TW202120411A - Processing device which is provided with a carrying-out mechanism capable of carrying out a warped workpiece from a cassette - Google Patents

Processing device which is provided with a carrying-out mechanism capable of carrying out a warped workpiece from a cassette Download PDF

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Publication number
TW202120411A
TW202120411A TW109139420A TW109139420A TW202120411A TW 202120411 A TW202120411 A TW 202120411A TW 109139420 A TW109139420 A TW 109139420A TW 109139420 A TW109139420 A TW 109139420A TW 202120411 A TW202120411 A TW 202120411A
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workpiece
cassette
support plate
carrying
warped
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TW109139420A
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Chinese (zh)
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柿沼良典
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Feeding Of Workpieces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

This invention provides a processing device, which comprises a carrying-out mechanism capable of carrying out a warped workpiece from a cassette. The processing device comprises a cassette placement area on which the cassette is placed, wherein the cassette contains a plate-like workpiece in a warped manner that a first surface and a second surface located at the opposite side of the first surface become a convex first surface and a concave second surface; a carrying-out mechanism that carries the workpiece out of the cassette placed in the cassette placement area; and a processing unit that processes the workpiece carried out by the carrying-out mechanism. The carrying-out mechanism comprises a support plate positioned in a manner of facing a lower surface of the workpiece; at least three projecting members projecting from an upper surface side of the support plate and disposed on at least three sites of the upper surface of the support plate, capable of being respectively in contact with the lower surface of the workpiece; and a moving unit connected with the support plate to move the support plate. Furthermore, the carrying-out mechanism can transport the workpiece in a manner of maintaining a warped state of the workpiece by having the at least three protruding members in contact with the lower surface of the workpiece.

Description

加工裝置Processing device

本發明係關於一種加工裝置，其具備搬出機構，搬送具有翹曲之板狀被加工物。The present invention relates to a processing device, which is provided with a carry-out mechanism and transports a warped plate-shaped to-be-processed object.

在以加工裝置將元件晶圓或樹脂封裝基板等各種板狀被加工物進行加工之情形中，加工裝置會配置容納有多個被加工物的卡匣。容納於卡匣內的被加工物，例如為矽晶圓或半導體封裝基板。When processing various plate-shaped workpieces such as element wafers or resin-encapsulated substrates with a processing device, the processing device is equipped with cassettes containing a plurality of workpieces. The processed object contained in the cassette is, for example, a silicon wafer or a semiconductor package substrate.

被加工物為矽晶圓之情形，在被覆晶圓背面側之金屬膜、形成於晶圓背面側之研削變形、包含形成於晶圓正面側的絕緣膜及金屬層之層積物等的影響下，有時晶圓會發生翹曲。例如，晶圓有時會發生中凸形狀或中凹形狀的翹曲。When the workpiece is a silicon wafer, the metal film on the back side of the coated wafer, the grinding deformation formed on the back side of the wafer, the laminate including the insulating film and the metal layer formed on the front side of the wafer, etc. Under the circumstances, sometimes the wafer will warp. For example, the wafer may be warped in a convex shape or a concave shape.

又，被加工物為半導體封裝基板之情形，由於分別構成半導體封裝基板的金屬製框架與封膜樹脂之熱膨脹率差異，而半導體封裝基板有時會發生中凸形狀或中凹形狀的翹曲。In addition, when the workpiece is a semiconductor package substrate, the thermal expansion coefficient of the metal frame and the sealing film resin constituting the semiconductor package substrate is different, and the semiconductor package substrate may be warped in a convex shape or a concave shape.

被加工物係藉由搬送機械手臂等搬出機構而個別地被搬送至卡匣的外部（例如，參照專利文獻1）。搬送機械手臂具有板狀的手部，在此手部之一面上，例如設置有多個吸附墊片。各吸附墊片透過電磁閥等而與真空產生源連接，若使電磁閥等呈開啟狀態，則在吸附墊片產生負壓。The to-be-processed object is individually conveyed to the outside of the cassette by the unloading mechanism, such as a conveyance robot arm (for example, refer patent document 1). The transport robot arm has a plate-shaped hand, and for example, a plurality of suction pads are provided on one surface of the hand. Each suction pad is connected to a vacuum generating source through a solenoid valve or the like. When the solenoid valve or the like is opened, a negative pressure is generated in the suction pad.

搬送機械手臂係在以吸附墊片吸附被加工物的狀態下搬送被加工物，但在被加工物具有翹曲之情形，有時會無法以吸附墊片吸附被加工物。此情況下，搬送機械手臂無法搬送被加工物。 [習知技術文獻] [專利文獻]The transport robot is to transport the workpiece with the suction pad adsorbing the workpiece. However, when the workpiece is warped, it may not be able to adsorb the workpiece with the suction pad. In this case, the transport robot cannot transport the workpiece. [Literature Technical Literature] [Patent Literature]

[專利文獻1]日本特開2002-270674號公報[Patent Document 1] JP 2002-270674 A

[發明所欲解決的課題] 本發明係鑒於所述問題點而完成，其目的在於提供一種加工裝置，其具備可將具有翹曲之被加工物從卡匣搬出至卡匣外部的搬出機構。[The problem to be solved by the invention] The present invention was made in view of the above-mentioned problems, and its object is to provide a processing device provided with an unloading mechanism capable of unloading a warped workpiece from the cassette to the outside of the cassette.

[解決課題的技術手段] 根據本發明之一態樣，可提供一種加工裝置，其具備：卡匣載置區域，其載置卡匣，所述卡匣容納有第1面與位於該第1面之相反側的第2面以成為凸狀之該第1面與凹狀之該第2面的方式翹曲的板狀被加工物；搬出機構，其將該被加工物從載置於該卡匣載置區域的該卡匣搬出至該卡匣的外部；以及加工單元，其將藉由該搬出機構所搬出的該被加工物進行加工，其中，該搬出機構具有：支撐板，其以面對該被加工物之下表面的方式被定位；至少3個突起構件，其等從該支撐板之上表面側突出，配置於該支撐板之上表面的至少3處，並分別可與該被加工物之該下表面接觸；以及移動單元，其與該支撐板連結，且使該支撐板移動，並且，該搬出機構係藉由該至少3個突起構件與該被加工物之該下表面接觸，而一邊維持著該被加工物翹曲的狀態一邊搬送該被加工物。[Technical means to solve the problem] According to an aspect of the present invention, there can be provided a processing apparatus including: a cassette mounting area in which a cassette is mounted, the cassette accommodating a first surface and a second surface located on the opposite side of the first surface A plate-shaped workpiece whose surface is warped such that the first surface of the convex shape and the second surface of the concave shape are warped; a carry-out mechanism for removing the workpiece from the cassette mounting area The cassette is carried out to the outside of the cassette; and a processing unit that processes the processed object carried out by the carry-out mechanism, wherein the carry-out mechanism has: a support plate facing the processed object The lower surface is positioned; at least 3 protruding members, which protrude from the upper surface side of the support plate, are arranged on at least 3 places on the upper surface of the support plate, and can be respectively connected to the lower surface of the workpiece Contact; and a moving unit that is connected to the support plate and moves the support plate, and the unloading mechanism is contacted by the at least three protruding members and the lower surface of the workpiece while maintaining the The workpiece is conveyed while the workpiece is warped.

[發明功效] 本發明之一態樣的加工裝置具備搬出機構與加工單元。搬出機構具有：支撐板，其以面對被加工物之下表面的方式被定位；以及至少3個突起構件，其等從支撐板之上表面側突出，配置於支撐板之上表面的至少3處，並分別可與被加工物之下表面接觸。搬出機構進一步具有：移動單元，其與支撐板連結，且使支撐板移動。[Efficacy of invention] A processing device according to an aspect of the present invention includes a carry-out mechanism and a processing unit. The carry-out mechanism has: a support plate, which is positioned to face the lower surface of the workpiece; and at least three protruding members protruding from the upper surface of the support plate and arranged on at least 3 of the upper surface of the support plate. , And can be in contact with the lower surface of the workpiece respectively. The carry-out mechanism further includes a moving unit that is connected to the support plate and moves the support plate.

