BR0109301A - Electroplating apparatus and electroplating method - Google Patents

Electroplating apparatus and electroplating method

Info

Publication number
BR0109301A
BR0109301A BR0109301-0A BR0109301A BR0109301A BR 0109301 A BR0109301 A BR 0109301A BR 0109301 A BR0109301 A BR 0109301A BR 0109301 A BR0109301 A BR 0109301A
Authority
BR
Brazil
Prior art keywords
cylinders
electroplating
anode
substrate
electrogalvanization
Prior art date
Application number
BR0109301-0A
Other languages
Portuguese (pt)
Inventor
John Michael Lowe
Original Assignee
Technology Dev Associate Opera
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technology Dev Associate Opera filed Critical Technology Dev Associate Opera
Publication of BR0109301A publication Critical patent/BR0109301A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

"APARELHO PARA ELETROGALVANIZAçãO E MéTODO DE ELETROGALVANIZAçãO". A presente invenção refere-se a um aparelho de eletrogalvanização (1) tem um banho do eletrogalvanização (2)contendo eletrólito (3), uma configuração de anodo imersa no eletrólito (3)sendo um anodo plano (4)e um anodo sólido arqueado (5). Em uso, uma folha metálica contínua de substrato flexível (6) (em ambos os lados do material a ser depositado) é passada ao longo do sistema de transporte (7)em uma direção mostrada pela seta (A). O sistema de transporte (7)compreende um conjunto de cilindros (8, 9), cujos cilindros (8) são geralmente cilíndricos, de acionamento, enquanto cilindros (9)são conectores de cátodo e têm um número de projeções circunferenciais (10)que garantem o contato elétrico com regiões não-conectadas, ou separadas, no substrato (6). Outro aparelho de eletrogalvanização (20)tem uma configuração de conector de cátodo (21)com quatro eletrodos em forma de pente (22), cada um tendo uma parte principal (23)com uma pluralidade de dentes (24), cada um dos quais tem uma extremidade (25)inclinada na direção do movimento do substrato."APPLIANCE FOR ELECTROGALVANIZATION AND METHOD OF ELECTROGALVANIZATION". The present invention relates to an electroplating apparatus (1) has an electroplating bath (2) containing electrolyte (3), an anode configuration immersed in the electrolyte (3) being a flat anode (4) and a solid arcuate anode (5). In use, a continuous metallic sheet of flexible substrate (6) (on both sides of the material to be deposited) is passed along the transport system (7) in a direction shown by the arrow (A). The transport system (7) comprises a set of cylinders (8, 9), whose cylinders (8) are generally cylindrical, actuating, while cylinders (9) are cathode connectors and have a number of circumferential projections (10) that guarantee electrical contact with unconnected, or separate, regions in the substrate (6). Another electroplating apparatus (20) has a cathode connector configuration (21) with four comb-shaped electrodes (22), each having a main part (23) with a plurality of teeth (24), each of which has an end (25) inclined in the direction of movement of the substrate.

BR0109301-0A 2000-03-13 2001-03-13 Electroplating apparatus and electroplating method BR0109301A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0005883.4A GB0005883D0 (en) 2000-03-13 2000-03-13 Electro-plating apparatus and a method of electoplating
PCT/GB2001/001086 WO2001068951A1 (en) 2000-03-13 2001-03-13 Electro-plating apparatus and a method of electro-plating

Publications (1)

Publication Number Publication Date
BR0109301A true BR0109301A (en) 2002-12-24

Family

ID=9887431

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0109301-0A BR0109301A (en) 2000-03-13 2001-03-13 Electroplating apparatus and electroplating method

Country Status (12)

Country Link
EP (1) EP1266052A1 (en)
JP (1) JP2003527489A (en)
KR (1) KR20030007464A (en)
CN (1) CN1425080A (en)
AU (1) AU775221B2 (en)
BR (1) BR0109301A (en)
CA (1) CA2403116A1 (en)
GB (1) GB0005883D0 (en)
HK (1) HK1053153A1 (en)
MX (1) MXPA02008976A (en)
RU (1) RU2244767C2 (en)
WO (1) WO2001068951A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4479535B2 (en) * 2005-02-21 2010-06-09 セイコーエプソン株式会社 Optical element manufacturing method
CN103603025A (en) * 2013-12-02 2014-02-26 昆山亿诚化工容器有限公司 Device for electroplating metal coiled material
CN105603494A (en) * 2016-01-27 2016-05-25 南通彩都新能源科技有限公司 Electrophoretic deposition system and method for preparing silicon-based anode material of lithium ion battery
CN109750281B (en) * 2017-11-07 2024-04-12 东莞市腾明智能设备有限公司 Horizontal copper deposition device
JP7113881B2 (en) * 2019-12-11 2022-08-05 エスケー ネクシリス カンパニー リミテッド Cathode assembly for plating equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2156981A5 (en) * 1971-10-13 1973-06-01 Honeywell Bull
DE3603856C2 (en) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Method and device for galvanizing flat workpieces such as printed circuit boards
EP0889680A3 (en) * 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Method of removing and/or applying conductive material
IT1298150B1 (en) * 1998-01-19 1999-12-20 Occleppo Di Francesco Occleppo DEVICE FOR ELECTROLYTIC DEPOSITION ON TRANSLATING METALLIC SHEETS IN SPECIES FOR PRINTED CIRCUITS, BY CLOSING A

Also Published As

Publication number Publication date
GB0005883D0 (en) 2000-05-03
MXPA02008976A (en) 2004-10-14
AU775221B2 (en) 2004-07-22
KR20030007464A (en) 2003-01-23
RU2244767C2 (en) 2005-01-20
CA2403116A1 (en) 2001-09-20
WO2001068951A1 (en) 2001-09-20
EP1266052A1 (en) 2002-12-18
CN1425080A (en) 2003-06-18
HK1053153A1 (en) 2003-10-10
JP2003527489A (en) 2003-09-16
AU4080401A (en) 2001-09-24

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: TDAO LIMITED (GB)

Free format text: ALTERADO DE: TECHNOLOGY DEVELOPMENT ASSOCIATE OPERATIONS LIMITED

B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7O E 8O ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO DA RPI 2016 DE 25/08/2009.