CN112987348A - End material removing device and end material removing method - Google Patents
End material removing device and end material removing method Download PDFInfo
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- CN112987348A CN112987348A CN202011358517.XA CN202011358517A CN112987348A CN 112987348 A CN112987348 A CN 112987348A CN 202011358517 A CN202011358517 A CN 202011358517A CN 112987348 A CN112987348 A CN 112987348A
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- end material
- substrate
- bonded
- adsorption
- material removing
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
- B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Medicines Containing Plant Substances (AREA)
Abstract
The end material removing device (1) is provided with a turnover table (5), a first mechanical arm (7) and a controller (31). The turn-over table (5) has a table suction device (17) and can be turned over up and down. The controller (31) executes: a step of orienting an adsorption part (17) of the turnover table (5) upward; a step of arranging the end material (M2a) on a table suction device (17) of the turnover table (5) by using the conveying device in a state that the second substrate (M2) faces downwards; a step of making the end material (M2a) be adsorbed on the workbench adsorption device (17); a step of separating the mother substrate (M) from the turnover table (5) by a first mechanical arm (7) to cut the main body (P2) from the end material (M2 a); a step of turning the turn table (5) up and down to direct the table suction device (17) and the end material (M2a) downward; and a step of releasing the adsorption of the end material (M2a) by the workbench adsorption device (17) so as to drop the end material (M2 a).
Description
Technical Field
The present invention relates to an end material removing apparatus, and more particularly, to an end material removing apparatus and an end material removing method for separating an end material of a bonded substrate from a body.
Background
The liquid crystal device is constituted by a bonded substrate in which a first substrate and a second substrate are bonded with a sealing material so that a liquid crystal layer is interposed therebetween. In such a bonded substrate, a color filter is pattern-formed on one of the substrates (for example, a first substrate), and a TFT (Thin Film Transistor) and a connection terminal are formed on the other substrate (for example, a second substrate).
In the above-described bonded substrate, it is necessary to expose a connection terminal formed on the second substrate in order to connect to an external electronic device. Patent documents 1 and 2 disclose a method for separating a substrate in which a surface on which a connection terminal is formed is exposed (an inner surface of one of the bonded substrates is exposed) in a bonded substrate serving as a liquid crystal device.
In the end material removing device described in patent document 1, an end material is separated and removed from a product portion using a blower.
In the substrate cutting device described in patent document 2, an end material is separated and removed from a product portion by using an adsorption device.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2019-109292
Patent document 2: japanese patent laid-open publication No. 2017-95294
Disclosure of Invention
Technical problem to be solved
However, in the conventional apparatus, when the end member of the bonded substrate is positioned on the lower side, it is difficult to remove the end member.
The invention aims to reliably remove an end material positioned below a bonding substrate in an end material removing device.
(II) technical scheme
A plurality of modes are described below as means for solving the problem. These modes can be arbitrarily combined as required.
An end material removing apparatus according to an aspect of the present invention is an end material removing apparatus for removing an end material from a main body of a second substrate of a bonded substrate having a first substrate and a second substrate, the second substrate being bonded to the first substrate and having dividing lines formed on a surface thereof for separating the end material, the end material removing apparatus including: the device comprises a turnover worktable, a conveying device and a control part.
The turnover table has an adsorption part and can be turned over up and down.
The conveying device conveys the bonded substrate to the turnover worktable.
The control unit executes the following steps.
And directing the suction portion of the turn table upward.
And arranging the end material on the suction portion of the turn table with the second substrate facing downward.
And adsorbing the end material to the adsorption section.
And cutting the main body from the end member by separating the bonded substrate from the turn table by the transfer device.
And turning the turning table up and down to direct the adsorption part and the end material downward.
And dropping the end material by releasing the adsorption of the end material by the adsorption part.
In this apparatus, the end material of the substrate on the lower side of the bonded substrate can be easily removed.
After the step of dropping the end material, the control section may execute a step of arranging the bonded substrate on the reverse table by the conveying device.
In this apparatus, the bonded substrate after the end material has fallen can be placed on the flip table.
In the step of separating the bonded substrate from the turn table, the control section may cause the transfer device to move the bonded substrate obliquely upward from the turn table.
In this apparatus, since the load acting on the exposed surface of the main body to which the substrate is bonded is reduced, the accuracy of the exposed surface is improved.
An end material removing method for removing an end material from a main body of a second substrate having a bonded substrate of a first substrate and a second substrate bonded to the first substrate and having dividing lines for separating the end material formed on a surface thereof in an end material removing apparatus, the end material removing apparatus comprising: a turnover table which has an adsorption part and can be turned over up and down; and a conveying device for conveying the bonded substrate to the turnover table, wherein the end material removing method comprises the following steps.
Step of orienting adsorption part of turn table upward
Arranging the end material of the second substrate bonded with the substrate on the adsorption part of the turn table in a state that the second substrate faces downward
Adsorption of end material to adsorption part
Cutting the main body from the end material by separating the bonded substrate from the turn table by the conveying device
Turning the turn table up and down to turn the adsorption part and the end material downward
Step of dropping the end material by releasing the end material from the adsorption by the adsorption part
In this method, the end member of the bonded substrate located on the second substrate can be easily removed.
After the step of dropping the end material, a step of disposing the bonded substrate on the inversion table by the transfer device may be further provided.
In this method, the substrate after the end material has fallen can be placed on the substrate by using the turn table.
In the step of separating the bonded substrate from the turn table, the transfer device may move the bonded substrate obliquely upward from the turn table.
In this method, since the load acting on the exposed surface of the main body to which the substrate is bonded is reduced, the accuracy of the exposed surface is improved.
(III) advantageous effects
In the terminal material removing apparatus and the terminal material removing method of the present invention, the terminal material of the second substrate of the bonded substrate can be reliably removed.
Drawings
Fig. 1 is a schematic perspective view of an end material removing device of a first embodiment.
Fig. 2 is a schematic perspective view of the turnover mechanism.
Fig. 3 is a schematic side view of an end material removing device.
Fig. 4 is a block diagram showing a control structure of the end material removing device.
Fig. 5 is a schematic side view showing a substrate cutting operation.
Fig. 6 is a schematic side view showing a substrate cutting operation.
Fig. 7 is a schematic side view showing a substrate cutting operation.
Fig. 8 is a schematic side view showing a substrate cutting operation.
Fig. 9 is a schematic side view showing a substrate cutting operation.
Fig. 10 is a schematic side view showing a substrate cutting operation.
Fig. 11 is a schematic side view showing a substrate cutting operation.
Fig. 12 is a schematic side view showing a substrate cutting operation.
Fig. 13 is a schematic side view showing a substrate cutting operation.
Description of the reference numerals
1-an end material removing device; 3-turning over the mechanism; 5-overturning the workbench; 7-a first robot arm; 9-a first adsorption hand; 9 a-a main body of the suction part; 9 b-an adsorption face; 17-a table adsorption device; 19-a rotating shaft; 21-a support structure; 31-a controller; 33-a first arm drive; 35-negative pressure generating means; 37-a rotation drive; 41-a second mechanical arm; 45-a second arm drive; 49-second adsorption hand; m-mother substrate; m1 — first substrate; m2 — a second substrate; m2 a-end stock; p2-body
Detailed Description
1. First embodiment
(1) Structure of end material removing device
The structure of the end material removing apparatus 1 (an example of an end material removing apparatus) will be described with reference to fig. 1 to 3. Fig. 1 is a schematic perspective view of an end material removing device of a first embodiment. Fig. 2 is a schematic perspective view of the turnover mechanism. Fig. 3 is a schematic side view of an end material removing device.
In fig. 1 and 2, the substrate transport direction is a first direction (arrow X), and a second direction (arrow Y) orthogonal to the first direction is provided.
The cutting target is a mother substrate M (an example of a bonded substrate). As shown in fig. 3, the mother substrate M is a bonded glass composed of a first substrate M1 (an example of a first substrate) and a second substrate M2 (an example of a second substrate), which are two substrates.
The end material removing apparatus 1 is an apparatus for cutting the main body P2 (an example of a main body) of the second substrate M2 (an example of a second substrate) of the mother substrate M (that is, removing the end material M2a) from the end material M2a (an example of an end material).
The end material removing apparatus 1 includes a turning mechanism 3. The turnover mechanism 3 has a turnover table 5 (an example of the turnover table). The turn table 5 can be turned upside down. The first surface 5a of the turn table 5 is a flat surface.
The turnover mechanism 3 has a table suction device 17 (an example of a suction unit). The table suction device 17 is provided on the second surface 5b side of the turn table 5 and extends in the second direction on the side of the turn table 5. The table suction device 17 is provided with a plurality of suction holes (not shown). The plurality of adsorption holes are communicated with a negative pressure generating device 35 (described later) such as a vacuum pump via an air duct (not shown).
The turnover mechanism 3 has: a rotary shaft 19 fixed to the turn table 5, a support structure 21 for rotatably supporting the rotary shaft 19, and a rotation driving device 37 (described later) including a motor and the like.
The rotary shafts 19 extend in the second direction and are provided at both ends of the turn table 5.
The end material removing apparatus 1 includes a first robot arm 7 (an example of a conveying apparatus). The first robot arm 7 is a multi-joint robot and can move a first suction hand 9 (described later) up and down and sideways. The first robot arm 7 includes a first arm driving device 33 (described later) including a motor and the like.
The end material removing apparatus 1 includes a first suction hand 9 (an example of a conveying apparatus). The first suction hand 9 can suck and convey the mother substrate M. The first suction hand 9 is attached to the front end of the first robot arm 7.
The suction unit main body 9a of the first suction hand 9 has a horizontal suction surface 9b on the lower side, and the mother substrate M to be processed is sucked on the suction surface 9 b. The suction surface 9b is provided with a plurality of air suction holes (not shown). The air adsorption hole communicates with the negative pressure generating device 35 via an air duct (not shown).
The first suction hand 9 sucks the first substrate M1 of the fixed mother substrate M.
The end material removing apparatus 1 has a second robot arm 41. The second robot arm 41 has the same function as the first robot arm 7. The second arm 41 includes a second arm driving device 45 (described later) including a motor and the like.
The end material removing apparatus 1 has a second suction hand 49. The second suction hand 49 can suck and convey the mother substrate M. The second suction hand 49 is attached to the tip of the second robot arm 41. The air suction hole (not shown) of the second suction hand 49 communicates with the negative pressure generating device 35 via an air duct (not shown).
(2) Control structure of end material removing device
The control structure of the material removing apparatus 1 will be described with reference to fig. 4. Fig. 4 is a block diagram showing a control structure of the end material removing device.
The end material removing apparatus 1 has a controller 31. The controller 31 is a computer system having a processor (e.g., CPU), a storage device (e.g., ROM, RAM, HDD, SSD, etc.), and various interfaces (e.g., a/D converter, D/a converter, communication interface, etc.). The controller 31 executes a program stored in a storage unit (corresponding to a part or all of a storage area of the storage device) to perform various control operations.
The controller 31 may be configured by a single processor, or may be configured by a plurality of independent processors for respective control.
A part or all of the functions of the respective elements of the controller 31 may be implemented as a program executable in a computer system constituting the controller 31. In addition, a part of the functions of the respective elements of the controller 31 may be constituted by a custom IC.
The controller 31 can control the first arm driving device 33, the negative pressure generating device 35, the rotation driving device 37, and the second arm driving device 45.
Further, although not shown, a sensor for detecting the size, shape, and position of the substrate, a sensor and a switch for detecting the state of each device, and an information carrying-in device are connected to the controller 31.
(3) Substrate cutting operation of end material removing device
The substrate cutting operation of the material removal device 1 will be described with reference to fig. 5 to 13. Fig. 5 is a flowchart of substrate cutting operation control. Fig. 6 to 13 are schematic side views showing a substrate cutting operation.
