CN109987832A - Material removing device and end material is held to remove method - Google Patents
Material removing device and end material is held to remove method Download PDFInfo
- Publication number
- CN109987832A CN109987832A CN201811610958.7A CN201811610958A CN109987832A CN 109987832 A CN109987832 A CN 109987832A CN 201811610958 A CN201811610958 A CN 201811610958A CN 109987832 A CN109987832 A CN 109987832A
- Authority
- CN
- China
- Prior art keywords
- substrate
- end material
- adhesive substrates
- face
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Mining & Mineral Resources (AREA)
- Specific Conveyance Elements (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Technical problem: in the case where removing end material after forming scribing line and make the medial surface exposure of any substrate of adhesive substrates, end material is removed without damaging the face to be exposed.Solution: unit adhesive substrates (100) are truncated in end material removing device (61), which, which has, is formed with the second unit substrate (102) for the first unit substrate (101) from the third of main body (106) separating end material (107) scribing line (S3) and the back side for fitting in the first unit substrate (101) on surface.Adsorb conveyer (7) upper bill of lading position adhesive substrates (100) in the state that the first unit substrate (101) are lower section.End material press device (25) and the elastic press section (23a) of pressing component (23) is abutted and pressed with the end face at end material (107) makes that material (107) is held to separate from main body (106).
Description
Technical field
Method is removed the present invention relates to a kind of end material removing device and end material, more particularly to a kind of is formed on surface from having
The adhesive substrates for having the first substrate for the scribing line of separating end material and fitting in the second substrate at the back side of first substrate remove
The method held the device of material and remove end material.
Background technique
Liquid-crystal apparatus by by liquid crystal layer mode between using sealing material fitting first substrate and the second substrate and
At adhesive substrates constitute.In adhesive substrates, pattern is formed with filter on one (such as first substrate) in aforesaid substrate
Color device, be formed on another substrate (such as the second substrate) TFT (Thin Film Transistor: thin film transistor (TFT)) and
Connection terminal.
In adhesive substrates, the connection terminal exposure for being formed in the second substrate is made to connect with external electronic device.
In adhesive substrates, it is known to for making the face for being formed with connection terminal exposure (make the inside of a substrate in adhesive substrates
Face exposure) substrate separation method (referring for example to patent document 1).
In patent document 1, most start to be staggered formed on the first substrate the allocation position of the cutter of scribing line with the
The allocation position of the cutter of scribing line is formed on two substrates to form scribing line.Later, when the portion to the residual side as adhesive substrates
When (end material) being divided to be separated with main body and make connection terminal exposure, make to clamp in the state of keeping end material using clamping component
Component is separated from main body.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Publication 2012-250871 bulletin
Summary of the invention
(1) technical problems to be solved
By keeping end material using clamping component and being allowed to mobile method removing end material, hold in order to prevent
The formation that material consumingly presses main body has the face (damage of connection terminal in order to prevent) of connection terminal, and needs accurately to adjust
The position of whole clamping component.
It is an object of the present invention to remove end material after forming scribing line and keep the medial surface of any substrate of adhesive substrates sudden and violent
In the case where dew, end material is removed without damaging the face to be exposed.
(2) technical solution
Illustrate multiple modes as the means used to solve the problem below.These modes can as needed any group
It closes.
End material removing device of the invention is used to remove end material from adhesive substrates, and the adhesive substrates have to be formed on surface
There is the first substrate of the scribing line for separating the end material from main body and fits in the second substrate at the back side of first substrate, it is described
End material removing device, which has, above to be mentioned the substrates of adhesive substrates and above mentions device and the end material press device with pressing component.
Absorption conveyer adsorbs the second substrate in the state that first substrate is lower section and above mentions adhesive substrates.
End material press device is by making pressing component and the end face of material being held (to be equivalent to the outer peripheral surface of the end material side of first substrate
(side substantially at right angles intersected with interarea)) abut and pressed and from main body separating end material.
In the apparatus, using the pressing force of pressing component and from the main body separating end material of first substrate.
In the apparatus, when removing end material, end material will not press the surface of the second substrate, be not easy to make the sudden and violent of the second substrate
Show up damage.
Device is mentioned on substrate can be absorption conveyer.
In the apparatus, due to using absorption conveyer above mentioned adhesive substrates in the state of separating end material,
Such as the top for the discarded mouth being connected to by the way that material press device will be held to be configured at end material disposable containers, make substrate to discarded mouth
Top is mobile, and the separating end material above discarded mouth, abandons end material so as to Xiang Duancai disposable containers.
End material removing device of the invention can have substrate turnover device, make the patch of the state of first substrate top
It closes substrate and is turned into the state that first substrate is lower section.
In the apparatus, though first substrate be top in the state of receive adhesive substrates when, can also utilize
The pressing force separating end material of pressing component.
Pressing component can have elastic press section, can make elastic press section with hold material end face abut and carry out by
Pressure.
End material press device by enable pressing component to horizontal direction movement and be allowed to abut with the end face of material is held.
In the apparatus, only by making pressing component can be from main body separating end material to horizontal direction movement.
End material removing device of the invention, which can also have, above mentions it to above mentioning device (absorption conveyer) using substrate
Preceding substrate (including the substrate overturn by substrate turnover device), end material remove after the substrate-placing portion that is loaded of substrate.
End material removing device can also have adsorbent equipment.Adsorbent equipment is set to substrate-placing portion, can also adsorb adhesive substrates.
It in the apparatus, can be in the state that substrate be adsorbed on substrate-placing portion before using pressing component pressing
The observation and calibration of substrate (main body and end material) are carried out, therefore can accurately and steadily carry out the end face of pressing component opposite end material
Pressing.
End material of the invention removes method and is used to remove end material from adhesive substrates, and the adhesive substrates have to be formed on surface
There is the first substrate for the scribing line from main body separating end material and fits in the second substrate at the back side of first substrate, the end material
Removing method has following steps.
◎ supports pressing component and the end face of the end material of the adhesive substrates above mentioned in the state of first substrate lower section
The step of connecing and being pressed.
In the method, using the pressing force of pressing component and from the main body separating end material of first substrate.
End material of the invention, which removes method, can have following steps.
◎ turns over the substrate that the adhesive substrates for the state that first substrate is top are turned into the state that first substrate is lower section
It goes to step.
◎ above proposes step with the adhesive substrates that absorption conveyer above proposes the state that first substrate is lower section.
◎ by make pressing component with hold the end face of material abuts and pressed and separates end material from main body end material by
Press step.
It in the method, can be from the main body separating end material of first substrate using the pressing force of pressing component.
In the method, by it is upper mentioned adhesive substrates in the state of transported, and can desired position into
The pressing of row pressing component.For example, by carrying out pressing for pressing component in the top for the discarded mouth being connected to end material disposable containers
Pressure, and can make to fall using the isolated end material Xiang Duancai disposable containers of the pressing of pressing component.
In the method, due to that substrate can be made to overturn, even receiving in the state that first substrate is top
Adhesive substrates, also can first substrate be lower section in the state of separating end material.
In the method, when removing end material, end material will not press the surface of the second substrate, and be not susceptible to the second substrate
Exposure damage.
In the method, pressing component can have elastic press section, and elastic press section can be made to support with the end face of material is held
It connects.
In the method, by enable pressing component to horizontal direction movement and be allowed to abut with the end face of material is held.
In the method, only by making pressing component can be from main body separating end material to horizontal direction movement.
End material of the invention, which removes method, can also have the adsorption step that adhesive substrates are adsorbed in substrate-placing portion.
In the method, since adhesive substrates can be carried out in the state that adhesive substrates are adsorbed in substrate-placing portion
Observation and calibration, therefore can accurately and steadily carry out the pressing of pressing component (elastic press section).
(3) beneficial effect
In end material removing device of the invention and end material removing method, in the end material for the first substrate for removing adhesive substrates
And in the case where making the medial surface exposure of the second substrate, end material can be removed with simpler method without wanting to the second substrate
Exposed face applies superfluous power.
Detailed description of the invention
Fig. 1 is substrate turnover device, substrate-placing platform and the side view for adsorbing conveyer.
Fig. 2 is the perspective view of substrate turnover device.
Fig. 3 is the schematic perspective view of substrate-placing platform.
Fig. 4 is the schematic plan of substrate-placing platform.
Fig. 5 is the perspective view for holding material pressing component.
Fig. 6 is the schematic side elevation of the adhesive substrates for one embodiment of the present invention.
Fig. 7 is the schematic side elevation of the adhesive substrates after truncation.
Fig. 8 is the schematic side elevation of the adhesive substrates after the truncation for the state for remaining end material.
Fig. 9 is the schematic side elevation of the end material removing device of first embodiment.
Figure 10 is the schematic side elevation for indicating the end material removing device of substrate-placing step.
Figure 11 be indicate since conveyer adsorb start step play workbench absorption stopping step until state end
The schematic side elevation of material removing device.
Figure 12 is to indicate that substrate above mentions the schematic side elevation of the end material removing device of step.
Figure 13 is the schematic side elevation for indicating the end material removing device of end material pressing step.
Description of symbols
1- substrate, which is transported into, mentions device；3- substrate-placing platform；5- substrate turnover device；7- adsorbs conveyer；13- work
Make platform；13a- mounting surface；15- receiving part；23- pressing component；23a- elasticity press section；The end 25- material press device；The end 61-
Material removing device；100- unit adhesive substrates；The first unit substrate of 101-；The second unit substrate of 102-；102a- exposure；
The end face 102b-；106- main body；The end 107- material.
Specific embodiment
1. first embodiment
(1) substrate turnover device and substrate-placing platform
Fig. 1 be the substrate of end material removing device of the invention be transported into mention device (substrate receive platform, substrate overturning dress
Set, substrate-placing platform and absorption conveyer) side view.Fig. 2 is the perspective view of substrate turnover device.Fig. 3 is substrate
Load the schematic perspective view of platform.Fig. 4 is the schematic plan of substrate-placing platform.Fig. 5 be hold material press device by
The perspective view of splenium part.
In FIG. 1 to FIG. 5, arrow X is first level direction, and arrow Y is the second horizontal direction.
Being transported into of adhesive substrates in the material removing device of end mentions device 1 and receives platform 9, substrate turnover device with substrate
5, substrate-placing platform 3, absorption conveyer 7.Substrate of 5 one side of substrate turnover device from substrate of the receiving from other devices
Receive platform 9 and overturn substrate on one side to the transport of substrate-placing platform 3, and in order to remove end material, absorption conveyer 7 above proposes configuration
In the substrate 100 on substrate-placing platform.The substrate-placing for being placed in other devices can be overturn with substrate turnover device 5 on one side
Substrate on platform is conveyed to substrate-placing platform 3 on one side.
(1-1) substrate receives platform and substrate turnover device
For example, it is the device for receiving substrate 100 from other devices that substrate, which receives platform 9,.Substrate turnover device 5 is overturning base
The device of plate 100.Substrate turnover device 5 can make to connect from other devices to substrate with the state that first substrate (end material) is top
It is that the state of lower section is placed in the upper surface of workbench 13 with first substrate (end material) by the overturning of substrate 100 that platform 9 is transported into.
Substrate turnover device 5 has support construction 31 and overturning structure 33 (Fig. 1 and Fig. 2).
Overturning structure 33 is supported the support of structure 31 to turn centered on the rotation axis 35 extended on paper orthogonal direction
It moves freely.Overturning structure 33 has axis 37, and axis 37 is with rotation axis 35 in concentric.Structure 33 is overturn with vertically extending from axis 37
Multiple retaining arms 39.Multiple retaining arms 39 are extended in parallel to identical direction.
Multiple retaining arms 39 receive to rotate between platform 9 centered on rotation axis 35 in the position on workbench 13 and substrate
(Fig. 1).Multiple air adsorption pads 41 (Fig. 2) are provided on the face of the same side of retaining arm 39.Air adsorption pad 41 is being kept
The upper surface of retaining arm 39 is configured under the posture that arm 39 is configured on workbench 13.
