GB0005883D0 - Electro-plating apparatus and a method of electoplating - Google Patents
Electro-plating apparatus and a method of electoplatingInfo
- Publication number
- GB0005883D0 GB0005883D0 GBGB0005883.4A GB0005883A GB0005883D0 GB 0005883 D0 GB0005883 D0 GB 0005883D0 GB 0005883 A GB0005883 A GB 0005883A GB 0005883 D0 GB0005883 D0 GB 0005883D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electoplating
- electro
- plating apparatus
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0005883.4A GB0005883D0 (en) | 2000-03-13 | 2000-03-13 | Electro-plating apparatus and a method of electoplating |
AU40804/01A AU775221B2 (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
EP01911882A EP1266052A1 (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
JP2001567826A JP2003527489A (en) | 2000-03-13 | 2001-03-13 | Electroplating apparatus and electroplating method |
KR1020027012079A KR20030007464A (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
CA002403116A CA2403116A1 (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
RU2002127419/02A RU2244767C2 (en) | 2000-03-13 | 2001-03-13 | Plating method and apparatus |
PCT/GB2001/001086 WO2001068951A1 (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and a method of electro-plating |
CN01808237A CN1425080A (en) | 2000-03-13 | 2001-03-13 | Electro-plating apparatus and method of electro-plating |
MXPA02008976A MXPA02008976A (en) | 2000-03-13 | 2001-03-13 | Electro plating apparatus and a method of electro plating. |
BR0109301-0A BR0109301A (en) | 2000-03-13 | 2001-03-13 | Electroplating apparatus and electroplating method |
HK03104367.4A HK1053153A1 (en) | 2000-03-13 | 2003-06-18 | Electro-plating apparatus and a method of electro-plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0005883.4A GB0005883D0 (en) | 2000-03-13 | 2000-03-13 | Electro-plating apparatus and a method of electoplating |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0005883D0 true GB0005883D0 (en) | 2000-05-03 |
Family
ID=9887431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0005883.4A Ceased GB0005883D0 (en) | 2000-03-13 | 2000-03-13 | Electro-plating apparatus and a method of electoplating |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP1266052A1 (en) |
JP (1) | JP2003527489A (en) |
KR (1) | KR20030007464A (en) |
CN (1) | CN1425080A (en) |
AU (1) | AU775221B2 (en) |
BR (1) | BR0109301A (en) |
CA (1) | CA2403116A1 (en) |
GB (1) | GB0005883D0 (en) |
HK (1) | HK1053153A1 (en) |
MX (1) | MXPA02008976A (en) |
RU (1) | RU2244767C2 (en) |
WO (1) | WO2001068951A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4479535B2 (en) | 2005-02-21 | 2010-06-09 | セイコーエプソン株式会社 | Optical element manufacturing method |
CN103603025A (en) * | 2013-12-02 | 2014-02-26 | 昆山亿诚化工容器有限公司 | Device for electroplating metal coiled material |
CN105603494A (en) * | 2016-01-27 | 2016-05-25 | 南通彩都新能源科技有限公司 | Electrophoretic deposition system and method for preparing silicon-based anode material of lithium ion battery |
CN109750281B (en) * | 2017-11-07 | 2024-04-12 | 东莞市腾明智能设备有限公司 | Horizontal copper deposition device |
JP7113881B2 (en) * | 2019-12-11 | 2022-08-05 | エスケー ネクシリス カンパニー リミテッド | Cathode assembly for plating equipment |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2156981A5 (en) * | 1971-10-13 | 1973-06-01 | Honeywell Bull | |
DE3603856C2 (en) * | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Method and device for galvanizing flat workpieces such as printed circuit boards |
EP0889680A3 (en) * | 1997-07-01 | 2000-07-05 | Deutsche Thomson-Brandt Gmbh | Method of removing and/or applying conductive material |
IT1298150B1 (en) * | 1998-01-19 | 1999-12-20 | Occleppo Di Francesco Occleppo | DEVICE FOR ELECTROLYTIC DEPOSITION ON TRANSLATING METALLIC SHEETS IN SPECIES FOR PRINTED CIRCUITS, BY CLOSING A |
-
2000
- 2000-03-13 GB GBGB0005883.4A patent/GB0005883D0/en not_active Ceased
-
2001
- 2001-03-13 CN CN01808237A patent/CN1425080A/en active Pending
- 2001-03-13 CA CA002403116A patent/CA2403116A1/en not_active Abandoned
- 2001-03-13 BR BR0109301-0A patent/BR0109301A/en not_active IP Right Cessation
- 2001-03-13 JP JP2001567826A patent/JP2003527489A/en active Pending
- 2001-03-13 RU RU2002127419/02A patent/RU2244767C2/en not_active IP Right Cessation
- 2001-03-13 KR KR1020027012079A patent/KR20030007464A/en active IP Right Grant
- 2001-03-13 WO PCT/GB2001/001086 patent/WO2001068951A1/en active IP Right Grant
- 2001-03-13 MX MXPA02008976A patent/MXPA02008976A/en not_active Application Discontinuation
- 2001-03-13 AU AU40804/01A patent/AU775221B2/en not_active Ceased
- 2001-03-13 EP EP01911882A patent/EP1266052A1/en not_active Withdrawn
-
2003
- 2003-06-18 HK HK03104367.4A patent/HK1053153A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU775221B2 (en) | 2004-07-22 |
EP1266052A1 (en) | 2002-12-18 |
JP2003527489A (en) | 2003-09-16 |
MXPA02008976A (en) | 2004-10-14 |
KR20030007464A (en) | 2003-01-23 |
CA2403116A1 (en) | 2001-09-20 |
WO2001068951A1 (en) | 2001-09-20 |
AU4080401A (en) | 2001-09-24 |
RU2244767C2 (en) | 2005-01-20 |
CN1425080A (en) | 2003-06-18 |
HK1053153A1 (en) | 2003-10-10 |
BR0109301A (en) | 2002-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |