CN109872966A - Substrate absorption device - Google Patents
Substrate absorption device Download PDFInfo
- Publication number
- CN109872966A CN109872966A CN201811455014.7A CN201811455014A CN109872966A CN 109872966 A CN109872966 A CN 109872966A CN 201811455014 A CN201811455014 A CN 201811455014A CN 109872966 A CN109872966 A CN 109872966A
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- CN
- China
- Prior art keywords
- substrate
- adsorption
- adsorption plate
- conveying
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
Abstract
Technical problem:, can be to leak few state sorbing substrate in substrate absorption device.Solution: substrate absorption device (1) is the device for strip substrate (111) to be adsorbed and kept, and has frame (221) and Porous adsorption plate (225).Negative pressure is supplied to frame parts (223).Porous adsorption plate (225) is installed on frame parts (223), and has flexibility.
Description
Technical field
The present invention relates to a kind of substrate absorption devices.
Background technique
As the device that the glass substrate for being used for liquid crystal etc. is fixed and conveyed, it is known that glass substrate to vacuumize
The substrate adsorption conveying device that mode is adsorbed.In substrate adsorption conveying device, it is known that one kind is formed by porous ceramic
The mode of adsorption plane (referring for example to patent document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Patent Publication is at 6-8086 bulletin
Summary of the invention
(1) technical problems to be solved
In the case where adsorption plane is made of porous ceramic in vacuum absorption device as described above, it is difficult to maintain to inhale
The flatness in attached face.As a result, adsorption capacity can be made to become smaller there is a situation where leakage in the presence of when sorbing substrate.
In the lower situation of flatness of the component of supporting substrate, the above problem is especially pronounced.
It is an object of the present invention in substrate absorption device, it can be to leak few state sorbing substrate.
(2) technical solution
In the following, illustrating multiple modes as the means for solving above-mentioned technical problem.These modes can be according to need
Want any combination.
The substrate absorption device of one aspect of the present invention is the device for being adsorbed and being kept to substrate, tool
Standby suction unit and Porous adsorption plate.
Suction unit supplies negative pressure.
Porous adsorption plate is installed on suction unit, and has flexibility.
In the apparatus, since Porous adsorption plate has flexibility, leakage when sorbing substrate can be reduced.Its
The reason is that, Porous adsorption plate, which enters, to be become the region in gap and is close to other components in the past.
Substrate absorption device can also have the portion of lifting.In Porous adsorption plate to being placed in the indent and convex mounting portion of tool
When substrate is adsorbed, lift portion by being moved upward suction unit and Porous adsorption plate from mounting portion, thus by substrate
Lift from mounting portion.
In the apparatus, substrate-placing is in the top for having indent and convex mounting portion, but due to Porous adsorption plate have it is soft
It is soft, therefore leakage when can reduce sorbing substrate.
Porous adsorption plate can also be made of rubber.
In the apparatus, manufacturing cost is more cheap.
The thin sheet form that Porous adsorption plate is also possible to a thickness of 1~3mm.
In the apparatus, thin substrate can effectively be adsorbed.
(3) beneficial effect
It, can be to leak few state sorbing substrate in substrate absorption device of the invention.
Detailed description of the invention
Fig. 1 is the schematic plan of the base plate processing device of first embodiment of the invention.
Fig. 2 is the schematic perspective view of substrate breaking apparatus.
Fig. 3 is the schematic side elevation of substrate breaking apparatus.
Fig. 4 is the block diagram for indicating the control structure of base plate processing device.
Fig. 5 is the perspective view of substrate adsorption rotating device.
Fig. 6 is the partial perspective view of substrate adsorption rotating device.
Fig. 7 is the schematic cross sectional views of adsorption structure body.
Fig. 8 is to indicate that Porous adsorption plate is tightly attached to the schematic cross sectional views of the state of the substrate on belt conveyor.
Fig. 9 is to indicate that Porous adsorption plate is tightly attached to the schematic cross sectional views of the state of the substrate on belt conveyor.
Description of symbols
1- base plate processing device；3- crosses to form device；5- substrate breaking apparatus；The first break-up device of 7-；9- second divides
Disconnected device；11- pick device；29- conveying device；The first conveying device of 41-；The second conveying device of 43-；45- third conveying dress
It sets；50- controller；51- scribing unit；100- adhesive substrates；111- strip substrate；113- unit substrate；201- substrate adsorption
Rotating device；205- adsorption structure body；207- drives upside down mechanism；209- rotating mechanism；211- beam；213- suction device；
The cellular porous body of 221-；225- Porous adsorption plate.
Specific embodiment
1. first embodiment
(1) summary description of base plate processing device
Base plate processing device 1 is illustrated using FIG. 1 to FIG. 3.Fig. 1 is the substrate processing of first embodiment of the invention
The schematic plan of device.Fig. 2 is the schematic perspective view of substrate breaking apparatus.Fig. 3 is the side view of substrate breaking apparatus.
In Fig. 1, the up and down direction of figure is first direction (arrow X), and the left and right directions of figure is second direction (arrow Y).
Base plate processing device 1 is the device that multiple unit substrates 113 are formed from adhesive substrates 100.In Fig. 1, next
The multiple devices illustrated arrange from left to right in a second direction.That is, being processed the conveying direction of the substrate of object is
Second direction, substrate are processed while conveying from left to right in a second direction.It therefore, is defeated on the left of the second direction of Fig. 1
Direction upstream side is sent, is conveyance direction downstream side on the right side of the second direction of Fig. 1.
There is base plate processing device 1 scribing line to form device 3.Scribing line formed device 3 formed on the surface of adhesive substrates 100 it is more
A first scribing line S1 and multiple second scribing line S2.First scribing line S1 and the second scribing line S2 are mutually orthogonal.In addition, by after scribing line processing
Substrate as adhesive substrates 100A.
Specifically, scribing line forms device 3 and includes scribing unit 51；Conveying device 53, it is defeated to conveyance direction downstream side
Send adhesive substrates 100；And clamp system 55, it keeps adhesive substrates 100 and keeps it mobile to conveying direction two sides.Scribing line is single
Member 51 includes scribing line beam 51a extended in a first direction, can move in a first direction along scribing line beam 51a
Scribe head 51b (Fig. 4) and scribing line head moving device 51c (Fig. 4).Conveying device 53 is belt conveyor.Clamp system 55
It includes the clamped beam 55a being arranged in a manner of it can move forwards, backwards along second direction in the top of conveying device 53, clamp
It beam mobile device 55b (Fig. 4) and is formed in the unilateral side of clamped beam 55a and holds the clamping element 55c of adhesive substrates 100.Pass through
Clamped beam 55a is mobile towards scribing unit 51 to first direction two sides, thus the adhesive substrates 100 1 that clamping element 55c is held
Side is scribed on one side by the lower section of scribe head 51b (Fig. 4).
Base plate processing device 1 has substrate breaking apparatus 5.Substrate breaking apparatus 5 by along it is multiple first scribing line S1 and
Multiple second scribing line S2 disjunction adhesive substrates 100A are to form unit substrate 113.Substrate breaking apparatus 5 is configured at scribing line and is formed
The conveyance direction downstream side of device 3.
Substrate breaking apparatus 5 has the first break-up device 7.First break-up device 7 passes through along multiple S1 points of first scribing line
Disconnected adhesive substrates 100A is to form multiple strip substrates 111.First break-up device 7 is prolonged in the mode parallel with first direction
It stretches, and accordingly moves repeatedly/disjunction in the conveying direction with multiple first scribing line S1 of adhesive substrates 100A.
As shown in Fig. 2, substrate breaking apparatus 5 has substrate adsorption rotating device 201 (an example of substrate absorption device).Base
Plate absorption rotating device 201 makes multiple strip substrates 111 be rotated by 90 ° (aftermentioned) under vertical view.
Substrate breaking apparatus 5 has the second break-up device 9.Second break-up device 9 is configured at the conveying of the first break-up device 7
Direction downstream side, and by along second scribing line the multiple strip substrates 111 of S2 disjunction, to form multiple unit substrates 113.The
Two break-up devices 9 are extended in the mode parallel with first direction, and corresponding with multiple second scribing line S2 of multiple strip substrates 111
Ground moves repeatedly/disjunction in the conveying direction.
Base plate processing device 1 has pick device 11.Pick device 11 picks up multiple unit substrates 113 and to other device
13 conveyings.
Then, the conveying device 29 for conveying substrate is illustrated.Conveying device 29 forms device 3, the to cross
One break-up device 7, the second break-up device 9, pick device 11 sequentially-fed substrate.
Specifically, conveying device 29 has the first conveying device 41, the second conveying device 43, third conveying device 45.
First conveying device 41 forms between device 3 and the first break-up device 7 in scribing line and extends.Second conveying device 43 is in the first disjunction
Extend between device 7 and the second break-up device 9.Third conveying device 45 is prolonged between the second break-up device 9 and pick device 11
It stretches.
As shown in figure 3, the first conveying device 41 has first band 41a, multiple roller 41b, the first motor 41c (Fig. 4).It is more
The roller of conveying direction upstream side in a roller 41b and the roller of conveyance direction downstream side can be within the specified scope to before conveying directions
After move.
As shown in figure 3, the second conveying device 43 is with second with 43a (an example of conveying device), multiple roller 43b, second
Motor 43c (Fig. 4).The roller of conveying direction upstream side in multiple roller 43b and the roller of conveyance direction downstream side can provide
It is moved forward and backward in range to conveying direction.
As shown in figure 3, third conveying device 45 has third band 45a, multiple roller 45b, third motor 45c (Fig. 4).It is more
The roller of conveying direction upstream side in a roller 45b and the roller of conveyance direction downstream side can be within the specified scope to before conveying directions
After move.
As shown in figure 3, the conveyance direction downstream side end of the upper surface part of first band 41a and the second upper surface part with 43a
Conveying direction upstream side approached across small gap.The conveyance direction downstream side end of second upper surface part with 43a
The conveying direction upstream side of upper surface part with third with 45a is approached across small gap.
According to above structure, in base plate processing device 1, when the first break-up device 7 segmentation adhesive substrates 100A is to shape
When at multiple strip substrates 111, at the same time, it is multiple so as to be formed that the second break-up device 9 divides multiple strip substrates 111
Unit substrate 113.Thus, the ability of the formation unit substrate 113 of base plate processing device 1 is higher than previous.
(2) control structure of base plate processing device
It is illustrated using control structure of the Fig. 4 to base plate processing device 1.Fig. 4 is the control for indicating base plate processing device
The block diagram of structure.
Base plate processing device 1 has controller 50.Controller 50 be with processor (such as CPU), storage device (such as
ROM, RAM, HDD, SSD etc.), the computer systems of various interfaces (such as A/D converter, D/A converter, communication interface etc.).
Controller 50 is stored in the program of storage unit (some or all corresponding with the storage region of storage device) by executing
To carry out various control actions.
Controller 50 can constitute with single processor, or each control of carry out and by independent multiple processing
Device is constituted.
Part or all of the function of each element of controller 50 can also be used as can be in the meter for constituting controller 50
The program that executes in calculation machine system is realized.In addition to this, a part of the function of each element of controller 50 can also be by fixed
IC processed is constituted.
As shown in figure 4, being connected with scribing unit 51 (scribe head 51b, scribing line head moving device 51c), folder in controller 50
Tight mechanism 55 (clamped beam mobile device 55b, clamping element 55c), the first motor 41c of the first conveying device 41, the second conveying
The third motor 45c of second motor 43c of device 43, third conveying device 45.First point is also connected in controller 50
Disconnected device 7, the second break-up device 9.
Although not shown, size, shape and the sensor of position for detecting substrate are connected in controller 50, be used for
Detect the sensor and switch and message input device of each unit state.
(3) structure of substrate adsorption rotating device
Substrate adsorption rotating device 201 is illustrated using Fig. 5 and Fig. 6.Fig. 5 is the solid of substrate adsorption rotating device
Figure.Fig. 6 is the partial perspective view of substrate adsorption rotating device.
Substrate adsorption rotating device 201 adsorbs multiple strip substrates 111 and lifts it from the second band 43a, and then in water
It square is rotated by 90 ° upwards, is placed in the second band 43a later.
Substrate adsorption rotating device 201 has adsorption structure body 205.Adsorption structure body 205 is to adsorb multiple strips together
The adsorption section of substrate 111.
Substrate adsorption rotating device 201, which has, drives upside down mechanism 207 (an example for lifting portion).Drive upside down mechanism 207
Go up and down adsorption structure body 205.
Substrate adsorption rotating device 201 has rotating mechanism 209.Rotating mechanism 209 makes adsorption structure body 205 around vertical axle
Center is rotated by 90 °.It drives upside down mechanism 207 and rotating mechanism 209 is set to beam 211.
Substrate adsorption rotating device 201 has suction device 213.Suction device 213 is with vacuum pump etc. and to generate negative
The mechanism of pressure.
It is connect as shown in figure 4, driving upside down mechanism 207, rotating mechanism 209, suction device 213 with controller 50.
Adsorption structure body 205 is illustrated using Fig. 7.Fig. 7 is the schematic cross sectional views of adsorption structure body.
Adsorption structure body 205 is the structural body for adsorbing multiple strip substrates 111.Adsorption structure body 205 is to overlook
Under the thin component that is square.
As shown in fig. 7, adsorption structure body 205 has the cellular porous body 221 of plate.Under cellular porous body 221
Surface 221a is the flat surface extended in the horizontal direction.
As shown in fig. 7, adsorption structure body 205 has the frame section of the side and upper surface that surround cellular porous body 221
Part 223 (an example of suction unit).Frame parts 223 has the port 224 connecting with suction device 213.According to the above structure, real
The suction unit for generating negative pressure is showed.
As shown in fig. 7, adsorption structure body 205 has the Porous absorption being bonded with the lower surface of cellular porous body 221
Plate 225.Porous adsorption plate 225 maintains the flat shape extended in the horizontal direction.
Specifically, Porous adsorption plate 225 is made of rubber.Thus, manufacturing cost is more cheap.
More specifically, Porous adsorption plate 225 is polyurethane rubber, and hardness is 60 ° of (Asker c-type hardness
Meter), hole diameter is 10~60 μm, and void content is 70%.As an example, Porous adsorption plate 225 by RUBYCELL (Japanese:
ル ビ ー セ Le) (registered trademark) composition.
Porous adsorption plate 225 is the thin sheet form with a thickness of 1~3mm.In this way, the rigidity of Porous adsorption plate 225 becomes
It is low, therefore leakage can be reduced.
(4) movement of substrate adsorption rotating device
The movement of substrate adsorption rotating device 201 is illustrated.Movement below is the control action of controller 50.
Firstly, declining adsorption structure body 205 using mechanism 207 is driven upside down, Porous adsorption plate 225 is connected to multiple
The upper surface of strip substrate 111.
Then, adsorption structure body 205 adsorbs multiple strip substrates 111.
Then, adsorption structure body 205 rises, and adsorption structure body 205 lifts multiple strip substrates 111 from the second band 43a.
Then, adsorption structure body 205 is rotated by 90 ° by rotating mechanism 209, rotates multiple strip substrates 111.
Then, decline adsorption structure body 205 using driving upside down mechanism 207, multiple strip substrates 111 are placed in the
Two conveyor surfaces with 43a.
Finally, adsorption structure body 205 releases the absorption of multiple strip substrates 111.
In the apparatus, strip substrate 111 is placed on the indent and convex second band 43a of tool, but due to Porous adsorption plate
225 have flexibility, therefore can reduce leakage when adsorbing strip substrate 111.Its reason is, even if strip substrate 111
Posture is not horizontality, and Porous adsorption plate 225 can be also close to the entire surface of strip substrate 111.
An example is illustrated using Fig. 8 and Fig. 9.Fig. 8 and Fig. 9 is indicated on Porous adsorption plate and belt conveyor
The schematic cross sectional views for the state that substrate is close to.In addition, emphasizing feature for convenience of explanation in Fig. 8 and Fig. 9.