Adsorbed with retaining arm 39 and be configured at substrate and receive substrate 100 on platform 9, and rotate retaining arm 39 and by substrate
100 are placed on workbench 13.Retaining arm 39 receives 9 side of platform to substrate from 3 side of substrate-placing platform and rotates, and connects from top
It closely is placed in the substrate 100 that substrate receives the upper surface of platform 9, air adsorption pad 41 is contacted with the upper surface of substrate 100.Pass through
Make suction pump work (not shown), so that the absorption of air adsorption pad 41 be made to keep substrate 100.Receive retaining arm 39 from substrate flat
9 side of platform to workbench 13 turn on one's side turnback.Workbench 13 is located at the second position, and mounting surface 13a is configured at lower than scheduled height
Position.After entering between the receiving part 15 for being located at the workbench 13 of the second position in retaining arm 39, mounting surface 13a rises
To scheduled height, substrate 100 is handover to the mounting surface 13a of workbench 13.Later, workbench 13 is from the second position to first
Position is mobile.
(1-2) substrate-placing platform
Substrate-placing platform 3 has fixed platform 11, the workbench 13 (an example in substrate-placing portion) being configured on platform 11.
Workbench 13 for platform 11 can the carriage direction downstream side as the second horizontal direction first position (Fig. 3 and
Fig. 4) moved between the second position of carriage direction upstream side.
Workbench 13 constitutes (Fig. 3 and Fig. 4) by multiple receiving parts 15.Multiple receiving parts 15 are on first level direction
It arranges and is extended parallel to each other in the second horizontal direction.Multiple suctions (not shown) are formed in the upper surface of receiving part 15
Attached hole, and it is connected to adsorbent equipment 16 (Figure 10).Multiple receiving parts 15 receive substrate from substrate turnover device 5 in the second position
100 (Fig. 1).
(1-3) adsorbs conveyer
Absorption conveyer 7 is the device that end material Shi Shangti substrate 100 is pressed and removed from substrate 100.Dress is transported in absorption
Setting 7 has adsorption section 7a, carriage direction moving portion (not shown), lifting unit (not shown) etc..Absorption conveyer 7 can be mentioned above
The substrate 100 and Xiang Duancai press device being placed on workbench 13 transport, in addition, also can above mention substrate from other devices
100 simultaneously Xiang Duancai press device transports.
The air adsorption pad 41 of the retaining arm 39 of substrate turnover device 5 and the adsorption section 7a of conveyer 7 is adsorbed via matching
Pipe is connected to the air suction devices such as vacuum pump (not shown).
(1-4) holds material press device
Hold material removing device that there is end material press device 25 in the top of substrate-placing platform 3.Material press device 25 is held to have
There is the support construction 21 (Fig. 3 and Fig. 4) of gate, the support construction 21 of the gate by pair of right and left pillar 17 and is set up in this
A little pillars 17 and the beam 19 upwardly extended in first level side is constituted.Pressing component 23 (Fig. 5) is installed on beam 19.End material is pressed
Pressure device is that the end material 107 for separating towards the first substrate of the lower section for the substrate 100 for above proposing state (is attached to the second substrate
End lower surface or first substrate main body end material) device.Pressing component 23 can have elastic press section
23a.Elastic press section 23a is formed by elastomers such as sponge, rubber, sponge rubbers (expanded rubber).Elastic press section 23a is with face
The mode of the end face of opposite end material 107 is towards horizontal direction, when the end face (the especially lower half portion of end face) of press-side material 107
When, by keeping beam 19 mobile to horizontal direction, it can also make it mobile to horizontal direction, in addition, by making beam 19 to level side
It to movement, and moves pressing component 23 downwards, can also it be made oliquely downward to move.
(2) adhesive substrates
Fig. 6 is the schematic side elevation of the adhesive substrates (whole adhesive substrates) for one embodiment of the present invention.
Whole adhesive substrates 100A is by first substrate 101A, the second substrate 102A at the back side for fitting in first substrate 101A
It constitutes.On first substrate 101A and the second substrate 102A, the first scribing line S1 and the second scribing line S2 are equally spaced on width direction
Extended to form on (first level direction), by using they as boundary is truncated and obtain unit adhesive substrates 100 (hereinafter referred to as
For " substrate 100 ").
