JP6256178B2 - Breaking device for brittle material substrate - Google Patents

Breaking device for brittle material substrate Download PDF

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JP6256178B2
JP6256178B2 JP2014092493A JP2014092493A JP6256178B2 JP 6256178 B2 JP6256178 B2 JP 6256178B2 JP 2014092493 A JP2014092493 A JP 2014092493A JP 2014092493 A JP2014092493 A JP 2014092493A JP 6256178 B2 JP6256178 B2 JP 6256178B2
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substrate
brittle
stage
head
break
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JP2015208937A (en
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欣也 太田
欣也 太田
直洋 黒田
直洋 黒田
博之 富本
博之 富本
郁祥 中谷
郁祥 中谷
聡 礒嶌
聡 礒嶌
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三星ダイヤモンド工業株式会社
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Description

  The present invention relates to a breaking device for separating and completely breaking a peripheral material around a substrate in which a resin layer is coated on a brittle material substrate such as a semiconductor substrate or a ceramic substrate.
  Patent Document 1 proposes a substrate breaker that breaks a substrate on which a scribe line is formed by pressing the substrate with a break bar perpendicularly to the surface along the scribe line from the back surface on which the scribe line is formed. ing. If the substrate to be broken is a semiconductor wafer and a large number of functional regions are formed in alignment, scribe lines are first formed on the substrate in the vertical and horizontal directions at equal intervals between the functional regions. Form. And it is necessary to divide along a scribe line with a break device.
  Patent Document 2 discloses a transport mechanism for transporting a substrate by transporting the substrate by transporting the brittle material substrate by bringing the support arm into contact with the substrate, adsorbing it in a vacuum, and moving the support arm.
  After breaking the brittle material substrate or removing the peripheral edge material, it is necessary to break the resin layer and invert it to completely separate each chip. Patent Document 3 discloses a reversing mechanism for reversing a brittle material substrate using a robot arm. In this reversal operation, the scribed substrate is temporarily placed on a pedestal by a robot arm and then reversed from below to perform reversal.
JP 2004-39931 A JP 2013-177309 A Japanese Patent No. 3787489
  Using a break device, a substrate in which a number of functional regions are formed at a constant pitch along the x-axis and y-axis in a manufacturing process on a brittle material substrate, for example, a ceramic substrate, and the upper surface of the ceramic substrate is filled with silicon resin, It shall break. When a scribe line is formed on the substrate in a lattice shape and breaks, only the portion of the ceramic substrate is separated along the scribe line, and the silicon resin layer remains as it is. Therefore, it is necessary to reverse the substrate and extend the scribe to the silicon resin layer.
  However, in the prior art, a conveying device that conveys a brittle material substrate that has been broken except for the resin layer, a separation end material device that separates the end material, a reversing device, and a break device that breaks the resin layer are independent of each other. However, there is a problem that the apparatus becomes large.
  The present invention has been made paying attention to such a problem, and it is possible to transport a brittle material substrate in which only the substrate excluding the resin layer is broken without falling off, and to separate surrounding end materials. The object is to reduce the size of the device that can be reversed and completely break by separating the resin layer, so that the work can be performed efficiently.
  In order to solve this problem, a brittle material substrate breaking device according to the present invention is a breaking device for breaking a brittle material substrate, wherein the brittle material substrate has a predetermined pitch in a longitudinal direction and a lateral direction on one surface. The functional area is formed by a resin coating, and is broken along a scribe line formed in a lattice shape so that the functional area is located in the center. An end material separating device that separates the peripheral material around the brittle material substrate held on the separation stage, an inversion device that sandwiches and reverses the brittle material substrate between the end material separating stage and the expand stage, and the brittle material And an expanding mechanism that expands the resin layer of the substrate and breaks along the scribe lines formed in a lattice shape.
  Here, the break device is a frame-shaped pusher having an end material separation stage for holding the brittle material substrate rotatably provided on an upper surface, and a side corresponding to a portion serving as an end material around the brittle material substrate. A plate, a first raising / lowering mechanism for raising and lowering the pusher plate in parallel with the surface of the brittle material substrate, and rotating so as to overlap the end material separation stage on the same rotation axis as the rotation axis of the end material separation stage A freely provided expand stage, first and second rotation mechanisms for independently rotating the end material separating stage and the expand stage, an expander having an expand bar on the lower surface, and the expander being brittle A second ascent that breaks the resin layer of the brittle material substrate by descending along the scribe line from above the material substrate. A mechanism may be provided with a.
  According to the present invention having such a feature, in the brittle material substrate having the functional region on the surface, the pusher against the substrate in which only the substrate excluding the resin layer is broken. The peripheral material is separated by pushing down the plate. Then, the brittle material substrate can be inverted as it is by simultaneously rotating the expand stage and the end material separation stage in the same direction by a coaxial rotation mechanism. Furthermore, the resin layer can be separated by holding the substrate on the expand stage and pressing the expander against the resin layer. Since the edge material separation stage is used for edge material separation and reversal, and the expand stage is used for reversal and expansion, the entire apparatus can be reduced in size and increased in efficiency.
FIG. 1 is a perspective view showing the overall configuration of a break device that realizes an embodiment of the present invention. FIG. 2 is a front view showing a break device for realizing the embodiment of the present invention. FIG. 3 is a front view showing an example of a substrate transported by the transport head of the present embodiment and a partial cross-sectional view along the line AA. FIG. 4 is a perspective view showing the transport head according to the embodiment of the present invention. FIG. 5 is a front view of the transport head according to the present embodiment. FIG. 6 is a bottom view of the transport head according to the present embodiment. FIG. 7 is a perspective view showing a part of the transport head according to the present embodiment. FIG. 8 is a perspective view showing an example of a dust collector used in the transport apparatus according to this embodiment. FIG. 9 is a perspective view showing an example of a pusher plate used in the end material separating apparatus according to the present embodiment. FIG. 10 is a side view showing an end material separating stage and an expanding stage according to the present embodiment. FIG. 11 is a cross-sectional view showing the transport head, the end material separation stage, and the expand stage according to the present embodiment. FIG. 12 is a cross-sectional view showing a part of the transport head and the end material separation stage according to the present embodiment. FIG. 13 is a perspective view showing an end material separating stage and an expanding stage according to the present embodiment. FIG. 14 is a perspective view showing an expanding stage and upper and lower expanders according to the present embodiment. FIG. 15 is a side view showing an end material separation stage, a conveyance head, an expansion stage, and an expansion head according to the present embodiment. FIG. 16 is a perspective view showing a state in which the substrate according to the present embodiment is sandwiched and rotated. FIG. 17 is a side view showing the expanded stage and the end material separating stage after being rotated according to the present embodiment. FIG. 18 is an enlarged sectional view showing a state where the resin according to the present embodiment is expanded and separated.
  A break device according to an embodiment of the present invention will be described. FIG. 1 is a perspective view showing an overall configuration of a break device that realizes the present embodiment, and FIG. 2 is a front view thereof. As shown in these drawings, a beam 11 is held on a base 10 in parallel with the upper surface of the base 10 by a support column, and a linear slider 12 is provided on the side of the beam 11. The linear slider 12 freely moves the transport head 13 along the beam 11. As shown in FIGS. 1 and 2, a break stage 14 for breaking a brittle material substrate (hereinafter simply referred to as a substrate), an end material separation stage 15 for separating the end material described later, and an expand stage 16 are provided on the base 10. Is provided. The transport head 13 sucks the substrate from the break stage 14 and transports it to the end material separation stage 15 on the right side in the drawing.
  A substrate to be a break target in the embodiment of the present invention will be described. As shown in FIG. 3, the substrate 20 is a substrate in which a large number of functional regions 22 are formed on the ceramic substrate 21 at a constant pitch along the x-axis and y-axis in the manufacturing process. This functional region 22 is, for example, a region having a function as an LED, and a circular lens for the LED is formed on each surface in each functional region. The upper surface of the substrate is filled with a silicon resin 23. In order to keep the silicon resin 23 within the range of the functional region 22 where the LED is formed, the outer surface of the functional region 22 is slightly surrounded by the surface of the ceramic substrate 21. Highly linear protrusions 24 are formed. When the silicon resin 23 is filled, the silicon resin 23 may reach the upper surface of the linear protrusion 24 or the outside thereof.
Then, in order to divide each functional area into LED chips, before breaking the substrate 20, vertical scribing lines S y1 to S yn are arranged so that each functional area is centered by a scribing device, Scribing is performed so that the horizontal scribe lines S x1 to S xm are orthogonal to each other.
The scribed substrate 20 is broken along the scribe lines S x1 to S xm and the scribe lines S y1 to S yn by a break device (not shown) with the surface on which the lens is formed as the upper surface in the break stage 14 shown in FIG. Is done. It is assumed that the substrate 20 immediately after being broken has only the ceramic substrate 21 layer cut along the scribe line, but the silicon resin 23 layer is not broken. That is, the substrate 20 is connected only by the thin layer of the silicon resin 23, and becomes a large number of functional region portions arranged on the x and y axes inside the linear protrusions 24 and the outer peripheral end material. And unnecessary parts.
  Next, the transport head 13 for sucking and transporting the substrate 20 will be described. 4 is a perspective view showing the transport head 13, FIG. 5 is a side view thereof, FIG. 6 is a bottom view thereof, and FIG. 7 is a perspective view showing a part of the transport head cut away.
  As shown in FIG. 4, in the transport head 13, a substantially L-shaped hanger 32 is vertically connected to a substantially square-shaped horizontal hanger base 31. A rectangular hanger bracket 33 is connected to the side of the hanger 32, and a rectangular hanger bracket 34 is attached to the hanger bracket 33 so as to overlap the surface. A linear slider 35 that can move up and down is attached to the hanger bracket 34. Provided. A head portion 40 is provided below the linear slider 35. The linear slider 35 is a first elevating mechanism that has an inflow port through which an air flow flows in two directions, an upward direction and a downward direction, and allows the head unit 40 to move up and down by switching the inflow. . The linear slider 35 need only be capable of moving the head portion 40 up and down, and may be one that moves up and down with a motor or the like as well as one that moves up and down by the inflow of airflow.
  The head portion 40 is a rectangular parallelepiped housing, the inside of the housing is hollow, and the lower surface is open. As shown in FIG. 7, a base plate 41 is provided on the lower surface. The base plate 41 is a metal member having a flat bottom surface, and is made of, for example, aluminum. In the base plate 41, a large number of openings aligned in the xy directions are provided at equal intervals so as to correspond to the functional regions 22 of the broken substrate 20. These openings are each larger than the diameter of the lens. In addition, an opening along the outer periphery is also provided in a portion corresponding to the end material on the outer periphery of the functional region 22 of the substrate 20.
  A thin elastic sheet 42 is attached to the lower surface of the base plate 41. The elastic sheet 42 is a flat plate made of rubber. The elastic sheet 42 also has openings at equal intervals in the x and y directions corresponding to the functional areas 22 of the substrate 20 to be transported as shown in FIG. The opposing part has a square annular recess. In addition, an opening along the outer periphery is provided outside the annular recess also in a portion corresponding to the end material on the outer periphery of the functional region 22 of the substrate 20. These openings are located at the same position when the base plate 41 and the elastic sheet 42 are overlapped. Here, the opening of the base plate 41 and the opening of the elastic sheet 42 are set to have a diameter slightly larger than the diameter of the LED lens formed in the functional area 22, and the lens in the functional area 22 is elastic when the broken substrate 20 is sucked. The sheet 42 is configured not to contact directly.
  Next, a duct 43 is attached to one side surface of the head portion 40, and a blower 44 of a dust collector shown in FIG. Although a dust collector is used here, the blower 44 may be used alone. When the blower 44 is driven in a state where the substrate 20 is in contact with the elastic sheet 42 and air is sucked through the duct 43, air is sucked from the openings of the base plate 41 and the elastic sheet 42, and the substrate 20 is sucked. be able to. Further, the air flow can be switched from inflow to outflow by a switching unit (not shown), so that the air can be switched to a state of being ejected from the opening of the elastic sheet 42.
  A plurality of latch mechanisms 46 are provided on the four side walls of the head portion 40. The latch mechanism 46 is configured to detachably hold the base plate 41 and the elastic sheet 42 integrally on the lower surface of the head portion 40, and to be easily replaced when the rubber of the elastic sheet 42 deteriorates. . The latch mechanism 46 may be provided on at least a pair of parallel side walls of the head portion 40.
  A frame-like pusher plate 47 shown in FIG. 9 is provided on the outer periphery of the lower portion of the head portion 40 so as to be movable up and down. The pusher plate 47 separates an unnecessary portion around the substrate 20 as an end material by lowering the pusher plate 47 while holding the substrate 20 between the head portion 40 and the end material separation stage 15. . The pusher plate 47 is a frame-like member having a size corresponding to the end material portion around the substrate 20. Further, as shown in the drawing, the upper surface has a constant height, the pair of opposing sides 47a and 47b are thick, and the two opposing sides 47c and 47d perpendicular to the thickness are thin. It is configured.
  Next, the raising / lowering mechanism of the pusher plate 47 will be described. Of the side walls of the head portion 40, air cylinders 48 are provided as lifting mechanisms on two side walls parallel to each other except for one side wall to which the duct 43 is connected. As shown in FIG. 5, the air cylinder 48 includes a main body portion 48a fixed to the side wall of the head portion 40 with screws, a plate-like connecting member 48b that can move up and down, and a frame-like connecting member connected thereto. 48c. A pusher plate 47 is connected below the connecting member 48c so as to be movable up and down.
  Next, the end material separation stage 15 used for separating the end material and reversing the substrate will be described. As shown in FIGS. 10 to 12, the end material separation stage 15 includes a rectangular chamber 52 on the arm 51, an upper base plate 53, and an elastic plate 54 having substantially the same shape. A large depression is formed in the central portion of the chamber 52 and communicates with a duct 51 a formed inside the arm 51. The base plate 53 is a rectangular flat plate corresponding to the entire functional area of the broken substrate, but is preferably slightly smaller than the entire functional area. The base plate 53 is made of, for example, aluminum. The base plate 53 is provided with a large number of openings aligned in the xy direction so as to correspond to the respective functional regions 22.
  An elastic plate 54 is attached to the upper surface of the base plate 41. The elastic plate 54 is a flat plate made of rubber or the like having a shape corresponding to a rectangular area corresponding to the entire functional area of the substrate 20, but is preferably slightly smaller than the entire functional area. The elastic plate 54 is provided with a large number of openings aligned in the xy direction so as to correspond to the openings of the base plate 53 except for the outer periphery of the four sides, that is, the functional area of the broken substrate. It is preferable that the edge portion of the upper surface of the elastic plate 54 has a slightly curved structure.
  Now, since the openings of the elastic plate 54 and the base plate 53 are provided so as to correspond to the respective functional regions 22, it is possible to circulate external air through the openings to the depressions of the chamber 52 through these openings. it can. The duct 51a inside the arm 51 is connected to a vacuum suction device through a tube (not shown), and air can be ejected or sucked from the opening of the elastic plate 54 by driving the vacuum suction device.
  The arm 51 is configured to be rotatable by 180 ° clockwise from the state of FIG. A rotating mechanism for rotating the arm 51 together with the chamber 52, the base plate 53, and the elastic plate 54 provided thereon is provided on the shaft. The rotation mechanism is sufficient if it can rotate the arm 51 by 180 °, and may be a rotary cylinder, or may be composed of a motor and a reduction gear.
  Next, the expansion stage 16 used when reversing the substrate 20 and breaking the layer of the silicon resin 23 will be described with reference to FIGS. As shown in FIGS. 11 and 13, the expand stage 16 includes an arm 61 and a rectangular parallelepiped cartridge 62 attached to the arm 61. The cartridge 62 has L-shaped columnar portions at four corners thereof, and holds a spacer 63, a sponge 64, and an expand rubber 65 inside thereof. The spacer 63 and the expander bar 65 are flat plates having a size corresponding to the functional area of the substrate, and the expander bar 65 is an elastic support plate made of rubber. The expander bar 65 is provided with a large number of openings arranged at equal intervals in the xy direction so as to correspond to the functional area 22 of the broken substrate 20. This opening has a diameter that is slightly larger than the diameter of the LED lens formed in the functional area 22, and is configured so that the lens in the functional area 22 does not directly contact the expander bar 65 when the broken substrate 20 is sucked. ing.
  In FIG. 11, a frame-shaped flat pressing plate 66 having substantially the same shape as the cartridge is provided on the lower surface of the expander bar 65. The holding plate 66 is connected to the cartridge 62 by screwing to prevent the spacer 63, the sponge 64, and the expander bar 65 from falling off.
  The arm 61 is configured to be rotatable by 180 ° about the same rotation axis as the rotation axis 55 of the arm 51. A rotation mechanism for rotating the arm 61 together with the cartridge 62, the spacer 63, the sponge 64, and the expander rubber 65 is provided. The rotation mechanism is sufficient if it can rotate the arm 61 by 180 °, and may be a rotary cylinder, or may be composed of a motor and a reduction gear. A holder 67 is provided on the base 10 as shown in FIG. The holder 67 supports the lower surface of the arm 61 at that position when the arm 61 of the expand stage is rotated 180 degrees clockwise.
  Next, the expansion mechanism 17 used for the break of the silicon resin 23 of this embodiment will be described with reference to FIGS. The expanding mechanism 17 is for completely breaking the substrate 20 by breaking the layer of the silicon resin 23 of the substrate 20 held on the expanding stage 16. As shown in FIG. 14, the expand mechanism 17 has a base 71 parallel to the base 10 and a linear slider 72 as a second lifting mechanism for moving the base 71 in the vertical direction. An expand head 73 is movably attached to the base 71, and a linear slider 74 that moves the expand head 73 in the x-axis direction and a rotation mechanism 75 that rotates the expand head 73 along the axis are provided. Here, the rotation mechanism 75 has a pair of belt wheels, a pulley, a motor connected to the pulley, and a rotation gear. However, any device that rotates the expand head 73 is sufficient, and therefore a motor and a reduction mechanism are used. It may be a thing.
  An expander 80 is attached to the lower surface of the expand head 73 in parallel to the surface of the expand stage 16. Thereby, when the expand head 73 is moved up and down by the linear slider 72, the expander 80 is also moved up and down at the same time. In the expander 80, a large number of streak-like expanded bars 81 parallel to a planar base are formed in parallel, and all the ridge lines of each expanded bar constitute one plane. The interval between the expanded bars 81 is constant and may be an integer multiple of 2 or more than the interval between the scheduled scribe lines, and is doubled in the present embodiment. The cross section of each expanding bar 81 is arcuate so that it can be pressed along the scribe line as shown in FIGS.
  Next, a case where the substrate 20 is transferred from the break stage 14 to the end material separation stage 15 by this transfer device will be described. First, the transfer head 13 of the transfer apparatus is moved directly above the substrate 20 on the break stage 14, and the head unit 40 is lowered along with the substrate 20. Then, the opening of the elastic sheet 42 at the bottom of the head portion 40 is positioned so as to correspond to the LED lens. Next, when the blower 44 is driven to suck air through the duct 43, the air is sucked from the openings of the base plate 41 and the elastic sheet 42, and the substrate 20 brought into contact with the elastic sheet 42 can be sucked. . Here, even if air leaks when air is sucked from the opening of the elastic sheet 42, the air can always be sucked into the inside from the opening, so that the substrate 20 can be sucked. Then, by lifting the transport head 13, the broken substrate 20 can be lifted as it is.
  In this state, the substrate 20 can be transported to a desired position by moving the entire transport head 13 by the linear slider 12. In this way, as shown in FIG. 10, after the transport head 13 is moved directly above the end material separation stage 15, the head unit 40 is lowered by the linear slider 35. Then, the substrate 20 held on the lower surface of the head unit 40 comes into contact with the upper part of the end material separation stage 15, and the descent is stopped by positioning so that the functional region 22 corresponds to the opening of the elastic sheet 54, respectively. To do. The substrate 20 can be held on the end material separation stage 15 by sucking air through the arm 51 with the lower surface of the substrate 20 in contact with the elastic plate 54. At this time, the blower 44 may be kept operating or may be stopped.
  Next, the operation at the time of separating the scrap material by the scrap material separating apparatus will be described. First, by blowing air from the air cylinder 48 of the lifting mechanism of the pusher plate 47, the pusher plate 47 below the head portion 15 can be lowered. When the pusher plate 47 is lowered in parallel to the substrate 20, first, only the long and thin peripheral portions outside the functional area of the substrate 20 are subjected to downward pressure by the thick sides 47a and 47b, and are separated into end materials. If the descent continues further, the thin peripheral portions outside the functional area of the substrate 20 are separated by the descent pressure by the two thin sides 47c and 47d, and become end materials. FIG. 13 shows four separated pieces. In this way, all the end materials around the substrate 20 can be separated by a single descent operation of pushing down the pusher plate 47. At this time, adjacent sides around the substrate 20 are not separated as end materials at the same time. The elastic plate 54 is slightly smaller than the pusher plate 47, and the edge portion of the upper surface is curved. For this reason, it is possible to separate all the peripheral end materials in a short time without damaging the functional region of the substrate 20.
  Thereafter, in a state where air is sucked from the arm 51, the air is ejected from the blower 44 and the head unit 40 is raised. As a result, the head unit 40 is separated from the substrate 20. With the head portion 40 raised, the linear slider 12 moves the transport head 13 to the left in FIG. 2 to restore the original state.
  After the head portion 13 is moved away from above the end material separation stage 15 in this way, the arm 61 of the expand stage 16 is rotated, and the expander bar 65 is brought into contact with the upper surface of the substrate 20 above the end material separation stage 15. FIG. 13 is a diagram showing this state. At this time, the lens is positioned so that the lens does not contact the inner wall of the opening of the expander rubber 65. Then, the substrate 20 is sandwiched between the end material separating stage 15 and the expanding stage 16. In this state, the arm 51 and the arm 61 are rotated along the same rotation axis as shown in FIG. If it carries out like this, the substrate 20 can be reversed in the state which hold | maintained completely with the end material separation stage 15 and the expand stage 16, and the board | substrate 20 does not drop out in the middle of rotation. FIG. 17 shows a state in which these stages are rotated 180 ° and the lower surface of the expand stage 16 is supported by the holder 67.
  After completing the rotation in this way, air is ejected from the opening of the elastic plate 54 through the duct of the arm 51 of the end material separation stage 15, and the substrate 20 is separated from the end material separation stage 15. Next, only the end material separation stage 15 is rotated 180 ° in the reverse direction to return to the original position. As a result, the substrate 20 is held on the expand stage 16, but the upper portion of the substrate 20 is opened.
  Next, a method for extending the scribe line formed on the ceramic substrate 21 to the layer of the silicon resin 23 to complete the cutting of the substrate 20 will be described. First, the expanding head 73 is moved by the linear slider 74 so as to be directly above the substrate 20. Then, the lowermost ridge line of each expand bar 81 of the expander 80 is positioned by the linear slider 74 so as to match the scribe line S as shown in FIG.
  Next, the linear slider 72 is driven, and the expander 80 is gradually lowered while being kept parallel to the expand stage 16. Then, as shown in FIG. 18B, the ceramic substrate 21 is pressed from right above the scribe line S by the expanding bar 81. In this way, as shown in FIG. 18C, the ceramic substrate 21 is pushed and deformed by the expanding bar 81, sinks and the expanding rubber 65 is similarly deformed into a V shape, and the layer of the silicon resin 23 of the substrate 20 is formed. Can break. When the break is completed, the expander 80 is raised by reversing the linear slider 72.
  At this time, the expander 80 has a large number of expanded bars 81 formed in parallel, and the interval is twice the pitch of the scribe lines, so that the silicon resin 23 is broken simultaneously along every other scribe line. can do.
  Then, by moving the expand head 73 by the pitch of the scribe line in the x-axis direction and lowering the expander 80 in the same manner, the break of the resin layer can be completed for other adjacent scribe lines. Here, since the interval between the expanded bars 81 is twice the pitch of the scribe lines, all the breaks in the x-axis direction of the substrate 20 can be completed by shifting the expanded head 73 once to break. When the interval between the expanded bars 81 is three times the pitch of the scribe line, all the breaks in the x-axis direction can be completed by moving the expand head 73 twice to break.
  Then, the expand head 73 is rotated 90 ° by the rotation mechanism 75. After positioning the y-axis scribe line, the expander 80 is lowered and the layer of the silicon resin 23 is broken. Then, the expander 73 is moved by the scribe line pitch in the x-axis direction, and the expander 80 is lowered in the same manner. In this way, the functional area is divided into a lattice shape, and the entire surface is completely broken, so that a large number of LED chips can be formed.
  In this embodiment, the functional area can be protected by using a large number of openings of the expander bar 65 as through-holes. However, a protective hole that does not contact the structure of the substrate 20 at the time of the break is sufficient. It is good also as a hollow of the depth which a structure does not contact.
  In this embodiment, an example of manufacturing an LED chip of an LED substrate having a functional region having a lens on its upper surface is described. However, the present invention is not limited to a chip having a lens on its surface, and particularly has no function protruding. The present invention can also be applied to a chip having a region, and can also be applied to a brittle material substrate having a functional region having a projection other than a lens.
  Further, in this embodiment, a brittle material substrate in which a silicon resin is applied to a ceramic substrate is described. However, substrates of various other material layers may be used. For example, a layer such as a polarizing plate may be laminated on a glass substrate.
  Although the air cylinder is described as the pusher plate lifting mechanism in the above-described end material separation stage, it goes without saying that the lifting mechanism may be another shape lifting mechanism such as a linear slider.
  INDUSTRIAL APPLICABILITY According to the present invention, a substrate obtained by breaking only a ceramic substrate, which is a brittle material substrate, can be conveyed, and the end material can be separated, inverted, and broken.
DESCRIPTION OF SYMBOLS 10 Base 11 Beam 12 Linear slider 13 Conveyance head 14 Break stage 15 End material separation stage 16 Expand stage 17 Expand mechanism 20 Substrate 21 Ceramic substrate 22 Functional area 23 Silicon resin 24 Linear protrusion 31 Hanger base 32 Hanger 33, 34 Hanger bracket 35 Linear slider 40 Head part 41 Base plate 42 Elastic plate 43 Duct 44 Blower 46 Latch mechanism 47 Pusher plate 48 Air cylinder 51 Arm 52 Chamber 53 Base plate 54 Elastic plate 55 Rotating shaft 61 Arm 62 Cartridge 63 Spacer 64 Sponge 65 Expander bar 67 Holder 71 Base 72, 74 Linear slider 73 Expanding head 75 Rotating machine Structure 80 Expander 81 Expanding bar

Claims (2)

  1. A break device for breaking a brittle material substrate,
    The brittle material substrate is
    Breaks along a scribe line that has functional areas formed at a predetermined pitch in the vertical and horizontal directions on one side, is coated with resin, and is formed in a lattice shape so that the functional areas are located at the center. It has been
    The break device is
    An end material separating device for separating the end material around the brittle material substrate held on the end material separating stage;
    A reversing device for sandwiching and reversing the brittle material substrate between the end material separating stage and the expanding stage;
    A brittle material substrate breaker comprising: an expand mechanism that expands a resin layer of the brittle material substrate and breaks along a scribe line formed in a lattice shape.
  2. The break device is
    An end material separation stage for holding the brittle material substrate rotatably provided on an upper surface;
    A frame-shaped pusher plate having a side corresponding to a portion to be an end material around the brittle material substrate;
    A first elevating mechanism for elevating and lowering the pusher plate parallel to the surface of the brittle material substrate;
    An expand stage that is rotatably provided to overlap with the end material separation stage on the same rotation axis as the end material separation stage;
    First and second rotating mechanisms for independently rotating the end material separating stage and the expanding stage;
    An expander having an expanded bar on the lower surface;
    2. The brittle material substrate breaking device according to claim 1, further comprising a second lifting mechanism for breaking the resin layer of the brittle material substrate by lowering the expander along a scribe line from above the brittle material substrate. .
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JP2014092493A JP6256178B2 (en) 2014-04-28 2014-04-28 Breaking device for brittle material substrate
TW103142982A TWI639566B (en) 2014-04-28 2014-12-10 Cracking device for brittle material substrate
KR1020150003344A KR20150124376A (en) 2014-04-28 2015-01-09 Apparatus for breaking brittle material substrate
CN201510142652.3A CN105034179B (en) 2014-04-28 2015-03-27 The brisement device of brittle substrate

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JP6256178B2 true JP6256178B2 (en) 2018-01-10

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TW201540678A (en) 2015-11-01
CN105034179A (en) 2015-11-11

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