JP2014130899A - Substrate conveyance device, substrate inspection apparatus, and substrate conveyance method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate conveyance device capable of detecting that a substrate is placed on arms in a corrected state when conveyed.SOLUTION: A wafer conveyance device 2 comprises: arms 8; suction pads 41; vacuum suction pads 42a; and friction members 42. Each arm 8 has flow channels 43 and 44, and holds a wafer W with a bottom surface of the wafer W. Each suction pad 41 is arranged on a holding surface 8s of the arm 8, for holding the wafer W, and generates negative pressure between the holding surface 8s and the wafer W. Each vacuum suction pad 42a arranged on the holding surface 8s has an opening 42a2 to which the bottom surface of the wafer W is tightly attached when air is sucked through the opening 42a2 by evacuating the inside of the flow channel 44, and detects whether the wafer W is tightly attached to the opening 42a2. Friction members 42 arranged on the holding surface 8s prevent the wafer W attached to the holding surface 8s from side-slipping in a direction parallel to the holding surface 8s by utilizing friction generated when contacting with the wafer W.

Description

  The present invention relates to a substrate transfer apparatus, a substrate inspection apparatus, and a substrate transfer method, and more particularly to a substrate transfer apparatus, a substrate inspection apparatus, and a substrate transfer method for transferring a substrate such as a semiconductor wafer.

  Conventionally, in a semiconductor manufacturing process, various processing processes are performed on a substrate in a manufacturing apparatus, and the substrate is inspected. In recent years, substrates such as wafers have been increased in size and thickness, and various devices have been proposed for reliably transporting a substrate that is warped or bent in the manufacturing process.

  For example, as disclosed in Japanese Patent Application Laid-Open No. 2010-135381, there is a substrate inspection apparatus in which a wafer is attracted and held on a mounting surface of an arm. In the substrate inspection layer apparatus, a wafer is taken out from a wafer cassette, and macro inspection by visual inspection and micro inspection by a microscope are performed. The wafer is mounted on an arm as a transfer means, and is transferred from the wafer cassette to the inspection mounting table, from the mounting table to another mounting table, and from the mounting table to the wafer cassette.

  Japanese Patent No. 4299104 discloses a substrate transfer apparatus for transferring a wafer using negative pressure generating means.

JP 2010-135381 A Japanese Patent No. 4299104

  However, if the wafer is not placed on the arm so that the warpage or deflection of the wafer is corrected, the wafer may drop from the arm during wafer transfer, or the wafer may be in a wafer cassette, placement table, etc. There is also a risk of contact and damage.

  In the inspection apparatus according to the proposal as described above, even if the wafer is attracted, it cannot be detected whether the wafer is placed on the arm with the warpage corrected. When the wafer is transported, the wafer may come into contact with the wafer cassette, the mounting table or the like and be damaged.

  Accordingly, an object of the present invention is to provide a substrate transfer device, a substrate inspection device, and a substrate transfer method that can detect that the substrate is placed on the arm in a corrected state during substrate transfer. And

  The substrate transfer device of one embodiment of the present invention includes a first channel and a second channel, and an arm that holds the substrate on the lower surface of the substrate and a holding surface that holds the substrate on the arm. The first opening is provided, and a predetermined gas is supplied through the first flow path, and the predetermined gas is blown out from the first opening, whereby the substrate is A negative pressure generating portion for generating a negative pressure between the holding surface and the substrate, and a second opening provided on the holding surface so as to be adsorbed to the holding surface; By vacuuming the inside of the flow path, suction from the second opening is performed, the lower surface of the substrate is adsorbed to the second opening, and the substrate is adsorbed to the second opening. A vacuum suction pad for detecting whether or not it is provided on the holding surface and is in contact with the substrate The friction, having a friction member for the substrate attracted to the holding surface so as not to skid in a direction parallel of the holding surface.

  The board | substrate inspection apparatus of 1 aspect of this invention contains the board | substrate conveyance apparatus of this invention, and the test | inspection part which test | inspects the board | substrate conveyed by the said board | substrate conveyance apparatus.

  A substrate transport method according to an aspect of the present invention includes a negative pressure generation unit, a vacuum suction pad, and a friction member, and the substrate is transported by an arm that holds the substrate on a lower surface of the substrate. A predetermined gas is supplied through the first flow path by the negative pressure generating portion provided on the holding surface for holding the substrate and having the first opening, and the predetermined opening is supplied from the first opening. The negative pressure is generated between the holding surface and the substrate so that the substrate is adsorbed to the holding surface by blowing out the gas, and the vacuum having the second opening is provided on the holding surface. A suction pad is used to evacuate the inside of the second flow path so that suction from the second opening is performed so that the lower surface of the substrate is adsorbed to the second opening, and the substrate is moved to the second opening. Detects whether it is adsorbed to the opening of And the friction member provided on the holding surface prevents the substrate adsorbed on the holding surface from slipping in a direction parallel to the holding surface due to friction when contacting the substrate. Transport.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate conveyance apparatus, board | substrate inspection apparatus, and board | substrate conveyance method which can detect that the board | substrate is mounted on the arm in the state where it was correct | amended at the time of board | substrate conveyance are realizable. .

It is a top view for demonstrating the structure of the wafer inspection apparatus concerning embodiment of this invention. It is a perspective view of arms 8a and 8b connected to arm support part 9 concerning an embodiment of the invention. It is a perspective view from the diagonally downward direction of the arm 8 concerning embodiment of this invention. It is a perspective view of the suction pad 41, the friction member 42, and the vacuum suction pad 42a which were provided on the holding surface of the arm concerning embodiment of this invention. It is a side view of the arm 8 concerning embodiment of this invention. It is a figure for demonstrating the state of the wafer W mounted on the arm 8 concerning embodiment of this invention.

Embodiments of the present invention will be described below with reference to the drawings.
In each drawing used for the following description, the scale is different for each component in order to make each component large enough to be recognized on the drawing. It is not limited only to the quantity of the component described in the drawing, the shape of the component, the ratio of the size of the component, and the relative positional relationship of each component.
(overall structure)
FIG. 1 is a plan view for explaining the configuration of the wafer inspection apparatus according to the present embodiment. The wafer inspection apparatus 1 includes a wafer transfer apparatus 2, a wafer cassette 3, a macro inspection section 4 that performs a macro inspection of a wafer W (indicated by a two-dot chain line) that is an inspection object transferred by the wafer transfer apparatus 2, and a wafer A substrate inspection apparatus including a micro inspection unit 5 that performs W micro inspection and an operation unit 6.

  The wafer transfer apparatus 2 which is a substrate transfer apparatus includes an arm drive unit 7 described later and four arms 8a, 8b, 8c, and 8d (hereinafter referred to as an arm 8 when referring to all or one of the four arms). ) And an arm support portion 9 that supports the four arms 8. The two arms 8a and 8b are provided on the arm support portion 9 so as to extend from one side surface of the arm support portion 9, and the two arms 8c and 8d are the side surfaces from which the arms 8a and 8b extend. The arm support portion 9 is provided so as to extend from the opposite side surface.

  The operation unit 6 includes an input device 6a such as a keyboard and a display device 6b such as a liquid crystal display device. The inspector can instruct the operations of the wafer transfer device 2, the macro inspection unit 4, and the micro inspection unit 5 by inputting various instruction commands from the input device 6a while viewing the screen displayed on the display device 6b. it can.

  The arm driving unit 7 is rotatable about a rotation axis (axis in the Z-axis direction) in which the two arms 8a and 8b and the two arms 8c and 8d are rotationally symmetric, and in the vertical direction (Z The arm support portion 9 is supported from above so as to be movable in the axial direction.

  Therefore, the arm drive unit 7 drives the arm support unit 9 so as to rotate around the rotation axis and move in the vertical direction (Z-axis direction). The four arms 8 are also rotated in the direction indicated by the arrow A1 by the rotation of the arm support portion 9, and the four arms 8 are also moved up and down by the vertical movement of the arm support portion 9.

  In the wafer cassette 3, a plurality of wafers W to be inspected are stacked in the height direction. Each wafer W, which is a substrate, has a peripheral edge portion of the wafer W supported by a peripheral edge supporting portion in the wafer cassette 3.

  Each wafer W is taken out from the wafer cassette 3 by the wafer transfer device 2, subjected to a predetermined inspection in the macro inspection unit 4 and the micro inspection unit 5, and the wafer W that has been inspected is placed in the wafer cassette 3. It is accommodated by the transport device 2. Therefore, the arm drive unit 7 is movable in the arrow A2 direction (X-axis direction) along a rail (not shown).

The macro inspection unit 4 includes a swing mechanism 4a that swings the wafer W, which is a substrate, and a wafer mounting table 4b that is used to transfer the wafer W.
The micro-inspection unit 5 is installed on the XY stage 5b, the XY stage 5b that can move in the biaxial direction, the microscope 5a for magnifying the wafer W, and moves the wafer W in the XYZ axial directions. And a wafer mounting table 5c used for delivering the wafer W.

  As described above, the arm drive unit 7 rotates the four arms 8 around the rotation axis (Z axis), moves up and down in the vertical direction (Z axis direction), or along the X axis direction. Therefore, by controlling the operation of the arm drive unit 7, the wafer W is taken out from the wafer cassette 3, and the wafer W placed on the arm 8 is accommodated in the wafer cassette 3. The wafer W can be mounted on the inspection table 4b, moved between the mounting tables 4b and 5c, and the wafer W on the mounting tables 4b and 5c can be lifted. For example, the wafer W can be carried in and out of the wafer cassette 3 by the movement of the arm drive unit 7 in the X-axis direction and the vertical movement of the arm support unit 9.

Further, the substrate inspection apparatus 1 is provided with an air supply pump 21 and a suction pump 22. In the present embodiment, the air supply pump 21 is connected to the connector 23 of the board inspection apparatus 1 to supply compressed air into the pipe line 23a provided in the board inspection apparatus 1, and the suction pump 22 is Then, it is connected to the connector 24 of the board inspection apparatus 1 and sucks the air in the conduit 24 a disposed in the board inspection apparatus 1. A vacuum sensor 26 is provided in the pipe line 24a so that the vacuum state in the pipe line 24a can be detected.
Note that the air supply function of the air supply pump 21 and the suction function of the suction pump 22 may be realized using one pump.

  The substrate inspection apparatus 1 includes a control unit 25 that controls conveyance of a wafer W that is a substrate, and the control unit 25 includes a central processing unit (CPU) and storage devices such as ROM and RAM. The control unit 25 is connected to the wafer transfer device 2, the macro inspection unit 4, and the micro inspection unit 5, and the control unit 25 causes a predetermined program to be executed according to the inspection instruction input to the operation unit 6. Thus, control of the wafer transfer device 2, the macro inspection unit 4, and the micro inspection unit 5 is executed. Furthermore, a vacuum sensor 26 is also connected to the control unit 25. As will be described later, the control unit 25 controls the operations of the wafer transfer device 2, the air supply pump 21, and the suction pump 22 during the transfer of the wafer W, and places the wafer W on the arm 8 in a corrected state. It is detected whether it is placed. In particular, the control unit 25 can control the air supply via the pipe line 23a and the suction via the pipe line 24a independently of each other.

An example of an inspection procedure will be described.
Under the control of the control unit 25, the wafer transfer device 2 takes out the wafer W from the wafer cassette 3 and places it on the mounting table 4b. The swing mechanism 4a of the macro inspection unit 4 lifts and swings the wafer W placed on the wafer mounting table 4b, and visual inspection (that is, macro inspection) is performed by the inspector. At this time, the arm drive unit 7 moves the arm support unit 9 downward to make the arm 8 stand by.

  When the macro inspection is completed, the wafer transfer device 2 moves the arm support 9 upward, and then rotates the arm support 9 by 180 degrees in the direction of the arrow A1, thereby causing the arms 8a, 8b and 8c, The positions of 8d are interchanged with each other.

  Next, the wafer transfer device 2 moves the wafer support portion 9 rotated 180 degrees downward to place the wafer W on the placement table 5c. Then, the XY stage 5b is controlled by the control unit 25, and by moving the XY stage 5b, magnified observation (micro observation) of the wafer W is performed using the microscope 5a while appropriately moving and rotating the wafer W. Is called. When the micro observation is completed, the XY stage 5b is moved to a position where the wafer W is delivered.

  Again, the wafer transfer device 2 moves the arm support 9 upward and then rotates it 180 degrees, so that the positions of the arms 8a and 8b and the arms 8c and 8d are interchanged. Then, the wafer transfer apparatus 2 moves the arm support unit 9 downward to place the wafer W on the mounting table 4b of the macro inspection unit 4.

In addition, after the arm support portion 9 is rotated 180 degrees from the macro inspection portion 4 to the micro inspection portion 5, another wafer W1 that has been subjected to the macro inspection is placed on the other arms 8c and 8d. When returning the wafer W after the micro inspection to the mounting table 4b, another wafer W1 can be transferred to the micro inspection section 5.
The inspection of the wafer W is performed on both surfaces of the wafer W.
(Configuration of wafer transfer device)
Next, the configuration of the wafer transfer apparatus 2 that is a substrate inspection apparatus will be described.

  2 to 5 are views for explaining the configuration of the arm 8 of the wafer transfer apparatus 2. FIG. 2 is a perspective view of the arms 8 a and 8 b connected to the arm support portion 9. FIG. 3 is a perspective view of the arm 8 from an obliquely downward direction. FIG. 4 is a perspective view of the suction pad 41, the friction member 42, and the vacuum suction pad 42a provided on the holding surface of the arm. FIG. 5 is a side view of the arm 8. Since the arms 8c and 8d have the same configuration as the arms 8a and 8b, description thereof is omitted.

  The arm 8 serving as a substrate transfer arm has a plate shape with a narrow tip portion. As shown in FIG. 5, the arm 8 is configured by bonding two plate members 31 and 32 together. The plate member 31 has an arm distal end portion 31a having a narrow width and an arm base end portion 31b having a width wider than that of the arm distal end portion 31a. The plate member 32 has a rectangular shape that is substantially the same shape as the arm base end portion 31b. Each arm 8 has two flow paths (43, 44) to be described later, and is an arm that holds a wafer W as a substrate on the lower surface of the wafer W.

  As shown in FIG. 2, a suction pad 41 as a negative pressure generating portion and a plurality of friction members 42 are provided on the distal end side of the arm base end portion 31b. One of the plurality of friction members 42 is a vacuum suction pad 42a having a suction function.

  As shown in FIG. 4, the suction pad 41 has a pair of injection ports 41 a that are openings provided in a circular recess, and the pair of injection ports 41 a communicate with the flow path 43 in the arm 8. Yes. The suction pad 41 injects compressed air supplied through the flow path 43 in a predetermined direction from the pair of injection ports 41a, and generates a negative pressure on the surface of the suction pad 41 by a swirling flow generated by the injection. By doing so, the wafer W is adsorbed.

  That is, the suction pad 41 is provided on the upper surface 8 s that is a holding surface for holding the wafer W in the arm 8, and has a pair of injection ports 41 a that are openings, and feeds a predetermined gas through the flow path 43. And a negative pressure generator that generates a negative pressure between the upper surface 8s of the arm 8 and the wafer W so as to attract the wafer W to the upper surface by blowing a predetermined gas from the pair of injection ports 41a. To do. The structure of the suction pad 41 as such a negative pressure generating part is disclosed in, for example, Japanese Patent No. 4299104 and is publicly known.

  The friction member 42 is a member having a cylindrical shape, and is a conductive rubber member. That is, the friction member 42 is provided on the upper surface 8 s that is the holding surface of the arm 8, so that the wafer W adsorbed on the upper surface 8 s does not slide in the direction parallel to the upper surface 8 s due to friction when contacting the wafer W. It is a friction member.

  As shown in FIG. 4, the vacuum suction pad 42a has a cylindrical shape, and an annular friction member 42a1 is provided at the tip, that is, the upper surface portion. An opening 42a2 formed at the center of the vacuum suction pad 42a communicates with a flow path 44 formed in the arm 8.

  That is, the vacuum suction pad 42 a is provided on the upper surface 8 s that is the holding surface of the arm 8, has the opening 42 a 2, and performs suction from the opening 42 a 2 by evacuating the inside of the flow path 44. The suction pad is used to detect whether the wafer W is attracted to the opening 42a2 by attracting the lower surface of the wafer W to the opening 42a2.

  Further, since the friction member 42a1 and the two friction members 42 on the vacuum suction pad 42a are disposed around the suction pad 41, when the wafer W is sucked by the suction pad 41, the wafer W is moved to three points. Can be supported. That is, a plurality of friction members are provided on the upper surface 8 s of the arm 8 and are provided around the suction pad 41 that is a negative pressure generating portion.

  The flow paths 43 and 44 are formed by grooves formed in at least one of the contact surfaces of the two plate members 31 and 32. One end of the flow path 43 communicates with a pair of injection ports 41 a that are openings, and the other end of the flow path 43 communicates with an opening 45 provided at a lower portion on the base end side of the arm 8. As shown in FIGS. 2 and 3, the flow path 43 and the flow path 44 are arranged so as to run in parallel in the arm 8.

One end of the flow path 44 communicates with the opening 42 a 2, and the other end of the flow path 44 communicates with the opening 46 provided in the lower portion on the proximal end side of the arm 8. The flow path 43 is connected to the pipe line 23 a connected to the air supply pump 21 through the opening 45. The flow path 44 is connected to the pipe line 24 a connected to the suction pump 22 through the opening 46.
As shown in FIG. 3, the base end portion of the arm 8 is provided with a plurality of screw holes 47 for fixing to the arm support portion 9 by screws.

  Further, as shown in FIG. 5, the height d1 of the suction pad 41 from the surface 8s of the arm 8 is lower than the height d2 of the friction member 42 and the vacuum suction pad 42a. This is because, when the wafer W is sucked by the suction pad 41, the friction members 42 and 42a1 come into firm contact with the wafer W and support the wafer W so that the wafer W does not move due to the frictional force.

In the present embodiment, the friction member 42a1 is provided on the vacuum suction pad 42a, but the friction member 42a1 may not be provided on the vacuum suction pad 42a. In that case, the height of the vacuum suction pad 42a from the holding surface 8s is higher than the height d1 of the suction pad 41.
(function)
As described above, the output of the vacuum sensor 26 connected to the flow path 24 a is input to the control unit 25. Therefore, the control unit 25 can detect that the wafer W is attracted to the opening 42a2 when the inside of the flow path 44 is evacuated.

  As shown in FIG. 2, the wafer transfer apparatus 2 transfers a wafer W, which is a substrate, on the holding surfaces 8 s (that is, the upper surfaces) of the two arms 8. When the controller 25 indicates that the output of the vacuum sensor 26 is in a vacuum state when the wafer W is placed on the upper surfaces of the two arms 8, the wafer W remains in the corrected state in the arm 8. It can be determined that it is placed on the top.

For example, when the wafer W is transferred by the two arms 8a and 8b, when the wafer W comes into close contact with both of the two openings 42a2 of the two vacuum suction pads 42a of the two arms 8a and 8b, the vacuum sensor 26a is The two vacuum suction pads 42a and one pipe line 24a are connected so as to output the vacuum state. Therefore, when the wafer W is in close contact with both of the two vacuum suction pads 42a, the control unit 25 determines that the wafer W is placed on the two arms 8a and 8b in a corrected state.
Instead of providing one vacuum sensor for the two arms 8, a vacuum sensor is provided for each of the two pipe lines connected to the two vacuum suction pads, and the outputs of the two vacuum sensors are both When an output indicating a vacuum state is obtained, the control unit 25 may determine that the wafer W is placed in a corrected state on the two arms 8a and 8b.
Although the pipe lines for the two arms 8c and 8d are not shown, the two arms 8c and 8d are the same as the two arms 8a and 8b.
This will be specifically described.
FIG. 6 is a view for explaining the state of the wafer W placed on the arm 8. In some cases, the wafer W is thin, and as shown by the two-dot chain line in FIG. 6, the wafer W warps and the suction pad 41 cannot firmly hold the lower surface of the wafer W.

  In this case, since the wafer W does not adhere to the vacuum suction pad 42a, the vacuum sensor 26 does not supply an output indicating a vacuum state to the control unit 25. In this case, the control unit 25 can determine that the wafer W has been corrected and is not placed on the arm 8. When the vacuum sensor 26 does not detect the vacuum state, the control unit 25 retries the mounting operation of the wafer W on the arm 8. That is, when the control unit 25 detects that the wafer W is not attracted to the opening 42a2 when the wafer W is transferred by the arm 8, the transfer of the wafer W is stopped again. Execute the operation.

  On the other hand, even if the wafer W is thin, as shown by the solid line in FIG. 6, when the suction pad 41 firmly sucks the lower surface of the wafer W with the wafer W corrected, the wafer is placed on the vacuum suction pad 42a. W is in close contact, and the vacuum sensor 26 supplies an output indicating a vacuum state to the control unit 25. In this case, the control unit 25 can determine that the wafer W is placed on the arm 8 in a corrected state.

  That is, by providing the vacuum suction pad 42a in the vicinity of the suction pad 41, it is possible to detect whether the wafer W is placed on the arm 8 in a corrected state.

  As described above, according to the above-described embodiment, the substrate transfer device, the substrate inspection device, and the substrate that can detect that the substrate is placed on the arm in a corrected state when the substrate is transferred. A conveyance method can be realized.

  The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Wafer inspection apparatus, 2 Wafer transfer apparatus, 3 Wafer cassette, 4 Macro inspection part, 4a Oscillation mechanism, 4b Wafer mounting base, 5 Micro inspection part, 5a Microscope, 5b XY stage 5b, 5c Wafer mounting base, 6 Operation part 6a input device, 6b display device, 7 arm drive unit, 8 (8a, 8b, 8c, 8d) arm, 9 arm support unit, 21 air supply pump, 22 suction pump, 23 connector, 23a conduit, 24 connector, 24a pipe, 25 control unit, 26 vacuum sensor, 31 plate member, 31a arm tip, 31b arm base end, 32 plate member, 41 suction pad, 41a injection port, 42 friction member, 42a vacuum suction pad, 42a1 friction Member, 42a2 opening, 43, 44 channel, 45, 46 opening, 47 screw hole.

Claims (10)

An arm having a first flow path and a second flow path and holding the substrate on a lower surface of the substrate;
The arm is provided on a holding surface for holding the substrate and has a first opening, and a predetermined gas is supplied through the first flow path, and the first opening is used to supply the gas. A negative pressure generating section that generates a negative pressure between the holding surface and the substrate so as to attract the substrate to the holding surface by blowing out a predetermined gas;
The second opening is provided on the holding surface and has a second opening, and the second flow path is evacuated to perform suction from the second opening, thereby lowering the lower surface of the substrate to the second. A vacuum suction pad for detecting whether or not the substrate is sucked into the second opening,
A friction member that is provided on the holding surface and prevents the substrate adsorbed on the holding surface from slipping in a direction parallel to the holding surface by friction when contacting the substrate;
A substrate transfer apparatus comprising:   The substrate transfer apparatus according to claim 1, wherein a height of the negative pressure generating unit from a surface of the holding surface of the arm is lower than a height of the friction member from the surface of the arm. The arm has a tip portion having a narrow width and a base end portion having a width wider than the width of the tip portion,
The substrate transfer apparatus according to claim 1, wherein the negative pressure generating unit is provided on the distal end side of the base end portion. A plurality of the friction members are provided,
The substrate transport apparatus according to claim 1, wherein the plurality of friction members are provided around the negative pressure generation unit.   5. The substrate transfer apparatus according to claim 1, wherein the first flow path and the second flow path are arranged so as to run in parallel in the arm. . A control unit for controlling conveyance of the substrate by the arm;
The said control part controls the said air_supply via the said 1st flow path, and the said suction via the said 2nd flow path independently, The Claim 1 characterized by the above-mentioned. The board | substrate conveyance apparatus of description.   The substrate according to claim 6, wherein the control unit detects that the substrate is adsorbed to the second opening when the inside of the second flow path becomes a vacuum. Conveying device.   The said control part stops conveyance of the said board | substrate, when detecting that the said board | substrate is not adsorb | sucking to the said 2nd opening part, when conveying the said board | substrate by the said arm. Item 8. The substrate transfer apparatus according to Item 7. A substrate transfer apparatus according to any one of claims 1 to 8,
An inspection unit for inspecting a substrate conveyed by the substrate conveyance device;
A board inspection apparatus comprising: In the substrate transport method, which includes a negative pressure generating unit, a vacuum suction pad, and a friction member, and transports the substrate by an arm that is held by the lower surface of the substrate.
The first opening is provided by supplying a predetermined gas through the first flow path by the negative pressure generator provided on the holding surface of the arm for holding the substrate and having the first opening. The negative gas is generated between the holding surface and the substrate so as to adsorb the substrate to the holding surface by blowing out the predetermined gas from
The vacuum suction pad provided on the holding surface and having the second opening portion performs suction from the second opening portion by evacuating the inside of the second flow path, thereby lowering the lower surface of the substrate. Detecting whether the substrate is adsorbed to the second opening by adsorbing to the second opening,
The friction member provided on the holding surface conveys the substrate so that the substrate adsorbed on the holding surface does not skid in a direction parallel to the holding surface due to friction when contacting the substrate. A substrate carrying method characterized by: