WO2001068951A1 - Electro-plating apparatus and a method of electro-plating - Google Patents

Electro-plating apparatus and a method of electro-plating Download PDF

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Publication number
WO2001068951A1
WO2001068951A1 PCT/GB2001/001086 GB0101086W WO0168951A1 WO 2001068951 A1 WO2001068951 A1 WO 2001068951A1 GB 0101086 W GB0101086 W GB 0101086W WO 0168951 A1 WO0168951 A1 WO 0168951A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cathode connector
cathode
deposited
contact
Prior art date
Application number
PCT/GB2001/001086
Other languages
French (fr)
Inventor
John Michael Lowe
Original Assignee
Technology Development Associate Operations Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technology Development Associate Operations Limited filed Critical Technology Development Associate Operations Limited
Priority to AU40804/01A priority Critical patent/AU775221B2/en
Priority to BR0109301-0A priority patent/BR0109301A/en
Priority to JP2001567826A priority patent/JP2003527489A/en
Priority to EP01911882A priority patent/EP1266052A1/en
Priority to CA002403116A priority patent/CA2403116A1/en
Priority to MXPA02008976A priority patent/MXPA02008976A/en
Publication of WO2001068951A1 publication Critical patent/WO2001068951A1/en
Priority to HK03104367.4A priority patent/HK1053153A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the present invention related to electro-plating apparatus and a method of electro-plating.
  • the object to be plated is immersed in a bath of electrolyte together with, but not touching, one or more pieces of the metal with which it is to be plated. Connections are made to a source of electrical current such that the item to be plated becomes the cathode and the pieces of metal become the anode. When an electric current is supplied, ions flow towards the cathode and are reduced thereon to give a coating of the metal from which the anodes are made.
  • conductive tracks are provided on a printed circuit by use of a tool having an absorptive member carrying a plating solution.
  • electro-plating apparatus comprising a cathode connector for contact with a substrate onto which material is to be deposited, wherein the cathode connector has means to contact at least one discrete region not in the main plane of the substrate.
  • electro-plating apparatus comprising an elongate connector cathode for movement relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
  • apparatus of the invention may ensure that electrical contact is maintained with portions of the substrate which would be otherwise electrically isolated from the main body of the substrate.
  • the present invention may include any one or more of the following preferred features :-
  • the cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
  • At least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
  • each tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
  • the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
  • the cathode connector is formed of copper, or beryllium copper, or phosphor bronze, or stainless steel, or any other material with the required electrical and mechanical properties.
  • the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate before entering the bath.
  • the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate after leaving the bath.
  • electro-plating means to effect dry plating of material onto a substrate.
  • a tool having an absorptive member to carry plating solution.
  • the electrode comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
  • the present invention provides an electroplating method to deposit a material onto a substrate, the method comprising applying a cathode connector to contact with at least one discrete region of the substrate not in the main plane of the substrate.
  • the present invention may also provide an electro-plating method comprising moving an elongate cathode connector relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
  • the method may include any one or more the following preferred features:
  • the present invention also provides a computer program product directly loadable into the internal memory of digital computer, comprising software code portions for performing the steps of a method of the present invention when said product is run on a computer.
  • the invention is applicable to electro-plating processes including, but not limited to, those as described hereinabove.
  • FIG. 1 is a block schematic drawing of electro-plating apparatus embodying the present invention
  • Figure 2 is a schematic drawing of an alternative apparatus
  • Figure 3 A is a detailed view of part of a conventional apparatus
  • Figure 3B is a detailed view of part of the apparatus of Figure 2;
  • Figure 4 is a schematic drawing of a further embodiment of apparatus
  • Figure 5 is a schematic drawing of a further embodiment of apparatus.
  • Electro-plating apparatus 1 as shown in Figure 1 comprises an electroplating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 and comprising a planar anode 4 and an arcuate solid anode 5.
  • a continuous web of flexible subsfrate 6 (onto both sides of which material is to be deposited) is passed along a fransport system 7 in a direction shown by arrow A.
  • Transport system 7 comprises a set of rollers 8,9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connector and have a number of circumferential projections 10 which ensure electrical contact (in spite of the fransport speed, substrate flexibility or roughness of substrate 6) with unconnected or discrete regions on subsfrate 6.
  • Figure 2 shows another electro-plating apparatus 20 having a cathode connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement of the substrate.
  • the teeth 24 may be equi-spaced along the comb main portion 23 or they may be spaced to fit with the required region spacing of the substrate.
  • the positioning of the teeth along the main portion 23 may be adjustable to accommodate either option.
  • Figure 3A show the problem associated with disconnected areas in a conventional plating bath.
  • the inner conducting area 50 is electrically isolated from the outer conducting area 51 by the non-conducting area 52 and, therefore, the inner area 50 is not connected electrically to the negative terminal 53 of the current source.
  • FIG. 3B shows how cathode connector 60 connects discrete areas to the negative potential and shows the use of a cathode connector 60 whereby the substrate 61 passes over the cathode connector 60 just prior to entering the electrolyte 62. All conducting areas on the substrate 61 are contacted by one or more fingers 63 of the cathode connector 60 such that contact is maintained until at least 50% the length, in the direction of substrate travel, has passed into the electrolyte 62. The gap between the cathode connector 60 and the electrolyte 62 causes a portion of the conducting parts of the subsfrate not to be plated because of the loss of contact.
  • FIG. 4 shows an electro-plating apparatus 30 for plating a rigid substrate 31 which hence cannot be immersed in an electrolyte bath in the manner of Figures 1 and 2.
  • Apparatus 30 comprises a hollow anode 32 through the centre of which electrolyte 33 is directed onto a portion of substrate 31 moving in direction B and then removed along side channels 34.
  • Cathode connectors 35 are in the form of comb main portions 36 with teeth 37 to ensure that unconnected regions of substrate 31 are electrically connected to cathode connectors 35 before and after impingement of electrolyte 33 to ensure that there is adequate deposition of material onto all required parts of substrate 31.
  • Two cleaners 38 with nozzles 39 are provided to direct de-ionised water onto the substrate 30 before and after contact with cathodes 35.
  • roller 8 or main comb portion 23 may have a brush instead of projections 10, disc or teeth 24 to contact the discrete or unconnected regions on subsfrate 6.
  • Figure 5 shows a variant of the apparatus of Figure 4 but wherein both sides of substrate 31 are plated.

Abstract

Electro-plating apparatus (1) has an electro-plating bath (2) containing electrolyte (3), an anode configuration immersed in electrolyte (3) being a planar anode (4) and an arcuate solid anode (5). In use, a continuous web of flexible substrate (6) (onto both side of which material is to be deposited) is passed along a transport system (7) in a direction shown by arrow (A). Transport system (7) comprises a set of rollers (8, 9) of which rollers (8) are generally cylindrical, driving rollers while rollers (9) are cathode connectors and have a number of circumferential projections (10) which ensure electrical contact with unconnected or discreet regions on substrate (6). Another electro-plating apparatus (20) has a cathode connector configuration (21) with four comb electrodes (22) each having a main portion (23) with a plurality of teeth (24) each of which has end (25) inclined in the direction of the movement of the substrate.

Description

ELECTRO-PLATINGAPPARATUS AND A METHOD OF ELECTRO-PLATING
The present invention related to electro-plating apparatus and a method of electro-plating.
In a conventional electro-plating process, the object to be plated is immersed in a bath of electrolyte together with, but not touching, one or more pieces of the metal with which it is to be plated. Connections are made to a source of electrical current such that the item to be plated becomes the cathode and the pieces of metal become the anode. When an electric current is supplied, ions flow towards the cathode and are reduced thereon to give a coating of the metal from which the anodes are made.
In another electro-plating process, described in International Patent
Application No. W99/52336, conductive tracks are provided on a printed circuit by use of a tool having an absorptive member carrying a plating solution.
According to the present invention, there is provided electro-plating apparatus comprising a cathode connector for contact with a substrate onto which material is to be deposited, wherein the cathode connector has means to contact at least one discrete region not in the main plane of the substrate. According to the present invention, there is also provided electro-plating apparatus comprising an elongate connector cathode for movement relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
In this way, apparatus of the invention may ensure that electrical contact is maintained with portions of the substrate which would be otherwise electrically isolated from the main body of the substrate.
The present invention may include any one or more of the following preferred features :-
• the cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
• at least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
• each tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
• the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
• the cathode connector is formed of copper, or beryllium copper, or phosphor bronze, or stainless steel, or any other material with the required electrical and mechanical properties.
• means to pass a substrate, onto which material is to be deposited, over the cathode the length of which extends a substantial part of, or all, the width of the substrate.
• an electro-plating bath into which the substrate is immersed for deposition of material.
• the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate before entering the bath.
• the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate after leaving the bath.
• cleaning means to remove electrolyte from the substrate downstream of the cathode connector.
• cleaning means to remove electrolyte from the substrate upstream of the cathode connector.
• at least one nozzle means to direct cleansing fluid towards the substrate.
• electro-plating means to effect dry plating of material onto a substrate. • a tool having an absorptive member to carry plating solution.
• the electrode comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
• the teeth or discs are adjustably spaced along the main portion.
The present invention provides an electroplating method to deposit a material onto a substrate, the method comprising applying a cathode connector to contact with at least one discrete region of the substrate not in the main plane of the substrate.
The present invention may also provide an electro-plating method comprising moving an elongate cathode connector relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
The method may include any one or more the following preferred features:
• passing a substrate, onto which material is to be deposited, over the cathode connector the length of which extends a substantial or part of, or all, the width of the substrate.
• immersing the substrate, onto which material is to be deposited into an electro-plating bath containing electrolyte. • passing the substrate over the cathode connector located adjacent to the path of a substrate to contact the substrate before entering the bath.
• passing the substrate over the cathode connector located adjacent to the path of a substrate to contact with the substrate after leaving the bath.
• cleaning the substrate downstream of the cathode connector to remove electrolyte.
• cleaning the substrate upstream of the cathode connector to remove electrolyte.
• effecting dry plating of material onto a substrate.
Apparatus or methods of the present invention as described herein may provide the following advantages:-
• effective electro-plating of isolated regions (i.e. not connected with one another) of the substrate is ensured.
• effective electro-plating is achieved even for highly-flexible substrates.
• effective electro-plating is achieved even for substrates having very roughened surface.
The present invention also provides a computer program product directly loadable into the internal memory of digital computer, comprising software code portions for performing the steps of a method of the present invention when said product is run on a computer.
The invention is applicable to electro-plating processes including, but not limited to, those as described hereinabove.
In order that the present invention may more readily be understood, a description is now given, by way of example only, reference being made to the accompanying drawings, in which:-
Figure 1 is a block schematic drawing of electro-plating apparatus embodying the present invention;
Figure 2 is a schematic drawing of an alternative apparatus;
Figure 3 A is a detailed view of part of a conventional apparatus;
Figure 3B is a detailed view of part of the apparatus of Figure 2;
Figure 4 is a schematic drawing of a further embodiment of apparatus; Figure 5 is a schematic drawing of a further embodiment of apparatus.
Electro-plating apparatus 1 as shown in Figure 1 comprises an electroplating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 and comprising a planar anode 4 and an arcuate solid anode 5. In use, a continuous web of flexible subsfrate 6 (onto both sides of which material is to be deposited) is passed along a fransport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8,9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connector and have a number of circumferential projections 10 which ensure electrical contact (in spite of the fransport speed, substrate flexibility or roughness of substrate 6) with unconnected or discrete regions on subsfrate 6.
Figure 2 shows another electro-plating apparatus 20 having a cathode connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement of the substrate.
In each embodiment, the teeth 24 may be equi-spaced along the comb main portion 23 or they may be spaced to fit with the required region spacing of the substrate. The positioning of the teeth along the main portion 23 may be adjustable to accommodate either option.
Figure 3A show the problem associated with disconnected areas in a conventional plating bath. The inner conducting area 50 is electrically isolated from the outer conducting area 51 by the non-conducting area 52 and, therefore, the inner area 50 is not connected electrically to the negative terminal 53 of the current source.
Figure 3B shows how cathode connector 60 connects discrete areas to the negative potential and shows the use of a cathode connector 60 whereby the substrate 61 passes over the cathode connector 60 just prior to entering the electrolyte 62. All conducting areas on the substrate 61 are contacted by one or more fingers 63 of the cathode connector 60 such that contact is maintained until at least 50% the length, in the direction of substrate travel, has passed into the electrolyte 62. The gap between the cathode connector 60 and the electrolyte 62 causes a portion of the conducting parts of the subsfrate not to be plated because of the loss of contact. These portions are plated at the time of exit from the electrolyte 62 when the already plated area make contact with a further cathode connector situated just above the point at which the substrate exits the electrolyte 62. Conducting area 64 on substrate 61 is surrounded by non-conducting areas 65 but fingers 63 of cathode 60 still make contact to ensure electro-plating happens. Figure 4 shows an electro-plating apparatus 30 for plating a rigid substrate 31 which hence cannot be immersed in an electrolyte bath in the manner of Figures 1 and 2. Apparatus 30 comprises a hollow anode 32 through the centre of which electrolyte 33 is directed onto a portion of substrate 31 moving in direction B and then removed along side channels 34. Cathode connectors 35 are in the form of comb main portions 36 with teeth 37 to ensure that unconnected regions of substrate 31 are electrically connected to cathode connectors 35 before and after impingement of electrolyte 33 to ensure that there is adequate deposition of material onto all required parts of substrate 31.
Two cleaners 38 with nozzles 39 are provided to direct de-ionised water onto the substrate 30 before and after contact with cathodes 35.
In a variant, roller 8 or main comb portion 23 may have a brush instead of projections 10, disc or teeth 24 to contact the discrete or unconnected regions on subsfrate 6.
Figure 5 shows a variant of the apparatus of Figure 4 but wherein both sides of substrate 31 are plated.

Claims

1. Electro-plating apparatus comprising a cathode connector for contact with a substrate onto which material is to be deposited, wherein the cathode connector has means to contact at least one discrete region not in the main plane of the substrate.
2. Electro-plating apparatus comprising an elongate cathode connector for movement relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode and at least one projection which extends away from the main body section.
3. Apparatus according to Claim 1 or 2 wherein the cathode connector comprises a comb-shaped element having an elongate body and at least one tooth extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
4. Apparatus according to Claim 3 wherein the at least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
5. Apparatus according to Claim 3 or 4 wherein the or each tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
6. Apparatus according to Claim 1 or 2 wherein the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
7. Apparatus according to any preceding claim wherein the cathode connector is formed of copper, or beryllium copper, or phosphor bronze, or stainless steel.
8. Apparatus according to any preceding claim comprising means to pass a substrate, onto which material is to be deposited, over the cathode coonector the length of which extends a substantial part of, or all, the width of the substrate.
9. Apparatus according to any preceding claim comprising an electroplating bath into which the substrate is immersed for deposition of material.
10. Apparatus according to Claim 9 wherein the cathode connector is located adjacent to the path of a substrate to contact, in use, the subsfrate before entering the bath.
11. Apparatus according to Claim 9 or 10 wherein the cathode connector is located adjacent to the path of a substrate to contact, in use, the substrate after leaving the bath.
12. Apparatus according to any of Claims 9 to 11 comprising cleaning means to remove electrolyte from the subsfrate downsfream of the cathode.
13. Apparatus according to any of Claims 9 to 12 comprising cleaning means to remove electrolyte from the substrate upstream of the cathode connector.
14. Apparatus according to any of Claims 9 to 13 comprising at least one nozzle to direct cleansing fluid towards the substrate.
15. Apparatus according to any of Claims 1 to 7 comprising electroplating means to effect dry plating of material onto a substrate.
16. Apparatus according to Claim 15 comprising a tool having a absorptive member to carry plating solution.
17. Apparatus according to any preceding claim wherein the cathode connector comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
18. Apparatus according to Claim 17 wherein teeth or discs are adjustably spaced along the main portion of the cathode.
19. Electro-plating method to deposit a material onto a substrate, the method comprising applying a cathode connector to contact with at least one discrete region of the substrate not in the main plane of the substrate.
20. An electro-plating method comprising moving an elongate cathode connector relative to a substrate on which material is to be deposited, the cathode connector having a main body section lying along the longitudinal axis of the cathode connector and at least one projection which extends away from the main body section.
21. A method according to Claim 19 wherein the cathode connector comprises a comb-shaped element having an elongate body and at least one finger extending away from the main body section towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
22. A method according to Claim 21 wherein the at least one tooth is flexibly biased towards a location for a substrate on which material is to be deposited.
23. A method according to Claim 21 or 22 wherein the or each tooth comprises an end portion inclined, relative to the reminder of the tooth, in a direction towards a location of the substrate to provide flexible bias towards a location for a substrate on which material is to be deposited.
24. A method according to Claim 20 wherein the cathode connector comprises a roller having at least one disk extending away from the roller towards a location for a substrate on which material is to be deposited, to contact in use a portion of the substrate.
25. A method according to any of Claims 19 to 24 wherein the cathode is formed of copper or beryllium copper, or phosphor bronze, or stainless steel.
26. A method according to any of Claims 19 to 25 comprising passing a substrate, onto which material is to be deposited, over the cathode connector the length of which extends a substantial or part of, or all, the width of the substrate.
27. A method according to any of Claims 19 to 26 comprising immersing the subsfrate, onto which material is to be deposited, into an electro-plating bath containing electrolyte.
28. A method according to Claim 27 comprising passing the subsfrate over the cathode connector located adjacent to the path of a substrate to contact the substrate before entering the bath.
29. A method according to Claim 27 or 28 comprising passing the substrate over the cathode connector located adjacent to the path of a substrate to contact with the substrate after leaving the bath.
30. A method according to any of Claims 27 to 29 comprising cleaning the substrate downsfream of the cathode connector to remove electrolyte.
31. ' A method according to any of Claims 27 to 30 comprising cleaning the substrate upstream of the cathode to remove electrolyte.
32. A method according to any of Claims 27 to 31 comprising directing a cleansing fluid against the substrate.
33. A method according to any of Claims 19 to 26 comprising effecting dry plating of material onto a substrate.
34. A method according to Claim 33 comprising a tool having a absorptive member to carry plating solution.
35. A method according to any of Claims 19 to 34 wherein the cathode connector comprises a plurality of teeth or discs, one or more to contact electrically with a separate region which is isolated from other regions of the substrate on the substrate.
36. A method according to any of Claims 19 to 35 comprising adjusting the spacing of the teeth or discs along the main portion of the cathode.
37. A computer program product directly loadable into the internal memory of a digital computer, comprising software code portions for performing the steps of a method according to any one or more of Claims 19 to 36 when said product is run on a computer.
38. Electronic distribution of a computer program as defined in Claim
37.
PCT/GB2001/001086 2000-03-13 2001-03-13 Electro-plating apparatus and a method of electro-plating WO2001068951A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU40804/01A AU775221B2 (en) 2000-03-13 2001-03-13 Electro-plating apparatus and a method of electro-plating
BR0109301-0A BR0109301A (en) 2000-03-13 2001-03-13 Electroplating apparatus and electroplating method
JP2001567826A JP2003527489A (en) 2000-03-13 2001-03-13 Electroplating apparatus and electroplating method
EP01911882A EP1266052A1 (en) 2000-03-13 2001-03-13 Electro-plating apparatus and a method of electro-plating
CA002403116A CA2403116A1 (en) 2000-03-13 2001-03-13 Electro-plating apparatus and a method of electro-plating
MXPA02008976A MXPA02008976A (en) 2000-03-13 2001-03-13 Electro plating apparatus and a method of electro plating.
HK03104367.4A HK1053153A1 (en) 2000-03-13 2003-06-18 Electro-plating apparatus and a method of electro-plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0005883.4A GB0005883D0 (en) 2000-03-13 2000-03-13 Electro-plating apparatus and a method of electoplating
GB0005883.4 2000-03-13

Publications (1)

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WO2001068951A1 true WO2001068951A1 (en) 2001-09-20

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EP (1) EP1266052A1 (en)
JP (1) JP2003527489A (en)
KR (1) KR20030007464A (en)
CN (1) CN1425080A (en)
AU (1) AU775221B2 (en)
BR (1) BR0109301A (en)
CA (1) CA2403116A1 (en)
GB (1) GB0005883D0 (en)
HK (1) HK1053153A1 (en)
MX (1) MXPA02008976A (en)
RU (1) RU2244767C2 (en)
WO (1) WO2001068951A1 (en)

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CN105603494A (en) * 2016-01-27 2016-05-25 南通彩都新能源科技有限公司 Electrophoretic deposition system and method for preparing silicon-based anode material of lithium ion battery
CN109750281B (en) * 2017-11-07 2024-04-12 东莞市腾明智能设备有限公司 Horizontal copper deposition device
JP7113881B2 (en) * 2019-12-11 2022-08-05 エスケー ネクシリス カンパニー リミテッド Cathode assembly for plating equipment

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MXPA02008976A (en) 2004-10-14
KR20030007464A (en) 2003-01-23
RU2244767C2 (en) 2005-01-20
CN1425080A (en) 2003-06-18
EP1266052A1 (en) 2002-12-18
JP2003527489A (en) 2003-09-16
BR0109301A (en) 2002-12-24
GB0005883D0 (en) 2000-05-03
CA2403116A1 (en) 2001-09-20
AU4080401A (en) 2001-09-24

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