CN105034179A - Apparatus for breaking brittle material substrate - Google Patents
Apparatus for breaking brittle material substrate Download PDFInfo
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- CN105034179A CN105034179A CN201510142652.3A CN201510142652A CN105034179A CN 105034179 A CN105034179 A CN 105034179A CN 201510142652 A CN201510142652 A CN 201510142652A CN 105034179 A CN105034179 A CN 105034179A
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- microscope carrier
- brisement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Condensed Matter Physics & Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention provides an apparatus for breaking brittle material substrates. A substrate is arranged in the longitudinal direction and the transverse direction with a functional area, and the material is separated from the surrounding material, and the end material is separated, and the resin layer is cracked. The substrate (20) is maintained on the base plate (15) and the push plate (47) is decreased, and the material is separated. Then, in the end stage separation material (15) and expansion stage (16) into the substrate and rotated. After that, the end material is separated from the carrier platform 15 to the opposite direction, and the extension head 73 to the substrate is vertical down and the resin layer is cracked, thereby separating the chip. Since the end of the material is used in the separation and inversion of the end material, the expansion of the carrier is used to reverse and expand, so the invention can obtain the effect of the whole device miniaturization and efficiency.
Description
Technical field
The invention relates to a kind of for carrying out the end material around substrate being separated and the brisement device of fully brisement, this substrate on the brittle substrate such as semiconductor substrate, ceramic substrate, is coated with resin bed form.
Background technology
In patent document 1, mention following substrate brisement device: to the substrate being formed with score line, by from the back side in face being formed with score line, utilize brisement bar along score line and vertically press with face and carry out brisement.Be semiconductor crystal wafer and in when to be formed with the situation of multiple functional area in array at the substrate becoming brisement object, first at substrate to form score line across mode at equal intervals at longitudinal direction and transverse direction between functional area.Then disjunction must be carried out along this score line with brisement device.
In addition, in patent document 2, following transport mechanism is mentioned: make supporting arm and substrate contacts to transport brittle substrate and adsorb with vacuum, supporting arm being moved, transports substrate whereby.
After end material around brisement brittle substrate, taking-up, in order to disrumpent feelings resin bed, to be separated each chip completely, and be necessary substrate is reversed.In patent document 3, disclose the reversing device having and use mechanical arm that brittle substrate is reversed.In this reverse turn operation, once the substrate delineated is configured at pallet with mechanical arm, supports from below by changing and reverse.
Patent document 1: Japanese Unexamined Patent Publication 2004-39931 publication
Patent document 2: Japanese Unexamined Patent Publication 2013-177309 publication
Patent document 3: Japanese Patent No. 3787489 publication
On brittle substrate, such as ceramic substrate, in manufacturing step, form multiple functional area along x-axis and y-axis with a determining deviation, use brisement device to carry out brisement to the substrate being filled with silicones on ceramic substrate.Forming score line in lattice shape to this substrate, and when carrying out brisement, only the part of ceramic substrate be separated along score line, silicone layer is still remained stationary state and remaining.Therefore substrate must be made to reverse and at silicone layer, delineation be stretched.
But in existing known technology, the brisement device of the carrying device transported the brittle substrate of brisement except resin bed, the separating end material device of separating end material, inversion set and brisement resin bed is respective independence, these devices are not integrated into one, and have the problem of larger-scale unit.
Summary of the invention
The present invention is the problem being conceived to existing known larger-scale unit, its object is to miniaturization of the apparatus, efficiency can carry out operation goodly, this device can not transported with coming off under state of remaining stationary by the brittle substrate of brisement the substrate only except resin bed, and the end material of surrounding can be separated and reverse, separation resin layer also fully carries out brisement.
