MXPA02008976A

MXPA02008976A - Electro plating apparatus and a method of electro plating.

Info

Publication number: MXPA02008976A
Application number: MXPA02008976A
Authority: MX
Inventors: John Michael Lowe
Original assignee: Tdao Ltd
Priority date: 2000-03-13
Filing date: 2001-03-13
Publication date: 2004-10-14
Also published as: JP2003527489A; GB0005883D0; BR0109301A; EP1266052A1; KR20030007464A; RU2244767C2; HK1053153A1; AU775221B2; AU4080401A; WO2001068951A1; CA2403116A1; CN1425080A

Abstract

Electro plating apparatus (1) has an electro plating bath (2) containing electrolyte (3), an anode configuration immersed in electrolyte (3) being a planar anode (4) and an arcuate solid anode (5). In use, a continuous web of flexible substrate (6) (onto both side of which material is to be deposited) is passed along a transport system (7) in a direction shown by arrow (A). Transport system (7) comprises a set of rollers (8, 9) of which rollers (8) are generally cylindrical, driving rollers while rollers (9) are cathode connectors and have a number of circumferential projections (10) which ensure electrical contact with unconnected or discreet regions on substrate (6). Another electro plating apparatus (20) has a cathode connector configuration (21) with four comb electrodes (22) each having a main portion (23) with a plurality of teeth (24) each of which has end (25) inclined in the direction of the movement of the substrate.

Description

APPLIED ELECTRO APPARATUS AND A METHOD OF ELECTRO CHAPEADO The present invention relates to an electroplating apparatus and an electroplating method.

In a conventional electroplating process, the object to be plated is immersed in an electrolyte bath with, but not touching, one or more pieces of the metal to be plated. Connections are made to an electric current source in such a way that the element to be plated becomes the cathode and the metal parts at the anode. When an electric current is applied, the ions flow towards the cathode and are reduced in it to give it a cover of the metal from which the anodes are made.

In another electroplating process, described in International Patent Application No. W99 / 52336, conductive tracks are provided in a printed circuit through the use of a tool having an absorbent element containing a plating solution.

According to the present invention, an electroplated apparatus is provided which includes a cathode connector for contacting a substrate within which the material is to be deposited, wherein the cathode connector has a way of contacting at least one discrete region that is not in the main plane of the substrate.

According to the present invention, there is also provided an electroplating apparatus comprising an elongated connector cathode for movement relative to a substrate in which the material is to be deposited, the connector having a main body section lying at along the longitudinal axis of the cathode connector n and at least one projection extending away from the main body section.

In this way, the apparatus of the invention can ensure that electrical contact is maintained with portions of the substrate that would otherwise be electrically isolated from the main body of the substrate.

The present invention may include one or more of the following preferable representations: • The cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section toward a substrate location in which the material will be deposited, to contact in use a portion of the substrate.

• At least one tooth is flexibly biased to a location on a substrate where the material is to be deposited.

• Each tooth includes an inclined end portion, relative to the tooth reminder, in a direction toward a substrate location to provide flexible polarization to a location on a substrate where the material is to be deposited.

• The cathode connector includes a roller having at least one disk extending away from the roller to a location on a substrate in which the material is to be deposited, to contact in use a portion of the substrate.

• The cathode connector is made of copper, or beryllium copper, or phosphor bronze, or stainless steel, or any other material with the required electrical and mechanical properties.

• Means for passing a substrate, in which the material is to be deposited, on the cathode whose length extends over a substantial part of, or throughout, the width of the substrate.

• An electroplated bath in which the substrate is submerged by deposition of material.

• The cathode connector is located adjacent to the path of a substrate to contact the substrate, in use, before introducing the bath.

• The cathode connector is located adjacent to the path of a substrate to contact the substrate, in use, after leaving the bathroom.

• Cleaning means to remove the electrolyte from the substrate downstream of the cathode connector.

• Cleaning means to remove the electrolyte from the substrate upstream of the cathode connector.

• At least one nozzle means for directing cleaning fluids towards the substrate.

• Electroplated media for dry plating of the material inside the substrate.

• A tool with an absorbent element to contain the plating solution.

• The electrode includes a plurality of teeth or discs, one or more to electrically contact a separate region that is isolated from other regions of the substrate in the substrate.

• The spaces of the teeth or discs are adjustable along the main portion.

The present invention provides an electroplating method for depositing a material within a substrate, including the method, the application of a cathode connector to contact at least one discrete region of the substrate that is not in the main plane of the substrate. The present invention can also provide an electroplating method comprising moving an elongate cathode connector relative to a substrate in which the material is to be deposited, the connector cathode having a main body section lying along the longitudinal axis of the connector cathode and at least one projection extending away from the main body section.

The method may include one or more of the following preferable representations: • passing a substrate, into which the material is to be deposited, on the connector cathode the length of which a substantial part, or part of, or all, of the substrate width extends.

• Immerse the substrate inside which the material is to be deposited, inside a plated electrolyte bath containing electrolyte.

• Pass the substrate over the cathode connector located adjacent to the path of a substrate to contact the substrate before bathing.

• Pass the substrate over the cathode connector located adjacent to the path of a substrate to contact the substrate after leaving the bath.

• Clean the substrate downstream of the cathode connector to remove the electrolyte.

• Clean the substrate upstream of the cathode connector to remove the electrolyte.

• Carry out dry plating of the material inside a substrate.

The apparatuses or methods of the present invention, as described herein, can provide the following advantages: • Effective electroplating of isolated regions (eg not connected to others) of the substrate is ensured.

• Effective electroplating is achieved, even for highly flexible substrates.

· Effective electroplating is achieved even for substrates that have very rough surfaces.

The present invention also provides a computer program product that is loaded directly into the internal memory of a digital computer, comprising portions of software code to carry out the steps of a method of the present invention, when said product is run. in a computer.

The invention is applicable to electroplating processes which include, but are not limited to, those described above.

In order that the present invention may be more easily understood, a description is now given, by way of example only, with reference to the accompanying drawings, wherein: Figure 1 is a schematic block drawing of an electroplating apparatus depicting the present invention; Figure 2 is a schematic drawing of an alternative apparatus; Figure 3A is a detailed view of part of a conventional apparatus; Figure 3B is a detailed view of part of the apparatus of Figure 2; Figure 4 is a schematic drawing of an additional representation of apparatuses; Figure 5 is a schematic drawing of an additional representation of apparatuses.

The electroplated apparatus (1) as shown in Figure 1 comprises an electroplated bath (2) containing electrolyte (3), an anode configuration immersed in electrolyte (3), and including a planar anode (4) and a solid arc-shaped anode (5). In use, a continuous web of the flexible substrate (6) (on both sides of which the material is to be deposited) is passed along a transport system (7) in a direction shown by the arrow. The transport system (7) comprises a group of rollers (8,9) of which the rollers (8) are generally cylindrical driving rollers, while the rollers (9) are cathode connectors and have numerous circumferential projections (10). ) that ensure electrical contact with disconnected or discrete regions in the substrate (6) (despite the transport speed, the flexibility of the substrate or the roughness | of the substrate (6)).

Figure 2 shows another electroplated device (20) having a cathode connector configuration (21) with four comb electrodes (22) each of which has a main portion (23) with a plurality of teeth (24). ) each of which has an end (25) inclined in the direction of the movement of the substrate.

In each representation, the tooth (24) can be equi-spaced along the main portion (23) of the comb or it can be spaced to match the required spacing of the substrate region. The positioning of the teeth along the main portion (23) can be adjustable to accommodate any option.

Figure 3A shows the problem associated with the disconnected areas in a conventional plating bath. The internal conductive area (50) is electrically isolated from the external conductive area (51) by the non-conductive area (52) and, therefore, the internal area (50) is not electrically connected to the negative terminal (53) of the current source.

Figure 3B shows how the cathode connector (60) connects discrete areas to the negative potential and shows the use of a cathode connector (60) by means of which the substrate (61) passes over the cathode connector (60) just before entering the cathode (60). electrolyte (62). All the conductive areas in the substrate (61) are contacted by one more fingers (63) of the cathode connector (60) so that the contact is maintained up to at least 50% of the length, in the direction of travel of the substrate, passing inside the electrolyte (62). The space between the cathode connector (6C) and the electrolyte (62) causes a portion of the conductive parts of the substrate not to be plated due to loss of contact. These portions are silver when leaving the electrolyte (62), when the already veneered area makes contact with an additional cathode connector located just above the point at which the substrate leaves the electrolyte (52). The conductive area 64 on the substrate (61) is surrounded by non-conductive areas (65) but the fingers (63) of the cathode (60) still make contact to ensure electroplating occurs.

Figure 4 shows an electroplating apparatus (30) for plating a rigid substrate (31) which therefore can not be submerged in an electrolyte bath in the form of Figures 1 and 2. The apparatus (30) comprises a hollow anode (32) through the center of which the electrolyte (33) is directed towards a portion of the substrate (31) moving in the direction B and then removed along the lateral channels (34). The cathode connectors (35) are in the form of main comb portions (36) with teeth (37) to ensure that the unconnected regions of the substrate (31) are electrically connected to the cathode connectors (35) before after printing of the electrolyte (33) to ensure that there is an adequate deposit of material in all the required parts of the substrate (31).

Two cleaners (38) with nozzles (39) are provided to direct deionized water in the substrate (30) before and after contact with the cathodes (35).

In a variant, the roller (8) or the main portion (23) of the comb may have a brush instead of the projections (10), the disc or the teeth (24) to contact discrete or unconnected regions in the substrate (6) Figure 5 shows a variant of the apparatus of Figure 4 but in which both sides of the substrate (31) are plated.

