JP2018069495A - Dividing device for brittle material substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dividing device by which high strength of a divided substrate end surface can be maintained.SOLUTION: In a dividing and transporting device 1 for a brittle material substrate W, the brittle material substrate W on which a scribe line S is formed, is loaded on a loading table 3a. A breaking-dividing table 17 is located on a substrate transport direction downstream side of the loading table 3a, and a division scheduled part Wa which is more on the substrate transport direction downstream side from the scribe line S of the brittle material substrate W, is loaded on the breaking-dividing table. An adsorption part 77 adsorbs and holds a division scheduled part W1 on a top face 17a of the breaking-dividing table 17. A second motor 75 turns the breaking-dividing table 17. A controller 81 causes the adsorption part 77 to adsorb the division scheduled part Wa on the top face 17a of the breaking-dividing table 17. By turning the breaking-dividing table 17 by the second motor 75, the division scheduled part Wa is broken and divided along the scribe line S.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a cutting apparatus for a brittle material substrate.

Dividing a brittle material substrate such as a glass substrate is performed by a scribe process for forming a scribe line on the substrate surface and a break process for dividing the substrate along the formed scribe line. In the scribing step, the cutting edge of the scribing wheel is moved along a predetermined line while being pressed against the substrate surface. A scribe device provided with a scribe head is used for forming the scribe line (see, for example, Patent Document 1).
Patent Document 1 describes an apparatus for dividing a substrate along a scribe line. In this apparatus, with the clamp bar sandwiching the substrate from above and below, the break bar presses the upper surface of the end portion of the substrate, whereby the end portion of the substrate is cut along the scribe line.

JP 2014-18962 A

  However, according to the method of the cited document 1, when the substrate is folded, the opposing separation end faces may come into contact with each other and the separation end face may be damaged. Thereby, the end surface strength is reduced.

  An object of the present invention is to provide a cutting apparatus capable of keeping the strength of a divided substrate end face high.

  Hereinafter, a plurality of modes will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary.

A brittle material substrate cutting apparatus according to an aspect of the present invention includes a placement table, a folding table, a suction unit, a rotation mechanism, and a control unit.
A brittle material substrate having a scribe line formed on at least one surface is placed on the placement table.
The folding table is disposed on the downstream side of the placement table in the substrate transport direction, and a parting scheduled portion on the downstream side of the substrate transport direction from the scribe line of the brittle material substrate is placed.
The suction part sucks and holds the part to be divided on the upper surface of the folding table.
The rotation mechanism rotates the folding table.
The controller causes the suction part to attract the part to be divided on the upper surface of the folding table and rotates the parting table by the rotation mechanism to fold the part to be divided along the scribe line.
In this apparatus, the part to be divided is adsorbed on the upper surface of the folding table, and is folded along the scribe line by rotating the folding table. In this case, the divided substrate moves away from the original substrate in an oblique direction. Therefore, the divided substrate end faces do not come into contact with each other. As a result, the strength of the substrate end face can be kept high.

The rotation axis of the folding table may be on a straight line that passes through the scribe line of the brittle material substrate placed on the folding table and is orthogonal to the plane of the brittle material substrate.
In this apparatus, a force component acting in the horizontal direction with respect to the scribe line and a force component acting downward are generated. Therefore, the divided substrate is moved obliquely downward from the scribe line, so that the division is reliably performed at the scribe line.

The cutting apparatus may further include a shift mechanism that can move the folding table in the substrate transport direction.
The control unit folds the part to be divided along the scribe line, then moves the folding table to the downstream side in the substrate transport direction by the shift mechanism, and then returns the folding table to the original posture by the rotating mechanism. You may return.
In this apparatus, the folding table is moved to the downstream side in the substrate transport direction after the portion to be divided is broken, and then rotated to return to the original posture. In this case, since the gap is ensured between the divided end faces of the substrates by the amount of movement by the shift mechanism, they do not come into contact with each other. As a result, the strength of the substrate end face can be kept high.

  In the cutting apparatus according to the present invention, it is possible to keep the strength of the divided substrate end face high.

1 is a schematic perspective view of a substrate cutting apparatus as one embodiment of the present invention. The typical top view of a substrate cutting device. The typical front view of a substrate cutting device. The typical side view of a substrate cutting device. The block diagram of the control structure of a board | substrate cutting device. The flowchart of board | substrate cutting operation. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement. The schematic diagram which shows board | substrate parting operation | movement.

1. First Embodiment (1) Outline of Substrate Cutting Device The cutting and conveying device 1 will be described with reference to FIGS. FIG. 1 is a schematic perspective view of a substrate cutting apparatus as one embodiment of the present invention. FIG. 2 is a schematic plan view of the substrate cutting apparatus. FIG. 3 is a schematic front view of the substrate cutting apparatus. FIG. 4 is a schematic side view of the substrate cutting apparatus. In the figure, the first horizontal direction is indicated by an arrow X, and the second horizontal direction perpendicular thereto is indicated by an arrow Y.

  The divided conveyance device 1 is a device that divides a brittle material substrate W (hereinafter referred to as “substrate W”) having a scribe line S formed on an upper surface thereof to form a divided substrate W1 and convey the substrate. 1-4, the arrow X is a board | substrate conveyance direction. The left side of FIGS. 2 and 3 is the upstream side in the substrate transport direction, and the right side is the downstream side in the substrate transport direction.

In FIG. 2, a substrate W and a plurality of divided substrates W1 formed therefrom are shown. The divided substrate W1 is a rectangle whose X direction side is shorter than the Y direction side. As shown in FIG. 3, the substrate W has a plurality of scribe lines S extending in the Y direction. The scribe line S is formed on the upper surface of the substrate W. The further downstream side of the scribe line S on the most downstream side in the substrate transport direction of the substrate W is a portion to be divided Wa.
The dividing conveyance device 1 has a placement unit 3. The placement unit 3 has a structure on which the substrate W is placed. The placement unit 3 has a plurality of placement tables 3a. The plurality of mounting tables 3a extend in the X direction, and are arranged at intervals in the Y direction. The top surfaces 3b of the plurality of mounting tables 3a are flat horizontal surfaces and have the same height. The substrate W is placed on the upper surface 3b of the plurality of placement tables 3a. In this embodiment, the number of mounting tables 3a is three, but the number is not limited (hereinafter, the number of each device is not particularly limited).

The placement unit 3 includes a plurality of lifting units 5A. The elevating unit 5A is a device that moves the substrate W placed on the placement unit 3 in the vertical direction. The lifting unit 5A is disposed between the placing tables 3a. That is, the lifting unit 5A and the placing table 3a are alternately arranged in the Y direction.
The elevating unit 5A includes a support rail 7, a plurality of jacks 9A, and a first shuttle arm 11A. The support base rails 7 are arranged extending in the X direction between the placement tables 3a. The jack 9 </ b> A is disposed on the support base rail 7. The first shuttle arm 11A is disposed on the jack 9A. The first shuttle arm 11A extends in the X direction, and the upper surface 11a is a flat horizontal surface. The elevating unit 5A has a plurality of motors 71 (FIG. 5). When the motor 71 is driven, the jack 9A moves up and down the first shuttle arm 11A. Thereby, 11 A of 1st shuttle arms can move between the immersion position where the upper surface 11a is lower than the upper surface 3b of the mounting table 3a, and the appearance position where the upper surface 11a is higher than the upper surface 3b of the mounting table 3a.
Furthermore, the lifting unit 5A has a first transport direction drive unit 73 (FIG. 5) that moves the support base rail 7 in the substrate transport direction. As a result, the first shuttle arm 11A (the second shuttle arm 11B and the third shuttle arm 11C described later) can move between the upstream position in the substrate transport direction and the downstream position in the substrate transport direction. The distance between the upstream position in the substrate transport direction and the downstream position in the substrate transport direction corresponds to the length of the divided substrate W1 in the substrate transport direction. In addition, the 1st conveyance direction drive part 73 is a well-known technique.

  The dividing conveyance device 1 has a folding part 15. The folding unit 15 is a device that places the substrate W on the upper surface and separates the divided substrate W1. The folding part 15 is disposed close to the downstream side in the substrate transport direction of the plurality of lifting units 5A. The folding unit 15 has a plurality of folding tables 17. The folding table 17 is disposed close to the downstream side of the placement table 3a in the substrate transport direction. On the upper surface 17 a of the folding table 17, a parting scheduled portion Wa of the substrate W is placed. A shaft 19 is fixed to the lower end of the folding table 17. The shaft 19 extends in the Y direction. The shaft 19 is rotated by a rotary actuator 75, whereby the folding table 17 has a first posture (FIG. 7) in which the height of the upper surface 17a coincides with the height of the upper surface 3b of the mounting table 3a, and the upper surface 17a. However, the posture can be changed between the second posture (FIG. 8) that is separated from the placement table 3a to the downstream side in the substrate transport direction and downward. The shaft 19 is on a straight line L passing through the scribe line S of the substrate W placed on the placement table 3 a and the folding table 17 and orthogonal to the surface of the substrate W.

The folding part 15 has the adsorption | suction part 77 (FIG. 5). The suction part 77 has an opening on the upper surface 17a of the folding table 17, and is an apparatus that holds the divided substrate W1 on the upper surface 17a of the folding table 17.
The folding part 15 has the 2nd conveyance direction drive part 79 (FIG. 5). The folding unit 15 is a device that moves the folding table 17 in the substrate transport direction. Thereby, the folding table 17 is movable between the upstream position in the substrate transport direction and the downstream position in the substrate transport direction. Specifically, the second transport direction drive unit 79 is a mechanism for moving the shaft 19 in the substrate transport direction. As shown in FIGS. 1 and 3, both ends in the Y direction of the shaft 19 are raised by a shift guide 80. It is guided so as to be movable within a predetermined range while maintaining its position. The second transport direction driving unit 79 is a known technique.

The folding part 15 has a plurality of lifting units 5B. The lifting unit 5B is a device that moves the divided substrate W1 placed on the folding table 17 in the vertical direction. The lifting unit 5A is arranged between the folding tables 17. That is, the lifting unit 5B and the folding table 17 are alternately arranged in the Y direction.
The elevating unit 5B has a jack 9B and a second shuttle arm 11B. The jack 9B is disposed on the support base rail 7. The second shuttle arm 11B is a member that conveys the divided substrate W1. The second shuttle arm 11B is disposed on the jack 9B. The second shuttle arm 11B is a horizontal surface having a flat upper surface 11b. The folding part 15 has a motor 71 (FIG. 5). When the motor 71 is driven, the jack 9B moves up and down the second shuttle arm 11B. Thus, the second shuttle arm 11B is movable between an immersion position where the upper surface 11b is lower than the upper surface 17a of the folding table 17 and an appearance position where the upper surface 11b is higher than the upper surface 17a of the folding table 17. That is, the jack 9 </ b> B displaces the second shuttle arm 11 </ b> B to the appearance position above the upper surface 17 a of the folding table 17 and the immersion position below.

  The divided conveyance device 1 has a placement unit 21. The placement unit 21 has a structure on which the divided substrate W1 is placed. The placement unit 21 has a plurality of placement tables 21a. The plurality of mounting tables 21a extend in the X direction, and are arranged at intervals in the Y direction. The plurality of placement tables 21 a are disposed on the downstream side of the plurality of placement tables 3 a and the folding table 17 in the substrate transport direction. The upper surfaces 21b of the plurality of mounting tables 21a are flat horizontal surfaces and have the same height.

The dividing and conveying apparatus 1 has a plurality of lifting units 5C. The lifting unit 5C is a device that moves the divided substrate W1 placed on the placement unit 21 in the vertical direction. The elevating unit 5C is disposed between the placement tables 21a. That is, the lifting unit 5A and the mounting table 21a are alternately arranged in the Y direction.
The elevating unit 5C has a jack 9C and a third shuttle arm 11C. The jack 9 </ b> C is disposed on the support base rail 7. The third shuttle arm 11C is disposed on the jack 9C. The third shuttle arm 11C is a horizontal surface with a flat upper surface 11c.
The folding part 15 has a plurality of motors 71 (FIG. 5). When the motor 71 is driven, the jack 9C moves up and down the third shuttle arm 11C. Thus, the third shuttle arm 11C is movable between an immersion position where the upper surface 11c is lower than the upper surface 21b of the mounting table 21a and an appearance position where the upper surface 11c is higher than the upper surface 21b of the mounting table 21a.

(2) Control configuration of substrate cutting apparatus A control configuration of the cutting and conveying apparatus 1 will be described with reference to FIG. FIG. 5 is a block diagram of a control configuration of the substrate cutting apparatus. The dividing conveyance device 1 has a controller 81.
The controller 81 is a computer having a processor (eg, CPU), a storage device (eg, ROM, RAM, HDD, SSD) and various interfaces (eg, A / D converter, D / A converter, communication interface, etc.). System. The controller 81 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

The controller 81 may be composed of a single processor, but may be composed of a plurality of independent processors for each control.
Some or all of the functions of each element of the controller 81 may be realized as a program that can be executed by a computer system that constitutes the controller 81. In addition, some of the functions of each element of the controller 81 may be configured by a custom IC.

The controller 81 is connected to a motor 71, a first transport direction drive unit 73, a rotary actuator 75, a suction unit 77, and a second transport direction drive unit 79. The controller 81 can control these devices.
Although not shown, the controller 81 is connected to sensors for detecting the size, shape and position of the substrate W and the divided substrate W1, sensors and switches for detecting the state of each device, and an information input device.

(3) Substrate cutting operation The substrate cutting operation will be described with reference to FIGS. FIG. 6 is a flowchart of the substrate cutting operation. 7 to 14 are schematic views showing the substrate cutting operation.
The controller 81 divides the substrate W by the folding table 17 and then displaces the second shuttle arm 11B from the immersive position to the appearance position by the jack 9B, whereby the divided substrate W1 is separated from the folding table 17 by the second shuttle arm. Next, the divided substrate W1 is moved by shifting the second shuttle arm 11B to the downstream side in the substrate transport direction by the first transport direction driving unit 73.
The control flowchart described below is an example, and each step can be omitted or replaced as necessary. Also, a plurality of steps may be executed simultaneously, or some or all of them may be executed in an overlapping manner.
Furthermore, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.

  In step S1, the suction of the substrate W by the folding table 17 is started. Specifically, the controller 81 drives the suction unit 77 to suck the part to be divided Wa of the substrate W onto the upper surface 17 a of the folding table 17. At this time, as shown in FIG. 7, the folding table 17 is in the first posture, the upper surface 17a of the folding table 17 is in a horizontal state, and the height coincides with the upper surface 3b of the mounting table 3a. . Further, the folding table 17 is located upstream in the substrate transport direction between the mounting table 3a and the mounting table 21a, so that the edge end surface of the mounting table 3a and the edge end surface of the folding table 17 are close to each other. Or they are in contact. The first shuttle arm 11A and the second shuttle arm 11B are in the upstream position and the immersive position in the substrate transport direction.

In step S2, the swing operation of the folding table 17 is performed. Specifically, the controller 81 drives the rotary actuator 75 to rotate the folding table 17 from the first posture to the second posture as shown in FIG. As a result, the divided substrate W1 is folded.
A shaft 19 that is a rotation axis of the folding table 17 is on a straight line L that passes through the scribe line S of the substrate W placed on the folding table 17 and is orthogonal to the surface of the substrate W. Therefore, a force component acting in the horizontal direction and a force component acting downward are generated on the scribe line S. As a result, the divided substrate W1 is moved obliquely downward from the scribe line S, so that the division is reliably performed on the scribe line S.

In step S3, the folding table 17 is moved from the upstream position in the substrate transport direction to the downstream position in the substrate transport direction. Specifically, the controller 81 drives the second transport direction drive unit 79 to move the folding table 17 downstream in the transport direction as shown in FIG.
In step S4, the return swing operation of the folding table 17 is performed. Specifically, the controller 81 drives the rotary actuator 75 to rotate the folding table 17 from the second posture to the first posture as shown in FIG. As a result, the divided substrate W1 assumes a horizontal posture in a state where the end surfaces are separated from the substrate W in the substrate transport direction.

  As described above, after the divided substrate W1 is folded along the scribe line S, the folding table 17 is moved to the downstream side in the substrate transport direction by the second transport direction drive unit 79, and then is folded by the rotary actuator 75. The split table 17 is returned to the first posture. Therefore, a gap in the amount of movement of the folding table 17 in the substrate transport direction is ensured between the end surfaces of the substrate W and the divided substrate W1, so that they do not contact each other. As a result, the strength of the substrate end face can be kept high.

In step S5, the adsorption of the substrate W by the folding table 17 is stopped. Specifically, the controller 81 stops the operation of the suction unit 77.
In step S6, the first shuttle arm 11A and the second shuttle arm 11B are moved from the immersion position to the appearance position. Specifically, the controller 81 drives the motor 71 to raise the first shuttle arm 11A and the second shuttle arm 11B as shown in FIG. As a result, the first shuttle arm 11A lifts the substrate W from the mounting table 3a as shown in FIG. Further, the second shuttle arm 11B lifts the divided substrate W1 from the folding table 17.

In step S7, the first shuttle arm 11A and the second shuttle arm 11B are moved from the upstream position in the substrate transport direction to the downstream position in the substrate transport direction. Specifically, the controller 81 drives the first transport direction driving unit 73 to move the first shuttle arm 11A and the second shuttle arm 11B to the downstream side in the substrate transport direction as shown in FIG. As a result, the substrate W and the divided substrate W1 are moved downstream in the substrate transport direction.
In step S8, the folding table 17 is moved from the downstream position in the substrate transport direction to the upstream side in the substrate transport direction. Specifically, the controller 81 drives the second transport direction driving unit 79 to move the folding table 17 to the upstream side in the traveling direction as shown in FIG. Note that either step S7 or step S8 may be performed first or simultaneously.

In step S9, the first shuttle arm 11A and the second shuttle arm 11B are moved from the appearance position to the immersion position. Specifically, the controller 81 drives the motor 71, and the first shuttle arm 11A and the second shuttle arm 11B are lowered as shown in FIG. As a result, the substrate W is placed on the placement table 3a. Further, the portion Wa to be divided of the substrate W is placed on the folding table 17.
Further, as shown in FIG. 13, the divided substrate W1 is placed on the placement table 21a. In other words, after the divided substrate W1 is moved, the divided substrate W1 is transferred to the mounting table 21a by displacing the second shuttle arm 11B from the appearance position to the immersive position by the jack 9B. In this way, the divided substrate W1 is reliably transferred to the mounting table 21a by a simple structure and operation.

In step S10, the first shuttle arm 11A and the second shuttle arm 11B are moved from the downstream position in the substrate transport direction to the upstream position in the substrate transport direction. Specifically, the controller 81 drives the first transport direction driving unit 73 to move the first shuttle arm 11A and the second shuttle arm 11B to the upstream side in the substrate transport direction as shown in FIG.
As described above, the divided substrate W1 is placed on the second shuttle arm 11B, and the second shuttle arm 11B is shifted to the downstream side in the substrate transport direction by the first transport direction driving unit 73. Therefore, it is difficult for impact and vibration to be applied to the divided substrate W1, and thus the surface of the divided substrate W1 is not easily damaged.

As described above, the divided substrate W1 is attracted to the upper surface 17a of the folding table 17, and is folded along the scribe line S as the folding table 17 rotates. Since the end surfaces of the divided substrate W1 and the substrate W do not contact each other, the strength of the substrate end surface can be kept high.
As described above, the first shuttle arm 11A repeatedly performs the operation of lifting the substrate W from the mounting table 3a and moving it to the downstream side in the substrate transport direction after dropping the substrate and then lowering it to the mounting table 3a. In addition, after the substrate is divided, the second shuttle arm 11B repeatedly performs the operation of lifting the divided substrate W1 from the folding table 17 and moving it to the downstream side in the substrate transport direction and then lowering it to the mounting table 21a. The operations of the first shuttle arm 11A and the second shuttle arm 11B are synchronized. Although omitted in the above description, the third shuttle arm 11C operates in synchronization with the first shuttle arm 11A and the second shuttle arm 11B. Specifically, after the substrate is divided, the third shuttle arm 11C repeatedly performs the operation of lifting the divided substrate W1 from the mounting table 21a and moving it to the downstream side in the substrate transport direction and then lowering it to the mounting table 21a.

2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as necessary.
In the embodiment, the second shuttle arm 11B and the third shuttle arm 11C are separate bodies, but they may be integrated.
In the embodiment, the method for transporting the substrate is a method for lifting and shifting by the shuttle arm, but the substrate transport method is not particularly limited. For example, the divided substrate may be sucked up by a vacuum suction plate and conveyed to the next step.

  The present invention is widely applied to a brittle material substrate cutting apparatus.

1: Dividing conveyance device (an example of a dividing device)
3: Placement unit 3a: Placement table 3b: Upper surface 5A: Lifting unit 5B: Lifting unit 5C: Lifting unit 7: Supporting base 9A: Jack 9B: Jack 9C: Jack 11A: First shuttle arm 11B: Second shuttle arm 11C: Third shuttle arm 11a: Upper surface 11b: Upper surface 11c: Upper surface 15: Folding portion 17: Folding table 17a: Upper surface 19: Shaft 21: Mounting portion 21a: Mounting table 21b: Upper surface 71: Motor 73: First 1 transport direction drive unit 75: rotary actuator (an example of a rotation mechanism)
77: Suction unit 79: Second transport direction drive unit 81: Controller (an example of a control unit)
S: Scribe line W: Brittle material substrate W1: Divided substrate Wa: Divided planned portion

Claims (3)

A mounting table on which a brittle material substrate having a scribe line formed on at least one surface is mounted;
A folding table that is arranged on the downstream side in the substrate transport direction of the placement table and on which the parting planned portion that is downstream in the substrate transport direction from the scribe line of the brittle material substrate is placed;
An adsorbing part that adsorbs and holds the part to be divided on the upper surface of the folding table;
A turning mechanism for turning the folding table;
A controller that causes the portion to be divided to be attracted to the upper surface of the split table by the suction portion, and that the portion to be split is bent along the scribe line by rotating the split table by the rotation mechanism. When,
A brittle material substrate cutting apparatus comprising:   2. The brittleness according to claim 1, wherein a rotation axis of the folding table is on a straight line passing through the scribe line of the brittle material substrate placed on the folding table and perpendicular to the surface of the brittle material substrate. Material substrate cutting device. A shift mechanism capable of moving the folding table in the substrate transport direction;
The control unit folds the portion to be divided along the scribe line, then moves the folding table to the downstream side in the substrate transport direction by the shift mechanism, and then moves the folding table by the rotation mechanism. The apparatus for cutting a brittle material substrate according to claim 1 or 2, wherein the apparatus is returned to the original posture.

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