TWI380943B - Sucking apparatus - Google Patents

Sucking apparatus Download PDF

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Publication number
TWI380943B
TWI380943B TW098139474A TW98139474A TWI380943B TW I380943 B TWI380943 B TW I380943B TW 098139474 A TW098139474 A TW 098139474A TW 98139474 A TW98139474 A TW 98139474A TW I380943 B TWI380943 B TW I380943B
Authority
TW
Taiwan
Prior art keywords
adsorption
zone
substrate
plane
holes
Prior art date
Application number
TW098139474A
Other languages
Chinese (zh)
Other versions
TW201114669A (en
Inventor
Juihsi Chen
Lihshiuan Sun
Shih Ming Tseng
Original Assignee
Sun Yueh Way
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US25637209P priority Critical
Application filed by Sun Yueh Way filed Critical Sun Yueh Way
Priority claimed from JP2010016726A external-priority patent/JP2011093081A/en
Publication of TW201114669A publication Critical patent/TW201114669A/en
Application granted granted Critical
Publication of TWI380943B publication Critical patent/TWI380943B/en

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Description

Adsorption device
The present invention relates to an adsorption device; and more particularly to an adsorption device for adsorbing a substrate.
With the development of technology and the advancement of semiconductor manufacturing, flat display panels have played a pivotal role in daily life, such as flat-panel TVs for enjoying audio-visual programs, or small-size LCD screens (LCDs) for mobile phones and cameras. ), are all part of the product category of flat display panels.
In the process steps of the liquid crystal panel, a large-sized substrate is first produced, and according to different customer requirements, the process of the LCD cell mother board is divided into independent LCD screen units according to different panel sizes. To make a liquid crystal screen.
In detail, the panel cut step is performed after the panel unit assembly step. The panel unit group is formed by vertically combining an A-side glass having a color filter and a B-side glass having a liquid crystal cell (LCD Cell) to form a liquid crystal panel unit mother board. The panel unit cutting step is to cut the LCD screen unit motherboard to meet the specifications of a specific size LCD screen. Since there is an IC mounting area or other terminal wiring area between the A-side glass and the B-side glass, when performing the panel cutting step, the A-side glass is cut first, then the panel substrate is flipped, and the B-side glass is successively cut, or Cut in reverse order to form a panel unit of a specific size and ensure that the IC mounting area or other terminal line area is not damaged.
In the prior art, when the liquid crystal screen unit mother board cutting step is performed, it is necessary to use a conventional suction cup to perform the steps of flipping and moving the liquid crystal screen unit mother board. However, since the adsorption force of the conventional suction cup is concentrated on one point of the glass substrate, stress concentration is likely to occur, and when a large substrate is adsorbed by a conventional suction cup, the movement of the suction cups at each point is inconsistent or the moving speed is too fast, causing the substrate to be broken. In view of the above-mentioned conventional suction cup limitation, when a large-sized substrate cutting step is currently performed, a large-sized substrate, such as a liquid crystal display unit mother board, is repeatedly quarantined into four smaller-sized substrates, or cut into more. For a substrate having a smaller size, the steps of flipping and moving the panel substrate are carefully performed manually. However, the above process, as the size of the panel substrate increases and the thickness of the substrate is gradually thinned, has caused problems such as excessive labor costs, low production efficiency, and low process yield.
In view of the above, it is an urgent problem to be solved in the industry to provide an adsorption device capable of stably adsorbing a large-sized substrate.
An object of the present invention is to provide an adsorption device capable of adsorbing a large-sized substrate and performing operations such as transporting and flipping the substrate without damage, high efficiency, avoiding cracking of the panel substrate, improving production yield, and saving labor costs. And improve production efficiency.
To achieve the above object, the adsorption device has an adsorption body and a gas pressure control device. The adsorption body comprises a plane and a plurality of holes. The plane has a distribution range and is adapted to be in contact with a substrate. The holes are formed on a plane and are substantially evenly distributed over the distribution of the plane. The air pressure control device is pneumatically connected to a low air pressure source and the holes to stabilize the substrate in contact with the plane and the adsorption body. When the substrate is in contact with the plane and the air pressure control device pneumatically connects the holes and the low pressure source, the substrate and the adsorption body are mutually stabilized. Thereby, the adsorption device of the present invention is suitable for avoiding stress concentration on the substrate, so as to facilitate subsequent processes such as substrate flipping and substrate transportation.
The above objects, technical features, and advantages will be more apparent from the following description.
As shown in Fig. 1, it is a perspective view of one of the adsorption devices 10 of the present invention. The adsorption device 10 is adapted to connect a low pressure source (not shown) and to adsorb a substrate (not shown). The adsorption device 10 includes an adsorption body 20 and a gas pressure control device 30. Referring to FIG. 2 at the same time, the adsorption body 20 includes a flat surface 22 and a plurality of holes 24 . The plane 22 has a distribution range 26 and the plane 22 is adapted to contact the substrate. The holes 24 are formed on the plane 22 and are substantially evenly distributed within the distribution range 26 of the plane 22. The air pressure control device 30 pneumatically connects the low air pressure source with the holes 24 to stabilize the substrate in contact with the plane 22 and the adsorption body 20. Thereby, when the substrate is in contact with the plane 22 and the air pressure control device 30 connects the holes 24 and the low air pressure source, the substrate is adapted to be stable with the adsorption body 20 without falling. At this time, the adsorption device 10 applies a uniformly distributed adsorption force on the surface of the substrate by substantially uniformly distributing the holes 24 in the distribution range 26 of the plane 22, so as to avoid stress concentration and inadvertently crack the substrate, further making the substrate Processes such as transportation and turning can be mechanically automated. It should be noted that, in this embodiment, the substrate is preferably a glass substrate which can be divided and fabricated into a liquid crystal display unit mother board of a liquid crystal display, and the low voltage source is preferably a vacuum pump.
In a preferred embodiment, the holes 24 of the adsorption body 20 can be divided into a plurality of groups, and the air pressure control device 30 correspondingly includes a plurality of pneumatic control valves. The pneumatic control valves are pneumatically coupled to the groups, and each of the pneumatic control valves is adapted to independently control the holes 24 in each of the groups to be pneumatically coupled to the low pressure source. Preferably, the air pressure control valves are each a solenoid valve, and the holes 24 are preferably divided into a first group, a second group, and a third portion. Group, a fourth group and a fifth group, a total of five groups. The pneumatic control valves are preferably five-pressure control valves for pneumatically connecting the five groups. As shown in FIG. 2, the distribution range 26 of the plane 22 is divided into a first area 261, a second area 262, a third area 263, a fourth area 264, a fifth area 265, and a sixth area. 266. The second zone 262, the third zone 263, and the fourth zone 264 are disposed outwardly around the first zone 261, and the fifth zone 265 and the sixth zone 266 are respectively disposed on opposite sides of the fourth zone 264. The first group, the second group, the third group, and the fourth group of the holes 24 are substantially evenly distributed in the first area 261, the second area 262, the third area 263, and the first Within the four zones 264, and the fifth group of the holes 24 are substantially evenly distributed within the fifth zone 265 and the sixth zone 266.
Thereby, when the distribution range 26 of the plane 22 is in contact with the substrate, and the air pressure control device 30 pneumatically connects the holes 24 and the low air pressure source with the air pressure control valves, respectively, the adsorption body 20 is adapted to pass through the first area 261, The second zone 262, the third zone 263, the fourth zone 264, the fifth zone 265, and the sixth zone 266 are secured to each other. The advantage of such an arrangement is that when there is any one of the first zone 261, the second zone 262, the third zone 263, the fourth zone 264, the fifth zone 265, and the sixth zone 266, because the air pressure control valve is malfunctioning or Due to other factors, it is impossible to seal the substrate and make the low pressure leak. When the substrate cannot be adsorbed, the other regions can still maintain the action of adsorbing the substrate by the normal operation of the air pressure control valve, without losing the adsorption force, thereby causing the substrate to fall. Drop and damage the substrate. At the same time, the arrangement of the holes 24 also has a dispersive adsorption force, which avoids the concentration of the adsorption stress and causes damage to the substrate. In addition, the plane 22 of the adsorption body 20 is further formed with a plurality of grooves 28 disposed between the first region 261, the second region 262, the third region 263, the fourth region 264, the fifth region 265, and the sixth region 266.
The adsorption device 10 further includes a buffer device 40 and a support structure 50 disposed between the support structure 50 and the adsorption body 20. The support structure 50 is further connected to other mechanized equipment for processes such as flipping and transporting substrates. The cushioning device 40 absorbs one of the impact forces generated when the adsorption body 20 and the substrate are instantaneously touched, thereby avoiding damage to the substrate and improving the production yield.
The adsorption device 10 of the present invention can be widely applied to a liquid crystal screen unit mother board cutting process. For example, in an application, the adsorption device 10 is disposed on one of the flipping portions of a substrate inverting device, and when the adsorption device 10 adsorbs and stabilizes the substrate, the inverting portion is adapted to drive the adsorption device 10 to flip along with the substrate. In another application, the adsorption device 10 is disposed on a substrate transport device, and when the adsorption device 10 adsorbs and stabilizes the substrate, the substrate transport device is adapted to drive the adsorption device 10 together with the substrate, moving from a first position to a second position. position.
In summary, the adsorption device 10 of the present invention controls the pneumatic connection of the low pressure source and the holes 24 through the air pressure control device 30, so that the contact region 26 of the adsorption body 20 can properly adsorb and stabilize the substrate. Since the air pressure control valves of the air pressure control device 20 independently control the holes 24 in each group, even if any area or any of the air pressure control valves cannot operate normally to adsorb the substrate, it does not affect other air pressure control valves or The normal operation of the area greatly increases the reliability of the substrate of the adsorption device 10 and avoids damage to the substrate. Furthermore, the holes 24, which are evenly distributed in the distribution range 26 of the plane 22, also have an average dispersion adsorption force, which avoids the concentration of the adsorption stress and causes damage to the substrate, thereby improving the production yield of the substrate.
The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims.
10. . . Adsorption device
20. . . Adsorption body
twenty two. . . flat
twenty four. . . Hole
26. . . distribution range
261. . . First district
262. . . Second district
263. . . Third district
264. . . Fourth district
265. . . Fifth district
266. . . Sixth district
28. . . Trench
30. . . Air pressure control device
40. . . Buffer device
50. . . supporting structure
Figure 1 is a perspective view of the adsorption device of the present invention;
Fig. 2 is a bottom view of the adsorption body of the present invention.
10. . . Adsorption device
20. . . Adsorption body
30. . . Air pressure control device
40. . . Buffer device
50. . . supporting structure