The object of the invention to solve the technical problems realizes by the following technical solutions.The brisement device of the brittle substrate proposed according to the present invention, it is brisement device brittle substrate being carried out to brisement, this brittle substrate,, in one side, there is the functional area formed with given pitch at longitudinal direction and transverse direction, and be coated with resin, the score line formed in lattice shape along the mode being positioned at center with this functional area and by its brisement; This brisement device, possess the end material be held in around brittle substrate that end material is separated on microscope carrier is separated end material separator, be separated microscope carrier at this end material and sandwich this brittle substrate with expansion microscope carrier and inversion set reverse and expand the resin bed of this brittle substrate and edge forms the extension mechanism of cancellate score line brisement.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The brisement device of aforesaid brittle substrate, wherein this brisement device, possess and be arranged to the rotatable end material separation microscope carrier keeping this brittle substrate above, there is the frame-shaped push pedal on the limit corresponding with the part of the end material become around this brittle substrate, make this push pedal with the first elevating mechanism be elevated abreast with the face of this brittle substrate, the mode overlapped to be separated microscope carrier with this end material at the same rotating shaft of rotating shaft being separated microscope carrier with this end material is arranged to rotatable expansion microscope carrier, make first and second rotating mechanism that this end material separation microscope carrier and this expansion microscope carrier rotate independently of one another, there is the expander of expander bar below, by making this expander decline from the top of brittle substrate along score line, the resin bed of this brittle substrate is carried out to the second elevating mechanism of brisement.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, the present invention is formed with resin bed and has in the brittle substrate of functional area on surface on brittle substrate, is separated end material around by only being pressed with push pedal by the substrate of the substrate brisement except resin bed.Then, by utilizing coaxial rotating mechanism to make expansion microscope carrier be separated microscope carrier simultaneously toward equidirectional rotation with end material, and brittle substrate can be made to reverse under state of remaining stationary.Further, keep substrate by expansion microscope carrier, resin bed is pressed with expander, and can separation resin layer.Be used in the separation of end material and reversion because end material is separated microscope carrier, expansion microscope carrier is used in reversion and expansion, therefore can obtain the effect that can make device integral miniaturization, efficient activity.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to technological means of the present invention can be better understood, and can be implemented according to the content of description, and can become apparent to allow above and other object of the present invention, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the stereogram representing that the entirety of the brisement device realizing the invention process form is formed.
Fig. 2 is the front view representing the brisement device realizing the invention process form.
Fig. 3 (a) represents conveyance head by this embodiment and the front view of substrate one example transported.
Fig. 3 (b) represents conveyance head by this embodiment and the fragmentary cross-sectional view along A-A line of substrate one example transported.
Fig. 4 is the stereogram of the conveyance head representing the invention process form.
Fig. 5 is the front view of the conveyance head of this embodiment.
Fig. 6 is the upward view of the conveyance head of this embodiment.
Fig. 7 is the part of this embodiment of excision conveyance head and the stereogram that represents.
Fig. 8 is the stereogram of precipitron one example representing the carrying device being used in this embodiment.
Fig. 9 is the stereogram of push pedal one example representing the end material separator being used in this embodiment.
Figure 10 represents that the end material of this embodiment is separated microscope carrier and the side view expanding microscope carrier.
Figure 11 represents that the conveyance head of this embodiment is separated microscope carrier with end material and expands the profile of microscope carrier.
Figure 12 represents that the conveyance head of this embodiment is separated the profile of a part for microscope carrier with end material.
Figure 13 represents that the end material of this embodiment is separated microscope carrier and the stereogram expanding microscope carrier.
Figure 14 is the stereogram representing the expander that the expansion microscope carrier of this embodiment is upper and lower with it.
Figure 15 represents that the end material of this embodiment is separated microscope carrier, conveyance head, expansion microscope carrier and prolate-headed side view.
Figure 16 be represent this embodiment sandwich substrate and the stereogram of the state making it rotate.
Figure 17 is the side view being separated microscope carrier through postrotational expansion microscope carrier with end material representing this embodiment.
Figure 18 (a) to Figure 18 (d) be represent this embodiment resin is expanded and the amplification profile of the state be separated.
[main element symbol description]
10: pedestal 11: beam
12: linear saddle 13: conveyance head
14: brisement microscope carrier 15: end material is separated microscope carrier
16: expansion microscope carrier 17: extension mechanism
20: substrate 21: ceramic substrate
22: functional area 23: silicones
24: wire projection 31: suspension bracket pedestal
32: suspension bracket 33,34: suspension bracket bracket
35: linear saddle 40: head
41: base plate 42: flexure strip
43: conduit 44: air blast
46: latch mechanism 47: push pedal
48: cylinder 51: arm
52: chamber 53: base plate
54: elastic plate 55: rotating shaft
61: arm 62: casket
63: partition 64: sponge
65: expansion rubber 67: holder
71: pedestal 72,74: linear saddle
73: extension header 75: rotating mechanism
80: expander 81: expander bar
Detailed description of the invention
Brisement device for the invention process form is described.Fig. 1 is the stereogram representing that the entirety of the brisement device realizing this embodiment is formed, and Fig. 2 is its front view.As shown in Figures 1 and 2, on pedestal 10, beam 11 is held in parallel with above pedestal 10 by pillar, arranges linear saddle 12 in the side of this beam 11.Linear saddle 12 makes conveyance 13 along beam 11 comfortable ground action.On pedestal 10, as shown in Figure 1 and Figure 2, be provided with to brittle substrate (hereinafter referred to as substrate) carry out brisement brisement microscope carrier 14, be separated following end material end material be separated microscope carrier 15 and expansion microscope carrier 16.Conveyance 13 attracts substrate and end material separation microscope carrier 15 toward right figure transports from brisement microscope carrier 14.
Be described for the substrate becoming brisement object in the invention process form.Substrate 20, as disclosed front view and Fig. 3 (b) discloses shown in its fragmentary cross-sectional view, for being formed with the substrate of multiple functional area 22 along x-axis and y-axis with a determining deviation on ceramic substrate 21 in manufacturing step at Fig. 3 (a).This functional area 22, such as, for having the region as LED function, at each functional area, the rod-like crystal for LED is formed at each surface.On this substrate, filling silicones 23, but in order to make this silicones 23 indwelling in the scope being formed with LED function region 22, around outside functional area 22, being formed with the wire projection 24 slightly high compared with the surface of ceramic substrate 21.When filling silicones 23, sometimes have the situation above or outside it that silicones 23 arrives wire projection 24.
And, in order to carry out disjunction with regard to each functional area to form LED chip, before brisement is carried out to substrate 20, be positioned at the mode at center with each functional area by scoring device, and delineate in the mode that the score line Sx1 ~ Sxm of the score line Sy1 of longitudinal direction ~ Syn and transverse direction is mutually orthogonal.
Through the substrate 20 of delineation in the brisement microscope carrier 14 shown in Fig. 2, with the face being formed with crystal for above, and by not shown brisement device along score line Sx1 ~ Sxm ' with score line Sy1 ~ Syn by its brisement.Substrate 20 after brisement is that only ceramic substrate 21 layers is along score line disjunction, but silicones 23 layers is not by brisement.That is substrate 20 becomes only thinner by surface silicones 23 layers and becomes the state of connection, and have inside wire projection 24 and be arranged in x, the part of multiple functional areas of y-axis and the part becoming outer circumference end material and do not want.
Then, be described for for attracting this substrate 20 and carrying out the conveyance that transports 13.Fig. 4 is the stereogram representing conveyance 13, and Fig. 5 is its side view, and Fig. 6 is its upward view, the stereogram that Fig. 7 is the excision first part of conveyance and represents.
As shown in Figure 4, conveyance 13, is vertically connected with the suspension bracket 32 of roughly L-shaped at the suspension bracket pedestal 31 of the roughly horizontal direction of square shape.Be connected with OBL suspension bracket bracket 33 in the side of suspension bracket 32, in the mode in its face that overlaps, OBL suspension bracket bracket 34 be installed further at suspension bracket bracket 33, the linear saddle 35 that can move up and down freely is set at suspension bracket bracket 34.In the below of linear saddle 35, head 40 is set.Linear saddle 35 has to two directions with lower direction the inflow entrance flowing into air stream up respectively, flows into by switching it and makes head 40 move up and down elevating mechanism freely.In addition, as long as linear saddle 35 can make head 40 be elevated, only do not make it move up and down for the inflow by air stream, also can be and utilize motor etc. and make it move up and down.
Head 40 is baskets of Nogata body shape, and basket inside is cavity, open underneath.And as shown in Figure 7, base plate 41 is set below.Base plate 41 is smooth metal member below being, such as, be aluminum.At base plate 41 in the mode corresponding with the functional area 22 of the substrate 20 through brisement, be equally spaced provided with the multiple openings in being arranged in xy direction in array.Described opening is configured to the path length being greater than crystal respectively.In addition, also in the part that the outer circumference end material of the functional area 22 with substrate 20 is corresponding, opening is circumferentially provided with.
Thin flexure strip 42 is installed below base plate 41.Flexure strip 42 is smooth rubber system flat boards.And, as shown in Figure 6, also equally spaced have opening in the mode corresponding with each functional area 22 becoming the substrate 20 transporting object in x direction and y direction at flexure strip 42, the part of wire projection 24 subtend further around with it has dimetric annular recessed portion.In addition, also in the part that the outer circumference end material of the functional area 22 with substrate 20 is corresponding, opening is circumferentially had in the arranged outside of annular recessed portion.Described opening becomes same position at coincidence base plate 41 with during flexure strip 42.Herein, the opening of base plate 41 and the opening of flexure strip 42 are configured to the slightly large path length of the path length of the LED crystal being comparatively formed at functional area 22, and in attraction when the substrate 20 of brisement, the crystal being configured to functional area 22 does not directly contact with flexure strip 42.
Then, in a side of this head 40, conduit 43 is installed, is linked with the air blast (blower) 44 of the precipitron shown in Fig. 8 in the front end of conduit 43.In addition, though use precipitron herein, air blast 44 monomer can also be used.Under the state of substrate 20 contact resilient sheet 42, once blower 44 attract air by conduit 43, then attract air from the opening of base plate 41, flexure strip 42, and substrate 20 can be attracted.In addition, by not shown switching part, air stream is switched to outflow from inflow, the state that air is sprayed from the opening of flexure strip 42 can be switched to whereby.
And, the sidewall of four sides of this head 40 is provided with multiple latch (latch) mechanism 46.Latch mechanism 46 is to base plate 41 and flexure strip 42 be configured to one below at head 40 and be held in handling freely, and can easily change when the situation that the rubber of flexure strip 42 is deteriorated.In addition, this latch mechanism 46 also can be located at least parallel pair of sidewalls of head 40.
In the lower, outer perimeter of head 40, in moving up and down the push pedal 47 arranging the frame-shaped shown in Fig. 9 freely.Push pedal 47 substrate 20 being held in head 40 with under the state of holding material to be separated between microscope carrier 15, by making push pedal 47 decline, the part do not wanted being separated as end material around substrate 20.Push pedal 47 be with substrate 20 around the frame-shaped component of the suitable size of end material part.In addition, as diagram, height certain above being configured to, the thickness of a pair relative limit 47a, 47b is thicker, the thinner thickness of two relative limit 47c, 47d rectangular therewith.
Then, the elevating mechanism for push pedal 47 is described.Among the sidewall of head 40, be parallel to each other 2 sidewalls except a sidewall except linking conduit 43, arrange cylinder 48 using as the first elevating mechanism.Cylinder 48, has as shown in Figure 5 and is fixed on the body 48a of the sidewall of head 40 with bolt, moves up and down the coupling member 48c of flat coupling member 48b freely and connected frame-shaped.In addition, push pedal 47 is linked with in the below of coupling member 48c freely in moving up and down.
Then the end material separation microscope carrier 15 for the separation and substrate reversion that are used in end material is described.End material is separated microscope carrier 15, as shown in Figure 10 ~ Figure 12, arm 51 has the base plate 53 on OBL chamber 52 and its top and the elastic plate 54 of almost identical shape therewith.Be formed with large recess at the middle body of chamber 52, and be communicated with the conduit 51a being formed at arm 51 inside.Base plate 53 is OBL flat boards suitable with the global function region of the substrate through brisement, but is preferably and is slightly less than global function region.Base plate 53 is such as aluminum.At base plate 53, the mode corresponding with each functional area 22 is provided with the multiple openings in being arranged in xy direction in array.
Elastic plate 54 is pasted with on base plate 41.Elastic plate 54 is the flat boards such as the rubber of the shape suitable with the oblong-shaped region in the global function region being equivalent to substrate 20, but is preferably and is slightly less than global function region.At elastic plate 54 except the peripheral part on 4 limits, be provided with base plate 53 opening that is in the mode corresponding with the functional area of the substrate through brisement in the multiple openings being arranged in xy direction in array.The part being preferably the edge above elastic plate 54 is the structure of slight curvature.
In addition, this elastic plate 54 is all configured to each functional area 22 corresponding with the opening of base plate 53, therefore, it is possible to make extraneous air be circulated in the recess of chamber 52 by described opening when overlapping.Conduit 51a in arm 51 inside is linked with vacuum absorption device by not shown pipe, and air can be made by driving vacuum absorption device from the opening ejection of elastic plate 54 or attract.
In addition, be configured to can from the state of Figure 10 toward rotatable 180 ° clockwise centered by rotating shaft 55 for this arm 51.This axle is provided with the first rotating mechanism making to rotate together with the chamber 52 on arm 51 and its top, base plate 53 and elastic plate 54.As long as rotating mechanism can make arm 51 rotate 180 ° of persons, can be revolving cylinder, or also can by being made up of motor and reduction gearing.
Then, the reversion being directed to substrate 20 and the expansion microscope carrier 16 used when carrying out brisement silicones 23 layers, use Figure 10, Figure 11, Figure 13 ~ Figure 15 to be described.Expansion microscope carrier 16, as shown in Figure 11, Figure 13, has arm 61 and the casket (cartridge) 62 of Nogata body shape being installed on arm 61.Casket 62 is the columnar part in its four corners with L-shaped, and keeps partition (spacer) 63, sponge (sponge) 64 and expansion rubber 65 within it.Partition 63 and expansion rubber 65 are flat boards of size suitable for the functional area of substrate, and expansion rubber 65 is elastically supported plates of rubber.At expansion rubber 65, in the mode corresponding with the functional area 22 of the substrate 20 through brisement, be equally spaced provided with the multiple openings in being arranged in xy direction in array.This opening is configured to the slightly large path length of the path length of the LED crystal being comparatively formed at functional area 22, and is configured in attraction when the substrate 20 of brisement, and the crystal of functional area 22 does not directly contact with expansion rubber 65.
And in fig. 11, the smooth pressing plate 66 of the frame-shaped of shape almost identical with casket is set below expansion rubber 65.Pressing plate 66 is connected by bolt with casket 62, prevents partition 63 or sponge 64, expands coming off of rubber 65.
In addition, be configured to can centered by the rotating shaft identical with the rotating shaft 55 of arm 51 and rotatable 180 ° for arm 61.And arrange and make arm 61 and casket 62 or partition 63, sponge 64 and expand the second rotating mechanism rotated together with rubber 65.As long as rotating mechanism can make arm 61 rotate 180 °, can be revolving cylinder, also can by being made up of motor and reduction gearing.And, on pedestal 10, as shown in figure 13, be provided with holder 67.Holder 67 is making the arm 61 of expansion microscope carrier toward when rotating 180 ° clockwise, below its position supporting arm 61.
Then, for the extension mechanism 17 of brisement of silicones 23 being used in this embodiment, Figure 14, Figure 15 is used to be described.Extension mechanism 17 is for by carrying out disrumpent feelings to the silicones 23 layers of substrate 20 be held on expansion microscope carrier 16, and brisement substrate 20 completely.Extension mechanism 17, has the pedestal 71 parallel with pedestal 10 and the second elevating mechanism moved it in above-below direction and linear saddle 72 as shown in figure 14.At pedestal 71 in being movably provided with extension header 73, being provided with and making the linear saddle 74 that extension header 73 is displaced into x-axis direction and the rotating mechanism 75 that extension header 73 is rotated along this axle.Rotating mechanism 75, though herein for having a pair belt pulley and belt and connected motor and swing pinion, as long as owing to making extension header 73 rotate, therefore also can be use has motor and reducing gear.
To be provided with expander 80 abreast with the face of expansion microscope carrier 16 below extension header 73.Whereby, when the situation making extension header about 73 move by linear saddle 72, expander 80 is also side by side in moving up and down integratedly.Expander 80, be formed with the expander bar 81 with the muscle shape of plane base parallel abreast in multiple, all crest lines of each expander bar form a plane.In addition, as long as the interval of expander bar 81 is also necessarily the integral multiple of more than 2 of delineation preset lines interval, in this embodiment, be 2 times.And the section of each expander bar 81, as shown in Figure 14, Figure 15, can be set as arc-shaped along the mode of score line pressing.
