JP2019099407A - Substrate aligning device - Google Patents

Substrate aligning device Download PDF

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JP2019099407A
JP2019099407A JP2017230253A JP2017230253A JP2019099407A JP 2019099407 A JP2019099407 A JP 2019099407A JP 2017230253 A JP2017230253 A JP 2017230253A JP 2017230253 A JP2017230253 A JP 2017230253A JP 2019099407 A JP2019099407 A JP 2019099407A
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Prior art keywords
substrates
alignment
substrate
strip
alignment member
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JP6970432B2 (en
Inventor
勝喜 中田
Katsuyoshi Nakata
勝喜 中田
平道 谷垣内
Hiramichi Yakaito
平道 谷垣内
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2017230253A priority Critical patent/JP6970432B2/en
Priority to KR1020180147795A priority patent/KR20190064466A/en
Priority to TW107142628A priority patent/TW201925114A/en
Priority to CN201811456187.0A priority patent/CN110028233A/en
Publication of JP2019099407A publication Critical patent/JP2019099407A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor

Abstract

To align a plurality of substrates to be supplied to a parting step.SOLUTION: A substrate aligning device 1 for aligning an end faces 111a of a plurality of substrates 111 to a straight line includes a conveyor 3, an aligning member 5, and an alignment driving unit 7. The conveyor 3 has a conveying face 3a for conveying a plurality of the substrates 111. The aligning member 5 is installed above the conveying face 3a and has an aligning end face 5a of a straight line at the downstream side of conveying. The alignment driving unit 7 can move the aligning member 5 between a first position upward distant from the conveying face 3a and a second position touching or near the conveying face 3a.SELECTED DRAWING: Figure 10

Description

本発明は、基板整列装置、特に、複数の基板を整列する基板整列装置に関する。   The present invention relates to a substrate alignment apparatus, and more particularly to a substrate alignment apparatus for aligning a plurality of substrates.

ガラス基板の分断方法として、下記の方法が知られている(例えば、特許文献1を参照)。
第1ステップでは、マザー基板の互いに直交するX方向とY方向に複数のスクライブラインを形成する。
第2ステップでは、X方向に延びるスクライブラインに沿って分断を行い、複数の短冊状(一方に長い矩形状の)基板を形成する。
第3ステップでは、短冊状の基板をY方向に延びるスクライブラインに沿って分断を行い、単位基板を形成する。
The following method is known as a method of dividing a glass substrate (see, for example, Patent Document 1).
In the first step, a plurality of scribe lines are formed in the X direction and the Y direction orthogonal to each other of the mother substrate.
In the second step, division is performed along a scribe line extending in the X direction to form a plurality of strip-shaped (long rectangular shape on one side) substrates.
In the third step, the strip substrate is divided along a scribe line extending in the Y direction to form a unit substrate.

特開2013−71335号公報JP, 2013-71335, A

生産性を向上させるため、第3ステップでは、従来より複数の短冊状基板を同時に分断することが望まれている。しかし、その場合、複数の短冊状基板が互いに整列していなければ、Y方向に延びるスクライブラインの位置が互いにずれてしまい、正確な分断ができなくなる。   In order to improve the productivity, in the third step, it has been desired to simultaneously cut a plurality of strip substrates at the same time. However, in this case, if the plurality of strip-like substrates are not aligned with one another, the positions of the scribe lines extending in the Y direction shift from one another, and accurate division can not be performed.

本発明の目的は、次に分断工程が待っている複数の基板を整列させることにある。   An object of the present invention is to align a plurality of substrates, which are then awaiting the dividing step.

以下に、課題を解決するための手段として複数の態様を説明する。これら態様は、必要に応じて任意に組み合せることができる。   Below, a plurality of modes are explained as a means to solve a subject. These aspects can be arbitrarily combined as needed.

本発明の一見地に係る基板整列装置は、複数の基板の端面を直線状に整列するための装置であって、コンベヤ装置と、整列部材と、駆動部とを備えている。
コンベヤ装置は、複数の基板を搬送する搬送面を有する。
整列部材は、搬送面の上方に配置され、搬送方向第1側に直線状の整列端面を有する。
駆動部は、整列部材を、搬送面から上方に離れた第1位置と、搬送面に当接又は近接した第2位置との間で移動可能である。
この装置では、整列部材が第2位置にあるときに、コンベヤ装置が複数の基板を搬送して複数の基板の端面を整列部材の整列端面に当接させることで、複数の基板の端面をコンベヤ装置搬送方向に整列させる。
The substrate alignment apparatus according to the first aspect of the present invention is an apparatus for aligning the end faces of a plurality of substrates linearly, and includes a conveyor device, an alignment member, and a drive unit.
The conveyor apparatus has a transport surface for transporting a plurality of substrates.
The alignment member is disposed above the transport surface and has a linear alignment end face on the first side in the transport direction.
The drive unit is capable of moving the alignment member between a first position spaced upward from the transport surface and a second position in abutment or proximity to the transport surface.
In this apparatus, when the alignment member is in the second position, the conveyor device conveys the plurality of substrates and brings the end faces of the plurality of substrates into contact with the alignment end faces of the alignment member to convey the end faces of the plurality of substrates Align in the machine transport direction.

基板整列装置は、コントローラをさらに備えていてもよい。
コントローラは、下記のステップを実行する。
◎駆動部によって整列部材を第1位置に配置させるステップ。
◎コンベヤ装置によって、複数の基板を整列部材の下方を搬送方向第2側から搬送方向第1側に通過させるステップ。
◎駆動部によって整列部材を第2位置に移動させるステップ。
◎コンベヤ装置によって複数の基板を搬送方向第2側に移動させることで、複数の基板の端面を整列部材の整列端面に当接させるステップ。
この装置では、コンベヤ装置が複数の基板を整列部材の下方を通過させた後に、整列部材をコンベヤ装置の搬送面に当接又は近接させ、次に、コンベヤ装置が複数の基板を搬送して複数の基板の端面を整列部材の整列端面に当接させることで、複数の基板の端面をコンベヤ装置搬送方向に整列させる。
The substrate alignment apparatus may further include a controller.
The controller performs the following steps:
配置 arranging the alignment member at the first position by the drive unit.
A step of passing the plurality of substrates below the alignment member from the second side in the transport direction to the first side in the transport direction by the conveyor device.
ス テ ッ プ moving the alignment member to the second position by the drive unit.
Step of bringing the end faces of the plurality of substrates into contact with the alignment end surface of the alignment member by moving the plurality of substrates to the second side in the transport direction by the conveyor device.
In this apparatus, after the conveyor device passes the plurality of substrates below the alignment member, the alignment member is brought into contact with or close to the transport surface of the conveyor device, and then the conveyor device transports the plurality of substrates to The end faces of the plurality of substrates are aligned in the conveyance direction of the conveyor device by bringing the end faces of the substrates into contact with the alignment end faces of the alignment member.

基板整列装置は、複数の基板を搬送面上で保持することで複数の基板の位置を固定する基板保持部をさらに備えていてもよい。コントローラは、複数の基板を搬送面上で保持することで複数の基板の位置を固定するステップをさらに実行してもよい。   The substrate alignment apparatus may further include a substrate holding unit that fixes the positions of the plurality of substrates by holding the plurality of substrates on the transport surface. The controller may further perform the step of fixing the positions of the plurality of substrates by holding the plurality of substrates on the transport surface.

本発明に係る基板整列装置では、次に分断工程が待っている複数の基板を整列させることができる。   In the substrate alignment apparatus according to the present invention, it is possible to align a plurality of substrates which are next to be divided.

本発明の第1実施形態に係る基板整列装置の側面図。The side view of the substrate alignment device concerning a 1st embodiment of the present invention. 基板整列装置の制御構成を示すブロック図。FIG. 2 is a block diagram showing a control configuration of a substrate alignment apparatus. 基板整列装置の整列制御動作を示すフローチャート。6 is a flowchart showing an alignment control operation of the substrate alignment apparatus. 整列動作の一状態を示す基板整列装置の側面図。The side view of the substrate alignment apparatus which shows one state of alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the substrate alignment apparatus which shows one state of alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the substrate alignment apparatus which shows one state of alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the substrate alignment apparatus which shows one state of alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the substrate alignment apparatus which shows one state of alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。FIG. 7 is a schematic plan view of the substrate alignment device showing one state of alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。FIG. 7 is a schematic plan view of the substrate alignment device showing one state of alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。FIG. 7 is a schematic plan view of the substrate alignment device showing one state of alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。FIG. 7 is a schematic plan view of the substrate alignment device showing one state of alignment operation.

1.第1実施形態
(1)基板整列装置の構成
図1を用いて、基板整列装置1を説明する。図1は、本発明の第1実施形態に係る基板整列装置の側面図である。
基板整列装置1は、複数の短冊状基板111の端面111aを直線状に整列するための装置である。複数の短冊状基板111は、貼り合わせ基板を複数の第1スクライブラインに沿って分断されることで形成されている。複数の短冊状基板111は、図9に示すように、単位基板と端材とを有しており、後に複数のスクライブラインに沿って分断されることで複数の単位基板になる。
図1において、紙面直交方向が第1方向(矢印X)であり、図左右方向が第2方向(矢印Y)である。複数の短冊状基板111の搬送方向は第2方向であり、複数の短冊状基板111は第2方向において左から右に向かって搬送されながら加工される。そのため、図1の第2方向左側が搬送上流側であり、図1の第2方向右側が搬送方向下流側である。
基板整列装置1は、コンベヤ装置3(コンベヤ装置の一例)と、整列部材5(整列部材の一例)と、整列駆動部7(駆動部の一例、図2)とを備えている。
1. First Embodiment (1) Configuration of Substrate Alignment Device The substrate alignment device 1 will be described with reference to FIG. FIG. 1 is a side view of a substrate alignment apparatus according to a first embodiment of the present invention.
The substrate alignment apparatus 1 is an apparatus for aligning the end faces 111a of the plurality of strip-like substrates 111 in a straight line. The plurality of strip-like substrates 111 are formed by dividing the bonded substrate along the plurality of first scribe lines. As shown in FIG. 9, the plurality of strip-like substrates 111 have a unit substrate and an end material, and are later divided along a plurality of scribe lines to become a plurality of unit substrates.
In FIG. 1, the direction orthogonal to the sheet is the first direction (arrow X), and the horizontal direction is the second direction (arrow Y). The transport direction of the plurality of strip-shaped substrates 111 is the second direction, and the plurality of strip-shaped substrates 111 are processed while being transported from the left to the right in the second direction. Therefore, the left side in the second direction in FIG. 1 is the upstream side of conveyance, and the right side in the second direction in FIG. 1 is the downstream side in the conveyance direction.
The substrate alignment device 1 includes a conveyor device 3 (an example of a conveyor device), an alignment member 5 (an example of an alignment member), and an alignment drive unit 7 (an example of a drive unit, FIG. 2).

コンベヤ装置3は、複数の短冊状基板111を搬送する搬送面3aを有する。具体的には、コンベヤ装置3は、搬送方向に延びるベルトコンベヤである。図1では、複数の短冊状基板111は、図9に示すように、第1方向に間を空けて並んでおり、第2方向(搬送方向)に延びて配置されている。そして、複数の短冊状基板111の端面111aは、搬送方向上流側を向いている。
整列部材5は、搬送面3aの上方に配置され、直線状の整列端面5aを有する。整列端面5aは、第1方向に沿って延び搬送方向下流側を向いた平面である。
The conveyor device 3 has a transport surface 3 a for transporting a plurality of strip-like substrates 111. Specifically, the conveyor device 3 is a belt conveyor extending in the transport direction. In FIG. 1, as shown in FIG. 9, the plurality of strip-shaped substrates 111 are arranged in the first direction at intervals, and extend in the second direction (the transport direction). And the end surface 111a of the several strip-shaped board | substrate 111 has faced the conveyance direction upstream.
The alignment member 5 is disposed above the transport surface 3a and has a linear alignment end face 5a. The alignment end face 5a is a flat surface extending along the first direction and facing the downstream side in the transport direction.

整列駆動部7は、整列部材5を、搬送面3aから上方に離れた第1位置(図1)と、搬送面3aに当接又は近接した第2位置(図4)との間で移動可能である。具体的には、整列駆動部7は、整列部材5を上下方向に駆動する流体シリンダである。整列駆動部7は、他の直線駆動装置であってもよい。
基板整列装置1では、整列部材5が第2位置にあるときに、コンベヤ装置3が複数の短冊状基板111を搬送して複数の短冊状基板111の端面111aを整列部材5の整列端面5aに当接させることで、複数の短冊状基板111の端面111aを搬送方向に整列させる。
The alignment drive unit 7 can move the alignment member 5 between a first position (FIG. 1) spaced upward from the transport surface 3a and a second position (FIG. 4) in contact with or close to the transport surface 3a. It is. Specifically, the alignment drive unit 7 is a fluid cylinder that drives the alignment member 5 in the vertical direction. The alignment drive 7 may be another linear drive.
In the substrate alignment device 1, when the alignment member 5 is at the second position, the conveyor device 3 conveys the plurality of strip-like substrates 111 and sets the end faces 111a of the plurality of strip-like substrates 111 to the alignment end face 5a of the alignment member 5. By bringing them into contact, the end faces 111a of the plurality of strip-like substrates 111 are aligned in the transport direction.

基板整列装置1は、さらに、吸着保持装置9(基板保持部の一例)を有している。吸着保持装置9は、整列後の複数の短冊状基板111を搬送面3a上で保持するための装置である。それにより、短冊状基板111の搬送面3a上の位置が固定される。吸着保持装置9は、整列部材5より搬送方向下流側に配置されている。吸着保持装置9は、吸着部11、保持駆動部13(図2)、吸引装置15(図2)を有している。
吸着部11は、下方に向いた吸着口を有して、上下方向に移動可能な部材である。保持駆動部13(図2)は、吸着部11を上下方向に移動する装置である。吸引装置15(図2)は、吸着部11に負圧を供給する装置である。
The substrate alignment device 1 further includes a suction holding device 9 (an example of a substrate holding unit). The suction holding device 9 is a device for holding the plurality of aligned strip substrates 111 on the transport surface 3 a. Thereby, the position on the conveyance surface 3a of the strip-like substrate 111 is fixed. The suction holding device 9 is disposed downstream of the alignment member 5 in the transport direction. The suction holding device 9 has a suction unit 11, a holding drive unit 13 (FIG. 2), and a suction device 15 (FIG. 2).
The suction unit 11 is a member that has a suction port facing downward and is movable in the vertical direction. The holding drive unit 13 (FIG. 2) is a device that moves the suction unit 11 in the vertical direction. The suction device 15 (FIG. 2) is a device that supplies a negative pressure to the suction unit 11.

(2)基板整列装置の制御構成
図2を用いて、基板整列装置の制御構成を説明する。図2は、基板整列装置の制御構成を示すブロック図である。
図2に示すように、基板整列装置1は、コントローラ50を有している。
(2) Control Configuration of Substrate Alignment Device The control configuration of the substrate alignment device will be described with reference to FIG. FIG. 2 is a block diagram showing a control configuration of the substrate alignment apparatus.
As shown in FIG. 2, the substrate alignment apparatus 1 has a controller 50.

コントローラ50は、プロセッサ(例えば、CPU)と、記憶装置(例えば、ROM、RAM、HDD、SSDなど)と、各種インターフェース(例えば、A/Dコンバータ、D/Aコンバータ、通信インターフェースなど)を有するコンピュータシステムである。コントローラ50は、記憶部(記憶装置の記憶領域の一部又は全部に対応)に保存されたプログラムを実行することで、各種制御動作を行う。   The controller 50 is a computer having a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.) It is a system. The controller 50 performs various control operations by executing the program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

コントローラ50は、単一のプロセッサで構成されていてもよいが、各制御のために独立した複数のプロセッサから構成されていてもよい。
コントローラ50の各要素の機能は、一部又は全てが、コントローラ50を構成するコンピュータシステムにて実行可能なプログラムとして実現されてもよい。その他、コントローラ50の各要素の機能の一部は、カスタムICにより構成されていてもよい。
The controller 50 may be configured by a single processor, but may be configured by a plurality of independent processors for each control.
Some or all of the functions of the components of the controller 50 may be implemented as a program that can be executed by a computer system that constitutes the controller 50. In addition, some of the functions of each element of the controller 50 may be configured by a custom IC.

コントローラ50には、コンベヤ装置3、整列駆動部7、保持駆動部13、吸引装置15が接続されている。
コントローラ50には、図示しないが、対象物の大きさ、形状及び位置検出するセンサ、各装置の状態を検出するためのセンサ及びスイッチ、並びに情報入力装置が接続されている。
The conveyor device 3, the alignment drive unit 7, the holding drive unit 13, and the suction device 15 are connected to the controller 50.
Although not shown, the controller 50 is connected with sensors for detecting the size, shape and position of an object, sensors and switches for detecting the state of each device, and an information input device.

(3)基板整列装置の整列動作
図3〜図10を用いて、基板整列装置の整列動作を説明する。図3は、基板整列装置の整列制御動作を示すフローチャートである。図4〜8は、整列動作の一状態を示す基板整列装置の側面図である。図9〜12は、整列動作の一状態を示す基板整列装置の模式的平面図である。
(3) Alignment Operation of Substrate Alignment Device The alignment operation of the substrate alignment device will be described with reference to FIGS. FIG. 3 is a flowchart showing the alignment control operation of the substrate alignment apparatus. 4-8 are side views of the substrate alignment apparatus showing one state of alignment operation. 9 to 12 are schematic plan views of the substrate alignment device showing one state of alignment operation.

以下に説明する制御フローチャートは例示であって、各ステップは必要に応じて省略及び入れ替え可能である。また、複数のステップが同時に実行されたり、一部又は全てが重なって実行されたりしてもよい。
さらに、制御フローチャートの各ブロックは、単一の制御動作とは限らず、複数のブロックで表現される複数の制御動作に置き換えることができる。
なお、各装置の動作は、コントローラ50から各装置への指令の結果であり、これらはソフトウェア・アプリケーションの各ステップによって表現される。
The control flowchart described below is an example, and each step can be omitted and replaced as necessary. Also, multiple steps may be performed simultaneously, or some or all may be performed overlapping.
Furthermore, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.
Note that the operation of each device is the result of a command from the controller 50 to each device, and these are represented by each step of the software application.

図3では、コントローラ50は、下記のステップを実行する。
ステップS1では、整列駆動部7によって整列部材5を第1位置に配置させる。その結果、図1に示すように、整列部材5は、搬送面3aから離れて配置される。
ステップS2では、コンベヤ装置3によって、複数の短冊状基板111を整列部材5の下方を搬送方向上流側から搬送方向下流側に通過させる。その結果、図1及び図9に示すように、複数の短冊状基板111が整列部材5より搬送方向下流側に位置する。図9では、複数の短冊状基板111の端面111aの搬送方向位置が互いにずれていることが強調して示されている。
In FIG. 3, the controller 50 performs the following steps.
In step S1, the alignment driving unit 7 arranges the alignment member 5 at the first position. As a result, as shown in FIG. 1, the alignment member 5 is disposed away from the transport surface 3a.
In step S2, the conveyor device 3 passes the plurality of strip-like substrates 111 below the alignment member 5 from the upstream side in the transport direction to the downstream side in the transport direction. As a result, as shown in FIGS. 1 and 9, the plurality of strip-like substrates 111 are positioned downstream of the alignment member 5 in the transport direction. In FIG. 9, it is emphasized that the transport direction positions of the end surfaces 111 a of the plurality of strip-like substrates 111 are shifted from each other.

ステップS3では、整列駆動部7によって、整列部材5を第2位置に移動させる。その結果、図4に示すように、整列部材5が搬送面3aに当接又は近接する位置に配置される。
ステップS4では、コンベヤ装置3によって複数の短冊状基板111を搬送方向上流側に移動させることで、複数の短冊状基板111の端面111aを整列部材5の整列端面5aに当接させる。その結果、図5及び図11に示すように、複数の短冊状基板111の端面111aの搬送方向位置は同じになる。このようにして、複数の短冊状基板111が搬送方向に整列される。
In step S3, the alignment driving unit 7 moves the alignment member 5 to the second position. As a result, as shown in FIG. 4, the alignment member 5 is disposed at a position in contact with or close to the transport surface 3a.
In step S 4, the end faces 111 a of the plurality of strip-like substrates 111 are brought into contact with the alignment end face 5 a of the alignment member 5 by moving the plurality of strip-like substrates 111 upstream in the transport direction by the conveyor device 3. As a result, as shown in FIGS. 5 and 11, the transport direction positions of the end faces 111a of the plurality of strip-like substrates 111 become the same. In this manner, the plurality of strip-like substrates 111 are aligned in the transport direction.