Claims (11)

  1. An adsorption device for adsorbing a substrate and adapted to connect to a low pressure source, the adsorption device comprising: an adsorption body comprising a plane and a plurality of holes, wherein the plane has a distribution range and is adapted to contact the substrate And the holes are formed on the plane and are substantially evenly distributed within the distribution of the plane; and a gas pressure control device is adapted to pneumatically connect the low pressure source to the holes, The substrate in contact with the plane and the adsorption body are mutually stabilized; wherein the distribution range of the plane is divided into a first zone, a second zone, a third zone, a fourth zone, and a fifth zone And a sixth zone, the second zone, the third zone and the fourth zone are arranged outwardly around the first zone, and the fifth zone and the sixth zone are respectively disposed in the fourth zone The opposite side of the second.
  2. The adsorption device of claim 1, wherein the holes of the adsorption body are divided into a plurality of groups, and the air pressure control device correspondingly comprises a plurality of pneumatic control valves, wherein the pneumatic control valves are pneumatically connected to the groups respectively. And each of the pneumatic control valves is adapted to independently control the holes in each of the groups to be pneumatically coupled to the low pressure source.
  3. The adsorption device of claim 2, wherein the holes are divided into a first group, a second group, a third group, a fourth group, and a fifth group, and the same The pneumatic control valve is a five-pressure control valve that is pneumatically connected to the groups.
  4. The adsorption device of claim 3, wherein the first group, the second group, the third group, and the fourth group are substantially evenly distributed in the first region The inner zone, the second zone, the third zone and the fourth zone, and the fifth group is substantially evenly distributed in the fifth zone and the sixth zone.
  5. The adsorption device of claim 4, further comprising a buffer device and a support structure, and the buffer device is disposed between the support structure and the adsorption body to absorb the instantaneous contact between the adsorption body and the substrate One of the impact forces.
  6. The adsorption device of claim 5, wherein the plane of the adsorption body is further formed with a plurality of grooves disposed in the first zone, the second zone, the third zone, the fourth zone, and the fifth zone And between the sixth district.
  7. The adsorption device of claim 2, wherein the pneumatic control valves are each a solenoid valve.
  8. The adsorption device according to claim 1, wherein the adsorption device is disposed on a reversing portion of a substrate inverting device, and the inverting portion is adapted to drive the adsorption device, and the substrate is inverted and adsorbed and stabilized with the adsorption device.
  9. The adsorption device according to claim 1, wherein the adsorption device is disposed on a substrate transport device, and the substrate transport device is adapted to drive the adsorption device, together with the substrate adsorbed and stabilized with the adsorption device, by a first The position moves to a second position.
  10. The adsorption device of claim 1, wherein the low pressure source is a vacuum pump.
  11. The adsorption device according to claim 1, wherein the substrate is a glass substrate of one liquid crystal display.
TW098139474A 2009-10-30 2009-11-20 Sucking apparatus TWI380943B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US25637209P true 2009-10-30 2009-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010016726A JP2011093081A (en) 2009-10-30 2010-01-28 Suction apparatus

Publications (2)

Publication Number Publication Date
TW201114669A TW201114669A (en) 2011-05-01
TWI380943B true TWI380943B (en) 2013-01-01

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Family Applications (5)

