TW201930167A - Substrate sucking device capable of sucking substrate with less leakage - Google Patents
Substrate sucking device capable of sucking substrate with less leakage Download PDFInfo
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- TW201930167A TW201930167A TW107142631A TW107142631A TW201930167A TW 201930167 A TW201930167 A TW 201930167A TW 107142631 A TW107142631 A TW 107142631A TW 107142631 A TW107142631 A TW 107142631A TW 201930167 A TW201930167 A TW 201930167A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
Description
本發明係關於一種基板吸附裝置。The present invention relates to a substrate adsorption device.
作為固定並搬送液晶等所使用之玻璃基板之裝置，已知有將玻璃基板抽真空並吸附之基板吸附搬送裝置。於基板吸附搬送裝置中，已知有由多孔質陶瓷形成吸附面者(例如，參照專利文獻1)。
[先前技術文獻]
[專利文獻]As a device for fixing and transporting a glass substrate used for a liquid crystal or the like, a substrate adsorption transfer device that vacuums and adsorbs a glass substrate is known. In the substrate adsorption transport apparatus, an adsorption surface is formed of a porous ceramic (for example, see Patent Document 1).
[Previous Technical Literature]
[Patent Literature]
[專利文獻1]日本專利特開平6-8086號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 6-8086
[發明所欲解決之問題][The problem that the invention wants to solve]
如上所述於真空吸附裝置中於吸附面包含多孔質陶瓷之情形時，難以維持吸附面之平坦度。其結果，於基板之吸附時產生洩漏而吸附力變小。
尤其於支持基板之構件之平坦度較低之情形時，上述問題顯著。As described above, in the case where the adsorption surface contains porous ceramics in the vacuum adsorption apparatus, it is difficult to maintain the flatness of the adsorption surface. As a result, a leak occurs at the time of adsorption of the substrate, and the adsorption force becomes small.
Especially in the case where the flatness of the member supporting the substrate is low, the above problems are remarkable.
本發明之目的在於於基板吸附裝置中，可於洩漏較少之狀態下吸附基板。
[解決問題之技術手段]An object of the present invention is to adsorb a substrate in a state where the leakage is small in the substrate adsorption device.
[Technical means to solve the problem]
以下，作為用於解決問題之手段說明複數個態樣。該等態樣可根據需要任意組合。Hereinafter, a plurality of aspects will be described as means for solving the problem. These aspects can be arbitrarily combined as needed.
本發明之一基板吸附裝置係用於吸附並保持基板之裝置，並具備吸引部、多孔質吸附板。
吸引部被供給負壓。
多孔質吸附板安裝於吸引部，並具有柔軟性。
於此裝置中，因多孔質吸附板具有柔軟性，故可使吸附基板時之洩漏減少。原因在於，先前多孔質吸附板侵入成為間隙之區域而密著於其他構件。A substrate adsorption device according to the present invention is a device for adsorbing and holding a substrate, and includes a suction portion and a porous adsorption plate.
The suction portion is supplied with a negative pressure.
The porous adsorption plate is attached to the suction portion and has flexibility.
In this apparatus, since the porous adsorption plate has flexibility, leakage during adsorption of the substrate can be reduced. The reason is that the porous adsorbing plate invaded into the region of the gap and adhered to the other members.
基板吸附裝置亦可進而具備提昇部。提昇部當多孔質吸附板吸附載置於具有凹凸之載置部之基板時，藉由使吸引部及多孔質吸附部自載置部向上方移動，而可自載置部提昇基板。
於此裝置中，基板雖載置於具有凹凸之載置部之上，但因多孔質吸附板具有柔軟性，故可使吸附基板時之洩漏減少。The substrate adsorption device may further include a lift portion. When the porous adsorbing plate adsorbs the substrate placed on the mounting portion having the unevenness, the lifting portion can move the substrate from the mounting portion by moving the suction portion and the porous adsorbing portion upward from the mounting portion.
In this apparatus, although the substrate is placed on the mounting portion having the unevenness, the porous adsorbing plate has flexibility, so that the leakage at the time of adsorbing the substrate can be reduced.
多孔質吸附板亦可為橡膠製。
於此裝置中，製造成本相對低價。The porous adsorption plate may also be made of rubber.
In this device, the manufacturing cost is relatively low.
多孔質吸附板亦可係厚度為1～3 mm之薄板形狀。
於此裝置中，可確實地吸附較薄之基板。
[發明之效果]The porous adsorption plate may also be in the form of a thin plate having a thickness of 1 to 3 mm.
In this device, a thin substrate can be reliably adsorbed.
[Effects of the Invention]
於本發明之基板吸附裝置中，可於洩漏較少之狀態下吸附基板。In the substrate adsorption apparatus of the present invention, the substrate can be adsorbed in a state where leakage is small.
1.第1實施形態
(1)基板加工裝置之概略說明
使用圖1～圖3，說明基板加工裝置1。圖1係本發明之第1實施形態之基板加工裝置之示意性俯視圖。圖2係基板分斷裝置之示意性立體圖。圖3係基板分斷裝置之示意性側視圖。於圖1中，圖之上下方向為第1方向(箭頭X)，圖之左右方向為第2方向(箭頭Y)。
基板加工裝置1係自貼合基板100形成複數個單位基板113之裝置。於圖1中，隨後所述之複數個裝置於第2方向上自左向右排列。即，被加工對象之基板之搬送方向為第2方向，基板一面於第2方向上自左向右搬送一面加工。因此，圖1之第2方向左側為搬送方向上游側，圖1之第2方向右側為搬送方向下游側。1. First embodiment
(1) Outline of Substrate Processing Apparatus A substrate processing apparatus 1 will be described with reference to Figs. 1 to 3 . Fig. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. 2 is a schematic perspective view of a substrate breaking device. Figure 3 is a schematic side view of a substrate breaking device. In FIG. 1, the upper direction of the figure is the first direction (arrow X), and the left and right direction of the figure is the second direction (arrow Y).
The substrate processing apparatus 1 is a device that forms a plurality of unit substrates 113 from the bonding substrate 100. In Fig. 1, a plurality of devices described later are arranged from left to right in the second direction. In other words, the substrate to be processed is transported in the second direction, and the substrate is processed from the left to the right in the second direction. Therefore, the left side in the second direction of FIG. 1 is the upstream side in the transport direction, and the right side in the second direction of FIG. 1 is the downstream side in the transport direction.
基板加工裝置1具有劃線形成裝置3。劃線形成裝置3於貼合基板100之表面形成複數條第1劃線S1與複數條第2劃線S2。第1劃線S1與第2劃線S2相互正交。再者，將劃線加工後之基板設為貼合基板100A。
劃線形成裝置3具體而言具有：劃線單元51；輸送裝置53，其將貼合基板100向搬送方向下游側搬送；及夾盤機構55，其保持貼合基板100並使之向搬送方向兩側移動。劃線單元51具有：劃線樑51a，其沿第1方向延伸設置；劃線頭51b(圖4)，其可沿該劃線樑51a於第1方向移動；及劃線頭移動裝置51c(圖4)。輸送裝置53係皮帶輸送機。夾盤機構55具有：夾盤樑55a，其可沿第2方向向前後移動地設置於輸送裝置53之上；夾盤樑移動裝置55b(圖4)；及夾盤55c，其形成於夾盤樑55a之單側，並固持貼合基板100。藉由夾盤樑55a向劃線單元51於第1方向兩側移動，而固持於夾盤55c之貼合基板100一面通過劃線頭51b(圖4)之下方一面被劃線。The substrate processing apparatus 1 has a scribing line forming device 3. The scribing line forming device 3 forms a plurality of first scribing lines S1 and a plurality of second scribing lines S2 on the surface of the bonded substrate 100. The first scribe line S1 and the second scribe line S2 are orthogonal to each other. Furthermore, the substrate after the scribing process is used as the bonding substrate 100A.
Specifically, the scribing line forming device 3 includes a scribing unit 51, a transport device 53 that transports the bonded substrate 100 to the downstream side in the transport direction, and a chuck mechanism 55 that holds the bonded substrate 100 in the transport direction. Move on both sides. The scribing unit 51 has a scribing beam 51a extending in the first direction, a scribing head 51b (FIG. 4) movable along the scribing beam 51a in the first direction, and a scribing head moving device 51c ( Figure 4). The conveying device 53 is a belt conveyor. The chuck mechanism 55 has a chuck beam 55a that is disposed to move forward and backward along the second direction on the conveying device 53; a chuck beam moving device 55b (Fig. 4); and a chuck 55c formed on the chuck One side of the beam 55a is attached to the bonding substrate 100. The skein beam 55a is moved to both sides in the first direction by the chuck beam 55a, and the bonded substrate 100 held by the chuck 55c is scribed by the lower side of the scribe head 51b (Fig. 4).
基板加工裝置1具有基板分斷裝置5。基板分斷裝置5藉由將貼合基板100A沿複數條第1劃線S1與複數條第2劃線S2進行分斷，而形成單位基板113。基板分斷裝置5配置於劃線形成裝置3之搬送方向下游側。The substrate processing apparatus 1 has a substrate cutting device 5. The substrate cutting device 5 forms the unit substrate 113 by dividing the bonded substrate 100A along the plurality of first scribe lines S1 and the plurality of second scribe lines S2. The substrate cutting device 5 is disposed on the downstream side in the conveying direction of the scribing line forming device 3.
基板分斷裝置5具有第1分斷裝置7。第1分斷裝置7藉由將貼合基板100A沿複數條第1劃線S1進行分斷，而形成複數個短條狀基板111。第1分斷裝置7沿第1方向平行地延伸，對準於貼合基板100A之複數條第1劃線S1，於搬送方向反覆進行移動/分斷。
基板分斷裝置5如圖2所示，具有基板吸附旋轉裝置201(基板吸附裝置之一例)。基板吸附旋轉裝置201，使複數個短條狀基板111於俯視下旋轉90度(後述)。The substrate cutting device 5 has a first breaking device 7. The first breaking device 7 forms a plurality of short strip substrates 111 by dividing the bonded substrate 100A along a plurality of first scribe lines S1. The first breaking device 7 extends in parallel in the first direction, and is aligned with the plurality of first scribe lines S1 of the bonded substrate 100A, and is repeatedly moved/disconnected in the transport direction.
As shown in FIG. 2, the substrate cutting device 5 includes a substrate adsorption rotating device 201 (an example of a substrate adsorption device). The substrate adsorption rotating device 201 rotates a plurality of short strip substrates 111 by 90 degrees in a plan view (described later).
基板分斷裝置5具有第2分斷裝置9。第2分斷裝置9配置於第1分斷裝置7之搬送方向下游側，並藉由將複數個短條狀基板111沿第2劃線S2分斷，而形成複數個單位基板113。第2分斷裝置9沿第1方向平行地延伸，並對準複數個短條狀基板111之複數條第2劃線S2，於搬送方向反覆進行移動/分斷。
基板加工裝置1具有拾取裝置11。拾取裝置11拾取複數個單位基板113並搬送至其他裝置13。The substrate cutting device 5 has a second breaking device 9. The second breaking device 9 is disposed on the downstream side in the conveying direction of the first breaking device 7, and a plurality of unit substrates 113 are formed by dividing the plurality of short strip substrates 111 along the second scribe line S2. The second breaking device 9 extends in parallel in the first direction, and aligns the plurality of second scribe lines S2 of the plurality of short strip substrates 111, and repeatedly moves/breaks in the transport direction.
The substrate processing apparatus 1 has a pickup device 11. The pickup device 11 picks up a plurality of unit substrates 113 and transports them to the other devices 13.
其次，說明用於搬送基板之搬送裝置29。搬送裝置29係以劃線形成裝置3、第1分斷裝置7、第2分斷裝置9、及拾取裝置11之順序搬送基板。
具體而言，搬送裝置29具有第1輸送裝置41、第2輸送裝置43、及第3輸送裝置45。第1輸送裝置41於劃線形成裝置3與第1分斷裝置7之間延伸。第2輸送裝置43於第1分斷裝置7與第2分斷裝置9之間延伸。第3輸送裝置45於第2分斷裝置9與拾取裝置11之間延伸。Next, the conveying device 29 for conveying the substrate will be described. The conveying device 29 conveys the substrates in the order of the scribing line forming device 3, the first breaking device 7, the second breaking device 9, and the picking device 11.
Specifically, the transport device 29 includes a first transport device 41 , a second transport device 43 , and a third transport device 45 . The first conveying device 41 extends between the scribing forming device 3 and the first breaking device 7. The second transport device 43 extends between the first breaking device 7 and the second breaking device 9. The third conveying device 45 extends between the second breaking device 9 and the pickup device 11.
如圖3所示，第1輸送裝置41具有第1皮帶41a、複數個輥41b、及第1馬達41c(圖4)。複數個輥41b中之搬送方向上游側者及搬送方向下游側者，於特定範圍內可於搬送方向前後移動。
如圖3所示，第2輸送裝置43具有第2皮帶43a(搬送裝置之一例)、複數個輥43b、及第2馬達43c(圖4)。複數個輥43b中之搬送方向上游側者及搬送方向下游側者，於特定範圍內可於搬送方向前後移動。As shown in Fig. 3, the first transport device 41 has a first belt 41a, a plurality of rollers 41b, and a first motor 41c (Fig. 4). Among the plurality of rollers 41b, the upstream side in the transport direction and the downstream side in the transport direction can be moved back and forth in the transport direction within a specific range.
As shown in Fig. 3, the second transport device 43 includes a second belt 43a (an example of a transport device), a plurality of rollers 43b, and a second motor 43c (Fig. 4). Among the plurality of rollers 43b, the upstream side in the transport direction and the downstream side in the transport direction can move back and forth in the transport direction within a specific range.
如圖3所示，第3輸送裝置45具有第3皮帶45a、複數個輥45b、及第3馬達45c(圖4)。複數個輥45b中之搬送方向上游側者與搬送方向下游側者於特定範圍內可於搬送方向前後移動。
如圖3所示，第1皮帶41a之上表面部之搬送方向下游側端、與第2皮帶43a之上表面部之搬送方向上游側端隔著微小之間隙而接近。第2皮帶43a之上表面部之搬送方向下游側端、與第3皮帶45a之上表面部之搬送方向上游側端隔著微小之間隙而接近。As shown in Fig. 3, the third transport device 45 has a third belt 45a, a plurality of rollers 45b, and a third motor 45c (Fig. 4). In the plurality of rollers 45b, the upstream side in the transport direction and the downstream side in the transport direction are movable forward and backward in the transport direction within a specific range.
As shown in Fig. 3, the downstream end of the upper surface of the first belt 41a in the conveying direction and the upstream end of the upper surface of the second belt 43a in the conveying direction are close to each other with a slight gap therebetween. The downstream end of the upper surface of the second belt 43a in the conveying direction and the upstream end of the upper surface of the third belt 45a in the conveying direction are close to each other with a slight gap therebetween.
藉由上述之構成，於基板加工裝置1中，於第1分斷裝置7分割貼合基板100A而形成複數個短條狀基板111時，與此同時第2分斷裝置9可分割複數個短條狀基板111而形成複數個單位基板113。因此，基板加工裝置1之形成單位基板113之能力較先前以來提高。According to the above configuration, in the substrate processing apparatus 1, when the plurality of short strip substrates 111 are formed by dividing the bonded substrate 100A by the first breaking device 7, the second breaking device 9 can be divided into a plurality of short A plurality of unit substrates 113 are formed by the strip substrate 111. Therefore, the ability of the substrate processing apparatus 1 to form the unit substrate 113 is improved as compared with the prior art.
(2)基板加工裝置之控制構成
使用圖4說明基板加工裝置1之控制構成。圖4係表示基板加工裝置之控制構成之方塊圖。
基板加工裝置1具有控制器50。控制器50係電腦系統，其具有處理器(例如CPU(Central Processing Unit：中央處理單元))、記憶裝置(例如ROM(Read Only Memory：唯讀記憶體)、RAM(Random Access Memory：隨機存取記憶體)、HDD(Hard Disk Drive：硬碟驅動器)、及SSD(Solid State Drive：固態驅動器)等)、及各種介面(例如A/D(analog to digital，類比-數位)轉換器、D/A(digital to analog，數位-類比)轉換器、及通信介面等)。控制器50藉由執行保存於記憶部(對應於記憶裝置之記憶區域之一部分或全部)之程式而進行各種控制動作。(2) Control Structure of Substrate Processing Apparatus The control structure of the substrate processing apparatus 1 will be described with reference to Fig. 4 . Fig. 4 is a block diagram showing the control structure of the substrate processing apparatus.
The substrate processing apparatus 1 has a controller 50. The controller 50 is a computer system having a processor (for example, a CPU (Central Processing Unit)) and a memory device (for example, ROM (Read Only Memory), RAM (Random Access Memory) Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), and various interfaces (such as A/D (analog to digital) converter, D/) A (digital to analog, digital-to-analog converter), and communication interface. The controller 50 performs various control operations by executing a program stored in the memory unit (corresponding to part or all of the memory area of the memory device).
控制器50可由單一之處理器構成，亦可由用於各控制而獨立之複數個處理器構成。
控制器50之各要素之功能之一部分或全部亦可作為可於構成控制器50之電腦系統中執行之程式而實現。此外，控制器50之各要素之功能之一部分亦可藉由客製IC(Integrated circuit：積體電路)構成。The controller 50 may be composed of a single processor or a plurality of processors independent of each control.
Some or all of the functions of the various elements of the controller 50 may also be implemented as a program executable in the computer system that constitutes the controller 50. Further, part of the functions of the respective elements of the controller 50 may be constituted by a custom IC (integrated circuit).
如圖4所示，於控制器50連接有劃線單元51(劃線頭51b、劃線頭移動裝置51c)、夾盤機構55(夾盤樑移動裝置55b、夾盤55c)、第1輸送裝置41之第1馬達41c、第2輸送裝置43之第2馬達43c、及第3輸送裝置45之第3馬達45c。於控制器50進而連接有第1分斷裝置7、與第2分斷裝置9。
於控制器50，雖無圖示，但連接有檢測基板之大小、形狀及位置之感測器、用於檢測各裝置之狀態之感測器、及開關、以及資訊輸入裝置。As shown in FIG. 4, the controller 50 is connected to the scribing unit 51 (the scribing head 51b, the scribing head moving device 51c), the chuck mechanism 55 (the chuck beam moving device 55b, the chuck 55c), and the first conveying. The first motor 41c of the device 41, the second motor 43c of the second conveyor 43, and the third motor 45c of the third conveyor 45. Further, the controller 50 is connected to the first breaking device 7 and the second breaking device 9.
The controller 50 is connected to a sensor for detecting the size, shape, and position of the substrate, a sensor for detecting the state of each device, a switch, and an information input device, although not shown.
(3)基板吸附旋轉裝置之構成
使用圖5及圖6，說明基板吸附旋轉裝置201。圖5係基板吸附旋轉裝置之立體圖。圖6係基板吸附旋轉裝置之部分立體圖。
基板吸附旋轉裝置201係吸附複數個短條狀基板111並將其自第2皮帶43a提昇，於水平方向旋轉90°，其後再載置於第2皮帶43a之裝置。
基板吸附旋轉裝置201具有吸附構造體205。吸附構造體205係一併吸附複數個短條狀基板111之吸附部。
基板吸附旋轉裝置201具有上下驅動機構207(提昇部之一例)。上下驅動機構207使吸附構造體205進行升降。
基板吸附旋轉裝置201具有旋轉機構209。旋轉機構209使吸附構造體205以鉛垂軸為中心旋轉90度。上下驅動機構207及旋轉機構209設置於樑211。
基板吸附旋轉裝置201具有吸引裝置213。吸引裝置213係具有真空泵等，並產生負壓之機構。(3) Configuration of Substrate Adsorption Rotation Device The substrate adsorption rotation device 201 will be described with reference to FIGS. 5 and 6 . Figure 5 is a perspective view of a substrate adsorption rotating device. Figure 6 is a partial perspective view of the substrate adsorption rotating device.
The substrate adsorption rotating device 201 is a device that adsorbs a plurality of short strip-shaped substrates 111 and lifts them from the second belt 43a, rotates them by 90° in the horizontal direction, and then loads them on the second belt 43a.
The substrate adsorption rotating device 201 has an adsorption structure 205. The adsorption structure 205 adsorbs the adsorption portions of the plurality of short strip substrates 111 at the same time.
The substrate adsorption rotating device 201 has an up-and-down driving mechanism 207 (an example of a lifting portion). The vertical drive mechanism 207 raises and lowers the adsorption structure 205.
The substrate adsorption rotating device 201 has a rotation mechanism 209. The rotation mechanism 209 rotates the adsorption structure 205 by 90 degrees around the vertical axis. The vertical drive mechanism 207 and the rotation mechanism 209 are provided on the beam 211.
The substrate adsorption rotating device 201 has a suction device 213. The suction device 213 is a mechanism that has a vacuum pump or the like and generates a negative pressure.
如圖4所示，上下驅動機構207、旋轉機構209、吸引裝置213係連接於控制器50。As shown in FIG. 4, the vertical drive mechanism 207, the rotation mechanism 209, and the suction device 213 are connected to the controller 50.
使用圖7說明吸附構造體205。圖7係吸附構造體之示意性剖視圖。
吸附構造體205係用於吸附複數個短條狀基板111之構造體。吸附構造體205為俯視下正方形之較薄之構件。
如圖7所示，吸附構造體205具有板狀之蜂窩多孔質體221。蜂窩多孔質體221之下表面221a係沿水平方向延伸之平坦面。
如圖7所示，吸附構造體205具有包圍蜂窩多孔質體221之側面及上表面之框架構件223(吸引部之一例)。框架構件223具有連接於吸引裝置213之端口224。藉由以上之構成，實現產生負壓之吸引部。The adsorption structure 205 will be described using FIG. Fig. 7 is a schematic cross-sectional view showing an adsorption structure.
The adsorption structure 205 is a structure for adsorbing a plurality of short strip substrates 111. The adsorption structure 205 is a thin member that is square in plan view.
As shown in FIG. 7, the adsorption structure 205 has a plate-shaped honeycomb porous body 221 . The lower surface 221a of the honeycomb porous body 221 is a flat surface extending in the horizontal direction.
As shown in FIG. 7, the adsorption structure 205 has a frame member 223 (an example of a suction portion) that surrounds the side surface and the upper surface of the honeycomb porous body 221. The frame member 223 has a port 224 that is coupled to the suction device 213. With the above configuration, the suction portion that generates the negative pressure is realized.
如圖7所示，吸附構造體205具有貼附於蜂窩多孔質體221之下表面之多孔質吸附板225。多孔質吸附板225維持沿水平方向延伸之平坦之形狀。
具體而言，多孔質吸附板225係橡膠製。因此，製造成本相對低價。As shown in FIG. 7, the adsorption structure 205 has a porous adsorption plate 225 attached to the lower surface of the honeycomb porous body 221. The porous adsorption plate 225 maintains a flat shape extending in the horizontal direction.
Specifically, the porous adsorption plate 225 is made of rubber. Therefore, the manufacturing cost is relatively low.
更具體而言，多孔質吸附板225係聚胺基甲酸酯橡膠，硬度為60°(Asker C型硬度計)，氣孔直徑為10～60 μm，孔隙率為70%。作為一例，多孔質吸附板225包含Ruby cell(註冊商標)。
多孔質吸附板225係厚度為1～3 mm之薄板形狀。如此般因多孔質吸附板225之剛性變低，故可減少洩漏。More specifically, the porous adsorbing plate 225 is a polyurethane rubber having a hardness of 60° (Asker C type hardness meter), a pore diameter of 10 to 60 μm, and a porosity of 70%. As an example, the porous adsorption plate 225 includes a Ruby cell (registered trademark).
The porous adsorption plate 225 is in the form of a thin plate having a thickness of 1 to 3 mm. As a result, the rigidity of the porous adsorbing plate 225 is lowered, so that leakage can be reduced.
(4)基板吸附旋轉裝置之動作
說明基板吸附旋轉裝置201之動作。以下之動作係控制器50之控制動作。
首先，藉由上下驅動機構207而吸附構造體205下降，多孔質吸附板225抵接於複數個短條狀基板111之上表面。
接著，吸附構造體205吸附複數個短條狀基板111。
接著，吸附構造體205上升，吸附構造體205將複數個短條狀基板111自第2皮帶43a提昇。(4) Operation of the substrate adsorption rotating device The operation of the substrate adsorption rotating device 201 will be described. The following actions are the control actions of the controller 50.
First, the adsorption structure 205 is lowered by the vertical drive mechanism 207, and the porous adsorption plate 225 abuts against the upper surface of the plurality of short strip substrates 111.
Next, the adsorption structure 205 adsorbs a plurality of short strip substrates 111.
Next, the adsorption structure 205 is raised, and the adsorption structure 205 lifts the plurality of short strip substrates 111 from the second belt 43a.
接著，吸附構造體205藉由旋轉機構209旋轉90度，並使複數個短條狀基板111旋轉。
接著，藉由上下驅動機構207而吸附構造體205下降，複數個短條狀基板111載置於第2皮帶43a之搬送面。
最後，吸附構造體205解除複數個短條狀基板111之吸附。Next, the adsorption structure 205 is rotated by 90 degrees by the rotation mechanism 209, and a plurality of short strip substrates 111 are rotated.
Then, the adsorption structure 205 is lowered by the vertical drive mechanism 207, and a plurality of short strip substrates 111 are placed on the transfer surface of the second belt 43a.
Finally, the adsorption structure 205 releases the adsorption of the plurality of short strip substrates 111.
於此裝置中，短條狀基板111雖載置於具有凹凸之第2皮帶43a之上，但因多孔質吸附板225具有柔軟性，故使吸附短條狀基板111時之洩漏減少。其理由在於，即使短條狀基板111之姿勢並非為水平狀態，但多孔質吸附板225亦密著於短條狀基板111之表面整體。In this apparatus, the short strip substrate 111 is placed on the second belt 43a having irregularities. However, since the porous adsorbing plate 225 has flexibility, the leakage when the short strip substrate 111 is adsorbed is reduced. The reason is that even if the posture of the short strip substrate 111 is not horizontal, the porous adsorption plate 225 is adhered to the entire surface of the short strip substrate 111.
使用圖8及圖9，說明一例，圖8及圖9係表示多孔質吸附板密著於皮帶輸送機上之基板之狀態之示意性剖視圖。再者，於圖8及圖9中，為了便於說明而突出表示特徵。
如圖8所示，於第2皮帶43a之下，設置有自下方支持第2皮帶43a之支持構件43d。支持構件43d係例如沿第1方向延伸之較薄之板，且上端面抵接於第2皮帶43a之下表面。因此，如圖8所示，第2皮帶43a以產生起伏之方式彎曲，短條狀基板111亦追隨於此以產生起伏之方式彎曲。
如圖9所示，若基板吸附旋轉裝置201之多孔質吸附板225自上方密著於短條狀基板111，則多孔質吸附板225藉由進行彈性變形而密著於短條狀基板111之上表面整體。即，於短條狀基板111產生起伏之情形時，多孔質吸附板225亦遍及短條狀基板111之整面進行密著吸附。自以上之結果，吸附短條狀基板111時之洩漏減少。
作為其他例，於短條狀基板111非水平而傾斜地配置之情形時，亦可獲得與上述相同之效果。An example will be described with reference to FIGS. 8 and 9 , and FIGS. 8 and 9 are schematic cross-sectional views showing a state in which the porous adsorption plate is adhered to the substrate on the belt conveyor. In addition, in FIGS. 8 and 9, features are highlighted for convenience of explanation.
As shown in Fig. 8, below the second belt 43a, a support member 43d that supports the second belt 43a from below is provided. The support member 43d is, for example, a thin plate extending in the first direction, and the upper end surface abuts against the lower surface of the second belt 43a. Therefore, as shown in FIG. 8, the second belt 43a is bent in such a manner as to cause undulations, and the short-length substrate 111 is also bent to cause undulation.
As shown in FIG. 9, when the porous adsorption plate 225 of the substrate adsorption rotating device 201 is adhered to the short strip substrate 111 from above, the porous adsorption plate 225 is adhered to the short strip substrate 111 by elastic deformation. The upper surface is overall. That is, when the short strip substrate 111 is undulated, the porous adsorbing plate 225 is also closely adhered to the entire surface of the short strip substrate 111. As a result of the above, the leakage when the short strip substrate 111 is adsorbed is reduced.
As another example, when the short strip substrate 111 is disposed in a non-horizontal and oblique manner, the same effects as described above can be obtained.
2.其他實施形態
以上，雖已對本發明之一實施形態進行說明，但本發明並非限定於上述實施形態，可於不脫離發明要旨之範圍內進行各種變更。尤其，本說明書所記載之複數個實施形態及變化例係可根據需要任意組合。2. Other Embodiments Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications may be made without departing from the scope of the invention. In particular, the plurality of embodiments and variations described in the present specification can be arbitrarily combined as needed.
(1)基板之變化例
於貼合2片脆性材料基板而成之貼合脆性材料基板，包含：平面顯示面板，其為貼合玻璃基板而成之液晶面板、電漿顯示器面板、有機EL(Electro Luminescence：電致發光)顯示器面板等；及半導體基板，其係將矽基板、藍寶石基板等貼合於玻璃基板而成。
基板之種類並無特別限定。基板包含單板之玻璃、半導體晶圓、及陶瓷基板。(1) A variation of the substrate is a bonded brittle material substrate obtained by bonding two brittle material substrates, and includes a flat display panel, which is a liquid crystal panel, a plasma display panel, and an organic EL which are bonded to a glass substrate. Electro Luminescence: a display panel or the like; and a semiconductor substrate obtained by bonding a germanium substrate, a sapphire substrate, or the like to a glass substrate.
The type of the substrate is not particularly limited. The substrate comprises a single-plate glass, a semiconductor wafer, and a ceramic substrate.
(2)各種裝置之變化例
載置基板之載置部亦可為皮帶輸送機以外。
一次吸附及旋轉之基板亦可為1片。
多孔質吸附板可應用於吸附基板並搬送至其他場所之基板搬送裝置。
多孔質吸附板可應用於載置基板之平台。
多孔質吸附板亦可構成下方具有開放之空洞部之殼體之下表面。
[產業上之可利用性](2) Variation of Various Devices The mounting portion on which the substrate is placed may be other than the belt conveyor.
The substrate for one adsorption and rotation can also be one piece.
The porous adsorption plate can be applied to a substrate transfer device that adsorbs a substrate and transports it to another place.
The porous adsorption plate can be applied to a platform on which a substrate is placed.
The porous adsorbing plate may also constitute a lower surface of the casing having an open cavity below.
[Industrial availability]
本發明可廣泛應用於基板吸附裝置。The invention can be widely applied to a substrate adsorption device.
1‧‧‧基板加工裝置1‧‧‧Substrate processing device
3‧‧‧劃線形成裝置 3‧‧‧ scribing device
5‧‧‧基板分斷裝置 5‧‧‧Substrate breaking device
7‧‧‧第1分斷裝置 7‧‧‧1st breaking device
9‧‧‧第2分斷裝置 9‧‧‧2nd breaking device
11‧‧‧拾取裝置 11‧‧‧ picking device
13‧‧‧其他裝置 13‧‧‧Other devices
29‧‧‧搬送裝置 29‧‧‧Transporting device
41‧‧‧第1皮帶輸送裝置 41‧‧‧1st belt conveyor
41a‧‧‧第1皮帶 41a‧‧‧1st belt
41b‧‧‧輥 41b‧‧‧roll
41c‧‧‧第1馬達 41c‧‧‧1st motor
43‧‧‧第2皮帶輸送裝置 43‧‧‧2nd belt conveyor
43a‧‧‧第2皮帶 43a‧‧‧2nd belt
43b‧‧‧輥 43b‧‧‧roll
43c‧‧‧第2馬達 43c‧‧‧2nd motor
43d‧‧‧支持構件 43d‧‧‧Support components
45‧‧‧第3皮帶輸送裝置 45‧‧‧3rd belt conveyor
45a‧‧‧第3皮帶 45a‧‧‧3rd belt
45b‧‧‧輥 45b‧‧‧roll
45c‧‧‧第3馬達 45c‧‧‧3rd motor
50‧‧‧控制器 50‧‧‧ Controller
51‧‧‧劃線單元 51‧‧‧Drawing unit
51a‧‧‧劃線樑 51a‧‧‧Drawing beam
51b‧‧‧劃線頭 51b‧‧‧Drawing head
51c‧‧‧劃線頭移動裝置 51c‧‧‧Scribing head mobile device
53‧‧‧輸送裝置 53‧‧‧Conveyor
55‧‧‧夾盤機構 55‧‧‧ chuck mechanism
55a‧‧‧夾盤樑 55a‧‧‧Chuck beam
55b‧‧‧夾盤樑移動裝置 55b‧‧‧Clamp beam moving device
55c‧‧‧夾盤 55c‧‧‧ chuck
100‧‧‧貼合基板 100‧‧‧Fixed substrate
100A‧‧‧貼合基板 100A‧‧‧Finished substrate
111‧‧‧短條狀基板 111‧‧‧ Short strip substrate
113‧‧‧單位基板 113‧‧‧unit substrate
201‧‧‧基板吸附旋轉裝置 201‧‧‧Substrate adsorption rotating device
205‧‧‧吸附構造體 205‧‧‧Adsorption structure
207‧‧‧上下驅動機構 207‧‧‧Up and down drive mechanism
209‧‧‧旋轉機構 209‧‧‧Rotating mechanism
211‧‧‧樑 211‧‧ ‧ beams
213‧‧‧吸引裝置 213‧‧‧Attraction device
221‧‧‧蜂窩多孔質體 221‧‧‧ Honeycomb porous body
221a‧‧‧蜂窩多孔質體之小表面 221a‧‧‧Small surface of honeycomb porous body
223‧‧‧框架構件 223‧‧‧Frame components
224‧‧‧端口 224‧‧‧port
225‧‧‧多孔質吸附板 225‧‧‧Porous adsorption board
S1‧‧‧第1劃線 S1‧‧‧1st line
S2‧‧‧第2劃線 S2‧‧‧2nd line
X‧‧‧箭頭(第1方向) X‧‧‧ arrow (first direction)
Y‧‧‧箭頭(第2方向) Y‧‧‧ arrow (2nd direction)
圖1係本發明之第1實施形態之基板加工裝置之示意性俯視圖。Fig. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention.
圖2係基板分斷裝置之示意性立體圖。 2 is a schematic perspective view of a substrate breaking device.
圖3係基板分斷裝置之示意性側視圖。 Figure 3 is a schematic side view of a substrate breaking device.
圖4係顯示基板加工裝置之控制構成之方塊圖。 Fig. 4 is a block diagram showing the control structure of the substrate processing apparatus.
圖5係基板吸附旋轉裝置之立體圖。 Figure 5 is a perspective view of a substrate adsorption rotating device.
圖6係基板吸附旋轉裝置之部分立體圖。 Figure 6 is a partial perspective view of the substrate adsorption rotating device.
圖7係吸附構造體之示意性剖視圖。 Fig. 7 is a schematic cross-sectional view showing an adsorption structure.
圖8係表示多孔質吸附板密著於皮帶輸送機上之基板之狀態之示意性剖視圖。 Fig. 8 is a schematic cross-sectional view showing a state in which a porous adsorbing plate is adhered to a substrate on a belt conveyor.
圖9係表示多孔質吸附板密著於皮帶輸送機上之基板之狀態之示意性剖視圖。 Fig. 9 is a schematic cross-sectional view showing a state in which a porous adsorbing plate is adhered to a substrate on a belt conveyor.
Claims (4)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017230254A JP2019102584A (en) | 2017-11-30 | 2017-11-30 | Substrate suction device |
| JP2017-230254 | 2017-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201930167A true TW201930167A (en) | 2019-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107142631A TW201930167A (en) | 2017-11-30 | 2018-11-29 | Substrate sucking device capable of sucking substrate with less leakage |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019102584A (en) |
| KR (1) | KR20190064463A (en) |
| CN (1) | CN109872966A (en) |
| TW (1) | TW201930167A (en) |
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- 2017-11-30 JP JP2017230254A patent/JP2019102584A/en active Pending
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| KR20190064463A (en) | 2019-06-10 |
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