JP2002103295A5 - - Google Patents

Description

[0004]
FIG. 2 shows a breaking method for a bonded glass substrate such as a liquid crystal panel.
1. In the scribing apparatus 1 ' , scribing is performed on the surface A of the bonded glass substrate 3' (in the figure, the surface A is the upper glass substrate) ( FIG. 2a ) .
2. Next, in the breaking apparatus 5 ' , the break bar 8 is pressed against the B surface of the inverted bonded glass substrate to break the lower A surface ( FIG. 2b ) .
3. A glass substrate 3 bonded 'was transferred to a second scribing device 1 "(or the scribing device 1' back to) is scribed with respect to B side (relationships forming a terminal on one end of the glass edge in the liquid crystal panel Furthermore, the scribing position the a side and the B side are shifted from each other (Figure 2c)).
4. Next, in the second breaking device 5 " (or the above breaking device 5 ' ), the break bar 8 is pressed against the A surface of the laminated glass substrate 3' which has been reversed again to break the lower B surface ( Figure 2d ) .

[0005]
[Problems to be solved by the invention]
However, as described above, when transporting the scribed brittle substrate 3 from the scribing apparatus to the breaking apparatus , the reversing process of the brittle substrate 3 is indispensable. In order to perform the inversion, as shown in FIG. 3 ( a ) , the scribed brittle substrate 3 is temporarily placed on another mounting base 11 or the like by the robot arm 10 or the like, and then the brittle substrate 3 as shown in FIG. 3 ( b ) . This time, the robot arm 10 lifts it from below (that is, changes its position) and sets it on the table 6 of the breaking apparatus as shown in FIG. 3 ( c ) . Therefore, not only such a reversing mechanism is required, but also the working efficiency is low.
In addition, the system has become large in size and expensive because the deviating apparatus conventionally requires its own dedicated reversing device for scribing and breaking.

[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 4 shows an assembled view of the break bar 25 used in the breaking method of the present invention. As shown in the upper drawing, a columnar rectangular parallelepiped 21 made of an aluminum material is used. The dimension is made into any value of length 300 mm-1000 mm, width 10 mm-30 mm, and thickness 10 mm-50 mm according to a process object. A groove 21 a having a width of 6 mm and a depth of 0.5 mm is formed in the longitudinal axis direction of the rectangular parallelepiped 21 at the center of the upper surface of the columnar rectangular parallelepiped 21.

[0009]
Next, as shown in the middle view, partition pieces 22 of four elastic bodies in total are embedded at both ends of the groove 21a and at a predetermined length inside from both ends. The thickness of each of the partition pieces 22 is the same as the depth of the groove 21a. The groove 21 a is divided into three sections in the longitudinal axis direction of the rectangular parallelepiped 21 by these partition pieces 22. Suction holes 23 penetrating from the bottom of the groove in each of the sections to the lower surface of the columnar rectangular parallelepiped 21 are respectively formed.

[0010]
Then, as shown in the lower drawing, a suction sheet 24 of 5 mm in thickness made of an elastic body is joined to the upper surface of the columnar rectangular parallelepiped 21. Thereby, three closed sections are formed in the above-mentioned groove 21a. Then, formed in correspondence between these three closed section, a cut eye 24a penetrating from the upper surface of the suction sheet 24 on the lower surface between the respective closed interval. Thus, the break bar 25 is obtained. Here, the incisions 24a are formed to be divided into three corresponding to the three closed sections, but it is also possible to use one continuous incision.

[0014]
Although the closed interval of FIG. 4 the blanking Reikuba has described the case of three, as 4-20 a closed interval, in accordance with the cutting conditions of the brittle material, it is desirable to individually control the vacuum pressure of the individual sections.

[0015]
FIG. 7 shows a vertical section at the location of the plug 26 of FIG. 5 (also in FIG. 6). Substantially match the line of the cut-th 24a the scribe line S of the brittle substrate 3. Here, it should be noted that the scribe line S is not on the lower surface of the brittle substrate 3 but on the upper surface, and no cushion sheet is required between the brittle substrate 3 and the table 6.