Fig. 7 is the schematic side elevation of substrate (the unit adhesive substrates after truncation) 100.Substrate 100 has the first unit
Second unit substrate 102 of substrate 101 and the back side for fitting in the first unit substrate 101.In Fig. 7, eliminate as first
The end material of the end of unit substrate 101, therefore a part of the interarea of the second unit substrate 102 becomes the exposure of exposure
102a。
It is contemplated, however, that the case where end material cannot be removed when entirety adhesive substrates 100A is truncated.
Fig. 8 is the schematic side elevational for remaining the substrate (the unit adhesive substrates after truncation) 100 of state of end material 107
Figure.
As shown in figure 8, being following state, that is, although being formed with third scribing line S3, end material 107 is attached to the first unit
The main body 106 of substrate 101.
(3) mechanical structure of material removing device is held
Fig. 9 is the schematic side elevation of the end material removing device of first embodiment of the invention.Holding material removing device 61 is
For the device from the 100 separating end material 107 of substrate for remaining end material 107.
End material removing device 61 is made of absorption conveyer 7 and end material press device 25.
Substrate 100 by the first unit substrate 101 and the back side for fitting in the first unit substrate 101 the second unit substrate
102 constitute (Fig. 9).The third scribing line S3 for dividing main body 106 and holding material 107 is formed on the surface of the first unit substrate 101.
Substrate 100 is placed on workbench 13 in such a way that the first unit substrate 101 is underlying.
Adsorbent equipment 16 (Fig. 9) is connected in workbench 13.Adsorbent equipment 16 is set to workbench 13, and adsorbs fixed base
Plate 100.Adsorbent equipment 16 has the air suction devices (not shown) such as vacuum pump.
End material press device 25 holds end face (the especially lower half of end face of material 107 by the way that pressing component 23 to be connected to
Point or less) pressed and make that material 107 is held to separate from main body 106.Pressing component 23 is (close to hold material with the end of substrate 100
107 side) it is equal height perhaps in the top of the end of substrate 100 to face in the horizontal direction or in oblique upper
The mode of the end face of material 107 is held to configure.End material press device 25 pass through make with hold the opposed pressing component 23 in the end face of material 107 to
Horizontal direction or obliquely downward are allowed to towards movement and the end face of end material 107 abuts and pressed, thus from the first unit
The 106 separating end material 107 of main body of substrate 101.
Pressing component 23 has elasticity press section 23a.Elastic press section 23a is by having the elastomer, such as of regulation elasticity
The elastomers such as sponge, rubber, sponge rubber (expanded rubber) are formed.
In the apparatus, by making pressing component 23 that there is elasticity press section 23a, thus will not opposite end material 107 more than must
Apply excessive impact with wanting limit, the optimal pressing force that can make that material 107 is held to separate from main body 106 can be applied.
Constitute the end of type (elasticity etc.) of elastomer of elasticity press section 23a etc., the elastic press section opposite end 23a material 107
The pressing force in face can be based on for example holding the size of material 107, weight and appropriate adjustment.
Pressing component 23 can be with being extended by the width direction (first level direction) along substrate 100 longlyer
The structure for the elastic press section 23a that rodlike elastomer is constituted, alternatively, it is also possible to be the width direction (first along substrate 100
Horizontal direction) configured with it is multiple and in vertical direction in face of end material 107 end face front end be elastic press section 23a stick
The structure (Fig. 5) of shape.
(4) control structure of material removing device is held
Hold material removing device 61 that there is controller.
Controller is with processor (such as CPU), storage device (such as ROM, RAM, HDD, SSD etc.), various interfaces
The computer system of (such as A/D converter, D/A converter, communication interface etc.).Controller is stored in storage unit by executing
The program of (some or all corresponding with the storage region of storage device) carries out various control actions.
Controller can both constitute with single processor, or each control and by independent multiple processor structures
At.
The some or all of the function of each element of controller can also be used as in the department of computer science for constituting controller
The program that is able to carry out in system is realized.A part of the function of each element of control unit can also be constituted by customizing IC.
