JP2020001964A - Substrate parting apparatus and substrate parting method - Google Patents

Abstract

To provide a parting device and method for substrate that can omit a rotating mechanism for rotating a strip-like substrate and also shorten a manufacture line to take unit substrates out in a saved space.SOLUTION: A parting device consists of: a first scribe part 2 which processes a first scribe line S1 extending in a direction orthogonal to a sending direction on a mother substrate W sent by a first conveyance part 1; a first break part 3 which parts the substrate along the first scribe line to cut out a strip-like substrate W1 having its length directed along the first scribe line; a second carrying part 17 which carries the cut strip-like substrate W1 along a length without changing its direction; a second scribe part 18 which processes a second scribe line S2 extending in a direction orthogonal to the sending direction on the strip-like substrate sent by a second conveyance part; a second break part 19 which cuts a unit substrate W2 out of the strip-like substrate along the second scribe line S2; and a unit substrate carrying-out part 20 which takes the cut unit substrate out.SELECTED DRAWING: Figure 2

Description

The present invention relates to a device and a method for cutting a large-area mother substrate made of a resin substrate or a brittle material substrate. In particular, the present invention relates to a cutting device and a cutting method for cutting a strip substrate from a scribe line formed on a mother substrate and cutting the strip substrate into unit substrates (unit products).
Here, the strip-shaped substrate refers to a substrate in which a plurality of unit substrates are arranged in a line.

When cutting a strip-shaped substrate from the mother substrate, as shown in FIG. 13, a plurality of scribes in the vertical direction (Y direction) and the horizontal direction (X direction) crossing each other with a laser beam or a cutter wheel with respect to the mother substrate W. The lines S1 and S2 are formed, and subsequently, the substrate is bent from the scribe line S1 in the Y direction by using a break bar or the like to break the rectangular substrate W1. Next, there is known a method of rotating the strip-shaped substrate W1 by 90 degrees, breaking along the scribe line S2, and taking out a unit product W2 (for example, Patent Document 1).
Note that the mother board divided layout shown in FIG. 13 is designed to cut out a total of 32 unit substrates W2 in four rows and eight rows, and the periphery of each unit substrate W2 is cut off at the time of cutting. An end material region Ta in the Y direction and an end material region Tb in the X direction are formed. However, there is also a divided layout in which the end material regions Ta and Tb are not provided.

  In the dividing apparatus that implements this dividing method, a rotating mechanism that rotates the strip-shaped substrate Wa by 90 degrees while maintaining a horizontal posture on a mounting plane is used together with a transport mechanism that transports the substrate in a linear direction.

JP 2006-315901 A

  The above-described conventional dividing method requires a rotating mechanism such as a turntable for rotating the strip-shaped substrate by 90 degrees while maintaining a horizontal posture on the mounting plane, and equipment costs for installing the rotating mechanism are reduced. In addition to requiring space, fine adjustment of the angular position of the strip-shaped substrate due to the rotation is complicated and troublesome. Further, since the substrate is transported linearly from upstream to downstream from the mother substrate to the cutout of the unit substrate, the production line becomes long and a large installation area is required. In addition, when all processes are managed by one worker, if the production line becomes longer, the moving distance of the worker from the substrate entrance to the substrate exit becomes longer, and the burden increases.

Furthermore, in the division of a mother substrate made of a brittle material, when a scribe line crossing the mother substrate vertically and horizontally is cross-scribed with a cutter wheel or the like, minute breakage called `` chip '' at the intersection of the scribe lines, In some cases, processing defects called "sedge" occurred. “Soge” means that a crack in the vertical direction of the scribe line extends in an oblique direction.
Such scars such as "scratch" and "shorn" naturally impair the quality of the product after division, and are a major cause of lowering the production yield.

  In view of the above problems, the present invention eliminates the rotation mechanism for rotating the strip-shaped substrate, shortens the production line, allows the unit substrate to be taken out in a space-saving manner, and causes the above-described scars at the time of scribing. It is an object of the present invention to provide an apparatus for separating a mother board without the need.

  In order to achieve the above object, the present invention takes the following technical measures. That is, according to the present invention, there is provided a cutting device that cuts a strip-shaped substrate from a mother substrate and cuts a unit product from the strip-shaped substrate, and a first transfer unit that transfers the mother substrate in a horizontal posture from upstream to downstream. And a first scribe section for processing a first scribe line extending in a direction orthogonal to a feed direction on the mother substrate sent by the first transfer section; A first break portion for cutting out a strip-shaped substrate whose longitudinal direction is oriented along the first scribe line, and a second transfer portion for transferring the cut-out strip-shaped substrate in the longitudinal direction without changing its direction. A second scribe section for processing a second scribe line extending in a direction orthogonal to a feed direction on the strip-shaped substrate sent by the second transfer section; and the second scribe section. A second break portion for cutting out the unit substrate from the strip-shaped substrate along the in, and a unit substrate unloading portion for transferring the cut out unit substrate in the same direction as the second transfer portion and extracting the unit substrate. And

  Further, the present invention is a dividing method for dividing a strip-shaped substrate from a mother substrate and separating a unit product from the strip-shaped substrate, and extends in a direction orthogonal to a feeding direction with respect to a mother substrate conveyed from upstream. The first scribe line is processed, and then the mother substrate is divided along the first scribe line, and a strip-shaped substrate whose longitudinal direction is directed to the direction along the first scribe line is cut out. Transporting the strip-shaped substrate in the longitudinal direction of the substrate without changing its direction, and then processing a second scribe line extending in a direction perpendicular to a feeding direction of the fed strip-shaped substrate, Next, the strip substrate is cut along the second scribe line to cut a unit substrate, and the cut unit substrate is in the same feeding direction as the strip substrate. Cutting method to extract the unit substrate is transported to the direction also characterized.

  According to the present invention, the mother substrate conveyed from the upstream is cut into strip-shaped substrates at the first break portion, and is conveyed in a direction orthogonal to the upstream feed direction without changing its direction, and cut into unit substrates. Therefore, the transfer is performed only by the linear motion, and a rotation mechanism (turntable) for rotating the strip-shaped substrate by 90 degrees as in the related art can be omitted, and the equipment cost can be reduced. And fine adjustment of the angle accompanying the rotation of the strip substrate is not required. Further, the work line of the cutting device can be greatly reduced as compared with the conventional method in which the unit substrate is cut out while being transported linearly from upstream to downstream, and space can be saved. In addition, the moving distance for managing the entire process is shorter for the worker. In addition, since only the first scribe line is processed on the mother substrate and cut into strip-shaped substrates along the first scribe line, the second scribe line is processed. There is no cross scribe in which the scribe lines intersect with each other, and this has the effect of preventing the occurrence of scars such as "scratch" and "sedge" due to the cross scribe.

In the present invention, a loading table for loading the mother substrate into the first transport unit is provided, and the loading table can load the mother substrate from a direction orthogonal to a transport direction of the first transport unit. And the substrate transfer direction from the second transfer unit to the unit substrate transfer unit is preferably formed parallel to the substrate transfer direction of the loading table toward the substrate transfer side.
As a result, the individually divided unit substrates are taken out on the same side as the substrate carrying-in side of the dividing device, so that the moving range of the worker for carrying in the mother board and taking out the unit board is reduced, and Labor burden can be reduced.

In the present invention, it is preferable that a plurality of units including the second transport unit, the second scribe unit, the second break unit, and the unit substrate unloading unit arranged on the same line are installed in parallel.
Thus, a plurality of unit substrates are simultaneously cut out by placing the strip-shaped substrates sequentially cut out in the first scribe unit on the plurality of second transfer units and transferring them to the second scribe unit and the second break unit. Work efficiency can be improved.

FIG. 3 is a schematic side view of the cutting device according to the present invention as viewed from a direction along line AA in FIG. 2. FIG. 2 is a schematic plan view of the cutting device. The enlarged side view of the 1st break part and the 2nd break part in the above-mentioned dividing device. FIG. 3 is a schematic rear view as viewed from a direction along line BB in FIG. 2. FIG. 4 is a plan view showing a first step of a processing procedure by the cutting device. FIG. 7 is a plan view showing a second step of the processing procedure by the cutting device. FIG. 8 is a plan view showing a third step of the processing procedure by the cutting device. The side view of the above-mentioned 3rd process. The side view showing the 4th process by the above-mentioned dividing device. The top view which shows the 5th process by the said cutting device. FIG. 9 is a plan view showing a sixth step by the cutting device. The top view which shows the 7th process by the said cutting device. Explanatory drawing which shows the conventional board | substrate dividing procedure.

Hereinafter, details of the cutting device according to the present invention will be described with reference to FIGS.
In this separating apparatus, the mother substrate W is transported from the upstream to the downstream in a horizontal posture and sent to the first scribe unit 2 and the first break unit 3, and is sent by the first transport unit 1. A first scribe section 2 for processing a scribe line (hereinafter referred to as a first scribe line) S1 extending in a direction perpendicular to the feed direction on both front and back surfaces of the mother substrate W, and a mother along the first scribe line. A first break portion 3 for cutting the strip-shaped substrate W2 with the longitudinal direction directed along the first scribe line by dividing the substrate.
Here, a direction from the upstream to the downstream of the first transport unit 1 is defined as an X direction, and a direction orthogonal to the X direction on a horizontal plane is defined as a Y direction.

  The first transport unit 1 may be any mechanism having a mechanism capable of transporting the mother substrate W in the X direction. In this embodiment, the first transport unit 1 chucks the mother substrate W on the mounting table 4 from behind. 5 and is conveyed in the X direction along the guide 5a.

  Further, in the dividing apparatus, a loading table 28 for loading the mother substrate W into the first transport unit 1 is provided. The loading table 28 is formed so that the mother substrate W can be loaded from one side (lower side in FIG. 2) of the device located on the side orthogonal to the transport direction of the first transport unit 1, that is, the X direction. Have been. A plurality of rollers 29 are provided on the upper surface of the loading table 28.

  The first scribe unit 2 includes cutter wheels 8, 8 disposed above and below the mother substrate W between the fixed table 6 and the tilting table 7, which are disposed at intervals along the Y direction. I have. The cutter wheel 8 is vertically movably attached to a scribe head 10 held by a portal-shaped frame 9 installed so as to straddle the mother substrate W to be sent. As shown in FIG. 3, the scribe head 10 is held by a cross beam (beam) 11 of the frame 9 so as to be movable along the Y direction. By moving the cutter wheels 8 in the Y direction while pressing them against the surface of the mother substrate W, the first scribe lines along the Y direction are formed on both the front and back surfaces of the mother substrate W. Note that the fixed table 6 and the tilting table 7 are provided with a large number of air suction holes on the upper surface for sucking and holding the placed substrate.

In the present embodiment, the first breaker 3 is configured to divide the mother substrate W by the tilting operation of the tilting table 7 described above. That is, after the first scribe line S1 (see FIG. 7) is processed by the cutter wheel 8, the bending table is tilted downward or upward so that a bending moment is applied to the mother substrate to separate the mother substrate from the first scribe line S1. I have to. As shown in FIG. 3, the tilting table 7 supports the tip of the tilting table 7 adjacent to the fixed table 6 with a rotating shaft 12 and holds the other end with a fluid cylinder 13. By moving the rod up and down, the rod can be tilted up and down with the rotating shaft 12 as a fulcrum.
The tilting table 7 is formed so as to be able to carry the divided strip-shaped substrate W1 and to move in the X direction along the guide rails 14. At the moving position of the tilting table 7, the strip-shaped substrate W1 is suction-padded. There is provided a first transfer unit 16 that sucks the sheet at 15 and transfers it to a second transport unit described below.

  In addition, the cutting apparatus includes a second transport unit 17 that transports the strip-shaped substrate W1 cut by the first break unit 3 in the Y direction without changing its direction. The transport direction of the second transport unit 17 is parallel to the transport direction of the loading table 28, and is formed toward the side of the cutting device on the mother substrate loading side.

Further, a scribe line (hereinafter, referred to as a second scribe line) S2 along a direction orthogonal to the feed direction, that is, the X direction is processed on the strip-shaped substrate W1 sent by the second transport unit 17. A second scribing section 18, a second breaking section 19 for cutting out the unit substrate W2 from the strip-shaped substrate W1 along the second scribe line S2, and a side of the cutting apparatus which conveys the cut out unit substrate W2 in the Y direction. And a unit substrate unloading section 20 for unloading the unit substrate W2. The unit substrate unloading section 20 is formed by a conveyor.
In the present embodiment, a series of units including the second transport unit 17, the second scribe unit 18, the second break unit 19, and the unit substrate unloading unit 20 arranged on the same line in the Y direction are arranged in four rows in parallel. Are located. The reference numerals of the respective parts are described only for the units in one row.

  In the second transport unit 17, instead of the chuck of the first transport unit 1, the rear end of the strip-shaped substrate W <b> 1 is pressed and transported by the pressing roller 21. A mechanism such as a guide rail for moving the pressing roller 21 is omitted from the drawing.

  Similarly to the first scribe section 2, the second scribe section 18 includes upper and lower cutter wheels held between a fixed table 23 and a tilting table 24, which are spaced apart, and held by a portal frame 22. 25, 25, the second scribe line S2 in the X direction is formed on both the front and back surfaces of the strip-shaped substrate W1 (see FIG. 11).

  The second break portion 19 is also configured to divide the strip-shaped substrate W1 by the tilting operation of the tilting table 24 in the same manner as the first break portion 3 described above. The mechanism is the same as that of the tilting table 7 described above, and the description is omitted.

  Further, there is provided a second delivery unit 26 that sucks the unit substrate W2 cut out by the second break unit 19 with the suction pad 27 and transfers the unit substrate W2 to the unit substrate unloading unit 20.

Next, the operation of the cutting device will be described.
First, as shown in FIGS. 5 and 6, a large-sized mother substrate W is placed on the carry-in table 28 and sent to the base plate 4 of the first transport unit 1. This feeding operation is performed manually by a worker or using a robot arm. In the present embodiment, a mother board W to be divided is a laminated board in which a plurality of boards are stacked. Further, the division layout of the mother substrate W is the same as that shown in FIG. 13, and a total of 32 unit substrates of four columns and eight rows are cut out along the lines to be divided indicated by the dotted lines in FIG. 6. Is set to In FIG. 6, FIG. 7, FIG. 10, FIG. 11, and FIG. 12, in order to avoid complication of the drawings, the display of the scrap material regions Ta and Tb shown in FIG. 13 is omitted.

  The mother substrate W sent to the first transport section 1 is positioned at a fixed position by a positioning means (not shown), and then sent to the first scribe section 2 on the downstream side along the X direction to be fed into the strip-shaped substrates W1 and Y. A first scribe line S1 along the Y direction for cutting out the end material region in the direction is processed on both front and back surfaces (see FIGS. 7 and 8).

  Next, the mother substrate W is divided along the first scribe line S1 by the first breaker 3, and a strip-shaped substrate W2 whose longitudinal direction is directed in the Y direction is cut out. At the time of this cutting, the scrap material region in the Y direction is also divided and dropped into the scrap material collecting box 30 installed below the apparatus. The strip-shaped substrate W1 thus cut out has a rectangular shape in which four unit substrates are arranged in a line along the longitudinal direction together with the lateral end material regions.

  As shown in FIG. 9, the cut strip-shaped substrate W1 is placed on the tilting table 7 and moves in the X direction, is sucked by the suction pad 15 of the first transfer unit 16, and does not change its direction. It is sequentially delivered to the transport unit 17.

After the strip-shaped substrate W1 placed on the second transport section 17 is positioned at a fixed position by a positioning means (not shown), as shown in FIG. 11, the same side (in FIG. It is conveyed in the Y direction (downward) and sent to the second scribe unit 18. The fed strip-shaped substrate W1 is processed on both the front and back surfaces thereof with the unit substrate W2 and the second scribe line S2 along the X direction for cutting out the end material region in the X direction. The substrate is divided into substrates W2. At the time of this cutting, the cut material region in the X direction is also cut and dropped into the cut material accumulation box 31 installed below the apparatus.
The divided unit substrate W2 is sucked by the suction pad 27 of the second transfer unit 26 and delivered to the unit substrate unloading unit 20, and is unloaded in the Y direction by the unloading unit 20 and is on the same side as the substrate loading side of the cutting device. (See FIG. 12).

  As described above, according to the present cutting apparatus, the strip-shaped substrate W1 conveyed along the X direction and cut out at the first break portion is conveyed in the Y direction orthogonal to the X direction without changing its direction, and the unit substrate W2 is conveyed. Since only linear movement is carried out, a rotating mechanism (turntable) for rotating the strip-shaped substrate by 90 degrees as in the conventional case can be omitted, and equipment cost can be reduced. In addition to this, it is not necessary to perform fine adjustment of the angle associated with the rotation of the strip-shaped substrate. Further, the working line of the cutting device is also shortened as compared with a method in which the unit substrate is cut out while being transported linearly from upstream to downstream, and the installation space can be reduced. In addition, since the scribe line S2 is processed after the mother substrate W is divided into strip-shaped substrates W1 along the scribe line S1, there is no cross scribe in which the scribe lines cross each other as in the related art. It is possible to prevent the occurrence of scars such as "scratch" and "sedge" due to cross scribe.