ステップS5では、整列駆動部7によって、整列部材5を第1位置に移動させる。その結果、図6に示すように、整列部材5が搬送面3aから上方に離れる。
ステップS6では、コンベヤ装置3によって、複数の短冊状基板111を搬送方向下流側に移動させる。その結果、図7及び図11に示すように、複数の短冊状基板111が整列部材5から搬送方向下流側に離れた位置に配置される。このときも複数の短冊状基板111の整列状態は維持される。
ステップS7では、吸着保持装置9が短冊状基板111を吸着して保持する。その結果、図8及び図12に示すように、複数の短冊状基板111が搬送面3a上で固定される。具体的には、吸着保持装置9は、複数の短冊状基板111の端材部分を吸着する。この状態で図示しない基板分断装置が短冊状基板111のスクライブラインを分割していき、複数の単位基板を形成する。このときに、複数の短冊状基板111が整列されているので、スクライブラインも整列しており、したがって分断の精度が向上する。
In step S5, the alignment drive unit 7 moves the alignment member 5 to the first position. As a result, as shown in FIG. 6, the alignment member 5 separates upward from the transport surface 3a.
In step S6, the plurality of strip-like substrates 111 are moved downstream in the transport direction by the conveyor device 3. As a result, as shown in FIG. 7 and FIG. 11, the plurality of strip-like substrates 111 are arranged at the positions separated from the alignment member 5 on the downstream side in the transport direction. Also in this case, the alignment state of the plurality of strip substrates 111 is maintained.
In step S7, the suction holding device 9 holds the strip substrate 111 by suction. As a result, as shown in FIGS. 8 and 12, the plurality of strip-like substrates 111 are fixed on the transport surface 3a. Specifically, the suction holding device 9 sucks the end material portions of the plurality of strip-like substrates 111. In this state, a substrate cutting device (not shown) divides the scribe line of the strip-like substrate 111 to form a plurality of unit substrates. At this time, since the plurality of strip-like substrates 111 are aligned, the scribe lines are also aligned, and therefore the accuracy of the division is improved.

以上に述べたように、基板整列装置1では、コンベヤ装置3が複数の短冊状基板111を整列部材5の下方を通過させた後に、整列部材5をコンベヤ装置3の搬送面3aに当接又は近接させ、次に、コンベヤ装置3が複数の短冊状基板111を搬送して複数の短冊状基板111の端面111aを整列部材5の整列端面5aに当接させることで、複数の短冊状基板111の端面111aを第2方向(基板搬送方向)に整列させる。この結果、次に複数の単位基板を形成するために分断するときに、複数の短冊状基板111が整列されているので、スクライブラインも整列しており、したがって分断の精度が向上する。   As described above, in the substrate alignment device 1, after the conveyor device 3 passes the plurality of strip-like substrates 111 below the alignment member 5, the alignment member 5 abuts on the conveying surface 3 a of the conveyor device 3 or Next, the plurality of strip-like substrates 111 are brought close by conveying the plurality of strip-like substrates 111 and bringing the end faces 111 a of the plurality of strip-like substrates 111 into contact with the alignment end faces 5 a of the alignment member 5. Is aligned in the second direction (substrate transfer direction). As a result, when dividing to form a plurality of unit substrates next, since the plurality of strip-like substrates 111 are aligned, the scribe lines are also aligned, and therefore the accuracy of the division is improved.

2.他の実施形態
以上、本発明の一実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、発明の要旨を逸脱しない範囲で種々の変更が可能である。特に、本明細書に書かれた複数の実施形態及び変形例は必要に応じて任意に組み合せ可能である。
2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, the embodiments and modifications described herein may be arbitrarily combined as needed.

(1)基板の変形例
2枚の脆性材料基板を貼り合せた貼り合せ脆性材料基板には、ガラス基板を貼り合わせた液晶パネル、プラズマディスプレイパネル、有機ELディスプレイパネル等のフラットディスプレイパネルと、シリコン基板、サファイヤ基板等をガラス基板に貼り合わせた半導体基板とが含まれる。
基板の種類は特に限定されない。基板は、単板のガラス、半導体ウエハ、セラミック基板を含んでいる。
(1) Modification of Substrate A bonded brittle material substrate in which two brittle material substrates are bonded together is a liquid crystal panel in which a glass substrate is bonded, a flat display panel such as a plasma display panel, an organic EL display panel, and silicon The substrate includes a semiconductor substrate in which a substrate, a sapphire substrate or the like is bonded to a glass substrate.
The type of substrate is not particularly limited. The substrate includes a single plate glass, a semiconductor wafer, and a ceramic substrate.

(2)各種装置の変形例
第1実施形態では整列後に吸着保持装置9が短冊状基板を保持していたが、必ずしも保持動作を行わなくてもよい。
吸着保持装置が設けられていなくてもよい。
短冊状基板以外の基板を整列してもよい。
(2) Modifications of Various Devices In the first embodiment, the suction holding device 9 holds the strip-like substrate after alignment, but the holding operation may not necessarily be performed.
The adsorption holding device may not be provided.
Substrates other than the strip substrate may be aligned.

本発明は、複数の基板を整列する基板整列装置に広く適用できる。   The present invention is broadly applicable to a substrate alignment apparatus for aligning a plurality of substrates.

1 :基板整列装置
3 :コンベヤ装置
3a :搬送面
5 :整列部材
5a :整列端面
7 :整列駆動部
9 :吸着保持装置
11 :吸着部
13 :保持駆動部
15 :吸引装置
50 :コントローラ
111 :短冊状基板
111a :端面
DESCRIPTION OF SYMBOLS 1: Substrate alignment device 3: Conveyor device 3a: Conveying surface 5: Alignment member 5a: Alignment end surface 7: Alignment drive part 9: Suction holding device 11: Suction part 13: Holding drive part 15: Suction device 50: Controller 111: Strip Substrate 111a: End face

Claims (3)

複数の基板の端面を直線状に整列するための基板整列装置であって、
複数の基板を搬送する搬送面を有するコンベヤ装置と、
前記搬送面の上方に配置され、搬送方向第1側に直線状の整列端面を有する整列部材と、
前記整列部材を、前記搬送面から上方に離れた第1位置と、前記搬送面に当接又は近接した第2位置との間で移動可能な駆動部と、
を備えた基板整列装置。
A substrate alignment apparatus for aligning the end faces of a plurality of substrates in a straight line, comprising:
A conveyor apparatus having a transport surface for transporting a plurality of substrates;
An alignment member disposed above the transport surface and having a linear alignment end face on the first side in the transport direction;
A driving unit capable of moving the alignment member between a first position spaced upward from the transport surface and a second position in contact with or close to the transport surface;
Substrate alignment device equipped with.
コントローラをさらに備え、
前記コントローラは、
前記駆動部によって前記整列部材を前記第1位置に配置させるステップと、
前記コンベヤ装置によって、前記複数の基板を前記整列部材の下方を搬送方向第2側から搬送方向第1側に通過させるステップと、
前記駆動部によって前記整列部材を前記第2位置に移動させるステップと、
前記コンベヤ装置によって前記複数の基板を搬送方向第2側に移動させることで、前記複数の基板の端面を前記整列部材の前記整列端面に当接させるステップと、
を実行する、請求項1に記載の基板整列装置。
Further equipped with a controller,
The controller
Placing the alignment member in the first position by the drive unit;
Passing the plurality of substrates below the alignment member from the second side in the transport direction to the first side in the transport direction by the conveyor device;
Moving the alignment member to the second position by the drive unit;
Moving the end surfaces of the plurality of substrates to the alignment end surface of the alignment member by moving the plurality of substrates to the second side in the transport direction by the conveyor device;
The substrate alignment apparatus according to claim 1, wherein:
前記複数の基板を前記搬送面上で保持することで前記複数の基板の位置を固定する基板保持部をさらに備え、
前記コントローラは、前記複数の基板を前記搬送面上で保持することで前記複数の基板の位置を固定するステップをさらに実行する、請求項2に記載の基板整列装置。
The substrate processing apparatus further includes a substrate holding unit that fixes the positions of the plurality of substrates by holding the plurality of substrates on the transport surface.
The substrate alignment apparatus according to claim 2, wherein the controller further executes the step of fixing the positions of the plurality of substrates by holding the plurality of substrates on the transport surface.
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