CN109750281B - Horizontal copper deposition device - Google Patents

Horizontal copper deposition device Download PDF

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Publication number
CN109750281B
CN109750281B CN201711085108.5A CN201711085108A CN109750281B CN 109750281 B CN109750281 B CN 109750281B CN 201711085108 A CN201711085108 A CN 201711085108A CN 109750281 B CN109750281 B CN 109750281B
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Prior art keywords
roller
roller pair
medicine
circuit board
sensor
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CN201711085108.5A
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CN109750281A (en
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董先甫
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Dongguan Tengming Intelligent Equipment Co ltd
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Dongguan Tengming Intelligent Equipment Co ltd
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Abstract

The invention discloses a horizontal copper precipitation device. The horizontal copper deposition device comprises a rectifier, an anode metal plate, a medicine tank and a roller assembly; the anode metal plate is fixed in the medicine pond; the roller assembly comprises a first roller pair and a second roller pair; the first roller pair is fixed in the medicine pond and immersed in the liquid medicine in the medicine pond, the second roller pair and the first roller pair are horizontally arranged transversely and are positioned outside the medicine pond, and the first roller pair and the second roller pair are used for pulling the circuit board to horizontally move forwards; the anode metal plate is electrically connected with the anode output end of the rectifier, and the second roller pair is electrically connected with the cathode output end of the rectifier. The circuit board passing through the horizontal copper deposition device has good backlight effect.