It is connected with adsorbent equipment 16, absorption conveyer 7 and end material press device 25 on the controller.
It is connected with the size for detecting substrate, shape and the sensor of position on the controller, for detecting each dress
The sensor and switch and message input device for the state set.
(5) formation of substrate (unit adhesive substrates)
The process for forming substrate (unit adhesive substrates) 100 by whole adhesive substrates 100A is illustrated.
Most start, prepares whole adhesive substrates 100A, and form device in first substrate 101A using scribing line (not shown)
Surface formed first scribing line S1 and third cross S3, then the second substrate 102A surface formed second scribing line S2.
The first scribing line S1, the second scribing line S2 and third scribing line S3 are truncated using cutting device (not shown) and is formed with
Multiple substrates 100.
(6) control action of material removing device is held
Illustrate the side that the end material 107 for separating the first unit substrate 101 from substrate 100 is removed using Figure 10~Figure 13
Method.Figure 10~Figure 13 is the schematic side of end material removing device 25 corresponding with end each step of control flow of material removing device 25
View.
Control explained below process is to illustrate, and each step can be omitted and be replaced as needed.Alternatively, it is also possible to
Multiple steps are performed simultaneously or some or all Overlapped Executions.
Each step of the control flow is not limited to single control action, can also be replaced as being showed by multiple steps more
A control action.
The movement of each device is to issue instruction from controller to each device as a result, they pass through software/application
Each step performance.
The control flow have such as substrate-placing step S1, workbench adsorption step S2, conveyer adsorption step S3,
Step S5 and end material pressing step S6 is mentioned on workbench absorption stopping step S4, substrate.
In substrate-placing step S1, the substrate 100 for remaining end material 107 is placed on workbench 13 (Figure 10).First
Unit substrate 101 is located below (Figure 10) for the second unit substrate 102.Material 107 is held to enter the second unit substrate
It is placed on workbench 13 in the state of on the downside of 102 end.In substrate-placing step S1, controller control base board is turned over sometimes
Rotary device 1 is executed (Fig. 1), and the absorption conveyer 7 of controller control sometimes is executed (Fig. 9).
In workbench adsorption step S2, substrate 100 is adsorbed in workbench 13.In workbench adsorption step S2, control
Device control adsorbent equipment 1 is executed.In the state that substrate 100 is placed on workbench 13 and is adsorbed, hold as needed
The observation determination of position (mounting) of row substrate 100, calibration etc..
In conveyer adsorption step S3, absorption the second unit substrate from conveyer 7 to substrate 100 upper surface side
Decline, and from the upper surface side sorbing substrate 100 (Figure 11) of the second substrate.
It adsorbs and stops in step S4 in workbench, absorption (Figure 11) of the stop table 13 to substrate 100.It is inhaled in workbench
In attached stopping step S4, controller control adsorbent equipment 16 is executed.
It is above mentioned in step S5 in substrate, in the second unit substrate of the adsorption section 7a sorbing substrate 100 of absorption conveyer 7
In the state of 102, absorption conveyer 7 rises, and above mentions substrate 100 (Figure 12) from workbench 13.
In the method, before by holding material to be pressed, substrate 100 is above mentioned from workbench 13.As a result, not
Isolated end material 107 remains on substrate 100 (Figure 12) with main body 106 together.
In end material pressing step S6, make the elastic press section 23a Xiang Duancai for holding the pressing component 23 of material press device 25
107 end face is mobile and is allowed to abut and pressed (Figure 13).By making to hold the beam 19 of material press device 25 to horizontal direction
It moves and keeps pressing component 23 mobile to horizontal direction, elastic press section 23a is abutted with the end face of end material 107.As a result, end
Material 107 is separated from main body 106.In end material pressing step S6, controller control terminal material press device 25 is executed.For example,
In the case where substrate 100 is adsorbed conveyer 7 and is transported into, the state that conveyer 7 is transported into can also be adsorbed from substrate 100
Start actuating station material and presses step S6.
