KR20190072463A - Apparatus and method for removing end portion - Google Patents

Abstract

In the case of exposing the inner surface of one of substrates of bonded substrates by removing an end material after forming a scribe line, the end material is removed without damaging a surface to be exposed. An end material removing device (61) divides a unit bonded substrate (100) having a first unit substrate (101) having a surface, on which a third scribe line (S3) for cutting and removing an end material (107) from a main body (106) is formed, and a second unit substrate (102) bonded to the back surface of the first unit substrate (101). The unit bonded substrate (100) is placed on a table (13) in a state that the first unit substrate (101) is downward. An air blowing device (23) separates the end material (107) from the main body (106) by causing the flow of gas (FL) to be in contact with the end material (107) or the vicinity of the end material of the second unit substrate (102).

Description

[0001] APPARATUS AND METHOD FOR REMOVING END PORTION [0002]

The present invention relates to an edge material removing apparatus and a method for removing edge material, and more particularly, to a method of manufacturing an edge material removing apparatus and a edge material removing method, which comprises a first substrate having a scribe line formed on a surface thereof for cutting- The present invention relates to an apparatus and a method for removing an edge member from a bonded substrate having an edge.

The liquid crystal device is constituted by a bonded substrate on which a first substrate and a second substrate are bonded by a sealing material so as to interpose the liquid crystal layer therebetween. In the bonded substrate, a color filter is pattern-formed on one of the substrates (for example, the first substrate), and a TFT (Thin Film Transistor) and a connection terminal Respectively.

In the bonded substrate, the connection terminal formed on the second substrate is exposed in order to connect to an external electronic device. A method of separating a substrate for exposing a surface on which a connection terminal is formed (exposing an inner surface of one of the substrates in a bonded substrate stack) in a bonded substrate is known (see, for example, Patent Document 1).

In Patent Document 1, a scribe line is formed by shifting the arrangement position of the cutter for forming the scribe line on the first substrate first and the arrangement position of the cutter for forming the scribe line on the second substrate. Thereafter, when the connecting substrate (the end piece) on the side to be cut is separated from the main body and the connection terminal is exposed, the chuck member is moved away from the main body while holding the end member by the chuck member I will.

Japanese Laid-Open Patent Publication No. 2012-250871

In the case of removing the end member by the method of holding and moving the end member with the chuck member as described above, it is necessary to adjust the position of the chuck member accurately so that the end member does not strongly press the surface on which the connection terminal of the main body is formed. The reason for this is to prevent damage to the connection end.

An object of the present invention is to remove edge members without damaging the surface to be exposed in the case of exposing the inner side surfaces of any of the substrates of the bonded substrate stack by removing the edge members after forming the scribe lines.

Hereinafter, a plurality of embodiments will be described as means for solving the problems. These embodiments may be arbitrarily combined as necessary.

A cutting apparatus according to one aspect of the present invention includes a first substrate having a scribe line formed on a surface thereof for cutting off a substrate from a main body and a second substrate bonded to a back surface of the first substrate, A substrate mounting portion, and an air blowing device.

In the substrate mounting portion, the bonded substrate stack is placed with the first substrate downward.

The air blow device separates the end material from the main body by bringing the flow of the gas into contact with the end member and / or the vicinity of the end member of the second substrate.

In this apparatus, the end member is separated from the main body of the first substrate by the flow of the gas generated by the air blowing apparatus.

By this division, the edge member does not press the surface of the second substrate unlike the prior art. As a result, it is difficult for the step to damage the exposed surface of the second substrate.

Further, since the above-described dividing is performed in a state in which the term material is placed on the substrate mounting portion, management of the term material after the termination is easy.

The air blowing device may have a nozzle arranged at a position higher than the bonded substrate and oriented obliquely downward toward the end member of the end member and / or the end member of the second substrate.

In this apparatus, by providing the above-described nozzle, the air blow apparatus can provide an optimum flow of gas to the end member and / or the main body so that the end member can be detached from the main body.

The end material removal device may further include an absorption device. The adsorption apparatus may be formed in the substrate mounting section to adsorb the bonded substrate.

In this apparatus, since the main body and the end member can be sucked to the substrate mounting portion by the sucking device during the division by the air blowing device, the division is stably performed.

The end material removal device may further include a lifting device. The lifting device may lift the bonded substrate stack from the substrate mounting portion by sucking the second substrate.

In this apparatus, the first substrate and the second substrate are lifted up from the substrate mounting portion by a lifting device after division by the blow step. As a result, the divided end member remains on the substrate mounting portion.

According to another aspect of the present invention, there is provided a method for removing a substrate, comprising: a first substrate having a scribe line formed on a surface thereof for cutting off a substrate from the substrate; and a second substrate bonded to a back surface of the first substrate, As a method, the following steps are provided.

A placing step of placing the bonded substrate stack on the substrate mounting portion in a state that the first substrate is downward.

An air blow step for separating the end material from the main body by bringing the gas flow into contact with the end member and / or the vicinity of the end member of the main body.

In this method, the end material is separated from the main body of the first substrate by the flow of the gas generated by the air blowing device.

By this division, the edge member does not press the surface of the second substrate unlike the prior art. As a result, it is difficult for the step to damage the exposed surface of the second substrate.

In addition, since the above-described division is performed in a state in which the term material is placed on the substrate mounting portion, management of the termination after the termination is easy.

The air blow step may be carried out at a position higher than the bonded substrate, and the flow of the gas may be obliquely directed toward the end member of the end member and / or the end member of the main body.

In this method, the blow step generates the above-mentioned flow of gas, so that it is possible to give the end material and / or the main body an optimal flow of gas capable of detaching the end material from the main body.

The edge material removing method may further include an adsorption step of adsorbing the bonded substrate stack to the substrate placing section.

In this method, since the main body and the end member can be attracted to the substrate mounting portion during the division by the blow step, the division is stably performed.

The edge member removing method may further include a lifting step of lifting the first substrate and the second substrate from the substrate mounting portion by suctioning the second substrate.

In this method, the first substrate and the second substrate are lifted from the substrate mounting portion after division by the blow step. As a result, the divided end member remains on the substrate mounting portion.

In the edge member removing apparatus and the edge member removing method according to the present invention, in the case of exposing the inner surface of the second substrate of the bonded substrate stack by removing the end portion after formation of the scribe line, in a simpler method, It is possible to remove the edge member without giving excessive force to the surface having the edge.

1 is a side view of a substrate placement stage and a substrate flipping device.
2 is a perspective view of the substrate inverting apparatus.
3 is a schematic perspective view of the substrate placement stage.
4 is a schematic plan view of a substrate placement stage.
5 is a perspective view of the air blowing apparatus.
6 is a schematic side view of a bonded substrate used in an embodiment of the present invention.
Fig. 7 is a schematic side view of the bonded substrate after the separation. Fig.
Fig. 8 is a schematic side view of the bonded substrate stack after the dividing state in which the termination material remains. Fig.
9 is a schematic side view of the apparatus for removing a substrate according to the first embodiment of the present invention.
10 is a block diagram showing a control configuration of the termination removing apparatus.
11 is a flowchart showing a control operation of the term-material removing device.
12 is a schematic side view of an apparatus for removing a section showing a blow step of the apparatus.
13 is a partially enlarged view of Fig.
14 is a schematic side view of an apparatus for removing a substrate showing a blow step of the apparatus.
15 is a schematic side view of an apparatus for removing a substrate showing a blow step of the apparatus.

DESCRIPTION OF THE PREFERRED EMBODIMENTS [

1. First Embodiment

(1) Substrate placement stage and substrate reversing device

1 to 5, the substrate placement stage and the substrate inverting apparatus will be described. 1 is a side view of a substrate placement stage and a substrate inverting apparatus. 2 is a perspective view of the substrate inverting apparatus. 3 is a schematic perspective view of the substrate placement stage. 4 is a schematic plan view of the substrate placement stage. 5 is a perspective view of the air blowing apparatus.

1 to 5, the arrow X is the first horizontal direction, and the arrow Y is the second horizontal direction.

The substrate processing apparatus 1 has a substrate placement stage 3, a substrate inverting apparatus 5, and a suction conveying apparatus 7. The adsorption transport apparatus 7 transports the unit bonded substrate 100 (hereinafter referred to as the substrate 100) to the substrate placement stage 3 and then the substrate inverting apparatus 5 reverses the substrate 100 To another apparatus (9).

(1-1) Substrate placement stage

The substrate placement stage 3 has a stationary stage 11 and a table 13 (an example of a substrate placement section) arranged on the stage 11. The table 13 is movable between a first position (Figs. 3 and 4) on the upstream side in the transport direction, which is the second horizontal direction, and a second position on the downstream side in the transport direction, with respect to the table 11.

As shown in Figs. 3 and 4, the table 13 is composed of a plurality of supporting members 15. A plurality of supporting members 15 receive the substrate 100 (Fig. 1) from the adsorption transport apparatus 7 at the first position. The plurality of supporting members 15 are arranged in the first horizontal direction and extend parallel to each other in the second horizontal direction. A plurality of suction holes (not shown) are formed on the upper surface of the support member 15 and are connected to the adsorption device 16 (Fig. 10).

(1-2) Substrate reversing device

The substrate inverting apparatus 5 is an apparatus for inverting the substrate 100. Specifically, the substrate inverting apparatus 5 reverses the substrate 100 disposed on the upper surface of the table 13 and conveys the substrate 100 to another apparatus 9.

As shown in Figs. 1 and 2, the substrate inverting apparatus 5 has a supporting structure 31 and an inverting structure 33. [

The inversion structure 33 is supported by the support structure 31 so as to be pivotable about a pivot 35 extending in the direction perpendicular to the paper. The inverted structure 33 has a shaft 37 and the shaft 37 is concentric with the rotary shaft 35. [ The inverting structure 33 has a plurality of holding arms 39 vertically extending from the shaft 37. [ The plurality of holding arms 39 extend in parallel in the same direction.

As shown in Fig. 1, the plurality of holding arms 39 pivot about the rotary shaft 35 between the position on the table 13 and the other device 9. As shown in Fig. 2, a plurality of air adsorption pads 41 are formed on the same side of the holding arm 39. As shown in Fig. The air adsorption pad 41 is disposed on the upper surface of the holding arm 39 in a posture in which the holding arm 39 is disposed on the table 13. [

An operation of sucking and rotating the substrate 100 placed on the table 13 by the holding arm 39 of the substrate inverting apparatus 5 will be described. The holding arm 39 is initially disposed at a position lower than a height at which the placement surface 13a of the table 13 is planned. Then, the table 13 on which the substrate 100 is placed is moved from the first position to the second position. Thus, the substrate 100 is positioned above the holding arm 39. [ Next, the holding arm 39 moves upward, and the air adsorption pad 41 comes into contact with the lower surface of the substrate 100 on the table 13. Then, by operating a suction pump (not shown), the substrate 100 is held and held by the air adsorption pad 41.

Then, the holding arm 39 is inverted by 180 degrees. The holding arms 39 come out from between the supporting members 15 and guide the substrate 100 to the upper surface of the other device 9.

(1-3) Adsorption conveying device

The adsorption transport device 7 is a device for adsorbing and transporting the substrate 100 and placing the substrate 100 on the table 13 of the substrate placement stage 3. The adsorption transport apparatus 7 has a suction section 7a, a transport direction movement section (not shown), a lift section (not shown), and the like. The operation of the adsorption transport apparatus 7 will be described later.

The air adsorption pad 41 of the holding arm 39 of the substrate inverting apparatus 5 and the adsorption section 7a of the adsorption transport apparatus 7 are connected to an air suction device such as a vacuum pump (Not shown).

(1-4) Air blow device

3 and 4, the substrate placement stage 3 further includes a pair of right and left pillars 17 and a beam 19 bridging the pillars 17 and extending in the first horizontal direction, Shaped support structure 21 made of a metal. As shown in Fig. 5, an air blow device 23 is attached to the beam 19. As shown in Fig. The air blowing device 23 is a device for separating the stage material that has fallen below the substrate 100 placed on the table 13. The air blowing device 23 has a plurality of air nozzles 23a arranged in the first horizontal direction. Each of the air nozzles 23a faces obliquely downward, specifically, toward the downstream end surface of the substrate 100 in the transport direction. The air blow device 23 will be described later.

(2)

With reference to Fig. 6, the entire bonded substrate 100A will be described. 6 is a schematic side view of a bonded substrate used in an embodiment of the present invention.

The entire bonded substrate 100A is composed of a first substrate 101A and a second substrate 102A bonded to the back surface of the first substrate 101A. The first scribing line S1 and the second scribing line S2 are formed in the first substrate 101A and the second substrate 102A at equal intervals by extending in the width direction (first horizontal direction) The unit bonded substrate 100 (hereinafter referred to as " substrate 100 ") is obtained.

The substrate 100 will be described with reference to Fig. 7 is a schematic side view of the unit bonded substrate. The substrate 100 has a first unit substrate 101 and a second unit substrate 102 bonded to the back surface of the first unit substrate 101. [ In Fig. 2, the end portion of the first unit substrate 101 is removed, and therefore, a part of the main surface of the second unit substrate 102 is exposed to the exposed surface 102a.

However, a case can be considered in which the end member can not be removed when the whole bonded substrate 100A is divided.

With reference to Fig. 8, the substrate 100 in which the edge member remains as described above will be described. Fig. 8 is a schematic side view of the bonded substrate stack after the dividing step in a state in which the end members remain.

8, the stage member 107 is attached to the main body 106 of the first unit substrate 101 although the third scribing line S3 is formed.

(3) Mechanical configuration of the termination removing device

With reference to Fig. 9, a description will be given of the material removal device 61. Fig. The termination removing device 61 is a device for dividing the end member 107 from the substrate 100 in which the end member 107 is left as described above. Fig. 9 is a schematic side view of the edge material removal device according to the first embodiment of the present invention. Fig.

The end material removal device 61 comprises the table 13 and the air blow device 23 described above. In the following description, the operation of removing the termination will be mainly described, and a description of the constitution and operation that are not directly related to termination elimination will be omitted. Also, the drawings are simplified.

The substrate 100 is composed of a first unit substrate 101 and a second unit substrate 102 bonded to the back surface of the first unit substrate 101 as shown in Fig. Here, on the surface of the first unit substrate 101, a third scribe line S3 dividing the main body 106 and the end member 107 is formed.

The substrate 100 is placed on the table 13 such that the first unit substrate 101 is positioned downward.

As shown in Fig. 9, the adsorption device 16 is connected to the table 13 as described above. The adsorption apparatus 16 is formed on the table 13, and adsorbs and fixes the substrate 100. The adsorption device 16 has an air suction device (not shown) such as a vacuum pump.

The air blow device 23 is configured to cause the flow of the gas FL having the predetermined flow rate and pressure to touch the end member 107 or the vicinity of the end member of the second unit substrate 102, ). Specifically, the air blow device 23 generates a flow FL of gas (for example, air, nitrogen or the like) in an oblique direction with respect to the end face 102b of the second unit substrate 102, And separates the end member 107 from the main body 106 of the one unit substrate 101. [

The air blowing device 23 has an air nozzle 23a as described above. The air nozzle 23a is disposed at an upper side of the end portion (closer to the end member 107) of the substrate 100 toward the end member 107 or the vicinity of the end member of the second unit substrate 102 .

In this apparatus, the air nozzle 23 has the above-described air nozzle 23a, so that the end member 107 is detached from the main body 106 with respect to the end member 107 and / or the second unit substrate 102 It is possible to provide an optimum flow of gas that can be discharged.

The air blowing device 23 has a gas supply device 25 (a device for supplying gas including a gas cylinder) connected to the air nozzle 23a.

The gas flow rate and pressure of the gas flow FL can be appropriately adjusted based on, for example, the size and weight of the end member 107. [

A plurality of air nozzles 23a are arranged along the width direction (first horizontal direction) of the substrate 100 (see FIG. 5).

The air nozzle 23a may be movable in the width direction of the substrate 100. [ The gas flow FL is supplied to the entire width direction of the second unitary substrate 102 (and the end portion 107) so that the end portion 107 is separated from the main unit 106 of the first unit substrate 101 Can be separated.

(4) Control configuration of the termination removing device

The control configuration of the end material removal device 61 will be described with reference to Fig. 10 is a block diagram showing the control configuration of the apparatus for removing a material.

As shown in Fig. 10, the end material removal device 61 has a controller 50. As shown in Fig.

The controller 50 includes a processor (for example, a CPU), a storage device (for example, ROM, RAM, HDD, SSD or the like), various interfaces (for example, an A / D converter, a D / , Communication interface, etc.). The controller 50 performs various control operations by executing a program stored in a storage unit (corresponding to a part or all of the storage area of the storage device).

The controller 50 may be composed of a single processor, but may be composed of a plurality of independent processors for each control.

The function of each element of the controller 50 may be partially or wholly realized as a program executable by the computer system constituting the controller 50. [ In addition, some of the functions of the elements of the control unit may be configured by a custom IC.

The adsorption device 16, the adsorption transport device 7, and the air blow device 23 are connected to the controller 50.

Although not shown, the controller 50 is connected to sensors for detecting the size, shape and position of the substrate, sensors and switches for detecting the state of each device, and an information input device.

(5) Formation as unit bonded substrate

The process of forming the unit bonded substrate 100 from the whole bonded substrate 100A will be described.

First, the entire bonded substrate 100A is prepared, and a first scribing line S1 and a third scribing line S3 are formed on the surface of the first substrate 101A by a scribing line forming apparatus (not shown) , And a second scribe line (S2) is further formed on the surface of the second substrate (102A).

Next, the first scribing line S1, the second scribing line S2, and the third scribing line S3 are divided by a dividing device (not shown) to form a plurality of unit bonded substrates 100. [

(6) Control operation of the termination removing device

11 to 15, a method of dividing the end member 107 of the first unit substrate 101 from the substrate 100 and removing the end members 107 from the first unit substrate 101 will be described do. 11 is a flowchart showing a control operation of the apparatus for removing a material. Fig. 12 and Fig. 14 to Fig. 15 are schematic side views of an apparatus for removing a substrate showing a blow step of the apparatus for removing a substrate. 13 is a partially enlarged view of Fig.

The control flow chart described below is an example, and each step can be omitted and replaced as necessary. Also, a plurality of steps may be executed at the same time, or some or all of them may be executed in a superimposed manner.

Each block in the control flow chart is not limited to a single control operation, but can be replaced with a plurality of control operations represented by a plurality of blocks.

In addition, the operation of each device is a result of a command from the controller 50 to each device, and these are expressed by each step of the software application.

In step S1 of Fig. 11, as shown in Fig. 9, the substrate 100 on which the end member 107 is left is placed on the table 13 (mounting step). Here, as shown in Fig. 9, the first unit substrate 101 is positioned downward with respect to the second unit substrate 102. As shown in Fig. Therefore, the stage member 107 is placed on the table 13 in a state where the stage member 107 is lowered to the lower side of the end portion of the second unit substrate 102. Specifically, the controller 50 controls the adsorption transport apparatus 7 to perform the above operation.

In step S2, the substrate 100 is adsorbed on the table 13 (adsorption step). More specifically, the controller 50 controls the adsorption device 16 to execute the above operation.

In step S3, as shown in Figs. 12 and 13, a blow for causing the gas flow FL to touch the end member 107 or the vicinity of the end member of the second unit substrate 102 (that is, the end face 102b) And is performed for a predetermined time (blow step). Specifically, gas is supplied from the air blowing device 23 to the air nozzle 23a to generate a gas flow FL. As a result, the end member 107 is separated from the main body 106. More specifically, the controller 50 controls the air blowing device 23 to execute the above operation. The blowing operation may be started before the step S1 or the step S2, or may be performed after the step S3.

Since the air nozzle 23a is arranged at an oblique angle (that is, not perpendicular to the end face 102b of the second unit substrate 102) from above the position away from the end member 107, Or the cross-section 102b of the second unit substrate 102, as shown in Fig. Therefore, it is possible to impart an optimal flow of gas to the end face 107 and / or the end face 102b of the second unit substrate 102 so that the end face 107 can be detached from the main body 106. [

In addition, since the main body 106 and the end member 107 are attracted to the table 13 during the division by the air blow step, the division is stably performed.

In step S4, the adsorption of the substrate 100 to the table 13 is stopped. More specifically, the controller 50 controls the adsorption device 16 to execute the above operation. Also, the adsorption may be continued after step S4.

14, the adsorption section 7a of the adsorption transport apparatus 7 adsorbs the second unit substrate 102 of the substrate 100 as shown in Fig. 14, and the adsorption section 7a of the adsorption section 7a adsorbs the substrate 100 And lifted from the table 13 (lifting step).

In this method, after the separation by the air blow step, the substrate 100 is lifted from the table 13. As a result, as shown in Fig. 15, the divided end member 107 is left on the table 13. Fig.

The end member removing device 61 does not move the end member from the main body of the first unit substrate while holding the end member as in the conventional case but allows the flow of the gas (FL) generated by the air blow device (23) 107 from the main body 106 of the first unit substrate 101. Unlike the prior art, the gas flow FL allows the main body 106 of the first unit substrate 101 to be in a noncontact manner without moving and holding the end member 107 by any member, . As a result, since the exposed surface 102a of the second unit substrate 102 is not pressed by the end member 107 during the separation of the end member 107, the exposed surface is not damaged.

Since the above-described division is performed in a state in which the stage member 107 is placed on the table 13, management of the stage member 107 after the division is easy. In other words, there is no problem that the end member 107 after the division is scattered to another position.

2. Other Embodiments

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the gist of the invention. In particular, the plurality of embodiments and modifications described in this specification may be arbitrarily combined as needed.

(1) Modification of the end member removing device

The edge material removing device may be formed in a device other than the pedestal on which the bonded substrate stack is placed by the substrate inverting device.

(2) Modification of substrate

A bonded brittle material substrate to which two brittle material substrates are bonded includes a flat display panel such as a liquid crystal panel, a plasma display panel, and an organic EL display panel to which a glass substrate is bonded and a flat display panel in which a silicon substrate, a sapphire substrate, And a semiconductor substrate.

The type of the substrate is not particularly limited. The substrate includes glass of a single plate, a semiconductor wafer, and a ceramic substrate.

(3) Variation of scribe line

The shape of the scribe line is not limited. In the first embodiment, the scribe line is a straight line, but a scribe line may have a curve partially or entirely.

(4) Variation of gas

In the above embodiment, air or nitrogen is used as the gas for separating the end member. However, it is also possible to use another gas (for example, an inert gas such as argon) in accordance with the environment (atmosphere) have.

1: substrate processing apparatus
3: Substrate placement stage
5: substrate reversing device
7: Adsorption conveying device
13: Table
13a: Putting it on
15: Support member
23: Air blow device
23a: Air nozzle
25: Gas supply device
61:
100: unit bonded substrate
101: first unit substrate
102: second unit substrate
102a: exposed surface
102b: section
106: Body
107: Component

Claims (8)

And a second substrate bonded to the back surface of the first substrate, wherein the scribing line is formed on a surface of the scribing line for cutting off the substrate from the main body,
A substrate mounting part on which the bonded substrate stack is placed with the first substrate facing downward,
An air blow device for separating the end material from the main body by causing a flow of gas to touch the end material of the end material or the end material of the second substrate,
(10). The method according to claim 1,
Wherein the air blow device is disposed at a higher position than the bonded substrate and has a nozzle which faces downwardly toward the end of the step material or the vicinity of the step material of the second substrate. 3. The method according to claim 1 or 2,
Further comprising an adsorption device formed in the substrate mounting section for adsorbing the bonded substrate. 3. The method according to claim 1 or 2,
And a lifting device for lifting the bonded substrate from the substrate mounting portion by suctioning the second substrate. A first substrate having a scribe line formed on a surface thereof for cutting off a substrate from a main body and a second substrate bonded to a back surface of the first substrate,
A mounting step of placing the bonded substrate stack on a substrate mounting part in a state in which the first substrate is downward,
An air blow step for separating the end material from the main body by making a flow of the gas come into contact with the end material or the vicinity of the end material of the main body,
. 6. The method of claim 5,
Wherein the air blow step causes a flow of gas to be obliquely downward from a position higher than the bonded substrate toward the end member of the end member or the end member of the main body. The method according to claim 5 or 6,
Further comprising an adsorption step of adsorbing the bonded substrate to the substrate mounting section. The method according to claim 5 or 6,
Further comprising a lifting step of lifting the first substrate and the second substrate from the substrate mounting portion by suctioning the second substrate.

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