Description

Horizontal copper deposition device
Technical Field
The invention relates to the technical field of PCB copper deposition equipment, in particular to a horizontal copper deposition device.
Background
The copper deposition equipment of the PCB circuit board in the prior art often has poor copper deposition backlight phenomenon in the process of chemically depositing copper on the circuit board, and the circuit board with poor copper deposition ensures that the overall quality of the circuit board is not high.
Disclosure of Invention
The invention provides a horizontal copper precipitation device for solving the technical problems.
A horizontal copper precipitation device; wherein, the horizontal copper deposition device comprises a rectifier, a metal plate, a medicine tank and a roller assembly; the metal plate is fixed in the medicine pond; the roller assembly comprises a first roller pair and a second roller pair; the first roller pair is fixed in the medicine pond and immersed in the liquid medicine in the medicine pond, the second roller pair is positioned outside the medicine pond and horizontally arranged with the first roller pair transversely, and the first roller pair and the second roller pair are used for pulling the circuit board to horizontally move forwards; the metal plate is electrically connected with the anode output end of the rectifier, and the second roller pair is electrically connected with the cathode output end of the rectifier.
Preferably, the horizontal copper precipitation device further comprises a controller; the controller is fixed on the side wall of the medicine pond and is electrically connected with the control end of the rectifier.
Preferably, the first roller pair comprises a first upper roller and a first lower roller; the first upper roller is fixed above the first lower roller, and a first gap for providing a circuit board moving space is formed between the first upper roller and the first lower roller; a first sensor is arranged in the first gap.
Preferably, the second roller pair comprises a second upper roller and a second lower roller; the second upper roller is fixed above the second lower roller, and a second gap for providing a circuit board moving space is formed between the second upper roller and the second lower roller; and a second sensor is arranged in the second gap.
Preferably, the first sensor and the second sensor are both pressure sensors, and control ends of the first sensor and the second sensor are electrically connected with the controller.
Preferably, a plurality of groups of roller pairs which are horizontally arranged are arranged between the first roller pair and the second roller pair.
Preferably, the bottom of the medicine pool is vertically provided with a partition plate; the partition plate is used for isolating the medicine tank into a medicine feeding tank and a reaction tank, an overflow port is arranged on the partition plate, and the medicine feeding tank is communicated with the reaction tank through the overflow port.
Compared with the prior art, the invention has the following advantages:
the second roller pair is positioned outside the medicine pond and horizontally arranged with the first roller pair transversely, so that the circuit board can move forwards horizontally under the rolling action of the first roller pair and the second roller pair; in addition, since the metal plate is electrically connected to the anode output end of the rectifier, the second roller pair is electrically connected to the cathode output end of the rectifier; providing current through the rectifier, wherein the cathode is electrically connected with the second roller pair, the anode is electrically connected with the metal plate and is soaked in copper precipitation liquid medicine, and when the circuit board contacts the second roller pair and then contacts the copper precipitation liquid medicine, the anode and the cathode are conducted to form a loop, so that the copper precipitation is accelerated;
the overflow port arranged on the partition plate in the middle of the medicine tank of the copper deposition device can keep the liquid level in the reaction tank constant, so that the influence on the copper deposition effect caused by the change of the liquid level can be reduced;
the horizontal copper deposition device drives the circuit board into the reaction tank through the roller group, and the roller group is of an upper layer structure and a lower layer structure, so that when the circuit board passes between the upper roller and the lower roller of the roller group, the rollers squeeze the board surface of the circuit board, thereby facilitating liquid medicine to enter nonmetallic holes on the circuit board to form copper deposition, and avoiding poor backlight of the circuit board;
the rollers in the roller group are connected with the pressure sensor, so that the pressure on the surface of the circuit board can be sensed by the pressure sensor, and the distance between the upper roller and the lower roller can be adjusted according to the pressure requirement.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a horizontal copper deposition apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of a drug reservoir in an embodiment of the present invention;
fig. 3 is a schematic diagram of the connection state of the roller and the pressure sensor.
Reference numerals:
1. a rectifier; 2. the medicine pond, 21, the medicine feeding pond, 22, the reaction pond, 23, the division plate, 24 and the overflow port; 3. the roller assembly 31, the first roller pair 32, the second roller pair 33 and the pressure sensor; 4. a metal plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 3, the horizontal copper precipitation device comprises a rectifier 1, a medicine tank 2 and a roller assembly 3, wherein copper precipitation liquid medicine is arranged in the medicine tank 2, a metal plate 44 which is not electrically connected with the anode of the rectifier 1 is immersed in the copper precipitation liquid medicine, the roller assembly 3 comprises a first roller pair 31 and a second roller pair 32, and a plurality of groups of roller pairs which are horizontally arranged are arranged between the first roller pair 31 and the second roller pair 32; the first roller pair 31 is fixed in the medicine pond 2 and immersed in the liquid medicine in the medicine pond 2, the second roller pair 32 is positioned outside the medicine pond 2 and horizontally arranged with the first roller pair 31 transversely, and the first roller pair 31 and the second roller pair are used for pulling the circuit board to horizontally move forwards; in the embodiment of the present invention, the roller assembly 3 includes two rows of rollers disposed at the upper end of the medicine tank 2 and along the horizontal direction, the second roller pair 32 disposed at the forefront end of the roller assembly 3 is disposed outside the medicine tank 2 and electrically connected to the negative electrode of the rectifier 1, and the first roller pair 31 disposed at the rearmost end of the roller assembly 3 is disposed in the medicine tank 2 and immersed in the liquid medicine in the medicine tank 2; the first roller pair 31 includes a first upper roller and a first lower roller; the first upper roller is fixed above the first lower roller and is provided with a first gap for providing a circuit board moving space with the first lower roller; the first gap is provided with a first sensor; the second roller pair 32 includes a second upper roller and a second lower roller; the second upper roller is fixed above the second lower roller and is provided with a second gap for providing a circuit board moving space with the second lower roller; the second gap is provided with a second sensor; the horizontal copper precipitation device also comprises a controller (not shown); the controller is fixed on the side wall of the medicine pond 2 and is electrically connected with the control end of the rectifier, and the control ends of the first sensor and the second sensor are electrically connected with the controller; the pressure condition of the first roller pair 31 on the circuit board is detected by the first sensor, pressure data are transmitted into the controller, then the motor is controlled to drive the first upper roller and the first lower roller to move up and down, and the width of a first gap for providing a moving space of the circuit board is adjusted, so that the pressure pressed on the circuit board is adjusted, the pressure of the circuit board on the first roller pair 31 is kept constant, and the phenomenon of slipping caused by excessive pressure and pressure damage or insufficient pressure is not easy to occur; the pressure condition of the second roller pair 32 on the circuit board is detected by the second sensor, pressure data are transmitted into the controller, then the motor is controlled to drive the second upper roller and the second lower roller to move up and down, and the width of a second gap for providing a moving space of the circuit board is adjusted, so that the pressure pressed on the circuit board is adjusted, the pressure of the circuit board on the second roller pair 32 is kept constant, and the phenomenon of slipping caused by excessive pressure or insufficient pressure is not easy to occur; and the operation of the rectifier 1 can be controlled at any time through the controller, and the on-off of the rectifier 1 can be controlled at any time.
In addition, there is a division board 23 in the medicine pond 2, division board 23 will medicine pond 2 keeps apart into a medicine feeding pond 2 and a reaction pond 22, an overflow port 24 has been seted up on the division board 23, the overflow port 24 can guarantee the upper surface of the liquid medicine in the reaction pond 22 all the time with the lower extreme of overflow port 24 flushes, can guarantee the liquid level in the reaction pond 22 remains invariable.
The gap between the upper and lower rollers at the corresponding positions in the two rows of rollers is adjustable, and the first sensor and the second sensor are both pressure sensors 33, and the pressure sensors 33 can sense the pressure born by the upper and lower plate surfaces of the circuit board between the two rollers.
When the copper plating device works, the distance between the upper row of rollers and the lower row of rollers can be adjusted according to the thickness and the material of the circuit board to be plated with copper, and the pressure on the circuit board is set to be constant. The circuit board moves from the second roller pair 32 to the first roller pair 31 along the horizontal roller, and enters the reaction tank 22 to conduct the copper deposition circuit. Because in the motion of circuit board the in-process, the gyro wheel is oppressed two upper and lower surfaces of circuit board, be favorable to the copper precipitation liquid medicine to get into in the nonmetal hole on the circuit board like this to be favorable to the chemistry copper precipitation in the nonmetal hole, and then make the circuit board have good effect in a poor light.
The foregoing has outlined a detailed description of a horizontal copper precipitation apparatus according to embodiments of the present invention, wherein specific examples are provided herein to illustrate the principles and embodiments of the present invention, and the above examples are provided to assist in understanding the core idea of the present invention; also, as will be apparent to those skilled in the art in light of the present teachings, the present disclosure should not be limited to the specific embodiments and applications described herein.

Claims (4)

1. The utility model provides a horizontal copper deposition device which characterized in that: the horizontal copper deposition device comprises a rectifier, an anode metal plate, a medicine tank and a roller assembly; the anode metal plate is fixed in the medicine pond; the roller assembly comprises a first roller pair and a second roller pair; the first roller pair is fixed in the medicine pond and immersed in the liquid medicine in the medicine pond, the second roller pair and the first roller pair are horizontally arranged transversely and are positioned outside the medicine pond, and the first roller pair and the second roller pair are used for pulling the circuit board to horizontally move forwards; the anode metal plate is electrically connected with the anode output end of the rectifier, and the second roller pair is electrically connected with the cathode output end of the rectifier;
wherein:
the first roller pair comprises a first upper roller and a first lower roller; the first upper roller is fixed above the first lower roller, and a first gap for providing a circuit board moving space is formed between the first upper roller and the first lower roller; a first sensor is arranged in the first gap;
the second roller pair comprises a second upper roller and a second lower roller; the second upper roller is fixed above the second lower roller, and a second gap for providing a circuit board moving space is formed between the second upper roller and the second lower roller; a second sensor is arranged in the second gap;
and a plurality of groups of roller pairs which are horizontally arranged are also arranged between the first roller pair and the second roller pair.
2. The horizontal copper precipitation device according to claim 1, wherein: the horizontal copper precipitation device also comprises a controller; the controller is fixed on the side wall of the medicine pond and is electrically connected with the control end of the rectifier.
3. A horizontal copper precipitation device according to claim 2, wherein: the first sensor and the second sensor are pressure sensors, and the control ends of the first sensor and the second sensor are electrically connected with the controller.
4. A horizontal copper precipitation unit according to any of claims 1-3, wherein: a partition plate is vertically arranged at the bottom of the medicine tank; the partition plate is used for isolating the medicine tank into a medicine feeding tank and a reaction tank, an overflow port is arranged on the partition plate, and the medicine feeding tank is communicated with the reaction tank through the overflow port.
CN201711085108.5A 2017-11-07 2017-11-07 Horizontal copper deposition device Active CN109750281B (en)

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Application Number Priority Date Filing Date Title
CN201711085108.5A CN109750281B (en) 2017-11-07 2017-11-07 Horizontal copper deposition device

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Application Number Priority Date Filing Date Title
CN201711085108.5A CN109750281B (en) 2017-11-07 2017-11-07 Horizontal copper deposition device

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CN109750281B true CN109750281B (en) 2024-04-12

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CN114071890A (en) * 2020-08-05 2022-02-18 深南电路股份有限公司 Circuit board and copper deposition method thereof