Then, for by this carrying device, the situation that substrate 20 transports from brisement microscope carrier 14 toward end material separation microscope carrier 15 is described.First, the conveyance of carrying device 13 is displaced into directly over the substrate 20 on brisement microscope carrier 14, head 40 is declined and to be harmonious with substrate 20.Then, position in the mode making the opening of the flexure strip 42 of head 40 foot correspond to LED crystal.Then, when attracting air by conduit 43, attract air from the opening of base plate 41, flexure strip 42 when blower 44, and the substrate 20 that contacts with flexure strip 42 can be attracted.Herein, even if attracting from the opening of flexure strip 42 to produce air leakage during air, because air flows into from opening toward inner all the time, therefore also substrate 20 can be attracted.Then, by lifting conveyance 13, and the substrate 20 through brisement can be lifted under state of remaining stationary.
In this condition, conveyance 13 entirety are moved by linear saddle 12, substrate 20 can be transported to desired position whereby.In such a manner, as shown in Figure 10, move to end material making conveyance 13 and be separated after directly over microscope carrier 15, head 40 is declined by linear saddle 35.Then, the substrate 20 be held in below head 40 is separated the upper contact of microscope carrier 15 with end material, and the mode becoming the position of corresponding elastic plate 54 opening respectively with its functional area 22 is located and stopped declining.Then, below substrate 20 contact resilient plate 54 state under attract air by arm 51, substrate 20 can be held in end material whereby and be separated on microscope carrier 15.Now, also can be the state maintaining and make air blast 44 action, it also can be made again to stop.
Then, be described for action when holding the end material of material separator to be separated.First, can by cylinder 48 blow out air of the elevating mechanism from push pedal 47, and the push pedal 47 of head 15 bottom be declined.Once make push pedal 47 and substrate 20 decline abreast, then first by limit 47a, 47b that thickness is thicker, the elongated peripheral part outside the functional area of only substrate 20 bears downward pressure, is separated and becomes end material.Further once continuous decrease, then by two limit 47c, 47d of thinner thickness, the elongated peripheral part outside the functional area of substrate 20 bears the pressure of decline and is separated and becomes end material.Figure 13 discloses separated 4 end materials.Can by pressing the step-down operation to wait and so on push pedal 47 so, and the end material completely around separating base plate 20.Now, limit adjacent around substrate 20 is not made to become end material simultaneously and be separated.In addition, elastic plate 54 is slightly less than push pedal 47, the edge bend portions above it.Therefore, it is possible to when the functional area of not wounded substrate 20, the end material of surrounding is separated completely in the short time.
Afterwards, under the state attracting air from arm 51, spray air from air blast 44, make head 40 increase.Whereby, head 40 is separated from substrate 20.Under the state making head 40 increase, conveyance 13 is made to move toward Fig. 2 left and be back to previous status by linear saddle 12.
Make head 40 be separated the top of microscope carrier 15 away from afterwards from end material in such a manner, make arm 61 turn of expansion microscope carrier 16, expansion rubber 65 contact jaw material is separated above the substrate 20 on microscope carrier 15 top.Figure 13 is represent this state graphic.The mode now not contacting the inwall of expansion rubber 65 opening with crystal is located.And substrate 20 is sandwiched between end material separation microscope carrier 15 and expansion microscope carrier 16.Make in this condition arm 51 and arm 61 along same rotating shaft as shown in figure 16 as rotate.Can it be made to reverse under the state utilizing end material separation microscope carrier 15 and expansion microscope carrier 16 fully to be kept by substrate 20 accordingly, and substrate 20 can not come off in rotation way.Figure 17 makes these microscope carriers rotate 180 °, by the state supported by holder 67 below expansion microscope carrier 16.
After terminating in such a manner to rotate, the conduit being separated the arm 51 of microscope carrier 15 by end material makes air spray from the opening of elastic plate 54, makes substrate 20 be separated microscope carrier 15 from end material and is separated.Then only make end material be separated microscope carrier 15 and rotate 180 ° in the other direction, be back to original position.Whereby, though be held in by substrate 20 on expansion microscope carrier 16, the top of substrate 20 is in open state.
Then, be described with the method for the disjunction of completing substrate 20 for making the score line being formed at ceramic substrate 21 also stretch toward silicones 23 layers.First, the mode of coming directly over substrate 20 by linear saddle 74 with extension header 73 moves it.Then, make the crest line of each expander bar 81 foot of expander 80 as shown in Figure 18 (a), position by linear saddle 74 in the mode of closing with score line S-phase.
Then, drive linear saddle 72, expander 80 is kept relative to expanding, and microscope carrier 16 is parallel to decline lentamente.Then, as shown in Figure 18 (b), directly over score line S, press ceramic substrate 21 by expander bar 81.Accordingly, as shown in Figure 18 (c), ceramic substrate 21 is pressed by expander bar 81 and is out of shape, sink and expand rubber 65 and be similarly deformed into V shape, can the silicones 23 layers of brisement substrate 20.Once complete brisement, linear saddle 72 is reversed and makes expander 80 increase.
Now, expander 80, be formed with multiple expander bar 81 side by side, and its interval is 2 times of score line spacing, therefore, it is possible to every one along many score line side by side brisement silicones 23.
And, extension header 73 can be made only to move with the amount of separation of score line in x-axis direction, and similarly also adjacent to other score line complete the brisement of resin bed by making expander 80 decline.Herein, the interval due to expander bar 81 is 2 times of score line spacing, therefore, it is possible to by making extension header 73 be shifted 1 time and carrying out the brisement in brisement and all x-axis directions of completing substrate 20.In addition, expander bar 81 be spaced apart the situation of score line spacing 3 times time, 2 times can be moved by making extension header 73 and carry out brisement and complete the brisement in all x-axis directions.
Then, make extension header 73 by rotating mechanism 75 half-twist.Also after positioning the score line of y-axis, expander 80 is declined, brisement silicones 23 layers.Then, extension header 73 is only moved with the amount of separation of score line in x-axis direction, and similarly make expander 80 decline.Accordingly, functional area can be divided and be broken into clathrate to complete comprehensive brisement, form multiple LED wafer.
In addition; in this embodiment, though can defencive function region using the multiple openings expanding rubber 65 as through hole, as long as when brisement the tectosome not contact protection hole of substrate 20; therefore also can be non-through hole, and be the groove of the tectosome not degree of depth of exposure level.
In this embodiment, though be illustrated for manufacturing the example had in the LED chip of the LED-baseplate with crystal functional area above, but the present invention is not only applicable to the chip that surface has crystal, especially the chip having and do not have any outstanding functional area is also applicable to, in addition, the brittle substrate of the functional area having the thrust had beyond crystal is also applicable to.
Further, in this embodiment, though be illustrated for the brittle substrate being coated with silicones at ceramic substrate, also can be the substrate of other various material layers.Such as, also can be and have the layers such as Polarizer to form to glass substrate lamination.
Though the elevating mechanism being separated push pedal in microscope carrier as above-mentioned end material for cylinder is illustrated, elevating mechanism also can be the elevating mechanism of other shapes such as linear saddle certainly.
The present invention can to only transporting the substrate of the ceramic substrate brisement of brittle substrate, and separating end material also reverses, and carries out brisement, can be applicable to the manufacture of substrate in a effective manner.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (2)
1. a brisement device for brittle substrate, is carry out brisement to brittle substrate, it is characterized in that:
This brittle substrate, is have in one side the functional area formed with given pitch at longitudinal direction and transverse direction, and is coated with resin, the score line formed in lattice shape along the mode being positioned at center with this functional area and by its brisement;
This brisement device, possesses:
The end material separator that the end material be held in around brittle substrate that end material is separated on microscope carrier is separated,
This end material be separated microscope carrier with expansion microscope carrier sandwich this brittle substrate and the inversion set reversed and
Expand the resin bed of this brittle substrate and the extension mechanism of the cancellate score line brisement of edge formation.
2. the brisement device of brittle substrate according to claim 1, is characterized in that wherein this brisement device, possesses:
Be arranged to rotatable keep above the end material of this brittle substrate be separated microscope carrier,
Have the frame-shaped push pedal on the limit corresponding with the part of the end material become around this brittle substrate,
Make this push pedal with the first elevating mechanism be elevated abreast with the face of this brittle substrate,
The mode overlapped to be separated microscope carrier with this end material at the same rotating shaft of rotating shaft being separated microscope carrier with this end material be arranged to rotatable expansion microscope carrier,
First and second rotating mechanism that this end material separation microscope carrier and this expansion microscope carrier are rotated independently of one another,
Have below expander bar expander and
By making this expander decline from the top of brittle substrate along score line, the resin bed of this brittle substrate is carried out to the second elevating mechanism of brisement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014092493A JP6256178B2 (en) | 2014-04-28 | 2014-04-28 | Breaking device for brittle material substrate |
| JP2014-092493 | 2014-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105034179A true CN105034179A (en) | 2015-11-11 |
| CN105034179B CN105034179B (en) | 2017-10-20 |
Family
ID=54441432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510142652.3A Expired - Fee Related CN105034179B (en) | 2014-04-28 | 2015-03-27 | The brisement device of brittle substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6256178B2 (en) |
| KR (1) | KR20150124376A (en) |
| CN (1) | CN105034179B (en) |
| TW (1) | TWI639566B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105313227A (en) * | 2014-05-29 | 2016-02-10 | 三星钻石工业股份有限公司 | Method and apparatus for dividing edged material of brittle material substrate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001058317A (en) * | 1999-08-20 | 2001-03-06 | Berudekkusu:Kk | Method and apparatus for scribing |
| CN1359784A (en) * | 2000-12-19 | 2002-07-24 | 三星钻石工业股份有限公司 | Method and device for dividing brittle substrate |
| CN1750917A (en) * | 2003-02-21 | 2006-03-22 | 三星钻石工业股份有限公司 | Substrate-processing table and substrate processing device |
| CN101708633A (en) * | 2008-08-29 | 2010-05-19 | 三星钻石工业股份有限公司 | Brittle material breaking device |
| JP2013177309A (en) * | 2013-06-05 | 2013-09-09 | Mitsuboshi Diamond Industrial Co Ltd | Brittle substrate conveying unit |
| CN103381624A (en) * | 2012-05-03 | 2013-11-06 | 江俊昇 | Method and device for cutting fragile sheet work piece |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09136319A (en) * | 1995-11-15 | 1997-05-27 | Fujitsu Ten Ltd | Apparatus for dividing substrate |
| JP4646467B2 (en) * | 2001-09-04 | 2011-03-09 | 旭化成せんい株式会社 | Spun yarn |
| JP2005225637A (en) * | 2004-02-13 | 2005-08-25 | Toyota Industries Corp | Panel inverting device |
| JP2011037104A (en) * | 2009-08-10 | 2011-02-24 | Asahi Glass Co Ltd | Device and method for dividing substrate |
| JP5170195B2 (en) * | 2010-09-24 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate with resin |
| JP5981791B2 (en) * | 2012-07-18 | 2016-08-31 | 三星ダイヤモンド工業株式会社 | Breaking device for brittle material substrate |
-
2014
- 2014-04-28 JP JP2014092493A patent/JP6256178B2/en active Active
- 2014-12-10 TW TW103142982A patent/TWI639566B/en not_active IP Right Cessation
-
2015
- 2015-01-09 KR KR1020150003344A patent/KR20150124376A/en not_active Application Discontinuation
- 2015-03-27 CN CN201510142652.3A patent/CN105034179B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001058317A (en) * | 1999-08-20 | 2001-03-06 | Berudekkusu:Kk | Method and apparatus for scribing |
| CN1359784A (en) * | 2000-12-19 | 2002-07-24 | 三星钻石工业股份有限公司 | Method and device for dividing brittle substrate |
| CN1750917A (en) * | 2003-02-21 | 2006-03-22 | 三星钻石工业股份有限公司 | Substrate-processing table and substrate processing device |
| CN101708633A (en) * | 2008-08-29 | 2010-05-19 | 三星钻石工业股份有限公司 | Brittle material breaking device |
| CN103381624A (en) * | 2012-05-03 | 2013-11-06 | 江俊昇 | Method and device for cutting fragile sheet work piece |
| JP2013177309A (en) * | 2013-06-05 | 2013-09-09 | Mitsuboshi Diamond Industrial Co Ltd | Brittle substrate conveying unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105313227A (en) * | 2014-05-29 | 2016-02-10 | 三星钻石工业股份有限公司 | Method and apparatus for dividing edged material of brittle material substrate |
| CN105313227B (en) * | 2014-05-29 | 2018-12-28 | 三星钻石工业股份有限公司 | The end material separation method and end material separator of brittle material substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201540678A (en) | 2015-11-01 |
| KR20150124376A (en) | 2015-11-05 |
| TWI639566B (en) | 2018-11-01 |
| JP6256178B2 (en) | 2018-01-10 |
| CN105034179B (en) | 2017-10-20 |
| JP2015208937A (en) | 2015-11-24 |
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