JP2019040941A - Device for bonding adhesion tape to substrate and adhesion method - Google Patents

Abstract

To provide an adhesion tape bonding device capable of bonding adhesion tapes having various diameters in accordance with an outer form of a substrate.SOLUTION: An adhesion tape T is sucked to a bonding table 18 comprising a circular hole 27 having an almost same diameter with or a slightly large diameter than an outer diameter of a substrate W, by cutting the adhesion tape T from below the circular hole 27 with a cutter 33 while adsorbing a back surface by the bonding table 18, and thereby the cut adhesion tape T is sucked to a suction table 45 and conveyed onto the substrate W, and the adhesion tape T is bonded onto the substrate W. A pressing ring 63 surrounding an outer periphery of the suction table 45 is previously provided, and the pressing ring 63 is lowered while keeping the suction of the adhesion tap T with the suction table 45 when cutting the adhesion tape T. Thus, a gap between the suction table 45 and the adhesion tape T formed is cut by raising the suction table 45 by a predetermined amount while nipping the adhesion tape T of an outer edge part of the circular hole 27, to form the adhesion tape T having a diameter smaller than an outer shape of the suction table 45.SELECTED DRAWING: Figure 12

Description

  The present invention relates to an apparatus and method for applying an adhesive tape to a substrate on which various adhesive tapes such as a protective tape are attached to a substrate such as a semiconductor wafer.

  Conventionally, in a general semiconductor manufacturing process, a protective tape is first attached to a circuit forming surface of a semiconductor wafer (hereinafter referred to as a wafer), and then the back surface of the wafer is ground and thinned. Thereafter, the wafer attached to the protective tape is mounted on the dicing frame via the dicing tape, and the protective tape is peeled off with a peeling tape or the like. Subsequently, the wafer is formed into chips by dicing.

  The wafer back surface grinding is performed by applying a protective tape to the circuit forming surface formed on the front surface of the wafer and polishing the back surface of the wafer or performing an etching process to reduce the size of the semiconductor chip. ing.

  The protective tape prevents damage to the circuit pattern and prevents contamination of the circuit pattern due to penetration of a polishing solution or an etching solution during the back grinding.

  By the way, in the affixing of the protective tape to the wafer, if the cut edge of the affixed protective tape is exposed from the outer peripheral edge of the wafer, the protective tape is easily peeled off from the cut edge part, and the peeled protective tape is There is a problem that the wafer is damaged when grinding the back surface of the wafer, or the wafer is damaged, or a polishing solution or an etching solution enters from the peripheral portion of the outer periphery of the wafer to contaminate the circuit pattern of the wafer.

  Therefore, recently, there has been provided a protective tape attaching device for attaching the protective tape so that the protective tape is substantially equal to the outer peripheral edge of the wafer or inside the outer peripheral edge of the wafer (for example, Patent Document 1).

  The protective tape attaching device of Patent Document 1 includes an attaching table provided with a circular hole that is substantially the same as or slightly smaller than the outer diameter of the wafer, and has a width wider than the circular hole on the attaching table. A protective tape can be attached. Subsequently, at a position facing the circular hole, the protective tape is sucked from the non-adhesive surface side to the suction table of the tape transport and pasting mechanism, and a circumferential cutter acts from below the circular hole. The protective tape is cut out along the suction table.

  Next, the protective tape cut out substantially equal to the outer diameter or smaller than the outer diameter of the wafer is conveyed onto the circuit forming surface of the wafer by the tape conveying and pasting mechanism. The protective tape is attached to the wafer W by swinging the suction table in a reduced pressure atmosphere.

  In addition, when the protective tape sticking apparatus of Patent Document 1 cuts out the protective tape with the circumferential cutter, the protective cutter is cut out by causing the circumferential cutter to enter along the outer shape of the suction table. For this reason, in order to prevent damage and wear of the circumferential cutter and the suction table, the protective tape is cut out to be larger than the outer diameter of the suction table and slightly smaller than the circular hole.

Japanese Patent No. 3607143

  By the way, affixing of the protective tape to the wafer described in Patent Document 1 is a very effective means for affixing the protective tape so as to be inside the outer diameter of the wafer. However, in the protective tape attaching apparatus of Patent Document 1, when the protective tape is cut out with the cutter as described above, the protective tape can be cut only larger than the outer diameter of the suction table.

  For this reason, it is necessary to change the diameter of the circular hole of the affixing table for each outer diameter of the adhesive tape affixed to the wafer, or to change the outer diameter of the adsorption table that adsorbs the protective tape. It was necessary to prepare or modify the equipment.

  In the present invention, when an adhesive tape is applied that is substantially the same as or smaller than the outer diameter of the wafer, air bubbles and wrinkles are not generated on the adhesive tape application surface, and the outer peripheral portion is peeled off. The present invention provides an adhesive tape application device and an attachment method that can change the outer diameter of the adhesive tape to be attached without replacing the suction table. Objective.

Accordingly, the invention of claim 1 is cut by the adhesive tape attaching portion having a mounting table for holding the substrate, the adhesive tape cutting portion for cutting the adhesive tape into the shape of the substrate, and the adhesive tape cutting portion. In an adhesive tape affixing device provided with a tape conveyance affixing mechanism for adhering and holding an adhesive tape and conveying it to the adhesive tape affixing unit and affixing the adhesive tape on the substrate at the adhesive tape affixing unit ,
The adhesive tape cutting section includes a circular hole having a diameter substantially the same as or slightly larger than the outer diameter of the substrate, and an adhesive table on which the adhesive tape is attached so as to cover the circular hole; A cutting means for cutting the adhesive tape attached to the attachment table and attached to the attachment table inside the circular hole, and an attachment means for attaching the adhesive tape on the attachment table;
The tape conveying and pasting mechanism is movable up and down and horizontally, adsorbs and holds the adhesive tape cut out by the cutting means so as to overlap with the non-adhesive surface of the adhesive tape when lowered onto the pasting table, and By lowering onto the tape application part, an adsorption table for adhering an adhesive tape on the substrate, and an outer periphery of the adsorption table so as to surround the adsorption table are provided to be movable up and down with respect to the adsorption table, A pressing ring that presses a portion protruding from the suction table of the adhesive tape sucked and held by the suction table, and
While adhering and holding the adhesive tape affixed on the affixing table from the non-adhesive surface, the adhesive tape is pressed by the pressing ring, and the adsorbing table is raised by a predetermined amount from the affixing surface of the affixing table. And adopting a configuration in which an adhesive tape to be attached to the substrate is formed by cutting the gap portion between the adhesive tape and the suction table generated by partially releasing the suction from the suction surface of the suction table with the cutting means. This is a device for attaching an adhesive tape to a substrate.

  The invention according to claim 2 is the invention according to claim 1, wherein the turning radius of the cutting means is configured to be smaller than the inner diameter of the circular hole, and is slightly smaller than the outer diameter of the suction table. The adhesive tape affixing device to a substrate configured to be capable of cutting the adhesive tape from a small diameter range to a slightly larger diameter range than the outer diameter.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the adhesive tape is substantially the same diameter as the outer diameter of the substrate or inside the outer diameter of the substrate. It is the adhesive tape sticking apparatus to the board | substrate which employ | adopted the structure cut | disconnected in this way.

According to a fourth aspect of the present invention, an adhesive tape is applied and held so as to cover the circular hole on an attachment table having a circular hole having substantially the same diameter as the substrate outer diameter or slightly larger diameter. The adhesive tape is cut from the back surface of the adhesive tape by the cutting means in the circumferential direction from below the circular hole while holding the adhesive tape by suction with a substantially substrate-shaped suction table. In the adhesive tape affixing method in which the adhesive tape is transported on the substrate while adhering and holding the adhesive tape, and the adhesive tape is affixed on the substrate,
A pressing ring that can move up and down with respect to the suction table and presses the adhesive tape so as to surround the outer periphery of the suction table is provided.
While pressing and holding the back surface of the adhesive tape with the suction table when cutting the adhesive tape, the pressing ring is lowered, and the adhesive tape is sandwiched between the outer peripheral portions of the circular holes of the attaching table, Raising the suction table by a predetermined amount causes the cutting means to act on the gap between the suction table and the adhesive tape formed when the suction of the suction table is released, and is slightly smaller than the outer diameter of the suction table. This is a method of attaching an adhesive tape to a substrate that employs a configuration in which the adhesive tape is cut from a large diameter range to a slightly smaller diameter range than the outer diameter.

  According to invention of Claim 1 and Claim 4, the press ring is provided so that the said suction table may be enclosed in the outer peripheral part of a suction table, and when the said adhesive tape is cut | disconnected, the said adhesive table is the said suction table. The suction table and the adhesive tape are formed by releasing the suction of the suction table by lowering the pressure ring and lowering the pressure ring to press the adhesive tape and raising the suction table by a predetermined amount. Since the circumferential cutter acts on the gap, the adhesive tape can be cut to approximately the same diameter as the outer diameter of the suction table or smaller than the outer diameter.

  Also, since the adhesive tape is cut by providing a predetermined amount of height difference between the pressing surface of the pressing ring and the suction surface of the suction table, the cut edges of the adhesive tape are prevented from being reattached by an adhesive or an adhesive. And does not contaminate the substrate or the device.

  In addition, since the adhesive tape cut to a size corresponding to the outer diameter of the substrate is held on the suction table, and the adhesive tape is attached to the substrate by swinging the suction table in a reduced pressure atmosphere, The adhesive tape can be applied between the surface of the substrate and the adhesive tape adsorption surface of the adsorption table, and a load that presses the substrate with an application roller is not applied, so that the substrate is not damaged.

  In addition, since a pressing ring that can be raised and lowered is provided on the outer peripheral portion of the suction table, the outer peripheral edge exposed from the suction table of the adhesive tape when the adhesive tape is cut larger than the outer diameter of the suction table is reduced in pressure. The substrate can be pressed down and the adhesive tape can be adhered to the substrate with good adhesion. Therefore, the polishing liquid and the etching liquid do not enter from the outer peripheral portion of the adhesive tape and contaminate the substrate during the back surface grinding.

  Further, when cutting the adhesive tape, the adhesive tape can be cut without bringing the cutter into contact with the suction table and the attachment table, so that the life of the cutter is improved and the suction table and the attachment table are worn. There is nothing.

  According to the second aspect of the present invention, the adhesive tape can be formed to have substantially the same diameter as the outer diameter of the suction table or smaller than the outer diameter without changing the diameter of the circular hole of the suction table or the pasting table. Therefore, it is not necessary to prepare a plurality of types of pasting tables and suction tables, and it is possible to reduce the labor and cost of table replacement.

  According to the invention of claim 3, when the back surface of the substrate is ground, the adhesive tape that protrudes from the substrate is not caught and damaged, and the adhesive tape that protrudes from the substrate is peeled off. The etching solution does not enter from the outer peripheral portion of the adhesive tape to contaminate the substrate.

These are the whole top views of the adhesive tape sticking apparatus to the board | substrate of this invention. FIG. 2 is a longitudinal front view in the AA direction of FIG. 1. FIG. 2 is a longitudinal side view in the BB direction of FIG. 1. FIG. 2 is a left side view in which a part of the upper chamber portion of FIG. 1 is cut away. FIG. 5 is a plan view in which a part of the upper chamber portion of FIG. 4 is cut away. FIG. 6 is a cross-sectional arrow view in the CC direction of FIG. 5. These are explanatory drawings of the operation | movement which affixes an adhesive tape on an affixing table with the affixing apparatus of this invention. (A) And (b) is explanatory drawing of the operation | movement which affixes an adhesive tape on a board | substrate with the affixing apparatus of this invention. (C) is explanatory drawing of the operation | movement which affixes an adhesive tape on a board | substrate with the affixing apparatus of this invention. (D) And (e) is explanatory drawing of the operation | movement which affixes an adhesive tape on a board | substrate with the affixing apparatus of this invention. (F) And (g) is explanatory drawing of the operation | movement which affixes an adhesive tape on a board | substrate with the affixing apparatus of this invention. (A) And (b) is explanatory drawing of the operation | movement which affixes an adhesive tape on a board | substrate with the affixing apparatus of this invention. (C) is explanatory drawing of the operation | movement which affixes an adhesive tape on a board | substrate with the affixing apparatus of this invention. (A) And (b) is explanatory drawing of the operation | movement which affixes the adhesive tape in another embodiment of this invention on a board | substrate. (A) And (b) is explanatory drawing of the operation | movement which affixes the adhesive tape in another embodiment of this invention on a board | substrate. These are the top views concerning one Embodiment of the board | substrate which affixed the adhesive tape with the affixing apparatus of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a plan view showing the overall structure of an apparatus for attaching an adhesive tape to a substrate, FIG. 2 is a longitudinal front view in the direction of AA in FIG. 1, and FIG. 3 is a longitudinal side view in the direction of BB in FIG. is there.

  1 to 3, the apparatus for attaching an adhesive tape to a substrate takes out the wafer W from the substrate supply / storage unit a, the positioning unit b, and the substrate supply / storage unit a one by one and transports them to the positioning unit b. A substrate transport mechanism c for performing the above operation, an adhesive tape attaching portion d for receiving and supporting the wafer W positioned by the positioning portion b, and a substrate transport for transferring the wafer W on the positioning portion b to the adhesive tape attaching portion d. Adjacent to the mechanism e, an adhesive tape cutting part f that is located adjacent to the adhesive tape attaching part d and cuts the adhesive tape T into a size and a shape corresponding to the outer shape of the wafer W, and the adhesive tape attaching part d It moves between the tape cutting parts f, adsorbs and holds the adhesive tape T cut by the adhesive tape cutting part f, transfers it to the adhesive tape attaching part d, and contacts the wafer W at the adhesive tape attaching part d. Made from the tape transport applying mechanism pasted tape T g or the like, and is configured by providing them on the machine frame 1.

  A case where a semiconductor wafer is used as an embodiment of the substrate used in the present invention will be described below.

  As shown in FIG. 16, the semiconductor wafer of the present embodiment (hereinafter referred to as wafer W) is formed in a shape having a notch 93 in a part of a disc-shaped outer periphery. Further, as the adhesive tape T adhered to the wafer W, a protective tape that protects the surface of the wafer W is used, and a tape that is formed in a roll shape that is slightly wider than the outer shape of the wafer W is used.

  The substrate supply / storage unit a includes a storage cassette 2 which is located on the machine base 1 and can be moved up and down by an appropriate mechanism (not shown). The storage cassette 2 has a structure in which a large number of wafers W are stacked and stored therein.

  The positioning part b is located close to the wafer supply / storage part a, and the substrate transfer mechanism c includes a transfer robot 3 that holds the wafer W by suction. The transfer robot 3 is configured to be able to move back and forth, up and down, and turn, and takes out wafers W of the substrate supply / storage unit a one by one and transfers them to the positioning unit b. Yes.

  The transfer robot 3 sucks and transfers the wafer W from the upper surface, and this suction is configured to suck the outer peripheral portion where the pattern of the wafer W is not formed. A non-contact hand that transfers the wafer W in a non-contact manner may be employed.

  The positioning part b, the adhesive tape attaching part d, and the adhesive tape cutting part f are arranged in a straight line at the central part on the machine base 1. The positioning part b holds the positioning table 4 provided so as to horizontally support the wafer W on the machine base 1 and the outer peripheral portion of the wafer W provided above the positioning table 4 by sandwiching it from both sides. A holding frame 95 that rotates the wafer W is also formed. A rotary motor 6 is provided below the positioning table 4.

  The rotation motor 6 is adapted to apply rotation to the positioning table 4. When the wafer W is placed on the positioning table 4, the wafer W is clamped from both sides of the outer periphery by the holding frame 95 and positioned. The notch 93 is detected by an appropriate positioning sensor 5 that rotates integrally with the table 4 and is provided in the vicinity of the positioning table 4. The wafer W from which the notch 93 is detected is positioned so that the notch 93 faces in a predetermined direction, and the wafer W is released from the holding state and placed on the positioning table 4.

  In addition, various means that can perform positioning without touching the inner peripheral part, such as rotating the hand while holding the wafer W with the non-contact hand, may be employed.

  The adhesive tape attaching part d includes a lower chamber 7 fixedly arranged on the machine base 1, a mounting table 8 provided in the lower chamber 7, and the like. The wafer W positioned by the positioning portion b is transferred onto the mounting table 8 and is placed on the mounting table 8 and sucked and held.

  The mounting table 8 is provided with a plurality of lifting guides 12 below, and a support plate 14 that supports the lifting guides 12 is connected to a lifting cylinder 13 fixed to the outside of the lower chamber 7. The table 8 is moved up and down by operating the elevating cylinder 13.

  Further, the mounting table 8 is formed in, for example, a porous porous shape, and can suck the back surface of the wafer W. The mounting table 8 communicates with the suction pipe 11, and the suction pipe 11 is connected to an appropriate vacuum pump (not shown), so that an adsorption force is generated independently of a vacuum chamber described later. Yes.

  The substrate transport mechanism e includes a suction hand 15 that sucks the wafer W, and the suction hand 15 is disposed along a guide rail 16 provided on the machine base 1 and positioned by the positioning portion b. Is supplied onto the mounting table 8 of the adhesive tape attaching part d. A non-contact hand that holds the wafer W in a non-contact manner may be used as the suction hand 15.

  The adhesive tape cutting part f is disposed so as to be located on the opposite side of the positioning part b with the adhesive tape attaching part d interposed therebetween. The adhesive tape cutting portion f is disposed between a pair of side plates 17 and 17 erected so as to face the machine base 1, and an upper end portion of the lower chamber 7 is arranged at the center between the side plates 17 and 17. Affixing table 18 is provided horizontally at substantially the same height. A cutter mechanism 19 as a cutting means is provided at the lower part of the affixing table 18 so as to freely move up and down and turn, and cut out the adhesive tape T affixed to the affixing table 18 inside the circular hole 27. ing.

  As shown in FIG. 3, a tape supply roll 20 for the adhesive tape T, a separator take-up roll 21, and a tape take-up roll 22 for taking up excess adhesive tape after cutting are provided between the side plates 17 and 17. . Further, between the side plates 17, 17, a pair of guide rollers 23 that further guides the adhesive tape T drawn from the tape supply roll 20 downward, and a pair that peels the separator Ta from the adhesive tape T below the guide rollers 23. The guide roller 24, the guide roller 25 located behind the upper surface of the affixing table 18 in the moving direction of the adhesive tape T, and a pair of guides for guiding the adhesive tape T to the upper tape take-up roll 22 A roller 26 is provided. The adhesive tape T from which the separator Ta has been peeled is held in a substantially horizontal state between the pair of guide rollers 24 and the guide roller 25 with its adhesive surface facing downward. Will approach.

  2, 3, and 7, the affixing table 18 is formed in a planar rectangular shape that is larger than the outer shape of the wafer W, and has a circular hole 27 that is slightly larger than the outer diameter of the wafer W at the center. ing. The circular hole 27 may be formed so as to have substantially the same diameter as the outer diameter of the wafer W or slightly larger than the outer diameter of the wafer W. The affixing table 18 is provided with a notch hole 69 on the upper surface thereof, and a support frame 49 and a support frame 50 provided in an upper chamber 44 of a tape transport and affixing mechanism g described later, and the affixing table. The upper surface of 18 does not interfere.

  Affixing rollers 28 are provided above the upper surface of the affixing table 18. The affixing roller 28 is positioned above the adhesive tape T between the pair of guide rollers 24 and the guide roller 25, and can move horizontally along the rail 36. Further, a peeling roller 29 located below the adhesive tape T is disposed along the rail 36 so as to be horizontally movable.

  As shown in FIGS. 2 and 3, the cutter mechanism 19 includes a rotating shaft 94 erected coaxially with the circular hole 27 on the machine base 1, a motor 34 that rotates the rotating shaft 94, and the motor 34. A support plate 30 rotatably attached to the slider, a slider 35 movably fitted to a radial rail 31 on the support plate 30, and a movable base 32 provided on the slider 35 and fixed at an appropriate position. The movable table 32 includes a circumferential cutter 33 that can be moved up and down by a cylinder or the like.

  When the circumferential cutter 33 rises, the portion located in the circular hole 27 of the adhesive tape T adhered on the attaching table 18 is broken, and the adhesive tape T is cut out into a circle by turning by the start of the motor 34. It has become. Further, the circumferential cutter 33 has a movable radius at the ascending position so that the adhesive tape T is cut out in a range slightly larger than an outer diameter of a suction table 45 described later and slightly smaller than the outer diameter. The table 32 is adjustable.

  As for the notch 93 of the wafer W, when the adhesive tape T covers the notch 93, the adhesive tape T by the circumferential cutter 33 is formed by an appropriate cutter mechanism (not shown) (for example, punching with a V-shaped cutter). It is only necessary to form a cut in the shape of the notch 93 before cutting out. Further, when an orientation flat is formed on the wafer W, an orientation flat cutter is provided as appropriate, and the orientation tape is cut into the orientation tape T.

  The affixing roller 28 is pivotally supported by a bearing member 37 provided between the opposing surfaces of the side plates 17 and 17. The bearing member 37 is horizontally movable by an appropriate drive source (not shown) along two horizontal rails 36 and 36 laid on both side plates 17 and 17. Accordingly, the adhesive roller T is pressed and pasted onto the pasting table 18 by the pasting roller 28 reciprocating.

  The peeling roller 29 is pivotally supported by a bearing member 38 provided between the opposing surfaces of the side plates 17 and 17 and is located on the lower surface side of the adhesive tape T. The bearing member 38 is horizontally movable along the rails 36 and 36 by an appropriate driving source (not shown). Further, the bearing member 38 reciprocates between the adhesive tape T and the affixing table 18, thereby peeling off the surplus adhesive tape T after being cut out by the circumferential cutter 33 from the upper surface of the affixing table 18. It is like that.

  Support frames 40, 40 are horizontally provided on opposite surfaces of the side plates 17, 17, and rails 41, 41 are laid along the support frames 40, 40. Further, sliders 68 and 68 are slidably fitted to the rails 41 and 41 on both sides, and a moving frame 42 is provided between the sliders 68 and 68. Accordingly, the tape transport and attachment mechanism g is movable between the position immediately above the adhesive tape attaching portion d and the adhesive tape cutting portion f by an appropriate driving means such as a motor (not shown) by the moving frame 42.

  Further, an upper chamber 44 having an open lower surface is attached to the lower portion of the moving frame 42 via an elevating cylinder 43 so as to be movable up and down. A suction table 45 is provided in the upper chamber 44.

  The suction table 45 includes a circular table frame 46 and a porous porous body 10 that is fitted into the table frame 46. The suction table 45 is formed so that the outer diameter is substantially the same as or slightly smaller than the outer diameter of the wafer W. Further, a support plate 47 is fixed on the table frame 46, and one end thereof is provided with a spring 48 for biasing the suction table 45 so that the suction table 45 is always inclined upward, and the support frame 50 is directed downward at the other end. It is extended. The support frame 50 is pivotally supported via a shaft 51 on a support frame 49 suspended inside the upper chamber 44 as shown in FIG.

  A rail 52 is laid along the upper surface of the support plate 47, and a swing roller 53 that can roll on the rail 52 is provided. The swing roller 53 is pivotally supported by a support frame 55, and the support frame 55 is horizontally movable by an appropriate mechanism along a rail 54 laid on the inner surface of the upper chamber 44.

  When the swing roller 53 moves horizontally from the lower end side of the suction table 45 inclined upward to the upper end side, the suction table 45 swings about the shaft 51 as a fulcrum. ing. The shaft 51 holds the adhesive tape T holding surface of the suction table 45 so that a horizontal displacement force is not generated on the adhesive tape T or the wafer W when the adhesive tape T is swung and attached. It is preferable to set so that the lower end of the slope becomes a fulcrum. By doing in this way, the surface of the wafer W and the holding surface of the adhesive tape T can be precisely adhered to each other.

  The suction table 45 is formed such that the porous body 10 is fitted and held in a table frame 46, and a suction pipe 66 connected to a vacuum pump (not shown) is connected to the porous body 10. The suction table 45 generates a suction force on the table surface of the suction table 45 through the suction pipe 66. Therefore, the suction force is generated independently of the vacuum pressure in the vacuum chamber described later.

  The suction table 45 is formed in a circular shape having a slightly smaller diameter than the outer diameter of the wafer W. When the upper chamber 44 is lowered directly above the adhesive tape cutting portion f, the suction table 45 in a horizontal posture is The circular hole 27 and the coaxial core are arranged. And the said adsorption | suction table 45 overlaps the part located on the circular hole 27 of the said adhesive tape T, and adsorb | sucks the said adhesive tape T from the non-adhesive surface side.

  Further, when the upper chamber 44 is lowered just above the lower chamber 7 of the adhesive tape attaching part d, the adhesive tape T sucked and held by the suction table 45 is placed on the wafer W held on the mounting table 8. Then, the lower edge of the upper chamber 44 overlaps with the upper edge of the lower chamber 7, and the inside of both the chambers 7 and 44 forms a sealed chamber. Then, the periphery of the wafer W and the adhesive tape T is brought into a reduced pressure atmosphere by suction from the vacuum adapter 58 connected to the vacuum pump.

  The suction table 45 is formed in a disk shape having a diameter substantially the same as the outer diameter of the wafer W or slightly smaller than the outer diameter of the wafer W, whereas the circular hole 27 of the attaching table 18 is The diameter is a little larger than that. Therefore, an annular gap is formed between the inner periphery of the circular hole 27 and the outer periphery of the suction table 45 positioned with the adhesive tape T interposed therebetween.

  The suction table 45 is formed as a porous body 10 using, for example, porous ceramics, and the suction table 45 sucks and holds the adhesive tape T over the entire surface thereof.

  In addition, an outer peripheral ring 63 is provided on the outer periphery of the suction table 45 so as to be slidable with the suction table 45. As shown in FIGS. 4 to 6, the outer peripheral ring 63 has support frames 64 erected at the four upper portions thereof.

  The support frame 64 is slidably provided via fixing pins 65 and guides 72 erected at four notches provided in the table frame body 46 and is urged upward by a spring 73. Yes.

  Further, since the outer peripheral ring 63 is fastened to the support frame 64, it is biased upward by a spring 73 together with the support frame 64 in an initial state, and is positioned at an upper position, and is lowered by pressing of the support frame 64. Along with this, the support frame 64 is lowered integrally. Accordingly, the adhesive tape T protruding from the outer periphery of the suction table 45 can be pressed.

  A pressing pin 62 as a pressing member that presses down the support frame 64 is provided immediately above the support frame 64 fixed to the outer peripheral ring 63. The pressing pin 62 is provided at a position corresponding to each support frame 64 on the lower surface of the two support plates 61, 61 suspended in the upper chamber 44 so as to be vertically movable.

  The support plates 61 and 61 are fixed to the lower ends of the guide shafts 60 and 60 of the two guides 57 and 57 provided on the outer upper portion of the upper chamber 44, and the upper ends of the guide shafts 60 and 60 are It is connected to a support plate 59 provided horizontally above the upper chamber 44. The support plate 59 is provided so as to be movable up and down by the action of a cylinder 56 fixed on the outer upper side of the upper chamber 44. The vertical movement of the support plate 59 causes the pressing pin 62 to move up and down to move the pressing ring. 63 is pushed down. In this embodiment, the pressing pin 62 is used as the pressing member. However, as long as the pressing ring 63 can be moved up and down, the pressing pin 63 can be changed as appropriate, for example, by directly moving the pressing ring 63 up and down.

  The above is the configuration of the apparatus for attaching an adhesive tape to a substrate according to the present invention. Next, an embodiment of an attaching operation for attaching an adhesive tape T to a wafer W will be described with reference to FIGS. .

  2 and 3 show the initial state, the tape transporting and pasting portion g stands in a raised position immediately above the adhesive tape cutting portion f, and the suction table 45 in the upper chamber 44 is held in an inclined posture. In the cutter mechanism 19 of the adhesive tape cutting part f, the circumferential cutter 33 is waiting at the lowered position. Further, the separator Ta is peeled off in the middle of the adhesive tape T pulled out from the tape supply roll 20 and is taken up by the separator take-up roll 21. The adhesive tape T from which the separator Ta has been peeled approaches the upper surface of the affixing table 18 between the guide rollers 24 and 25 in a predetermined stretch state substantially horizontally with the adhesive surface facing downward. Then, the affixing roller 28 reciprocates as indicated by the arrows in FIG. 3, and the adhesive tape T is adhered to the upper surface of the affixing table 18 as shown in FIG. At this time, the peeling roller 29 is located behind the adhesive tape T on the collection side.

  In this state, the wafers W in the wafer supply / storage unit a are taken out one by one by the substrate transfer mechanism c, transferred to the positioning unit b, and positioned. The wafer W positioned by the positioning unit b is supplied onto the mounting table 8 of the adhesive tape attaching unit d by the substrate transport mechanism e as shown in FIG. 8A, and the mounting table 8 is positioned and mounted. The placed wafer W is sucked and held.

  In parallel with the supply of the wafer W onto the mounting table 8, the swing roller 53 in the upper chamber 44 moves to bring the suction table 45 into a horizontal posture. Then, the upper chamber 44 is lowered and the suction table 45 is superimposed on the adhesive tape T affixed on the affixing table 18, and the non-adhesive surface of the adhesive tape T is adsorbed on its lower surface.

  At this time, as shown in FIG. 12A, the suction table 45 sucks and holds the adhesive tape T on the affixing table 18 and lowers the pressing pin 62, thereby pushing down the pressing ring 63. . The pressing ring 63 presses the vicinity of the outer edge of the circular hole 27 of the adhesive tape T attached on the attaching table 18, and the adhesive tape T is placed between the pressing ring 63 and the attaching table 18. Hold it.

  Next, as shown in FIG. 12B, the suction table 45 is raised by a predetermined amount. When the suction table 45 is raised, the suction on the outer periphery of the suction table 45 is partially released, and the adhesive tape T is inclined between the suction portion of the adhesive tape T and the pressing edge of the pressing ring 63. The raising amount of the suction table 45 can be appropriately changed according to the outer diameter of the adhesive tape T described later.

  Subsequently, the circumferential cutter 33 rises, cuts the inclined portion of the adhesive tape T, and the circumferential cutter 33 turns to cut the adhesive tape T in the circumferential direction. At this time, the operating position of the circumferential cutter 33 can be changed by appropriately moving the circumferential cutter 33 according to the outer diameter to be cut. The rotational radius of the circumferential cutter 33 can be set smaller than the inner diameter of the circular hole 27, and is slightly larger than the outer diameter from a range slightly smaller than the outer diameter of the suction table 45. The adhesive tape T can be cut within a certain range. Therefore, the adhesive tape T can be cut to be approximately the same diameter as the outer diameter of the wafer W or slightly smaller. If the diameter is smaller than the inner diameter of the circular hole 27, the adhesive tape T can be cut larger than the outer diameter of the wafer W.

  Since the circumferential cutter 33 cuts the portion where the adhesive tape T is inclined, the circumferential cutter 33 does not contact the suction table 45, and the circumferential cutter 33 and the suction table 45 are moved. There is no damage.

  As shown in FIG. 13C, the pressing of the pressing pin 62 is released, the pressing ring 63 is lifted by the bias of the spring 73, and the suction table 45 is lifted while holding the cut adhesive tape T.

  Next, as shown in FIG. 8B, the circumferential cutter 33 returns to the lowered position, the upper chamber 44 is raised, and the mounting table 8 is lowered at the adhesive tape attaching portion d.

  Next, as shown in FIG. 9C, the upper chamber 44 moves onto the lower chamber 7, and during this movement, the swing roller 53 moves to the shaft 51 side and sucks the cut adhesive tape T. The held suction table 45 is inclined. In this state, the upper chamber 44 descends and overlaps the lower chamber 7, and the chambers 7 and 44 are sealed to form a vacuum chamber. When the vacuum chamber is formed, the inside of the vacuum chamber is brought into a reduced pressure atmosphere through the vacuum adapter 58 by an appropriate vacuum pump (not shown). At this time, the inclined lower end portion of the adhesive tape T faces the bonding start end portion of the wafer W.

  Next, in the vacuum chamber in a reduced pressure state as shown in FIG. 10 (d), the mounting table 8 is raised, and the adhesive tape T held on the suction table 45 is moved toward the inclined descending end side. The adhesion start end of the wafer W is brought into contact.

  Next, as shown in FIG. 10E, the suction table 45 swings in a horizontal posture as the swing roller 53 moves, and the adhesive tape T held by suction on the lower surface of the suction table 45 has an adhesive surface. Is pressure-applied to the upper surface of the wafer W. In addition, since there is a difference between the vacuum pressure in which the chamber is evacuated and the suction pressure that applies the suction action to the placement table 8 and the suction table 44, even if the chamber is evacuated, the placement table 8 The holding of the wafer W and the suction of the adhesive tape T of the suction table 44 can be maintained.

  When the attachment of the adhesive tape T to the wafer W in the vacuum chamber is completed, the atmosphere is introduced into the vacuum chamber via the vacuum adapter 58, and the inside of the vacuum chamber is returned to atmospheric pressure, although not shown.

  Next, as shown in FIG. 11 (f), the upper chamber 44 is raised and the pressing of the support frame 64 by the pressing pin 62 is released, and the pressing ring 63 is raised by the biasing force of the spring 73. ), The swing roller 53 is horizontally moved to the shaft 51 side to bring the suction table 45 into the initial state of the inclined state, and the mounting table 8 is lowered and returned to the initial state.

  The process of attaching the adhesive tape T to the wafer W is performed in an atmosphere of reduced pressure (for example, 250 pa), and after the suction table 45 is stacked on the wafer W in an inclined state, the suction table 45 is placed in a horizontal posture. The air between the wafer W and the adhesive tape T is pushed out and can be reliably discharged. Therefore, no bubbles are generated between the wafer W and the bonding surface of the adhesive tape T, and the adhesive tape T is sucked and held by the suction table 45 in a stretched state. There is no wrinkle when attaching.

  In the adhesive tape cutting portion f, when the cutting of the adhesive tape T by the circumferential cutter 33 is completed, the peeling roller 29 moves toward the adhesive tape T starting side as shown in FIG. The excess part of the removed adhesive tape T is peeled off from the upper surface of the affixing table 18. Thereafter, the peeling roller 29 returns to the initial position, and the tape collecting roll 22 rotates to wind up the adhesive tape T by a predetermined length, so that a new part of the adhesive tape T is attached to the affixing table. It is drawn out to the upper surface of 18.

  As described above, when the bonding of the adhesive tape T to the wafer W is completed, the upper chamber 44 rises and returns to the position immediately above the adhesive tape cutting portion f, and the adhesive tape T is placed on the mounting table 8 described above. Remains on the wafer W. Thereafter, the placement table 8 is lifted to remove the suction, and the wafer W on which the adhesive tape T has been attached is transferred from the placement table 8 to the storage cassette by the transfer robot 3 of the substrate transfer mechanism c. 2, each part repeats the above operation.

  The above is the description of the embodiment relating to the attachment of the adhesive tape T to the wafer W when the adhesive tape T is cut substantially the same diameter as the outer diameter of the suction table 45 or smaller than the outer diameter. Another embodiment in the case where the adhesive tape T is cut larger than the outer diameter of the suction table 45 will be described below.

  The circumferential cutter 33 is positioned slightly outside the outer periphery of the suction table 45 as shown in FIG. The position of the circumferential cutter 33 can be changed according to the size of the adhesive tape T to be attached to the wafer W as appropriate.

  In the present embodiment, the pressing ring 63 is located at the raised position. Then, the suction table 45 descends to the attachment surface of the adhesive tape T of the attachment table 18 and adsorbs and holds the non-adhesive surface side of the adhesive tape T.

  Subsequently, as shown in FIG. 14B, the circumferential cutter 33 is lifted to cut the adhesive tape T outside the suction table 45, and then the circumferential cutter 33 is swung to The adhesive tape T is cut out into a circle.

  At this time, the circumferential cutter 33 cuts the adhesive tape T at a gap portion between the suction table 45 and the attachment table 18 so as not to damage the suction table 45 and the attachment table 18. Accordingly, the adhesive tape T is exposed slightly (for example, about 0.5 mm) from the outer periphery of the suction table 45. Since the cutter 33 has a thickness, the exposure amount is exposed to about 0.2 mm even if the cutter 33 is cut in close contact with the suction table 45. Further, since the cut-out adhesive tape T is sucked and held on the lower surface of the suction table 45, it does not fall off.

  The cut adhesive tape T is formed in a circular shape having the same diameter as the outer diameter of the wafer W or a slightly smaller diameter.

  Thereafter, as in the first embodiment, the suction table 45 sucks and holds the cut-out adhesive tape T and conveys the adhesive tape T onto the wafer W held on the mounting table 8. .

  The suction table 45 is lowered integrally with the upper chamber 44, overlaps with the lower chamber 7 to form a vacuum chamber, and the inside of the vacuum chamber is decompressed (see FIG. 9C). Subsequently, as shown in FIG. 15A, when the mounting table 8 is raised, the wafer W is attached to the inclined lower end portion of the adhesive tape T held on the suction table 45. Subsequently, the adhesive tape T is attached to the wafer W as the suction table 45 swings and becomes horizontal.

  During the attaching operation, the adhesive tape T that protrudes from the suction table 45 is not sufficiently pressed, so that the adhesive tape T may not adhere to the wafer W in some cases. In addition, since it is under a reduced pressure atmosphere, even if the protruding portion of the adhesive tape T from the suction table 45 comes into contact with the wafer W, no bubbles are generated.

  Next, as shown in FIG. 15B, the pressing ring 63 is pressed down by the pressing pin 62 in a state where the suction table 45 is horizontal, and the adhesive tape T protruding from the suction table 45 is pressed against the wafer W for bonding. Let At this time, the exposed portion of the adhesive tape T is pressed against the wafer in a reduced-pressure atmosphere, so that the outer peripheral portion of the adhesive tape T can be adhered with good adhesion without generating wrinkles or bubbles.

  Next, as in the first embodiment, as shown in FIG. 10E, after the adhesive tape T is attached to the wafer W, the atmosphere is introduced and the adhesive tape T is further pressed against the wafer W by the differential pressure. As a result, the adhesive tape T is brought into close contact with the wafer W and bonded.

  As described above, since the outer peripheral portion of the adhesive tape T is pressed and adhered with good pressure by the pressing ring 63 in a reduced pressure atmosphere, the outer peripheral edge of the adhesive tape T is peeled off when grinding the back surface of the wafer W. In addition, if the adhesive tape T is attached so that the etching solution does not enter the inner side of the outer diameter of the wafer W, the adhesive tape T is not caught during grinding and the wafer W is not damaged.

  In the embodiment of the present invention, a protective tape is used for the adhesive tape T, but various types of adhesive tapes (such as a die bond tape and a dry film resist) can be used within the scope of the present invention. In addition, when an adhesive tape that requires heating is used, a heater or the like may be appropriately installed on the mounting table or the like.

  In the embodiment of the present invention, the pressing pin is used as the pressing member of the pressing ring, but various types can be used as long as the pressing ring can be pressed down. Also, various mechanisms that enable the pressing ring to be raised and lowered, such as integrally forming the pressing ring and the pressing member, can be employed.

  As the substrate, various substrates such as a flat wafer, a bumpy wafer with bumps and the like formed thereon can be used.

  Further, the degree of decompression of the vacuum chamber and the outer diameter of the adhesive tape T to be cut can be appropriately changed according to the type of the substrate W and the adhesive tape T to be attached.

W substrate (wafer)
T Adhesive tape (protective tape)
P Circuit pattern a Substrate supply / storage unit b Positioning unit c Substrate transport mechanism d Adhesive tape pasting unit e Substrate transport mechanism f Tape cutting unit g Tape transport pasting mechanism 1 Machine stand 2 Storage cassette 3 Transport robot 4 Holding table 5 Alignment Sensor 6 Rotating motor 7 Lower chamber 8 Mounting table 10 Porous body 11 Suction pipe 12 Lifting guide 13 Lifting cylinder 14 Support plate 15 Transfer robot 16 Guide rail 17 Side plate 18 Attaching table 19 Cutting mechanism 20 Tape supply roll 21 Separator take-up roll 22 Tape take-up roll 23 Guide roller 24 Peeling roller 25 Guide roller 26 Guide roller 27 Circular hole 28 Attaching roller 29 Peeling roller 30 Support plate 31 Rail 32 Movable base 33 Circumferential cutter 34 Motor 35 Slider 36 Rail 37 Bearing member 38 Bearing member 40 Support frame 41 Rail 42 Moving frame 43 Lifting cylinder 44 Upper chamber 45 Suction table 46 Frame body 47 Fixing plate 48 Spring 49 Support frame 50 Support frame 51 Axis 52 Rail 53 Swing roller 54 Rail 55 Support frame 56 Cylinder 57 Guide 58 Vacuum Adapter 59 Elevating Plate 60 Guide Shaft 61 Support Plate 62 Pressing Pin (Pressing Member)
63 Press ring 64 Fixed frame 65 Fixed pin 66 Suction pipe 68 Slider 69 Notch hole 70 Bolt 72 Guide 80 Upper chamber 81 Press roller 83 Rail 84 Adsorption table 85 Tape attachment transport mechanism 86 Adhesion table 87 Circular hole 88 Circumferential cutter 89 Vacuum adapter 90 Shaft 91 Outer peripheral rib 92 Metal film 93 Notch 94 Rotating shaft 95 Holding frame

Claims (4)

Adhesive tape attaching part having a mounting table for holding the substrate, adhesive tape cutting part for cutting the adhesive tape into the shape of the substrate, and adhering by holding the adhesive tape cut by the adhesive tape cutting part In an adhesive tape attaching apparatus comprising a tape transporting and pasting mechanism for transporting to the tape attaching unit and attaching the adhesive tape on the substrate at the adhesive tape attaching unit,
The adhesive tape cutting section includes a circular hole having a diameter substantially the same as or slightly larger than the outer diameter of the substrate, and an adhesive table on which the adhesive tape is attached so as to cover the circular hole; A cutting means for cutting the adhesive tape attached to the attachment table and attached to the attachment table inside the circular hole, and an attachment means for attaching the adhesive tape on the attachment table;
The tape conveying and pasting mechanism is movable up and down and horizontally, adsorbs and holds the adhesive tape cut out by the cutting means so as to overlap with the non-adhesive surface of the adhesive tape when lowered onto the pasting table, and By lowering onto the tape application part, an adsorption table for adhering an adhesive tape on the substrate, and an outer periphery of the adsorption table so as to surround the adsorption table are provided to be movable up and down with respect to the adsorption table, A pressing ring that presses a portion protruding from the suction table of the adhesive tape sucked and held by the suction table, and
While adhering and holding the adhesive tape affixed on the affixing table from the non-adhesive surface, the adhesive tape is pressed by the pressing ring, and the adsorbing table is raised by a predetermined amount from the affixing surface of the affixing table. The adhesive tape generated by partially releasing the suction from the suction surface of the suction table and the gap between the suction table are cut by the cutting means to form an adhesive tape to be attached to the substrate. Adhesive tape affixing device to the substrate.   The rotation radius of the cutting means is configured to be set smaller than the inner diameter of the circular hole, and the range is slightly smaller than the outer diameter of the suction table to slightly larger than the outer diameter. The adhesive tape attaching apparatus according to claim 1, wherein the adhesive tape is configured to be cut.   3. The adhesive tape according to claim 1, wherein the adhesive tape is cut so as to be substantially the same diameter as the outer diameter of the substrate or inside the outer diameter of the substrate. 4. Adhesive tape affixing device to the substrate. Adhesive tape is affixed and held so as to cover the circular hole on a bonding table having a circular hole having the same diameter or slightly larger diameter as the outer diameter of the substrate. While adsorbing and holding the adhesive tape with the shape of the adsorbing table, while adsorbing and holding the adhesive tape cut by the adsorbing table by cutting the adhesive tape in the circumferential direction with a cutting means from below the circular hole, In the adhesive tape attaching method of transporting on the substrate and attaching the adhesive tape on the substrate,
A pressing ring that can move up and down with respect to the suction table and presses the adhesive tape so as to surround the outer periphery of the suction table is provided.
While pressing and holding the back surface of the adhesive tape with the suction table when cutting the adhesive tape, the pressing ring is lowered, and the adhesive tape is sandwiched between the outer peripheral portions of the circular holes of the attaching table, Raising the suction table by a predetermined amount causes the cutting means to act on the gap between the suction table and the adhesive tape formed when the suction of the suction table is released, and is slightly smaller than the outer diameter of the suction table. A method for attaching an adhesive tape to a substrate, characterized in that the adhesive tape is cut from a large diameter range to a slightly smaller diameter range than the outer diameter.

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