JP2019119643A - Edge material removing device and edge material removing method - Google Patents

Abstract

To remove edge materials without breaking a face to be exposed, when the edge materials are removed and stuck together after forming a scribe line, and either inside face of a substrate is exposed.SOLUTION: The edge material 61 segments a first unit substrate 101 in which a third scribe line S3 for separating the edge material 107 from a main body 106 is formed in a surface, and a unit aligned substrate 100 having a second unit substrate 102 which is stuck to a rear face of the first unit substrate 101. An adsorption carrier device 7 lifts up the unit aligned substrate 100 in a state that the first unit substrate 101 is at down side. An edge material pressing device 25 separates an edge material 107 from the main body 106 by pressing an elastic pressing part 23a of a pressing member 23 with contacting it to the edge material 107.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a scrap material removing device and a scrap material removing method, in particular, a first substrate having a scribe line formed on the surface for separating the scrap material, and a second substrate bonded to the back surface of the first substrate. The present invention relates to an apparatus for removing scraps and a method for removing scraps from a bonded substrate.

  The liquid crystal device is configured of a bonded substrate in which a first substrate and a second substrate are bonded by a sealing material such that a liquid crystal layer is interposed therebetween. In the bonded substrate, a color filter is formed in a pattern on one of the above substrates (for example, the first substrate), and a TFT (Thin Film Transistor) and a connection terminal are formed on the other substrate (for example, the second substrate). ing.

  In the bonded substrate, in order to connect to an external electronic device, the connection terminal formed on the second substrate is exposed. In the bonded substrate, there is known a separation method of the substrate for exposing the surface on which the connection terminal is formed (for exposing the inner side surface of one of the bonded substrates) (for example, Patent Document 1) reference).

  In Patent Document 1, the scribing line is formed by shifting the arrangement position of the cutter for forming the scribe line on the first substrate first and the arrangement position of the cutter for forming the scribe line on the second substrate. Then, when the part (end material) used as the piece end of a bonded substrate and the main body are separated and the connection terminal is exposed, the chuck member is moved away from the main body while holding the end material by the chuck member.

JP, 2012-250871, A

  When removing the end material by holding and moving the end material with the chuck member, the end material does not strongly press the surface on which the connection terminal of the main body is formed (for preventing damage to the connection terminal), It is necessary to accurately adjust the position of the chuck member.

  An object of the present invention is to remove scraps without damaging the surface to be exposed, in the case where scraps are removed after scribing lines are formed to expose the inner surface of any of the bonded substrates. It is in.

  Below, a plurality of modes are explained as a means to solve a subject. These aspects can be arbitrarily combined as needed.

The scrap material removing apparatus according to the present invention is a bonded substrate including a first substrate having a scribe line formed on the surface to separate the scrap from the main body, and a second substrate bonded to the back surface of the first substrate. A scrap removing device for removing scrap, which comprises a substrate lifting device for lifting a bonded substrate and a scrap pressing device having a pressing member.
The suction and transfer apparatus sucks the second substrate in a state where the first substrate is downward and lifts the bonded substrate.
The edge material pressing device presses the edge material by bringing the pressing member into contact with the end surface of the edge material (corresponding to the outer peripheral surface on the edge material side of the first substrate (side surface substantially orthogonal to the main surface)) Separate from the body.

In this device, the end material is separated from the main body of the first substrate by the pressing force of the pressing member.
In this device, the scrap does not press the surface of the second substrate when removing the scrap, and the exposed surface of the second substrate is less likely to be damaged.
The substrate lifting device can be a suction transport device.
In this apparatus, the scrap is separated in a state in which the bonded substrate is lifted by the suction conveyance device, so, for example, the scrap pressing device is disposed above the disposal port communicating with the scrap disposal container and the substrate is By moving upward and separating the scrap on the waste port, the scrap can be disposed of in the scrap disposal container.

The scrap material removal apparatus of the present invention can include a substrate reversing device that reverses the bonded substrate in a state in which the first substrate is on the upper side to a state in which the first substrate is on the lower side.
In this apparatus, even when the bonded substrate is received with the first substrate facing upward, the end material can be separated by the pressing force of the pressing member.

The pressing member can have an elastic pressing portion, and can press the elastic pressing portion in contact with the end face of the end material.
The end material pressing device can be brought into contact with the end surface of the end material by moving the pressing member in the horizontal direction.
In this device, the end material can be separated from the main body only by moving the pressing member horizontally.

The scrap material removing apparatus according to the present invention is a substrate loading apparatus for loading a substrate (including a substrate inverted by a substrate reversing apparatus) before being lifted by a substrate lifting apparatus (suction transport apparatus) or a substrate after scrapping. You may provide a holder. The offcut removing device may further include an adsorption device. The suction device may be provided on the substrate placement unit to suction the bonded substrate.
In this apparatus, observation and alignment of the substrate (the main body and the end material) can be performed in a state in which the substrate is adsorbed by the substrate mounting portion before pressing by the pressing member. Can be performed accurately and stably.

According to the present invention, there is provided a method of removing scraps from a bonded substrate comprising a first substrate having a scribe line formed on the surface to separate the scrap from the main body, and a second substrate bonded to the back of the first substrate. A method of removing scrap material for removing material, comprising the following steps:
A step of bringing the pressing member into contact with the end face of the end of the end of the bonded substrate which has been lifted in a state where the first substrate is in the downward direction and pressing the same.
In this method, the end material is separated from the main body of the first substrate by the pressing force of the pressing member.

The scrap material removal method of the present invention can include the following steps.
A substrate reversing step of reversing the bonded substrate in a state in which the first substrate is on the upper side to a state in which the first substrate is on the lower side
持 ち 上 げ Lifting step of lifting the bonded substrate in a state in which the first substrate is in the lower position by the suction and transfer device.
An edged material pressing step in which the edged material is separated from the main body by bringing the pressing member into contact with and pressing the end surface of the edged material.
In this method, the end material can be separated from the main body of the first substrate by the pressing force of the pressing member.
In this method, pressing by the pressing member can be performed at a desired position by conveying the bonded substrate in a lifted state. For example, by performing the pressing by the pressing member above the discard port communicating with the scrap waste container, it is possible to drop the scrap separated by the pressing by the pressing member to the scrap disposal.
In this method, since the substrate can be reversed, even in the case of a bonded substrate which is received with the first substrate facing upward, the end material can be separated with the first substrate facing downward.

  In this method, the end material does not press the surface of the second substrate when removing the end material, and damage to the exposed surface of the second substrate is less likely to occur.

In this method, the pressing member can have an elastic pressing portion, and the elastic pressing portion can be brought into contact with the end face of the end material.
In this method, the pressing member can be brought into contact with the end face of the end material by moving the pressing member in the horizontal direction.
In this method, the end material can be separated from the main body only by moving the pressing member horizontally.

The scrap material removal method of the present invention may further include an adsorption step of adsorbing the bonded substrate stack to the substrate mounting portion.
In this method, observation and alignment of the bonded substrate can be performed in a state where the bonded substrate is adsorbed to the substrate mounting portion, and therefore pressing by the pressing member (elastic pressing portion) can be performed accurately and stably. .

  In the waste material removing apparatus and the waste material removing method according to the present invention, the second material is removed by a simpler method in the case where the waste material of the first substrate of the bonded substrate is removed to expose the inner surface of the second substrate. The scrap can be removed without exerting an excessive force on the exposed surface of the substrate.

The side view of a substrate inversion apparatus, a substrate mounting stage, and a suction conveyance apparatus. The perspective view of a substrate inversion device. The schematic perspective view of a board | substrate mounting stage. The schematic plan view of a substrate mounting stage. FIG. 5 is a perspective view of an end material pressing member. The typical side view of the bonded substrate used for one embodiment of the present invention. The schematic side view of the bonding board | substrate after division. The typical side view of the bonded substrate board after division in the state where scraps remained. BRIEF DESCRIPTION OF THE DRAWINGS The typical side view of the scrap material removal apparatus which concerns on 1st Embodiment. The schematic side view of the scrap material removal apparatus which shows a board | substrate mounting step. The schematic side view of the scrap material removal apparatus which shows the state from a transfer apparatus adsorption start step to a table adsorption stop step. FIG. 7 is a schematic side view of a scrap removal device showing a substrate lifting step. The schematic side view of the scrap removing device which shows a scrap pressing step.

1. First Embodiment (1) Substrate Inverting Device and Substrate Placing Stage FIG. 1 is a substrate loading and lifting device (substrate receiving stage, substrate inverting device, substrate placing stage and suction conveying device) of the end material removing device of the present invention. It is a side view. FIG. 2 is a perspective view of the substrate reversing device. FIG. 3 is a schematic perspective view of a substrate mounting stage. FIG. 4 is a schematic plan view of the substrate mounting stage. FIG. 5 is a perspective view of the pressing member of the end material pressing device.
In FIGS. 1-5, arrow X is a 1st horizontal direction, and arrow Y is a 2nd horizontal direction.

  The bonded substrate loading and lifting apparatus 1 in the scrap material removal apparatus includes a substrate receiving stage 9, a substrate reversing device 5, a substrate placement stage 3, and a suction transfer device 7. The substrate reversing device 5 transports the substrate from the substrate receiving stage 9 receiving another substrate from the substrate receiving stage 9 to the substrate placing stage 3 while reversing the substrate, and removes the substrate 100 placed on the substrate placing stage 3 The suction conveyance device 7 lifts. The substrate placed on the substrate placing stage of another device can be countered to the substrate placing stage 3 while being inverted by the substrate reversing device 5.

(1-1) Substrate Receiving Stage and Substrate Inversion Device For example, the substrate receiving stage 9 is a device for receiving the substrate 100 from another device. The substrate reversing device 5 is a device for reversing the substrate 100. The substrate reversing device 5 reverses the substrate 100 carried in to the substrate receiving stage 9 with the first substrate (mill end) from the other device being in the upper position, and the table 13 with the first substrate (mill end) in the lower position. Can be placed on top of the

The substrate reversing device 5 has a support structure 31 and a reversing structure 33 (FIGS. 1 and 2).
The reversing structure 33 is supported by the support structure 31 so as to be pivotable about a pivot shaft 35 extending in the direction orthogonal to the drawing sheet. The reversing structure 33 has a shaft 37, which is concentric with the pivot shaft 35. The reversing structure 33 has a plurality of retaining arms 39 extending perpendicularly from the shaft 37. The plurality of holding arms 39 extend in parallel in the same direction.

  The plurality of holding arms 39 pivot around a pivot shaft 35 between a position on the table 13 and the substrate receiving stage 9 (FIG. 1). A number of air suction pads 41 are provided on the same side of the holding arm 39 (FIG. 2). The air suction pad 41 is disposed on the upper surface of the holding arm 39 in a posture in which the holding arm 39 is disposed on the table 13.

The substrate 100 placed on the substrate receiving stage 9 is adsorbed by the holding arm 39, and the holding arm 29 is rotated to place the substrate 100 on the table 13. The holding arm 39 rotates from the substrate mounting stage 3 side to the substrate receiving stage 9 side to approach the substrate 100 mounted on the upper surface of the substrate receiving stage 9 from above, and the air suction pad 41 is on the upper surface of the substrate 100 Contact By operating a suction pump (not shown), the air suction pad 41 sucks and holds the substrate 100. The holding arm 39 is inverted 180 degrees from the substrate receiving stage 9 side to the table 13 side. The table 13 is located at the second position, and the placement surface 13a is located at a lower position than the planned height. After the holding arm 39 enters between the receiving members 15 of the table 13 positioned at the second position, the mounting surface 13a is raised to a predetermined height, and the substrate 100 is mounted on the table 13 Delivered to 13a. Thereafter, the table 13 is moved from the second position to the first position.

(1-2) Substrate Mounting Stage The substrate mounting stage 3 has a fixed base 11 and a table 13 (an example of a substrate mounting part) disposed on the base 11. The table 13 is movable with respect to the table 11 between a first position (FIGS. 3 and 4) on the downstream side in the transport direction which is the second horizontal direction and a second position on the upstream side in the transport direction.
The table 13 is composed of a plurality of receiving members 15 (FIGS. 3 and 4). The plurality of receiving members 15 extend in parallel in the first horizontal direction and in the second horizontal direction. A plurality of suction holes (not shown) are formed on the upper surface of the receiving member 15 and connected to the suction device 16 (FIG. 10). The plurality of receiving members 15 receive the substrate 100 from the substrate reversing device 5 at the second position (FIG. 1).

(1-3) Suction and Transport Device The suction and transport device 7 is a device for lifting the substrate 100 when pressing off the substrate material from the substrate 100. The suction conveyance device 7 has a suction unit 7a, a conveyance direction moving unit (not shown), an elevation unit (not shown), and the like. The suction and transfer device 7 can also lift the substrate 100 placed on the table 13 and transfer it to the end material pressing device, and can also lift the substrate 100 from other devices and transfer it to the end material pressing device. it can.
The air suction pad 41 of the holding arm 39 of the substrate reversing device 5 and the suction portion 7a of the suction conveyance device 7 are connected to an air suction device (not shown) such as a vacuum pump via piping.

(1-4) Edge Material Pressing Device The edge material removing device has an edge material pressing device 25 above the substrate placement stage 3. The end material pressing device 25 has a gate-shaped support structure 21 composed of a pair of left and right columns 17 and a beam 19 bridged to the columns 17 and extending in the first horizontal direction (FIGS. 3 and 4). The pressing member 23 is attached to the beam 19 (FIG. 5). The scrap pressing device separates the scrap 107 of the first substrate (the scrap attached to the lower surface of the end of the second substrate or the main body of the first substrate) of the first substrate facing downward of the substrate 100 in the lifted state. Device of The pressing member 23 can have an elastic pressing portion 23a. The elastic pressing portion 23a is formed of an elastic body such as sponge, rubber, sponge rubber (porous rubber) or the like. The resilient pressing portion 23a is directed horizontally to face the end face of the end piece 107, and moves the beam 19 in the horizontal direction when pressing the end face of the end piece 107 (particularly the lower half of the end face). Therefore, the beam 19 can be moved horizontally and the pressing member 23 can be moved obliquely downward by moving the beam 19 downward.

(2) Bonded Substrate FIG. 6 is a schematic side view of a bonded substrate (entirely bonded substrate) used in an embodiment of the present invention.
The whole bonded substrate 100A is composed of a first substrate 101A and a second substrate 102A bonded to the back surface of the first substrate 101A. A first scribe line S1 and a second scribe line S2 are formed extending in the width direction (first horizontal direction) at equal intervals on the first substrate 101A and the second substrate 102A, and they are divided at the boundary. The unit-bonded substrate 100 (hereinafter referred to as the “substrate 100”) is obtained.

FIG. 7 is a schematic side view of a substrate (a unit bonded substrate after division) 100. The substrate 100 includes a first unit substrate 101 and a second unit substrate 102 bonded to the back surface of the first unit substrate 101. In FIG. 7, the end material which is the end portion of the first unit substrate 101 is removed, so that the exposed surface 102 a is a part of the main surface of the second unit substrate 102 exposed.
However, when dividing the whole bonded substrate 100A, it is conceivable that the end material could not be removed.

FIG. 8 is a schematic side view of the substrate (unit-bonded substrate after division) 100 in a state where the scraps 107 remain.
As shown in FIG. 8, although the third scribe line S <b> 3 is formed, the end material 107 is in a state of being attached to the main body 106 of the first unit substrate 101.

(3) Mechanical configuration of scrap material removal apparatus FIG. 9 is a schematic side view of the scrap material removal apparatus according to the first embodiment of the present invention. The scrap material removal device 61 is a device for separating the scrap material 107 from the substrate 100 in which the scrap material 107 remains.
The scrap material removing device 61 is configured of an adsorption conveyance device 7 and a scrap material pressing device 25.
The substrate 100 is composed of a first unit substrate 101 and a second unit substrate 102 bonded to the back surface of the first unit substrate 101 (FIG. 9). A third scribe line S3 is formed on the surface of the first unit substrate 101 to separate the main body 106 and the end material 107.

The substrate 100 is placed on the table 13 such that the first unit substrate 101 is positioned below.
A suction device 16 is connected to the table 13 (FIG. 9). The suction device 16 is provided on the table 13 to suction and fix the substrate 100. The adsorption device 16 has an air suction device (not shown) such as a vacuum pump.

  The edge material pressing device 25 separates the edge material 107 from the main body 106 by pressing the pressing member 23 against the end surface of the edge material 107 (in particular, the lower half of the edge surface or less). The pressing member 23 has a height equal to or higher than the end of the substrate 100 (closer to the end material 107), horizontally or obliquely upward with respect to the end surface of the end material 107. , Are arranged to face each other. The edge material pressing device 25 moves the pressing member 23 facing the end surface of the edge material 107 in the horizontal direction or diagonally downward, and abuts on the edge surface of the edge material 107 to press it. The scraps 107 are separated from the main body 106.

The pressing member 23 has an elastic pressing portion 23 a. The elastic pressing portion 23a is formed of an elastic body having a predetermined elasticity, for example, an elastic body such as sponge, rubber, sponge rubber (porous rubber) or the like.
In this device, the pressing member 23 has the resilient pressing portion 23a, so that an optimum pressing can be performed such that the end material 107 can be separated from the main body 106 without giving an excessive impact to the end material 107 more than necessary. It can give pressure.
The type (elasticity, etc.) of the elastic body constituting the elastic pressing portion 23a and the pressing force of the elastic pressing portion 23a against the end face of the end material 107 can be appropriately adjusted based on, for example, the size and weight of the end material 107. .

  The pressing member 23 may have a width direction of the substrate 100 (the elastic pressing portion 23 a may be formed of a rod-like elastic member elongated along the first horizontal direction, or the width direction of the substrate 100 (first A plurality of bars may be arranged along the horizontal direction, and a tip end facing the end face of the end material 107 in the vertical direction may be a rod-like configuration (FIG. 5).

(4) Control configuration of scrap material removal device The scrap material removal device 61 has a controller.
The controller is a computer system having a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.) It is. The controller performs various control operations by executing the program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

The controller may be configured with a single processor, but may be configured with independent processors for each control.
Some or all of the functions of the components of the controller may be implemented as a program executable on a computer system that constitutes the controller. A part of the function of each element of the control unit may be configured by a custom IC.

The adsorption device 16, the adsorption conveyance device 7, and the end material pressing device 25 are connected to the controller.
Connected to the controller are sensors for detecting the size, shape and position of the substrate, sensors and switches for detecting the state of each device, and an information input device.

(5) Formation of Substrate (Unit Bonded Substrate) A process of forming the substrate (unit bonded substrate) 100 from the entire bonded substrate 100A will be described.
First, the whole bonded substrate 100A is prepared, and a first scribe line S1 and a third scribe line S3 are formed on the surface of the first substrate 101A by a scribe line forming apparatus (not shown), and further on the surface of the second substrate 102A. A second scribe line S2 is formed.
The first scribing line S1, the second scribing line S2, and the third scribing line S3 are divided by a dividing device (not shown) to form a plurality of substrates 100.

(6) Control Operation of Cutting Edge Removal Device A method of separating and removing the cutting edge 107 of the first unit substrate 101 from the substrate 100 will be described with reference to FIGS. 10 to 13 are schematic side views of the scrap material removing device 25 corresponding to the respective steps of the control flow of the scrap material removing device 25. FIG.

The control flow described below is an example, and each step can be omitted and replaced as necessary. Also, multiple steps may be performed simultaneously, or some or all may be performed overlapping.
Each step of the control flow is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of steps.
The operation of each device is the result of a command from the controller to each device, which are represented by the steps of the software application.

The control flow includes, for example, a substrate placement step S1, a table suction step S2, a transfer device suction step S3, a table suction stop step S4, a substrate lifting step S5, and an end material pressing step S6.
In the substrate placement step S1, the substrate 100 with the end material 107 remaining thereon is placed on the table 13 (FIG. 10). The first unit substrate 101 is positioned below the second unit substrate 102 (FIG. 10). The scraps 107 are placed on the table 13 in a state in which they are under the end of the second unit substrate 102. When the controller controls and executes the substrate reversing device 1 (FIG. 1), the substrate mounting step S1 may control and execute the suction conveyance device 7 (FIG. 9).
In the table suction step S2, the substrate 100 is suctioned to the table 13. The controller controls the suction device 1 to execute the tape suction step S2. In a state where the substrate 100 is placed on the table 13 and adsorbed, the observation (specification of the placement position) of the substrate 100, alignment, and the like are performed as necessary.

  In the transfer device suction step S3, the suction transfer device 7 is lowered to the upper surface side of the second unit substrate of the substrate 100 to suck the substrate 100 from the upper surface side of the second substrate (FIG. 11).

In the table suction stop step S4, the suction of the substrate 100 by the table 13 is stopped (FIG. 11). The controller controls the suction device 16 to execute the table suction stop step S4.
In the substrate lifting step S5, with the suction unit 7a of the suction transfer device 7 sucking the second unit substrate 102 of the substrate 100, the suction transfer device 7 ascends to lift the substrate 100 from the table 13 (FIG. 12) .

  In this method, the substrate 100 is lifted from the table 13 before pressing by the end material pressing. As a result, the uncut end pieces 107 remain on the substrate 100 together with the main body 106 (FIG. 12).

In the edge material pressing step S6, the elastic pressing portion 23a of the pressing member 23 of the edge material pressing device 25 is moved toward the end surface of the edge material 107, brought into contact with it, and pressed (FIG. 13). As the beam 19 of the end material pressing device 25 moves in the horizontal direction, the pressing member 23 moves in the horizontal direction, and the elastic pressing portion 23 a abuts on the end surface of the end material 107. As a result, the end material 107 separates from the main body 106. The controller controls the end material pressing device 25 to execute the end material pressing step S6. For example, when the substrate 100 is carried in by the suction conveyance device 7, the end material pressing step S <b> 6 may be performed from the state where the substrate 100 is carried in by the suction conveyance device 7.
The pressing member 23 is disposed facing the end face of the end piece 107 at a position separated horizontally from the end piece 107 or at a position separated horizontally, and is moved horizontally or obliquely downward to be cut off It abuts on the end face of the face 107 and presses it. The edge material pressing member 23 can apply an appropriate pressing force to the end surface of the edge material 107 so that the edge material 107 can be separated from the main body 106 in an appropriate direction.
The edged material pressing step S6 can be performed at a position where the substrate 100 is lifted from the table 13 and the edged material 107 falls to the outside of the table 13 (a waste port communicating with the waste material waste container). In this case, the end material 107 is discarded to the outside of the table 13 (the end material waste container) in the end material pressing step S6.

In the end material removing apparatus 61, the end material 107 is pressed by pressing the end surface of the end material 107 with the pressing member 23, instead of holding the end material and moving it from the main body 106 of the first unit substrate as in the prior art. It is separated from the main body 106 of the first unit substrate 101. As a result, since the exposed surface 102 a of the second unit substrate 102 is not pressed by the edge material 107 during separation of the edge material 107, the exposed surface 102 a is not damaged.
Since the end material 107 can be separated in a state where the end material 107 of the substrate 100 is lifted out of the table 13, the end material 107 can be dropped to a desired position. Can be dispensed with.

2. Other Embodiments The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Several embodiment and modification can be combined arbitrarily as needed.
(1) Modifications of the scrap removing device The scrap removing device is a device (a specific processing device such as a scribing device, a breaking device) other than the substrate mounting stage on which the bonded substrate is mounted by the substrate reversing device. It may be provided.
(2) Modification of Substrate A liquid crystal panel in which a glass substrate is laminated to a bonded brittle material substrate in which two brittle material substrates are laminated, a plasma display panel, a flat display panel such as an organic EL display panel, a silicon substrate And a semiconductor substrate in which a sapphire substrate or the like is bonded to a glass substrate. The type of each constituent substrate constituting the bonded substrate is not particularly limited. The constituent substrate includes a single plate glass, a semiconductor wafer, and a ceramic substrate.

(3) Modification of Scribe Line The shape of the scribe line is not limited. In the first embodiment, the scribe line is a straight line, but may have, for example, a shape having a curve in part or all.

1: Substrate Loading and Lifting Device 3: Substrate Mounting Stage 5: Substrate Reversing Device 7: Suction Transport Device 13: Table 13a: Mounting Surface 15: Receiving Member 23: Pressing Member 23a: Elastic Pressing Portion 25: End Material Pressing Device 61 Abrasive material removal apparatus 100: unit bonded substrate 101: first unit substrate 102: second unit substrate 102a: exposed surface 102b: end surface 106: main body 107: scrap material

Claims (9)

An end for removing the end material from a bonded substrate including a first substrate having a scribe line for separating the end material from the main body and a second substrate attached to the back surface of the first substrate. A material removal device,
A substrate lifting device for lifting the bonded substrate in a state in which the first substrate is in a lower position;
An edge material pressing device for separating the edge material from the main body by bringing a pressing member into contact with the end surface of the edge material and pressing the edge member;
Waste material removal device equipped with. An edge material for removing an edge material from a bonded substrate including a first substrate having a scribe line formed on the front surface for separating the edge material from the main body, and a second substrate bonded to the back surface of the first substrate. A removal device,
A substrate reversing device for reversing the bonded substrate in a state in which the first substrate is on the upper side to a state in which the first substrate is on the lower side;
A substrate lifting device for lifting the bonded substrate in a state in which the first substrate is in a lower position;
An edge material pressing device for separating the edge material from the main body by bringing a pressing member into contact with the end surface of the edge material and pressing the edge member;
Waste material removal device equipped with.   The substrate scrap removing device according to claim 1 or 2, wherein the substrate lifting device is a suction transfer device.   The scrap material removing device according to claim 1 or 2, wherein the pressing member has a resilient pressing portion, and causes the resilient pressing portion to abut on the end face of the scrap. The scrap material removing device according to claim 1 or 2, wherein the pressing member is brought into contact with the end face of the scrap by moving the pressing member horizontally. An end for removing the end material from a bonded substrate including a first substrate having a scribe line for separating the end material from the main body and a second substrate attached to the back surface of the first substrate. Material removal method,
The end material removal method which makes the end material separate from the main body by making a pressing member contact and press the end face of the end of the end of the pasted substrate which was raised in the state where the 1st substrate became below. An end for removing the end material from a bonded substrate including a first substrate having a scribe line for separating the end material from the main body and a second substrate attached to the back surface of the first substrate. Material removal method,
A substrate reversing step of reversing the bonded substrate in a state in which the first substrate is on the upper side to a state in which the first substrate is on the lower side;
Lifting the laminated substrate in a state in which the first substrate is in the downward direction;
An edged material pressing step in which the edged material is separated from the main body by bringing a pressing member into contact with the end surface of the edged material and pressing it
Waste material removal method equipped with The end material removing method according to claim 6 or 7, wherein the pressing member has an elastic pressing portion, and causes the elastic pressing portion to abut on the end face of the end material. The scrap material removing method according to claim 6 or 7, wherein the pressing member is brought into contact with the end face of the scrap by moving the pressing member in the horizontal direction.

Images