Application Number Title Priority Date Filing Date
TW098139468A TW201114525A (en) 2009-10-30 2009-11-20 Method for cutting a liquid crystal display cell mother board and automatic cutting system for the same
TW098139470A TW201115678A (en) 2009-10-30 2009-11-20 Panel suction unit and panel suction assembly having the same
TW098139474A TWI380943B (en) 2009-10-30 2009-11-20 Sucking apparatus
TW098139480A TWI381981B (en) 2009-10-30 2009-11-20 Container, carriage and method for resetting the container
TW098139472A TWI379817B (en) 2009-10-30 2009-11-20 Overturning apparatus for overturning a plate and overturning method of the same

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW098139468A TW201114525A (en) 2009-10-30 2009-11-20 Method for cutting a liquid crystal display cell mother board and automatic cutting system for the same
TW098139470A TW201115678A (en) 2009-10-30 2009-11-20 Panel suction unit and panel suction assembly having the same

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW098139480A TWI381981B (en) 2009-10-30 2009-11-20 Container, carriage and method for resetting the container
TW098139472A TWI379817B (en) 2009-10-30 2009-11-20 Overturning apparatus for overturning a plate and overturning method of the same

Country Status (2)

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CN (5) CN102050567A (en)
TW (5) TW201114525A (en)

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JP5271393B2 (en) * 2011-07-20 2013-08-21 三星ダイヤモンド工業株式会社 Laser scribing equipment
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CN102617030B (en) * 2012-04-06 2015-05-20 深圳市巨潮科技股份有限公司 Cutting method for liquid crystal panel with liquid crystal
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CN103811375B (en) * 2012-11-07 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 The loading/unloading unit of batch processing silicon chip and Apparatus and method for
JP6059565B2 (en) * 2013-03-13 2017-01-11 三星ダイヤモンド工業株式会社 Adsorption reversing device
JP2014176926A (en) * 2013-03-14 2014-09-25 Yaskawa Electric Corp Robot system and method for conveying work
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JP6280332B2 (en) * 2013-09-09 2018-02-14 三星ダイヤモンド工業株式会社 Substrate reverse transfer device
CN103707117B (en) * 2013-12-23 2016-05-25 苏州博众精工科技有限公司 One turning lifting mechanism
CN103979786B (en) * 2014-05-16 2015-12-09 深圳市华星光电技术有限公司 The cutting method of single panel-shaped glass substrate
CN104084952B (en) * 2014-07-05 2018-02-16 广东格林精密部件股份有限公司 The transferred product manipulator jig and its transfer method of a kind of Packing Machine
CN105093577A (en) * 2015-07-22 2015-11-25 武汉华星光电技术有限公司 Cutting device for liquid crystal display panel
CN106353902B (en) * 2016-11-08 2019-03-22 武汉华星光电技术有限公司 A kind of liquid crystal panel shift apparatus and liquid crystal display panel diced system
CN106932930A (en) * 2017-04-17 2017-07-07 昆山精讯电子技术有限公司 A kind of display module switching mechanism
CN107121797B (en) * 2017-05-26 2020-04-21 明基材料有限公司 Turning device
CN107601043A (en) * 2017-08-23 2018-01-19 武汉华星光电半导体显示技术有限公司 Base plate transfer device
TWI647985B (en) * 2017-12-19 2019-01-11 佳世達科技股份有限公司 Circuit board automatic cutting apparatus and method
CN108465605A (en) * 2018-04-19 2018-08-31 江门思玛特光电科技有限公司 A kind of highly compatible box dam machine based on automatic material stacking mode
CN108793713B (en) * 2018-06-27 2021-07-23 武汉华星光电技术有限公司 Cutting machine for cutting glass substrate and cutting method of glass substrate
CN109387963A (en) * 2018-12-21 2019-02-26 深圳市华星光电技术有限公司 Sliver adsorbs the cutting splitting method of microscope carrier and liquid crystal display panel
CN110422599B (en) * 2019-07-31 2020-12-22 马鞍山市金韩防水保温工程有限责任公司 Turnover translation device for heat insulation board production line and operation method thereof
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Publication number Publication date
TWI381981B (en) 2013-01-11
CN102050564A (en) 2011-05-11
TW201114659A (en) 2011-05-01
TW201114703A (en) 2011-05-01
CN102054728A (en) 2011-05-11
CN102050280A (en) 2011-05-11
CN102050280B (en) 2012-11-14
TWI379817B (en) 2012-12-21
CN102050567A (en) 2011-05-11
CN102050566A (en) 2011-05-11
TW201114525A (en) 2011-05-01
TW201115678A (en) 2011-05-01
TW201114669A (en) 2011-05-01

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