Claims

CLAIMS 1. Electroplated apparatus comprising a cathode connector for contacting a substrate on which the material is to be deposited, wherein the cathode connector has means for contacting at least one discrete region that is not in the main plane of the substrate. 2. Electroplated apparatus comprising an elongate cathode connector for relative movement towards a substrate in which the material is to be deposited, the connector cathode having a main body section lying along the longitudinal axis of the cathode and at least one projection that extends away from the main body section. 3. Apparatus according to Claims 1 or 2, wherein the cathode connector comprises an element in a dependent form having an elongated body and at least one front extending away from the main body section towards a location for a substrate in which will deposit the material, to contact in use a portion of the substrate. 4. Apparatus according to Claim 3 is flexibly biased towards a location on a substrate in which the material is to be deposited. Apparatus according to Claims 3 or 4 wherein the or each tooth comprises a final inclined portion, relative to the reminder of the tooth, in a direction towards a location on the substrate to provide flexible polarization to a location on a substrate on which it goes to deposit the material. 6. Apparatus according to claim 1 or 2 wherein the cathode connector comprises a roller having at least one disk extending away from the roller toward a substrate in which the material is to be deposited, to contact in use a portion of the substrate. ~! . Apparatus according to any of the preceding claims wherein the cathode connector is formed of copper, or beryllium copper, or phosphor bronze, or stainless steel. Apparatus according to any one of the preceding claims, comprising the means for passing a substrate, in which the material is to be deposited, on the cathode connector the length of which extends a substantial part of, or touching, the width of the substrate Apparatus according to any of the preceding Claims comprising an electroplated bath in which the substrate for depositing the material is immersed. 10. Apparatus according to Claim 9 wherein the cathode connector is located adjacent the path of a substrate to contact in use to the substrate, before entering the bath. 11. Apparatus according to Claim 9 or 10 wherein the cathode connector is located adjacent the path of a substrate to contact in use the substrate after leaving the bath. Apparatus according to any of Claims 9 to 11 comprising cleaning means for removing the electrolyte from the substrate downstream of the cathode. Apparatus according to any of Claims 9 to 12 comprising cleaning means for removing the electrolyte from the substrate upstream of the cathode connector. 14. Apparatus according to any of Claims 9 to 13 comprising at least one nozzle for directing cleaning fluid to the substrate. 15. Apparatus according to any of Claims 1 to 7 comprising electroplating means for effecting dry plating of the material within a substrate. 16. Apparatus according to Claim 15 which includes a tool with an absorbent element for containing the plating solution. 17. Apparatus according to any of the preceding Claims wherein the cathode connector includes a plurality of teeth or discs, one or more for electrically contacting a separate region that is isolated from other regions of the substrate, in the substrate. 18. Apparatus according to Claim 17 wherein the space of the teeth or discs is adjustable along the main portion of the cathode. 19. Electro plating method to deposit a material within a substrate, method comprising applying a cathode connector to contact at least one discrete region of the substrate that is not in the main plane of the substrate. 20. An electroplating method comprising moving an elongate cathode connector relative to a substrate in which the material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection that extends away from the main body section. The method according to claim 19 wherein the cathode connector comprises an element in the form of a depeine having an elongate body and at least one finger extending away from the section of the main body towards a location for a substrate in which the material is to be deposited. , to contact in use a portion of the substrate. 22. A method according to claim 21 wherein at least one tooth is flexibly biased to a location on a substrate on which the material is to be deposited. 23. A method according to claim 21 or 22 wherein the or each tooth comprises an inclined end portion, relative to the tooth reminder, in a direction toward a location on the substrate to provide flexible polarization to a location on a substrate in which the material will be deposited. 24. A method according to Claim 20 wherein the cathode connector comprises a roller having at least one disk extending away from the roller toward a location for a substrate on which the material is to be deposited, to contact in use a portion of the substrate. 25. A method according to any of Claims 19 to 24 wherein the cathode is formed of copper, or beryllium copper, or phosphor bronze, or stainless steel. 26. A method according to any of Claims 19 to 25 comprising passing a substrate, in which the material is to be deposited, on the cathode connector the length of which extends a substantial part of, or all, the width of the substrate 27. A method according to any of Claims 19 to 26 comprising submerging the substrate, in which the material is to be deposited, within an electrolyte-plated electrolyte bath. 28. A method according to Claim 27 comprising passing the substrate over the cathode connector located adjacent the path of a substrate to contact the substrate before entering the bath. 29. A method according to claim 27 or 28 comprising passing the substrate over the cathode connector located adjacent the path of a substrate to contact the substrate after leaving the bath. 30. A method according to any of Claims 27 to 29 comprising cleaning the substrate downstream of the cathode connector to remove the electrolyte. 31. A method according to any of Claims 27 to 30 comprising cleaning the substrate upstream of the cathode to remove the electrolyte. 32. A method according to any of Claims 27 to 31 which comprises directing a cleaning fluid against the substrate. 33. A method according to any of Claims 19 to 26 comprising dry chamfering the material within a substrate. 34. A method according to Claim 33 comprising a tool having an absorbent element for containing the plating solution. 35. A method according to any of Claims 19 to 34 wherein the cathode connector comprises a plurality of teeth or discs, one or more to electrically contact a separate region that is isolated from other regions of the substrate, in the substrate. 36. A method according to any of Claims 19 to 35 which comprises adjusting the space of the teeth or discs along the main portion of the cathode. 37. A directly loadable computer program product within the internal memory of a digital computer, which includes portions of software code for performing the steps of a method according to any one or more of Claims 19 to 36 when said product runs in a computer. 38. Electronic distribution of a computer program as defined in Claim 37.