Pressing component 23 is upper the position separated with the end position that separates in the horizontal direction of material 107 or in the horizontal direction
The end face of aspect opposite end material 107 is configured, and is abutted simultaneously to horizontal direction or obliquely downward movement with the end face of end material 107
It is pressed.End material pressing component 23 can apply in suitable direction and can make to hold material 107 from master in the end face of opposite end material 107
The optimal pressing force that body 106 separates.
End material pressing step S6 can from workbench 13 above mention substrate 100 and making hold material 107 to except workbench 13 (with
End material disposable containers connection discarded mouth) fall position on carry out.In this case, in end material pressing step S6, end
Material 107 is abandoned to (end material disposable containers) except workbench 13.
It is not as currently kept end material to be allowed to the main body 106 from the first unit substrate in the material removing device 61 of end
It is mobile, but make to hold master of the material 107 from the first unit substrate 101 and using the end face of 23 press-side material 107 of pressing component
Body 106 separates.As a result, the exposure 102a of second unit substrate 102 will not be by end material 107 in the separation of end material 107
Pressing, therefore exposure 102a will not be damaged.
Due to can in the state that a part of the end material 107 of substrate 100 is above mentioned to except workbench 13 separating end
Material 107, therefore can make that material 107 is held to fall to desired position, it may not be necessary to the end from workbench 13 after discharge separation
The device of material 107.
2. other embodiment
The present invention is not limited to above-mentioned embodiments, can carry out various changes without departing from the spirit of the invention
More.Multiple embodiments and variation being capable of any combination as needed.
(1) variation of material removing device is held
End material removing device also can be set in using substrate turnover device mounting adhesive substrates substrate-placing platform with
Outer device (specific processing unit (plant), such as lineation device, breaking device).
(2) variation of substrate
It is opened in fitting brittle material substrate made of brittle material substrate in fitting two, the liquid including being bonded glass substrate
The panel display boards such as crystal panel, Plasmia indicating panel, organic EL display panel；Silicon substrate, sapphire substrate etc. are bonded
Semiconductor substrate made of on to glass substrate etc..The type for constituting each structural substrate of adhesive substrates is not particularly limited.Knot
Structure substrate includes the glass, semiconductor wafer, ceramic substrate of veneer.
(3) variation crossed
The shape of scribing line is not limited.Scribing line is straight line but it is also possible to be for example in a part in the first embodiment
Or all with the shape of curve.
Claims (9)
1. a kind of end material removing device is used to remove end material from adhesive substrates, the adhesive substrates have to be formed on surface
For separating the first substrate and the second substrate at the back side for fitting in the first substrate of the scribing line of the end material from main body,
The end material removing device has:
Device is mentioned on substrate, above mentions the adhesive substrates in the state that first substrate is lower section；And
Hold material press device, made and making pressing component abut and be pressed with the end face of the end material end material from
The main body separation.
2. a kind of end material removing device is used to remove end material from adhesive substrates, the adhesive substrates have to be formed on surface
For separating the first substrate and the second substrate at the back side for fitting in the first substrate of the scribing line of the end material from main body,
The end material removing device has:
Substrate turnover device makes the adhesive substrates of the state of the first substrate top be turned into the first substrate
For the state of lower section；
Device is mentioned on substrate, above mentions the adhesive substrates in the state that first substrate is lower section；And
Hold material press device, made and making pressing component abut and be pressed with the end face of the end material end material from
The main body separation.
3. material removing device in end according to claim 1 or 2, which is characterized in that
It is absorption conveyer that the substrate, which above mentions device,.
4. material removing device in end according to claim 1 or 2, which is characterized in that
The pressing component has elastic press section, abuts elastic press section and the end face of the end material.
5. material removing device in end according to claim 1 or 2, which is characterized in that
By make the pressing component to horizontal direction movement and be allowed to abut with the end face of the end material.
6. a kind of end material removes method, it is used to remove end material from adhesive substrates, the adhesive substrates have to be formed on surface
For separating the first substrate and the second substrate at the back side for fitting in the first substrate of the scribing line of the end material from main body,
By the end material for making pressing component with the adhesive substrates above mentioned in the state of the first substrate lower section
End face abut and pressed and separate the end material from the main body.
7. a kind of end material removes method, it is used to remove end material from adhesive substrates, the adhesive substrates have to be formed on surface
For separating the first substrate and the second substrate at the back side for fitting in the first substrate of the scribing line of the end material from main body,
The end material removes method
Substrate overturning step, makes the adhesive substrates of the state above the first substrate be turned into the first substrate to be
The state of lower section；
Step is proposed on substrate, above mentions the adhesive substrates for the state that the first substrate is lower section；And
Material is held to press step, by making pressing component make the end material from institute and abutting and pressed with the end face of the end material
State main body separation.
8. end material according to claim 6 or 7 removes method, which is characterized in that
The pressing component has elastic press section, abuts elastic press section and the end face of the end material.
9. end material according to claim 6 or 7 removes method, which is characterized in that
By make the pressing component to horizontal direction movement and be allowed to abut with the end face of the end material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017255115A JP2019119643A (en) | 2017-12-29 | 2017-12-29 | Edge material removing device and edge material removing method |
| JP2017-255115 | 2017-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109987832A true CN109987832A (en) | 2019-07-09 |
Family
ID=67129684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811610958.7A Pending CN109987832A (en) | 2017-12-29 | 2018-12-27 | Material removing device and end material is held to remove method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019119643A (en) |
| KR (1) | KR20190082095A (en) |
| CN (1) | CN109987832A (en) |
| TW (1) | TW201930212A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5374545B2 (en) | 2011-06-01 | 2013-12-25 | 三星ダイヤモンド工業株式会社 | Substrate cutting device |
-
2017
- 2017-12-29 JP JP2017255115A patent/JP2019119643A/en active Pending
-
2018
- 2018-12-17 KR KR1020180163235A patent/KR20190082095A/en unknown
- 2018-12-17 TW TW107145393A patent/TW201930212A/en unknown
- 2018-12-27 CN CN201811610958.7A patent/CN109987832A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201930212A (en) | 2019-08-01 |
| KR20190082095A (en) | 2019-07-09 |
| JP2019119643A (en) | 2019-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110000928A (en) | Rim charge removing device and rim charge remove method | |
| TW201114703A (en) | Overturning apparatus for overturning a plate and overturning method of the same | |
| KR101577481B1 (en) | Substrate transfer apparatus and substrate transfer method | |
| TW200941616A (en) | Apparatus and method for manufacturing laminated substrate | |
| CN108274445A (en) | Base plate processing device | |
| KR20130047590A (en) | Sticking apparatus and sticking method | |
| JP2004325539A (en) | Method and device for sticking polarizing plate to substrate | |
| CN109987832A (en) | Material removing device and end material is held to remove method | |
| TWI746589B (en) | Substrate breaking system | |
| WO2013058094A1 (en) | Workpiece holding device | |
| CN100529873C (en) | System and method for removing blank glass from panel | |
| CN104103568A (en) | Chuck Workbench | |
| TWI739869B (en) | Substrate breaking system | |
| CN109927184A (en) | Substrate disconnects device | |
| JP2008227199A (en) | Component mounting apparatus and substrate conveying method | |
| CN109872966A (en) | Substrate absorption device | |
| KR100771279B1 (en) | Method for printing solder pastes using a mask and a jig used therefor | |
| KR100592338B1 (en) | Electronic component pickup device, electronic component pickup method and electronic component pickup program | |
| TW202136163A (en) | End material removal apparatus and end material removal method | |
| KR20110123548A (en) | Apparatus for manufacturing liquid crystal display device | |
| KR20070062817A (en) | Bonding device for fpd glass substrate useful to large scale glass substrate | |
| KR101166960B1 (en) | Method for cutting a liquid crystal display cell mother board and automatic cutting system for the same | |
| TWI336680B (en) | Polarizer conveying and film removing device and method thereof | |
| WO2012144169A1 (en) | Polarizing plate attachment device and polarization plate attachment method | |
| JP2008227134A (en) | Component mounting apparatus and substrate conveying method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190709 |
|
| WD01 | Invention patent application deemed withdrawn after publication |