JP2011121122A - Grinding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding device requiring less space for installation and capable of grinding a large plate-like object. <P>SOLUTION: A chuck table 70 for sucking and holding a wafer W is provided to each side-surface 62 of a quadratic prism-like rotary holding body 60, and the rotary holding body 60 is intermittently rotated in increments of 90&deg;. The positions of the three side-surfaces 62 when the rotary holding body is stopped to rotate are set to the rough grinding position, the finish grinding position, and the polishing position, and a grinding means for rough grinding 80A, a grinding means for finish grinding 80B, and a grinding means for polishing 80C are disposed so as to face these machining positions, respectively. The wafers W sucked and held on the chuck table 70 at the loading/unloading positions are sequentially set to the respective machining positions by rotating the rotary holding body 60, and the wafers are rough ground, finish ground, and polished at these respective machining positions. The space for installation of the grinding device can be saved by three-dimensionally holding the plurality of wafers W by the quadratic prism-like rotary holding body 60. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a grinding apparatus for grinding a plate-shaped workpiece such as a semiconductor wafer.

  Semiconductor wafers formed on the surface of a large number of devices having electronic circuits such as ICs and LSIs divided by the division lines, resin substrates, various ceramic substrates and glass substrates used for electronic components, etc. After the back surface is ground and polished to a predetermined thickness, the plate-like material is divided into individual devices by means such as cutting or laser processing. Thinning by backside grinding is performed for the purpose of reducing the size and weight of equipment and improving heat dissipation. The devices (chips) processed and divided in this way are widely used in various electric / electronic devices such as mobile phones and personal computers.

  As a grinding apparatus for grinding the back surface of the plate-like material, a grinding apparatus called a grinder having a plurality of grinding (polishing) means such as rough grinding means and finish grinding means (which may include polishing means) is generally used. It has been. This type of grinding machine rotates a turntable in which a plurality of chuck tables are arranged at equal intervals on the outer periphery, and processes a workpiece that is a plate-like object that is held on the chuck table and the back surface is exposed. There is known a technique in which a workpiece is sequentially subjected to a series of processes from rough grinding to finish grinding and polishing by a grinding means or a polishing means disposed at a position and disposed above the processing position (for example, Patent Document 1). 2).

JP 2001-284303 A JP-A-10-86048

  By the way, in recent plate-like objects, the size has been increased in order to increase the number of devices per work, and in particular, standardization of φ450 mm has been promoted for semiconductor wafers. Semiconductor wafers at present are generally of a size of, for example, φ200 mm or φ300 mm, so that the size of φ450 mm semiconductor wafers is greatly increased. Therefore, in order to produce such a large semiconductor wafer grinding apparatus with a turntable type as described above, the entire apparatus including the turntable is increased in size and weight, and the turntable is rotated. There arises a problem that a rotating mechanism or the like needs a large amount of operating energy.

  This invention is made | formed in view of the said situation, The main technical subject is to provide the grinding device which can grind a large sized plate-shaped object in more space saving.

  The grinding device of the present invention has a plurality of side surfaces between both end surfaces, and a polygonal column-shaped rotation holding body that is rotatably supported around a rotation axis extending in the axial direction extending between the both end surfaces, and the rotation A rotation driving means for intermittently rotating the holding body; a holding surface for holding the plate-like workpiece; and a holding surface support portion for rotatably supporting the holding surface with a direction orthogonal to the holding surface as a rotation axis. The holding surface is arranged in parallel with the side surface and supported by the rotary holding body, and the holding table is disposed to face the holding surface of the holding table when the rotary holding body stops rotating. And a grinding means including a grinding tool acting on a workpiece held on the surface.

  In the grinding apparatus of the present invention, a plurality of holding tables for holding the workpiece are arranged on each side of the rotary holding body, and the grinding means arranged to face each side against the workpiece held on these holding tables. Grinding is performed. The grinding means is to be ground in stages, such as for rough grinding and finishing (including polishing means), and the work is stopped at a position facing each grinding means by rotating the rotating holder. By repeating the process of grinding, the workpiece can be sequentially processed from rough grinding to finish grinding or polishing.

  According to the present invention, since the holding table for holding the workpiece is disposed on the side surface of the polygonal columnar rotating holder, the workpiece is positioned and held in a three-dimensional manner. Therefore, a significant space saving can be achieved as compared with the conventional turntable type in which the workpieces are arranged in a plane.

The work referred to in the present invention is not particularly limited. For example, a silicon wafer, a semiconductor wafer made of gallium arsenide (GaAs), ceramic, glass, a sapphire (Al ₂ O ₃ ) -based inorganic material substrate, a plate metal, Ductile materials such as resin, flatness on the order of micron to submicron (TTV: total thickness variation-maximum and minimum values on the entire ground surface of the workpiece measured in the thickness direction with reference to the ground surface of the workpiece Various processed materials that require a difference in value).

  According to the present invention, since the work is three-dimensionally arranged and held on the polygonal columnar rotation holding body, there is an effect that a large plate-like object can be ground with more space saving.

1 is a perspective view of a wafer with a protective tape to be ground and polished by a grinding apparatus according to an embodiment of the present invention. 1 is an overall perspective view of a grinding apparatus according to an embodiment. FIG. 2 is a partially enlarged view of FIG. 1, and is a perspective view showing a rotation holder and its peripheral part. It is a top view which shows the internal structure of a rotation holding body, and arrangement | positioning of a grinding means. It is a front view which shows the process of 1 cycle of grinding and polishing operation | movement of the grinding device which concerns on one Embodiment.

Hereinafter, a semiconductor wafer grinding apparatus according to an embodiment of the present invention will be described.
(1) Semiconductor wafer First, with reference to FIG. 1, the disk-shaped semiconductor wafer (workpiece | work, abbreviated as wafer below) W by which back grinding is carried out with the grinding apparatus of one Embodiment is demonstrated. The wafer W is a silicon wafer or the like, and the thickness before the back surface grinding is, for example, about 700 μm. A large number of rectangular devices (chip regions) 3 partitioned by grid-like divisional lines 2 are formed on the entire surface of the wafer W (the front surface is exposed on the lower side and therefore the back surface is exposed upward in FIG. 1). Is formed. An electronic circuit (not shown) such as an IC or an LSI is formed on the surface of these devices 3. A V-shaped notch 4 indicating the crystal orientation of the semiconductor is formed at a predetermined location on the peripheral surface of the wafer W.

  The back surface of the wafer W is ground by the grinding apparatus 10 according to the embodiment shown in FIG. 2 and thinned to a thickness of about 50 to 100 μm, for example. A protective tape 5 is attached to the entire surface of the wafer W supplied to the grinding apparatus 10 for protecting the electronic circuit. The protective tape 5 is, for example, one in which an adhesive layer having a thickness of about 5 to 20 μm is formed on one side of a resin base sheet such as a polyolefin having a thickness of about 70 to 200 μm. Affixed to match.

  Note that a rigid substrate may be attached to the surface of the wafer W instead of the protective tape 5. The substrate enables the wafer W, which has been processed to be extremely thin by grinding and reduced in rigidity, to be reliably transported in a flat state without being bent. For example, silicon or glass that is a material of the semiconductor wafer W The one formed into a disk shape by is used.

(2) Grinding device (2-1) Configuration of grinding device Next, the configuration of the grinding device 10 shown in FIG. 2 will be described. In FIG. 2, reference numeral 11 denotes a rectangular parallelepiped apparatus base that is long in the X-axis direction. A device wall portion 12 erected along the Z-axis direction is fixed to the end of the device base 11 on the far side (Y2 side) in the Y-axis direction. The upper surface of the apparatus base 11 is a loading / unloading stage 11A for the wafer W, and the front surface of the apparatus wall 12 on the apparatus base 11 side is a processing stage 12A.

  Two cassette bases 13A and 13B arranged in the X-axis direction are provided on the front side (Y1 side) of the apparatus base 11 in the Y-axis direction. Among these cassette bases 13A and 13B, the supply side cassette 14a is placed on the cassette base 13A on the X1 side, and the collection side cassette 14b is placed on the cassette base 13B on the X2 side. These cassettes 14a and 14b have the same configuration, and are provided with a tray for storing a plurality of wafers W each having a protective tape 5 attached to the surface shown in FIG. The cassettes 14a and 14b are placed on the cassette bases 13A and 13B, respectively, with the opening serving as a loading / unloading port for the wafer W facing the Y2 side, that is, the loading / unloading stage 11A side.

  A recess 11a is formed in the center of the loading / unloading stage 11A. At the bottom of the recess 11a, a loading / unloading robot 20 is installed in which a thin plate-like suction portion 22 is attached to the tip of a revolving transport arm 21. The loading / unloading robot 20 sucks a single wafer W (hereinafter referred to simply as “wafer W”) to which the protective tape 5 is adhered from the supply-side cassette 14a. The wafer W that has been unloaded and ground and polished is sucked by the suction portion 22 and loaded into the collection cassette 14b.

  A positioning table 30 on which the wafer W unloaded from the supply side cassette 14a by the loading / unloading robot 20 is placed on the X1 side of the recess 11a in the loading / unloading stage 11A. In this positioning table 30, the horizontal position of the mounted wafer W is adjusted, and the wafer W is positioned at a certain transfer start position.

  A spinner type cleaning device 40 for cleaning and drying the ground and polished wafer W is disposed on the X2 side of the recess 11a in the loading / unloading stage 11A. In this spinner type cleaning device 40, a vacuum chuck type spinner table 42 is disposed in a casing 41 whose inside is opened and closed by a liftable cover 41a, and the wafer W placed on the spinner table 42 and held by suction. On the other hand, the cleaning water is jetted from a washing water jet nozzle (not shown), and then the dry air is jetted. The ground / polished wafer W is transferred to the spinner table 42 by the loading / unloading robot 20, the cover 41 a is closed, and the casing 41 is cleaned and dried.

  Next, the processing stage 12A will be described. As shown in FIGS. 2 and 3, a rotation holding body 60 formed of a square columnar box is rotatably supported at a central portion of the processing stage 12 </ b> A via a rotation shaft 50 extending in the Y-axis direction. As shown in FIG. 4, the rotation holding body 60 has a Y2 side end surface 61 a and a Y1 side end surface 61 b which are parallel to the front surface of the device wall portion 12. The rotary shaft 50 extends along the axial direction of the rotary holder 60 across both end surfaces 61a and 61b, and is fixed to the wall portion 61A in a state of passing through the wall portion 61A having the end surface 61a on the Y2 side. . Thereby, the rotation holding body 60 rotates integrally with the rotating shaft 50.

  Further, the rotation holder 60 has four side surfaces 62 parallel to the X-axis direction between both end surfaces 61a and 61b. Each set of these side surfaces 62 that face each other is parallel to each other. A chuck table (holding table) 70 is rotatably disposed on each side surface 62. The rotary shaft 50 is rotated by rotation driving means (not shown), and one set of the side faces 62 of the rotary holder 60 facing each other is parallel to the XY plane, and the other set is the Y / Z plane. Are intermittently rotated by 90 ° in a state of being parallel to each other. The rotation driving means is disposed in the apparatus wall portion 12, for example.

  As shown in FIG. 4, the chuck table 70 includes a disk-shaped frame body (holding surface support portion) 71 made of stainless steel or the like, and a disk-shaped porous body 72 in which numerous pores are scattered. . A circular recess 71b is formed concentrically on most of the surface of the frame 71, leaving the outer peripheral edge 71a, and the porous body 72 is fitted in the recess 71b. The surface of the porous body 72 and the surface of the outer peripheral edge 71a of the frame body 71 are flush with each other, and the surface of the porous body 72 is configured as a holding surface 73 that sucks and holds the entire wafer W. . The chuck table 70 is of a generally known vacuum chuck type that sucks and holds a workpiece (in this case, the wafer W) placed on the holding surface 73 by a negative pressure effect generated by sucking air. The holding surface 73 has the same diameter as the wafer W, and the wafer W is placed concentrically on the holding surface 73 and is sucked and held.

  As shown in FIG. 4, the chuck table 70 is disposed in a state in which the holding surface 73 projects outward from the side surface 62 and is parallel to the side surface 62 of the rotary holding body 60. Thus, the chuck tables 70 arranged on the side surfaces 62 are rotatably supported by the motor box 74 accommodated in the central portion of the inside of the rotation holding body 60 via the rotation shaft 75. The motor box 74 is fixed to the end of the rotary shaft 50 in the rotation holder 60. The rotation shaft 75 is supported by the motor box 74 so as to be independently rotatable, and the back surface of the frame body 71 of the chuck table 70 is concentrically fixed to the tip thereof. The axial direction of the rotation shaft 75 provided for each chuck table 70 extends radially (in a cross shape) from the motor box 74 along the direction along the vertical plane.

  In the motor box 74, a motor (not shown) that rotates each rotation shaft 75 is incorporated for each rotation shaft 75. Each rotating shaft 75 is independently rotated by these motors, and the rotation of the rotating shaft 75 causes the chuck table 70 to rotate about the center.

  As shown in FIG. 2, grinding means 80 having the same structure is provided at three positions in the X-axis direction (X1 side and X2 side) and above the rotation holding body 60 in the processing stage 12 </ b> A provided with the rotation holding body 60. Is arranged so as to be able to advance and retreat with respect to the rotation holding body 60. That is, the slide plate 16 is attached to the X1 side and the X2 side of the processing stage 12A along the guide 15 so as to be movable in the X axis direction, and the grinding means 80 is fixed to the slide plate 16. Further, a slide plate 16 is attached to the upper side of the processing stage 12A along the guide 15 so as to be movable in the Z-axis direction, and a grinding means 80 is fixed to the slide plate 16. Each slide plate 16 is moved along the guide 15 by a ball screw type processing feed means 17 driven by a servo motor 17a, and each grinding means 80 is a rotation holding body integrally with the slide plate 16. Move forward and backward against 60.

  The grinding means 80 has a configuration in which a grinding wheel 82 is fixed to the tip of a spindle (not shown) rotatably supported in a housing 81. In each grinding means 80, the housing 81 is fixed to the slide plate 16 so that the spindle is parallel to the moving direction of the slide plate 16 and the grinding wheel 82 faces inward, which is the rotation holding body 60 side. The spindle is rotationally driven by a spindle motor 83 fixed to the housing 81, and the grinding wheel 82 rotates integrally with the spindle.

  A grinding tool 84 for grinding the back surface of the wafer W held on the chuck table 70 of the rotary holder 60 is attached to the grinding wheel 82. There are three types of grinding tools 84 according to the number of grinding means 80: a rough grinding wheel 84a, a finish grinding wheel 84b, and a polishing tool 84c. An annular grinding wheel is used, and the polishing tool is a disc-like one. Things are used.

  In this case, as shown in FIG. 2, a rough grinding wheel 84a is mounted on the grinding wheel 82 of the grinding means 80 on the X2 side of the rotary holding body 60, and the grinding wheel 82 of the grinding means 80 above the rotary holding body 60 is attached. A grinding wheel 84b for finish grinding is mounted, and a polishing tool 84c is mounted on the grinding wheel 82 of the grinding means 80 on the X1 side of the rotary holder 60. That is, the grinding means 80 on the X2 side of the rotary holding body 60 is a rough grinding grinding means 80A, the grinding means 80 above the rotary holding body 60 is a grinding means 80B for finish grinding, and the grinding means 80 on the X1 side of the rotary holding body 60. Is the grinding means for polishing 80C.

  The grinding wheels 84a and 84b and the polishing tool 84c are selected according to the wafer W. For example, as the grinding wheels 84a and 84b, diamond grinding stones formed by solidifying diamond abrasive grains with a binder such as metal bond or resin bond are used. As the polishing tool, a polishing pad made of polishing cloth, polishing paper, or the like is used.

  As shown in FIG. 4, the diameter of the grinding wheel 82 is about the same as the diameter of the chuck table 70, that is, about the same as the wafer W. Each grinding means 80 (80A, 80B, 80C) is disposed at a position where the grinding wheel 82 is offset from the concentric position to the machining stage 12 side (Y2 side) by a length corresponding to the radius with respect to the chuck table 70. Has been.

  According to the grinding means 80 (80A to 80C), the grinding wheel 84 is rotated and processed by the processing feed means 17 in the direction of the wafer W held by the chuck table 70, whereby the grinding tool 84 (84a, 84b and 84c) press the back surface of the wafer W and grind (polish) the back surface. At the time of grinding (polishing), the chuck table 70 is rotated and the wafer W is rotated. Accordingly, the outer peripheral portion of the rotating grinding tool 84 (84a to 84c) presses the wafer W while passing through the center of the rotating wafer W, whereby the entire back surface of the wafer W is ground (polished).

  Each side surface 62 of the rotary holder 60 is provided with a processing liquid supply means (not shown) for supplying a processing liquid according to grinding or polishing to the wafer W. During grinding or polishing, this processing liquid supply is provided. The processing liquid is supplied from the means to the wafer W. Each side surface 62 is provided with a thickness measuring means (not shown) for measuring the thickness of the wafer W. The wafer W has a predetermined thickness based on the thickness measured by the thickness measuring means. It is ground.

(2-2) Operation of Grinding Device The above is the configuration of the grinding device 10, and the operation of grinding the wafer W backside by this grinding device 10 to reduce it to a predetermined thickness will be described.

  One wafer W (first wafer W1, see FIG. 5) is unloaded from the supply-side cassette 14a by the loading / unloading robot 20, and is transferred to the positioning table 30 and placed thereon. The wafer W1 is positioned on the positioning table 30 at a certain transfer start position. Next, the wafer W1 is again transferred to the holding surface 73 of the chuck table 70 facing downward by the loading / unloading robot 20, and is sucked and held on the holding surface 73 as shown in FIG. Wafer W1 is held on holding surface 73 such that the back surface to be ground is exposed. Here, the position where the chuck table 70 faces downward is referred to as a loading / unloading position. That is, the wafer W1 is loaded into the chuck table 70 positioned at the loading / unloading position, and is sucked and held.

  Next, as shown in FIG. 5B, the rotary holder 60 is rotated 90 ° counterclockwise (in the direction of arrow L in FIG. 3) indicated by an arrow in the drawing, and the first wafer W1 is roughly ground. It is positioned at a rough grinding position facing the grinding wheel 82 of the grinding means 80A for use. Thereafter, the next second wafer W2 is sucked and held on the holding surface 73 of the lower surface side chuck table 70 positioned at the loading / unloading position in the same manner as described above.

  Subsequently, as shown in FIG. 5B, the back surface of the first wafer W1 is roughly ground. That is, the chuck table 70 is rotated to rotate the first wafer W1, and the rough grinding grinding means 80A in which the grinding wheel 82 is rotationally driven is processed and fed by the processing feed means 17, and is rotated. The grindstone 84a is pressed against the rotating wafer W1. As a result, the back surface of the first wafer W1 is roughly ground. In addition, the arrow added to each grinding means 80A-80C in FIG. 5 has shown the state which the grinding tools 84a-84c of the said grinding means 80A-80C act on the wafer W, and are grind | polished or grind | polished. .

  When the first wafer W1 is roughly ground to the target thickness, the rough grinding grinding means 80A is retracted from the wafer W, and as shown in FIG. 5C, the rotating holder 60 is counterclockwise indicated by an arrow in the figure. Rotate again 90 degrees in the direction. As a result, the first wafer W1 is positioned at the finish grinding position facing the grinding wheel 82 of the finish grinding grinding means 80B, and the second wafer W2 is positioned at the rough grinding position. Thereafter, the next third wafer W3 is sucked and held on the holding surface 73 of the lower chuck table 70 positioned at the loading / unloading position.

  Subsequently, as shown in FIG. 5C, the back surface of the first wafer W1 is finish-ground, and the back surface of the second wafer W2 is roughly ground. That is, the grinding wheel 84b of the grinding means for finishing grinding 80B to be processed and fed is pressed to the first wafer W1 that rotates, and finish grinding is performed, and the second wafer W2 that rotates and is processed to feed. The grinding wheel 84a of the rough grinding grinding means 80A is pressed to perform rough grinding. In rough grinding, the thickness after finish grinding is ground to, for example, 30 to 40 μm before, and the rest is ground by finish grinding.

  When the final grinding for the first wafer W1 and the rough grinding for the second wafer W2 are performed until the target thickness is achieved, the rough grinding grinding means 80A and the final grinding grinding means 80B are transferred from the wafers W1 and W2. Each is retracted, and then, as shown in FIG. 5 (d), the rotary holding body 60 rotates 90 ° again in the counterclockwise direction indicated by the arrow in the drawing. As a result, the first wafer W1 is positioned at the polishing position facing the grinding wheel 82 of the polishing grinding means 80C. The second wafer W2 is positioned at the finish grinding position, and the third wafer W3 is positioned at the rough grinding position. Thereafter, the next fourth wafer W4 is sucked and held on the holding surface 73 of the lower chuck table 70 positioned at the loading / unloading position.

  Subsequently, as shown in FIG. 5D, the back surface of the first wafer W1 is polished, the back surface of the second wafer W2 is finish-ground, and the back surface of the third wafer W3 is rough-ground. The The back surface polishing of the first wafer W1 is performed by pressing the polishing tool 84c of the polishing grinding means 80C to be processed and fed to the rotating wafer W1. The finish grinding to the second wafer W2 and the rough grinding to the third wafer W3 are performed in the same manner as described above.

  When the polishing for the first wafer W1 and the finish grinding for the second wafer W2 and the rough grinding for the third wafer W3 are completed, the grinding means 80A to 80C are retracted from the wafers W1 to W3, respectively. As shown to (e), the rotation holding body 60 rotates 90 degrees again in the counterclockwise direction shown by the arrow in the figure. As a result, the processed first wafer W1 whose back surface is polished is positioned at the loading / unloading position. The second wafer W2 is positioned at the polishing position, the third wafer W3 is positioned at the finish grinding position, and the fourth wafer W4 is positioned at the rough grinding position.

  Next, the processed first wafer W1 positioned at the carry-in / carry-out position is carried out by the carry-in / carry-out robot 20 and accommodated in the collection cassette 14b. Thereafter, the next wafer W (fifth wafer) is moved from the positioning table 30 by the loading / unloading robot 20 to the chuck table 70 positioned at the loading / unloading position, and is sucked and held.

  Thereafter, as described above, intermittent rotation of the rotary holder 60 by 90 ° and grinding (polishing) processing at each processing position when the rotation is stopped are performed on the back surface of the wafer W. Sequentially, a plurality of wafers W are ground and polished and accommodated in the recovery side cassette 14b.

  When a predetermined number of processed wafers W are stored in the recovery side cassette 14b, the recovery side cassette 14b is transported to the next step, and the wafer W is finally divided after the protective tape 5 is peeled off. The line 2 is cut and divided into a number of devices 3.

(2-3) Effects of Grinding Apparatus According to the grinding apparatus 10 of the above-described embodiment, the chuck table 70 that holds the wafer W is disposed on each side surface 62 of the quadrangular columnar rotation holding body 60. The wafer W is positioned and held three-dimensionally. Accordingly, as compared with the conventional turntable type in which the wafers W are arranged in a plane, the member (the rotary holding body 60 in the above embodiment) that holds a plurality of wafers W can be reduced in size and weight. For this reason, a significant space saving of the entire apparatus can be achieved. As a result, even if the wafer W is large, grinding (polishing) processing can be performed in a space-saving manner. Moreover, since the rotation holding body 60 is smaller than the turntable, there is an advantage that the operating energy for rotating the rotation holding body 60 can be suppressed.

  In the above embodiment, the rotation pattern of the rotation holder 60 is intermittent rotation of 90 ° in one direction, but the rotation pattern of the rotation holder 60 that positions the wafer W at each processing position is not limited to this. It is set as appropriate for reasons such as device design. In the above embodiment, the rotary holding body 60 has a quadrangular prism shape and includes four side faces 62, that is, four holding faces 73 for holding the wafer 1. However, the rotary holding body of the present invention is not limited to this form. For example, as a form in which the number of side surfaces on which the holding surface of the wafer is provided is increased, such as a pentagonal column shape or a hexagonal column shape, the number of processing axes may be increased.

W (W1-W4) ... Wafer (workpiece)
DESCRIPTION OF SYMBOLS 10 ... Grinding device 50 ... Rotating shaft 60 ... Rotation holding body 61a, 61b ... End surface of rotation holding body 62 ... Side surface of rotation holding body 70 ... Chuck table (holding table)
71 ... Frame (holding surface support part)
73 ... Holding surface 75 ... Spinning shaft 80A ... Rough grinding grinding means 80B ... Finish grinding grinding means 80C ... Polishing grinding means 84a ... Rough grinding wheel (grinding tool)
84b ... Wheel for finishing grinding (grinding tool)
84c ... Polishing tool (grinding tool)

Claims (1)

A polygonal columnar rotation holder having a plurality of side surfaces between both end surfaces and supported rotatably about a rotation axis extending in an axial direction extending between the both end surfaces;
A rotation driving means for intermittently rotating the rotation holder;
A holding surface for holding a plate-like workpiece; and a holding surface support portion for rotatably supporting the holding surface with a direction orthogonal to the holding surface as a rotation axis, the holding surface being arranged in parallel with the side surface A holding table supported by the rotary holding body,
A grinding means including a grinding tool that is disposed opposite to the holding surface of the holding table when the rotation of the rotary holding body is stopped and acts on a work held on the holding surface;
A grinding apparatus comprising:

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