  In addition, since the individually cut unit substrates are taken out at the same side of the cutting device as the substrate loading side of the cutting device, the moving range of the worker for carrying in the mother substrate and taking out the unit substrate is reduced, and The labor burden of the worker can be reduced.

  The representative examples of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments. For example, the first transporting unit 1 and the second transporting unit 17 may use a method of transporting by a conveyor instead of the method of transporting by pressing from the rear end with a chuck or a pressing roller as described above. Further, in the above embodiment, the first scribe line S1 and the second scribe line S2 are processed by the cutter wheel, but they may be processed by optical means such as a laser. Further, the first break portion 3 and the second break portion 19 are not limited to the above-described dividing method by the tilting of the tilting table. There may be.

  Further, the mother substrate W to be divided can be a laminated substrate obtained by laminating a plurality of substrates from only one single plate, and the material is a substrate such as a brittle material substrate such as glass or a resin substrate. Can be. When the mother substrate W is a single plate, one of the upper and lower cutter wheels of the first break portion 3 and the second break portion 19 can be omitted.

  INDUSTRIAL APPLICABILITY The cutting device of the present invention can be used when cutting a unit substrate from a large mother substrate.

S1 first scribe line S2 second scribe line W mother substrate W1 strip-shaped substrate W2 unit substrate 1 first transport section 2 first scribe section 3 first break section 17 second transport section 18 second scribe section 19 second break section 20 unit board unloading section

Claims (6)

A cutting device that cuts a strip-shaped substrate from a mother board and cuts a unit product from the strip-shaped substrate,
A first transport unit that transports the mother substrate in a horizontal posture from upstream to downstream;
A first scribe section for processing a first scribe line extending in a direction orthogonal to a feed direction on the mother substrate sent by the first transfer section;
A first break portion that cuts out a strip-shaped substrate along the first scribe line and cuts a strip-shaped substrate with a longitudinal direction directed in a direction along the first scribe line;
A second transport unit that transports the cut strip-shaped substrate in the longitudinal direction without changing its direction,
A second scribe section for processing a second scribe line extending in a direction orthogonal to a feed direction on the strip-shaped substrate sent by the second transfer section;
A second break portion for cutting out a unit substrate from the strip-shaped substrate along the second scribe line;
A substrate cutting device comprising: a unit substrate unloading unit that transfers the cut-out unit substrate in the same direction as the second transfer unit and takes out the unit substrate.   The first transfer unit is provided with a carry-in table for carrying the mother substrate into, the carry-in table is formed so as to be able to carry the mother substrate from a direction perpendicular to the carrying direction of the first carrying unit, 2. The substrate cutting device according to claim 1, wherein a substrate transfer direction from the second transfer unit to the unit substrate unloading unit is formed parallel to the substrate transfer direction of the loading table toward the substrate transfer side. 3.   3. The substrate cutting device according to claim 1, wherein a plurality of the second transport unit, the second scribe unit, the second break unit, and the unit substrate unloading unit arranged on the same line are arranged in parallel. 4.   A first delivery mechanism that receives the strip-shaped substrate cut by the first breaker and transfers it to the second transporter, and a second transfer that receives the unit substrate split by the second breaker and transfers it to the unit substrate unloader The substrate cutting device according to claim 1, further comprising a unit.   The said mother board | substrate is a laminated board | substrate, The said 1st scribe part and the 2nd scribe part are formed so that a scribe line may be processed on both the front and back surfaces of a mother board. Substrate cutting equipment. A method of dividing a strip-shaped substrate from a mother substrate and dividing a unit product from the strip-shaped substrate,
The first scribe line extending in the direction perpendicular to the feed direction is processed on the mother substrate transferred from the upstream,
Dividing the mother substrate along the first scribe line, cutting out a strip-shaped substrate whose longitudinal direction is oriented in the direction along the first scribe line,
The cut strip-shaped substrate is transported in the longitudinal direction of the substrate without changing its direction,
A second scribe line extending in the direction orthogonal to the feed direction is processed on the fed strip-shaped substrate,
A substrate division in which the strip substrate is cut along the second scribe line to cut a unit substrate, and the cut unit substrate is carried out in the same direction as the feeding direction of the strip substrate to take out the unit substrate. Method.

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