搬出機構係藉由至少3個突起構件與被加工物之下表面接觸，而可一邊維持著被加工物翹曲的狀態一邊搬出被加工物。因此，在搬出具有翹曲之被加工物時，不需以外力使其變形成平坦，即使被加工物為中凸形狀或中凹形狀，也能夠以其原本的形狀搬送被加工物。The unloading mechanism is capable of unloading the processed object while maintaining the warped state of the processed object by contacting at least three protruding members with the lower surface of the processed object. Therefore, when carrying out a warped workpiece, no external force is required to make it flat, and even if the workpiece has a convex shape or a concave shape, the workpiece can be transported in its original shape.

參照附圖說明本發明之一態樣的實施方式。圖1係研削裝置2的立體圖。研削裝置（加工裝置）2具備大致長方體形狀的基台4。圖1中，將基台4的左右方向作為X軸方向，將基台4的前後方向作為Y軸方向，將基台4的上下方向作為Z軸方向。An embodiment of one aspect of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of the grinding device 2. The grinding device (processing device) 2 includes a base 4 having a substantially rectangular parallelepiped shape. In FIG. 1, the left-right direction of the base 4 is referred to as the X-axis direction, the front-rear direction of the base 4 is referred to as the Y-axis direction, and the vertical direction of the base 4 is referred to as the Z-axis direction.

在基台4的前方向（Y軸方向之一側）上形成有凹部4a，於此凹部4a中設置有搬送機械手臂（搬出機構）6。相對於凹部4a在右方向（X軸方向之一側）上具有卡匣載置區域8a，且相對於凹部4a在左方向（X軸方向之另一側）上具有卡匣載置區域8b。如此，卡匣載置區域8a、8b位於在X軸方向上夾持凹部4a的位置。A recess 4 a is formed in the front direction (one side of the Y-axis direction) of the base 4, and a transport robot (carry-out mechanism) 6 is provided in the recess 4 a. The recess 4a has a cassette mounting area 8a in the right direction (one side in the X-axis direction), and has a cassette mounting area 8b in the left direction (the other side in the X-axis direction) with respect to the recess 4a. In this way, the cassette mounting regions 8a, 8b are located at positions that sandwich the recessed portion 4a in the X-axis direction.

在卡匣載置區域8a上載置卡匣10a，所述卡匣10a容納有以研削裝置2進行加工之前的1個以上之被加工物11。又，在卡匣載置區域8b上載置卡匣10b，所述卡匣10b容納有以研削裝置2進行加工之後的1個以上之被加工物11。A cassette 10 a is placed on the cassette placement area 8 a, and the cassette 10 a accommodates one or more to-be-processed objects 11 before being processed by the grinding device 2. In addition, a cassette 10b is placed on the cassette placement area 8b, and the cassette 10b contains one or more to-be-processed objects 11 processed by the grinding device 2.

此處，參照圖2及圖3來說明將容納於卡匣10a之被加工物11從卡匣10a搬出的搬送機械手臂6。圖2係搬送機械手臂6等的放大立體圖。Here, with reference to FIGS. 2 and 3, the conveyance robot 6 which carries out the to-be-processed object 11 accommodated in the cassette 10a from the cassette 10a is demonstrated. Fig. 2 is an enlarged perspective view of the transport robot 6 and the like.

搬送機械手臂6具有：移動單元6a，其係由多個連桿可旋動地連結而成之彎折連桿機構所構成。移動單元6a具有圓筒支撐部6b。圓筒支撐部6b可藉由驅動手段（未圖示）而在Z軸方向上移動且可在XY平面上旋轉。The transport robot 6 has a moving unit 6a, which is composed of a bending link mechanism formed by rotatably connecting a plurality of links. The moving unit 6a has a cylindrical support part 6b. The cylindrical support portion 6b can be moved in the Z-axis direction by a driving means (not shown) and can be rotated on the XY plane.

第一連桿6c之一端部以可在XY平面上旋轉的態樣連接於圓筒支撐部6b之上端部。又，第二連桿6d之一端部以可在XY平面上旋轉的態樣連接於第一連桿6c之另一端部。One end of the first link 6c is connected to the upper end of the cylindrical support portion 6b in a manner rotatable on the XY plane. In addition, one end of the second link 6d is connected to the other end of the first link 6c in a manner rotatable on the XY plane.

可在XY平面上旋轉的平板狀的腕部6e連接於第二連桿6d之另一端部。作為端接器的手部6f連接於腕部6e的側部。A flat-plate-shaped wrist 6e rotatable on the XY plane is connected to the other end of the second link 6d. The hand 6f as a terminator is connected to the side of the wrist 6e.

腕部6e、第二連桿6d、第一連桿6c及圓筒支撐部6b構成移動單元6a。藉由移動單元6a，手部6f可沿著XY平面方向及Z軸方向移動。手部6f具有連結於腕部6e的支撐板6g。The arm portion 6e, the second link 6d, the first link 6c, and the cylindrical support portion 6b constitute a moving unit 6a. With the moving unit 6a, the hand 6f can move along the XY plane direction and the Z axis direction. The hand 6f has a support plate 6g connected to the wrist 6e.

支撐板6g係由金屬、陶瓷等所形成。支撐板6g包含連接部6g1 ，此連接部6g1 之一端側連結於腕部6e。在連接部6g1 之另一端側設置有2個指部6g2 。The support plate 6g is formed of metal, ceramics, or the like. The supporting plate 6g includes a connecting portion 6g 1 , and one end side of the connecting portion 6g 1 is connected to the wrist portion 6e. Two fingers 6g 2 are provided on the other end side of the connecting portion 6g 1 .

2個指部6g2 具有沿著第一方向（長度方向）的長邊部，所述第一方向係從連接部6g1 之一端朝向另一端。又，2個指部6g2 係設置於與第一方向正交之第二方向（寬度方向）上相對於連接部6g1 之中心呈左右對稱的位置。2個指部6g2 在連接部6g1 的寬度方向上彼此分開。The two finger portions 6g 2 have long side portions along a first direction (longitudinal direction) that is from one end of the connecting portion 6g 1 to the other end. In addition, the two finger portions 6g 2 are provided at positions that are bilaterally symmetrical with respect to the center of the connecting portion 6g 1 in the second direction (width direction) orthogonal to the first direction. The two finger portions 6g 2 are separated from each other in the width direction of the connecting portion 6g 1.

連接部6g1 及2個指部6g2 之上表面成為同一平面，而構成支撐板6g之上表面6g3 。在上表面6g3 的至少3處，以從上表面6g3 突出的方式設置有突起構件6h。The upper surfaces of the connecting portion 6g 1 and the two finger portions 6g 2 become the same plane, and constitute the upper surface 6g 3 of the support plate 6g. At least three of the upper surface 6g 3, provided to protrude from the upper surface of the projection member 6g 3 6h.

本實施方式中，突起構件6h設置於連接部6g1 之上表面6g3 與2個指部6g2 的各上表面6g3 。此外，突起構件6h的數量並不限定於3個。突起構件6h的數量亦可為4個以上。The present embodiment, the protrusion 6h member disposed on the surface of the connecting portion 6g 1 6g 3 and 2 on each surface of the finger portion 6g 2 6g 3. In addition, the number of protrusion members 6h is not limited to three. The number of protrusion members 6h may be 4 or more.

