HK1048280A1 - A method of making a brittle substrate and an apparatus thereof - Google Patents

A method of making a brittle substrate and an apparatus thereof

Info

Publication number
HK1048280A1
HK1048280A1 HK02108249.0A HK02108249A HK1048280A1 HK 1048280 A1 HK1048280 A1 HK 1048280A1 HK 02108249 A HK02108249 A HK 02108249A HK 1048280 A1 HK1048280 A1 HK 1048280A1
Authority
HK
Hong Kong
Prior art keywords
making
brittle substrate
brittle
substrate
Prior art date
Application number
HK02108249.0A
Other languages
Chinese (zh)
Inventor
高松生芳
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of HK1048280A1 publication Critical patent/HK1048280A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
HK02108249.0A 2000-10-02 2002-11-14 A method of making a brittle substrate and an apparatus thereof HK1048280A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000302059A JP3787489B2 (en) 2000-10-02 2000-10-02 Method and apparatus for breaking brittle substrate

Publications (1)

Publication Number Publication Date
HK1048280A1 true HK1048280A1 (en) 2003-03-28

Family

ID=18783487

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02108249.0A HK1048280A1 (en) 2000-10-02 2002-11-14 A method of making a brittle substrate and an apparatus thereof

Country Status (5)

Country Link
JP (1) JP3787489B2 (en)
KR (1) KR100573207B1 (en)
CN (1) CN1238167C (en)
HK (1) HK1048280A1 (en)
TW (1) TW527328B (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4169565B2 (en) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 Brittle material substrate break method, apparatus and processing apparatus therefor
KR100724474B1 (en) 2002-10-22 2007-06-04 엘지.필립스 엘시디 주식회사 Device for cutting liquid crystal display panel and method for cutting the same
US7426883B2 (en) * 2002-11-22 2008-09-23 Mitsuboshi Diamond Ind Co Ltd Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
CN100382941C (en) * 2003-04-18 2008-04-23 鸿富锦精密工业（深圳）有限公司 Cutting method of optical element
EP1630140A4 (en) * 2003-04-28 2006-10-25 Mitsuboshi Diamond Ind Co Ltd Brittle board dividing system and brittle board dividing method
JP4839007B2 (en) * 2005-03-17 2011-12-14 株式会社尼崎工作所 Laminated glass cutting device
JP2010232603A (en) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd Substrate fixing device
JP5308892B2 (en) * 2009-04-01 2013-10-09 三星ダイヤモンド工業株式会社 Integrated thin film solar cell manufacturing equipment
JP5583478B2 (en) * 2010-05-25 2014-09-03 株式会社シライテック Panel splitting device
JP5210409B2 (en) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 Break device
JP5210407B2 (en) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 Break device and break method
JP5210408B2 (en) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 Fragment material substrate cutting device
KR101329819B1 (en) * 2012-01-31 2013-11-15 주식회사 티이에스 Substrate breaking system and substrate breaking method
JP5981791B2 (en) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
CN103586985A (en) * 2012-08-17 2014-02-19 佳友科技有限公司 Method and system for processing fragile material
JP2015003513A (en) 2013-05-24 2015-01-08 三星ダイヤモンド工業株式会社 Cutter wheel and manufacturing method thereof
JP6140012B2 (en) 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 Breaking method for bonded substrates
JP6213134B2 (en) * 2013-10-16 2017-10-18 三星ダイヤモンド工業株式会社 Elastic support plate, breaking device and dividing method
JP6115438B2 (en) * 2013-10-16 2017-04-19 三星ダイヤモンド工業株式会社 Breaking device and cutting method
JP2015140289A (en) * 2014-01-29 2015-08-03 三星ダイヤモンド工業株式会社 Break apparatus
JP6387695B2 (en) 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
FR3024136B1 (en) * 2014-07-24 2021-04-30 Saint Gobain PROCESS FOR BREAKING A SHEET OF GLASS
JP6005708B2 (en) * 2014-10-23 2016-10-12 三星ダイヤモンド工業株式会社 Method and apparatus for dividing wafer laminate for image sensor
JP3195489U (en) * 2014-11-05 2015-01-22 株式会社シライテック Panel splitting device
FR3031102B1 (en) * 2014-12-31 2017-01-27 Saint Gobain PROCESS FOR RIPPING AN INNER SHAPE IN A GLASS SHEET
KR102509143B1 (en) 2015-06-30 2023-03-13 미쓰보시 다이야몬도 고교 가부시키가이샤 Cutter wheel and manufacturing method the same
JP6740606B2 (en) 2015-07-31 2020-08-19 三星ダイヤモンド工業株式会社 Cutter wheel
JP6716900B2 (en) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 Cutting device
JP2017112265A (en) * 2015-12-17 2017-06-22 株式会社ディスコ Wafer processing method
JP6746128B2 (en) 2016-05-24 2020-08-26 三星ダイヤモンド工業株式会社 Cutter wheel
JP6897951B2 (en) 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 Cutter wheel
JP6897950B2 (en) 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 Cutter wheel
JP2019038237A (en) 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 Break device
JP2019038238A (en) 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 Break device
CN108423981B (en) * 2018-05-21 2020-12-25 武汉华星光电半导体显示技术有限公司 Method and device for splitting glass substrate
JP2020083668A (en) 2018-11-16 2020-06-04 三星ダイヤモンド工業株式会社 Method for scribing glass substrate having glass frit film
JP2024077175A (en) * 2022-11-28 2024-06-07 日本電気硝子株式会社 Apparatus and method for manufacturing glass article

Also Published As

Publication number Publication date
JP3787489B2 (en) 2006-06-21
TW527328B (en) 2003-04-11
CN1348850A (en) 2002-05-15
CN1238167C (en) 2006-01-25
KR20020026815A (en) 2002-04-12
JP2002103295A (en) 2002-04-09
KR100573207B1 (en) 2006-04-24

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