JP2021095313A - End material removal apparatus and end material removal method - Google Patents

Abstract

To provide an end material removal apparatus capable of surely removing an end material on the lower side of a bonded substrate.SOLUTION: An end material removal apparatus includes a reversal table 5, a first robot arm and a controller. The reversal table 5 including a table adsorber 17 is vertically reversible, and the controller performs steps: facing the adsorption part 17 of the table 5 upward; arranging an end material M2a in the table adsorber 17 of the reversal table 5 in a state of facing a second substrate downward to a conveying device; adsorbing the end material M2a to the table adsorber 17; dividing a main body from the end material M2a by separating a mother from the reversal table 5 by the first robot arm; facing the table adsorber 17 and the end material M2a downward by vertically reversing the table 5; and dropping the end material M2a by releasing the adsorption of the end material M2a by the table adsorber 17.SELECTED DRAWING: Figure 8

Description

The present invention relates to an end material removing device, particularly an end material removing device for separating end materials of a bonded substrate from a main body, and an end material removing method.

The liquid crystal device is composed of a bonded substrate in which a first substrate and a second substrate are bonded by a sealing material so as to interpose a liquid crystal layer. In such a bonded substrate, a color filter is formed in a pattern on one of the above substrates (for example, the first substrate), and a TFT (Thin Film Transistor) and a connection terminal are formed on the other substrate (for example, the second substrate). Is formed.

In the above-mentioned bonded substrate, in order to connect to an external electronic device, it is necessary to expose the connection terminals formed on the second substrate. In the bonded substrate which is a liquid crystal device, a method for separating the substrate for exposing the surface on which the connection terminal is formed (exposing the inner side surface of one of the bonded substrates) is described in Patent Document 1 and Patent Documents. It is shown in 2.
In the scrap removing device described in Patent Document 1, the scrap is separated and removed from the product portion by using an air blow.
In the substrate dividing device described in Patent Document 2, a suction device is used to separate and remove scraps from the product portion.

JP-A-2019-109292 JP-A-2017-95294

However, in the conventional apparatus, it is difficult to remove the scraps when the scraps of the bonded substrate are on the lower side.

An object of the present invention is to reliably remove the scrap material under the bonded substrate in the scrap material removing device.

Hereinafter, a plurality of aspects will be described as means for solving the problem. These aspects can be arbitrarily combined as needed.

The scrap material removing device according to the first aspect of the present invention is a bonded substrate having a first substrate and a second substrate bonded to the first substrate and having a scribe line formed on the surface for separating the scraps. 2 This is a scrap material removing device for removing scraps from the main body of the substrate, and includes an inversion table, a transport device, and a control unit.
The reversing table has a suction portion and can be turned upside down.
The transport device transports the bonded substrate to the reversing table.
The control unit executes the following steps.
◎ Step to turn the suction part of the reversing table upward.
◎ The step of arranging the scraps on the suction part of the reversing table with the second substrate facing downward on the transfer device.
◎ Step to adsorb scraps to the adsorption part.
◎ The step of separating the main body from the scraps by separating the substrate from the reversing table, which is attached to the transport device.
◎ A step to turn the suction part and scraps downward by turning the inverted table upside down.
◎ The step of dropping the scraps by causing the suction part to release the suction of the scraps.
With this device, the scraps of the substrate on the lower side of the bonded substrate can be easily removed.

The control unit may execute a step of arranging the bonded substrate on the reversing table on the transfer device after the step of dropping the scraps.
In this device, an inversion table can be used to place the bonded substrate after the scraps have fallen.

The control unit may move the bonded substrate diagonally upward from the inverted table to the transfer device in the step of separating the bonded substrate from the inverted table.
In this device, the load acting on the exposed surface of the main body of the bonded substrate is reduced, so that the accuracy of the exposed surface is improved.

In a scrap removing device having a reversing table having a suction portion and capable of being turned upside down and a transporting device for transporting a bonded substrate to the flipped table, the first substrate and the scraps are bonded to the first substrate to separate the scraps. This is a method for removing scraps from the main body of the second substrate of a bonded substrate having a second substrate having a scribing line formed on the surface thereof, and includes the following steps.
◎ Step to turn the suction part of the reversing table upward ◎ Step to place the scraps of the second board of the laminated board on the suction device with the second board facing downward ◎ Step to the suction part of the reversing table Step to attract the scraps ◎ Step to separate the main body from the scraps by separating the bonded substrate from the flipping table by the transport device ◎ Step to turn the suction part and scraps downward by flipping the flipping table upside down ◎ Step of dropping the scraps by causing the suction part to release the suction of the scraps In this method, the scraps on the second substrate of the bonded substrate can be easily removed.

After the step of dropping the scraps, a step of arranging the bonded substrate on the reversing table in the transport device may be further provided.
In this method, an inversion table can be used to place the substrate after the scraps have fallen.

In the step of separating the bonded substrate from the reversing table, the bonded substrate may be moved obliquely upward from the reversing table by the transfer device.
In this method, the load acting on the exposed surface of the main body of the bonded substrate is reduced, so that the accuracy of the exposed surface is improved.

In the scrap material removing device and the scrap material removing method according to the present invention, the scrap material of the second substrate of the bonded substrate can be reliably removed.

The schematic perspective view of the scrap material removing apparatus of 1st Embodiment. Schematic perspective view of the reversing mechanism. Schematic side view of the scrap remover. The block diagram which shows the control composition of the scrap material removal device. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation. The schematic side view which shows the substrate division operation.

1. 1. 1st Embodiment (1) Structure of scrap material removing device The structure of the scrap material removing device 1 (an example of the scrap material removing device) will be described with reference to FIGS. FIG. 1 is a schematic perspective view of the scrap material removing device of the first embodiment. FIG. 2 is a schematic perspective view of the reversing mechanism. FIG. 3 is a schematic side view of the scrap material removing device.
In FIGS. 1 and 2, the substrate transport direction is the first direction (arrow X), and the direction orthogonal to the first direction (arrow Y) is.

The object to be divided is a mother substrate M (an example of a bonded substrate). As shown in FIG. 3, the mother substrate M is a laminated glass composed of two substrates, a first substrate M1 (an example of a first substrate) and a second substrate M2 (an example of a second substrate).
The scrap removing device 1 separates the main body P2 (an example of the main body) of the second substrate M2 (an example of the second substrate) of the mother substrate M from the scrap M2a (an example of the scrap) (that is, the scrap M2a). It is a device for removing).

The scrap removing device 1 includes a reversing mechanism 3. The reversing mechanism 3 has a reversing table 5 (an example of the reversing table). The flip table 5 can be flipped upside down. The first surface 5a of the reversing table 5 is a flat surface.
The reversing mechanism 3 has a table suction device 17 (an example of a suction portion). The table suction device 17 is provided on the second surface 5b side of the reversing table 5, and extends in the second direction on the side of the reversing table 5. The table suction device 17 is provided with a plurality of suction holes (not shown). The plurality of suction holes are communicated with a negative pressure generator 35 (described later) such as a vacuum pump via an air duct (not shown).

The reversing mechanism 3 has a rotating shaft 19 fixed to the reversing table 5, a support structure 21 for rotatably supporting the rotating shaft 19, and a rotation driving device 37 (described later) including a motor or the like.
The rotating shaft 19 extends along the second direction and is provided at both ends of the reversing table 5.

The scrap material removing device 1 has a first robot arm 7 (an example of a transport device). The first robot arm 7 is an articulated robot, and can move the first suction hand 9 (described later) up and down and sideways. The first robot arm 7 has a first arm driving device 33 (described later) including a motor or the like.
The scrap removing device 1 has a first suction hand 9 (an example of a transport device). The first suction hand 9 can suck and convey the mother substrate M. The first suction hand 9 is attached to the tip of the first robot arm 7.

The suction portion main body 9a of the first suction hand 9 has a horizontal suction surface 9b on the lower side, on which the mother substrate M to be processed is sucked. A plurality of air suction holes (not shown) are provided on the suction surface 9b. The air suction hole communicates with the negative pressure generator 35 via an air duct (not shown).
The first suction hand 9 sucks and fixes the first substrate M1 of the mother substrate M.

The scrap material removing device 1 has a second robot arm 41. The second robot arm 41 has the same function as the first robot arm 7. The second robot arm 41 has a second arm driving device 45 (described later) including a motor or the like.
The scrap removing device 1 has a second suction hand 49. The second suction hand 49 can suck and convey the mother substrate M. The second suction hand 49 is attached to the tip of the second robot arm 41. The air suction hole (not shown) of the second suction hand 49 communicates with the negative pressure generator 35 via an air duct (not shown).

(2) Control configuration of the scrap material removing device The control configuration of the scrap material removing device 1 will be described with reference to FIG. FIG. 4 is a block diagram showing a control configuration of the scrap material removing device.
The scrap removing device 1 has a controller 31. The controller 31 is a computer having a processor (for example, a CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.) and various interfaces (for example, an A / D converter, a D / A converter, a communication interface, etc.). It is a system. The controller 31 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

The controller 31 may be composed of a single processor, or may be composed of a plurality of independent processors for each control.
A part or all of the functions of each element of the controller 31 may be realized as a program that can be executed by the computer system constituting the controller 31. In addition, a part of the function of each element of the controller 31 may be configured by a custom IC.

The controller 31 can control the first arm drive device 33, the negative pressure generator 35, the rotation drive device 37, and the second arm drive device 45.
Although not shown, the controller 31 is connected to a sensor that detects the size, shape, and position of the substrate, a sensor and a switch for detecting the state of each device, and an information input device.

(3) Substrate Division Operation of the Scrap Removal Device The substrate division operation of the scrap removal device 1 will be described with reference to FIGS. 5 to 13. FIG. 5 is a flowchart of the substrate division operation control. 6 to 13 are schematic side views showing a substrate dividing operation.
The control flowchart described below is an example, and each step can be omitted or replaced as necessary. Further, a plurality of steps may be executed at the same time, or some or all of them may be executed in an overlapping manner.
Further, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.
The following control operations are realized by commands to various devices of the controller 31.

In step S1, as shown in FIG. 3, the inversion table 5 is inverted and the table suction device 17 is turned upward. Specifically, the controller 31 executes the above operation by controlling the rotation drive device 37.
In step S2, the first robot arm 7 carries the mother substrate M into the area of the reversing table 5. Specifically, the controller 31 executes the above operation by controlling the first robot arm 7. At this time, the second substrate M2 is on the lower side, and therefore, the scrap material M2a is in a state of being submerged in the lower side of the end portion of the first substrate M1.

In step S3, as shown in FIG. 6, the first robot arm 7 abuts the end material M2a of the second substrate M2 of the mother substrate M against the table suction device 17. Specifically, the controller 31. The above operation is executed by controlling the first robot arm 7.
In step S4, the table suction device 17 sucks the scrap material M2a. Specifically, the controller 31 controls the negative pressure generator 35 to execute the above operation.

In step S5, as shown in FIG. 7, the first robot arm 7 separates the first suction hand 9 from the reversing table 5. Specifically, the controller 31 controls the first robot arm 7 to execute the above operation. As a result, the main body P2 of the second substrate M2 of the mother substrate M is separated from the scrap material M2a (that is, the scrap material is separated and removed from the substrate).
In this step, the first robot arm 7 moves the mother substrate M diagonally upward from the reversing table 5. Therefore, the load acting on the exposed surface of the first substrate M1 of the mother substrate M becomes small, and therefore the accuracy of the exposed surface becomes high.

In step S6, as shown in FIG. 8, the table suction device 17 and the end material M2a are turned downward by turning the reversing table 5 upside down. Specifically, the controller 31 controls the rotation drive device 37 to execute the above operation.
In step S7, as shown in FIG. 9, the table suction device 17 releases the suction of the scrap material M2a. As a result, the scrap material M2a falls. Specifically, the controller 31 controls the negative pressure generator 35 to execute the above operation.

In step S8, as shown in FIG. 10, the first robot arm 7 arranges the mother substrate M from which the scraps have been removed on the first surface 5a of the reversing table 5. Specifically, the controller 31 controls the rotation drive device 37 to execute the above operation. In this way, the reversing table 5 can be used on the mother substrate M after the scrap material M2a has fallen.
In step S9, as shown in FIG. 11, the first suction hand 9 releases the suction to the mother substrate M and further separates from the mother substrate M. Specifically, the controller 31 controls the negative pressure generator 35 and the first robot arm 7 to execute the above operation.

In step S10, as shown in FIG. 12, the second robot arm 41 abuts the second suction hand 49 on the mother substrate M. Specifically, the controller 31 controls the second robot arm 41 to execute the above operation.
In step S11, the second suction hand 49 sucks the mother substrate M. Specifically, the controller 31 controls the negative pressure generator 35 to execute the above operation.
In step S12, as shown in FIG. 13, the second robot arm 41 carries out the mother substrate M from the area of the reversing table 5. Specifically, the controller 31 controls the second robot arm 41 to execute the above operation.

In this scrap removing device 1, the scrap M2a of the second substrate M2 of the mother substrate M can be easily removed.

2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention. In particular, the plurality of embodiments and modifications described herein can be arbitrarily combined as needed.

The two brittle material substrates are bonded together. The brittle material substrate is a flat display panel such as a liquid crystal panel, a plasma display panel, or an organic EL display panel in which a glass substrate is bonded, and a silicon substrate, a sapphire substrate, or the like is glass. A semiconductor substrate bonded to the substrate is included.
The type of substrate is not particularly limited. Substrates include veneer glass, semiconductor wafers, and ceramic substrates.

The present invention can be widely applied to a scrap material removing device and a scrap material removing method for separating scraps of a bonded substrate from a main body.

1: Scrap removal device 3: Reversing mechanism 5: Reversing table 7: First robot arm 9: First suction hand 9a: Suction part main body 9b: Suction surface 17: Table suction device 19: Rotating shaft 21: Support structure 31: Controller 33: 1st arm drive device 35: Negative pressure generator 37: Rotation drive device 41: 2nd robot arm 45: 2nd arm drive device 49: 2nd suction hand M: Mother board M1: 1st board M2: 1st 2 substrate M2a: scrap P2: main body

Claims (6)

The scrap material from the main body of the second substrate of the bonded substrate having a first substrate and a second substrate bonded to the first substrate and having a scribe line formed on the surface for separating the scrap material from the main body. It is a scrap removal device for removing
An inversion table that has a suction part and can be turned upside down,
A transport device that transports the bonded substrate to the reversing table, and
A step of directing the suction portion of the reversing table upward, a step of arranging the end material on the suction portion of the reversing table with the second substrate facing downward in the transport device, and the suction portion. The step of adsorbing the scraps, the step of separating the main body from the scraps by separating the bonded substrate from the reversing table in the transport device, and the step of flipping the reversing table upside down to suck the scraps. A control unit that executes a step of directing the end material and the end material downward, and a step of dropping the end material by causing the suction portion to release the adsorption of the end material.
Scrap removal device equipped with. The scrap removing device according to claim 1, wherein the control unit executes a step of arranging the bonded substrate on the reversing table in the transport device after the step of dropping the scrap. The scrap removing device according to claim 1 or 2, wherein the control unit moves the bonded substrate diagonally upward from the inverted table to the transport device in a step of separating the bonded substrate from the inverted table. In a scrap removing device having a reversing table having a suction portion and capable of being turned upside down and a transport device for transporting a bonded substrate to the reversing table, the first substrate and the first substrate are bonded to the first substrate from the main body. A method for removing scraps from the main body of the second substrate of a bonded substrate having a second substrate having a scribe line formed on the surface for separating the scraps.
A step of turning the suction portion of the reversing table upward,
A step of arranging the scraps on the suction portion of the reversing table with the second substrate facing downward on the transport device.
The step of adsorbing the offcuts to the adsorption part,
A step of separating the main body from the scrap material by separating the bonded substrate from the reversing table in the transport device, and
By turning the inversion table upside down, the step of turning the suction part and the end material downward, and
The step of dropping the end material by causing the adsorption portion to release the adsorption of the end material, and
A method for removing scraps. The method for removing scraps according to claim 4, further comprising a step of arranging the bonded substrate on the reversing table in the transport device after the step of dropping the scraps. The scrap removing method according to claim 4 or 5, wherein in the step of separating the bonded substrate from the inverted table, the bonded substrate is moved obliquely upward from the inverted table by the transport device.

Images