TWI659914B - Substrate processing device - Google Patents

Abstract

The substrate processing apparatus of the present invention can perform substrate processing with high efficiency. This substrate processing apparatus includes a conveying belt 2 for conveying a substrate, a breaking device 3 disposed on a side of a direction intersecting with the conveying direction of the conveying belt 2 and processing the substrate, and an arrangement and arrangement on the conveying belt 2 The substrate lower conveying mechanism 4 and the upper conveying mechanism 5 are conveyed in synchronization with the breaking device 3.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus including a substrate transfer mechanism.

A scoring device for forming a groove in a substrate, or a breaking device for cutting a substrate, has a beam that holds a processing head. The beam is a beam extending in the horizontal direction and supported in a gate shape by left and right pillars, and is arranged above a platform on which a substrate to be processed is placed.

In such a substrate processing apparatus, the platform on which the substrate is placed moves so as to sneak under the beam. The substrate is processed by a tool attached to the processing head. Therefore, if a scoring device or a severing device is arranged in series to constitute a processing line for severing a substrate, the entire length of the processing line becomes longer.

Therefore, in Patent Document 1, a scoring device or a breaking device is arranged in a second direction orthogonal to the first direction in which the substrates are sequentially transported. With such a structure, the processing line can be miniaturized.

Patent Document 1: Japanese Patent Application Laid-Open No. 11-116260

In the device of Patent Document 1, first, the substrate is transferred in the first direction, and stopped at a processing reference position (a position corresponding to the processing position on the transfer path) on the transfer path. Next, the substrate is transported in the second direction and positioned at a processing position in the processing device, so that For processing. After processing, the substrate is returned to the processing reference position on the transfer path, and is transferred to the downstream side on the transfer path.

However, in such a method, the substrate that has been processed first is returned to the processing reference position and cannot be transferred and processed to the next substrate until it is transferred to the downstream side of the transfer path. Therefore, there is a problem that the work efficiency is low.

The subject of the present invention is to enable efficient processing of a substrate.

A substrate processing apparatus according to the present invention includes a first transfer mechanism that transfers a substrate, a processing mechanism that is disposed on a side of a direction that intersects the transfer direction of the first transfer mechanism, and processes the substrate, and is arranged and arranged in A second transfer mechanism and a third transfer mechanism that transfer substrates between the first transfer mechanism and the processing mechanism.

In this device, the substrate transferred by the first transfer mechanism is transferred between the first transfer mechanism and the processing mechanism by the second and third transfer mechanisms.

Here, since the processing mechanism is disposed in a direction crossing the direction in which the substrate is transported, the length of the processing line in the transport direction can be miniaturized. In addition, when the processed substrate is returned to the first transfer mechanism by one of the second and third transfer mechanisms, the next substrate can be transferred to the processing mechanism by the other transfer mechanism, so the substrate can be shortened. The time taken for transportation and processing enables efficient processing of the substrate.

In another substrate processing apparatus of the present invention, the second transfer mechanism and the third transfer mechanism transfer the unprocessed substrate transferred by the first transfer mechanism to the processing mechanism, and at the same time process the processed substrate by the processing mechanism. The substrate is transferred to the first transfer mechanism.

In still another substrate processing apparatus of the present invention, when the second transfer mechanism and the third transfer mechanism transfer the processed substrate to one transfer mechanism, the other transfer mechanism The mechanism carries the next unprocessed substrate.

In still another substrate processing apparatus according to the present invention, the second transfer mechanism and the third transfer mechanism are arranged above the first transfer mechanism so as to be aligned in the vertical direction.

Here, the space occupied by each conveyance mechanism can be made small.

In still another substrate processing apparatus according to the present invention, the second transfer mechanism and the third transfer mechanism each include a rail disposed between the first transfer mechanism and the processing mechanism, a holding member for holding the substrate, and a holding member for raising and lowering. Lifting mechanism. The holding member and the lifting mechanism move along the rail.

In still another substrate processing apparatus of the present invention, the first transfer mechanism includes a transfer belt on which the substrate is placed.

In still another substrate processing apparatus according to the present invention, there is further provided a processing transfer belt for transferring the substrate between the end portions on the processing mechanism side of the second transfer mechanism and the third transfer mechanism and the processing position of the processing mechanism.

In the present invention as described above, the substrate can be processed efficiently.

1‧‧‧ substrate processing equipment

2‧‧‧ transport belt (first transport mechanism)

3‧‧‧ Cracking device (processing device)

4‧‧‧ lower transfer mechanism (second transfer mechanism)

5‧‧‧ upper transfer mechanism (third transfer mechanism)

6‧‧‧ Processing Belt

41, 51‧‧‧ rails

42, 52‧‧‧ holding members

43, 53‧‧‧Lifting mechanism

FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a processing state of a substrate.

FIG. 3A is a drawing showing a machining operation.

FIG. 3B is a drawing showing a machining operation.

FIG. 3C is a drawing showing a machining operation.

FIG. 3D is a drawing showing a machining operation.

FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In addition, in FIG. 1, the whole apparatus is shown typically.

This substrate processing apparatus 1 is a device for sequentially transferring a substrate and exposing a terminal portion formed on an end portion of the transferred substrate. A scribing device and a breaking device (not shown) are provided at a front stage of the substrate processing apparatus 1. Using a scoring device, a plurality of trenches for cracking are formed on one mother substrate. In addition, a mother substrate is fractured into a plurality of unit substrates by a breaking device (hereinafter, abbreviated as "substrate"). Therefore, in this substrate processing apparatus 1, a plurality of substrates S are sequentially conveyed. Each substrate S is a bonded substrate, and a groove is formed at an end portion (a portion where a terminal is formed) of the substrate S.

The substrate processing apparatus 1 includes a conveying belt (first conveying mechanism) 2, a plurality of breaking devices 3, a plurality of lower conveying mechanisms (second conveying mechanism) 4, and an upper conveying mechanism (third conveying mechanism) 5, And processing conveyor belt 6.

The conveyance belt 2 conveys a plurality of substrates S in the first direction (the left-right direction in the drawing) in FIG. 1. Here, the board | substrate S carried in from the left side of FIG. 1 is processed by the breaking device 3, and is carried out to the right.

The breaking device 3 is disposed on both sides of the conveying belt 2 on the downstream side in the conveying direction of the conveying belt 2. More specifically, three splitting devices 3 are arranged on one side of the conveying belt 2 so as to be aligned in the conveying direction, and three splitting devices are arranged on the other side of the conveying belt 2 so as to be aligned in the conveying direction.断 装置 3。 Off device 3. Each of the breaking devices 3 presses an end portion of the substrate S from above as shown in FIG. 2 in an enlarged manner, and removes a portion below the end portion of the substrate S. Thereby, the terminal portion formed on the end portion of the substrate S is exposed.

The lower transfer mechanism 4 and the upper transfer mechanism 5 transfer the substrate S transferred by the transfer belt 2 and the substrate S processed by the breaking device 3 in a second direction orthogonal to the first direction. As shown in FIGS. 1 and 3A to 3D, the lower conveying mechanism 4 and the upper conveying mechanism 5 are arranged above the conveying belt 2 and the processing conveying belt 6 so as to be aligned in the vertical direction. In FIG. 1, a part of the lower conveying mechanism 4 (specifically, a rail) overlaps the upper conveying mechanism 5 and is not shown.

The lower conveyance mechanism 4 includes a pair of rails 41, a holding member 42, and a lifting mechanism 43. A pair of rails 41 are arranged between the conveying belt 2 and the breaking device 3. The holding member 42 and the lifting mechanism 43 move along a pair of rails 41. The holding member 42 holds the substrate S under the surface by, for example, vacuum suction. The elevating mechanism 43 includes, for example, a rack-and-pinion mechanism to elevate the holding member 42. The width in the carrying direction of the holding member 42 is shorter than the distance between the pair of rails 41.

The upper conveyance mechanism 5 has the same configuration as the lower conveyance mechanism 4, and includes a pair of rails 51, a holding member 52, and a lifting mechanism 53. In addition, as described above, since the width in the conveying direction of the holding member 52 is shorter than the distance between the pair of rails 51, the holding member 52 of the upper conveying mechanism 5 can pass between one of the rails 41 through the lower conveying mechanism 4. Lifting.

[Processing action]

FIGS. 3A to 3D show operations during processing of the substrate S that has been transferred to the processing reference position by the transfer belt 2. Here, the so-called “processing reference position” is on the conveyance belt 2 and is the same position in the conveying direction as the position where processing is actually performed in the breaking device 3. In addition, in the following, the processing operation of one breaking device 3 will be described, and in all other breaking devices 3, The exact same machining operation is also performed.

Once the substrate S is transferred to the processing reference position, the transfer of the transfer belt 2 is temporarily stopped. Then, the holding member 42 of the lower transport mechanism 4 is positioned directly above the substrate S (FIGS. 3A-a). Next, the holding member 42 is lowered by the lifting mechanism 43, and the substrate S is sucked by the holding member 42 (FIGS. 3A-b).

In this state, the holding member 42 is raised to lift the substrate S from the conveyance belt 2, and the holding member 42 is moved along the rail 41 to be positioned above the processing conveyance belt 6. In addition, at this time, the board | substrate S is moved to the edge part on the side of the breaking device 3 of the processing conveyance belt 6 (FIG. 3A-c). Then, the holding member 42 is lowered, and the substrate S is placed on the processing conveyor 6 (FIGS. 3A-d).

Thereafter, the holding member 42 is released from the suction of the substrate S and the holding member 42 is lifted, and the processing conveyor 6 is driven to move the substrate S to the processing position of the breaking device 3 (FIGS. 3A to 3E). In the breaking device 3, as shown in FIG. 2, the substrate S is pressed from above, and the end portion of the substrate S is broken to expose the terminal portion.

When the processing is completed, the processed substrate S is returned from the processing position of the breaking device 3 to the lower position of the lower transfer mechanism 4 by the processing conveying belt 6 (FIG. 3B-a). At this point, the next unprocessed substrate S is transferred to the processing reference position (FIG. 3B-a).

Next, the holding member 42 of the lower conveyance mechanism 4 is lowered and sucks the processed substrate S (FIG. 3B-b). In addition, at the same time, the holding member 52 of the upper conveyance mechanism 5 is lowered and sucks the raw substrate S (FIG. 3B-b). Then, the holding member 42 of the lower conveying mechanism 4 is raised to lift the processed substrate S from the processing conveyance belt 6, and the holding member 52 of the upper conveying mechanism 5 is raised to lift the unprocessed substrate S from the conveying belt 2. Lift up (Figure 3B-c).

After that, the holding member 42 of the lower conveying mechanism 4 is moved to the processing reference position. At the same time, the holding member 52 of the upper conveying mechanism 5 is moved above the processing conveying belt 6 (FIGS. 3B-d). At this time, as described above, the unprocessed substrate S is moved to the end portion on the side of the breaking device 3 of the processing transport belt 6. Then, the holding member 42 of the lower transfer mechanism 4 is lowered to place the processed substrate S on the transfer belt 2, and the holding member 52 of the upper transfer mechanism 5 is lowered to place the unprocessed substrate S on the processing Transport belt 6 (Fig. 3B-e).

Next, the holding member 52 of the upper conveying mechanism 5 is released from the suction of the unprocessed substrate S and the holding member 52 is raised, and the processing conveyance belt 6 is driven to move the unprocessed substrate S to the processing position of the breaking device 3 (FIG. 3C). -a). Then, in the same manner as described above, the breaking device 3 is operated to break the end portion of the substrate S and expose the terminal portion.

When the processing is completed, the processed substrate S is returned from the processing position of the breaking device 3 to the lower position of the upper conveying mechanism 5 by the processing conveying belt 6 (FIG. 3C-b). At this point, the next unprocessed substrate S is transferred to the processing reference position (FIG. 3C-b).

Next, the holding member 52 of the upper conveying mechanism 5 is lowered and sucks the processed substrate S, and the holding member 42 of the lower conveying mechanism 4 is lowered and sucks the next unprocessed substrate S (FIG. 3C-c). Then, the holding member 52 of the upper conveying mechanism 5 is raised to lift the processed substrate S from the processing conveyance belt 6, and the holding member 42 of the lower conveying mechanism 4 is lifted to convey the next unprocessed substrate S from the conveyance. The belt 2 is lifted (Fig. 3C-d).

After that, the holding member 52 of the upper conveying mechanism 5 is moved to the processing reference position, and the holding member 42 of the lower conveying mechanism 4 is moved above the processing conveying belt 6 (FIG. 3C-e). Then, the holding member 52 of the upper transfer mechanism 5 is lowered to place the processed substrate S on the transfer belt 2, and the holding member 42 of the lower transfer mechanism 4 is lowered to place the next unprocessed substrate S. Processing conveyor belt 6 (Fig. 3D-a).

By repeatedly performing the above processing, it is possible to process the substrates S that have been sequentially transferred, so as to reduce standby time. Therefore, conveyance and processing can be performed efficiently, and the overall processing time can be shortened.

[Other embodiments]

The present invention is not limited to the embodiments described above, and various modifications or changes can be made without departing from the scope of the present invention.

(a) In the above-mentioned embodiment, although the case where a breaking device was arrange | positioned on both sides of a conveyance belt was demonstrated, this invention can be applied similarly also when the breaking device is arrange | positioned only on one side. In addition, the number of the breaking devices is not limited to the above embodiment.

(b) In the embodiment described above, the splitting device has been described as an example of a processing mechanism. However, the present invention can be similarly applied to other scoring devices, for example.

(c) The specific configurations of the lower conveyance mechanism and the upper conveyance mechanism are not limited to the above embodiments.

Claims (6)

A substrate processing apparatus comprising a first transfer mechanism for transferring a substrate, a processing mechanism disposed on a side of a direction intersecting with a transfer direction of the first transfer mechanism, and processing the substrate, and an array thereof The second transfer mechanism and the third transfer mechanism which are arranged and transfer the substrate between the first transfer mechanism and the processing mechanism, and the second transfer mechanism and the third transfer mechanism are above the first transfer mechanism, and They are arranged in such a manner that they overlap each other in the up-down direction. For example, the substrate processing apparatus of the first scope of the patent application, wherein the second transfer mechanism and the third transfer mechanism transfer unprocessed substrates transferred by the first transfer mechanism to the processing mechanism, and The substrate processed by the processing mechanism is transferred to the first transfer mechanism. For example, if the substrate processing device of the scope of the patent application is No. 1 or 2, the second transfer mechanism and the third transfer mechanism transfer the processed substrate to one transfer mechanism and the other transfer mechanism to the next Raw substrates are transported. For example, the substrate processing device of the scope of application for patents 1 or 2, wherein the second transfer mechanism and the third transfer mechanism each have a rail and a substrate disposed between the first transfer mechanism and the processing mechanism. A holding member and a lifting mechanism for lifting the holding member; the holding member and the lifting mechanism move along the rail. For example, the substrate processing apparatus of the first or second patent application scope, wherein the first transfer mechanism has a transfer belt on which the substrate is placed. For example, the substrate processing apparatus for which the scope of the patent application is item 1 or 2 further includes: a processing belt, which is located at the end of the processing mechanism side of the second and third transport mechanisms and the processing mechanism. The substrate is transferred between processing positions.