在本實施方式中，3個突起構件6h係在上表面6g3 以不是並排成一直線狀（亦即，非直線狀）的方式配置。更具體而言，突起構件6h分別配置於連接部6g1 在第二方向的大致中央部與2個指部6g2 在第一方向的各前端附近。此外，3個突起構件6h位於預定直徑的圓周上。In the present embodiment, the three protrusion members 6h are arranged on the upper surface 6g 3 so as not to be aligned in a straight line (that is, non-linear). More specifically, the protrusion members 6h are respectively arranged in the approximate center of the connecting portion 6g 1 in the second direction and the vicinity of the respective front ends of the two finger portions 6g 2 in the first direction. In addition, three protruding members 6h are located on a circumference of a predetermined diameter.

此處，參照圖3說明突起構件6h。圖3係突起構件6h的剖面圖。突起構件6h係由橡膠狀的聚矽氧樹脂等橡膠、多孔質的硬質海綿等所形成，具有柔軟性。Here, the protrusion member 6h will be described with reference to FIG. 3. Fig. 3 is a cross-sectional view of the protruding member 6h. The protruding member 6h is formed of rubber such as rubber-like silicone resin, porous hard sponge, etc., and has flexibility.

又，突起構件6h對於被加工物11及貼附於被加工物11之保護膠膜具有較高的摩擦係數（例如，靜摩擦係數）。突起構件6h亦有在與被加工物11等對象物之間發揮將對象物保留於此處的所謂黏著（tack）力的情況。In addition, the protruding member 6h has a high coefficient of friction (for example, a coefficient of static friction) for the workpiece 11 and the protective film attached to the workpiece 11. The protruding member 6h may also exert a so-called tack force between the object to be processed 11 and other objects, which retains the object here.

突起構件6h具有半球狀的上部6h1 。圓柱狀的下部6h2 係與上部6h1 一體地設置於上部6h1 之下表面。下部6h2 之上表面的圓與上部6h1 之下表面的圓大致為相同直徑。下部6h2 之圓的直徑d為5mm以上且20mm以下（例如，10mm）。The protruding member 6h has a hemispherical upper portion 6h 1 . Cylindrical lower portion and an upper portion 6h 2 based 6h 1 to 6h 1 is integrally provided below the upper surface. The circle on the upper surface of the lower part 6h 2 and the circle on the lower surface of the upper part 6h 1 are approximately the same diameter. The diameter d of the circle of the lower part 6h 2 is 5 mm or more and 20 mm or less (for example, 10 mm).

又，將上部6h1 及下部6h2 組合的突起構件6h之高度h為2mm以上且10mm以下（例如，5mm）。此外，突起構件6h之高度h與支撐板6g之厚度的合計，例如為10mm左右。Moreover, the height h of the protrusion member 6h which combined the upper part 6h 1 and the lower part 6h 2 is 2 mm or more and 10 mm or less (for example, 5 mm). In addition, the total of the height h of the protrusion member 6h and the thickness of the support plate 6g is, for example, about 10 mm.

在本實施方式中，上部6h1 及下部6h2 的材料相同。但是，只要上部6h1 的材料係由橡膠、多孔質的硬質海綿等所形成，則下部6h2 亦可由金屬等非柔軟性的硬質材料所形成。又，上部6h1 的形狀並不限定於半球狀，亦可與下部6h2 相同而為圓柱狀。In this embodiment, the materials of the upper part 6h 1 and the lower part 6h 2 are the same. However, as long as the material of the upper part 6h 1 is formed of rubber, porous rigid sponge, etc., the lower part 6h 2 may be formed of a non-flexible rigid material such as metal. In addition, the shape of the upper part 6h 1 is not limited to a hemispherical shape, and may be cylindrical in the same manner as the lower part 6h 2.

具備突起構件6h之手部6f，在搬出被加工物11之情形中，會插入卡匣10a。如圖2所示，卡匣10a具有互相對向的一對側板10a1 。上板10a2 連接於一對側板10a1 之上端部，下板10a3 連接於下端部。The hand 6f provided with the protruding member 6h inserts the cassette 10a when the workpiece 11 is carried out. As shown in Fig. 2, the cassette 10a has a pair of side plates 10a 1 facing each other. The upper plate 10a 2 is connected to the upper end of the pair of side plates 10a 1 , and the lower plate 10a 3 is connected to the lower end.

又，藉由上板10a2 及下板10a3 之一端部與一對側板10a1 之一端部，而在卡匣10a之一端側形成開口。相對於此，在上板10a2 及下板10a3 之另一端部與一對側板10a1 之另一端部連接有另一側板（未圖示）。In addition, one end of the upper plate 10a 2 and the lower plate 10a 3 and one end of the pair of side plates 10a 1 form an opening on one end side of the cassette 10a. In contrast, another side plate (not shown) is connected to the other end of the upper plate 10a 2 and the lower plate 10a 3 and the other end of the pair of side plates 10a 1.

圖4（A）係卡匣10a等的局部剖面側面圖。此外，圖4（A）中，表示以從卡匣10a之另一側板朝向卡匣10a之開口的方向觀看卡匣10a之內部的情況。Fig. 4(A) is a partial cross-sectional side view of the cassette 10a and the like. In addition, FIG. 4(A) shows a situation in which the inside of the cassette 10a is viewed from the other side plate of the cassette 10a toward the opening of the cassette 10a.

在一對側板10a1 的內側面，於相同高度位置設置有一對支撐架10a4 。一對支撐架10a4 在卡匣10a的深度方向上延伸。又，沿著卡匣10a的高度方向形成有多對支撐架10a4 。 A pair of support frames 10a 4 are provided on the inner surfaces of the pair of side plates 10a 1 at the same height position. The pair of support frames 10a 4 extend in the depth direction of the cassette 10a. In addition, a plurality of pairs of support frames 10a 4 are formed along the height direction of the cassette 10a.

1個被加工物11係由一對支撐架10a4 所支撐。被加工物11為半導體晶圓或半導體封裝基板等板狀物，被加工物11有時會發生翹曲。A Department of the workpiece 11 is supported by a pair of support frame 10a 4. The workpiece 11 is a plate-like object such as a semiconductor wafer or a semiconductor package substrate, and the workpiece 11 may warp.

圖4（A）所示之例中，各被加工物11具備形成有元件等的正面（第1面）11a及位於與正面11a相反側的背面（第2面）11b，並以正面11a成為凸狀、背面11b成為凹狀的方式翹曲。被加工物11由於正面11a配置於下方側，故從上方觀看成為中凹形狀。In the example shown in FIG. 4(A), each workpiece 11 includes a front surface (first surface) 11a on which elements and the like are formed, and a back surface (second surface) 11b located on the opposite side of the front surface 11a, and the front surface 11a becomes The convex shape and the back surface 11b are warped in a concave shape. Since the front surface 11a of the to-be-processed object 11 is arrange|positioned on the lower side, it becomes a concave shape when viewed from above.

被加工物11的翹曲量，例如為100μm以上且300μm以下的預定值。此外，雖未圖示，但為了保護元件等，而在正面11a側貼附有尺寸與正面11a大致相同的樹脂製保護膠膜。The amount of warpage of the workpiece 11 is, for example, a predetermined value of 100 μm or more and 300 μm or less. In addition, although not shown, in order to protect elements and the like, a resin protective adhesive film having approximately the same size as the front surface 11a is attached to the front surface 11a side.

將被加工物11從卡匣10a搬出至外部之情形，藉由移動單元6a使手部6f往卡匣10a的深度方向移動，並以支撐板6g之上表面6g3 面對一被加工物11之下表面（本例中為正面11a）的方式將支撐板6g定位（參照圖4（A））。When the workpiece 11 is carried out from the cassette 10a to the outside, the hand 6f is moved in the depth direction of the cassette 10a by the moving unit 6a, and the upper surface 6g 3 of the support plate 6g faces a workpiece 11 Position the support plate 6g in the manner of the lower surface (front surface 11a in this example) (refer to FIG. 4(A)).

接著，使移動單元6a的圓筒支撐部6b移動至上方，使各突起構件6h與被加工物11之下表面接觸，以手部6f支撐被加工物11。圖4（B）係表示以手部6f支撐被加工物11之狀態的圖。Next, the cylindrical support portion 6b of the moving unit 6a is moved upward, and each protruding member 6h is brought into contact with the lower surface of the workpiece 11, and the workpiece 11 is supported by the hand 6f. Fig. 4(B) is a diagram showing a state where the workpiece 11 is supported by the hand 6f.

若以手部6f支撐被加工物11，則具有柔軟性之突起構件6h會與被加工物11之下表面接觸，並藉由被加工物11的自身重量而因應被加工物11的形狀進行變形。然後，在透過突起構件6h以支撐板6g支撐被加工物11的狀態下，使手部6f往卡匣10a的外部撤離。If the workpiece 11 is supported by the hand 6f, the flexible protruding member 6h will contact the lower surface of the workpiece 11 and deform according to the shape of the workpiece 11 by the weight of the workpiece 11 . Then, in a state where the workpiece 11 is supported by the support plate 6g through the protruding member 6h, the hand 6f is evacuated to the outside of the cassette 10a.

突起構件6h例如具有較高的摩擦係數，因此在將支撐板6g之上表面6g3 與XY平面大致平行地配置之情形，即使移動手部6f，被加工物11亦不會在手部6f上滑動。The protruding member 6h has, for example, a high coefficient of friction. Therefore, when the upper surface 6g 3 of the support plate 6g is arranged substantially parallel to the XY plane, even if the hand 6f is moved, the workpiece 11 will not be on the hand 6f. slide.

因此，在保持著被加工物11翹曲的狀態下，手部6f可透過突起構件6h支撐被加工物11，並可在被加工物11不會相對於支撐板6g移動（亦即，不滑動）的態樣下，搬送被加工物11。Therefore, while maintaining the warped state of the workpiece 11, the hand 6f can support the workpiece 11 through the protruding member 6h, and can prevent the workpiece 11 from moving relative to the support plate 6g (that is, without sliding ) In the state of transporting the to-be-processed object 11.

此處，針對圖1所示之其他構成要件進行說明。相對於卡匣載置區域8a在後方向（Y軸方向之另一側）上設置有定位台12，所述定位台12係將藉由搬送機械手臂6搬出之被加工物11相對於基台4進行定位。Here, the other constituent elements shown in FIG. 1 will be described. A positioning table 12 is provided in the rear direction (the other side in the Y-axis direction) relative to the cassette placement area 8a. The positioning table 12 moves the workpiece 11 carried out by the transport robot 6 relative to the base. 4 Perform positioning.

定位台12係設置於基台4之上表面中大致圓形的區域。在定位台12的中央部設置有圓柱狀的吸引台12a。此外，吸引台12a的直徑小於手部6f中的一對指部6g2 間的距離。The positioning table 12 is arranged in a substantially circular area on the upper surface of the base 4. A cylindrical suction table 12a is provided in the center of the positioning table 12. In addition, the diameter of the suction table 12a is smaller than the distance between the pair of fingers 6g 2 in the hand 6f.

在吸引台12a之上表面形成有1個或多個吸引口（未圖示）。流路（參照圖6（A）等）之一端連接於各吸引口。在流路之另一端連接有抽氣器等吸引源12c（參照圖6（A）等）。One or more suction ports (not shown) are formed on the upper surface of the suction table 12a. One end of the flow path (see Fig. 6(A), etc.) is connected to each suction port. A suction source 12c such as an air extractor is connected to the other end of the flow path (refer to FIG. 6(A), etc.).

在吸引口與吸引源12c之間設置有電磁閥12d（參照圖6（A）等）。只要在使吸引源12c運作的狀態下使電磁閥12d為開啟狀態，就會在吸引口產生負壓。A solenoid valve 12d is provided between the suction port and the suction source 12c (refer to FIG. 6(A), etc.). As long as the solenoid valve 12d is opened while the suction source 12c is operating, a negative pressure is generated at the suction port.

以吸引台12a為中心，多個定位銷12b環狀地配置於吸引台12a的周圍。各定位銷12b可往靠近吸引台12a的方向或遠離吸引台12a的方向移動。此外，各定位銷12b的移動距離被構成為相同。With the suction table 12a as the center, a plurality of positioning pins 12b are annularly arranged around the suction table 12a. Each positioning pin 12b can move in a direction close to the suction table 12a or a direction away from the suction table 12a. In addition, the movement distances of the positioning pins 12b are configured to be the same.

在定位台12的左方向（X軸方向之另一側）上設置有裝載臂部14。裝載臂部14具有預定長度的臂部。臂部之一端部係在可旋轉且可在Z軸方向上移動的態樣下連結於基台4。A loading arm 14 is provided in the left direction (the other side in the X-axis direction) of the positioning table 12. The loading arm portion 14 has an arm portion of a predetermined length. One end of the arm is connected to the base 4 in a state of being rotatable and movable in the Z-axis direction.

又，在臂部之另一端部設置有可吸引被加工物11的墊片部14a（參照圖6（A）等）。在墊片部14a之下表面形成有吸引口（未圖示），藉由在吸引口產生的負壓，墊片部14a之下表面發揮作為吸引面14b的功能。Moreover, the spacer part 14a which can attract the to-be-processed object 11 is provided in the other end part of an arm part (refer FIG. 6(A) etc.). A suction port (not shown) is formed on the lower surface of the gasket portion 14a, and the lower surface of the gasket portion 14a functions as a suction surface 14b due to the negative pressure generated at the suction port.

在裝載臂部14之一端部的後方向（Y軸方向之另一側）設置有圓盤狀的旋轉台16。旋轉台16可在基台4上旋轉，在旋轉台16之上表面，以在圓周方向上大致相距120度的態樣設置有3個卡盤台18。A disk-shaped turntable 16 is provided in the rear direction (the other side in the Y-axis direction) of one end of the loading arm portion 14. The rotating table 16 is rotatable on the base 4, and three chuck tables 18 are provided on the upper surface of the rotating table 16 with a distance of approximately 120 degrees in the circumferential direction.

在最接近裝載臂部14的區域（搬入搬出區域A）與俯視下從搬入搬出區域A往逆時針方向前進約120度的區域（粗研削區域B），分別配置有1個卡盤台18。又，在俯視下從搬入搬出區域A往順時針方向前進約120度的區域（完工研削區域C）亦配置有1個卡盤台18。One chuck table 18 is respectively arranged in the area closest to the loading arm 14 (carry-in/out area A) and an area (rough grinding area B) that moves counterclockwise from the carry-in/out area A by approximately 120 degrees in a plan view. In addition, one chuck table 18 is also arranged in an area (finished grinding area C) that is advanced by approximately 120 degrees in the clockwise direction from the carry-in and carry-out area A in a plan view.

卡盤台18係藉由使旋轉台16旋轉而往箭頭方向移動。例如，藉由旋轉台16，使位於搬入搬出區域A的卡盤台18按照粗研削區域B及完工研削區域C的順序在俯視下往逆時針反向移動後，再使其往順時針方向移動，而回到搬入搬出區域A。The chuck table 18 is moved in the arrow direction by rotating the rotating table 16. For example, with the turntable 16, the chuck table 18 located in the carry-in and carry-out area A is moved counterclockwise in the top view in the order of the rough grinding area B and the finished grinding area C, and then moved in the clockwise direction. , And go back to move-in and move-out area A.

各卡盤台18具有由陶瓷等所形成的圓盤狀框體。在框體之上表面側形成有圓盤狀的凹部（未圖示）。由多孔質材料所形成的圓盤狀多孔板固定於此凹部。Each chuck table 18 has a disk-shaped frame formed of ceramics or the like. A disc-shaped recess (not shown) is formed on the upper surface side of the frame. A disc-shaped porous plate formed of a porous material is fixed to this recess.

多孔板之上表面露出，且多孔板之下表面與形成於卡盤台18內的流路（未圖示）之一端連接。在此流路之另一端連接有抽氣器等吸引源（未圖示）。The upper surface of the porous plate is exposed, and the lower surface of the porous plate is connected to one end of a flow path (not shown) formed in the chuck table 18. A suction source (not shown) such as an air extractor is connected to the other end of the flow path.

若使吸引源運作，則在多孔板之上表面產生負壓，多孔板之上表面發揮作為吸引並保持被加工物11等之保持面18a的作用。此處，針對以下步驟進明說明：藉由裝載臂部14，將藉由搬送機械手臂6從卡匣10a搬出的被加工物11搬送至位於搬入搬出區域A的卡盤台18。When the suction source is operated, a negative pressure is generated on the upper surface of the porous plate, and the upper surface of the porous plate functions as a holding surface 18a that attracts and holds the workpiece 11 and the like. Here, the following steps will be explained. The loading arm 14 transports the workpiece 11 transported from the cassette 10a by the transport robot 6 to the chuck table 18 located in the transport-in/out area A.

藉由搬送機械手臂6，將被加工物11從卡匣10a搬出，並配置於定位台12上。圖5（A）係配置於定位台12上之被加工物11等的局部剖面側面圖。With the transport robot 6, the workpiece 11 is transported out of the cassette 10 a and placed on the positioning table 12. FIG. 5(A) is a partial cross-sectional side view of the workpiece 11 and the like arranged on the positioning table 12.

藉由使吸引台12a相對於手部6f上升，被加工物11從手部6f分離而載置於吸引台12a之上表面。圖5（B）係載置於吸引台12a之上表面的被加工物11等的局部剖面側面圖。By raising the suction table 12a with respect to the hand 6f, the workpiece 11 is separated from the hand 6f and placed on the upper surface of the suction table 12a. FIG. 5(B) is a partial cross-sectional side view of the workpiece 11 and the like placed on the upper surface of the suction table 12a.

載置後，以使全部定位銷12b接觸被加工物11之外周的方式，移動定位銷12b，使被加工物11的中心與定位台12的中心對應。接著，使裝載臂部14之一端部在XY平面上旋轉，將墊片部14a配置於吸引台12a及被加工物11的上方。After mounting, the positioning pins 12b are moved so that all the positioning pins 12b contact the outer periphery of the workpiece 11 so that the center of the workpiece 11 corresponds to the center of the positioning table 12. Next, one end of the loading arm portion 14 is rotated on the XY plane, and the spacer portion 14 a is arranged above the suction table 12 a and the workpiece 11.

然後，使裝載臂部14之一端部移動至Z軸方向的下方，將墊片部14a的吸引面14b按壓於被加工物11之上表面（本例中為背面11b）側。圖6（A）係將墊片部14a按壓於被加工物11時的被加工物11等的局部剖面側面圖。Then, one end portion of the loading arm portion 14 is moved downward in the Z-axis direction, and the suction surface 14b of the spacer portion 14a is pressed against the upper surface (rear surface 11b in this example) side of the workpiece 11. FIG. 6(A) is a partial cross-sectional side view of the workpiece 11 and the like when the gasket portion 14 a is pressed against the workpiece 11.

藉由以預定的力將墊片部14a按壓於被加工物11之上表面（本例中為背面11b），被加工物11會彈性地變形，而被加工物11的翹曲會被暫時消除。圖6（B）係變形成大致平坦之被加工物11等的局部剖面側面圖。By pressing the gasket portion 14a against the upper surface of the workpiece 11 (in this example, the back surface 11b) with a predetermined force, the workpiece 11 is elastically deformed, and the warpage of the workpiece 11 is temporarily eliminated . FIG. 6(B) is a partial cross-sectional side view of the workpiece 11 etc. deformed to be substantially flat.

使被加工物11變形成大致平坦後，在吸引面14b產生負壓，以吸引面14b吸引並保持被加工物11。之後，再次使裝載臂部14之一端部在XY平面上旋轉，將被加工物11移交至位於搬入搬出區域A之卡盤台18。After the workpiece 11 is deformed to be substantially flat, a negative pressure is generated on the suction surface 14b, and the workpiece 11 is sucked and held by the suction surface 14b. After that, one end of the loading arm portion 14 is rotated on the XY plane again, and the workpiece 11 is transferred to the chuck table 18 located in the carry-in and carry-out area A.

此處，再次回到圖1，針對圖1所示之其他構成要件進行說明。在比旋轉台16更靠近後方向（Y軸方向之另一側）上，以在基台4的高度方向之一側（例如，+Z方向）突出的態樣設置有四角柱狀的支撐構造20a、20b。Here, returning to FIG. 1 again, the other constituent elements shown in FIG. 1 will be described. In the rear direction (the other side in the Y-axis direction) closer to the rotating table 16, a quadrangular columnar support structure is provided in a manner protruding on one side of the height direction of the base 4 (for example, the +Z direction) 20a, 20b.

在支撐構造20a之位於前方向（Y軸方向之一側）的前面設置有Z軸移動機構22。Z軸移動機構22具備配置於支撐構造20a之前面且與Z軸方向大致平行的一對Z軸導軌24。A Z-axis moving mechanism 22 is provided on the front surface of the support structure 20a in the front direction (one side in the Y-axis direction). The Z-axis moving mechanism 22 includes a pair of Z-axis guide rails 24 arranged on the front surface of the support structure 20a and substantially parallel to the Z-axis direction.

Z軸移動板26可滑動地安裝於一對Z軸導軌24上。在Z軸移動板26的背面側設置有螺帽部（未圖示）。於一對Z軸導軌24之間沿著Z軸導軌24設置的Z軸滾珠螺桿28係以可旋轉的態樣連結於此螺帽部。The Z-axis moving plate 26 is slidably mounted on a pair of Z-axis guide rails 24. A nut portion (not shown) is provided on the back side of the Z-axis moving plate 26. The Z-axis ball screw 28 provided along the Z-axis guide rail 24 between the pair of Z-axis guide rails 24 is rotatably connected to this nut portion.

在Z軸滾珠螺桿28之一端部連結有Z軸脈衝馬達30。只要以Z軸脈衝馬達30使Z軸滾珠螺桿28旋轉，則Z軸移動板26沿著Z軸導軌24在Z軸方向上移動。粗研削單元（加工單元）32a固定於Z軸移動板26的前面側。A Z-axis pulse motor 30 is connected to one end of the Z-axis ball screw 28. As long as the Z-axis ball screw 28 is rotated by the Z-axis pulse motor 30, the Z-axis moving plate 26 moves in the Z-axis direction along the Z-axis guide rail 24. The rough grinding unit (processing unit) 32 a is fixed to the front side of the Z-axis moving plate 26.

粗研削單元32a具有固定於Z軸移動板26之前面側的筒狀主軸外殼34。在主軸外殼34內，以可旋轉的狀態容納有與Z軸方向平行地配置的主軸（未圖示）之一部分。The rough grinding unit 32 a has a cylindrical spindle housing 34 fixed to the front side of the Z-axis moving plate 26. In the spindle housing 34, a part of a spindle (not shown) arranged in parallel to the Z-axis direction is housed in a rotatable state.