The control flow chart described below is an example, and each step can be omitted or replaced as necessary. Further, a plurality of steps may be performed simultaneously, or a part or all of the steps may be performed in an overlapping manner.
Furthermore, each block of the control flowchart is not limited to a single control operation, and may be replaced with a plurality of control operations expressed by a plurality of blocks.
The following control operations are realized by commands issued by the controller 31 to the various devices.
As shown in fig. 3, in step S1, the inversion table 5 is inverted so that the table suction device 17 faces upward. Specifically, the controller 31 controls the rotation driving device 37 to perform the above-described operation.
In step S2, the first robot arm 7 carries the mother substrate M into the area of the inversion table 5. Specifically, the controller 31 controls the first robot arm 7 to execute the above-described operation. At this time, the second substrate M2 is positioned on the lower side, and thus, the end material M2a enters a state below the end of the first substrate M1.
As shown in fig. 6, in step S3, the first robot arm 7 brings the end member M2a of the second substrate M2 of the mother substrate M into contact with the stage adsorption device 17. Specifically, the controller 31 controls the first robot arm 7 to execute the above-described operation.
In step S4, the table suction device 17 sucks the end material M2 a. Specifically, the controller 31 controls the negative pressure generating device 35 to perform the above-described operation.
As shown in fig. 7, in step S5, the first robot arm 7 separates the first suction hand 9 from the inversion table 5. Specifically, the controller 31 controls the first robot arm 7 to execute the above-described operation. As a result, the body P2 of the second substrate M2 of the mother substrate M is cut off from the end member M2a (that is, the end member is separated and removed from the substrate).
In this step, the first robot arm 7 moves the mother substrate M obliquely upward from the flip table 5. Therefore, the load acting on the exposed surface of the first substrate M1 of the mother substrate M becomes smaller, and the accuracy of the exposed surface improves.
As shown in fig. 8, in step S6, the turn table 5 is turned upside down, so that the table suction device 17 and the end member M2a face downward. Specifically, the controller 31 controls the rotation driving device 37 to perform the above-described operation.
As shown in fig. 9, in step S7, the table suction device 17 releases the suction of the end material M2 a. As a result, the end member M2a falls. Specifically, the controller 31 controls the negative pressure generating device 35 to perform the above-described operation.
As shown in fig. 10, in step S8, the first robot arm 7 disposes the mother substrate M from which the end material has been removed on the first surface 5a of the turn table 5. Specifically, the controller 31 controls the rotation driving device 37 to perform the above-described operation. Thus, the mother substrate M after the end member M2a falls down can be placed on the turn table 5.
As shown in fig. 11, in step S9, the first suction hand 9 releases the suction of the mother substrate M and separates from the mother substrate M. Specifically, the controller 31 controls the negative pressure generator 35 and the first robot arm 7 to execute the above-described operation.
As shown in fig. 12, in step S10, the second robot arm 41 brings the second suction hand 49 into contact with the mother substrate M. Specifically, the controller 31 controls the second robot arm 41 to execute the above-described operation.
In step S11, the second suction hand 49 sucks the mother substrate M. Specifically, the controller 31 controls the negative pressure generating device 35 to perform the above-described operation.
As shown in fig. 13, in step S12, the second robot arm 41 carries the mother substrate M out of the area of the inversion table 5. Specifically, the controller 31 controls the second robot arm 41 to execute the above-described operation.
In the end material removing apparatus 1, the end material M2a of the second substrate M2 of the mother substrate M can be easily removed.
2. Other embodiments
While one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. In particular, the plurality of embodiments and modifications described in the present specification can be combined as desired.
A bonded brittle material substrate obtained by bonding two brittle material substrates together, comprising: flat display panels such as liquid crystal panels, plasma display panels, and organic EL display panels to which glass substrates are bonded; a semiconductor substrate formed by bonding a glass substrate to a silicon substrate, a sapphire substrate, or the like.
The type of the substrate is not particularly limited. The substrate includes single-plate glass, semiconductor wafer, and ceramic substrate.
Industrial applicability
The present invention can be widely applied to an end material removing apparatus and an end material removing method for separating an end material of a bonded substrate from a body.
Claims (6)
1. An end material removing device for removing an end material from a main body of a second substrate of a bonded substrate having a first substrate and the second substrate, wherein the second substrate is bonded to the first substrate and has a dividing line formed on a surface thereof for separating the end material from the main body,
the end material removing device is provided with:
a turnover table which has an adsorption part and can be turned over up and down;
a conveying device for conveying the bonded substrate to the turn table; and
a control unit that executes: a step of orienting the suction part of the turn table upward; disposing the end member on the suction portion of the turn table in a posture in which the second substrate faces downward; adsorbing the end material to the adsorption part; a step of separating the bonded substrate from the end material by the transfer device and cutting the main body from the end material; a step of turning the turning table up and down to make the adsorption part and the end material face downward; and releasing the adsorption of the end material by the adsorption part to drop the end material.
2. The end material removing device according to claim 1,
after the step of dropping the end material, the control unit performs a step of disposing the bonded substrate on the turn table by the conveying device.
3. The end material removing device according to claim 1 or 2,
in the step of separating the bonded substrate from the turn table, the control unit may cause the transfer device to move the bonded substrate obliquely upward from the turn table.
4. An end material removing method for removing an end material from a main body of a second substrate having a bonded substrate of a first substrate and a second substrate, wherein the second substrate is bonded to the first substrate and has a dividing line formed on a surface thereof for separating the end material from the main body, in an end material removing apparatus comprising: a turnover table which has an adsorption part and can be turned over up and down; and a conveying device for conveying the bonded substrate to the turnover table,
the end material removing method comprises:
a step of orienting the suction part of the turn table upward;
disposing the end material on the suction portion of the turn table with the second substrate facing downward by the conveying device;
adsorbing the end material to the adsorption part;
a step of separating the bonded substrate from the end material by the transfer device and cutting the main body from the end material;
a step of turning the turning table up and down to make the adsorption part and the end material face downward; and
and a step of releasing the adsorption of the end material by the adsorption part to drop the end material.
5. The method according to claim 4, wherein the step of removing the end material,
the method further includes, after the step of dropping the end material, a step of disposing the bonded substrate on the turn table by the conveying device.
6. The method for removing end material according to claim 4 or 5,
in the step of separating the bonded substrate from the turn-over table, the transfer device is caused to move the bonded substrate obliquely upward from the turn-over table.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019228551A JP2021095313A (en) | 2019-12-18 | 2019-12-18 | End material removal apparatus and end material removal method |
| JP2019-228551 | 2019-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112987348A true CN112987348A (en) | 2021-06-18 |
Family
ID=76344855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011358517.XA Pending CN112987348A (en) | 2019-12-18 | 2020-11-27 | End material removing device and end material removing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2021095313A (en) |
| KR (1) | KR20210078406A (en) |
| CN (1) | CN112987348A (en) |
| TW (1) | TW202136163A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017095294A (en) | 2015-11-20 | 2017-06-01 | 三星ダイヤモンド工業株式会社 | Substrate cutting device |
| JP2019109292A (en) | 2017-12-15 | 2019-07-04 | 三星ダイヤモンド工業株式会社 | End material removing device and end material removing method |
-
2019
- 2019-12-18 JP JP2019228551A patent/JP2021095313A/en active Pending
-
2020
- 2020-11-04 TW TW109138388A patent/TW202136163A/en unknown
- 2020-11-27 CN CN202011358517.XA patent/CN112987348A/en active Pending
- 2020-12-07 KR KR1020200169900A patent/KR20210078406A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202136163A (en) | 2021-10-01 |
| JP2021095313A (en) | 2021-06-24 |
| KR20210078406A (en) | 2021-06-28 |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210618 |
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| WD01 | Invention patent application deemed withdrawn after publication |