The support member 43d of the second transmission belt 43a is supported from below as shown in figure 8, being arranged with second with 43a.Branch
The thin plate that support part part 43d e.g. extends in a first direction, upper surface are connected to the second lower surface with 43a.Thus, such as scheme
Shown in 8, second it is bent in a manner of fluctuating with 43a sometimes, strip substrate 111 is also followed it and is bent in a manner of fluctuation.
As shown in figure 9, the Porous adsorption plate 225 when substrate adsorption rotating device 201 is tightly attached to strip substrate from top
When 111, Porous adsorption plate 225 is integrally close to by flexible deformation with the upper surface of strip substrate 111.That is, i.e.
Make in the case where strip substrate 111 fluctuates, Porous adsorption plate 225 is also close to throughout the entire surface of strip substrate 111
Absorption.The above results are to reduce leakage when adsorbing strip substrate 111.
As another example, strip substrate 111 be not horizontal but obliquely configure in the case where also can get with it is upper
State identical effect.
2. other embodiment
An embodiment of the invention is illustrated above, but the present invention is not limited to the above embodiments, it can be with
It makes various changes without departing from the spirit of the invention.The especially multiple embodiments and variation of this specification record
It can according to need and arbitrarily combine.
(1) variation of substrate
In the fitting brittle material substrate made of being bonded two brittle material substrates, comprising: be bonded glass substrate
The panel display boards such as liquid crystal display panel, Plasmia indicating panel, organic EL display panel；By silicon substrate, sapphire substrate etc.
Semiconductor substrate made of being bonded with glass substrate.
The type of substrate is not particularly limited.Substrate includes the glass, semiconductor wafer, ceramic substrate of veneer.
(2) variation of various devices
The mounting portion of mounting substrate is also possible to the device other than belt conveyor.
The primary substrate for adsorbing and rotating is also possible to one.
The base board delivery device that Porous adsorption plate can be suitable for sorbing substrate and convey to other positions.
Porous adsorption plate can be suitable for loading the workbench of substrate.
Porous adsorption plate also may be constructed the lower surface of the shell of the blank part with opened downward.
Industrial applicibility
The present invention can be widely used in substrate absorption device.
Claims (4)
1. a kind of substrate absorption device is used to adsorb substrate and be kept, have:
Suction unit supplies negative pressure；And
Porous adsorption plate is installed on the suction unit, and has flexibility.
2. substrate absorption device according to claim 1, which is characterized in that
The substrate absorption device also has a portion of lifting, described to lift portion and have bumps to being placed in the Porous adsorption plate
The substrate of mounting portion when being adsorbed, by make the suction unit and the Porous adsorption plate from the mounting portion upwards
It is mobile, so that the substrate be lifted from the mounting portion.
3. substrate absorption device according to claim 1 or 2, which is characterized in that
The Porous adsorption plate is made of rubber.
4. substrate absorption device described in any one of claim 1 to 3, which is characterized in that
The Porous adsorption plate is the thin sheet form with a thickness of 1~3mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-230254 | 2017-11-30 | ||
| JP2017230254A JP2019102584A (en) | 2017-11-30 | 2017-11-30 | Substrate suction device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109872966A true CN109872966A (en) | 2019-06-11 |
Family
ID=66848822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811455014.7A Pending CN109872966A (en) | 2017-11-30 | 2018-11-30 | Substrate absorption device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019102584A (en) |
| KR (1) | KR20190064463A (en) |
| CN (1) | CN109872966A (en) |
| TW (1) | TW201930167A (en) |
-
2017
- 2017-11-30 JP JP2017230254A patent/JP2019102584A/en active Pending
-
2018
- 2018-11-26 KR KR1020180147792A patent/KR20190064463A/en unknown
- 2018-11-29 TW TW107142631A patent/TW201930167A/en unknown
- 2018-11-30 CN CN201811455014.7A patent/CN109872966A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190064463A (en) | 2019-06-10 |
| TW201930167A (en) | 2019-08-01 |
| JP2019102584A (en) | 2019-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190611 |
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| WD01 | Invention patent application deemed withdrawn after publication |