JP2019109292A - End material removing device and end material removing method - Google Patents

Abstract

To remove end material, when the end material is removed after forming a scribe line to expose an inside surface of any substrate of laminated substrates, without damaging a surface to be exposed.SOLUTION: An end material removing device 61 segmentalizes a unit laminated substrate 100 having a first unit substrate 101 with a surface on which a third scribe line S3 for cutting off end material 107 from a main body 106 is formed and a second unit substrate 102 laminated on a rear surface of the first unit substrate 101. On a table 13, the unit laminated substrate 100 is placed in a state of having the first unit substrate 101 on the lower side. An air blow device 23 blows a gas flow FL against the end material 107 or a portion in the vicinity of the end material of the second unit substrate 102, so as to separate the end material 107 from the main body 106.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a scrap material removing device and a scrap material removing method, in particular, a first substrate having a scribe line formed on the surface for separating the scrap material, and a second substrate bonded to the back surface of the first substrate. The present invention relates to an apparatus and method for removing scraps from a bonded substrate.

  The liquid crystal device is configured of a bonded substrate in which the first substrate and the second substrate are bonded by a sealing material such that the liquid crystal layer is interposed therebetween. In the bonded substrate, a color filter is formed in a pattern on one of the above substrates (for example, the first substrate), and a TFT (Thin Film Transistor) and a connection terminal are formed on the other substrate (for example, the second substrate). ing.

  In the bonded substrate, in order to connect to an external electronic device, the connection terminal formed on the second substrate is exposed. In the bonded substrate, there is known a separation method of the substrate for exposing the surface on which the connection terminal is formed (for exposing the inner side surface of one of the bonded substrates) (for example, Patent Document 1) reference).

  In Patent Document 1, the scribing line is formed by shifting the arrangement position of the cutter for forming the scribe line on the first substrate first and the arrangement position of the cutter for forming the scribe line on the second substrate. Thereafter, when the bonded substrate (end material) to be the cut end and the main body are separated to expose the connection terminal, the chuck member is moved away from the main body in a state where the end material is held by the chuck member.

JP, 2012-250871, A

  As described above, when removing the end material by holding and moving the end material with the chuck member, the position of the chuck member is precisely adjusted so that the end material does not strongly press the surface on which the connection terminal of the main body is formed. It needs to be adjusted well. The reason is to prevent damage to the connection end.

  An object of the present invention is to remove scraps without damaging the surface to be exposed, in the case where scraps are removed after scribing lines are formed to expose the inner surface of any of the bonded substrates. It is in.

  Below, a plurality of modes are explained as a means to solve a subject. These aspects can be arbitrarily combined as needed.

According to an aspect of the present invention, there is provided a scrap material removing apparatus comprising: a first substrate having a scribe line formed on a surface thereof for separating the scrap from the main body; and a second substrate bonded to the back surface of the first substrate. An apparatus for cutting a bonded substrate stack, including a substrate placement unit and an air blow apparatus.
The bonded substrate stack is mounted on the substrate mounting portion with the first substrate facing downward.
The air blowing device separates the offcuts from the main body by applying the gas flow to the offcuts and / or a portion in the vicinity of the offcuts of the second substrate.
In this device, the end material is pulled away from the main body of the first substrate by the flow of gas generated by the air blowing device.

By such division, unlike in the prior art, the end material does not press the surface of the second substrate. As a result, it becomes difficult for the scrap to damage the exposed surface of the second substrate.
Furthermore, since the above-mentioned parting is performed in a state where the end material is placed on the substrate mounting portion, management of the end material after being divided is easy.

The air blowing device may be disposed at a position higher than the bonded substrate, and may have a nozzle directed obliquely downward toward the end material and / or a portion near the end material of the second substrate.
In this device, the air blow device having the above-described nozzle can provide the end material and / or the main body with an optimal gas flow that can separate the end material from the main body.

The offcut removing device may further include an adsorption device. The suction device may be provided on the substrate placement unit to suction the bonded substrate.
In this apparatus, since the main body and the end material can be adsorbed to the substrate mounting portion by the adsorption device during the division by the air blow device, the division is stably performed.

The offcut removing device may further comprise a lifting device. The lifting device may suck the second substrate and lift the bonded substrate from the substrate mounting portion.
In this apparatus, the first substrate and the second substrate are lifted by the lifting device from the substrate mounting portion after being divided by the blowing step. As a result, the cut off chips remain on the substrate mounting portion.

The scrap material removing method according to another aspect of the present invention includes a first substrate having a scribe line formed on the surface to separate the scrap from the main body, and a second substrate bonded to the back surface of the first substrate. A method for removing end material of a bonded substrate stack, comprising the following steps.
載 A mounting step of mounting the bonded substrate on the substrate mounting portion with the first substrate facing downward.
エ ア Air blow step in which the end material is separated from the main body by applying the gas flow to the end material and / or the vicinity of the end material of the main body.
In this method, the end material is pulled away from the main body of the first substrate by the flow of gas generated by the air blowing device.

By such division, unlike in the prior art, the end material does not press the surface of the second substrate. As a result, it becomes difficult for the scrap to damage the exposed surface of the second substrate.
Furthermore, since the above-mentioned parting is performed in a state where the end material is placed on the substrate mounting portion, management of the end material after being divided is easy.

In the air blowing step, the gas flow may be directed obliquely toward the end material and / or the end material near the end material from a position higher than the bonded substrate.
In this method, the blow step generates the above-described gas flow, thereby providing the end material and / or the main body with the optimum gas flow capable of separating the end material from the main body.

The scrap material removal method may further include an adsorption step of adsorbing the bonded substrate stack to the substrate mounting portion.
In this method, since the main body and the end material can be adsorbed to the substrate placement portion during the division by the blow step, the division is stably performed.

The offcuts removing method may further include a lifting step of sucking the second substrate and lifting the first substrate and the second substrate from the substrate mounting portion.
In this method, the first substrate and the second substrate are lifted from the substrate mounting portion after being divided by the blow step. As a result, the cut off chips remain on the substrate mounting portion.

  In the waste material removing apparatus and the waste material removing method according to the present invention, in the case of removing the end after forming the scribe line and exposing the inner surface of the second substrate of the bonded substrate, it is possible to use the simpler method. (2) The scrap can be removed without exerting an excessive force on the exposed surface of the substrate.

The side view of a board | substrate mounting stage and a board | substrate inversion apparatus. The perspective view of a substrate inversion device. The schematic perspective view of a board | substrate mounting stage. The schematic plan view of a substrate mounting stage. The perspective view of an air blow device. The typical side view of the bonded substrate used for one embodiment of the present invention. The schematic side view of the bonding board | substrate after division. The typical side view of the bonded substrate board after division in the state where scraps remained. BRIEF DESCRIPTION OF THE DRAWINGS The typical side view of the scrap material removal apparatus which concerns on 1st Embodiment of this invention. FIG. 2 is a block diagram showing a control configuration of the offcut removing device. The flowchart which shows the control action of the scrap material removal apparatus. The schematic side view of the scrap material removal apparatus which shows the blow step of a scrap material removal apparatus. The elements on larger scale of FIG. The schematic side view of the scrap material removal apparatus which shows the blow step of a scrap material removal apparatus. The schematic side view of the scrap material removal apparatus which shows the blow step of a scrap material removal apparatus.

1. First Embodiment (1) Substrate Mounting Stage and Substrate Inverting Device A substrate mounting stage and a substrate inverting device will be described with reference to FIGS. 1 to 5. FIG. 1 is a side view of a substrate mounting stage and a substrate reversing device. FIG. 2 is a perspective view of the substrate reversing device. FIG. 3 is a schematic perspective view of a substrate mounting stage. FIG. 4 is a schematic plan view of the substrate mounting stage. FIG. 5 is a perspective view of the air blowing device.
In FIGS. 1 to 5, the arrow X is the first horizontal direction, and the arrow Y is the second horizontal direction.

  The substrate processing apparatus 1 has a substrate mounting stage 3, a substrate reversing device 5, and a suction transfer device 7. The suction transport device 7 transports the unit-bonded substrate 100 (hereinafter referred to as the substrate 100) to the substrate mounting stage 3, and then the substrate reversing device 5 transports the substrate 100 to another device 9 while reversing the substrate 100.

(1-1) Substrate Mounting Stage The substrate mounting stage 3 has a fixed base 11 and a table 13 (an example of a substrate mounting part) disposed on the base 11. The table 13 is movable relative to the table 11 between a first position on the upstream side in the transport direction which is the second horizontal direction (FIGS. 3 and 4) and a second position on the downstream side in the transport direction.

  The table 13 is comprised of a plurality of receiving members 15 as shown in FIGS. 3 and 4. The plurality of receiving members 15 receive the substrate 100 (FIG. 1) from the suction conveyance device 7 at the first position. The plurality of receiving members 15 extend in parallel in the first horizontal direction and in the second horizontal direction. A plurality of suction holes (not shown) are formed on the upper surface of the receiving member 15, and are connected to the suction device 16 (FIG. 10).

(1-2) Substrate Inversion Device The substrate inversion device 5 is a device for inverting the substrate 100. Specifically, the substrate reversing device 5 reverses the substrate 100 disposed on the top surface of the table 13 and transports the substrate 100 to another device 9.

The substrate reversing device 5 has a support structure 31 and a reversing structure 33, as shown in FIGS.
The reversing structure 33 is supported by the support structure 31 so as to be pivotable about a pivot shaft 35 extending in the direction orthogonal to the drawing sheet. The reversing structure 33 has a shaft 37, which is concentric with the pivot shaft 35. The reversing structure 33 comprises a plurality of holding arms 39 extending perpendicularly from the shaft 37. The plurality of holding arms 39 extend in parallel in the same direction.

  The plurality of holding arms 39 pivot about a pivot shaft 35 between a position on the table 13 and the other device 9 as shown in FIG. Further, as shown in FIG. 2, a large number of air suction pads 41 are provided on the same side of the holding arm 39. The air suction pad 41 is disposed on the upper surface of the holding arm 39 in a posture in which the holding arm 39 is disposed on the table 13.

An operation of attracting and rotating the substrate 100 placed on the table 13 by the holding arm 39 of the substrate reversing device 5 will be described. The holding arm 39 is initially disposed at a position lower than the intended height of the mounting surface 13 a of the table 13. Then, the table 13 carrying the substrate 100 is moved from the first position to the second position. Thus, the substrate 100 is positioned above the holding arm 39. Next, the holding arm 39 moves upward, and the air suction pad 41 contacts the lower surface of the substrate 100 on the table 13. Then, the suction pump (not shown) is operated to cause the air suction pad 41 to hold the substrate 100 by suction.
Subsequently, the holding arm 39 is inverted 180 degrees. The holding arm 39 exits between the receiving members 15 and delivers the substrate 100 to the upper surface of the other device 9.

(1-3) Suction and Transfer Device The suction and transfer device 7 is a device that sucks and transfers the substrate 100 and places the substrate 100 on the table 13 of the substrate mounting stage 3. The suction conveyance device 7 has a suction unit 7a, a conveyance direction moving unit (not shown), an elevation unit (not shown), and the like. The operation of the suction conveyance device 7 will be described later.
The air suction pad 41 of the holding arm 39 of the substrate reversing device 5 and the suction part 7a of the suction conveyance device 7 are connected to an air suction device (not shown) such as a vacuum pump via piping.
(1-4) Air Blow Device The substrate mounting stage 3 further includes, as shown in FIGS. 3 and 4, a pair of left and right columns 17 and a beam 19 bridged to the columns 17 and extending in the first horizontal direction. A portal support structure 21 is provided. As shown in FIG. 5, an air blow device 23 is attached to the beam 19. The air blowing device 23 is a device for separating the end material which has entered under the substrate 100 placed on the table 13. The air blowing device 23 has a plurality of air nozzles 23 a aligned in the first horizontal direction. Each air nozzle 23 a is directed obliquely downward, specifically, to the downstream end surface of the substrate 100 in the transport direction. The air blow device 23 will be described later.

(2) Bonded Substrate The whole bonded substrate 100A will be described with reference to FIG. FIG. 6 is a schematic side view of a bonded substrate used in an embodiment of the present invention.
The whole bonded substrate 100A is composed of a first substrate 101A and a second substrate 102A bonded to the back surface of the first substrate 101A. A first scribe line S1 and a second scribe line S2 are formed extending in the width direction (first horizontal direction) at equal intervals on the first substrate 101A and the second substrate 102A, and they are divided at the boundary. The unit-bonded substrate 100 (hereinafter referred to as the “substrate 100”) is obtained.

The substrate 100 will be described with reference to FIG. FIG. 7 is a schematic side view of a unit bonded substrate. The substrate 100 includes a first unit substrate 101 and a second unit substrate 102 bonded to the back surface of the first unit substrate 101. In FIG. 2, the end material which is the end portion of the first unit substrate 101 is removed, so that the exposed surface 102 a is a part of the main surface of the second unit substrate 102 exposed.
However, when dividing the whole bonded substrate 100A, it is conceivable that the end material could not be removed.

With reference to FIG. 8, the substrate 100 in which the offcut remains as described above will be described. FIG. 8 is a schematic side view of the bonded substrate stack after being separated in a state in which the end material remains.
As shown in FIG. 8, although the third scribe line S <b> 3 is formed, the end material 107 is in a state of being attached to the main body 106 of the first unit substrate 101.

(3) Mechanical configuration of scrap material removing device The scrap material removing device 61 will be described with reference to FIG. The scrap material removing device 61 is a device for separating the scrap material 107 from the substrate 100 in which the scrap material 107 remains as described above. FIG. 9 is a schematic side view of the scrap material removing device according to the first embodiment of the present invention.
The scrap removing device 61 is configured of the above-described table 13 and an air blowing device 23. In the following explanation, it explains focusing on the operation of scrap material removal, and omits the explanation about the composition and operation which are not directly related to scrap material removal. The drawings are also simplified.
As shown in FIG. 9, the substrate 100 is composed of a first unit substrate 101 and a second unit substrate 102 bonded to the back surface of the first unit substrate 101. Here, on the surface of the first unit substrate 101, a third scribe line S3 for separating the main body 106 and the end material 107 is formed.

The substrate 100 is placed on the table 13 such that the first unit substrate 101 is positioned below.
As shown in FIG. 9, the suction device 16 is connected to the table 13 as described above. The suction device 16 is provided on the table 13 to suction and fix the substrate 100. The adsorption device 16 has an air suction device (not shown) such as a vacuum pump.

  The air blowing device 23 separates the end material 107 from the main body 106 by applying a flow FL of gas having a predetermined flow velocity and pressure to the end material 107 or a portion near the end material of the second unit substrate 102. Specifically, the air blowing device 23 generates the flow FL of gas (for example, air, nitrogen, etc.) in an oblique direction with respect to the end face 102 b of the second unit substrate 102, thereby the main body 106 of the first unit substrate 101. Is an apparatus for peeling off the end material 107.

As described above, the air blowing device 23 has the air nozzle 23a. The air nozzle 23 a is disposed obliquely above the end of the substrate 100 or near the end of the second unit substrate 102 above the end of the substrate 100 (closer to the end 107).
In this apparatus, the air blow device 23 includes the above-described air nozzle 23a, thereby providing the end material 107 and / or the second unit substrate 102 with an optimal gas flow that can release the end material 107 from the main body 106. be able to.
The air blowing device 23 has a gas supply device 25 (a device for supplying a gas including a gas cylinder or the like) connected to the air nozzle 23a.
The gas flow rate and pressure of the gas flow FL can be appropriately adjusted based on, for example, the size and weight of the offcut 107.

A plurality of air nozzles 23a are arranged along the width direction (first horizontal direction) of the substrate 100 (see FIG. 5).
The air nozzle 23 a may be movable in the width direction of the substrate 100. Thereby, the flow of gas FL can be supplied to the entire width direction of the second unit substrate 102 (and the end material 107), and the end material 107 can be separated from the main body 106 of the first unit substrate 101.

(4) Control configuration of the scrap removing device The control configuration of the scrap removing device 61 will be described with reference to FIG. FIG. 10 is a block diagram showing a control configuration of the scrap material removing device.
As shown in FIG. 10, the offcut removing device 61 has a controller 50.
The controller 50 is a computer having a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.) It is a system. The controller 50 performs various control operations by executing the program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

The controller 50 may be configured by a single processor, but may be configured by a plurality of independent processors for each control.
Some or all of the functions of the components of the controller 50 may be implemented as a program that can be executed by a computer system that constitutes the controller 50. In addition, a part of the function of each element of the control unit may be configured by a custom IC.

The suction device 16, the suction conveyance device 7 and the air blow device 23 are connected to the controller 50.
Although not shown, sensors for detecting the size, shape and position of the substrate, sensors and switches for detecting the state of each device, and an information input device are connected to the controller 50.

(5) Formation on Unit Bonded Substrate A process of forming the unit bonded substrate 100 from the entire bonded substrate 100A will be described.
First, the whole bonded substrate 100A is prepared, and a first scribe line S1 and a third scribe line S3 are formed on the surface of the first substrate 101A by a scribe line forming apparatus (not shown), and further on the surface of the second substrate 102A. A second scribe line S2 is formed.
Next, the first scribe line S1, the second scribe line S2, and the third scribe line S3 are divided by a dividing device (not shown) to form a plurality of unit bonded substrates 100.

(6) Control Operation of the Edge Material Removing Device The edge material 107 of the first unit substrate 101 is separated from the substrate 100 using FIGS. 11 to 15, and the separated edge material 107 is removed from the first unit substrate 101. Explain the method. FIG. 11 is a flowchart showing the control operation of the scrap material removing device. 12 and 14 to 15 are schematic side views of the scrap removing device showing the blow step of the scrap removing device. FIG. 13 is a partially enlarged view of FIG.

The control flowchart described below is an example, and each step can be omitted and replaced as necessary. Also, multiple steps may be performed simultaneously, or some or all may be performed overlapping.
Furthermore, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.
Note that the operation of each device is the result of a command from the controller 50 to each device, and these are represented by each step of the software application.

In step S1 of FIG. 11, as shown in FIG. 9, the substrate 100 with the scraps 107 remaining thereon is placed on the table 13 (placement step). Here, as shown in FIG. 9, the first unit substrate 101 is positioned below the second unit substrate 102. Therefore, the end material 107 is placed on the table 13 in a state in which it drops below the end of the second unit substrate 102. Specifically, the controller 50 controls the suction conveyance device 7 to execute the above operation.
In step S2, the substrate 100 is adsorbed to the table 13 (adsorption step). Specifically, the controller 50 controls the suction device 16 to execute the above operation.

In step S3, as shown in FIGS. 12 and 13, blowing is performed for a predetermined time by applying the gas flow FL to the end material 107 or a portion near the end material of the second unit substrate 102 (that is, the end surface 102b) (blow step) ). Specifically, a gas is supplied from the air blowing device 23 to the air nozzle 23a to generate a gas flow FL. As a result, the end material 107 is separated from the main body 106. Specifically, the controller 50 controls the air blowing device 23 to execute the above operation. The blowing operation may be started prior to step S1 or step S2, or may be performed after step S3.
The air nozzle 23a is disposed obliquely from above the position away from the end material 107 with respect to the end face 102b of the second unit substrate 102 (that is, an angle not perpendicular to the end surface), the end material 107 or the second unit substrate A gas flow is applied obliquely to the end face 102 b of 102. Therefore, it is possible to provide an optimal gas flow that can peel off the end material 107 from the main body 106 to the end material 107 and / or the end face 102 b of the second unit substrate 102.
In addition, since the main body 106 and the end material 107 are adsorbed on the table 13 during the division by the air blow step, the division is stably performed.

In step S4, adsorption of the substrate 100 to the table 13 is stopped. Specifically, the controller 50 controls the suction device 16 to execute the above operation. In addition, adsorption may be continued also after step S4.
In step S5, the suction unit 7a of the suction conveyance device 7 sucks the second unit substrate 102 of the substrate 100 as shown in FIG. 14 and lifts the substrate 100 from the table 13 as shown in FIG. 15 (lifting step).

  In this method, the substrate 100 is lifted from the table 13 after being divided by the air blowing step. As a result, as shown in FIG. 15, the cut off piece 107 remains on the table 13.

In the end material removing device 61, the end material 107 is not first held by the end material and moved from the main body of the first unit substrate as in the prior art, but the end material 107 is first The main substrate 106 of the unit substrate 101 is peeled off. By such division, unlike in the prior art, the off-chip 107 can be separated from the main body 106 of the first unit substrate 101 in a non-contact manner without being held and moved by any member due to the gas flow FL. As a result, since the exposed surface 102 a of the second unit substrate 102 is not pressed by the edge material 107 during the separation of the edge material 107, the exposed surface is not damaged.
Furthermore, since the above-described division is performed in a state where the end material 107 is placed on the table 13, management of the end material 107 after division is easy. In other words, there is no problem in that the separated end pieces 107 fly to another position.

2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, the embodiments and modifications described herein may be arbitrarily combined as needed.
(1) Modification of scrap material removal apparatus The scrap material removal apparatus may be provided in apparatuses other than a pedestal on which a bonded substrate is placed by the substrate reversing device.
(2) Modification of Substrate A bonded brittle material substrate in which two brittle material substrates are bonded together is a liquid crystal panel in which a glass substrate is bonded, a flat display panel such as a plasma display panel, an organic EL display panel, and silicon The substrate includes a semiconductor substrate in which a substrate, a sapphire substrate or the like is bonded to a glass substrate.
The type of substrate is not particularly limited. The substrate includes a single plate glass, a semiconductor wafer, and a ceramic substrate.

(3) Modification of Scribe Line The shape of the scribe line is not limited. In the first embodiment, the scribe line is a straight line, but may have, for example, a shape having a curve in part or all.
(4) Modifications of Gas In the above embodiment, air or nitrogen was used as the gas for separating offcuts, but other gases may be used depending on the environment (atmosphere) in which separation of the offcuts is performed. (For example, an inert gas such as argon) can also be used.

DESCRIPTION OF SYMBOLS 1: Substrate processing apparatus 3: Substrate mounting stage 5: Substrate reversing device 7: Suction conveyance device 13: Table 13a: Mounting surface 15: Receiving member 23: Air blow device 23a: Air nozzle 25: Gas supply device 61: Scraping material removal Device 100: unit bonded substrate 101: first unit substrate 102: second unit substrate 102a: exposed surface 102b: end surface 106: main body 107: end material

Claims (8)

An apparatus for dividing a bonded substrate, comprising: a first substrate having a scribe line formed on a surface thereof for separating an end material from a main body, and a second substrate bonded to a back surface of the first substrate,
A substrate placement unit on which the bonded substrate is placed with the first substrate facing downward;
An air blowing device for separating the end material from the main body by applying a gas flow to the end material or a portion near the end material of the second substrate;
Waste material removal device equipped with.   The air blow apparatus according to claim 1, wherein the air blow apparatus has a nozzle which is disposed at a position higher than the bonded substrate and which is directed obliquely downward toward the end material or a portion near the end material of the second substrate. Scrap material removal equipment.   The scrap material removing device according to claim 1, further comprising: a suction device provided in the substrate mounting portion and configured to suction the bonded substrate.   The scrap material removal apparatus according to any one of claims 1 to 3, further comprising: a lifting device configured to suck the second substrate and lift the bonded substrate from the substrate mounting portion. A method for removing the end material of a bonded substrate stack, comprising: a first substrate having a scribe line formed on a surface thereof for separating an end material from a main body, and a second substrate bonded to the back surface of the first substrate.
A placement step of placing the bonded substrate on the substrate placement part in a state where the first substrate is in the lower side;
An air blow step of separating the end material from the main body by applying a gas flow to the end material or a portion near the end material of the main body;
Waste material removal method equipped with   6. The method according to claim 5, wherein the air blowing step applies a gas flow obliquely downward toward the end material or a portion near the end material of the main body from a position higher than the bonded substrate.   The scrap material removal method according to claim 5, further comprising: an adsorption step of adsorbing the bonded substrate to the substrate mounting portion.   The scrap material removal method according to any one of claims 5 to 7, further comprising a lifting step of suctioning the second substrate and lifting the first substrate and the second substrate from the substrate mounting portion.

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