JP2011037104A - Device and method for dividing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for dividing a substrate, having a division groove and dividing surely the substrate into small pieces along the division groove, and a method for dividing the substrate using the dividing device, and the device and the method for dividing the substrate, allowing the dividing without damaging a cavity, when the small piece has the cavity. <P>SOLUTION: This device includes a conveying mechanism for conveying the substrate with the division groove, and a dividing mechanism for dividing the substrate along the division groove in a prescribed position in the midway of the conveyance, and the dividing mechanism includes a pressing part constituted to be movable vertically, and for pressing the substrate conveyed to the prescribed position, along the division groove, and a support member having an escape groove X and an evacuation groove Y orthogonal to the escape groove X, and divides the substrate along the division groove, by pressing the substrate, with a vertical movement of the pressing part, using the escape groove X as a reception part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate dividing apparatus for dividing a substrate having a dividing groove and obtaining small pieces by dividing along the dividing groove into small pieces with a high yield along the dividing groove, and to use the same. The present invention relates to a method of dividing a substrate. In particular, the present invention relates to a substrate dividing apparatus for satisfactorily dividing a small piece having a cavity and a substrate dividing method using the same.

  Conventionally, various dividing apparatuses have been proposed for dividing a ceramic substrate having a dividing groove along the dividing groove to obtain a ceramic electronic component such as a chip capacitor or a chip resistor, or a ceramic small substrate such as a small ceramic package.

  For example, in Patent Document 1, a substrate having a dividing groove is sandwiched between a pair of rubber-like elastic belts from both sides, a fixing plate is disposed on the outer surface side of one rubber-like elastic belt, and the other rubber-like one is placed. There has been proposed a substrate dividing apparatus in which a pressing portion that presses and divides the vicinity of the upper surface of the dividing groove of the substrate via the rubber-like elastic belt is arranged on the outer surface side of the elastic belt. In this substrate dividing apparatus, the pressing portion is driven when the sensor detects the starting point of the substrate.

Patent Document 2 proposes a ceramic substrate dividing apparatus having the following components (1) to (5).
(1) A ceramic substrate having a plurality of division grooves parallel to each other at a constant repetition interval is placed on the lower surface so that the division grooves are perpendicular to the transfer direction, and from the supply section provided on one end side to the other end side. The lower endless belt which comprises the transfer part which transfers horizontally toward the provided discharge part.
(2) An upper endless belt that is disposed to face the transfer unit between the supply unit and the discharge unit and constitutes a presser unit that holds the ceramic substrate and presses the transfer unit side.
(3) A support plate that supports the ceramic substrate by contacting the lower surface of the lower endless belt between the supply unit and the middle of the opposed region between the transfer unit and the pressing unit.
(4) The lower endless belt protrudes 0.05 to 0.5 mm above the support plate at a position spaced from the edge on the discharge portion side of the support plate to the discharge portion side by the same distance as the repetition interval. A support roller that contacts the lower surface and supports the ceramic substrate.
(5) A pressing roller that applies a pressing force to the ceramic substrate from above by contacting the upper surface of the upper endless belt immediately above the edge on the discharge portion side of the support plate in the pressing portion.

  Furthermore, Patent Document 3 discloses a substrate dividing apparatus having a dividing groove having a conveying mechanism that conveys a substrate having a dividing groove on a sheet and a dividing mechanism that divides the substrate in the middle of conveyance along the dividing groove. Proposed. In this dividing apparatus, the dividing mechanism includes a split portion and a press portion configured to be movable up and down, a connecting portion that is movably provided in the split portion, and is horizontally mounted on the press portion, and abuts on the connecting portion. The drive shaft that moves up and down by the crank mechanism, the stopper mechanism that regulates the downward movement of the presser part, the split part and the presser part are disposed so as to sandwich the sheet, and are arranged between the split part and the presser part. It is comprised from a receiving part. A feature of this device is that the substrate is transported so that the dividing groove of the substrate is positioned between the split part and the presser part, the split part and the presser part are moved downward by the downward movement of the drive shaft, and the presser is pressed by the stopper mechanism. By restricting the downward movement of the part and bringing it into contact with the substrate, the substrate is moved along the dividing groove with the receiving part as a fulcrum by further lowering the split part from the pressing part by the seesaw mechanism of the connecting part. It is to be divided.

  If such a conventional substrate dividing apparatus is used, the pressing force of the holding portion is sufficiently applied to the dividing groove if the area of the surface facing the holding portion of the small piece obtained by dividing is large to some extent. It can be divided along the dividing groove. However, when the area of the opposing surface is reduced as the small pieces are reduced in size, there is a problem in that the pressing force to the dividing grooves is not sufficiently applied, so that it cannot be divided along the dividing grooves or cannot be divided into small pieces. there were. In particular, when the cavity is formed in the small piece, there is a problem that the wall of the cavity is broken.

JP 9-38957 A JP 2002-18830 A Japanese Patent No. 3485519

  An object of the present invention is to provide a substrate dividing apparatus that has a dividing groove and can be surely divided into small pieces along the dividing groove, and a substrate dividing method using the dividing apparatus. Moreover, when a small piece has a cavity, it aims at providing the dividing apparatus and the dividing method which can be divided | segmented without a cavity being damaged.

The substrate dividing apparatus according to the present invention includes:
A substrate dividing apparatus for dividing a substrate provided with a region partitioned by a dividing groove into small pieces along the dividing groove,
A transport mechanism that transports the substrate having the split grooves in a state of being sandwiched between upper and lower buffer sheets, and a split mechanism that splits the substrate along the split grooves at a predetermined position during transport,
The dividing mechanism is configured to be movable up and down and is capable of pressing the substrate conveyed to the predetermined position along the dividing groove; and the opposite side of the pressing portion with the substrate and the upper and lower buffer sheets interposed therebetween And a clearance groove X as a receiving portion formed so as to be opposed to the pressing portion, and a clearance groove X direction of a region perpendicular to the clearance groove X and shallower than the clearance groove X and delimited by the division grooves A support member having a relief groove Y formed with a width shorter than the length of
The substrate sandwiched between the upper and lower cushioning sheets by the transport mechanism is transported to a split position where the split groove is positioned between the pressing portion and the relief groove X of the support member, and the lower portion of the lower portion is moved by the downward movement of the press portion. The escape groove X is used as a receiving portion via the side buffer sheet, and the substrate is pressed via the upper buffer sheet so as to be divided along the divided grooves.

  In addition, the present invention provides the substrate dividing apparatus according to the present invention, wherein the planar shape is rectangular, and each of the dividing grooves has a plurality of dividing grooves in a certain repeating unit in parallel with two adjacent sides. A substrate dividing method for dividing a substrate that may have a cavity in each region divided by the substrate into small pieces along the dividing groove, wherein the dividing groove is placed at least in one direction. The substrate dividing method includes a step of dividing the substrate along the dividing groove so as to leave the substrate in an undivided state, and a step of further dividing the substrate along the undivided dividing groove.

By using the substrate dividing apparatus of the present invention, a sufficient pressing force is applied to the dividing grooves, and the substrate can be reliably divided into small pieces. Further, when the small piece has a cavity, it can be divided without damaging the wall of the cavity.
According to the substrate dividing method of the present invention using this dividing apparatus, a sufficient pressing force is applied to the dividing groove, and the substrate can be reliably divided into small pieces. Further, when the small piece has a cavity, it can be divided without damaging the wall of the cavity.

It is sectional drawing of the direction orthogonal to the division | segmentation groove | channel of the board | substrate in one Embodiment of the division apparatus of the board | substrate of this invention. It is a perspective view of an example of a substrate to which a substrate dividing apparatus of the present invention is applied. (I) shows the substrate before division. (II) shows the substrate after division. It is sectional drawing of the width direction of the small piece obtained using the board | substrate division | segmentation apparatus of this invention (sectional drawing of the part corresponded in the B-B 'line in FIG. 2 (II)). It is sectional drawing of the part corresponded in the A-A 'line in FIG. 1 of embodiment of the board | substrate division | segmentation apparatus of this invention shown in FIG. It is a perspective view of the supporting member in embodiment of the division | segmentation apparatus of the board | substrate of this invention shown in FIG. It is sectional drawing of the division groove direction of the board | substrate in another embodiment of the division apparatus of the board | substrate of this invention. It is a figure which shows typically one Embodiment of the division | segmentation method of the board | substrate of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
<Substrate dividing device>
An embodiment (hereinafter referred to as “first embodiment”) of a substrate dividing apparatus according to the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view in a direction perpendicular to a substrate dividing groove in an embodiment of a substrate dividing apparatus of the present invention. FIG. 2 is a perspective view of an example of a substrate to which the substrate dividing apparatus of the present invention is applied. (I) shows the substrate before division. (II) shows a small piece after division. 4 is a cross-sectional view of a portion corresponding to the line AA ′ in FIG. 1 of the embodiment of the substrate dividing apparatus of the present invention shown in FIG.

  In the substrate dividing apparatus 1 according to the first embodiment of the present invention shown in FIG. 1, the substrate 4 to be divided has one dividing groove 2 shown in FIG. A substrate 4 is used in which the two divided regions each have a cavity 3 and an opening is provided on one surface side. In the substrate dividing apparatus 1 according to the first embodiment of the present invention, a plurality of substrates 4 are arranged in a direction perpendicular to the dividing grooves shown in FIG. 1 (hereinafter also referred to as “lateral direction”) with almost no gap. Further, a plurality of elements are similarly arranged in a direction parallel to the dividing grooves shown in FIG. 2 (hereinafter, also referred to as “longitudinal direction”). The substrate dividing apparatus 1 is set in a state in which a plurality of substrates 4 are arranged and fixed in the vertical and horizontal directions, and a set of the vertical and horizontal arrays of the substrates 4 is sequentially conveyed in the horizontal direction by a conveyance mechanism described below. The plurality of substrates 4 in the vertical direction that have reached a predetermined position for division are simultaneously divided into two small pieces 5 along the division grooves 2 by the division mechanism described below.

Here, in the substrate dividing apparatus of the present invention, the substrate to be divided is particularly limited as long as it has at least one dividing groove and a small piece can be obtained by dividing along the dividing groove. Not. However, the substrate dividing apparatus of the present invention is preferably used in a case where each piece obtained by dividing has a cavity on at least one surface. When the small piece has a cavity, it can be divided without damaging the wall of the cavity, and the advantage of the dividing apparatus of the present invention is great. Thus, when the small piece obtained after a division | segmentation has a cavity, the small piece may have a cavity only in the single side | surface, and may have it on both surfaces. Further, the number of cavities that the small piece has is not particularly limited. Furthermore, for example, a small piece having a configuration in which a functional element is mounted in a cavity and an opening is sealed may be used, or a small piece having only a cavity may be used. Specific examples of the small piece having a configuration in which the functional element is mounted in the cavity and the opening is sealed include a light emitting element package, a MEMS package, and the like. Further, as in the substrate 4 shown in FIG. 2I, the substrate dividing apparatus of the present invention is used for dividing the substrate into two pieces with cavities obtained by dividing along the dividing groove. In this case, the effect of the present invention is particularly remarkable.
In the substrate dividing apparatus of the present invention, the material of the substrate to be divided is not particularly limited. Usually, the dividing device of the present invention can be applied to a substrate used for a substrate related to an electronic / electrical component, for example, a substrate made of glass, ceramics or the like.

  The substrate preferably having a cavity or a plurality of small unit units arranged in such a manner that a functional element is mounted in the cavity and the opening is sealed is usually a substrate shown in FIG. It is not manufactured in the form of a combination of two small piece units such as 4, but is produced as a rectangular substrate in which small piece units are arranged in a plurality of vertical and horizontal rows, and for further dividing the substrate into small pieces. The dividing groove is formed by a conventionally known method. In the substrate dividing apparatus of the present invention, it is possible to divide the rectangular substrate, which is manufactured as described above, into small pieces divided into small pieces over a plurality of vertical and horizontal rows by the dividing grooves. A specific method for dividing the substrate will be described in the substrate dividing method of the present invention, which will be described later. In FIG. 1, a rectangular substrate divided into small pieces over a plurality of vertical and horizontal rows by dividing grooves. However, a state after being divided into two substrates each having a small piece unit such as the substrate 4 is shown.

  1 is formed from the surface side having the cavity opening of the substrate toward the surface on the opposite side, the division groove is not limited to this, and the substrate The surface opposite to the surface having the cavity opening may be formed toward the surface having the cavity opening. Furthermore, it is also possible to use a substrate having these two dividing grooves.

The substrate dividing apparatus of the present invention is preferably applied to the substrate dividing. The small piece that may have a cavity obtained by dividing along the dividing groove is a substantially rectangular parallelepiped, and the area that the small piece has The division of the substrate in which the ratio (a) / (b) of the length (a) of the side in the dividing direction to the length (b) of the side perpendicular to the dividing surface on the smaller dividing surface is 0.5 or more. Can be mentioned.
FIG. 3 shows a cross-sectional view in the width direction of an example of a small piece with a cavity obtained by using the substrate dividing apparatus of the present invention (a cross-sectional view of a portion corresponding to the line BB ′ in FIG. 2 (II)). However, the length (a) of the side in the dividing direction corresponds to the height (a) in the cross section cut in the width direction with the surface having the cavity shown in FIG. Similarly, the length (b) of the side orthogonal to the side in the dividing direction corresponds to the width (b) in the cross section cut in the width direction with the surface having the cavity shown in FIG. Hereinafter, the length (a) of the side in the dividing direction on the dividing surface having the smaller area of the small piece is referred to as “height (a)”, and the length (b) of the side perpendicular to the side in the dividing direction is referred to as “width”. (B) ". Further, the height (a) of the small piece is the same as the thickness (height) of the substrate, and hereinafter, the height of the substrate may also be represented by (a).

  Here, for example, the size of a small piece used for a package for a normal light emitting element is 2 to 10 mm for the width (b), 0.6 to 1.5 mm for the height (a), and about the length. It is about 2 to 10 mm, and (a) / (b) is generally less than 0.5. The size of the small piece with the cavity to which the substrate dividing apparatus of the present invention is applied is not particularly limited, but in the small piece (width (b) of 1.5 mm or less) obtained by dividing, the cavity has a large wall thickness. In the size of the thin piece, for example, the light emitting element, the cavity size is 0.2 to 1 mm in width, 2 to 4 mm in length, about 0.5 mm or less in depth, and the wall thickness in the width direction is 0.1 to 0. When used for dividing a substrate for a small piece having a cavity of about 3 mm, the effect of the present invention is remarkable.

  The substrate dividing apparatus 1 according to the first embodiment of the present invention shown in FIG. 1 has substrates 4 arranged in a plurality of rows and columns having the dividing grooves 2 with the opening side of the cavity 3 facing downward. It has a transport mechanism that transports while being sandwiched between the upper buffer sheet 6 and the lower buffer sheet 7, and a split mechanism that splits the substrate 4 along the split groove 2 at a predetermined position in the middle of transport. Here, the substrate 4 is sandwiched between the upper buffer sheet 6 and the lower buffer sheet 7 with the opening side of the cavity 3 on the lower side. And may be sandwiched.

  The upper buffer sheet 6 and the lower buffer sheet 7 included in the transport mechanism allow the substrate to be transported in a fixed state by sandwiching the substrate from both sides, and perform a split operation using the split mechanism. In this case, the surface of the substrate is prevented from being damaged. In addition, the lower buffer sheet 7 conveys a piece of the substrate that may occur in the division operation, thereby preventing the occurrence of a division failure due to the remaining piece in the subsequent division, It also functions to separate and recover from the finally obtained small pieces. The material constituting the lower buffer sheet 7 is not particularly limited as long as it is a material having a copying function of the contact portion, a buffering function, and the like. Specifically, the material is made of polyethylene terephthalate (PET), polypropylene, polyurethane, or the like. A plastic film is mentioned. The thickness of the lower buffer sheet 7 is not particularly limited as long as the above function can be achieved, but is preferably about 1/10 or less of the substrate height (a).

  The material constituting the upper buffer sheet 6 is not particularly limited as long as it has a copying function of the contact portion, a buffering function, and the like, and specifically, a plastic made of polyethylene terephthalate (PET), polypropylene, polyurethane, or the like. A film is mentioned. The thickness of the upper cushioning sheet 6 is not particularly limited as long as the above function can be achieved, but is preferably about 1/10 or less of the substrate height (a). Further, a single-sided adhesive film having an adhesive layer on the substrate side can be used as the upper buffer sheet 6 particularly for the purpose of fixing the substrate.

  In the substrate dividing apparatus 1 according to the first embodiment of the present invention shown in FIG. 1, the substrate 4 sandwiched between the upper buffer sheet 6 and the lower buffer sheet 7 is conveyed to a predetermined dividing position by the sending means 11. Is done. The upper buffer sheet 6 and the lower buffer sheet 7 are attached to the substrate at a stage prior to the delivery means 11, and the substrate 4 sandwiched between the upper and lower cushion sheets is placed on the delivery means 11 and conveyed. The delivery means 11 recognizes a predetermined division position by a normal method such as a sensor, temporarily stops the conveyance of the substrate 4 at the division position, and the substrate 4 is divided into small pieces by a division mechanism described below. In the substrate dividing apparatus 1 shown in FIG. 1, the sending means 11 repeatedly carries out operations of sequentially transferring the substrates 4 arranged in a plurality of rows in the horizontal direction to the dividing position and dividing them by the dividing mechanism. As the delivery means, known means such as motor feed amount control by pulse count, precision ball screw, etc. can be used. In addition, the small pieces 5 divided by the dividing device 1 are nipped and fixed at the stage where the small pieces 5 are conveyed to a position having a fixed distance from the division position by the delivery means 11, and the upper buffer sheet 6 and the lower buffer sheet 7 are fixed. Is separated and recovered as appropriate.

  In the substrate dividing apparatus 1 according to the first embodiment of the present invention shown in FIG. 1, the dividing mechanism is configured to be movable up and down and can press the substrate 4 conveyed to the predetermined position along the dividing groove 2. And a support plate 9 as a support member located on the opposite side of the pressing portion 8 with the substrate 4 and the upper and lower buffer sheets 6 and 7 interposed therebetween. The support plate 9 has a relief groove X as a receiving portion formed so as to face the pressing portion 8, and a relief groove X in a region which is perpendicular to the relief groove X and shallower than the relief groove X and is divided by the division grooves. An escape groove Y formed in a shape including a region corresponding to the opening of the cavity 3 when the substrate is transported to a division position where the substrate is divided along the division groove with a width shorter than the length in the direction. Have.

  The material and shape of the pressing portion 8 are not limited as long as the pressing portion 8 can press the substrate evenly along the dividing groove. Specifically, a cylindrical pin, a triangular prism-shaped hard pin, or the like can be given. As a specific material of the hard pin, a super hard material or the like can be given. The specific size of the hard pin includes a diameter of about 0.5 to 2 mm, although it depends on the size and height of the substrate. The dividing mechanism also includes a pressurizing means 10 as means for pressing the substrate 4 along the dividing groove 2 by moving the pressing portion 8 downward. As the pressurizing means, known means such as air pressure control using an air cylinder or torque control using a motor can be used. The pressing portion 8 can be moved downward by the pressurizing means 10, but the pressing portion 8 and the pressing means 10 are configured to be movable up and down independently. At the time of pressing the substrate, the pressing unit 8 can move the pressing unit 10 and the pressing unit 8 up and down so as to be positioned at the lowest side during a series of operations of transporting the substrate using the dividing apparatus → dividing (see FIG. Position adjustment). Further, when the substrate is transported, the positions of the pressing means 10 and the pressing portion 8 are controlled so that the pressing portion 8 does not come into contact with the upper buffer sheet 6.

  FIG. 5 shows a perspective view of a support plate 9 as a support member in the first embodiment of the substrate dividing apparatus of the present invention. The relief groove X in the support plate 9 corresponds to the pressing portion 8 and is one in the substrate dividing apparatus 1 according to the first embodiment of the present invention. However, when a plurality of pressing portions are provided in the dividing mechanism of the substrate dividing apparatus, the number of relief grooves X corresponding to the number of pressing portions is required. The escape groove X functions as a receiving portion when the pressing portion 8 presses the substrate during the substrate dividing operation. Therefore, although the shape and size of the escape groove X depend on the shape and size of the pressing portion 8, examples of the shape include a V-shaped groove, a U-shaped groove, and a concave groove. The size of the escape groove X is preferably 0.2 to 1.5 mm at the maximum width and 0.5 mm or less at the maximum depth.

  The relief groove Y in the support plate 9 has a plurality of substrate units in the direction of the dividing groove of the substrate, in which two small pieces such as a substrate 4 having the dividing groove 2 as shown in FIG. It is preferable that a plurality of substrates are formed so that a plurality of substrate units can be divided by one division operation. Specifically, the number of escape grooves Y is preferably 1 to 10.

  The escape groove Y plays a role of reducing the stress load on the wall portion of the cavity when the pressing portion 8 presses the substrate during the substrate dividing operation. Therefore, the shape and size of the escape groove Y depend on the shape and size of the cavity and the opening of the substrate. Examples of the shape of the escape groove Y include a V-shaped groove, a U-shaped groove, and a concave groove, but a concave groove is preferable. More preferably, the shape is such that the depth of the groove in the side wall portion is inclined so as to gradually increase from the end toward the central portion, and a region having a constant depth is formed in the central portion of the groove. The size of the escape groove Y is the maximum width, which is substantially the same width as the length of the side parallel to the dividing groove of the cavity or cavity opening, and the depth is 0.1 mm or less at the maximum depth. It is preferable. The depth of the escape groove Y is not intended to give a displacement for division, but is shallower than the escape groove X in order to reduce or eliminate the stress load on the cavity wall due to the pressing pressure.

  Even when the substrate is divided in order to obtain a small piece having no cavity, the relief groove Y reduces stress applied to portions other than the division groove more than necessary when the pressing portion presses the substrate. Play a role. In this case, the escape groove Y is formed on the support plate in a direction perpendicular to the escape groove X with a length shorter than the length of the small piece in the direction of the escape groove X in the region partitioned by the division grooves. .

  The material of the support plate 9 that is a support member is not particularly limited as long as it is a member that does not deform with respect to a stress load caused by pressing and has a smooth and hard surface. Examples include steel materials and ceramics.

  In the substrate dividing apparatus 1 according to the first embodiment of the present invention shown in FIG. 1, the dividing groove 2 has a pressing portion 8 and a support plate for the substrate 4 sandwiched between the upper and lower buffer sheets by the transport mechanism. 9 is moved to a dividing position located between the clearance groove X and the downward movement of the pressing portion 8 makes the escape groove X a receiving portion via the lower cushioning sheet 7 and the substrate 4 via the upper cushioning sheet 6. Can be broken along the dividing groove 2.

  In the substrate dividing apparatus 1 of the present invention shown in FIG. 1, when the substrate 4 is pressed by the pressing portion 8, a necessary portion is obtained by the above-described configuration of the relief groove X and the relief groove Y provided in the support plate 9. Specifically, it is possible to control the stress load distribution by concentrating stress on the four corners of the substrate 4 and reducing the stress load on unnecessary portions, specifically, the cavity opening and its vicinity. Become. Thereby, the substrate 4 is divided along the dividing grooves with high dimensional accuracy, and the occurrence of defects such as breakage is small, and the small pieces 5 can be obtained with high yield.

  From the viewpoint of controlling the stress distribution to the substrate when the substrate 4 is pressed by the pressing portion 8, in the substrate dividing device of the present invention, the pressing portion contacts the substrate when pressing the substrate. It is preferable that the area to be set is set so as to be small in the vicinity of the cavity and large otherwise. FIG. 6 is a sectional view in the direction of the dividing groove of the substrate in the embodiment of the substrate dividing apparatus according to the present invention (hereinafter referred to as “second embodiment”) designed so that the pressing portion has the above-described configuration. Show.

  In the substrate dividing apparatus 1 according to the second embodiment of the present invention shown in FIG. 6, the configuration other than the pressing portion 8 is the same as that of the first embodiment. In the second embodiment of the present invention, the pressing portion 8 is configured to have a small width in the vicinity of the cavity 3 and a large width in other portions as shown in a cross section in FIG. By making the pressing portion 8 into such a shape, the area where the pressing portion 8 contacts the substrate 4 when pressing the substrate 4 is small in the vicinity of the cavity 3 and is large in the other areas. Can be divided into small pieces, and the dimensional accuracy of the divided surface can be made higher.

<Division method of substrate>
The substrate dividing method of the present invention uses the above-described substrate dividing apparatus of the present invention, the planar shape is rectangular, and there are a plurality of dividing grooves in a certain repeating unit in parallel with two adjacent sides, A substrate dividing method for dividing a substrate that may have a cavity in each region divided by the dividing groove into small pieces along the dividing groove, wherein the dividing groove is formed in at least one direction. The method includes a step of dividing the substrate along the dividing groove so as to leave every other one in an undivided state, and a step of further dividing the substrate along the undivided dividing groove.

Hereinafter, the substrate dividing method of the present invention will be described with reference to FIG. FIG. 7 is a diagram schematically showing an embodiment of the substrate dividing method of the present invention.
In FIG. 7, (1) has a rectangular planar shape, and has a plurality of dividing grooves in a constant repeating unit in parallel with two adjacent sides, and each region divided by the dividing grooves has a cavity. A substrate 20 is shown. Although the dividing grooves are not shown in FIG. 7, the dividing grooves of the substrate 20 are eight dividing grooves in the direction parallel to the short side of the cavity, and the direction parallel to the long side of the cavity. There are 17 split grooves.

  FIG. 7B shows a state in which the substrate 20 shown in the above (1) is divided along all the eight divided grooves with respect to the divided grooves in the direction parallel to the short side of the cavity. Thus, the process of dividing the substrate 20 into the state shown in (1) to (2) is usually performed by the substrate dividing apparatus of the present invention, but may be performed by a conventional substrate dividing apparatus. When the dividing process from (1) → (2) → (3) → (4) in FIG. 7 is executed using the dividing apparatus of the present invention, the substrate 20 in the state (1) is previously stored. What is necessary is just to make it pinch | interpose to an upper buffer sheet and a lower buffer sheet, and to use for a series of division processes. When a preferable adhesive film is used as the upper buffer sheet, it is not removed in a series of dividing steps, but the lower buffer sheet can be replaced as needed for each dividing step.

  FIG. 7 (3) shows that the substrate divided as described in (2) above is left in an undivided state for every other divided groove in the direction parallel to the long side of the cavity. Thus, a state of being divided along the eight dividing grooves is shown. Each of the substrates obtained here is a substrate having a structure that is finally divided into two small pieces by the central dividing groove, like the substrate 4 shown in FIG. The step of dividing the substrate thus divided as described in (2) further into the state shown in (3) is usually performed by the substrate dividing apparatus of the present invention, but a conventional substrate dividing apparatus. May be performed.

  FIG. 7 (4) shows a state in which the substrate divided as described in (3) above is further divided along nine undivided dividing grooves and finally made into small pieces. The individual pieces obtained here are the same pieces as the pieces 5 shown in FIG. 2 (II). The step of further dividing the substrate divided as described in (3) into the state shown in (4) is performed by the substrate dividing apparatus of the present invention. In the first and second embodiments of the substrate dividing apparatus of the present invention shown in FIGS. 1 to 6, the substrate divided as described in (3) above is further changed to (4). The division operation which divides | segments into the state to show is shown.

  When performing the step of further dividing the substrate divided as described in (3) into the state shown in (4), a sufficient pressing force is selectively given to the division groove at the center of the substrate. This is achieved by using the dividing apparatus of the present invention, and the division of the substrate into small pieces can be performed reliably. In the conventional method, the substrate is divided as follows: (1) → (2) → (4), but sufficient accuracy is not obtained in the division of (2) → (4). In the dividing method of the present invention, the substrate is divided in the order of (2) → (3) → (4). Further, for the division of (3) → (4), the dividing device of the present invention is used in particular. The division into is ensured. In particular, if the substrate dividing method of the present invention is used for dividing a substrate in which the size of the small piece is small and the above (a) / (b) is 0.5 or more, the effect is remarkable.

Although an example of the embodiment of the substrate dividing method of the present invention has been described with reference to FIG. 7, the order of the dividing steps can be changed.
For example, by using the dividing apparatus of the present invention, the substrate 20 shown in the above (1) is left in an undivided state for every other dividing groove in the direction parallel to the long side of the cavity. Then, the step of dividing along the eight dividing grooves is performed, and then the step of dividing along all the eight dividing grooves is performed on the dividing grooves in the direction parallel to the short side of the cavity. Finally, the substrate in the state shown in (3) can be further divided along nine undivided dividing grooves in a direction parallel to the long side of the cavity, and finally can be made into small pieces. .

  Further, by using the dividing apparatus according to the present invention, the substrate 20 shown in the above (1) is left in an undivided state for every other dividing groove in the direction parallel to the long side of the cavity. Then, the step of dividing along the eight dividing grooves is performed, and then the substrate is further divided along nine undivided dividing grooves in the direction parallel to the long side of the cavity, and finally the cavity is formed. The dividing groove in the direction parallel to the short side can be divided into small pieces by executing a process of dividing along all the eight dividing grooves.

Depending on the shape of the small pieces and the shape of the cavities of the small pieces, the substrate is placed along the dividing grooves so that every other dividing groove is left undivided not only in one direction but also in two directions. After dividing, a method of further dividing the substrate along the undivided dividing grooves may be used. Also in this case, the dividing apparatus uses the substrate dividing apparatus of the present invention.
So far, the substrate dividing method of the present invention has been described by taking the substrate dividing method when obtaining a small piece with a cavity as an example. However, the substrate dividing method of the present invention is for a small piece having no cavity. The same can be applied to the division of the substrate as described above.

  By using the substrate dividing apparatus of the present invention, a sufficient pressing force is applied to the dividing grooves, and the substrate can be reliably divided into small pieces. Further, when the small piece has a cavity, it can be divided without damaging the wall of the cavity. According to the substrate dividing method of the present invention using this dividing apparatus, a sufficient pressing force is applied to the dividing groove, and the substrate can be reliably divided into small pieces. Further, when the small piece has a cavity, it can be divided without damaging the wall of the cavity.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

Example 1
Using the dividing apparatus shown in FIG. 1, the ceramic substrate (low temperature fired ceramic substrate) was divided. The substrate used was the same as the substrate shown in FIG. 2 (I), and 20 small pieces of this substrate were placed in the dividing device in a horizontal row so that the dividing groove was on the side opposite to the pressing portion. The installed substrate was sequentially conveyed to the dividing position by the feeding means, and was divided into small pieces by the downward movement of the pressing portion at the dividing position. The division was successful. This conveyance and division were repeated to obtain 20 small pieces from the 20 pieces of the substrate.
In addition, the size of the small piece unit in the substrate is width (a): 0.8 mm, length: 3.8 mm, height (b): 0.8 mm ((a) / (b) = 1.0). The shape of the cavity for each small piece is width: 0.4 mm, length: 2.9 mm, depth: 0.3 mm, and the dividing groove is formed from only one side of the substrate with a depth of 0 formed before firing. .2mm V-shaped groove.
The detailed specifications of the apparatus are as follows.

<Device specifications>
Upper buffer sheet: 4 × 30 mm, cellulosic adhesive sheet with a thickness of 0.04 mm Lower buffer sheet: 4 × 30 mm, polypropylene sheet with a thickness of 0.2 mm Pressing part: cylinder with a diameter of 0.8 mm and a length of 10 mm Shape, SUS304 hard pin Support plate: Support plate with one relief groove X (maximum width: 0.9 mm, maximum depth: 0.2 mm U-shaped groove)

<Result>
In the obtained small piece, 15 out of 20 did not have any defective portions (cracks, defects, cavity wall breakage, divided surface defects, etc.). Moreover, about the small piece without a defective location, the dispersion | variation in the width | variety (a) was less than 0.8 mm +/- 0.05mm, and the division | segmentation state was favorable.

(Comparative Example 1)
Using a known ceramic substrate divider (basic structure is Example 1 of Japanese Patent No. 3031384, apparatus described in FIGS. 1 to 4), a substrate pressing tool is added, and the same material as that of Example 1 above. The ceramic substrate (low-temperature fired ceramic substrate) having the cavities was divided. The size of the small piece unit on the substrate, the shape of the cavity provided for each small piece, and the size of the dividing groove are the same as those in Example 1, but the substrate size is 40 mm in width, 3.8 mm in length, and 3.8 mm in height. It was 0.8 mm. This substrate was installed in the above-mentioned apparatus so that a dividing groove was formed on the pressing portion side, and small pieces were obtained by sequentially dividing the substrate into the small piece size (width (a): 0.8 mm) along the dividing groove. Although it was possible to divide by the inclination of the support part, the end face inclination and the lower edge sedge occurred, resulting in frequent failures. The main cause was that the plate pressing position was easily shifted during division.

<Result>
For the 50 small pieces to be produced, there was no small piece substrate obtained without a defective portion. Furthermore, the variation of the width (a) was 0.8 mm ± 0.2 mm, and many of the sizes were not products.

  INDUSTRIAL APPLICABILITY The substrate dividing apparatus and the dividing method of the present invention are useful for dividing small pieces such as light emitting elements that require dimensional accuracy of the dividing surface.

DESCRIPTION OF SYMBOLS 1 ... Substrate dividing device, 2 ... Dividing groove, 3 ... Cavity, 4 ... Substrate having dividing groove, 5 ... Small piece, 6 ... Upper buffer sheet, 7 ... Lower buffer sheet, 8 ... Pressing part, 9 ... Support Plate 10, pressurizing means 11, delivery means X X escape groove X Y Y escape groove Y

Claims (7)

A substrate dividing apparatus for dividing a substrate provided with a region partitioned by a dividing groove into small pieces along the dividing groove,
A transport mechanism that transports the substrate having the split grooves in a state of being sandwiched between upper and lower buffer sheets, and a split mechanism that splits the substrate along the split grooves at a predetermined position during transport,
The dividing mechanism is configured to be movable up and down and is capable of pressing the substrate conveyed to the predetermined position along the dividing groove; and the opposite side of the pressing portion with the substrate and the upper and lower buffer sheets interposed therebetween And a clearance groove X as a receiving portion formed so as to be opposed to the pressing portion, and a clearance groove X direction of a region perpendicular to the clearance groove X and shallower than the clearance groove X and delimited by the division grooves A support member having a relief groove Y formed with a width shorter than the length of
The substrate sandwiched between the upper and lower cushioning sheets by the transport mechanism is transported to a split position where the split groove is positioned between the pressing portion and the relief groove X of the support member, and the lower portion of the lower portion is moved by the downward movement of the press portion. An apparatus for dividing a substrate, wherein the relief groove X is a receiving portion through a side buffer sheet and the substrate is pressed through the upper buffer sheet so as to be divided along the divided groove.   2. The substrate dividing apparatus according to claim 1, wherein the small piece obtained by dividing along the dividing groove has a cavity on at least one surface.   3. The substrate dividing apparatus according to claim 1, wherein an area of the pressing portion that contacts the substrate when pressing the substrate is set to be small in the vicinity of the cavity and large otherwise.   The small piece obtained by dividing along the dividing groove is a substantially rectangular parallelepiped, and the length (a) of the side in the dividing direction and the length of the side perpendicular to the dividing surface on the dividing surface on the small area side of the small piece ( 4. The substrate dividing apparatus according to claim 1, wherein a ratio (a) / (b) of b) is 0.5 or more.   5. The substrate dividing apparatus according to claim 1, wherein the maximum depth of the escape groove X is 0.5 mm or less, and the maximum depth of the escape groove Y is 0.1 mm or less.   The board | substrate division | segmentation apparatus of any one of Claims 1-5 by which the upper side buffer sheet in the said conveyance mechanism adhere | attaches a board | substrate. Using the substrate dividing apparatus according to any one of claims 1 to 6, the planar shape is rectangular, each having a plurality of dividing grooves in a constant repeating unit in parallel with two adjacent sides, A substrate dividing method for dividing a substrate that may have a cavity in each region divided by the dividing groove into small pieces along the dividing groove,
Dividing the substrate along the dividing groove so that every other dividing groove is left undivided in at least one direction; and further dividing the substrate along the undivided dividing groove; Substrate dividing method including:

Images