TWI698319B - Substrate breaking device and substrate breaking method - Google Patents
Substrate breaking device and substrate breaking method Download PDFInfo
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- TWI698319B TWI698319B TW105111475A TW105111475A TWI698319B TW I698319 B TWI698319 B TW I698319B TW 105111475 A TW105111475 A TW 105111475A TW 105111475 A TW105111475 A TW 105111475A TW I698319 B TWI698319 B TW I698319B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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Abstract
在貼合基板之分斷時,壓入量之最佳範圍較大,能確實地形成 良好之裂縫,且能容易地除去端材。 When the bonding substrate is broken, the optimal range of the press-in amount is large, and it can be formed reliably Good cracks, and the end material can be easily removed.
此裝置係貼合基板G之分斷裝置,該貼合基板G具有於表 面形成有用於將端部切離之刻劃線S之第1基板G1、以及貼合於第1基板G1之背面之第2基板G2。該分斷裝置具備按壓部11以及吸附部12。按壓部11自第1基板G1側按壓成為端材之端部GL,以沿刻劃線S將端部GL分斷。吸附部12吸附以按壓部11分斷之端部GL,以自第1基板G1取出端部GL。 This device is a cutting device for the bonded substrate G. The bonded substrate G is shown in the table The surface is formed with the first substrate G1 of the scribe line S for cutting off the end, and the second substrate G2 bonded to the back surface of the first substrate G1. This breaking device includes a pressing part 11 and a suction part 12. The pressing portion 11 presses the end portion GL that becomes the end material from the side of the first substrate G1 to divide the end portion GL along the scribe line S. The suction part 12 sucks the end part GL divided by the pressing part 11 to take out the end part GL from the first substrate G1.
Description
本發明係關於一種基板分斷裝置,特別係關於一種貼合基板之分斷裝置,該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於該第1基板之背面之第2基板。此外,本發明係關於一種基板分斷方法。 The present invention relates to a substrate cutting device, and more particularly to a cutting device of a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and is bonded to The second substrate on the back of the first substrate. In addition, the present invention relates to a substrate breaking method.
液晶裝置係藉由貼合基板構成,該貼合基板係以使液晶層介於其間之方式以密封材貼合第1基板與第2基板而成者。該貼合基板以生產性觀點來看,首先被製作成大片狀態,再藉由將其分斷得到複數個貼合基板。若詳細說明此分斷方法,則係先於貼合基板之第1基板側之面形成刻劃線,接著自第2基板側按壓貼合基板使其彎曲,進而使第1基板沿刻劃線裂斷。而後於貼合基板之第2基板側之面形成刻劃線,接著自第1基板側按壓貼合基板使其彎曲,進而使第2基板沿刻劃線裂斷。 The liquid crystal device is composed of a bonded substrate that is formed by bonding a first substrate and a second substrate with a sealing material with a liquid crystal layer interposed therebetween. From the viewpoint of productivity, the laminated substrate is first produced in a large-sized state, and then divided to obtain a plurality of laminated substrates. To describe this method in detail, the scribe line is formed on the first substrate side surface of the bonded substrate, and then the bonded substrate is pressed from the second substrate side to bend it, and then the first substrate is along the scribe line Cracked. Then, a scribe line is formed on the surface of the second substrate side of the bonded substrate, and then the bonded substrate is pressed from the first substrate side to bend it, and the second substrate is broken along the scribe line.
於以上方法中,在裂斷第1基板後,需要使貼合基板之表背面反轉,再進行第2基板之裂斷。專利文獻1中揭示了一種不需像這樣使貼合基板之表背面反轉之裝置。
In the above method, after the first substrate is fractured, the front and back surfaces of the bonded substrate need to be reversed, and then the second substrate is fractured.
專利文獻1之裝置具備第1裂斷單元及第2裂斷單元。並且,藉由搬送單元搬送之貼合基板,首先藉由第1裂斷單元裂斷第1基板,接著藉由第2裂斷單元裂斷第2基板。如此,藉由並列配置於搬送方向之
第1裂斷單元及第2裂斷單元,不需使貼合基板之表背面反轉,即能裂斷第1基板及第2基板。
The device of
[專利文獻1]日本特開2014-200940號公報。 [Patent Document 1] JP 2014-200940 A.
於專利文獻1之裝置中,第1裂斷單元及第2裂斷單元在上下方向之對向位置具有裂斷棒與備用棒。然而,於此種使用裂斷棒與備用棒之方法中,裂斷棒之壓入量之最佳範圍狹小。例如,於厚度為0.2mm之玻璃基板中,最佳壓入量為0.2mm~0.3mm。並且,若壓入量較此範圍淺,則不會形成裂縫,反之若較深,則有非預期形狀之裂縫形成至相反側之基板為止之情況。
In the device of
本發明之課題在於,在貼合基板之分斷時,壓入量之最佳範圍較大,能確實地形成良好之裂縫,且能容易地除去端材。 The subject of the present invention is that the optimum range of the press-in amount is large when the bonded substrate is broken, good cracks can be formed reliably, and the end material can be easily removed.
(1)本發明一方面提供一種基板分斷裝置,其係貼合基板之分斷裝置,該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於該第1基板之背面之第2基板。該分斷裝置具備按壓部以及吸附部。按壓部自第1基板側按壓端部,以沿刻劃線將端部分斷。吸附部吸附以按壓部分斷之端部,以自第1基板取出端部。 (1) One aspect of the present invention provides a substrate cutting device, which is a cutting device for a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and a sticker The second substrate that fits on the back of the first substrate. The breaking device includes a pressing part and a suction part. The pressing portion presses the end portion from the side of the first substrate to break the end portion along the scribe line. The suction part sucks and presses the partially broken end to take out the end from the first substrate.
此裝置,並非如現有技術般自與形成有刻劃線之側相反之側進行按壓,反之係自形成有刻劃線之側按壓基板。並且,利用吸附部吸附藉由按壓而分斷之端部,並自基板取出。 This device does not press from the side opposite to the side on which the scribe line is formed as in the prior art, but instead presses the substrate from the side where the scribe line is formed. In addition, the end portion broken by pressing is adsorbed by the suction portion, and taken out from the substrate.
藉由此種分斷,與現有技術相比,壓入量之最佳範圍較大,能確實地形成良好之裂縫。此外,藉由吸附部,能容易地自基板除去已分斷之端部。 With this breaking, compared with the prior art, the optimum range of the press-in amount is larger, and a good crack can be formed reliably. In addition, with the suction part, the divided end can be easily removed from the substrate.
(2)較佳為,該裝置更具備載置有貼合基板之載台、以及能相對於載台往水平方向及上下方向相對移動之頭部。並且,按壓部及吸附部配置於頭部。於此,按壓部及吸附部係作為一體設於頭部,因此可使裝置小型化。 (2) Preferably, the device further includes a stage on which the laminated substrate is placed, and a head that can move relative to the stage in the horizontal and vertical directions. In addition, the pressing part and the suction part are arranged on the head. Here, the pressing part and the suction part are integrally provided on the head, so the device can be miniaturized.
(3)較佳為,貼合基板係以刻劃線位於較載台之端部更外側之方式載置於載台上。於此,藉由以按壓部按壓端部,能沿刻劃線容易地進行分斷。 (3) Preferably, the bonded substrate is placed on the carrier in such a way that the scribe line is located outside the end of the carrier. Here, by pressing the end portion with the pressing portion, it can be easily broken along the scribe line.
(4)較佳為,按壓部具有按壓端部之按壓面,吸附部具有形成為較按壓面往貼合基板側突出且吸附端部之吸附面。 (4) Preferably, the pressing portion has a pressing surface that presses the end portion, and the suction portion has a suction surface formed to protrude toward the bonding substrate side from the pressing surface and suck the end portion.
於此,若將按壓部之按壓面與吸附部之吸附面設定為相同高度(亦即同一平面),則在以吸附部吸附已分斷之端部時,按壓部會與基板之其他部分之表面接觸。此時,按壓部所接觸之基板表面有損傷之虞。 Here, if the pressing surface of the pressing part and the suction surface of the suction part are set to the same height (that is, the same plane), when the divided end is sucked by the suction part, the pressing part will be in contact with other parts of the substrate. Surface contact. At this time, the surface of the substrate contacted by the pressing portion may be damaged.
據此,與按壓面相比,使吸附面較為突出。如此,在藉由吸附部之吸附面吸附端部時,能避免按壓部之按壓面碰到基板表面。 According to this, the suction surface is made more protruding than the pressing surface. In this way, when the end portion is sucked by the suction surface of the suction portion, the pressing surface of the pressing portion can be prevented from touching the surface of the substrate.
(5)較佳為,按壓部係由按壓端部時能彈性變形之彈性構件形成。 (5) Preferably, the pressing portion is formed of an elastic member that can elastically deform when the end portion is pressed.
(6)較佳為,吸附部係由多孔介質材料形成。 (6) Preferably, the adsorption part is formed of a porous medium material.
(7)本發明一方面提供一種基板分斷方法,其係貼合基板之分斷方法,該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於該第1基板之背面之第2基板。並且,該方法包括以下步驟。 (7) One aspect of the present invention provides a substrate cutting method, which is a method of cutting a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and a bonded substrate. The second substrate that fits on the back of the first substrate. And, the method includes the following steps.
a:以使第1基板位於上方,且刻劃線位於較載台之端部更外側之方式將貼合基板載置於載台上之步驟。 a: The step of placing the bonded substrate on the stage in such a way that the first substrate is located above and the scribe line is located more outside than the end of the stage.
b:自上方按壓第1基板之端部,以沿刻劃線將端部分斷之步驟。 b: A step of pressing the end of the first substrate from above to break the end along the scribe line.
c:吸附以按壓部分斷之端部,自第1基板取出端部之步驟。 c: A step of sucking to press the partially broken end and removing the end from the first substrate.
如上所述之本發明,在貼合基板之分斷時,壓入量之最佳範圍較大,能確實地形成良好之裂縫,且能容易地除去端材。 In the present invention as described above, the optimum range of the press-in amount is large when the bonded substrate is broken, a good crack can be formed reliably, and the end material can be easily removed.
1‧‧‧頭部 1‧‧‧Head
2‧‧‧載台 2‧‧‧ Stage
11‧‧‧按壓部 11‧‧‧Pressing part
11a‧‧‧按壓面 11a‧‧‧Pressing surface
12‧‧‧吸附部 12‧‧‧Adsorption part
12a‧‧‧吸附面 12a‧‧‧Adsorption surface
G‧‧‧貼合基板 G‧‧‧Laminated substrate
G1‧‧‧第1基板 G1‧‧‧First substrate
G2‧‧‧第2基板 G2‧‧‧Second substrate
GL‧‧‧端材 GL‧‧‧End Material
S‧‧‧刻劃線 S‧‧‧Scribe
圖1係本發明一實施形態之基板分斷裝置之示意圖。 Fig. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention.
圖2係用以說明基板分斷方法之按壓步驟之示意圖。 Fig. 2 is a schematic diagram for explaining the pressing step of the substrate breaking method.
圖3係用以說明基板分斷方法之基板移動步驟之示意圖。 Fig. 3 is a schematic diagram for explaining the substrate moving step of the substrate breaking method.
圖4係用以說明基板分斷方法之吸附步驟之示意圖。 Fig. 4 is a schematic diagram for explaining the adsorption step of the substrate breaking method.
圖5係用以說明基板分斷方法之端材取出步驟之示意圖。 Fig. 5 is a schematic diagram for explaining the end material removal step of the substrate breaking method.
圖6係用以說明基板分斷方法之端材排出步驟之示意圖。 Fig. 6 is a schematic diagram for explaining the end material discharge step of the substrate breaking method.
圖1係本發明一實施形態之基板分斷裝置之示意圖。此裝置係用於除去位於貼合基板G之一方表面之端部之端材GL之裝置。貼合基板G如圖1所示,由第1基板G1、以及貼合於第1基板G1之第2基板G2構成。於此,於第1基板G1之表面形成有刻劃線S,端材GL沿此刻劃線S被除去。 Fig. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention. This device is used to remove the end material GL located at the end of one surface of the bonded substrate G. As shown in FIG. 1, the bonded substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the first substrate G1. Here, a scribe line S is formed on the surface of the first substrate G1, and the end material GL is removed along the scribe line S.
分斷裝置具有複數個頭部1、以及載台2。複數個頭部1於圖1之紙面垂直方向並列支撐於未圖示之門架等支撐機構。各頭部1藉由驅動機構M1而昇降自如,且具有按壓部11、以及吸附部12。載台2以第1基板G1位於上方之方式載置有貼合基板G。又,貼合基板G係以端材GL位於較載台2之端面更外側之方式,即端材GL之下方不存在載台2之載置面之方式配置。載台2藉由包含驅動馬達或導引機構等之驅動機構M2而能移動於圖1之左右方向。
The breaking device has a plurality of
頭部1之按壓部11對貼合基板G,自第1基板G1側按壓端材GL。藉此,端材GL沿刻劃線S被分斷。按壓部11由剛性較第1基板G1低之樹脂等形成。因此,按壓部11在按壓端材GL時能彈性變形。
The
吸附部12配置於按壓部11之側方(沿載台2之移動方向之側方)。吸附部12由多孔介質材料形成,透過設於頭部1內部之通路等及外部配管3連接於真空泵P。
The
按壓部11之下面成為與端材GL接觸並往下方按壓之按壓面11a。又,吸附部12之下面形成為較按壓面11a往下方(第1基板G1側)突出,且成為吸附端材GL之吸附面12a。
The lower surface of the
接著,說明自貼合基板G分斷第1基板G1之端材GL,並 自第1基板G1取出已分斷之端材GL之方法。 Next, it is explained that the end material GL of the first substrate G1 is separated from the bonded substrate G, and A method of taking out the broken end material GL from the first substrate G1.
首先,準備貼合第1基板G1及第2基板G2而成之貼合基板G,藉由未圖示之刻劃線形成裝置,於第1基板G1之表面(未貼合第2基板G2之側之面)形成刻劃線S。 First, prepare a bonded substrate G formed by bonding the first substrate G1 and the second substrate G2, and apply a scribe line forming device not shown on the surface of the first substrate G1 (the second substrate G2 is not bonded). The side surface) forms a scribe line S.
接著,將貼合基板G載置於載台2之載置面。於此,在將貼合基板G載置於載台2上時,以如下方式載置。即如圖1所示,以使於表面形成有刻劃線之第1基板位於上方,且刻劃線S及端部(成為端材之部分)GL位於較載台2之載置面更外側之方式配置貼合基板G。進一步以端材GL位於頭部1之按壓部11之正下方,且遠離吸附部12之方式(以頭部1下降時,吸附部12不與端材GL接觸之方式)進行配置。
Next, the bonded substrate G is placed on the placement surface of the
接著,如圖2所示,使頭部1下降,並藉由按壓部11將端材GL往下方按壓。此時,由於端材GL之下方不存在載台2之載置面,因此藉由以按壓部11按壓端材GL部分,於第1基板G1以刻劃線S為起點形成裂縫,端材GL被完全切割。
Next, as shown in FIG. 2, the
其後,如圖3所示,使頭部1上升,而後進一步使載台2往圖3之左方向移動。此時,以使頭部1之吸附部12位於端材GL之正上方之方式移動載台2。
Thereafter, as shown in FIG. 3, the
接著,如圖4所示,使頭部1下降,使吸附部12抵接於端材GL。藉此,端材GL被吸附保持於吸附部12。於此狀態下,如圖5所示,使頭部1上升。藉此,自第1基板G1切離基材GL。
Next, as shown in FIG. 4, the
其後,如圖6所示,使載台2後退(往圖之右方向移動),以使貼合基板G自頭部1之下方退出。接著,只要解除以吸附部12進行之
吸附,端材GL即落下至端材置放處。
After that, as shown in FIG. 6, the
於如上所述本實施形態之方法中,例如,於貼合基板之厚度為0.2mm之情況,壓入量之最佳範圍,相較習知方法中之0.2mm~0.3mm,擴大至0.2mm~0.5mm。 In the method of this embodiment as described above, for example, when the thickness of the bonded substrate is 0.2mm, the optimum range of the pressing amount is expanded to 0.2mm compared to the 0.2mm~0.3mm in the conventional method ~0.5mm.
又,由於使按壓面11a與吸附面12a之高度不同,並使吸附面12a位於較下方處,因此於藉由吸附部12吸附端材GL時,能避免按壓面11a接觸第1基板G1之表面。據此,能避免第1基板G1之表面因按壓部11而損傷。
In addition, since the
本發明不限定於如上所述實施形態,可在不脫離本發明之範圍內進行各種變形或修正。 The present invention is not limited to the above-mentioned embodiments, and various modifications or corrections can be made without departing from the scope of the present invention.
於前述實施形態中,雖將按壓部及吸附部設於單一頭部,但按壓部及吸附部亦可設於不同構件。 In the foregoing embodiment, although the pressing part and the suction part are provided in a single head, the pressing part and the suction part may be provided in different members.
1‧‧‧頭部 1‧‧‧Head
2‧‧‧載台 2‧‧‧ Stage
3‧‧‧外部配管 3‧‧‧External piping
11‧‧‧按壓部 11‧‧‧Pressing part
11a‧‧‧按壓面 11a‧‧‧Pressing surface
12‧‧‧吸附部 12‧‧‧Adsorption part
12a‧‧‧吸附面 12a‧‧‧Adsorption surface
G‧‧‧貼合基板 G‧‧‧Laminated substrate
G1‧‧‧第1基板 G1‧‧‧First substrate
G2‧‧‧第2基板 G2‧‧‧Second substrate
GL‧‧‧端材 GL‧‧‧End Material
S‧‧‧刻劃線 S‧‧‧Scribe
P‧‧‧真空泵 P‧‧‧Vacuum pump
M1、M2‧‧‧驅動機構 M1, M2‧‧‧Drive mechanism
Claims (7)
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JP2019107779A (en) * | 2017-12-15 | 2019-07-04 | 三星ダイヤモンド工業株式会社 | Pickup unit |
JP2019109292A (en) * | 2017-12-15 | 2019-07-04 | 三星ダイヤモンド工業株式会社 | End material removing device and end material removing method |
KR102023453B1 (en) * | 2018-03-28 | 2019-09-20 | 주식회사 카이테크 | Apparatus and method for dividing substrate |
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JPH06205757A (en) * | 1993-01-07 | 1994-07-26 | Hitachi Ltd | Nuclear magnetic resonance inspecting system device |
JPH10268275A (en) * | 1997-03-24 | 1998-10-09 | Nec Kagoshima Ltd | Glass substrate cutting method |
JP2001163642A (en) * | 1999-12-09 | 2001-06-19 | Toyota Autom Loom Works Ltd | Device for taking out laminated glass panel |
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CN106316089A (en) | 2017-01-11 |
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JP6582630B2 (en) | 2019-10-02 |
TW201714721A (en) | 2017-05-01 |
CN106316089B (en) | 2021-04-02 |
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