在主軸之上端部連結有主軸馬達36。主軸之下端部則從主軸外殼34突出。在主軸之下端部裝設有圓環狀的粗研削輪38a。A spindle motor 36 is connected to the upper end of the spindle. The lower end of the spindle protrudes from the spindle housing 34. An annular rough grinding wheel 38a is installed at the lower end of the main shaft.

粗研削輪38a具有：大致圓環狀的輪基台40a，其係由不鏽鋼等金屬材料所形成；及多個粗研削磨石42a，其裝設於輪基台40a之下表面側。The rough grinding wheel 38a has a substantially annular wheel base 40a, which is formed of a metal material such as stainless steel, and a plurality of rough grinding stones 42a, which are installed on the lower surface side of the wheel base 40a.

多個粗研削磨石42a分別具有大致長方體形狀，並沿著輪基台40a之下表面的圓周，以在相鄰之研削磨石彼此之間設有間隙的態樣排列成環狀。The plurality of rough grinding grindstones 42a respectively have a substantially rectangular parallelepiped shape, and are arranged in a ring shape along the circumference of the lower surface of the wheel base 40a with a gap between adjacent grinding grindstones.

粗研削磨石42a例如係將金剛石、cBN（cubic boron nitride，立方氮化硼）等磨粒混合至金屬、陶瓷、樹脂等黏合劑所形成。此外，黏合劑及磨粒的材料並無特別限制，可依據粗研削磨石42a的規格而適當選擇。粗研削輪38a的正下方與上述粗研削區域B對應。The rough grinding grindstone 42a is formed, for example, by mixing abrasive grains such as diamond and cBN (cubic boron nitride) with a binder such as metal, ceramic, and resin. In addition, the materials of the binder and abrasive grains are not particularly limited, and can be appropriately selected according to the specifications of the rough grinding grindstone 42a. Just below the rough grinding wheel 38a corresponds to the rough grinding area B described above.

與設置有粗研削單元32a之支撐構造20a的左方向（X軸方向之另一側）鄰接而設置有四角柱狀的支撐構造20b。與支撐構造20a同樣地，在支撐構造20b之位於前方向（Y軸方向之一側）的前面設置有Z軸移動機構22。Adjacent to the left direction (the other side in the X-axis direction) of the support structure 20a provided with the rough grinding unit 32a, a quadrangular column-shaped support structure 20b is provided. As with the support structure 20a, a Z-axis movement mechanism 22 is provided on the front surface of the support structure 20b in the front direction (one side in the Y-axis direction).

又，在支撐構造20b的Z軸移動機構22上，透過Z軸移動板26連結有完工研削單元（加工單元）32b。與粗研削單元32a同樣地，完工研削單元32b亦具有主軸外殼34、主軸及主軸馬達36。在完工研削單元32b之主軸的下端部裝設有圓環狀的完工研削輪38b。In addition, to the Z-axis moving mechanism 22 of the support structure 20 b, a finishing grinding unit (processing unit) 32 b is connected via the Z-axis moving plate 26. Like the rough grinding unit 32a, the finished grinding unit 32b also has a spindle housing 34, a spindle, and a spindle motor 36. An annular finishing grinding wheel 38b is installed at the lower end of the main shaft of the finishing grinding unit 32b.

完工研削輪38b具有大致圓環狀的輪基台40b與裝設於輪基台40b之下表面側的多個完工研削磨石42b。多個完工研削磨石42b分別具有大致長方體形狀，並沿著輪基台40b之下表面的圓周，以在相鄰之研削磨石彼此之間設有間隙的態樣排列成環狀。The finished grinding wheel 38b has a substantially annular wheel base 40b and a plurality of finished grinding grindstones 42b installed on the lower surface side of the wheel base 40b. The plurality of finished grinding grindstones 42b respectively have a substantially rectangular parallelepiped shape, and are arranged in a ring shape along the circumference of the lower surface of the wheel base 40b with gaps between adjacent grinding grindstones.

完工研削磨石42b亦係將磨粒混合至黏合劑所形成。完工研削磨石42b中，相較於粗研削磨石42a的磨粒，其平均粒徑更小。但是，完工研削磨石42b的黏合劑及磨粒的材料並無特別限制，可依據完工研削磨石42b的規格而適當選擇。完工研削輪38b的正下方與上述完工研削區域C對應。The finished grinding stone 42b is also formed by mixing abrasive grains into a binder. In the finished grinding grindstone 42b, the average particle diameter is smaller than that of the abrasive grains of the rough grinding grindstone 42a. However, the material of the adhesive and abrasive grains of the finished grinding grindstone 42b is not particularly limited, and can be appropriately selected according to the specifications of the finished grinding grindstone 42b. Just below the finished grinding wheel 38b corresponds to the above-mentioned finished grinding area C.

藉由裝載臂部14而被搬入位於搬入搬出區域A之卡盤台18的被加工物11，其係在粗研削區域B藉由粗研削單元32a將其背面11b側進行粗研削（加工）。接著，被加工物11係在完工研削區域C藉由完工研削單元32b將其背面11b側進行完工研削（加工）。之後，使被加工物11回到搬入搬出區域A。The workpiece 11 carried into the chuck table 18 in the carry-in/out area A by the load arm 14 is rough-ground (processed) on the back surface 11b side by the rough-grinding unit 32a in the rough-grinding area B. Next, the workpiece 11 is subjected to finishing grinding (processing) on the back surface 11b side by the finishing grinding unit 32b in the finishing grinding area C. After that, the workpiece 11 is returned to the carry-in and carry-out area A.

在裝載臂部14之一端部的左方向（X軸方向之另一側）設置有卸載臂部44。卸載臂部44具有預定長度的臂部。臂部之一端部以可旋轉的態樣連結於基台4。An unloading arm 44 is provided in the left direction (the other side in the X-axis direction) of one end of the loading arm 14. The unloading arm 44 has an arm with a predetermined length. One end of the arm is connected to the base 4 in a rotatable manner.

又，在臂部之另一端部設置有可吸引被加工物11的墊片部。在墊片部之下表面形成有吸引口（未圖示），藉由在吸引口產生的負壓，墊片部之下表面發揮作為吸引面的功能。In addition, the other end of the arm is provided with a spacer that can attract the workpiece 11. A suction port (not shown) is formed on the lower surface of the gasket portion, and the negative pressure generated at the suction port functions as a suction surface on the lower surface of the gasket portion.

卸載臂部44吸引被加工物11，並從位於搬入搬出區域A之卡盤台18搬出被加工物11。在卸載臂部44的左方向（X軸方向之另一側）設置有用以將研削後的被加工物11進行清洗的旋轉清洗單元46。在旋轉清洗單元46的前方向（Y軸方向之一側）側設置有上述卡匣載置區域8b。The unloading arm 44 sucks the workpiece 11 and unloads the workpiece 11 from the chuck table 18 located in the carry-in/out area A. In the left direction (the other side in the X-axis direction) of the unloading arm portion 44, a rotary cleaning unit 46 for cleaning the workpiece 11 after grinding is provided. The above-mentioned cassette placement area 8 b is provided on the front direction (one side in the Y-axis direction) side of the rotary cleaning unit 46.

研削裝置2具備控制定位台12、裝載臂部14、旋轉台16、卡盤台18、粗研削單元32a、完工研削單元32b、卸載臂部44、旋轉清洗單元46等控制單元（未圖示）。The grinding device 2 includes control units (not shown) such as a control positioning table 12, a loading arm 14, a rotating table 16, a chuck table 18, a rough grinding unit 32a, a finishing grinding unit 32b, an unloading arm 44, and a rotating cleaning unit 46. .

控制單元係由包含CPU（Central Processing Unit，中央處理單元）等處理裝置、快閃記憶體等記憶裝置的電腦所構成。藉由依據記憶於記憶裝置之程式等軟體使處理裝置運作，控制單元發揮作為軟體與處理裝置（硬體資源）協作之具體手段的功能。The control unit is composed of a computer including a CPU (Central Processing Unit, central processing unit) and other processing devices, flash memory and other memory devices. By operating the processing device based on software such as programs stored in the memory device, the control unit functions as a specific means of cooperation between the software and the processing device (hardware resources).

本實施方式之搬送機械手臂6係藉由至少3個突起構件6h與被加工物11之下表面接觸，而可一邊維持著被加工物11翹曲的狀態一邊搬出被加工物11。因此，在搬出具有翹曲之被加工物11時，不需以外力使其變形成平坦，即使被加工物11為中凸形狀或中凹形狀，也能夠以其原本的形狀搬送被加工物11。The transport robot 6 of the present embodiment makes contact with the lower surface of the workpiece 11 by at least three protruding members 6h, so that the workpiece 11 can be carried out while maintaining the warped state of the workpiece 11. Therefore, when carrying out the warped workpiece 11, it does not need to be deformed to be flat by external force. Even if the workpiece 11 has a convex shape or a concave shape, the workpiece 11 can be transported in its original shape. .

再者，各突起構件6h具有藉由被加工物11的自身重量而因應被加工物11的形狀進行變形之柔軟性、較高的摩擦係數等。因此，搬送機械手臂6可在被加工物11不會相對於支撐板6g移動（亦即，不滑動）的態樣下搬送被加工物11。Furthermore, each protruding member 6h has flexibility to deform in accordance with the shape of the workpiece 11 by the weight of the workpiece 11, a high coefficient of friction, and the like. Therefore, the transport robot 6 can transport the workpiece 11 in a state where the workpiece 11 does not move (that is, does not slide) with respect to the support plate 6g.

接著，針對第二實施方式之研削裝置2進行說明。第二實施方式之定位台12與第一實施方式不同，其係以包圍吸引台12a的方式具有圓筒形狀的輔助台12e。Next, the grinding apparatus 2 of the second embodiment will be described. The positioning table 12 of the second embodiment is different from the first embodiment in that it is an auxiliary table 12e having a cylindrical shape so as to surround the suction table 12a.

圖7（A）係具有輔助台12e之定位台12等的局部剖面側面圖，圖7（B）係表示以輔助台12e及吸引台12a支撐被加工物11之狀態的定位台12等的局部剖面側面圖。Fig. 7(A) is a partial cross-sectional side view of the positioning table 12 and the like with an auxiliary table 12e, and Fig. 7(B) shows a part of the positioning table 12 and the like in a state in which the workpiece 11 is supported by the auxiliary table 12e and the suction table 12a Sectional side view.

第二實施方式之定位台12中，相較於第一實施方式，能夠以更廣泛的範圍支撐被加工物11之下表面。因此，在將墊片部14a按壓於具有翹曲之被加工物11的上表面側時，相較於第一實施方式，能夠更穩定地支撐被加工物11。In the positioning table 12 of the second embodiment, compared to the first embodiment, the lower surface of the workpiece 11 can be supported in a wider range. Therefore, when the spacer portion 14a is pressed on the upper surface side of the workpiece 11 having warpage, the workpiece 11 can be supported more stably than in the first embodiment.

接著，針對第三實施方式進行說明。第三實施方式之卡匣10a中容納有以成為凹狀之正面11a（第1面）與凸狀之背面（第2面）11b的方式翹曲的被加工物11。Next, the third embodiment will be described. The cassette 10a of the third embodiment accommodates the workpiece 11 that is warped so as to form a concave front surface 11a (first surface) and a convex back surface (second surface) 11b.

被加工物11由於正面11a配置於下方側，故從上方觀看成為中凸形狀。此外，雖未圖示，但在正面11a側貼附有尺寸與正面11a大致相同的樹脂製保護膠膜。Since the front surface 11a of the to-be-processed object 11 is arrange|positioned on the lower side, it becomes a convex shape when viewed from above. In addition, although not shown in the figure, a resin protective adhesive film having approximately the same size as the front surface 11a is attached to the front surface 11a side.

各被加工物11配置於一對支撐架10a4 。第三實施方式中，亦使手部6f往卡匣10a的深度方向移動，以支撐板6g之上表面6g3 面對一被加工物11之下表面（本例中為正面11a）的方式將支撐板6g定位（參照圖8）。Each workpiece 11 is arranged a pair of support bracket 10a 4. In the third embodiment, the hand 6f is also moved in the depth direction of the cassette 10a, so that the upper surface 6g 3 of the support plate 6g faces the lower surface of the workpiece 11 (the front surface 11a in this example). The support plate 6g is positioned (refer to Figure 8).

接著，使移動單元6a的圓筒支撐部6b移動至上方，以手部6f支撐被加工物11。圖8係表示以手部6f支撐被加工物11之狀態的圖。若以手部6f支撐被加工物11，則具有柔軟性之突起構件6h會與被加工物11之下表面接觸，並藉由被加工物11的自身重量而因應被加工物11的形狀進行變形。Next, the cylindrical support part 6b of the moving unit 6a is moved upward, and the to-be-processed object 11 is supported by the hand part 6f. Fig. 8 is a diagram showing a state in which the workpiece 11 is supported by the hand 6f. If the workpiece 11 is supported by the hand 6f, the flexible protruding member 6h will contact the lower surface of the workpiece 11 and deform according to the shape of the workpiece 11 by the weight of the workpiece 11 .

然後，在透過突起構件6h以支撐板6g支撐被加工物11的狀態下，使手部6f往卡匣10a的外部撤離。突起構件6h例如具有較高的摩擦係數，因此將支撐板6g之上表面6g3 與XY平面大致平行地配置之情形，即使移動手部6f，被加工物11亦不會在手部6f上滑動。Then, in a state where the workpiece 11 is supported by the support plate 6g through the protruding member 6h, the hand 6f is evacuated to the outside of the cassette 10a. The protruding member 6h has, for example, a high coefficient of friction. Therefore, when the upper surface 6g 3 of the support plate 6g is arranged approximately parallel to the XY plane, even if the hand 6f is moved, the workpiece 11 will not slide on the hand 6f. .

因此，各突起構件6h與被加工物11之下表面接觸之情形，在保持著被加工物11翹曲的狀態下，手部6f可透過突起構件6h支撐被加工物11。又，手部6f可在被加工物11不會相對於支撐板6g移動（亦即，不滑動）的態樣下搬送被加工物11。Therefore, when each protruding member 6h is in contact with the lower surface of the workpiece 11, the hand 6f can support the workpiece 11 through the protruding member 6h while keeping the workpiece 11 warped. Moreover, the hand 6f can convey the to-be-processed object 11 in the state where the to-be-processed object 11 does not move with respect to the support plate 6g (that is, does not slide).

此外，上述實施方式之構造、方法等，只要不脫離本發明之目的的範圍則可適當變更而實施。例如，在從配置於與上述研削裝置2不同之加工裝置的卡匣10a搬出中凹形狀或中凸形狀的被加工物11之情形中，可使用搬送機械手臂6。In addition, the structure, the method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as it does not deviate from the scope of the objective of the present invention. For example, in the case of carrying out a concave shape or convex shape to-be-processed object 11 from a cassette 10a arranged in a processing device different from the above-mentioned grinding device 2, the transport robot 6 can be used.

又，即使在卡匣10a中的被加工物11之正面11a側未貼附保護膠膜的情況下，藉由使突起構件6h與被加工物11接觸，搬送機械手臂6亦可在被加工物11不會相對於支撐板6g移動的態樣下搬送被加工物11。In addition, even if the protective film is not attached to the front surface 11a side of the workpiece 11 in the cassette 10a, by bringing the protruding member 6h into contact with the workpiece 11, the transport robot 6 can also be placed on the workpiece 11 11 conveys the to-be-processed object 11 in the state which does not move with respect to 6g of support plates.

2:研削裝置（加工裝置） 4:基台 4a:凹部 6:搬送機械手臂 6a:移動單元 6b:圓筒支撐部 6c:第一連桿 6d:第二連桿 6e:腕部 6f:手部 6g:支撐板 6g1 :連接部 6g2 :指部 6g3 :上表面 6h:突起構件 6h1 :上部 6h2 :下部 8a,8b:卡匣載置區域 10a,10b:卡匣 10a1 :側板 10a2 :上板 10a3 :下板 10a4 :支撐架 11:被加工物 11a:正面 11b:背面 12:定位台 12a:吸引台 12b:定位銷 12c:吸引源 12d:電磁閥 12e:輔助台 14:裝載臂部 14a:墊片部 14b:吸引面 16:旋轉台 18:卡盤台 18a:保持面 20a,20b:支撐構造 22:Z軸移動機構 24:Z軸導軌 26:Z軸移動板 28:Z軸滾珠螺桿 30:Z軸脈衝馬達 32a:粗研削單元 32b:完工研削單元 34:主軸外殼 36:主軸馬達 38a:粗研削輪 38b:完工研削輪 40a,40b:輪基台 42a:粗研削磨石 42b:完工研削磨石 44:卸載臂部 46:旋轉清洗單元 A:搬入搬出區域 B:粗研削區域 C:完工研削區域 d:直徑 h:高度2: Grinding device (processing device) 4: Base 4a: Recess 6: Transport robot 6a: Moving unit 6b: Cylindrical support 6c: First link 6d: Second link 6e: Wrist 6f: Hand 6g: Support plate 6g 1 : Connecting part 6g 2 : Finger part 6g 3 : Upper surface 6h: Protruding member 6h 1 : Upper part 6h 2 : Lower part 8a, 8b: Cassette placement area 10a, 10b: Cassette 10a 1 : Side plate 10a 2 : Upper plate 10a 3 : Lower plate 10a 4 : Support frame 11: Workpiece 11a: Front 11b: Back 12: Positioning table 12a: Suction table 12b: Positioning pin 12c: Suction source 12d: Solenoid valve 12e: Auxiliary table 14: Loading arm part 14a: Spacer part 14b: Suction surface 16: Rotating table 18: Chuck table 18a: Holding surface 20a, 20b: Support structure 22: Z-axis moving mechanism 24: Z-axis guide 26: Z-axis moving plate 28: Z-axis ball screw 30: Z-axis pulse motor 32a: Rough grinding unit 32b: Finished grinding unit 34: Spindle housing 36: Spindle motor 38a: Rough grinding wheel 38b: Finished grinding wheel 40a, 40b: Wheel base 42a: Coarse Grinding stone 42b: Finished grinding stone 44: Unloading arm 46: Rotary cleaning unit A: Loading and unloading area B: Rough grinding area C: Finishing grinding area d: Diameter h: Height

圖1係研削裝置的立體圖。 圖2係搬送機械手臂等的放大立體圖。 圖3係突起構件的剖面圖。 圖4（A）係卡匣等的局部剖面側面圖，圖4（B）係表示以手部支撐被加工物之狀態的圖。 圖5（A）係配置於定位台上之被加工物等的局部剖面側面圖，圖5（B）係配置於吸引台上表面之被加工物等的局部剖面側面圖。 圖6（A）係將墊片部按壓於被加工物時的被加工物等的局部剖面側面圖，圖6（B）係變形成大致平坦之被加工物等的局部剖面側面圖。 圖7（A）係具有輔助台之定位台等的局部剖面側面圖，圖7（B）係表示以輔助台及吸引台支撐被加工物之狀態的定位台等的局部剖面側面圖。 圖8係表示以手部支撐被加工物之狀態的圖。Figure 1 is a perspective view of the grinding device. Fig. 2 is an enlarged perspective view of a conveying robot arm and the like. Fig. 3 is a cross-sectional view of the protruding member. Fig. 4(A) is a partial cross-sectional side view of a cassette, etc., and Fig. 4(B) is a view showing a state in which the workpiece is supported by the hand. Fig. 5(A) is a partial cross-sectional side view of the workpiece etc. arranged on the positioning table, and Fig. 5(B) is a partial cross-sectional side view of the workpiece etc. arranged on the upper surface of the suction table. Fig. 6(A) is a partial cross-sectional side view of the workpiece etc. when the gasket portion is pressed against the workpiece, and Fig. 6(B) is a partial cross-sectional side view of the workpiece etc. deformed into a substantially flat workpiece. Fig. 7(A) is a partial cross-sectional side view of a positioning table etc. with an auxiliary table, and Fig. 7(B) is a partial cross-sectional side view of the positioning table etc. in a state where the auxiliary table and the suction table support the workpiece. Fig. 8 is a diagram showing a state in which the workpiece is supported by the hand.

6:搬送機械手臂6: Transporting the robotic arm

6a:移動單元6a: mobile unit

6b:圓筒支撐部6b: Cylinder support part

6c:第1連桿6c: 1st link

6d:第2連桿6d: 2nd link

6e:腕部6e: wrist

6f:手部6f: hands

6g:支撐板6g: support plate

6g1 :連接部6g 1 : Connection part

6g2 :指部6g 2 : Fingers

6g3 :上表面6g 3 : upper surface

6h:突起構件6h: Protruding member

10a:卡匣10a: Cassette

10a1 :側板10a 1 : side panel

10a2 :上板10a 2 : Upper plate

10a3 :下板10a 3 : Lower plate

10a4 :支撐架10a 4 : Support frame

11:被加工物11: processed objects

Claims (1)

一種加工裝置，其特徵在於具備： 卡匣載置區域，其載置卡匣，該卡匣容納有第1面與位於該第1面之相反側的第2面以成為凸狀之該第1面與凹狀之該第2面的方式翹曲的板狀被加工物； 搬出機構，其將該被加工物從載置於該卡匣載置區域的該卡匣搬出至該卡匣的外部；以及 加工單元，其將藉由該搬出機構所搬出的該被加工物進行加工， 其中，該搬出機構具有： 支撐板，其以面對該被加工物之下表面的方式被定位； 至少3個突起構件，其等從該支撐板之上表面側突出，配置於該支撐板之上表面的至少3處，並分別可與該被加工物之該下表面接觸；以及 移動單元，其與該支撐板連結，且使該支撐板移動， 並且，該搬出機構係藉由該至少3個突起構件與該被加工物之該下表面接觸，而一邊維持著該被加工物翹曲的狀態一邊搬送該被加工物。A processing device characterized by: A cassette placement area, which contains a cassette containing a first surface and a second surface located on the opposite side of the first surface so as to become the convex first surface and the concave second surface Warped plate-like processed objects in a different way; A carrying-out mechanism for carrying out the processed object from the cassette placed in the cassette loading area to the outside of the cassette; and The processing unit, which processes the object to be processed by the unloading mechanism, Among them, the moving out organization has: A support plate, which is positioned to face the lower surface of the object to be processed; At least three protruding members protruding from the upper surface side of the support plate, are arranged at at least three places on the upper surface of the support plate, and can respectively contact the lower surface of the workpiece; and The moving unit is connected with the support plate and moves the support plate, In addition, the unloading mechanism conveys the workpiece while maintaining the warped state of the workpiece by contacting the at least three protruding members with the lower surface of the workpiece.
TW109139420A 2019-11-15 2020-11-12 Processing device which is provided with a carrying-out mechanism capable of carrying out a warped workpiece from a cassette TW202120411A (en)

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