[0016]
Next, as shown in FIG. 8, when vacuum drawing is performed from the plug 26, the suction sheet 24 is slightly deformed in an inverted V shape, and the brittle substrate 3 is also deformed accordingly, and the scribe line S is formed by this deformation. Cracks grow downward and the brittle substrate 3 is divided. The reason for forming the cut eye 24a in the suction sheet 24, as shown in FIG. 7, in a state in which contact break bar 25 in the brittle substrate 3 under its own weight, remains in the gap portion existing slightly at the joint surface of both By suctioning air, the suction force between the two is increased. Instead of the cut-th 24a, it may be provided in a row of small holes, also, as the case is good adhesion between the brittle substrate 3 and the suction sheet 24 can be expected almost without provided with such cuts Suction can be obtained.

[0018]
An air cylinder 32 is provided at the center of the top plate 31a, and the lower end portion of the cylinder shaft 33 facing downward from the air cylinder 32 supports the break bar 25 at the center portion of the upper surface. The driving of the air cylinder 32 moves the break bar 25 up and down, but as shown in the partially enlarged view, the locking piece 34 fixed to the cylinder shaft 33 so that the break bar 25 does not collide with the brittle substrate 3 at the time of lowering. From an L-shaped stopper 35 fixed at one end to the top plate 31a and a screw 36 screwed into a screw hole provided in the locking piece 34 and having a lower end abutted from above on the horizontal part of the stopper 35 And a stopper mechanism 37. The descent position of the break bar 25 is adjusted according to the thickness of the glass plate 3 by turning the screw 36 through a hole Q provided in the top plate 31 a with a screw driver or the like. In place of the stopper mechanism 37, an appropriate braking mechanism may be provided so that the break bar 25 can be lowered gently.

[0020]
The vacuum pressure at the time of vacuum suction can be adjusted in the range of −1.33 × 10 ² Pa (−1 mmHg) to −8.64 × 10 ⁴ Pa (−650 mmHg) in gauge pressure, while the brittle substrate 3 is The vacuum pressure for suctioning and fixing on the table 6 was −1.33 × 10 ² Pa (−1 mmHg) or less in gauge pressure, and the suction hole formed on the table 6 was φ2 mm. If the vacuum pressure for fixing the glass plate is smaller (closer to the atmospheric pressure) than the vacuum pressure for breaking, even if the suction hole is located immediately below the scribe line, there is no problem in breaking.

[0030]
The bonded glass substrate 3 'on which the A surface is scribed and broken is set on the table of the second scribing and breaking apparatus SB2 after reversing the front and back (when configuring the system with only the scribing and breaking apparatus SB1) Return to the scribing and breaking apparatus SB1). Then, scribing and breaking are performed on the B surface located on the upper side, and the substrate is carried out to the next process.

[0031]
In order to completely separate a single plate brittle substrate and a bonded brittle substrate, a plurality of breaking devices are required depending on the conditions of the dividing conditions and the production method of the next process. For example, in a brittle substrate break the veneer, in a second direction break with Blake and 90 ° angle on the same plane in the first direction and the brittle substrate in a first direction, each individual of the present invention Use a break device. When the bonded brittle substrate is divided into strips and sent to the next process, the breaking apparatus of the present invention is used individually for the front and back surfaces of the brittle substrate until it is sent to the next process.

Brief Description of the Drawings
FIG. 1 is a view showing a conventional scribing and breaking on a single-plate brittle substrate. FIG. 2 is a view showing a conventional scribing and breaking on a laminated glass substrate. FIG. 4 is an assembly view of the break bar according to the present invention. FIG. 5 is a view showing the break bar of FIG. 4 in the break state. FIG. 6 is a view of the break when the size of the brittle substrate is small. [FIG. 7] A longitudinal sectional view of the plug of FIG. 5 [FIG. 8] A diagram showing a state at the time of a break in FIG. 5 [FIG. 9] One embodiment of a breaking apparatus employing the above break bar FIG. 10 is a system diagram of processing of a brittle substrate constructed using the above breaking apparatus. FIG. 11 is one example of a scribing and breaking apparatus having the breaking mechanism of FIG. 9 in a conventional scribing apparatus. Figure perspective showing the configuration [12] system diagram of processing of the brittle substrate constituted by using the above-described scribing and breaking apparatus [Description of symbols]
3 brittle substrate 6 table 21a groove ( closed space forming means )
22 partition pieces ( closing and sealing members, partition members )
23 suction hole 24 suction sheet ( closed space forming means )
24a nick 25 break bar 26 plug 30 break device 31 bridge 32 air cylinder 33 cylinder shaft 34 locking piece 35 stopper 36 screw 37 stopper mechanism 40 scribe and break device 41 bridge 42 guide bar 43 scribe head 44 holder support 45 cutter wheel tip 46 Tip holder S scribe line

Claims (20)

A closed space is formed covering a substrate surface area of a predetermined width including the scribe line formed on the surface of the brittle substrate substantially at the center, and the brittle substrate is bent in a reverse V shape and broken by depressurizing the closed space. What is claimed is: 1. A method of dividing a brittle substrate comprising the step of breaking . The method for dividing a brittle substrate according to claim 1, wherein the closed space comprises a plurality of regions airtightly separated from one another and breaking the brittle substrate by depressurizing at least one region. A scribing step of forming a scribing line on a brittle substrate;
  A method for dividing a brittle substrate comprising the breaking step according to claim 1 or 2. The brittle substrate is a bonded substrate obtained by bonding a first brittle substrate and a second brittle substrate.
A first parting process for performing the steps of scribing and breaking the first brittle substrate of the bonded substrate;
A reverse transfer step of reversely transferring the front and back of the bonded substrate;
And a second dividing step including the steps of scribing and breaking the second brittle substrate of the bonded substrate,
The breaking process according to claim 1 or 2 is used for said 1st division process and said 2nd division process, The division method of the brittle substrate characterized by the above-mentioned. A closed space forming means for forming a closed space covering a substrate surface area of a predetermined width including, in the approximate center, a scribe line formed on the surface of the brittle substrate;
A vacuum pump for decompressing the closed space;
A breaking mechanism for a brittle substrate, comprising breaking means for causing the brittle substrate to be bent in an inverted V shape by breaking the pressure in the closed space by the vacuum pump. The brittle substrate breaking mechanism according to claim 5, wherein the closed space forming means comprises a concave groove formed in a direction along the scribe line, and a sealing member embedded at both ends of the groove. The break of the brittle substrate according to claim 6, wherein the groove is divided by a partition member for airtightly dividing each other, and comprises a plurality of regions which can be depressurized individually together with the sealing member. mechanism. The breaking mechanism of a brittle substrate according to claim 6 or 7, wherein a suction sheet of an elastic body is attached to one surface on the contact surface of the closed space forming means with the brittle substrate. 9. The brittle substrate breaking mechanism according to claim 8, wherein the suction sheet has a cut penetrating in a thickness direction of the suction sheet in a direction along a scribing line. 9. The brittle substrate breaking mechanism according to claim 8, wherein the suction sheet has a cut penetrating in a thickness direction of the suction sheet for each of a plurality of areas which can be depressurized individually in the groove. . The incisions formed in the suction sheet are small holes penetrating in the thickness direction of the suction sheet, and are formed in line in a direction along the scribing line. Brittle substrate break mechanism. At least one scribing means for forming a scribing line on the brittle substrate;
  And at least one breaking mechanism for breaking the brittle substrate,
  The apparatus for dividing a brittle substrate according to any one of claims 5 to 11, wherein the breaking mechanism is the mechanism for breaking a brittle substrate according to any one of claims 5 to 11. A dividing system for dividing a brittle substrate made of a single plate,
  A scribing mechanism for performing scribing on the brittle substrate;
And a break mechanism for performing a break on the fragile substrate on which the scribing is performed;
The scribing mechanism unit and the breaking mechanism unit consist of independent devices, respectively. After the scribing mechanism unit performs scribing on the brittle substrate, the breaking mechanism unit performs breaking on the same surface of the brittle substrate A break system for a brittle substrate using the breaking mechanism according to any one of claims 5 to 11, configured to: A dividing system for dividing a brittle substrate made of a single plate,
A scribing mechanism for performing scribing on the brittle substrate;
  And a break mechanism for performing a break on the fragile substrate on which the scribing is performed;
The scribing mechanism portion and the breaking mechanism portion are composed of a dividing device incorporated in one device, and after the scribing mechanism portion of the dividing device performs scribing on the brittle substrate, the breaking mechanism portion has the same surface of the brittle substrate A break system for a brittle substrate using a breaking mechanism according to any one of claims 5 to 11, configured to perform a breaking against. A scribing mechanism and a breaking mechanism, each of which is an independent device;
The parting system for parting a brittle substrate consisting of a single plate according to claim 13 or 14, wherein the scribing mechanism part and the breaking part are selectively combined with a parting apparatus incorporated in one apparatus. A division system for dividing a bonded substrate obtained by bonding a first brittle substrate and a second brittle substrate,
A scribing mechanism for performing scribing on the brittle substrate;
A break mechanism unit for performing a break on the brittle substrate subjected to scribing;
Reverse transport means for reversing the front and back of the brittle substrate for transport;
The scribing mechanism portion and the breaking mechanism portion consist of independent devices respectively, and after the scribing mechanism portion performs scribing on the first surface of the brittle substrate, the breaking mechanism portion performs the first process of the brittle substrate After a break is performed on the surface, the break is reversed, and the scribing mechanism performs scribing on the second surface of the brittle substrate, and then the breaking mechanism on the second surface of the brittle substrate A break system for a brittle substrate using a breaking mechanism according to any one of claims 5 to 11, configured to perform a break. A division system for dividing a bonded substrate obtained by bonding a first brittle substrate and a second brittle substrate,
A first scribing mechanism for performing scribing on the brittle substrate;
A first breaking mechanism for performing a break on the brittle substrate subjected to scribing;
Reverse transport means for reversing the front and back of the brittle substrate for transport;
The first scribing mechanism portion and the first breaking mechanism portion consist of independent devices respectively, and at least one of the first scribing mechanism portion and the first breaking mechanism portion is a second scribing mechanism portion Or equipped with a second break mechanism,
After performing scribing on the first surface of the brittle substrate in the first scribing mechanism, breaking is performed on the first surface of the brittle substrate in the first breaking mechanism, and then reversing is performed. Then, when scribing and breaking the second surface of the brittle substrate, the second scribing mechanism and the second breaking mechanism, the first scribing mechanism and the second breaking mechanism, or The breaking mechanism according to any one of claims 5 to 11, wherein any one of the configurations of the second scribing mechanism and the first breaking mechanism can be used. Fragmentation system of brittle substrate using. A division system for dividing a bonded substrate obtained by bonding a first brittle substrate and a second brittle substrate,
A scribing mechanism for performing scribing on the brittle substrate;
A break mechanism unit for performing a break on the brittle substrate subjected to scribing;
Reverse transport means for reversing the front and back of the brittle substrate for transport;
The scribing mechanism portion and the breaking mechanism portion are composed of a dividing device incorporated in one device, and after the scribing mechanism portion of the dividing device scribes the first surface of the brittle substrate, the breaking mechanism portion performs the scribing. A break is performed on the first surface of the brittle substrate and then inverted, and a scribing mechanism of the cutting device performs the scribing on the second surface of the brittle substrate, and then the breaking mechanism of the cutting device The system for dividing a brittle substrate using a breaking mechanism according to any one of claims 5 to 11, wherein the breaking mechanism is configured to perform a breaking on the second surface of the brittle substrate in a part. A division system for dividing a bonded substrate obtained by bonding a first brittle substrate and a second brittle substrate,
A scribing mechanism for performing scribing on the brittle substrate;
A break mechanism unit for performing a break on the brittle substrate subjected to scribing;
Reverse transport means for reversing the front and back of the brittle substrate for transport;
A first dividing device and a second dividing device in which the scribing mechanism and the breaking mechanism are incorporated into one device;
After performing scribing on the first surface of the brittle substrate in the scribing mechanism of the first dividing device, after performing breaking on the first surface of the brittle substrate in the first breaking mechanism The breaking mechanism according to any one of claims 5 to 11, wherein the breaking mechanism according to any one of claims 5 to 11 is configured to reverse, and to perform breaking on the second surface of the brittle substrate in a breaking mechanism part of the second dividing device. Fragmentation system for brittle substrate used. A scribing mechanism and a breaking mechanism, each of which is an independent device;
20. The first brittleness according to any one of claims 16 to 19, wherein the scribing mechanism portion and the breaking mechanism portion are configured by selectively arranging at least one dividing device incorporated in one device. A cutting system for cutting a substrate obtained by bonding a substrate and a second brittle substrate.

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