TW202339099A - Processing apparatus, cleaning method and plate for cleaning capable of cleaning a holding surface for holding a workpiece without relying on a dedicated cleaning mechanism - Google Patents

Abstract

The present invention provides a processing apparatus that can clean a holding surface for holding a workpiece without relying on a dedicated cleaning mechanism. The processing apparatus comprises: a holding unit including a chuck table having a first holding surface for holding a workpiece; a processing unit; and a cassette carrying table capable of carrying a cassette which can accommodate a plate for cleaning that has a concave and convex structure provided on the first surface side; a transport unit including a holding pad; and a control unit capable of controlling the holding unit and the transport unit in accordance with a program stored in a memory device. The control unit executes the following steps according to the program: using the holding pad to hold the second surface of the plate for cleaning; when using the holding pad to hold the plate for cleaning, using the transport unit to push the first surface of the plate for cleaning against the first holding surface of the chuck table; and rotating the chuck table when the first surface of the plate for cleaning is pushed against the first holding surface of the chuck table,.

Description

Processing device, cleaning method and cleaning plate

The present invention relates to a processing device configured to clean a holding surface for holding a plate-shaped workpiece, a cleaning method used when cleaning the holding surface, and a cleaning plate.

In a processing apparatus that processes a plate-shaped workpiece represented by a semiconductor wafer, the workpiece is held by a tool called a chuck table or the like. This makes it possible to control the positional relationship between tools and the like used during processing and the workpiece with high precision, thereby realizing precise processing of the workpiece.

However, if chips and the like generated during processing are accumulated on the holding surface of the chuck table that holds the workpiece, the chuck table will not be able to properly hold the workpiece, and the accuracy of processing the workpiece will be reduced. . Therefore, a processing device including a dedicated cleaning mechanism for cleaning the holding surface of the chuck table has been proposed (for example, see Patent Document 1). [Known technical documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2015-54362

[Problem to be solved by the invention] However, if a dedicated cleaning mechanism as described above is provided in the processing device, the processing device will be enlarged due to the cleaning mechanism. Moreover, along with the cost of the cleaning mechanism, the price of the processing equipment will also increase significantly.

Therefore, an object of the present invention is to provide a processing device, a cleaning method, and a cleaning plate used for cleaning a holding surface for holding a workpiece without relying on a dedicated cleaning mechanism.

[Technical means to solve the problem] According to one aspect of the present invention, a processing device is provided, which is provided with a holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and capable of being wound around the workpiece. The rotation axis intersecting the first holding surface rotates; a processing unit that can process the workpiece held in the holding unit; a cassette placing platform that holds a cassette that can be accommodated on the side of the first surface A plate-shaped cleaning plate provided with a concave-convex structure and the workpiece; a transfer unit including a holding pad having a second holding surface for holding the workpiece, and capable of holding the workpiece accommodated in the cassette Transported to the chuck table; and a control unit, which has a processing device and a memory device, and can control the holding unit and the transport unit according to the program memorized in the memory device, and the control unit follows the program to execute the following Clean the first holding surface of the chuck table through the above procedure: use the transport unit to move out the cleaning plate contained in the cassette, and use the second holding surface of the holding pad to hold the cleaning plate. The first surface is the second surface on the opposite side; in a state where the second surface of the cleaning plate is held by the second holding surface of the holding pad, the transport unit is used to transfer the cleaning plate to the second surface. The process of pressing the first surface to the first holding surface of the chuck table; and when pressing the first surface of the cleaning plate to the first holding surface of the chuck table using the transport unit, The procedure for rotating the chuck table.

According to another aspect of the present invention, there is provided a processing device provided with a holding unit including a chuck table having a first holding surface for holding a plate-shaped workpiece and capable of being wound around the workpiece. The rotation axis intersecting the first holding surface rotates; a processing unit that can process the workpiece held in the holding unit; a cassette placing platform that holds a cassette, and the cassette can be accommodated on the first surface A plate-shaped cleaning plate with a concave-convex structure on one side and the workpiece; a transfer unit, which includes a holding pad with a second holding surface for holding the workpiece, and can hold the workpiece accommodated in the cassette The object is transported to the chuck table; and a control unit has a processing device and a memory device, and can control the holding unit and the transport unit according to the program memorized in the memory device, and the control unit follows the program to execute The following procedure is used to clean the second holding surface of the holding pad: using the transport unit to move out the cleaning plate contained in the cassette, and using the first holding surface of the chuck table to hold the cleaning plate The procedure for the second surface on the opposite side to the first surface; in a state where the second surface of the cleaning plate is held by the first holding surface of the chuck table, the transport unit is used to move the holding pad of the holding pad. The process of pressing the second holding surface to the first surface of the cleaning plate; and rotating the chuck table while pressing the second holding surface of the holding pad to the first surface of the cleaning plate. procedures.

For example, the chuck table holds the workpiece while the workpiece is being processed by the processing unit. And, for example, the processing device further includes a cleaning unit capable of cleaning the workpiece, and the chuck table holds the workpiece while the cleaning unit cleans the workpiece.

According to yet another aspect of the present invention, there is provided a cleaning method used when cleaning the first holding surface of a chuck table of a processing device, the processing device having a holding unit including the chuck table, The chuck table has a first holding surface that holds a plate-shaped workpiece, and can rotate around a rotation axis that intersects with the first holding surface; and a processing unit that can process the workpiece held by the holding unit. object; a cassette mounting platform that holds a cassette that can accommodate a plate-shaped cleaning plate with a concave and convex structure on the first side and the workpiece; and a transport unit that includes a device that holds the cassette. The holding pad of the second holding surface of the workpiece can transport the workpiece contained in the cassette to the chuck table. The cleaning method is such that the transport unit cleans the workpiece contained in the cassette. The cleaning plate is carried out, and the second surface of the cleaning plate opposite to the first surface is held by the second holding surface of the holding pad, and the cleaning plate is held by the second holding surface of the holding pad. In the state of the second surface, the first surface of the cleaning plate is pressed to the first holding surface of the chuck table by the transport unit, and the first surface of the cleaning plate is pressed by the transport unit. When the surface is pressed against the first holding surface of the chuck table, the first holding surface of the chuck table is cleaned by rotating the chuck table.

According to yet another aspect of the present invention, there is provided a cleaning method used when cleaning the second holding surface of the holding pad of a processing device, the processing device having a holding unit including a chuck table, the chuck The disc table has a first holding surface that holds a plate-shaped workpiece, and is rotatable around a rotation axis that intersects the first holding surface; a processing unit that can process the workpiece held by the holding unit; A cassette placement platform that holds a cassette that can accommodate a plate-shaped cleaning plate with a concave and convex structure on the first side and the workpiece; and a transport unit that includes a device that holds the workpiece. The holding pad of the second holding surface of the object can be used to transport the processed object contained in the cassette to the chuck table. The cleaning method is such that the transport unit will clean the processed object contained in the cassette. The cleaning plate is moved out, and the second surface of the cleaning plate opposite to the first surface is held by the first holding surface of the chuck table, and the cleaning plate is held by the first holding surface of the chuck table. In the state of using the second surface of the plate, use the transport unit to press the second holding surface of the holding pad to the first surface of the cleaning plate, and then press the second holding surface of the holding pad to When cleaning the first surface of the cleaning plate, the second holding surface of the holding pad is cleaned by rotating the chuck table.

For example, when the workpiece is processed by the machining unit, the chuck table holds the workpiece. And, for example, the processing device further includes a cleaning unit capable of cleaning the workpiece, and when the cleaning unit cleans the workpiece, the chuck table holds the workpiece.

According to yet another aspect of the present invention, there is provided a cleaning plate, which is a plate-shaped cleaning plate used when cleaning the first holding surface of the chuck table or the second holding surface of the holding pad of a processing device, The processing device is provided with a holding unit including the chuck table, the chuck table having the first holding surface for holding the plate-shaped workpiece, and being rotatable around a rotation axis intersecting the first holding surface. Rotation; a processing unit that can process the workpiece held in the holding unit; a cassette mounting platform that holds a cassette that can accommodate the workpiece; and a transfer unit that includes a device that holds the workpiece. The holding pad on the second holding surface can transport the processed object contained in the cassette to the chuck table. The cleaning plate has: a circular first surface; The second surface is a circular shape on the opposite side, and a concave and convex structure is provided on the first surface side.

Preferably, the cleaning plate is made of silicon. Moreover, when cleaning the first holding surface of the chuck table, the second surface is held by the second holding surface of the holding pad, and when cleaning the second holding surface of the holding pad, the second holding surface of the holding pad is held by The second surface is held by the first holding surface of the chuck table.

[Invention effect] The processing devices and cleaning methods of various aspects of the present invention clean the first part of the chuck table by using a holding unit including a chuck table, a transfer unit including a holding pad, and a cleaning plate provided with a concave and convex structure on the first surface side. The holding surface or the second holding surface of the holding pad allows the holding surface for holding the workpiece to be cleaned without relying on a dedicated cleaning mechanism.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing the grinding device (processing device) 2 according to this embodiment. In addition, in FIG. 1 , elements constituting part of the grinding device 2 are expressed as functional blocks. In addition, the X-axis direction (front-back direction), Y-axis direction (left-right direction), and Z-axis direction (vertical direction) used in the following description are mutually perpendicular.

As shown in FIG. 1 , the grinding device 2 includes a base 4 that supports various elements constituting the grinding device 2 . On the front end side of the upper surface of the base 4, there is provided a concave accommodation portion 4a whose upper end opens toward the upper surface of the base 4, and a container used for transporting the plate-shaped workpiece 11 is accommodated in the accommodation portion 4a. Robotic arm 6. In addition, the robot arm 6 can not only transport the workpiece 11 etc., but also reverse the up and down direction of the workpiece 11 .

The workpiece 11 is, for example, a disk-shaped wafer made of semiconductor material such as silicon. That is, this workpiece 11 has a circular front surface 11 a and a circular back surface 11 b opposite to the front surface 11 a. The front side 11 a of the workpiece 11 is divided into a plurality of small areas by a plurality of intersecting cutting lanes (planned division lines), and components such as integrated circuits (ICs) are formed in each small area.

The grinding device 2 of this embodiment is used, for example, when grinding the back surface 11 b side of the workpiece 11 . In addition, when grinding the back surface 11 b side of the workpiece 11 , a protective member represented by a protective film made of resin or other materials can be attached to the front surface 11 a side of the workpiece 11 . By attaching the protective member to the front surface 11a side of the workpiece 11, the impact exerted on the front surface 11a side during the grinding process on the backside 11b side is mitigated, and components and the like of the workpiece 11 are protected.

Furthermore, in this embodiment, a disc-shaped wafer made of semiconductor material such as silicon is used as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited thereto. Attitude. For example, a substrate made of other materials such as semiconductors, ceramics, resins, metals, etc. can be used as the workpiece 11 . Similarly, the type, quantity, shape, structure, size, arrangement, etc. of the components are not limited to the above-mentioned aspects. The workpiece 11 does not need to be formed with elements.

As shown in FIG. 1 , cassette stands 10 a and 10 b are provided in front of the accommodating part 4 a. The cassette stands 10 a and 10 b carry cassettes 8 a and 8 b that can accommodate a plurality of workpieces 11 and the like. A position adjustment mechanism 12 for adjusting the position of the workpiece 11 and the like is provided diagonally behind the accommodating portion 4a. The position adjustment mechanism 12 includes a disc-shaped position adjustment table and a plurality of pins arranged around the position adjustment table.

By moving the plurality of pins in the radial direction of the position adjustment table, for example, the center of the workpiece 11 carried out from the cassette 8 a by the robot arm 6 and placed on the position adjustment table is aligned in the X-axis direction and Align to the predetermined position in the Y-axis direction. In addition, the workpiece 11 is placed on the position adjustment table with the surface to be ground (for example, the back surface 11 b ) facing upward.

In this embodiment, a plate-shaped cleaning plate is accommodated in the cassettes 8 a and 8 b together with a plurality of workpieces 11 , and is used to clean any space holding the workpiece 11 . Keep face. That is, the cassettes 8a and 8b used in this embodiment are configured to accommodate the cleaning plate. FIG. 2 is a perspective view schematically showing the cleaning plate 1 .

The cleaning plate 1 is typically a disc-shaped wafer made of a semiconductor material such as silicon, and is the same size as or larger than the object 11 to be processed. That is, the cleaning plate 1 has: a circular first surface 1a; a circular second surface 1b on the opposite side to the first surface 1a; and an outer peripheral surface 1c connecting the first surface 1a and the second surface. 1b.

A plurality of linear grooves 1d are formed on the first surface 1a side of the cleaning plate 1 so as to cross each other. Furthermore, both ends of each groove 1d are opened on the outer peripheral surface 1c. By these plurality of grooves 1d, a concave and convex structure suitable for cleaning the holding surface is realized. In other words, the first surface 1a side of the cleaning plate 1 is provided with an uneven structure suitable for cleaning the holding surface. On the other hand, the second surface 1b side of the cleaning plate 1 is not provided with an uneven structure and is substantially flat.

In addition, in this embodiment, although a disc-shaped wafer made of semiconductor material such as silicon is used as the cleaning plate 1, the material, shape, structure, size, etc. of the cleaning plate 1 are not limited thereto. Attitude. For example, a substrate made of other materials such as semiconductor, ceramic, resin, metal, etc. can be used as the cleaning plate 1 . The cleaning plate 1 only needs to have at least a first surface 1 a larger than the holding surface to be cleaned. Furthermore, it suffices to provide an uneven structure on at least the first surface 1a side.

As shown in FIG. 1 , a first transfer arm 14 is provided on the side of the position adjustment mechanism 12 . The first transfer arm 14 is used when holding the workpiece 11 and the like and transporting the workpiece 11 and the like rearward. . A motor (not shown) and a cylinder are connected to the base end of the first transfer arm 14 . Therefore, the front end portion of the first transfer arm 14 moves (rotates) around the rotation axis that is substantially parallel to the Z-axis direction through the base end portion of the first transfer arm 14 by the power of the motor, and is moved (rotated) by the rotation of the cylinder. It moves up and down (lifting) due to power.

A first holding pad 16 is provided at the front end of the first transfer arm 14 . The first holding pad 16 can attract and hold the upper surface (surface to be ground) side of the workpiece 11 and the like. The first holding pad 16 includes, for example, a disk-shaped frame 18 (see FIG. 5 and the like). A recessed portion 18 a is provided in the lower portion of the frame 18 (see FIG. 5 and the like). The lower end of the recessed portion 18 a opens in a circular shape on the lower surface of the frame 18 .

A porous disk-shaped holding plate 20 made of a material such as ceramic is fixed to the recessed portion 18 a (see FIG. 5 and the like). The circular lower surface (second holding surface) 20 a of the holding plate 20 (see FIG. 5 and others) functions as a holding surface for holding the workpiece 11 and the like. The upper surface side of the holding plate 20 is connected to a suction source (not shown) such as an injector through a flow path (not shown) provided inside the frame 18 , a valve (not shown) arranged outside the frame 18 , etc. icon) connection.

Therefore, if the valve is opened with the workpiece 11 etc. in contact with the lower surface 20 a of the holding plate 20 and the negative pressure of the suction source acts, the workpiece 11 etc. will be sucked by the first holding pad 16 . That is, the workpiece 11 and the like are held by the lower surface 20 a of the first holding pad 16 . For example, the first holding pad 16 holds the workpiece 11 whose position has been adjusted by the position adjustment mechanism 12 , and the first holding pad 16 is rotated by the first conveyance arm 14 to convey the workpiece 11 to the rear.

A turntable 22 is provided behind the first transfer arm 14 and the first holding pad 16 . The rotary table 22 is connected to a motor (not shown) and the like, and is rotated around a rotation axis substantially parallel to the Z-axis direction by the power of the motor or the like. Three sets of disk-shaped chuck tables (processing chuck tables) 24 are provided on the upper surface of the turntable 22 at substantially equal angular intervals along the circumferential direction of the turntable 22 . However, the number of chuck tables 24 is not limited to this aspect.

Each chuck table 24 includes a disc-shaped frame 26 made of ceramic or other materials. The upper part of the frame 26 is provided with a recessed portion 26 a whose upper end opens in a circular shape on the upper surface of the frame 26 (see FIG. 5 and the like). A porous disk-shaped holding plate 28 made of a material such as ceramic is fixed to the recessed portion 26a.

The upper surface (first holding surface) 28a of the holding plate 28 is configured in a shape corresponding to a side surface of a cone, for example, and functions as a holding surface for holding the workpiece 11 and the like. In addition, the height difference (height difference) between the center of the upper surface 28a of the holding plate 28 corresponding to the apex of the cone and the outer peripheral edge of the upper surface 28a of the holding plate 28 is about 10 μm to 30 μm.

The lower surface side of the holding plate 28 is connected to a suction source (such as an injector) through a flow path 26b (see FIG. 5 etc.) provided inside the frame 26, a valve (not shown) arranged outside the frame 26, etc. (not shown) connection. Therefore, if the valve is opened while the workpiece 11 (protective member) etc. is in contact with the upper surface 28a of the holding plate 28 and the negative pressure of the suction source acts, the chuck table 24 will suck the workpiece 11 etc. . That is, the workpiece 11 and the like are held by the upper surface 28 a of the chuck table 24 .

A motor (not shown) or the like is connected to the lower part of the frame 26 of each chuck table 24 , and each chuck table 24 is driven by the power of this motor or the like to rotate around a rotation axis that is substantially parallel to the Z-axis direction or the like. Rotate on a slightly tilted rotation axis relative to the Z-axis direction. That is, each chuck table 24 is configured to be rotatable around a rotation axis that intersects with its upper surface 28a.

For example, when the rotary table 22 rotates in the direction of the arrow in FIG. 1 and in the opposite direction to the arrow, each chuck table 24 moves along the circumferential direction of the rotary table 22 . Specifically, the rotary table 22 moves the chuck table 24 sequentially, for example, in the following areas: the loading and unloading area adjacent to the first transfer arm 14 and the first holding pad 16, the rough grinding area behind the loading and unloading area, and the rough grinding area. The finishing area on the side of the grinding area and the loading and unloading area. The workpiece 11 is transported from the position adjustment table of the position adjustment mechanism 12 to the chuck table 24 arranged in the loading and unloading area by the first transport arm 14 and the first holding pad 16 .

As shown in FIG. 1 , columnar support structures 30 are respectively provided behind the rough grinding area and the fine grinding area (that is, behind the rotary table 22 ). A Z-axis moving mechanism 32 is provided on the front surface side of each support structure 30 . Each Z-axis moving mechanism 32 is provided with a pair of guide rails 34 that are substantially parallel to the Z-axis direction, and the moving plate 36 is slidably mounted on the pair of guide rails 34 .

A nut portion (not shown) constituting a ball screw is provided on the rear surface side (back side) of each moving plate 36 . The nut portion is rotatably connected to a ball screw that is substantially parallel to the guide rail 34 . Screw shaft 38. A motor 40 and the like are connected to one end of the screw shaft 38 . When the screw shaft 38 is rotated by the motor 40 etc., the moving plate 36 moves along the guide rail 34 (Z-axis direction).

A fixture 42 is provided on the front surface (front surface) of each moving plate 36 . Each fixture 42 supports a grinding unit (processing unit) 44 capable of grinding the workpiece 11 held by the chuck table 24 in a rough grinding area or a fine grinding area. Each grinding unit 44 includes a spindle housing 46 fixed to a fixture 42 . The spindle 48 is accommodated in each spindle housing 46 in such a manner that it can rotate about its axis. The spindle 48 becomes a rotation axis that is parallel to the Z-axis direction or a rotation axis that is slightly inclined with respect to the Z-axis direction.

The lower end of each spindle 48 is exposed from the lower end surface of the spindle housing 46, and a disc-shaped mounting member 50 is fixed to the lower end of the spindle 48. For example, a plurality of holes (not shown) that penetrate the mounting member 50 in the thickness direction are provided at the outer edge of each mounting member 50, and bolts 52 and the like are inserted into each hole.

A grinding wheel 54 for rough grinding is mounted on the lower surface of the attachment 50 of the grinding unit 44 on the rough grinding area side with bolts 52 . That is, the grinding wheel 54 for rough grinding is installed on the main spindle 48 on the rough grinding area side. Furthermore, the spindle housing 46 of the grinding unit 44 on the rough grinding area side accommodates a motor (not shown) connected to the upper end side of the spindle 48 and the like. The grinding wheel 54 for rough grinding rotates together with the spindle 48 by the power of this motor or the like.

On the other hand, a grinding wheel 54 for fine grinding is attached to the lower surface of the attachment 50 of the grinding unit 44 on the fine grinding area side with bolts 52 . That is, the grinding wheel 54 for fine grinding is installed on the spindle 48 on the fine grinding area side. Furthermore, the spindle housing 46 of the grinding unit 44 on the side of the fine grinding area accommodates a motor (not shown) connected to the upper end side of the spindle 48 and the like. The grinding wheel 54 for fine grinding rotates together with the spindle 48 by the power of this motor or the like.

Each grinding wheel 54 includes an annular wheel base formed of metal such as stainless steel or aluminum. A plurality of grinding grindstones are fixed on the lower surface of the wheel base along the circumferential direction of the wheel base. The plurality of grinding grindstones are made by dispersing abrasive grains such as diamond in a bonding agent such as a ceramic bond or a resin bond. become.

For example, the average particle size of the abrasive grains contained in the grinding stone of the grinding wheel 54 for fine grinding is smaller than the average particle size of the abrasive grains contained in the grinding stone of the grinding wheel 54 for rough grinding. Thereby, the grinding wheel 54 for rough grinding suitable for rough grinding and the grinding wheel 54 for fine grinding suitable for fine grinding are realized. The specific size of the abrasive grains is appropriately set according to the quality required of the workpiece 11 after grinding.

A nozzle 56 is arranged near each grinding unit 44, and the nozzle 56 can supply a liquid (grinding fluid) such as pure water to a portion of the workpiece 11 in contact with the grinding stone. In addition, a liquid supply port for supplying liquid may be provided in the grinding wheel 54 or the like instead of or together with the nozzle 56 .

The upper surface side of the workpiece 11 held by the chuck table 24 in the rough grinding area is ground by the grinding unit 44 on the rough grinding area side. Furthermore, the upper surface side of the workpiece 11 held by the chuck table 24 in the fine grinding area is ground and processed by the grinding unit 44 on the side of the fine grinding area.

That is, by sequentially moving the chuck table 24 holding the workpiece 11 in the loading and unloading area, the rough grinding area, and the fine grinding area, the rough grinding of the workpiece 11 and the finishing after rough grinding are continuously performed. grinding. When the chuck table 24 in the fine grinding area completes the fine grinding of the workpiece 11, it is positioned in the loading/unloading area again.

A second transport arm 58 is provided in front of the loading and unloading area and on the side of the first transport arm 14 and the first holding pad 16. The second transport arm 58 holds the workpiece 11 after grinding and grinds the workpiece 11. It is used when the processed workpiece 11 is transported forward. A motor (not shown) and a cylinder are connected to the base end of the second transfer arm 58 . Therefore, the front end portion of the second transfer arm 58 moves (rotates) around the rotation axis that is substantially parallel to the Z-axis direction through the base end portion of the second transfer arm 58 by the power of the motor, and is moved (rotated) by the rotation of the cylinder. It moves up and down (lifting) due to power.

A second holding pad 60 that can attract and hold the upper surface (surface to be ground) side of the workpiece 11 is provided at the front end of the second transfer arm 58 . The second holding pad 60 includes, for example, a disk-shaped frame 62 (see FIG. 7 and the like). The lower part of the frame 62 is provided with a recess 62 a whose lower end opens in a circular shape on the lower surface of the frame 62 (see FIG. 7 and the like).

A porous disk-shaped holding plate 64 made of a material such as ceramic is fixed to the recess 62 a (see FIG. 7 and the like). The circular lower surface (second holding surface) 64 a of the holding plate 64 (see FIG. 7 and others) functions as a holding surface for holding the workpiece 11 and the like. The upper surface side of the holding plate 64 is connected to a suction source (not shown) such as an injector through a flow path (not shown) provided inside the frame 62 , a valve (not shown) arranged outside the frame 62 , etc. icon) connection.

Therefore, if the valve is opened with the workpiece 11 etc. in contact with the lower surface 64 a of the holding plate 64 and the negative pressure of the suction source acts, the workpiece 11 etc. will be sucked by the second holding pad 60 . That is, the workpiece 11 etc. is held by the lower surface 64a of the second holding pad 60. For example, the ground workpiece 11 is held by the second holding pad 60 , and the second holding pad 60 is rotated by the second transfer arm 58 to carry the ground workpiece 11 from The chuck table 24 of the unloading area is moved forward.

A cleaning unit 66 is provided on the side of the second transfer arm 58 and the second holding pad 60. The cleaning unit 66 cleans the ground workpiece 11 carried out from the chuck table 24 in the loading and unloading area. actual use. The cleaning unit 66 includes, for example, a cleaning nozzle (not shown) that can spray cleaning fluid. A chuck table (cleaning chuck table) 68 that holds the workpiece 11 when the workpiece 11 is washed with the cleaning unit 66 (cleaning nozzle) is disposed below the cleaning nozzle.

The structure of the chuck table 68 is the same as the structure of the chuck table 24 that holds the workpiece 11 when the workpiece 11 is ground by the above-mentioned grinding unit 44 . However, the diameter of the chuck table 68 of this embodiment is, for example, smaller than the diameter of the above-mentioned chuck table 24 . Furthermore, the upper surface (first holding surface) 68a of the chuck table 68 is configured to be substantially flat, unlike the upper surface 28a of the chuck table 24.

A motor (not shown) or the like is connected to the lower part of the chuck table 68 , and the chuck table 68 is rotated around a rotation axis substantially parallel to the Z-axis direction by the power of the motor or the like. That is, the chuck table 68 is configured to be rotatable around a rotation axis that intersects with the upper surface 68a. The workpiece 11 is transported from the chuck table 24 arranged in the loading and unloading area to the chuck table 68 by the second transport arm 58 and the second holding pad 60 .

While the chuck table 68 is rotating, the cleaning fluid is sprayed from the cleaning nozzle toward the workpiece 11 held by the chuck table 68 , thereby cleaning the workpiece 11 . The cleaning fluid sprayed from the cleaning nozzle is typically a mixed fluid (two fluids) in which water and air are mixed. Of course, water that is not mixed with air can also be used as the cleaning fluid. The cleaned workpiece 11 is conveyed by the robot arm 6 and accommodated in the cassette 8b, for example.

The control unit 70 is connected to each element of the grinding device 2 . This control unit 70 is composed of, for example, a computer including a processing device 72 and a memory device 74, and controls the operations of each element of the above-mentioned grinding device 2 in order to appropriately grind the workpiece 11.

The processing device 72 is typically a CPU (Central Processing Unit), and performs various processes necessary to control the above-mentioned elements. The memory device 74 includes, for example, a main memory device such as DRAM (Dynamic Random Access Memory) and an auxiliary memory device such as a hard disk drive or flash memory. The function of the control unit 70 is realized, for example, by causing the processing device 72 to operate according to a program stored in the memory device 74 .

The input device 76 is connected to the control unit 70 . The input device 76 is, for example, a touch panel, and inputs instructions from the operator into the control unit 70 . This touch panel also serves as a display device for displaying information output from the control unit 70 . In addition, a keyboard, mouse, etc. may also be used as the input device 76 .

The control unit 70 of this embodiment is configured to clean the upper surface 28a of the chuck table 24, the upper surface 68a of the chuck table 68, and the upper surface 28a of the chuck table 68 using the plate-shaped cleaning plate 1 accommodated in the above-mentioned cassettes 8a and 8b. The lower surface 20a of one retaining pad 16 or the lower surface 64a of the second retaining pad 60.

More specifically, for example, a program for causing the processing device 72 to execute a program required for cleaning is stored in a part of the memory device 74 which is a non-transitory recording medium that can be read by a computer or the like. The processing device 72 follows this program to execute various programs required for cleaning.

FIG. 3 is a functional block diagram schematically showing the functional structure of the control unit 70 implemented by the above-mentioned program, and FIG. 4 is a flowchart showing the flow of the cleaning process. In addition, in FIG. 3 , for convenience of explanation, elements such as the input device 76 connected to the control unit 70 , the holding unit 78 , and the transport unit 80 are shown together.

As shown in FIG. 3 , the control unit 70 includes an input determination unit 70 a that determines input from the input device 76 . For example, if an instruction to start any one of the following four cleaning modes is input from the input device 76, the input determination unit 70a notifies the holding unit control unit 70b and the transfer unit control unit 70c of the purpose. The cleaning mode is: a first cleaning mode that executes a series of procedures for cleaning the upper surface 28a of any chuck table 24; a second cleaning mode that executes a series of procedures for cleaning the upper surface 68a of the chuck table 68; The third cleaning mode is a series of procedures for cleaning the lower surface 20 a of the first holding pad 16 ; or the fourth cleaning mode is a series of procedures for cleaning the bottom surface 64 a of the second holding pad 60 .

If the holding unit control unit 70b and the transfer unit control unit 70c receive the notification from the input determination unit 70, they respectively use the holding unit 78 and the transfer unit 80 to execute the first cleaning mode, the second cleaning mode, the third cleaning mode or the notification. A series of procedures required for any of the fourth cleaning modes.

In addition, the holding unit 78 includes the above-mentioned rotary table 22, the chuck table 24, the chuck table 68, and the motors, valves and other elements accompanying these. In addition, the transport unit 80 includes the above-mentioned robot arm 6, the first transport arm 14, the first holding pad 16, the second transport arm 58, the second holding pad 60, and the motors, cylinders, valves and other elements accompanying these.

First, a first cleaning mode for executing a series of procedures for cleaning the upper surface 28 a of an arbitrary chuck table 24 , that is, a first aspect of the cleaning method will be described. For example, if an instruction to start the first cleaning mode is input from the input device 76 (YES in step ST11), the input determination unit 70a notifies the holding unit control unit 70b and the transfer unit control unit 70c of the start of the first cleaning mode.

The transport unit control unit 70 c, which has been notified of the start of the first cleaning mode by the input determination unit 70 a, uses the transport unit 80 to carry out the cleaning plate 1 accommodated in the cassette 8 a (or the cassette 8 b). Specifically, the transport unit control unit 70 c uses, for example, the robot arm 6 to transport the cleaning plate 1 out of the cassette 8 a (or the cassette 8 b ) and place it on the position adjustment table of the position adjustment mechanism 12 .

In the first cleaning mode, the transport unit control part 70c uses the robot arm 6 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 with the second surface 1b facing upward. Thereafter, the transport unit control unit 70 c holds the second surface 1 b of the cleaning plate 1 placed on the position adjustment table of the position adjustment mechanism 12 with the lower surface 20 a of the first holding pad 16 (step ST12 ).

The holding unit control part 70b rotates the rotating table 22 as necessary, and arranges the chuck table 24 to be cleaned in the loading and unloading area. And the transport unit control part 70c rotates the 1st holding pad 16, and arrange|positions it above the chuck table 24 arrange|positioned in the carry-in and unload area. Then, the holding unit control part 70b rotates the chuck table 24 arranged in this loading/unloading area (step ST13). FIG. 5 is a cross-sectional view schematically showing a state in which the first holding pad 16 holding the cleaning plate 1 is arranged above the chuck table 24 in a rotating state.

Then, the transport unit control part 70c lowers the 1st holding pad 16, and presses the 1st surface 1a of the cleaning plate 1 to the upper surface 28a of the chuck table 24 (step ST14). FIG. 6 is a cross-sectional view schematically showing the state of the upper surface 28a of the chuck table 24 in a state where the first surface 1a of the cleaning plate 1 is pressed and rotated.

In this way, when the first surface 1a of the cleaning plate 1 is pressed against the upper surface 28a of the chuck table 24 in the rotating state, the chips etc. attached to the upper surface 28a of the chuck table 24 are set on the cleaning plate. The uneven structure on the first surface 1a side of 1 is removed from the upper surface 28a. That is, the upper surface 28a of the chuck table 24 is cleaned.

When the cleaning of the upper surface 28 a of the chuck table 24 is completed, for example, the holding unit control unit 70 b stops the rotation of the chuck table 24 . Then, the transport unit control part 70c places the cleaning plate 1 held by the first holding pad 16 on the chuck table 24. Furthermore, the transport unit control part 70c holds the cleaning plate 1 placed on this chuck table 24 using the second holding pad 60.

Thereafter, the transport unit control part 70c rotates the second holding pad 60 and arranges it above the chuck table 68, and places the cleaning plate 1 held by the second holding pad 60 on the chuck table 68. Then, the transport unit control part 70c uses the robot arm 6 to transport the cleaning plate 1 placed on the chuck table 68 into the cassette 8a (or the cassette 8b).

Furthermore, in the first cleaning mode, after the holding unit control part 70b rotates the chuck table 24, the transport unit control part 70c presses the first surface 1a of the cleaning plate 1 to the upper surface 28a of the chuck table 24. However, this sequence may be reversed as long as the load applied to the rotation of the chuck table 24 does not become too large. That is, after the transport unit control part 70c presses the first surface 1a of the cleaning plate 1 to the upper surface 28a of the chuck table 24, the holding unit control part 70b may rotate the chuck table 24.

In addition, in this first cleaning mode, after the cleaning of the upper surface 28a of the chuck table 24 is completed, the cleaning plate 1 is carried into the cassette 8a (or cassette 8b) via the chuck table 68, but it does not need to be via the chuck table 68. The chuck table 68 carries the cleaning plate 1 into the cassette 8a (or cassette 8b) via the position adjustment mechanism 12.

In this case, for example, the transport unit control unit 70 c rotates the first holding pad 16 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 . Thereby, the transport unit control part 70c can use the robot arm 6 to carry the cleaning plate 1 carried on the position adjustment table of the position adjustment mechanism 12 into the cassette 8a (or the cassette 8b).

Next, a second cleaning mode for executing a series of procedures for cleaning the upper surface 68 a of the chuck table 68 , that is, a second aspect of the cleaning method will be described. For example, if an instruction to start the second cleaning mode is input from the input device 76 (YES in step ST11), the input determination unit 70a notifies the holding unit control unit 70b and the transfer unit control unit 70c of the start of the second cleaning mode.

The transport unit control unit 70 c, which has been notified of the start of the second cleaning mode by the input determination unit 70 a, uses the transport unit 80 to carry out the cleaning plate 1 accommodated in the cassette 8 a (or the cassette 8 b). Specifically, the transport unit control unit 70 c uses, for example, the robot arm 6 to transport the cleaning plate 1 out of the cassette 8 a (or the cassette 8 b ) and place it on the position adjustment table of the position adjustment mechanism 12 .

In the second cleaning mode, the transport unit control part 70c uses the robot arm 6 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 with the second surface 1b facing upward. Thereafter, the transport unit control unit 70 c holds the second surface 1 b of the cleaning plate 1 placed on the position adjustment table of the position adjustment mechanism 12 with the lower surface 20 a of the first holding pad 16 .

Next, the transport unit control part 70c rotates the first holding pad 16 to load the cleaning plate 1 on the chuck table 24 arranged in the loading and unloading area. And the transport unit control part 70c holds the 2nd surface 1b of the cleaning plate 1 mounted on this chuck table 24 with the lower surface 64a of the 2nd holding pad 60 (step ST12).

Furthermore, the transport unit control part 70c rotates the second holding pad 60 and arranges it above the chuck table 68 . Then, the holding unit control part 70b rotates the chuck table 68 (step ST13). FIG. 7 is a cross-sectional view schematically showing a state in which the second holding pad 60 holding the cleaning plate 1 is arranged above the chuck table 68 in a rotating state.

Thereafter, the transport unit control part 70c lowers the second holding pad 60 and presses the first surface 1a of the cleaning plate 1 against the upper surface 68a of the chuck table 68 (step ST14). FIG. 8 is a cross-sectional view schematically showing the state of the upper surface 68a of the chuck table 68 in a state where the first surface 1a of the cleaning plate 1 is pressed and rotated.

In this way, when the first surface 1 a of the cleaning plate 1 is pressed against the upper surface 68 a of the chuck table 68 in a rotating state, the chips and the like attached to the upper surface 68 a of the chuck table 68 are set on the cleaning plate. The uneven structure on the first surface 1a side of 1 is removed from the upper surface 68a. That is, the upper surface 68a of the chuck table 68 is cleaned.

When the cleaning of the upper surface 68 a of the chuck table 68 is completed, for example, the holding unit control part 70 b stops the rotation of the chuck table 68 , and the transport unit control part 70 c places the cleaning plate 1 held on the second holding pad 60 on the chuck table 68 . Chuck table 68. Then, the transport unit control part 70c uses the robot arm 6 to transport the cleaning plate 1 placed on the chuck table 68 into the cassette 8a (or the cassette 8b).

Furthermore, in the second cleaning mode, after the holding unit control part 70b rotates the chuck table 68, the transport unit control part 70c presses the first surface 1a of the cleaning plate 1 to the upper surface 68a of the chuck table 68. However, this sequence may be reversed as long as the load applied to the rotation of the chuck table 68 does not become too large. That is, after the transport unit control part 70c presses the first surface 1a of the cleaning plate 1 to the upper surface 68a of the chuck table 68, the holding unit control part 70b may rotate the chuck table 68.

Moreover, in this second cleaning mode, after the cleaning of the upper surface 68a of the chuck table 68 is completed, the cleaning plate 1 is carried into the cassette 8a (or cassette 8b) via the chuck table 68, but it does not need to be via the chuck table 68. The chuck table 68 carries the cleaning plate 1 into the cassette 8a (or cassette 8b) via the position adjustment mechanism 12.

Next, a third cleaning mode for executing a series of procedures for cleaning the lower surface 20 a of the first holding pad 16 , that is, a third aspect of the cleaning method, will be described. For example, if an instruction to start the third cleaning mode is input from the input device 76 (YES in step ST11), the input determination unit 70a notifies the holding unit control unit 70b and the transfer unit control unit 70c of the start of the third cleaning mode.

The transport unit control unit 70 c, which has been notified of the start of the third cleaning mode by the input determination unit 70 a, uses the transport unit 80 to carry out the cleaning plate 1 accommodated in the cassette 8 a (or the cassette 8 b). Specifically, the transport unit control unit 70 c uses, for example, the robot arm 6 to transport the cleaning plate 1 out of the cassette 8 a (or the cassette 8 b ) and place it on the position adjustment table of the position adjustment mechanism 12 .

In the third cleaning mode, the transport unit control unit 70 c uses the robot arm 6 to place the cleaning plate 1 on the position adjustment table of the position adjustment mechanism 12 with the first surface 1 a facing upward. Thereafter, the transport unit control unit 70 c holds the first surface 1 a of the cleaning plate 1 placed on the position adjustment table of the position adjustment mechanism 12 with the lower surface 20 a of the first holding pad 16 .

Next, the transport unit control part 70c rotates the first holding pad 16 to load the cleaning plate 1 on the chuck table 24 arranged in the loading and unloading area. And the holding unit control part 70b holds the 2nd surface 1b of the cleaning plate 1 with the upper surface 28a of the chuck table 24 (step ST12).

Then, the holding unit control part 70b rotates the chuck table 24 holding the cleaning plate 1 (step ST13). FIG. 9 is a cross-sectional view schematically showing a state in which the first holding pad 16 is arranged above the cleaning plate 1 that rotates together with the chuck table 24 .

Then, the transport unit control part 70c lowers the 1st holding pad 16, and presses the lower surface 20a of the 1st holding pad 16 to the 1st surface 1a of the cleaning plate 1 (step ST14). In other words, the first surface 1 a of the cleaning plate 1 is pressed by the lower surface 20 a of the first holding pad 16 . FIG. 10 is a cross-sectional view schematically showing a state in which the lower surface 20 a of the first holding pad 16 is pressed against the first surface 1 a of the cleaning plate 1 that rotates together with the chuck table 24 .

In this way, when the lower surface 20a of the first holding pad 16 is pressed against the first surface 1a of the cleaning plate 1 in a rotating state, the debris and the like adhering to the lower surface 20a of the first holding pad 16 are set on the cleaning surface. The uneven structure on the first surface 1a side of the plate 1 is removed from the lower surface 20a. That is, the lower surface 20a of the first holding pad 16 is cleaned.

When the cleaning of the lower surface 20 a of the first holding pad 16 is completed, for example, the holding unit control unit 70 b stops the rotation of the chuck table 24 and releases the holding of the cleaning plate 1 by the chuck table 24 . Next, the transport unit control part 70c holds the cleaning plate 1 placed on the chuck table 24 using the second holding pad 60.

Thereafter, the transport unit control part 70c rotates the second holding pad 60 and arranges it above the chuck table 68, and places the cleaning plate 1 held by the second holding pad 60 on the chuck table 68. Then, the transport unit control part 70c uses the robot arm 6 to transport the cleaning plate 1 placed on the chuck table 68 into the cassette 8a (or the cassette 8b).

Furthermore, in the third cleaning mode, after the holding unit control part 70b rotates the chuck table 24 together with the cleaning plate 1, the transport unit control part 70c presses the lower surface 20a of the first holding pad 16 to the cleaning plate. 1, but this sequence may be reversed as long as the load imposed on the rotation of the chuck table 24 does not become too large. That is, after the transport unit control unit 70c presses the lower surface 20a of the first holding pad 16 against the first surface 1a of the cleaning plate 1, the holding unit control unit 70b may rotate the chuck table 24.

Furthermore, in this third cleaning mode, the first surface 1 a side of the cleaning plate 1 provided with the concave and convex structure is held by the first holding pad 16 and the like. Therefore, it is desirable to provide the groove 1d that realizes the uneven structure of the cleaning plate 1 so that the suction force acting on the cleaning plate 1 from the first holding pad 16 and the like is not insufficient.

For example, when both ends of the groove 1d are opened on the outer peripheral surface 1c, the negative pressure of the suction source leaks from the openings at both ends of the groove 1d, and the suction force acting on the cleaning plate 1 from the first holding pad 16 etc. becomes It's easy to get enough. Then, the groove 1d is formed so that the total area of the openings formed in the outer peripheral surface 1c becomes, for example, 5 mm ² or less, preferably 2.5 mm ² or less.

Thereby, the first surface 1a side of the cleaning plate 1 is appropriately held by the first holding pad 16 and the like. In addition, both ends of the groove 1d formed in the cleaning plate 1 do not necessarily need to be opened on the outer peripheral surface 1c. In this case, there is no situation where the suction force acting on the cleaning plate 1 from the first holding pad 16 etc. is insufficient due to the leakage of the negative pressure.

Moreover, in this third cleaning mode, after the cleaning of the upper surface 68a of the chuck table 68 is completed, the cleaning plate 1 is carried into the cassette 8a (or cassette 8b) via the chuck table 68, but it does not need to be via the chuck table 68. The chuck table 68 carries the cleaning plate 1 into the cassette 8a (or cassette 8b) via the position adjustment mechanism 12.

Most of the third cleaning mode described above is common to the fourth cleaning mode that executes a series of procedures for cleaning the lower surface 64 a of the second holding pad 60 , that is, common to the fourth aspect of the cleaning method. In the fourth cleaning mode, the transport unit control part 70c uses the second holding pad 60 to press the lower surface 64a of the second holding pad 60 against the first surface 1a of the cleaning plate 1 held by the chuck table 24 (step ST14).

That is, the first surface 1 a of the cleaning plate 1 is pressed by the lower surface 64 a of the second holding pad 60 . In addition, in this fourth cleaning mode, the lower surface 64 a of the second holding pad 60 may be pressed against the first surface 1 a of the cleaning plate 1 held by the chuck table 68 .

As described above, the grinding device (processing device) 2 and the cleaning method of this embodiment use the holding unit 78 including the chuck table 24 and the chuck table 68, the transport unit 80 including the first holding pad 16 and the second holding pad 60, and The cleaning plate 1 with a concave and convex structure is provided on the first surface 1a side, and the upper surface (first holding surface) 28a of the cleaning chuck table 24, the upper surface (first holding surface) 68a of the chuck table 68, the first The lower surface (second holding surface) 20a of the holding pad 16 or the lower surface (second holding surface) 64a of the second holding pad 60 can clean the holding surface for holding the workpiece 11 without relying on a dedicated cleaning mechanism. .

In addition, the present invention is not limited to the description of the above-mentioned embodiment, and various modifications can be made and implemented. FIG. 11 is a perspective view schematically showing a cleaning plate 21 according to a modified example. The cleaning plate 21 of this modified example is the same as the cleaning plate 1 of the embodiment except that the grooves 21d that realize the uneven structure are provided in radial points.

That is, the cleaning plate 21 has a circular first surface 21a; a circular second surface 21b that is on the opposite side to the first surface 21a; and an outer peripheral surface 21c that connects the first surface 21a and the second surface. 21b. A plurality of linear grooves 21d passing through the center of the first surface 21a are formed on the first surface 21a side of the cleaning plate 1. Both ends of each groove 21d are opened on the outer peripheral surface 21c. The plurality of grooves 21d realize an uneven structure suitable for cleaning the holding surface.

Furthermore, in the above-described embodiment, the grinding device 2 used for grinding the workpiece 11 is exemplified as an example of the processing device. However, the present invention can be applied to a workpiece having a device capable of holding the workpiece in a holding unit. 11. Processing device of any processing unit for processing. For example, the processing device of the present invention may be a cutting device used for cutting the workpiece 11, which includes a cutting unit (processing unit) having a ring-shaped The spindle of the cutting blade; the grinding device used for grinding the workpiece 11, which has a grinding unit (processing unit) having a spindle equipped with a grinding pad; the laser of the workpiece 11 The laser processing device used for processing has a laser oscillator that generates a laser beam and an optical system (processing unit).

Moreover, in the above-described embodiment, the program for cleaning the holding surface is stored in the memory device 74 in the control unit 70, but this program may also be recorded in any non-transitory file that can be read by a computer, etc. recording media. For example, the program may be recorded on an optical disc such as a CD (Compact Disc) that can be distributed at low cost.

In addition, the structures, methods, etc. of the above-described embodiments and modifications can be appropriately modified and implemented within the scope that does not deviate from the purpose of the present invention.

2: Grinding device (processing device) 4:Abutment 4a: Accommodation Department 6: Robotic arm 8a: Cassette 8b: Cassette 10a: Cassette stand 10b:Cassette table 12: Position adjustment mechanism 14:The first conveying arm 16: First holding pad 18:Frame 18a: concave part 20:keep board 20a: Lower surface (second retaining surface) 22: Rotary table 24:Chuck table (chuck table for processing) 26:frame 26a: concave part 26b:Flow path 28:Keeping board 28a: Upper surface (first retaining surface) 30:Support structure 32:Z-axis moving mechanism 34: Guide rail 36:Mobile board 38:Screw shaft 40: Motor 42: Fixture 44: Grinding unit (processing unit) 46:Spindle housing 48:Spindle 50:Installation parts 52:bolt 54:Grinding wheel 56:Nozzle 58:Second transfer arm 60: Second holding pad 62:Frame 62a: concave part 64:keep board 64a: Lower surface (second retaining surface) 66:Cleaning unit 68:Chuck table (chuck table for cleaning) 68a: Upper surface (first retaining surface) 70:Control unit 70a: Input judgment part 70b: Holding unit control part 70c: Transport unit control section 72: Processing device 74:Memory device 76:Input device 78:Hold unit 80:Transport unit 1: Cleaning board 1a: First side 1b: Second side 1c: Outer peripheral surface 1d: slot 11: Processed objects 11a: Front 11b: Back 21: Cleaning board 21a: Side 1 21b:Second side 21c: Outer peripheral surface 21d: slot

FIG. 1 is a perspective view schematically showing a grinding device. FIG. 2 is a perspective view schematically showing a cleaning plate. FIG. 3 is a functional block diagram schematically showing the functional structure of the control unit. FIG. 4 is a flowchart showing the flow of cleaning processing. 5 is a cross-sectional view schematically showing a state in which the first holding pad holding the cleaning plate is arranged above the rotating chuck table in the first cleaning mode. 6 is a cross-sectional view schematically showing the state of the upper surface of the chuck table in a state where the first surface of the cleaning plate is pressed and rotated in the first cleaning mode. 7 is a cross-sectional view schematically showing a state in which the second holding pad holding the cleaning plate is arranged above the rotating chuck table in the second cleaning mode. 8 is a cross-sectional view schematically showing the state of the upper surface of the chuck table in a state where the first surface of the cleaning plate is pressed and rotated in the second cleaning mode. 9 is a cross-sectional view schematically showing a state in which the first holding pad is arranged above the cleaning plate that rotates together with the chuck table in the third cleaning mode. 10 is a cross-sectional view schematically showing a state in which the lower surface of the first holding pad is pressed against the first surface of the cleaning plate that rotates together with the chuck table in the third cleaning mode. FIG. 11 is a perspective view schematically showing a cleaning plate according to a modified example.

ST11: Enter cleaning mode steps

ST12: Keep cleaning plate steps

ST13: Rotating chuck table steps

ST14: Press the cleaning plate step

Claims (11)

A processing device having: A holding unit that includes a chuck table that has a first holding surface that holds a plate-shaped workpiece and is rotatable about a rotation axis that intersects the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; A cassette holding platform holds a cassette that can accommodate a plate-shaped cleaning plate with a concave and convex structure on the first side and the workpiece; A transport unit includes a holding pad having a second holding surface for holding the workpiece, and can transport the workpiece accommodated in the cassette to the chuck table; and A control unit has a processing device and a memory device, and can control the holding unit and the transport unit according to the program memorized in the memory device, The control unit follows the program and executes the following program to clean the first holding surface of the chuck table: The procedure of using the transport unit to carry out the cleaning plate contained in the cassette, and using the second holding surface of the holding pad to hold the second surface of the cleaning plate that is opposite to the first surface; In a state where the second surface of the cleaning plate is held by the second holding surface of the holding pad, the first surface of the cleaning plate is pressed to the first holding surface of the chuck table by the transport unit. interview procedures; and A process of rotating the chuck table while the first surface of the cleaning plate is pressed to the first holding surface of the chuck table by the transport unit. A processing device having: A holding unit that includes a chuck table that has a first holding surface that holds a plate-shaped workpiece and is rotatable about a rotation axis that intersects the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; A cassette holding platform holds a cassette that can accommodate a plate-shaped cleaning plate with a concave and convex structure on the first side and the workpiece; A transport unit includes a holding pad having a second holding surface for holding the workpiece, and can transport the workpiece accommodated in the cassette to the chuck table; and A control unit has a processing device and a memory device, and can control the holding unit and the transport unit according to the program memorized in the memory device, The control unit follows the program and executes the following program to clean the second holding surface of the holding pad: The procedure of using the transport unit to move out the cleaning plate contained in the cassette, and using the first holding surface of the chuck table to hold the second surface of the cleaning plate opposite to the first surface; With the first holding surface of the chuck table holding the second surface of the cleaning plate, the transport unit is used to press the second holding surface of the holding pad to the first surface of the cleaning plate. interview procedures; and The process of rotating the chuck table while pressing the second holding surface of the holding pad to the first surface of the cleaning plate. The processing device of claim 1 or 2, wherein the chuck table holds the workpiece when the workpiece is processed by the processing unit. The processing device of claim 1 or 2, which further includes a cleaning unit capable of cleaning the processed object, The chuck table holds the workpiece while the cleaning unit cleans the workpiece. A cleaning method that is used when cleaning the first holding surface of a chuck table of a processing device. The processing device is provided with: A holding unit, which includes the chuck table, which has the first holding surface for holding the plate-shaped workpiece, and is rotatable around a rotation axis that intersects the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; A cassette holding platform holds a cassette that can accommodate a plate-shaped cleaning plate with a concave and convex structure on the first side and the workpiece; and A transport unit includes a holding pad having a second holding surface for holding the workpiece, and can transport the workpiece accommodated in the cassette to the chuck table, The cleaning method uses the transport unit to move out the cleaning plate stored in the cassette, and uses the second holding surface of the holding pad to hold the second surface of the cleaning plate that is opposite to the first surface. , In a state where the second surface of the cleaning plate is held by the second holding surface of the holding pad, the first surface of the cleaning plate is pressed to the first holding surface of the chuck table by the transport unit. noodle, When the first surface of the cleaning plate is pressed to the first holding surface of the chuck table by the transport unit, the first holding surface of the chuck table is cleaned by rotating the chuck table. . A cleaning method used when cleaning the second holding surface of a holding pad of a processing device, the processing device having: A holding unit that includes a chuck table that has a first holding surface that holds a plate-shaped workpiece and is rotatable about a rotation axis that intersects the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; A cassette holding platform holds a cassette that can accommodate a plate-shaped cleaning plate with a concave and convex structure on the first side and the workpiece; and A transport unit includes the holding pad having the second holding surface for holding the workpiece, and can transport the workpiece accommodated in the cassette to the chuck table, The cleaning method uses the transport unit to move out the cleaning plate contained in the cassette, and uses the first holding surface of the chuck table to hold the second side of the cleaning plate opposite to the first surface. noodle, With the first holding surface of the chuck table holding the second surface of the cleaning plate, the transport unit is used to press the second holding surface of the holding pad to the first surface of the cleaning plate. noodle, When the second holding surface of the holding pad is pressed to the first surface of the cleaning plate, the second holding surface of the holding pad is cleaned by rotating the chuck table. The cleaning method of claim 5 or 6, wherein when the workpiece is processed by the processing unit, the chuck table holds the workpiece. For example, the cleaning method of claim 5 or 6, wherein the processing device further includes a cleaning unit that can clean the processed object, When the cleaning unit cleans the workpiece, the chuck table holds the workpiece. A cleaning plate, which is a plate-shaped cleaning plate used when cleaning the first holding surface of the chuck table or the second holding surface of the holding pad of a processing device. The processing device is provided with: A holding unit, which includes the chuck table, which has the first holding surface for holding the plate-shaped workpiece, and is rotatable around a rotation axis that intersects the first holding surface; a processing unit capable of processing the workpiece held in the holding unit; A cassette holding platform holds a cassette that can accommodate the object to be processed; and A transport unit includes the holding pad having the second holding surface for holding the workpiece, and can transport the workpiece accommodated in the cassette to the chuck table, This cleaning board has: the first side of the circular shape; and a circular second surface opposite to the first surface, A concave and convex structure is provided on the first side. For example, the cleaning board of claim 9 is made of silicon. The cleaning plate of claim 9 or 10, wherein when cleaning the first holding surface of the chuck table, the second surface is held by the second holding surface of the holding pad, and when cleaning the holding surface The second holding surface of the pad is held by the first holding surface of the chuck table.