TWI468774B - - Google Patents
Info
- Publication number
- TWI468774B TWI468774B TW99140098A TW99140098A TWI468774B TW I468774 B TWI468774 B TW I468774B TW 99140098 A TW99140098 A TW 99140098A TW 99140098 A TW99140098 A TW 99140098A TW I468774 B TWI468774 B TW I468774B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010118981A JP5583478B2 (en) | 2010-05-25 | 2010-05-25 | Panel splitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201142409A TW201142409A (en) | 2011-12-01 |
TWI468774B true TWI468774B (en) | 2015-01-11 |
Family
ID=45006914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099140098A TW201142409A (en) | 2010-05-25 | 2010-11-19 | Panel cutting apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5583478B2 (en) |
KR (1) | KR101682441B1 (en) |
CN (1) | CN102260040B (en) |
TW (1) | TW201142409A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102879937B (en) * | 2012-10-16 | 2015-04-22 | 深圳市华星光电技术有限公司 | Sheet splitting device and method of LCD (liquid crystal display) panel |
CN105166080A (en) * | 2015-10-20 | 2015-12-23 | 周晓飞 | Bean curd skin product production process and equipment |
CN107042541A (en) * | 2017-04-19 | 2017-08-15 | 惠科股份有限公司 | Substrate cut machine and substrate cut control method |
CN107140818B (en) * | 2017-06-28 | 2020-02-14 | 重庆华瑞玻璃有限公司 | Strip-shaped glass cutting machine |
CN107129136B (en) * | 2017-06-28 | 2020-02-14 | 重庆华瑞玻璃有限公司 | Cutting device for glass |
JP7054170B2 (en) * | 2017-11-30 | 2022-04-13 | 三星ダイヤモンド工業株式会社 | Belt conveyor equipment |
KR102122427B1 (en) * | 2019-01-09 | 2020-06-12 | 한국미쯔보시다이아몬드공업(주) | Apparatus for removing edged material |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002103295A (en) * | 2000-10-02 | 2002-04-09 | Mitsuboshi Diamond Industrial Co Ltd | Fragile substrate breaking method and device therefor |
JP2008540325A (en) * | 2005-05-17 | 2008-11-20 | コーニング インコーポレイテッド | Method and apparatus for dividing a brittle material plate from a moving brittle material strip |
WO2009154022A1 (en) * | 2008-06-18 | 2009-12-23 | 三星ダイヤモンド工業株式会社 | Substrate processing system |
JP4402883B2 (en) * | 2001-01-17 | 2010-01-20 | 三星ダイヤモンド工業株式会社 | Dividing device, dividing system and dividing method |
TW201004879A (en) * | 2008-07-18 | 2010-02-01 | Shiraitekku Kk | Cutting device for liquid crystal panel |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4892916B2 (en) * | 2005-10-04 | 2012-03-07 | セントラル硝子株式会社 | Thin glass folding device and folding method |
KR100596130B1 (en) * | 2006-02-06 | 2006-07-03 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate of flat panel display |
JP4803220B2 (en) * | 2008-08-11 | 2011-10-26 | 坂東機工株式会社 | Glass plate processing equipment |
-
2010
- 2010-05-25 JP JP2010118981A patent/JP5583478B2/en not_active Expired - Fee Related
- 2010-06-30 KR KR1020100062563A patent/KR101682441B1/en active IP Right Grant
- 2010-11-19 CN CN201010554655.5A patent/CN102260040B/en active Active
- 2010-11-19 TW TW099140098A patent/TW201142409A/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002103295A (en) * | 2000-10-02 | 2002-04-09 | Mitsuboshi Diamond Industrial Co Ltd | Fragile substrate breaking method and device therefor |
JP4402883B2 (en) * | 2001-01-17 | 2010-01-20 | 三星ダイヤモンド工業株式会社 | Dividing device, dividing system and dividing method |
JP2008540325A (en) * | 2005-05-17 | 2008-11-20 | コーニング インコーポレイテッド | Method and apparatus for dividing a brittle material plate from a moving brittle material strip |
WO2009154022A1 (en) * | 2008-06-18 | 2009-12-23 | 三星ダイヤモンド工業株式会社 | Substrate processing system |
TW201004879A (en) * | 2008-07-18 | 2010-02-01 | Shiraitekku Kk | Cutting device for liquid crystal panel |
Non-Patent Citations (1)
Title |
---|
A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102260040A (en) | 2011-11-30 |
TW201142409A (en) | 2011-12-01 |
KR101682441B1 (en) | 2016-12-05 |
KR20110129319A (en) | 2011-12-01 |
CN102260040B (en) | 2015-04-08 |
JP2011247972A (en) | 2011-12-08 |
JP5583478B2 (en) | 2014-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |