JP2016016525A - Substrate machining device - Google Patents

Substrate machining device Download PDF

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JP2016016525A
JP2016016525A JP2014138525A JP2014138525A JP2016016525A JP 2016016525 A JP2016016525 A JP 2016016525A JP 2014138525 A JP2014138525 A JP 2014138525A JP 2014138525 A JP2014138525 A JP 2014138525A JP 2016016525 A JP2016016525 A JP 2016016525A
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substrate
transport mechanism
processing
transport
holding member
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JP6435669B2 (en
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直 得永
Nao Tokunaga
直 得永
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2014138525A priority Critical patent/JP6435669B2/en
Priority to KR1020150029278A priority patent/KR20160004903A/en
Priority to TW104107547A priority patent/TWI659914B/en
Priority to CN201510173280.0A priority patent/CN105216126B/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations

Abstract

PROBLEM TO BE SOLVED: To enable the machining of a substrate with high efficiency.SOLUTION: A substrate machining device is equipped with a carrying belt 2 which carries a substrate; a break device 3 which is disposed on a side part in a direction intersecting a carrying direction of the carrying belt 2, and machines the substrate; and a lower carrying mechanism 4 and an upper carrying mechanism 5 which are disposed side by side, and synchronously carry the substrate between the carrying belt 2 and the break device 3.SELECTED DRAWING: Figure 3A

Description

本発明は、基板加工装置、特に、基板の搬送機構を備えた基板加工装置に関する。   The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus including a substrate transport mechanism.

基板に溝を形成するスクライブ装置や、基板を分断するブレイク装置は、加工用のヘッドを保持するビームを有している。ビームは、左右の支柱によって門型に支持された横方向に延びる梁であり、加工される基板が載置されるテーブルの上方に配置されている。   A scribing device for forming a groove in a substrate and a breaking device for dividing the substrate have a beam for holding a processing head. The beam is a beam extending in the lateral direction supported in a gate shape by left and right columns, and is disposed above a table on which a substrate to be processed is placed.

このような基板加工装置では、基板が載置されたテーブルはビームの下方をくぐるように移動する。そして、加工ヘッドに装着されたツールによって基板が加工される。したがって、スクライブ装置やブレイク装置を直列に配置し、基板を分断するための加工ラインを構成すると、加工ライン全体の長さが長くなる。   In such a substrate processing apparatus, the table on which the substrate is placed moves so as to pass under the beam. Then, the substrate is processed by a tool attached to the processing head. Therefore, when the scribing device and the breaking device are arranged in series to form a processing line for dividing the substrate, the entire processing line becomes long.

そこで、特許文献１では、基板が順次搬送される第１方向に対して直交する第２方向に、スクライブ装置やブレイク装置を配置している。このような構成にすることによって、加工ラインをコンパクトにすることができる。   Therefore, in Patent Document 1, a scribing device and a breaking device are arranged in a second direction orthogonal to the first direction in which the substrates are sequentially conveyed. With this configuration, the processing line can be made compact.

特開平１１−１１６２６０号公報Japanese Patent Laid-Open No. 11-116260

特許文献１の装置では、まず、基板を第１方向に沿って搬送し、搬送路上の加工基準位置（加工位置に対応する搬送路上の位置）で停止する。次に、基板を第２方向に搬送して加工装置における加工位置に位置させ、加工を行う。加工後、基板を搬送路上の加工基準位置に戻し、搬送路上の下流側に搬送する。   In the apparatus of Patent Document 1, first, the substrate is transported along the first direction, and stopped at a processing reference position on the transport path (a position on the transport path corresponding to the processing position). Next, the substrate is transported in the second direction to be positioned at a processing position in the processing apparatus, and processing is performed. After processing, the substrate is returned to the processing reference position on the transport path and transported downstream on the transport path.

しかし、このような方法では、加工が完了した先の基板が加工基準位置に戻され、搬送路上の下流側に搬送されるまで、次の基板に対して搬送及び加工の処理を行うことができない。このため、作業効率が低いという問題がある。   However, in such a method, the next substrate cannot be transported and processed until the processed substrate is returned to the processing reference position and transported downstream on the transport path. . For this reason, there exists a problem that work efficiency is low.

本発明の課題は、高い効率で基板を加工できるようにすることにある。   An object of the present invention is to enable a substrate to be processed with high efficiency.

本発明の一側面に係る基板加工装置は、基板を搬送する第１搬送機構と、第１搬送機構の搬送方向と交差する方向の側方に配置され基板を加工する加工機構と、互いに並べて配置され第１搬送機構と加工機構との間で基板を搬送する第２搬送機構及び第３搬送機構と、を備えている。   A substrate processing apparatus according to an aspect of the present invention is arranged side by side with a first transport mechanism that transports a substrate, a processing mechanism that is disposed on a side in a direction that intersects the transport direction of the first transport mechanism, and that processes the substrate. And a second transport mechanism and a third transport mechanism for transporting the substrate between the first transport mechanism and the processing mechanism.

この装置では、第１搬送機構によって搬送されてきた基板は、第２及び第３搬送機構によって第１搬送機構と加工機構との間で搬送される。   In this apparatus, the substrate transported by the first transport mechanism is transported between the first transport mechanism and the processing mechanism by the second and third transport mechanisms.

ここでは、基板が搬送される方向と交差する方向に加工機構が配置されているので、加工ラインの搬送方向の長さをコンパクトにすることができる。また、加工された基板を第２及び第３搬送機構の一方によって第１搬送機構に戻す際に、次の基板を他方の搬送機構によって加工機構に搬送できるので、基板の搬送及び加工にかかる時間を短縮でき、高い効率で基板を加工することができる。   Here, since the processing mechanism is arranged in a direction intersecting with the direction in which the substrate is transported, the length of the processing line in the transport direction can be made compact. Further, when the processed substrate is returned to the first transport mechanism by one of the second and third transport mechanisms, the next substrate can be transported to the processing mechanism by the other transport mechanism. The substrate can be processed with high efficiency.

本発明の別の側面に係る基板加工装置では、第２搬送機構及び第３搬送機構は、第１搬送機構により搬送されてきた未加工の基板を加工機構に搬送するとともに、加工機構により加工された基板を第１搬送機構に搬送する。   In the substrate processing apparatus according to another aspect of the present invention, the second transport mechanism and the third transport mechanism transport the unprocessed substrate transported by the first transport mechanism to the processing mechanism and are processed by the processing mechanism. The transferred substrate is transferred to the first transfer mechanism.

本発明のさらに別の側面に係る基板加工装置では、第２搬送機構及び第３搬送機構は、一方の搬送機構が加工された基板を搬送する際に、他方の搬送機構が次の未加工の基板を搬送する。   In the substrate processing apparatus according to yet another aspect of the present invention, when the second transport mechanism and the third transport mechanism transport the processed substrate by the one transport mechanism, the other transport mechanism moves to the next unprocessed substrate. Transport the substrate.

本発明のさらに別の側面に係る基板加工装置では、第２搬送機構及び第３搬送機構は、第１搬送機構より上方において、上下方向に並べて配置されている。   In the substrate processing apparatus according to still another aspect of the present invention, the second transport mechanism and the third transport mechanism are arranged side by side in the vertical direction above the first transport mechanism.

ここでは、各搬送機構の占有スペースを小さくすることができる。   Here, the space occupied by each transport mechanism can be reduced.

本発明のさらに別の側面に係る基板加工装置では、第２搬送機構及び第３搬送機構はそれぞれ、第１搬送機構と加工機構との間に配置されたレールと、基板を保持する保持部材と、保持部材を昇降する昇降機構と、を有している。そして、保持部材及び昇降機構はレールに沿って移動する。   In the substrate processing apparatus according to still another aspect of the present invention, each of the second transport mechanism and the third transport mechanism includes a rail disposed between the first transport mechanism and the processing mechanism, and a holding member that holds the substrate. And an elevating mechanism for elevating and lowering the holding member. Then, the holding member and the lifting mechanism move along the rail.

本発明のさらに別の側面に係る基板加工装置では、第１搬送機構は基板が載置される搬送ベルトを有している。   In the substrate processing apparatus according to still another aspect of the present invention, the first transport mechanism has a transport belt on which the substrate is placed.

本発明のさらに別の側面に係る基板加工装置では、第２搬送機構と第３搬送機構の加工機構側の端部と加工機構の加工位置との間で基板を搬送する加工用搬送ベルトをさらに備えている。   In the substrate processing apparatus according to still another aspect of the present invention, the processing transport belt for transporting the substrate between the end of the second transport mechanism and the third transport mechanism on the processing mechanism side and the processing position of the processing mechanism is further provided. I have.

以上のような本発明では、高い効率で基板を加工することが可能になる。   In the present invention as described above, the substrate can be processed with high efficiency.

本発明の一実施形態による基板加工装置の平面図。The top view of the substrate processing apparatus by one Embodiment of this invention. 基板の加工の様子を示す模式図。The schematic diagram which shows the mode of a process of a board | substrate. 加工動作を示す図。The figure which shows processing operation. 加工動作を示す図。The figure which shows processing operation. 加工動作を示す図。The figure which shows processing operation. 加工動作を示す図。The figure which shows processing operation.

図１は本発明の一実施形態による基板加工装置の平面図である。なお、図１においては、装置全体を模式化して示している。   FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In addition, in FIG. 1, the whole apparatus is shown typically.

この基板加工装置１は、基板を順次搬送するとともに、搬送されてきた基板の端部に形成された端子部分を露出するための装置である。この基板加工装置１の前段には、図示しないスクライブ装置及びブレイク装置が設けられている。スクライブ装置では１枚のマザー基板にブレイク用の複数の溝が形成される。また、ブレイク装置では、１枚のマザー基板が複数の単位基板（以下、単に「基板」と記す）にブレイクされる。したがって、この基板加工装置１には、複数の基板Ｓが順次搬送されてくる。各基板Ｓは貼り合わせ基板であり、基板Ｓの端部（端子が形成された部分）には、溝が形成されている。   The substrate processing apparatus 1 is an apparatus for sequentially transporting substrates and exposing terminal portions formed at the ends of the substrates that have been transported. A scribing device and a breaking device (not shown) are provided in the front stage of the substrate processing apparatus 1. In the scribe device, a plurality of break grooves are formed on one mother substrate. In the break device, one mother substrate is broken into a plurality of unit substrates (hereinafter simply referred to as “substrates”). Accordingly, a plurality of substrates S are sequentially transferred to the substrate processing apparatus 1. Each substrate S is a bonded substrate, and a groove is formed at an end of the substrate S (portion where a terminal is formed).

基板加工装置１は、搬送ベルト（第１搬送機構）２と、複数のブレイク装置３と、それぞれ複数の下搬送機構４（第２搬送機構）及び上搬送機構（第３搬送機構）５と、加工用搬送ベルト６と、を有している。   The substrate processing apparatus 1 includes a transport belt (first transport mechanism) 2, a plurality of break devices 3, a plurality of lower transport mechanisms 4 (second transport mechanisms) and upper transport mechanisms (third transport mechanisms) 5, respectively. And a processing conveyor belt 6.

搬送ベルト２は、図１において、第１方向（図の左右方向）に複数の基板Ｓを搬送する。ここでは、図１の左から搬入されてきた基板Ｓが、ブレイク装置３によって加工され、右方向に搬出される。   In FIG. 1, the transport belt 2 transports a plurality of substrates S in the first direction (the left-right direction in the figure). Here, the board | substrate S carried in from the left of FIG. 1 is processed by the break apparatus 3, and is carried rightward.

ブレイク装置３は、搬送ベルト２の搬送方向下流側において、搬送ベルト２の両側に配置されている。より詳細には、搬送ベルト２の一方側に、３台のブレイク装置３が搬送方向に並べて配置され、搬送ベルト２の他方側に、３台のブレイク装置３が搬送方向に並べて配置されている。各ブレイク装置３は、図２に拡大して一部を示すように、基板Ｓの端部を上方から押圧し、基板Ｓの端部の下層部分を除去する。これにより、基板Ｓの端部に形成された端子部分が露出される。   The breaking device 3 is disposed on both sides of the conveyance belt 2 on the downstream side in the conveyance direction of the conveyance belt 2. More specifically, three break devices 3 are arranged side by side in the conveyance direction on one side of the conveyance belt 2, and three break devices 3 are arranged side by side in the conveyance direction on the other side of the conveyance belt 2. . Each breaking device 3 presses the end portion of the substrate S from above and removes the lower layer portion of the end portion of the substrate S, as shown in a part of FIG. Thereby, the terminal part formed in the edge part of the board | substrate S is exposed.

下搬送機構４及び上搬送機構５は、搬送ベルト２によって搬送されてきた基板Ｓ及びブレイク装置３によって加工された基板Ｓを、第１方向と直交する第２方向に搬送する。下搬送機構４及び上搬送機構５は、図１及び図３Ａ〜図３Ｄに示すように、搬送ベルト２及び加工用搬送ベルト６の上方において、上下方向に並べて配置されている。図１では、上下搬送機構４の一部（具体的にはレール）は、上搬送機構５に重なっており、表れていない。   The lower transport mechanism 4 and the upper transport mechanism 5 transport the substrate S transported by the transport belt 2 and the substrate S processed by the breaking device 3 in a second direction orthogonal to the first direction. The lower transport mechanism 4 and the upper transport mechanism 5 are arranged side by side in the vertical direction above the transport belt 2 and the processing transport belt 6 as shown in FIGS. 1 and 3A to 3D. In FIG. 1, a part (specifically, rail) of the vertical transport mechanism 4 overlaps the upper transport mechanism 5 and does not appear.

下搬送機構４は、１対のレール４１と、保持部材４２と、昇降機構４３と、を有している。１対のレール４１は搬送ベルト２とブレイク装置３との間に配置されている。保持部材４２及び昇降機構４３は、１対のレール４１に沿って移動する。保持部材４２は、例えば真空吸着によって基板Ｓを下面に保持する。昇降機構４３は、例えばラック・ピニオン機構を有し、保持部材４２を昇降させる。保持部材４２の搬送方向の幅は、１対のレール４１間の距離より短い。   The lower transport mechanism 4 includes a pair of rails 41, a holding member 42, and an elevating mechanism 43. The pair of rails 41 is disposed between the conveyor belt 2 and the breaking device 3. The holding member 42 and the elevating mechanism 43 move along the pair of rails 41. The holding member 42 holds the substrate S on the lower surface, for example, by vacuum suction. The elevating mechanism 43 has, for example, a rack and pinion mechanism, and elevates the holding member 42. The width of the holding member 42 in the transport direction is shorter than the distance between the pair of rails 41.

上搬送機構５も、下搬送機構４とまったく同様の構成であり、１対のレール５１と、保持部材５２と、昇降機構５３と、を有している。なお、前述のように、保持部材５２の搬送方向の幅は、１対のレール５１間の距離より短いので、上搬送機構５の保持部材５２は、下搬送機構４の１対のレール４１間を通過して、昇降することが可能である。   The upper transport mechanism 5 has the same configuration as that of the lower transport mechanism 4 and includes a pair of rails 51, a holding member 52, and an elevating mechanism 53. As described above, since the width of the holding member 52 in the conveyance direction is shorter than the distance between the pair of rails 51, the holding member 52 of the upper conveyance mechanism 5 is between the pair of rails 41 of the lower conveyance mechanism 4. It is possible to go up and down.

［加工動作］
図３Ａ〜図３Ｄは、搬送ベルト２によって加工基準位置に搬送されてきた基板Ｓを加工する際の動作を示している。ここで、「加工基準位置」とは、搬送ベルト２上において、ブレイク装置３において実際に加工する位置と搬送方向において同じ位置である。なお、以下では、１つのブレイク装置３による加工動作を説明するが、他のすべてのブレイク装置３においても、まったく同様の加工動作が実行される。 [Machining operation]
3A to 3D show an operation when the substrate S that has been transported to the processing reference position by the transport belt 2 is processed. Here, the “processing reference position” is the same position on the transport belt 2 as the actual processing position in the breaking device 3 in the transport direction. In the following, the machining operation by one break device 3 will be described, but the same machining operation is also executed in all the other break devices 3.

基板Ｓが加工基準位置に搬送されてくると、搬送ベルト２による搬送を一旦停止する。そして、下搬送機構４の保持部材４２を基板Ｓの真上に位置させる（図３Ａ−ａ）。次に、昇降機構４３により保持部材４２を下降させ、保持部材４２によって基板Ｓを吸着する（図３Ａ−ｂ）。   When the substrate S is transported to the processing reference position, the transport by the transport belt 2 is temporarily stopped. Then, the holding member 42 of the lower transport mechanism 4 is positioned directly above the substrate S (FIG. 3A-a). Next, the holding member 42 is lowered by the lifting mechanism 43, and the substrate S is sucked by the holding member 42 (FIGS. 3A-b).

このような状態で、保持部材４２を上昇させて基板Ｓを搬送ベルト２から持ち上げ、レール４１に沿って保持部材４２を移動させて、加工用搬送ベルト６の上方に位置させる。なお、このとき、加工用搬送ベルト６のブレイク装置３側の端部まで基板Ｓを移動させる（図３Ａ−ｃ）。そして、保持部材４２を下降させて、加工用搬送ベルト６に基板Ｓを載置する（図３Ａ−ｄ）。   In this state, the holding member 42 is raised to lift the substrate S from the transport belt 2, and the holding member 42 is moved along the rail 41 to be positioned above the processing transport belt 6. At this time, the substrate S is moved to the end of the processing conveyor belt 6 on the breaking device 3 side (FIGS. 3A to 3C). Then, the holding member 42 is lowered and the substrate S is placed on the processing conveyor belt 6 (FIGS. 3A to 3D).

その後、保持部材４２による基板Ｓの吸着を解除して保持部材４２を上昇させるとともに、加工用搬送ベルト６を駆動して基板Ｓをブレイク装置３の加工位置に移動させる（図３Ａ−ｅ）。ブレイク装置３では、図２に示すように、基板Ｓを上方から押圧し、基板Ｓの端部をブレイクして端子部分を露出させる。   Thereafter, the adsorption of the substrate S by the holding member 42 is released to raise the holding member 42, and the processing transport belt 6 is driven to move the substrate S to the processing position of the breaking device 3 (FIGS. 3A to 3e). In the breaking device 3, as shown in FIG. 2, the board | substrate S is pressed from upper direction, the edge part of the board | substrate S is broken, and a terminal part is exposed.

加工が終了すると、加工用搬送ベルト６によって、加工済み基板Ｓをブレイク装置３の加工位置から下搬送機構４の下方位置まで戻す（図３Ｂ−ａ）。なお、この時点では、加工基準位置に次の未加工基板Ｓが搬送されてきている（図３Ｂ−ａ）。   When the processing is completed, the processed transport belt 6 returns the processed substrate S from the processing position of the breaking device 3 to the lower position of the lower transport mechanism 4 (FIG. 3B-a). At this point, the next unprocessed substrate S has been transferred to the processing reference position (FIG. 3B-a).

次に、下搬送機構４の保持部材４２を下降させて加工済み基板Ｓを吸着する（図３Ｂ−ｂ）。また、これと同時に、上搬送機構５の保持部材５２を下降させて未加工基板Ｓを吸着する（図３Ｂ−ｂ）。そして、下搬送機構４の保持部材４２を上昇させて加工済み基板Ｓを加工用搬送ベルト６から持ちあげるとともに、上搬送機構５の保持部材５２を上昇させて未加工基板Ｓを搬送ベルト２から持ち上げる（図３Ｂ−ｃ）。   Next, the holding member 42 of the lower transport mechanism 4 is lowered to suck the processed substrate S (FIG. 3B-b). At the same time, the holding member 52 of the upper transport mechanism 5 is lowered to suck the unprocessed substrate S (FIG. 3B-b). Then, the holding member 42 of the lower transport mechanism 4 is raised to lift the processed substrate S from the processing transport belt 6, and the holding member 52 of the upper transport mechanism 5 is lifted to remove the unprocessed substrate S from the transport belt 2. Lift (Figure 3B-c).

その後、下搬送機構４の保持部材４２を加工基準位置に移動させると同時に、上搬送機構５の保持部材５２を加工用搬送ベルト６の上方に移動させる（図３Ｂ−ｄ）。このとき、前述と同様に、加工用搬送ベルト６のブレイク装置３側の端部まで未加工基板Ｓを移動させる。そして、下搬送機構４の保持部材４２を下降させて加工済み基板Ｓを搬送ベルト２上に載置するとともに、上搬送機構５の保持部材５２を下降させて未加工基板Ｓを加工用搬送ベルト６に載置する（図３Ｂ−ｅ）。   Thereafter, the holding member 42 of the lower transport mechanism 4 is moved to the processing reference position, and at the same time, the holding member 52 of the upper transport mechanism 5 is moved above the processing transport belt 6 (FIG. 3B-d). At this time, as described above, the unprocessed substrate S is moved to the end of the processing transport belt 6 on the break device 3 side. The holding member 42 of the lower transport mechanism 4 is lowered to place the processed substrate S on the transport belt 2, and the holding member 52 of the upper transport mechanism 5 is lowered to move the unprocessed substrate S to the processing transport belt. 6 (FIG. 3B-e).

次に、上搬送機構５の保持部材５２による未加工基板Ｓの吸着を解除して保持部材５２を上昇させるとともに、加工用搬送ベルト６を駆動して未加工基板Ｓをブレイク装置３の加工位置に移動させる（図３Ｃ−ａ）。そして、前記同様に、ブレイク装置３を作動させ、基板Ｓの端部をブレイクし、端子部分を露出させる。   Next, the holding member 52 is lifted by releasing the suction of the unprocessed substrate S by the holding member 52 of the upper transport mechanism 5 and the processing transport belt 6 is driven to remove the unprocessed substrate S from the processing position of the breaking device 3. (FIG. 3C-a). Then, similarly to the above, the break device 3 is operated, the end of the substrate S is broken, and the terminal portion is exposed.

加工が終了すると、加工用搬送ベルト６によって、加工済み基板Ｓをブレイク装置３の加工位置から上搬送機構５の下方位置まで戻す（図３Ｃ−ｂ）。なお、この時点では、加工基準位置に次の未加工基板Ｓが搬送されてきている（図３Ｃ−ｂ）。   When the processing is completed, the processed transport belt 6 returns the processed substrate S from the processing position of the breaking device 3 to the lower position of the upper transport mechanism 5 (FIG. 3C-b). At this point, the next unprocessed substrate S has been transferred to the processing reference position (FIG. 3C-b).

次に、上搬送機構５の保持部材５２を下降させて加工済み基板Ｓを吸着するとともに、下搬送機構４の保持部材４２を下降させて次の未加工基板Ｓを吸着する（図３Ｃ−ｃ）。そして、上搬送機構５の保持部材５２を上昇させて加工済み基板Ｓを加工用搬送ベルト６から持ち上げるとともに、下搬送機構４の保持部材４２を上昇させて次の未加工基板Ｓを搬送ベルト２から持ち上げる（図３Ｃ−ｄ）。   Next, the holding member 52 of the upper transport mechanism 5 is lowered to suck the processed substrate S, and the holding member 42 of the lower transport mechanism 4 is lowered to suck the next unprocessed substrate S (FIG. 3C-c). ). Then, the holding member 52 of the upper transport mechanism 5 is lifted to lift the processed substrate S from the processing transport belt 6, and the holding member 42 of the lower transport mechanism 4 is lifted to transfer the next unprocessed substrate S to the transport belt 2. (Fig. 3C-d).

その後、上搬送機構５の保持部材５２を加工基準位置に移動させると同時に、下搬送機構４の保持部材４２を加工用搬送ベルト６の上方に移動させる（図３Ｃ−ｅ）。そして、上搬送機構５の保持部材５２を下降させて加工済み基板Ｓを搬送ベルト２上に載置するとともに、下搬送機構４の保持部材４２を下降させて次の未加工基板Ｓを加工用搬送ベルト６に載置する（図３Ｄ−ａ）
以上の処理を繰り返し実行することによって、順次搬送されてくる基板Ｓを、待機時間を少なくして加工をすることができる。このため、効率よく搬送及び加工を行うことができ、全体の加工時間を短縮することができる。 Thereafter, the holding member 52 of the upper transport mechanism 5 is moved to the processing reference position, and at the same time, the holding member 42 of the lower transport mechanism 4 is moved above the processing transport belt 6 (FIG. 3C-e). The holding member 52 of the upper transport mechanism 5 is lowered to place the processed substrate S on the transport belt 2, and the holding member 42 of the lower transport mechanism 4 is lowered to process the next unprocessed substrate S. Place on the conveyor belt 6 (FIG. 3D-a)
By repeatedly executing the above processing, the substrate S that is sequentially transferred can be processed with a reduced waiting time. For this reason, conveyance and processing can be performed efficiently, and the entire processing time can be shortened.

［他の実施形態］
本発明は以上のような実施形態に限定されるものではなく、本発明の範囲を逸脱することなく種々の変形又は修正が可能である。 [Other Embodiments]
The present invention is not limited to the above-described embodiments, and various changes or modifications can be made without departing from the scope of the present invention.

（ａ）前記実施形態では、搬送ベルトの両側にブレイク装置が配置されている場合について説明したが、片側のみにブレイク装置が配置されている場合においても、本発明を同様に適用することができる。また、ブレイク装置の個数も、前記実施形態に限定されるものではない。   (A) In the above-described embodiment, the case where the breaking devices are arranged on both sides of the conveying belt has been described. However, the present invention can be similarly applied to the case where the breaking device is arranged only on one side. . Further, the number of break devices is not limited to the above embodiment.

（ｂ）前記実施形態では、加工機構としてブレイク装置を例にとって説明したが、他の、例えばスクライブ装置であっても本発明を同様に適用することができる。   (B) In the above-described embodiment, the breaking device has been described as an example of the processing mechanism. However, the present invention can be similarly applied to other, for example, a scribing device.

（ｃ）下搬送機構及び上搬送機構の具体的な構成は前記実施形態に限定されない。   (C) The specific configurations of the lower transport mechanism and the upper transport mechanism are not limited to the above embodiment.

１ 基板加工装置
２ 搬送ベルト（第１搬送機構）
３ ブレイク装置（加工機構）
４ 下搬送機構（第２搬送機構）
５ 上搬送機構（第３搬送機構）
６ 加工用搬送ベルト
４１，５１ レール
４２，５２ 保持部材
４３，５３ 昇降機構 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Conveyance belt (first conveyance mechanism)
3 Break device (processing mechanism)
4 Lower transport mechanism (second transport mechanism)
5 Upper transport mechanism (third transport mechanism)
6 Processing conveyor belt 41, 51 Rail 42, 52 Holding member 43, 53 Lifting mechanism

Claims (7)

基板を搬送する第１搬送機構と、
前記第１搬送機構の搬送方向と交差する方向の側方に配置され、前記基板を加工する加工機構と、
互いに並べて配置され、前記第１搬送機構と前記加工機構との間で基板を搬送する第２搬送機構及び第３搬送機構と、
を備えた基板加工装置。 A first transport mechanism for transporting a substrate;
A processing mechanism disposed on a side in a direction intersecting a transport direction of the first transport mechanism and processing the substrate;
A second transport mechanism and a third transport mechanism that are arranged side by side and transport a substrate between the first transport mechanism and the processing mechanism;
A substrate processing apparatus comprising: 前記第２搬送機構及び前記第３搬送機構は、前記第１搬送機構により搬送されてきた未加工の基板を前記加工機構に搬送するとともに、前記加工機構により加工された基板を前記第１搬送機構に搬送する、請求項１に記載の基板加工装置。   The second transport mechanism and the third transport mechanism transport an unprocessed substrate transported by the first transport mechanism to the processing mechanism, and process the substrate processed by the processing mechanism to the first transport mechanism. The board | substrate processing apparatus of Claim 1 conveyed to. 前記第２搬送機構及び前記第３搬送機構は、一方の搬送機構が加工された基板を搬送する際に、他方の搬送機構が次の未加工の基板を搬送する、請求項１又は２に記載の基板加工装置。   3. The second transport mechanism and the third transport mechanism according to claim 1, wherein when one transport mechanism transports a processed substrate, the other transport mechanism transports the next unprocessed substrate. Substrate processing equipment. 前記第２搬送機構及び前記第３搬送機構は、前記第１搬送機構より上方において、上下方向に並べて配置されている、請求項１から３のいずれかに記載の基板加工装置。   The substrate processing apparatus according to claim 1, wherein the second transport mechanism and the third transport mechanism are arranged side by side in a vertical direction above the first transport mechanism. 前記第２搬送機構及び前記第３搬送機構はそれぞれ、
前記第１搬送機構と前記加工機構との間に配置されたレールと、
基板を保持する保持部材と、
前記保持部材を昇降する昇降機構と、
を有し、
前記保持部材及び前記昇降機構は前記レールに沿って移動する、
請求項１から４のいずれかに記載の基板加工装置。 The second transport mechanism and the third transport mechanism are respectively
A rail disposed between the first transport mechanism and the processing mechanism;
A holding member for holding the substrate;
An elevating mechanism for elevating the holding member;
Have
The holding member and the lifting mechanism move along the rail;
The substrate processing apparatus according to claim 1. 前記第１搬送機構は基板が載置される搬送ベルトを有している、請求項１から５のいずれかに記載の基板加工装置。   The substrate processing apparatus according to claim 1, wherein the first transport mechanism includes a transport belt on which a substrate is placed. 前記第２搬送機構及び前記第３搬送機構の前記加工機構側の端部と前記加工機構の加工位置との間で基板を搬送する加工用搬送ベルトをさらに備えた、請求項１から６のいずれかに記載の基板加工装置。   The processing belt according to any one of claims 1 to 6, further comprising a processing transport belt for transporting the substrate between the processing mechanism side end of the second transport mechanism and the third transport mechanism and a processing position of the processing mechanism. A substrate processing apparatus according to claim 1.
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