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1048885A (en) * 1950-06-09 1953-12-24 Steel Prot Ltd Improvements to electrolytic coating installations
CN2171974Y (en) * 1993-05-17 1994-07-13 刘大富 Double-cylinder circulation printed circuit plate tin-plating trough
EP0741804A1 (en) * 1994-01-28 1996-11-13 ATOTECH Deutschland GmbH Process and device for the electrolytic metal coating or etching of articles
CN2443938Y (en) * 2000-09-26 2001-08-22 亚智科技股份有限公司 Floating type blocking mater rolling wheel
CN1425080A (en) * 2000-03-13 2003-06-18 科技发展及经营有限公司 Electro-plating apparatus and method of electro-plating
CN1631065A (en) * 2002-02-12 2005-06-22 埃托特克德国有限公司 Device and method for transporting flat workpieces in conveyorized processing lines
CN101254859A (en) * 2007-11-30 2008-09-03 无锡尚德太阳能电力有限公司 Roller train for conveying thin sheet panel and method for chemical treatment thereby
JP2010100874A (en) * 2008-10-21 2010-05-06 Nippon Steel Engineering Co Ltd Horizontal electroplating equipment
CN101985767A (en) * 2010-11-29 2011-03-16 奥特斯维能源(太仓)有限公司 Plating bath capable of realizing different deposition rates
CN202626333U (en) * 2012-04-27 2012-12-26 广州明毅电子机械有限公司 Conductive roller electroplating bath cathode conducting device
KR101317677B1 (en) * 2012-04-19 2013-10-18 (주)피엔티 Pressure regulation module of squeezing roll for electroless plating apparatus and electroless plating apparatus including the same
KR20150017998A (en) * 2013-08-08 2015-02-23 주식회사 포스코 Electric planting apparatus with horizontal cell
CN204247599U (en) * 2014-10-31 2015-04-08 镇江华印电路板有限公司 A kind of anti-etching printing ink piece-rate system for printing circuit board
CN105555050A (en) * 2016-01-08 2016-05-04 滁州嘉泰科技有限公司 Copper foil surface treatment apparatus for printed circuit board
CN106757182A (en) * 2017-01-19 2017-05-31 昆山元天电子有限公司 A kind of recycling technique of PCB surface metallic copper
CN106938363A (en) * 2017-04-21 2017-07-11 曾庆明 Roller pressure adjusting apparatus and its method
CN207525339U (en) * 2017-11-07 2018-06-22 东莞市腾明智能设备有限公司 A kind of horizontal copper precipitation unit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392773B (en) * 2009-03-06 2013-04-11 Advanced Semiconductor Eng Electro-thinning apparatus for removing excess metal on surface of substrate and removing method using the same
JP1606954S (en) * 2017-11-30 2018-06-18

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1048885A (en) * 1950-06-09 1953-12-24 Steel Prot Ltd Improvements to electrolytic coating installations
GB701574A (en) * 1950-06-09 1953-12-30 Albert Richard Norman Heath Improvements in or relating to electro-plating machines
CN2171974Y (en) * 1993-05-17 1994-07-13 刘大富 Double-cylinder circulation printed circuit plate tin-plating trough
EP0741804A1 (en) * 1994-01-28 1996-11-13 ATOTECH Deutschland GmbH Process and device for the electrolytic metal coating or etching of articles
CN1425080A (en) * 2000-03-13 2003-06-18 科技发展及经营有限公司 Electro-plating apparatus and method of electro-plating
CN2443938Y (en) * 2000-09-26 2001-08-22 亚智科技股份有限公司 Floating type blocking mater rolling wheel
CN1631065A (en) * 2002-02-12 2005-06-22 埃托特克德国有限公司 Device and method for transporting flat workpieces in conveyorized processing lines
CN101254859A (en) * 2007-11-30 2008-09-03 无锡尚德太阳能电力有限公司 Roller train for conveying thin sheet panel and method for chemical treatment thereby
JP2010100874A (en) * 2008-10-21 2010-05-06 Nippon Steel Engineering Co Ltd Horizontal electroplating equipment
CN101985767A (en) * 2010-11-29 2011-03-16 奥特斯维能源(太仓)有限公司 Plating bath capable of realizing different deposition rates
KR101317677B1 (en) * 2012-04-19 2013-10-18 (주)피엔티 Pressure regulation module of squeezing roll for electroless plating apparatus and electroless plating apparatus including the same
CN202626333U (en) * 2012-04-27 2012-12-26 广州明毅电子机械有限公司 Conductive roller electroplating bath cathode conducting device
KR20150017998A (en) * 2013-08-08 2015-02-23 주식회사 포스코 Electric planting apparatus with horizontal cell
CN204247599U (en) * 2014-10-31 2015-04-08 镇江华印电路板有限公司 A kind of anti-etching printing ink piece-rate system for printing circuit board
CN105555050A (en) * 2016-01-08 2016-05-04 滁州嘉泰科技有限公司 Copper foil surface treatment apparatus for printed circuit board
CN106757182A (en) * 2017-01-19 2017-05-31 昆山元天电子有限公司 A kind of recycling technique of PCB surface metallic copper
CN106938363A (en) * 2017-04-21 2017-07-11 曾庆明 Roller pressure adjusting apparatus and its method
CN207525339U (en) * 2017-11-07 2018-06-22 东莞市腾明智能设备有限公司 A kind of horizontal copper precipitation unit

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
化学沉铜工艺中背光失效分析及改善探讨;杨勇杰;;印制电路信息(06);全文 *
聚合物微结构滚轮压印成型设备的研制;王晓伟;刘颖;吴大鸣;许红;郑秀婷;;塑料(05);全文 *

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