber S
It is set on the first table and scribed on the upper A side. The mechanism of the scribe device will be described with reference to FIG.

The bonded glass substrate 3 'having the scribed surface A is set on a table of a breaker B1 (breaker shown in FIG. 9) with the surface A facing upward by a transporter. The surface A is broken according to the breaking method of the present invention.

The bonded glass substrate is turned upside down by a reversing machine, and then the second B-side scribe device S2
(When the system is composed of only the scribe device S1 and the break device B1, return to the scribe device S1). And B located on the upper side
Scribed against a face.

The bonded glass substrate having the scribed surface B is transferred to a second B-surface breaker B2 by a transporter.
(Or the breaker B1) is set on the table with the surface B facing up, and the surface B is broken. This completes the processing of the laminated glass substrate, and the substrate is carried out to the next step by the removal material transporter.

FIG. 11 shows an embodiment of a scribing and breaking device 40 which can also perform a break with a device of a scriber for brittle substrates. The bridge 41 provided so as to straddle the table 6 is composed of support columns on both sides and a guide bar 42 extending in the X direction. The guide bar 42 is provided with a guide 42a in the bar direction. I have. The scribe head 43 is a holder support 4
The scribe head 43 is provided movably along the guide 42 a through the scribe head 4, and a tip holder 46 for rotatably holding a cutter wheel tip 45 is provided below the scribe head 43.

Behind the scribe mechanism composed of the above elements, a break mechanism including the bridge 31 described with reference to FIG. 9 is located.

Behind the breaking mechanism, the brittle substrate 3
Is provided with a pair of cameras 51 and 52 for recognizing the alignment marks described in the above. Images captured by the cameras are displayed on monitors 53 and 54, and the alignment marks are image-recognized by an image recognition device. Its position data is calculated.

As described above, according to the present invention, the break can be performed without inverting the brittle substrate after scribing, and the break device does not require the cushion sheet 7 as shown in FIG. You can also break at the scribed table.

FIG. 12 is a system diagram for processing a laminated glass substrate employing the above-described scribing and breaking device 40. The bonded glass substrate 3 'is set on the table of the scribing / breaking device SB1 by a material feeder or the like, and is scribed on the upper surface A, followed by a break.

The bonded glass plate 3 'having the scribed and broken side A is set on the table of the second scribe and break unit SB2 after turning over (the system is composed of only the scribe and break unit SB1). When the scribe and break device SB1
Back to). Then, the scribe and the break are performed on the surface B located on the upper side, and are carried out to the next step.

In order to completely separate a single brittle substrate and a bonded brittle substrate, a plurality of breakers are required depending on the cutting conditions and the conditions according to the production method in the next step. For example, in the break of a single brittle substrate, separate break devices of the present invention are used for a break in a first direction and a break in a second direction having an angle of 90 ° with the first direction. In the case where the bonded brittle substrate is cut into strips and sent to the next step, individual break devices of the present invention are used for the front and back surfaces of the brittle substrate before sending to the next step.

The dimensions of the groove 21a and the suction sheet 24 (FIG. 4) employed in this embodiment are merely examples, and the dimensions suitable for implementing the present invention are as follows. Groove width: 3 mm to 10 mm Groove depth: 0.1 mm to 1 mm Sheet thickness: 1 mm to 8 mm

[0033]

As described above, according to the present invention, the brittle substrate after scribing can be broken without reversing the brittle substrate (that is, with the scribe line on the upper side). Since the reversing step is not required, the time required for the entire processing can be reduced.
In addition, at the time of the break, a cushion material between the brittle substrate and the table is not required, so that the break can be performed on the table of the scribing device. In this case, the scribed brittle substrate is scribed. There is no need for a mechanism for transporting from the apparatus to the breaker, and the system size and processing time can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing a conventional scribe and break for a single brittle substrate.

FIG. 2 is a diagram showing a conventional scribe and break for a laminated glass substrate.

FIG. 3 is a view showing a reversing step of reversing the front and back of a brittle substrate.

FIG. 4 is an assembly diagram of a break bar according to the present invention.

FIG. 5 is a diagram showing a state of the break bar of FIG. 4 at the time of a break;

FIG. 6 is a diagram showing a state of a break when the size of a brittle substrate is small.

FIG. 7 is a longitudinal sectional view of the plug of FIG. 5;

FIG. 8 is a diagram showing a state at the time of a break in FIG. 5;

FIG. 9 is a perspective view showing one embodiment of a breaking device employing the above-mentioned break bar.

FIG. 10 is a system diagram of processing of a brittle substrate configured by using the above-described breaking device.

11 is a perspective view showing an embodiment of a scribing and breaking device provided with a breaking mechanism of FIG. 9 in a conventional scribing device.

FIG. 12 is a system diagram of processing of a brittle substrate configured using the scribe and break device.

[Explanation of symbols]

 3 Brittle substrate 6 Table 21a Groove 22 Partition piece 23 Suction hole 24 Suction sheet 24a Cut 25 Break bar 26 Plug 30 Break device 31 Bridge 32 Air cylinder 33 Cylinder shaft 34 Lock piece 35 Stopper 36 Screw 37 Stopper mechanism 40 Scribe / break device 41 Bridge 42 Guide bar 43 Scribe head 44 Holder support 45 Cutter wheel tip 46 Tip holder S Scribe line

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[Procedure amendment]

[Submission Date] October 10, 2000 (2000.10.
10)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

Claims (8)

[Claims] 1. A closed space which covers a region of a predetermined width including a scribe line formed substantially in the center of a brittle substrate, and the closed space is decompressed to bend and break the brittle substrate. Break method. 2. A closed space covering a region of a predetermined width including a scribe line formed in a brittle substrate substantially at the center thereof, and the brittle substrate is curved and broken by reducing the pressure of the closed space. Break device. 3. The breaking device according to claim 2, wherein the closed space is a sealing member having a concave groove in a scribe line direction. 4. A suction sheet for maintaining airtightness is attached to one surface of the sealing member in contact with the brittle substrate.
Or the breaking device according to 4. 5. The breaking device according to claim 5, wherein a cut line penetrating the suction sheet in a thickness direction of the suction sheet is formed in a scribe line direction. 6. A table moved at least in the Y and θ directions, a guide bar extending in the X direction above the table, a scribe head movably provided along the guide bar 7, A scriber for a brittle substrate, comprising a chip holder movably up and down and swingable below a scribe head, wherein the breaking device according to any one of claims 2 to 6 is provided side by side on the same table. A scribing and breaking device, wherein a scribing and breaking process can be performed. 7. A scribing and breaking apparatus comprising: two scribing and breaking devices according to claim 7; and a work reversing mechanism capable of transporting the brittle substrate in an inverted state. Scribing and breaking the brittle substrate on the upper side of the above, the brittle substrate is turned over by a work reversing mechanism and transported to a second scribing and breaking device, and the brittle substrate above the bonded brittle substrate A brittle substrate processing apparatus, wherein a system is configured to perform scribing and breaking on a substrate. 8. A processing apparatus for a brittle substrate provided with a scribe and a break process in order to completely separate the brittle substrate, wherein at least one of the break devices according to claim 2 is provided in the break process. An apparatus for processing a brittle substrate, comprising: