JPH0778861A - Transfer device - Google Patents

Abstract

PURPOSE:To further cut down the time required for transfer action in a transfer device carrying an objective element to a specific position by a method wherein, after delivering the objective element held by the first transfer means to the second transfer means, the second transfer means is to be shifted. CONSTITUTION:In order to deliver an objective element 10 held by the first transfer means 11 at the second transfer means 3, the second transfer means 3 can start shifting immediately after finishing the suction at the objective element 10 detecting the suction finished state of the objective element 10 according to the suction pressure of the suction means 4A, 4B of the second transfer means 3 thereby enabling the time required for the transfer action to be further cut down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device, which is suitable for application to a transfer device for transferring a transfer target such as a semiconductor substrate or a liquid crystal display plate by vacuum suction.

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing a semiconductor substrate or the like, as a transfer device for transferring the semiconductor substrate, FIG.
There is something like.

That is, in FIG. 4, reference numeral 1 denotes a carrier as a whole, and a carrier arm 3 which can move in a direction indicated by an arrow a or in a direction opposite thereto is provided, and the carrier arm 3 is as shown in FIG. It is formed in a plane U shape.

A transport table 11 (FIG. 4) is provided in a portion surrounded by the transport arm 3 so as to be movable in the downward direction indicated by the arrow b or in the upward direction opposite thereto.
Adsorption nozzles 14A and 1 are mounted on the mounting surface of the transport table 11.
4B is provided and the suction nozzles 14A and 14 are provided.
B is connected to a pipe 17 through a passage 11A formed inside the transport table 11 and a joint 16.

The pipe 17 is connected to a vacuum pump (not shown), and the vacuum pressure of the vacuum pump is applied to the pipe 1.
7 and the passage 11A to the suction nozzles 14A and 14B. Therefore, in this state, the suction nozzle 1 concerned
By mounting the semiconductor substrate 10 to be transported on the 4A and 14B, the semiconductor substrate 10 can be suction-held on the transport table 11.

On the other hand, suction nozzles 4A, 4B, 4C and 4D (FIG. 5) are provided on the mounting surface of the transfer arm 3, and the suction nozzles 4A, 4B, 4C and 4D are attached to the transfer arm 3. It is connected to the pipe 7 through the passage 3A and the joint 6 formed inside.

The pipe 7 is connected to a vacuum pump (not shown), and the vacuum pressure by the vacuum pump is applied to the suction nozzles 4A, 4B, 4C and 4 via the pipe 7 and the passage 3A.
Given to D. Therefore, in this state, by mounting the semiconductor substrate 10 to be transported on the suction nozzles 4A, 4B, 4C and 4D, the semiconductor substrate 10
Can be adsorbed and held on the transfer arm 3.

A light-shielding plate 11B for position detection is formed on a part of the transport table 11 and the light-shielding plate 11B is provided.
Comes to a position where the detection light of the optical sensor DET3 is blocked, the detection signal S3 is output from the optical sensor DET3 to the control unit 1.
8 is sent to the control panel 18,
It is possible to detect that B is in a position that blocks the optical sensor DET3 (that is, the transport table 11 is moved up to the top of the moving region in the direction opposite to the direction indicated by the arrow b).

Further, the transport table 11 is lowered to lower the light shield plate 1.
When 1B moves to a position that blocks the optical sensor DET4,
The detection signal S4 is sent from the optical sensor DET4 to the control unit 18, so that the control unit 18 causes the shielding plate 11B to block the optical sensor DET4 (that is, the transport table 1).
It is possible to detect that 1 is in a state where it has moved down to the lowermost part of the moving area in the direction indicated by the arrow b).

Here, the position of the carrying table 11 detected by the optical sensor DET4 (the lowermost part of the moving area) is determined by the semiconductor substrate 10 held on the carrying table 11 being moved downward. It is provided at a position offset downward by a predetermined amount from the position transferred on the transfer arm 3. Therefore, when the carrier table 11 holding the semiconductor substrate 10 is moved downward in the direction of the arrow b, the semiconductor substrate 10 on the carrier table 11 is first transferred onto the carrier arm 3 and then the carrier table 11 is moved by a predetermined amount. The optical sensor DET4 detects the position at the lowered position, and the control unit 18 stops the moving operation. Therefore, the semiconductor substrate 10 is surely transferred to the transfer arm 3
The lowering operation of the transport table 11 can be stopped in the state of being handed over.

On the other hand, a light-shielding plate 3B for position detection is formed on a part of the transport arm 3, and when the light-shielding plate 3B reaches a position that blocks the light detected by the optical sensor DET1,
When the detection signal S1 is sent from the optical sensor DET1 to the control unit 18, the control unit 18 causes the shield plate 3B to block the optical sensor DET1 (that is, the transport arm 3 is in the opposite direction to the direction indicated by the arrow a). It is possible to detect that the robot has moved to the maximum movement position).

Further, when the transfer arm 3 moves in the direction of arrow a and the light blocking plate 3B moves to a position where it blocks the optical sensor DET2, the detection signal S2 is sent from the optical sensor DET2 to the control section 18, thereby controlling The portion 18 is the shield plate 3.
It is possible to detect that B is in a position that blocks the optical sensor DET2 (that is, the state in which the transport arm 3 has moved to the maximum movement position in the direction indicated by the arrow a).

Here, at the position of the transfer arm 3 detected by the optical sensor DET1 (the maximum movement position of the movement area with respect to the arrow a), the semiconductor substrate 10 held on the transfer table 11 is lowered. It is provided at a position where it is transferred onto the transfer arm 3 by movement. Therefore, the transfer arm 3 whose position is detected by the optical sensor DET1 is stopped by the control unit 18 at the position,
In this state, the transport table 11 on which the semiconductor substrate 10 is placed is lowered to move the transport table 1 concerned.
The semiconductor substrate 10 placed on the carrier 1 can be transferred onto the transfer arm 3.

[0014]

In the transfer apparatus 1 having such a structure, when the semiconductor substrate 10 held on the transfer table 11 is transferred to the transfer arm 3, after the transfer is completed, the light shielding plate 11B is lighted. The movement of the transfer arm 3 is started by being detected by the sensor DET4.

However, the semiconductor substrate 10 is the transport table 1
1 is transferred to the transfer arm 3 and then transferred to the transfer table 1
Since it takes a predetermined time until the light shielding plate 11B of No. 1 is detected by the optical sensor DET4, it takes a predetermined time from the transfer operation to the movement start operation of the transfer arm 3 to sufficiently perform the transfer operation. There was a problem that could not be shortened.

When the semiconductor substrate 10 sucked and held on the transfer arm 3 is delivered to the transfer stage 11, the light shielding plate 11B is detected by the optical sensor DET3 after the transfer is completed, whereby the transfer arm is detected. The retreat movement of 3 in the direction of arrow a is started.

However, after the semiconductor substrate 10 is transferred from the transfer arm 3 to the transfer table 11, the transfer table 1 is transferred.
Since it takes a predetermined time until the light shielding plate 11B of No. 1 is detected by the optical sensor DET3, it takes a predetermined time from the transfer operation to the start of the retreat movement of the transfer arm 3 and the transfer operation. However, there was a problem that it could not be shortened sufficiently.

The present invention has been made in consideration of the above points, and an object thereof is to propose a transfer device which can further shorten the transfer operation.

[0019]

In order to solve such a problem, in the present invention, the object to be conveyed 10 held by the first conveying means 11 (or 3) is transferred to the second conveying means 3 (or 1).
1) and then the second transfer means 3 (or 11) is moved to provide the second transfer means 3 (or 11) in the transfer device 20 that transfers the transfer target 10 to a predetermined position. And suction means 4A, 4B, 4C, 4D (or 14A, 14B) for vacuum-sucking the transfer target 10,
Adsorption means 4A, 4B, 4C, 4D (or 14A, 14
B) Pressure detection means 21 (or 22) for detecting the adsorption pressure
And a control means 18 for starting the movement of the second conveying means 3 (or 11) when the detection result of the pressure detecting means 21 (or 22) exceeds a predetermined pressure.

[0020]

The object 10 to be transferred is transferred to the second transfer means 3 (or 11).
Adsorption means 4A, 4B, 4C, 4D (or 14)
By directly detecting the suction completion state of the transfer target 10 by the suction pressure of A, 14B), the first transfer means 11
Immediately after the transfer of the transfer target 10 from (or 3) to the second transfer means 3 (or 11) is completed, the second transfer means 3
(Or 11) can start moving.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, in which parts corresponding to those in FIGS. 4 and 5 are designated by the same reference numerals, the transfer device 20 includes a pipe 7 for applying a vacuum pressure to the suction nozzles 4A, 4B, 4C and 4D of the transfer arm 3. A pressure sensor (vacuum sensor) 21 that detects the pressure in the pipe 7 is inserted in the.

That is, in a state where the vacuum pressure from the vacuum pump is applied to the suction nozzles 4A, 4B, 4C and 4D, the semiconductor substrate 1 is attached to the suction nozzles 4A, 4B, 4C and 4D.
When 0 is not placed, the pressure detected by the vacuum sensor 21 is substantially open to the atmosphere, while the suction nozzles 4A, 4B, 4C, and 4D receive the vacuum pressure from the vacuum pump. 4A, 4
When the semiconductor substrate 10 is placed on B, 4C, and 4D, the suction nozzles 4A, 4B, 4C, and 4D are closed by the semiconductor substrate 10, so that the pressure detected by the vacuum sensor 21 becomes a vacuum pressure.

Therefore, the pressure detected by the vacuum sensor 21 is measured, and it is judged whether or not the measurement result is a high pressure with a predetermined pressure value as a boundary.
It can be determined whether or not the semiconductor substrate 10 is suction-held on the transfer arm 3.

Further, the suction nozzle 14A of the transport table 11
A pressure sensor (vacuum sensor) 22 for detecting the pressure in the pipe 17 is inserted in the pipe 17 for applying a vacuum pressure to the pipes 14 and 14B.

That is, when the semiconductor substrate 10 is not placed on the suction nozzles 14A and 14B while the vacuum pressure from the vacuum pump is applied to the suction nozzles 14A and 14B, the pressure detected by the vacuum sensor 22 is almost open to the atmosphere. On the other hand, when the semiconductor substrate 10 is placed on the suction nozzles 14A and 14B in a state where the vacuum pressure from the vacuum pump is applied to the suction nozzles 14A and 14B, the suction nozzles 14A and 14B are not moved by the semiconductor substrate 10. As a result of being blocked, the pressure detected by the vacuum sensor 22 becomes a vacuum pressure.

Accordingly, by measuring the pressure detected by the vacuum sensor 22, the transport table 1
It is possible to determine whether or not the semiconductor substrate 10 is suction-held on the substrate 1.

FIG. 2 shows a transfer processing procedure in which the semiconductor substrate 10 sucked and held on the transfer table 11 is transferred to the transfer arm 3 and transferred, and the controller 18 controls the step SP.
In step SP2, the electromagnetic adsorption valve (not shown) for controlling the supply of the vacuum pressure from the vacuum pump to the transport table 11 or the stop of the supply is turned off in step SP2, and the transport table 11 is operated. Upper semiconductor substrate 1
After 0 is opened, the process proceeds to the next step SP3 to control the vacuum pressure from the vacuum pump to the transfer arm 3 so as to control or stop the vacuum pressure from the vacuum pump (not shown)
Is turned on to apply the vacuum pressure from the vacuum pump to the suction nozzle 4.
Control to supply to A, 4B, 4C and 4D.

In this state, the control unit 18 makes the step S
Moving to P4, the transport table 11 on which the semiconductor substrate 10 is placed is started to descend in the direction of arrow b (FIG. 1). At this time, when the semiconductor substrate 10 placed on the transfer table 11 is transferred onto the suction nozzles 4A, 4B, 4C and 4D of the transfer arm 3, the pressure of the vacuum sensor 21 in the atmosphere open state is a pressure indicating a vacuum state. The detection signal S sent from the vacuum sensor 21 to the control unit 18
21 changes to the ON state.

Therefore, when the control unit 18 obtains a positive result in the subsequent step SP5, this means that the semiconductor substrate 10 is attached to the suction nozzles 4A, 4B, 4C and 4D of the transfer arm 3.
Has been adsorbed, and at this time, the control unit 18 moves to the following step SP6 to start moving the transport arm 3 in the direction indicated by the arrow a.

Following this, the control unit 18 proceeds to step S.
In P7, it is determined whether or not the descending operation of the transport table 11 has been completed by the preset transport amount, and if a positive result is obtained, the process proceeds to the subsequent step SP8 and the optical sensor DET is set.
At 4, it is confirmed that the light shielding plate 11B has arrived.

Following this, the control unit 18 proceeds to step S.
At P9, the driving of the transfer arm 3 in the direction of the arrow a is ended by a preset movement amount, and it is confirmed that the optical sensor DET2 has detected the light shielding plate 3B as the end position, and the processing procedure is ended. To do.

Thus, the semiconductor substrate 10 held on the transfer stage 11 is transferred onto the transfer arm 3 and then transferred to a position where the transfer arm 3 is detected by the optical sensor DET2.

On the other hand, FIG. 3 shows that the semiconductor substrate 10 is held on the carrier arm 3 at the position detected by the optical sensor DET1.
Shows the transfer processing procedure for transferring the sheet to the transfer stage 11, and the control unit 18 enters the processing procedure from step SP21.
In step SP22, a vacuum suction solenoid valve (not shown) for controlling the vacuum pressure from the vacuum pump to the transport table 11 is controlled to be turned on or off to turn on the vacuum pressure by the vacuum pump to the suction nozzles 14A and 14B. Control to supply to.

Further, the control unit 18 continues the step SP23.
Then, the vacuum suction electromagnetic valve (not shown) for controlling the supply of the vacuum pressure from the vacuum pump to the transfer arm 3 or the stop of the supply of the vacuum pressure is turned off to open the semiconductor substrate 10 of the transfer arm 3. Control.

In this state, the control unit 18 makes the step S
Moving to P24, the transport table 11 is started to rise in the direction opposite to the arrow b (FIG. 1). At this time, when the semiconductor substrate 10 placed on the transfer arm 3 is transferred onto the suction nozzles 14A and 14B of the transfer table 11, the pressure of the vacuum sensor 22 in the atmosphere open state changes to a pressure indicating a vacuum state, The detection signal S22 sent from the vacuum sensor 22 to the control unit 18 changes to the ON state.

When the control unit 18 obtains a positive result in the following step SP25, this means that the transport table 1
This indicates that the semiconductor substrate 10 has been sucked by one of the suction nozzles 14A and 14B. At this time, the control unit 18 moves to the following step SP26 and starts the retracting operation of the transfer arm 3 in the direction indicated by the arrow a.

Following this, the control unit 18 proceeds to step S.
In P27, it is determined whether or not the lifting operation of the transport table 11 has been completed by the preset transport amount, and if a positive result is obtained, the process proceeds to the subsequent step SP28 and the optical sensor D
Confirm that the light shield 11B has arrived at ET3.

Following this, the control unit 18 proceeds to step S.
At P29, the retracting operation of the transfer arm 3 in the direction of the arrow a is completed by a preset movement amount, and
After confirming that the optical sensor DET2 has detected the light shielding plate 3B as the end position, the processing procedure is ended.

Thus, the semiconductor substrate 10 held on the transfer arm 3 is transferred onto the transfer stage 11 and then transferred to a position where the transfer stage 11 is detected by the optical sensor DET3.

In the above structure, when the semiconductor substrate 10 suction-held on the transport table 11 is transferred to the transport arm 3, the semiconductor substrate 10 is suction-held by the suction nozzles 4A, 4B, 4C and 4D of the transport arm 3. This is detected by the vacuum sensor 21, and the movement of the transfer arm 3 is started based on the detection result.

Accordingly, after the semiconductor substrate 10 is transferred to the transfer arm 3, the transfer stage 11 is lowered to a position where it is detected by the optical sensor DET4, and the optical sensor DET.
As compared with the conventional case where the transfer arm 3 starts to move based on the detection output of FIG. 4 (FIG. 4), the transfer arm 3 can start moving immediately after the semiconductor substrate 10 is suction-held by the transfer arm 3. Therefore, the time required for the entire transport operation can be further shortened.

When the semiconductor substrate 10 sucked and held on the transfer arm 3 is transferred to the transfer stage 11, the semiconductor substrate 10 is sucked by the suction nozzles 14A and 1A of the transfer stage 11.
It is detected by the vacuum sensor 22 that it is adsorbed and held by the 4B, and the transport stage 11 is detected based on the detection result.
The ascending movement of is started.

Accordingly, the semiconductor substrate 10 is transferred to the transfer stage 11
After being transferred to the optical sensor DET
3 to the position detected by the optical sensor D
Compared with the conventional case (FIG. 4) in which the retreat movement of the transfer arm 3 is started based on the detection output of the ET 3, the semiconductor substrate 10
Since the transfer stage 11 can start moving immediately after being absorbed and held by the transfer stage 11, the time required for the entire transfer operation can be further shortened.

According to the above configuration, when the semiconductor substrate 10 to be transferred is transferred between the transfer stage 11 and the transfer arm 3, the pressure change for vacuum-sucking the semiconductor substrate 10 to the transfer arm 3 or the transfer stage 11. Thus, by directly detecting that the semiconductor substrate 10 has been delivered, the delivery can be performed as compared with the conventional case in which the delivery is indirectly detected by the position of the transfer stage 11. It is possible to further shorten the time required for the carrying operation including the whole.

In the above embodiments, the case where the semiconductor substrate 10 is targeted for transportation has been described, but the present invention is not limited to this, and can be widely applied to a transportation device for transporting various other parts. .

Further, in the above-mentioned embodiment, the case where the transfer target is transferred between the transfer arm 3 and the transfer stage 11 has been described, but the present invention is not limited to this, and the transfer target is transferred between the two transfer stages, for example. In the case of handing over, etc., it can be widely applied to a carrying device for delivering a carrying object between two carrying means.

[0048]

As described above, according to the present invention, when the object held by the first carrier means is transferred to the second carrier means and vacuum-adsorbed, the suction means of the second carrier means attracts the object. By detecting the suction completion state of the transfer target based on the pressure, it is possible to start moving the second transfer means that has completely sucked the transfer target immediately after the suction is completed, and the time required for the transfer operation can be further shortened by this amount. A transport device that can be realized can be realized.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a carrying device according to the present invention.

FIG. 2 is a flow chart showing a carrying processing procedure according to the present invention.

FIG. 3 is a flow chart showing a carrying processing procedure according to the present invention.

FIG. 4 is a side view showing a conventional transfer device.

FIG. 5 is a plan view of the transfer device.

[Explanation of symbols]

1, 20 ... Transport device, 3 ... Transport arm, 4A, 4
B, 4C, 4D, 14A, 14B ... Suction nozzle, 10
...... Semiconductor substrate, 11 …… Transfer stage, 18 …… Control section, 21, 22 …… Bakium sensor, DET1, DE
T2, DET3, DET4 ... Optical sensor.

Claims (1)

[Claims] 1. A transport for transporting the transport target held at a first transport means to a predetermined position by transferring the transport target to a second transport means and then moving the second transport means. In the apparatus, a suction means provided in the second transfer means for vacuum-sucking the transfer target, a pressure detection means for detecting the suction pressure of the suction means, and a detection result of the pressure detection means exceeding a predetermined pressure. And a control means for starting the movement of the second transport means.