JP6933788B2 - Adhesive tape affixing device and affixing method to the substrate - Google Patents

Description

The present invention relates to an adhesive tape affixing apparatus and a method for affixing various adhesive tapes such as protective tapes to a substrate such as a semiconductor wafer.

Conventionally, in a general semiconductor manufacturing process, first, a protective tape is attached to a circuit forming surface of a semiconductor wafer (hereinafter referred to as a wafer), and then the back surface of the wafer is ground to make it thinner. After that, the wafer attached to the protective tape is mounted on the dicing frame via the dicing tape, and the protective tape is peeled off with a release tape or the like. Subsequently, the wafer is chipped by dicing.

The back surface grinding of the wafer is performed by attaching a protective tape to the circuit forming surface formed on the surface of the wafer, polishing the back surface of the wafer in order to reduce the size of the semiconductor chip, and performing an etching process or the like. ing.

At the time of the back surface grinding, the protective tape prevents damage to the circuit pattern and prevents the polishing liquid and the etching liquid from invading and contaminating the circuit pattern.

By the way, in attaching the protective tape to the wafer, if the cut edge of the protective tape after attachment is exposed from the outer peripheral edge of the wafer, the protective tape is easily peeled off from the cut edge portion, and the peeled protective tape is peeled off. There is a problem that the wafer is damaged when the back surface of the wafer is ground, or the circuit pattern of the wafer is contaminated by the polishing liquid or the etching liquid invading from the outer peripheral peripheral portion of the wafer.

Therefore, recently, there has been provided a device for attaching a protective tape that is substantially equal to the outer peripheral edge of the wafer or that the protective tape is attached so that the protective tape fits inside the outer peripheral edge of the wafer (for example, Patent Document 1).

The protective tape affixing device of Patent Document 1 includes a affixing table provided with circular holes substantially equal to or slightly smaller than the outer diameter of the wafer, and is wider than the circular holes on the affixing table. A protective tape can be attached. Subsequently, the protective tape is sucked from the non-adhesive surface side to the suction table of the tape transport and sticking mechanism at a position facing the circular hole, and the circumferential cutter acts from below the circular hole. , The protective tape is cut out along the suction table.

Next, a protective tape cut out having a diameter substantially equal to or smaller than the outer diameter of the wafer is conveyed onto the circuit forming surface of the wafer by the tape transfer attachment mechanism. The protective tape is attached to the wafer W by swinging the suction table in a reduced pressure atmosphere.

In the device for attaching the protective tape of Patent Document 1, when the protective tape is cut out by the circumferential cutter, the circumferential cutter is inserted along the outer shape of the suction table to cut out the protective tape. Therefore, in order to prevent the circumferential cutter and the suction table from being damaged or worn, the protective tape is cut out to be larger than the outer diameter of the suction table and slightly smaller than the circular hole.

Japanese Patent No. 3607143

By the way, the attachment of the protective tape to the wafer of Patent Document 1 is a very effective means for attaching the protective tape so as to fit inside the outer diameter of the wafer. However, in the protective tape affixing device of Patent Document 1, when the protective tape is cut out by the cutter as described above, the protective tape can be cut only larger than the outer diameter of the suction table.

For this reason, it is necessary to change the diameter of the circular hole of the sticking table for each outer diameter of the adhesive tape to be stuck to the wafer, or to change the outer diameter of the suction table that sucks the protective tape. It had to be prepared and the equipment had to be modified.

According to the present invention, when the adhesive tape is attached to the adhesive tape having an outer diameter substantially equal to or smaller than the outer diameter of the wafer, the outer peripheral portion is further peeled off without generating air bubbles or wrinkles on the adhesive tape attachment surface. To provide an adhesive tape affixing device that can be affixed without any need, and to provide an adhesive tape affixing device and a pasting method that can change the outer diameter of the adhesive tape to be attached without exchanging the suction table. The purpose.

Therefore, the invention of claim 1 is cut by an adhesive tape attaching portion provided with a mounting table for holding the substrate, an adhesive tape cutting portion that cuts the adhesive tape into the shape of the substrate, and the adhesive tape cutting portion. In an adhesive tape affixing device provided with a tape transfer affixing mechanism for adhering and holding an adhesive tape and transporting the adhesive tape to the adhesive tape affixing portion and affixing the adhesive tape onto the substrate at the adhesive tape affixing portion. ,
The adhesive tape cutting portion has a circular hole having a diameter substantially the same as the outer diameter of the substrate or a slightly larger diameter, and the adhesive tape is attached so as to cover the circular hole, and the adhesive tape is attached. It is formed by a cutting means for cutting out the adhesive tape arranged on the sticking table and sticking to the sticking table inside the circular hole, and a sticking means for sticking the adhesive tape on the sticking table.
The tape transport and sticking mechanism is movable up and down and horizontally, and when descending onto the sticking table, it overlaps with the non-adhesive surface of the adhesive tape and adsorbs and holds the adhesive tape cut out by the cutting means, and the adhesion is performed. By descending onto the tape sticking portion, a suction table for sticking the adhesive tape on the substrate and a suction table are provided on the outer periphery of the suction table so as to surround the suction table so as to be movable up and down with respect to the suction table. The suction table is provided with a pressing ring for pressing a portion of the adhesive tape that is sucked and held on the suction table and that protrudes from the suction table.
While sucking and holding the adhesive tape stuck on the sticking table from the non-adhesive surface, the adhesive tape is pressed by the pressing ring to raise the suction table by a predetermined amount from the sticking surface of the sticking table. A configuration is adopted in which the gap between the adhesive tape and the suction table generated by partially releasing the suction from the suction surface of the suction table is cut by the cutting means to form an adhesive tape to be attached to the substrate. This is an adhesive tape affixing device to the substrate.

Further, the invention of claim 2 is the invention of claim 1, wherein the turning radius of the cutting means can be set to a diameter smaller than the inner diameter of the circular hole, and is slightly smaller than the outer diameter of the suction table. It is an adhesive tape affixing device to a substrate configured so that the adhesive tape can be cut in a range from a small diameter to a slightly larger diameter than the outer diameter.

Further, the invention of claim 3 is the invention according to any one of claims 1 or 2, wherein the adhesive tape fits in substantially the same diameter as the outer diameter of the substrate or inside the outer diameter of the substrate. This is an adhesive tape affixing device to a substrate that adopts the structure of being cut as described above.

Further, in the invention of claim 4, an adhesive tape is attached and held so as to cover the circular hole on a pasting table having a circular hole having a diameter substantially the same as the outer diameter of the substrate or a slightly larger diameter. The adhesive tape is cut into the suction table by cutting the adhesive tape in the circumferential direction from below the circular hole while sucking and holding the adhesive tape from the back surface of the adhesive tape on a suction table having a substantially substrate shape. In the method of attaching the adhesive tape, which is carried on the substrate while adsorbing and holding the adhesive tape, and the adhesive tape is attached onto the substrate.
A pressing ring that can move up and down with respect to the suction table and presses the adhesive tape is provided so as to surround the outer circumference of the suction table.
When the adhesive tape is cut, the back surface of the adhesive tape is sucked and held by the suction table, the pressing ring is lowered, and the adhesive tape is sandwiched between the outer edges of the circular holes of the sticking table. By raising the suction table by a predetermined amount, the cutting means acts on the gap between the suction table and the adhesive tape formed by melting the suction of the suction table, so that the suction table is slightly larger than the outer diameter of the suction table. This is a method of attaching the adhesive tape to a substrate, which adopts a configuration in which the adhesive tape is cut in a range of a large diameter to a range slightly smaller than the outer diameter.

According to the first and fourth aspects of the invention, a pressing ring is provided on the outer peripheral portion of the suction table so as to surround the suction table, and the suction table is used to cut the adhesive tape. The suction table and the adhesive tape are formed by sucking and holding the back surface of the suction table, lowering the pressing ring to press the adhesive tape, and raising the suction table by a predetermined amount to dissolve the suction of the suction table. Since the circumferential cutter acts on the gap between the two, the adhesive tape can be cut to a diameter substantially the same as the outer diameter of the suction table or a diameter smaller than the outer diameter.

Further, since the adhesive tape is cut by providing a predetermined amount of height difference between the pressing surface of the pressing ring and the suction surface of the suction table, it is possible to prevent the cut edges of the adhesive tape from being reattached by the adhesive or the adhesive. It can be used and does not contaminate the substrate or equipment.

In addition, an adhesive tape cut to a size commensurate with the outer diameter of the substrate is held on the suction table, and the suction tape is shaken in a reduced pressure atmosphere and pressed against the substrate to be attached. Adhesive tape between the surface of the substrate and the adsorption surface of the suction table The adhesive tape can be attached to each other, and no load is applied to press the substrate with the attachment roller, so the substrate is not damaged.

Further, since a pressing ring that can be raised and lowered is provided on the outer peripheral portion of the suction table, the outer peripheral edge exposed from the suction table of the adhesive tape when the adhesive tape is cut larger than the outer diameter of the suction table is depressurized. It can be pressed against the substrate below, and the adhesive tape can be firmly attached to the substrate. Therefore, during backside grinding, the polishing liquid and the etching liquid do not invade from the outer peripheral portion of the adhesive tape and contaminate the substrate.

Further, when cutting the adhesive tape, the adhesive tape can be cut without contacting the cutter with the suction table and the sticking table, so that the life of the cutter is improved and the suction table and the sticking table are worn. There is no such thing.

According to the second aspect of the present invention, the adhesive tape can be formed to have substantially the same diameter as the outer diameter of the suction table or a diameter smaller than the outer diameter without changing the diameter of the circular hole of the suction table or the sticking table. Therefore, it is not necessary to prepare a plurality of types of pasting tables and suction tables, and the labor and cost of table replacement can be reduced.

According to the invention of claim 3, when the back surface of the substrate is ground, the adhesive tape protruding from the substrate is not caught and the substrate is not damaged, and the adhesive tape protruding from the substrate is peeled off to form a polishing liquid or the like. The etching solution does not invade from the outer peripheral portion of the adhesive tape and contaminate the substrate.

Is an overall plan view of the adhesive tape attaching device to the substrate of the present invention. Is a longitudinal front view of FIG. 1 in the AA direction. Is a vertical sectional side view of FIG. 1 in the BB direction. Is a left side view in which a part of the upper chamber portion of FIG. 1 is cut out. Is a plan view in which a part of the upper chamber portion of FIG. 4 is cut out. Is a cross-sectional arrow view in the CC direction of FIG. Is an explanatory diagram of an operation of sticking the adhesive tape to the sticking table by the sticking device of the present invention. (A) and (b) are explanatory views of the operation of sticking an adhesive tape to a substrate by the sticking apparatus of this invention. (C) is explanatory drawing of the operation of sticking an adhesive tape to a substrate by the sticking apparatus of this invention. (D) and (e) are explanatory views of the operation of sticking the adhesive tape to the substrate by the sticking apparatus of this invention. (F) and (g) are explanatory views of the operation of sticking the adhesive tape to the substrate by the sticking device of the present invention. (A) and (b) are explanatory views of the operation of sticking an adhesive tape to a substrate by the sticking apparatus of this invention. (C) is explanatory drawing of the operation of sticking an adhesive tape to a substrate by the sticking apparatus of this invention. (A) and (b) are explanatory views of the operation of attaching the adhesive tape to the substrate in another embodiment of the present invention. (A) and (b) are explanatory views of the operation of attaching the adhesive tape to the substrate in another embodiment of the present invention. Is a plan view according to an embodiment of a substrate to which an adhesive tape is attached by the attaching device of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 8.

1 is a plan view showing the overall structure of the adhesive tape attaching device to the substrate, FIG. 2 is a vertical sectional front view of FIG. 1 in the AA direction, and FIG. 3 is a vertical sectional side view of FIG. 1 in the BB direction. be.

In FIGS. 1 to 3, the adhesive tape attaching device to the substrate takes out the substrate supply / storage unit a, the positioning unit b, and the wafer W of the substrate supply / storage unit a one by one and conveys them to the positioning unit b. The substrate transfer mechanism c, the adhesive tape attaching portion d that receives and supports the wafer W positioned by the positioning portion b, and the substrate conveying portion d that transfers the wafer W on the positioning portion b to the adhesive tape attaching portion d. The mechanism e, the adhesive tape cutting portion f which is located adjacent to the adhesive tape attaching portion d and cuts the adhesive tape T into a size and shape suitable for the outer shape of the wafer W, and the adhesive tape attaching portion d are adhered to each other. It moves between the tape cutting portions f, attracts and holds the adhesive tape T cut by the adhesive tape cutting portion f, transfers it to the adhesive tape attaching portion d, and adheres it on the wafer W by the adhesive tape attaching portion d. It is composed of a tape transport sticking mechanism g or the like for sticking the tape T, and these are provided on the machine base 1.

A case where a semiconductor wafer is used as an embodiment of the substrate used in the present invention will be described below.

As shown in FIG. 16, the semiconductor wafer of the present embodiment (hereinafter referred to as wafer W) is formed in a shape having a notch 93 in a part of a disk-shaped outer circumference. Further, as the adhesive tape T to be attached to the wafer W, a protective tape that protects the surface of the wafer W is used, and a tape that is slightly wider than the outer shape of the wafer W and is formed in a roll shape is used.

The board supply / storage unit a is located on the machine base 1 and includes a storage cassette 2 that can be raised and lowered by an appropriate mechanism (not shown). The storage cassette 2 has a structure in which a large number of wafers W are stacked and stored inside.

The positioning unit b is located close to the wafer supply / storage unit a, and the substrate transfer mechanism c includes a transfer robot 3 that attracts and holds the wafer W. The transfer robot 3 is configured to be able to move back and forth, up and down, and swivel, and takes out the wafers W of the substrate supply / storage unit a one by one and conveys them to the positioning unit b. There is.

The transfer robot 3 is configured to suck the wafer W from the upper surface and deliver it, and the suction is configured to suck the outer peripheral portion where the pattern of the wafer W is not formed. A non-contact hand that conveys the wafer W in a non-contact manner may be adopted.

The positioning portion b, the adhesive tape attaching portion d, and the adhesive tape cutting portion f are provided side by side in a straight line at the central portion on the machine base 1. The positioning portion b sandwiches and holds a positioning table 4 provided on the machine base 1 so as to horizontally support the wafer W and an outer peripheral portion of the wafer W provided above the positioning table 4 from both sides. It is formed of a holding frame 95 for rotating the wafer W together with the wafer W. Further, a rotary motor 6 is provided below the positioning table 4.

The rotary motor 6 imparts rotation to the positioning table 4, and when the wafer W is placed on the positioning table 4, the holding frame 95 sandwiches the wafer W from both sides of the outer periphery for positioning. It rotates integrally with the table 4, and the notch 93 is detected by an appropriate positioning sensor 5 provided in the vicinity of the positioning table 4. The wafer W in which the notch 93 is detected is positioned so that the notch 93 faces in a predetermined direction, the wafer W is released from holding, and is placed on the positioning table 4.

In addition, various means may be adopted in which positioning can be performed without touching the inner peripheral portion, such as rotating the hand while holding the wafer W with a non-contact hand for positioning.

The adhesive tape affixing portion d includes a lower chamber 7 fixedly arranged on the machine base 1, a mounting table 8 provided in the lower chamber 7, and the like. The wafer W positioned by the positioning unit b is conveyed on the pre-described table 8 and placed on the pre-described table 8 to be attracted and held.

The above-mentioned table 8 is provided with a plurality of elevating guides 12 below, and a support plate 14 for supporting the elevating guides 12 is connected to an elevating cylinder 13 fixed to the outside of the lower chamber 7. The above-mentioned table 8 moves up and down by operating the elevating cylinder 13.

Further, the above-mentioned table 8 is formed in a porous porous shape, for example, so that the back surface of the wafer W can be adsorbed. The above-mentioned table 8 communicates with the suction pipe 11, and the suction pipe 11 is connected to an appropriate vacuum pump (not shown), so that a suction force is generated independently of the vacuum chamber described later. There is.

The substrate transport mechanism e includes a suction hand 15 that sucks the wafer W, and the suction hand 15 is arranged along a guide rail 16 provided on the machine base 1, and the wafer W is positioned by the positioning portion b. Is supplied onto the mounting table 8 of the adhesive tape pasting portion d. A non-contact hand that holds the wafer W in a non-contact manner may be used for the suction hand 15.

The adhesive tape cutting portion f is arranged so as to be located on the opposite side of the positioning portion b with the adhesive tape attaching portion d interposed therebetween. The adhesive tape cutting portion f is arranged between a pair of side plates 17 and 17 erected so as to face each other on the machine base 1, and is located at the center between the side plates 17 and 17 with the upper end portion of the lower chamber 7. A pasting table 18 having substantially the same height position is provided horizontally. A cutter mechanism 19 as a cutting means is provided at the lower part of the sticking table 18 so that the adhesive tape T can be freely moved up and down and swiveled and the adhesive tape T stuck to the sticking table 18 is cut out inside the circular hole 27. ing.

As shown in FIG. 3, a tape supply roll 20 for the adhesive tape T, a separator winding roll 21, and a tape winding roll 22 for winding the excess adhesive tape after cutting are provided between the plates 17 and 17 on both sides. .. Further, between the side plates 17 and 17, a guide roller 23 that further guides the adhesive tape T pulled out from the tape supply roll 20 downward, and a pair of peeling the separator Ta from the adhesive tape T below the guide roller 23. Guide roller 24, a guide roller 25 located behind the upper surface of the sticking table 18 in the moving direction of the adhesive tape T, and a pair of guides for guiding the adhesive tape T to the upper tape winding roll 22. A roller 26 is provided. Then, in the adhesive tape T from which the separator Ta has been peeled off, the portion between the pair of guide rollers 24 and the guide rollers 25 is held in a substantially horizontal state with the adhesive surface facing downward, and the upper surface of the sticking table 18 is held. Will approach.

The pasting table 18 is formed in a flat rectangular shape larger than the outer shape of the wafer W as shown in FIGS. 2, 3 and 7, and has a circular hole 27 at the center thereof, which is slightly larger than the outer diameter of the wafer W. ing. The circular hole 27 may be formed to have substantially the same diameter as the outer diameter of the wafer W or slightly larger than the outer diameter of the wafer W. Further, the sticking table 18 is provided with a notch hole 69 on the upper surface thereof, and the support frame 49 and the support frame 50 provided in the upper chamber 44 of the tape transport sticking mechanism g described later, and the sticking table. The upper surface of 18 does not interfere.

Further, a sticking roller 28 is provided above the upper surface of the sticking table 18. The sticking roller 28 is located above the adhesive tape T between the pair of guide rollers 24 and the guide rollers 25, and is horizontally movable along the rail 36. Further, a peeling roller 29 located below the adhesive tape T is arranged so as to be horizontally movable along the rail 36.

The cutter mechanism 19 includes a rotating shaft 94 erected on the machine base 1 in a coaxial center shape with a circular hole 27 as shown in FIGS. 2 and 3, a motor 34 for rotating the rotating shaft 94, and the motor 34. A support plate 30 rotatably attached to the support plate 30, a slider 35 movably fitted to a radial rail 31 on the support plate 30, and a movable base 32 provided on the slider 35 and capable of being fixed at an appropriate position. The movable base 32 is composed of a circumferential cutter 33 or the like that can be moved up and down by a cylinder or the like.

When the circumferential cutter 33 rises, it breaks through the portion of the adhesive tape T adhered on the sticking table 18 located in the circular hole 27, and the adhesive tape T is cut out in a circular shape by turning due to the activation of the motor 34. It has become. Further, the circumferential cutter 33 can move the turning radius at the ascending position so as to cut out the adhesive tape T from a range slightly larger than the outer diameter of the suction table 45, which will be described later, to a range slightly smaller than the outer diameter. It is adjustable by the table 32.

Regarding the notch 93 of the wafer W, when the adhesive tape T covers the notch 93, the adhesive tape T by the circumferential cutter 33 is provided by an appropriate cutter mechanism (for example, punching with a V-shaped cutter) (not shown). A notch may be formed in the shape of the notch 93 before the cutout. When the olifra is formed on the wafer W, a cutter for the olifra may be provided as appropriate to cut the adhesive tape T in the shape of the olifra.

The sticking roller 28 is pivotally supported by a bearing member 37 provided between the facing surfaces of the side plates 17 and 17. The bearing member 37 is horizontally movable by an appropriate drive source (not shown) along the two horizontal rails 36, 36 laid on the side plates 17, 17. Therefore, the sticking roller 28 reciprocates to press the adhesive tape T onto the sticking table 18 for sticking.

Further, the release roller 29 is pivotally supported by a bearing member 38 provided between the facing surfaces of the side plates 17 and 17, and is located on the lower surface side of the adhesive tape T. The bearing member 38 is horizontally movable along the rails 36 and 36 by an appropriate drive source (not shown). Further, the bearing member 38 reciprocates between the adhesive tape T and the sticking table 18 to peel off the surplus adhesive tape T cut out by the circumferential cutter 33 from the upper surface of the sticking table 18. It has become like.

Support frames 40, 40 are horizontally provided on the facing surfaces of the both side plates 17, 17, and rails 41, 41 are laid along the support frames 40, 40. Further, the sliders 68 and 68 are slidably fitted to the rails 41 and 41 on both sides, and a moving frame 42 is provided between the sliders 68 and 68. Therefore, the tape transport and sticking mechanism g is movable between the adhesive tape sticking portion d and the adhesive tape cutting portion f by an appropriate driving means such as a motor (not shown) by the moving frame 42.

Further, an upper chamber 44 having an open lower surface is attached to the lower portion of the moving frame 42 so as to be movable up and down via an elevating cylinder 43. Further, a suction table 45 is provided in the upper chamber 44.

The suction table 45 is composed of a circular table frame 46, a porous porous body 10 or the like internally fitted to the table frame 46, and the like. The suction table 45 is formed so that the outer diameter is substantially the same as the outer diameter of the wafer W or slightly smaller. Further, a support plate 47 is fixed on the table frame 46, a spring 48 for urging the suction table 45 to always tilt upward is provided at one end thereof, and the support frame 50 faces downward at the other end. Has been extended. Further, the support frame 50 is oscillatingly supported via a shaft 51 on a support frame 49 suspended inside the upper chamber 44 as shown in FIG.

Further, a rail 52 is laid along the upper surface of the support plate 47, and a swing roller 53 that can roll on the rail 52 is provided. The swing roller 53 is pivotally supported by a support frame 55, and the support frame 55 is horizontally movable by an appropriate mechanism along a rail 54 laid on the inner surface of the upper chamber 44.

When the swing roller 53 moves horizontally from the inclined lower end side to the inclined upper end side of the upwardly inclined suction table 45, the suction table 45 swings around the shaft 51 as a fulcrum. ing. The shaft 51 is attached to the adhesive tape T holding surface of the suction table 45 so as not to generate a force of displacement in the horizontal direction on the adhesive tape T or the wafer W when the adhesive tape T is swung and attached. It is preferable to set so that the lower end of the inclination of is a fulcrum. By doing so, the surface of the wafer W and the holding surface of the adhesive tape T can be precisely attached to each other.

The suction table 45 is formed by fitting and holding a porous body 10 in a table frame 46, and a suction pipe 66 connected to a vacuum pump (not shown) is connected to the porous body 10. The suction table 45 generates a suction force on the table surface of the suction table 45 through the suction pipe 66. Therefore, the suction force is generated independently of the vacuum pressure of the vacuum chamber described later.

Further, the suction table 45 is formed in a circular shape having a diameter slightly smaller than the outer diameter of the wafer W, and when the upper chamber 44 descends directly above the adhesive tape cutting portion f, the suction table 45 in a horizontal posture is moved. The arrangement is coaxial with the circular hole 27. Then, the suction table 45 overlaps the portion of the adhesive tape T located on the circular hole 27, and the adhesive tape T is sucked from the non-adhesive surface side.

Further, when the upper chamber 44 descends directly above the lower chamber 7 of the adhesive tape sticking portion d, the adhesive tape T sucked and held by the suction table 45 is held on the mounting table 8 on the wafer W. The lower edge of the upper chamber 44 overlaps the upper edge of the lower chamber 7, and the insides of both chambers 7 and 44 form a closed chamber. Then, suction from the vacuum adapter 58 that communicates with the vacuum pump creates a reduced pressure atmosphere around the wafer W and the adhesive tape T.

The suction table 45 is formed in a disk shape having substantially the same diameter as the outer diameter of the wafer W or slightly smaller than the outer diameter of the wafer W, whereas the circular hole 27 of the sticking table 18 has a circular hole 27. , The diameter is a little larger than that. Therefore, an annular gap is formed between the inner circumference of the circular hole 27 and the outer circumference of the suction table 45 located on the upper portion of the circular hole 27 with the adhesive tape T sandwiched between them.

The adsorption table 45 is formed as a porous body 10 using, for example, porous ceramics, and the adsorption table 45 is adapted to adsorb and hold the adhesive tape T on the entire surface thereof.

Further, an outer peripheral ring 63 is slidably provided on the outer peripheral portion of the suction table 45 with the suction table 45. As shown in FIGS. 4 to 6, the outer peripheral ring 63 has support frames 64 erected at four upper portions thereof.

The support frame 64 is slidably provided via fixing pins 65 and guides 72 erected in notches provided at four positions of the table frame body 46, and is urged upward by a spring 73. There is.

Further, since the outer peripheral ring 63 is fastened to the support frame 64, in the initial state, the outer peripheral ring 63 is urged upward by the spring 73 together with the support frame 64 and is located at the upper position, and is lowered by pressing the support frame 64. As a result, the support frame 64 is integrally lowered. Therefore, the adhesive tape T protruding from the outer periphery of the suction table 45 can be pressed.

Further, a pressing pin 62 as a pressing member for pushing down the support frame 64 is provided directly above the support frame 64 fixed to the outer peripheral ring 63. The pressing pins 62 are provided at positions corresponding to the respective support frames 64 on the lower surfaces of the two support plates 61 and 61 suspended so as to be vertically movable in the upper chamber 44.

The both support plates 61, 61 are fixed to the lower ends of the guide shafts 60, 60 of the two guides 57, 57 provided on the outer upper portion of the upper chamber 44, and the upper ends of the guide shafts 60, 60 are fixed to the lower ends of the guide shafts 60, 60. It is connected to a support plate 59 provided horizontally above the upper chamber 44. The support plate 59 is provided so as to be vertically movable by the action of a cylinder 56 fixed to the outside and upper side of the upper chamber 44, and the pressing pin 62 is moved up and down by the vertical movement of the support plate 59, and the pressing ring. 63 is designed to be pushed down. In this embodiment, the pressing pin 62 is used as the pressing member, but if the pressing ring 63 can be moved up and down, it can be changed as appropriate, for example, by directly moving the pressing ring 63 up and down.

The above is the configuration of the adhesive tape attaching device to the substrate of the present invention. Next, an embodiment of the attaching operation of attaching the adhesive tape T to the wafer W will be described with reference to FIGS. 8 to 15. ..

2 and 3 show an initial state, the tape transport and sticking portion g stands by in an ascending position directly above the adhesive tape cutting portion f, and the suction table 45 in the upper chamber 44 is held in an inclined posture. In the cutter mechanism 19 of the adhesive tape cutting portion f, the circumferential cutter 33 is waiting at the lowered position. Further, the adhesive tape T drawn out from the tape supply roll 20 is taken up by the separator take-up roll 21 after the separator Ta is peeled off in the middle. The adhesive tape T from which the separator Ta has been peeled approaches the upper surface of the sticking table 18 between the guide rollers 24 and 25 in a substantially horizontal and predetermined stretched state with the adhesive surface facing downward. Then, the sticking roller 28 reciprocates as shown by the arrow in FIG. 3, and the adhesive tape T is adhered to the upper surface of the sticking table 18 as shown in FIG. At this time, the release roller 29 is located behind the adhesive tape T on the collection side.

In this state, the wafers W of the wafer supply / storage unit a are taken out one by one by the substrate transfer mechanism c, transferred to the positioning unit b, and positioned. The wafer W positioned by the positioning portion b is supplied on the mounting table 8 of the adhesive tape sticking portion d by the substrate transport mechanism e as shown in FIG. 8A, and the mounting table 8 described above is positioned and mounted. The placed wafer W is sucked and held.

In parallel with the supply of the wafer W onto the above-mentioned table 8, the swing roller 53 in the upper chamber 44 moves and the suction table 45 is in a horizontal posture. Then, the upper chamber 44 is lowered, and the suction table 45 is placed on the adhesive tape T stuck on the sticking table 18, and the non-adhesive surface of the adhesive tape T is sucked on the lower surface thereof.

At this time, as shown in FIG. 12A, the suction table 45 sucks and holds the adhesive tape T on the sticking table 18 and lowers the pressing pin 62 to push down the pressing ring 63. .. The pressing ring 63 presses the vicinity of the outer edge of the circular hole 27 of the adhesive tape T attached on the sticking table 18, and the adhesive tape T is placed between the pressing ring 63 and the sticking table 18. Hold it.

Next, as shown in FIG. 12B, the suction table 45 rises by a predetermined amount. When the suction table 45 rises, the suction on the outer periphery of the suction table 45 is partially released, and the adhesive tape T is tilted between the suction portion of the adhesive tape T and the pressing edge of the pressing ring 63. The amount of increase of the suction table 45 can be appropriately changed according to the outer diameter of the adhesive tape T described later.

Subsequently, the circumferential cutter 33 rises to cut the inclined portion of the adhesive tape T, and the circumferential cutter 33 turns to cut the adhesive tape T in the circumferential direction. At this time, the action position of the circumferential cutter 33 can be changed by appropriately moving the circumferential cutter 33 according to the outer diameter to be cut. The radius of gyration of the circumferential cutter 33 can be set to a diameter smaller than the inner diameter of the circular hole 27, and the diameter is slightly larger than the outer diameter from a range slightly smaller than the outer diameter of the suction table 45. The adhesive tape T can be cut within a wide range. Therefore, the adhesive tape T can be cut to have a diameter substantially the same as the outer diameter of the wafer W or a slightly smaller diameter. If the diameter is smaller than the inner diameter of the circular hole 27, it is possible to cut the adhesive tape T larger than the outer diameter of the wafer W.

Since the circumferential cutter 33 cuts the portion where the adhesive tape T is in an inclined state, the circumferential cutter 33 does not come into contact with the suction table 45, and the circumferential cutter 33 and the suction table 45 are pressed. Will not be damaged.

As shown in FIG. 13C, the pressing of the pressing pin 62 is released, the pressing ring 63 is raised by the urging of the spring 73, and the suction table 45 is raised while holding the cut adhesive tape T.

Next, as shown in FIG. 8B, the circumferential cutter 33 returns to the descending position, the upper chamber 44 rises, and the above-mentioned table 8 descends at the adhesive tape affixing portion d.

Next, as shown in FIG. 9C, the upper chamber 44 moves onto the lower chamber 7, and during this movement, the swing roller 53 moves toward the shaft 51 and adsorbs the cut adhesive tape T. The holding suction table 45 is in an inclined posture. In this state, the upper chamber 44 descends and overlaps the lower chamber 7, and the insides of both chambers 7 and 44 are sealed to form a vacuum chamber. When the vacuum chamber is formed, the inside of the vacuum chamber is made into a reduced pressure atmosphere through the vacuum adapter 58 by an appropriate vacuum pump (not shown). At this time, the inclined lower end portion of the adhesive tape T faces the attachment start end portion of the wafer W.

Next, in the vacuum chamber in the depressurized state as shown in FIG. 10D, the above-mentioned table 8 is raised, and the adhesive tape T held on the suction table 45 is placed on the inclined descending end side of the adhesive tape T. The bonding start ends of the wafer W are brought into contact with each other.

Next, as shown in FIG. 10E, the suction table 45 swings in a horizontal position as the swing roller 53 moves, and the adhesive tape T sucked and held on the lower surface of the suction table 45 has an adhesive surface. Is pressure-bonded to the upper surface of the wafer W. Since there is a difference between the vacuum pressure in which the chamber is evacuated and the suction pressure for applying the suction action to the above-mentioned table 8 and the suction table 44, even if the inside of the chamber is evacuated, the above-mentioned table 8 is used. The holding of the wafer W and the suction of the adhesive tape T of the suction table 44 can be maintained.

When the adhesion of the adhesive tape T to the wafer W in the vacuum chamber is completed, the atmosphere is introduced into the vacuum chamber via the vacuum adapter 58 (not shown), and the inside of the vacuum chamber is returned to atmospheric pressure.

Next, as shown in FIG. 11 (f), the upper chamber 44 is raised, the pressing of the support frame 64 by the pressing pin 62 is released, and the pressing ring 63 is raised by the urging force of the spring 73. ), The swing roller 53 is horizontally moved toward the shaft 51 to bring the suction table 45 into the initial state of the tilted state, and the above-mentioned table 8 descends to return to the initial state.

The above-mentioned step of attaching the adhesive tape T to the wafer W is performed in an atmosphere of reduced pressure (for example, 250 pa), and after the suction table 45 is stacked on the wafer W in an inclined state, the suction table 45 is placed in a horizontal position. The air between the wafer W and the adhesive tape T can be pushed out and reliably discharged. Therefore, air bubbles are not generated between the wafer W and the bonding surface of the adhesive tape T, and the adhesive tape T is suction-held on the suction table 45 in a stretched state. No wrinkles occur when applying.

In the adhesive tape cutting portion f, when the cutting of the adhesive tape T by the circumferential cutter 33 is completed, the peeling roller 29 moves toward the sticking start side of the adhesive tape T and cuts as shown in FIG. The excess portion of the adhesive tape T that has been pulled out is peeled off from the upper surface of the sticking table 18. After that, the peeling roller 29 returns to the initial position, the tape collecting roll 22 rotates, and the adhesive tape T is wound up by a predetermined length, so that a new portion of the adhesive tape T becomes the sticking table. It is designed to be pulled out to the upper surface of 18.

As described above, when the adhesion of the adhesive tape T to the wafer W is completed, the upper chamber 44 rises and returns to directly above the adhesive tape cutting portion f, and the adhesive tape T is placed on the above-mentioned table 8. The wafer W to which is attached remains. After that, the pre-described table 8 is raised to release the adsorption, and the wafer W to which the adhesive tape T has been attached is subjected to the storage cassette from above the pre-described table 8 by the transfer robot 3 of the substrate transfer mechanism c. It is housed in 2 and each part repeats the above operation.

The above is a description of an embodiment relating to attachment of the adhesive tape T to the wafer W when the adhesive tape T is cut to have substantially the same diameter as the outer diameter of the suction table 45 or smaller than the outer diameter. Another embodiment in which the adhesive tape T is cut larger than the outer diameter of the suction table 45 will be described below.

As shown in FIG. 14A, the circumferential cutter 33 is positioned slightly outside the outer circumference of the suction table 45. The position of the circumferential cutter 33 can be appropriately changed according to the size of the adhesive tape T to be attached to the wafer W.

In the present embodiment, the pressing ring 63 is located in the raised position. Then, the suction table 45 descends to the sticking surface of the adhesive tape T of the sticking table 18, and sucks and holds the non-adhesive surface side of the adhesive tape T.

Subsequently, as shown in FIG. 14B, the circumferential cutter 33 rises to cut the adhesive tape T on the outside of the suction table 45, and then the circumferential cutter 33 swivels to form the above. The adhesive tape T is cut out in a circular shape.

At this time, the circumferential cutter 33 cuts the adhesive tape T at the gap between the suction table 45 and the sticking table 18 so as not to damage the suction table 45 and the sticking table 18. Therefore, the adhesive tape T is slightly exposed (for example, about 0.5 mm) from the outer circumference of the suction table 45. Since the cutter 33 has a large amount of exposure, about 0.2 mm is exposed even if the cutter 33 is brought into close contact with the suction table 45 for cutting. Further, since the cut-out adhesive tape T is sucked and held on the lower surface of the suction table 45, it does not fall off.

Further, the cut-out adhesive tape T is formed in a circular shape having substantially the same diameter as the outer diameter of the wafer W or a slightly smaller diameter.

After that, as in the first embodiment, the suction table 45 sucks and holds the cut-out adhesive tape T, and conveys the adhesive tape T onto the wafer W held on the mounting table 8. ..

The suction table 45 descends integrally with the upper chamber 44 and overlaps with the lower chamber 7 to form a vacuum chamber, so that the inside of the vacuum chamber is in a decompressed state (see FIG. 9C). Subsequently, as shown in FIG. 15A, the wafer W is attached to the inclined lower end portion of the adhesive tape T held on the suction table 45 by raising the pre-described table 8. Subsequently, the adhesive tape T is attached to the wafer W as the suction table 45 swings and becomes horizontal.

During the sticking operation, the adhesive tape T protruding from the suction table 45 may not be sufficiently pressed, so that the adhesive tape T may not adhere to the wafer W. Since the atmosphere is reduced, no bubbles are generated even if the portion of the adhesive tape T protruding from the suction table 45 comes into contact with the wafer W.

Next, as shown in FIG. 15B, the pressing ring 63 is pushed down by the pressing pin 62 in a state where the suction table 45 is horizontal, and the adhesive tape T protruding from the suction table 45 is pressed against the wafer W to adhere. Let me. At this time, since the adhesive tape T of the exposed portion is pressed against the wafer under a reduced pressure atmosphere, the outer peripheral portion of the adhesive tape T can be firmly attached without generating wrinkles or air bubbles.

Next, as in the first embodiment, as shown in FIG. 10E, after the adhesive tape T is attached to the wafer W, the atmosphere is introduced and the adhesive tape T is further pressed against the wafer W by the differential pressure. As a result, the adhesive tape T is brought into close contact with the wafer W and adhered.

As described above, since the outer peripheral portion of the adhesive tape T is pressed by the pressing ring 63 in a reduced pressure atmosphere and adhered well, the outer peripheral edge of the adhesive tape T is peeled off when the back surface of the wafer W is ground, and the polishing liquid or the polishing liquid or the like. If the adhesive tape T is attached so that the etching solution does not invade and the wafer W is fitted inside the outer diameter of the wafer W, the adhesive tape T is not caught during grinding and the wafer W is not damaged.

In the embodiment of the present invention, a protective tape is used for the adhesive tape T, but various adhesive tapes (die bond tape, dry film resist, etc.) can be used within the scope of the present invention. When using an adhesive tape that requires heating, a heater or the like may be appropriately installed on a mounting table or the like.

Further, in the embodiment of the present invention, although a pressing pin is used as the pressing member of the pressing ring, various types can be used as long as the pressing ring can be pressed and pushed down. Further, various mechanisms that enable the pressing ring to be raised and lowered, such as integrally forming the pressing ring and the pressing member, can be adopted.

Further, as the substrate, various substrates such as a flat wafer and a wafer having irregularities on which bumps and the like are formed can be used.

Further, the degree of decompression of the vacuum chamber and the outer diameter of the adhesive tape T to be cut can be appropriately changed according to the type of the substrate W to be attached and the adhesive tape T.

W substrate (wafer)
T Adhesive tape (protective tape)
P Circuit pattern a Board supply / storage part b Positioning part c Board transfer mechanism d Adhesive tape attachment part e Board transfer mechanism f Tape cutting part g Tape transfer attachment mechanism 1 Machine stand 2 Storage cassette 3 Transfer robot 4 Holding table 5 Alignment Sensor 6 Rotating motor 7 Lower chamber 8 Mounting table 10 Porous body 11 Suction pipe 12 Lifting guide 13 Lifting cylinder 14 Support plate 15 Transfer robot 16 Guide rail 17 Side plate 18 Sticking table 19 Cutting mechanism 20 Tape supply roll 21 Separator winding roll 22 Tape take-up roll 23 Guide roller 24 Peeling roller 25 Guide roller 26 Guide roller 27 Circular hole 28 Sticking roller 29 Peeling roller 30 Support plate 31 Rail 32 Movable base 33 Circumferential cutter 34 Motor 35 Slider 36 Rail 37 Bearing member 38 Bearing Member 40 Support frame 41 Rail 42 Moving frame 43 Lifting cylinder 44 Upper chamber 45 Suction table 46 Frame body 47 Fixing plate 48 Spring 49 Support frame 50 Support frame 51 Axis 52 Rail 53 Swing roller 54 Rail 55 Support frame 56 Cylinder 57 Guide 58 Vacuum Adapter 59 Lifting plate 60 Guide shaft 61 Support plate 62 Pressing pin (pressing member)
63 Press ring 64 Fix frame 65 Fix pin 66 Suction pipe 68 Slider 69 Notch hole 70 Bolt 72 Guide 80 Upper chamber 81 Press roller 83 Rail 84 Suction table 85 Tape sticking transport mechanism 86 Sticking table 87 Circular hole 88 Circumferential cutter 89 Vacuum Adapter 90 Shaft 91 Outer Rib 92 Metal Film 93 Notch 94 Rotating Shaft 95 Holding Frame

Claims (4)

The adhesive tape pasting portion provided with a mounting table for holding the substrate, the adhesive tape cutting portion for cutting the adhesive tape into the shape of the substrate, and the adhesive tape cut by the adhesive tape cutting portion are adsorbed and held to bond the adhesive tape. In an adhesive tape sticking device provided with a tape transport sticking mechanism for feeding the adhesive tape to the tape sticking portion and sticking the adhesive tape on the substrate at the adhesive tape sticking portion.
The adhesive tape cutting portion has a circular hole having a diameter substantially the same as the outer diameter of the substrate or a slightly larger diameter, and the adhesive tape is attached so as to cover the circular hole, and the adhesive tape is attached. It is formed by a cutting means for cutting out the adhesive tape arranged on the sticking table and sticking to the sticking table inside the circular hole, and a sticking means for sticking the adhesive tape on the sticking table.
The tape transport and sticking mechanism is movable up and down and horizontally, and when descending onto the sticking table, it overlaps with the non-adhesive surface of the adhesive tape and adsorbs and holds the adhesive tape cut out by the cutting means, and the adhesion is performed. By descending onto the tape sticking portion, a suction table for sticking the adhesive tape on the substrate and a suction table are provided on the outer periphery of the suction table so as to surround the suction table so as to be movable up and down with respect to the suction table. The suction table is provided with a pressing ring for pressing a portion of the adhesive tape that is sucked and held on the suction table and that protrudes from the suction table.
While sucking and holding the adhesive tape stuck on the sticking table from the non-adhesive surface, the adhesive tape is pressed by the pressing ring to raise the suction table by a predetermined amount from the sticking surface of the sticking table. The adhesive tape is formed by cutting the gap between the adhesive tape and the adsorption table, which is formed by partially releasing the adsorption from the adsorption surface of the adsorption table, by the cutting means to form an adhesive tape to be attached to the substrate. Adhesive tape affixing device to the substrate. The turning radius of the cutting means can be set to a diameter smaller than the inner diameter of the circular hole, and the diameter is slightly smaller than the outer diameter of the suction table to slightly larger than the outer diameter. The adhesive tape affixing device according to claim 1, wherein the adhesive tape is configured to be cuttable. The invention according to claim 1 or 2, wherein the adhesive tape is cut so as to have a diameter substantially the same as the outer diameter of the substrate or to be accommodated inside the outer diameter of the substrate. Adhesive tape affixing device to the substrate. An adhesive tape is attached and held so as to cover the circular holes on a pasting table having a circular hole having a diameter substantially the same as the outer diameter of the substrate or a slightly larger diameter, and the substrate is substantially formed from the back surface of the adhesive tape. While sucking and holding the adhesive tape on the suction table having a shape, the adhesive tape is cut in the circumferential direction by a cutting means from below the circular hole to suck and hold the adhesive tape cut on the suction table. In the adhesive tape sticking method of transporting on the substrate and sticking the adhesive tape on the substrate,
A pressing ring that can move up and down with respect to the suction table and presses the adhesive tape is provided so as to surround the outer circumference of the suction table.
When the adhesive tape is cut, the back surface of the adhesive tape is sucked and held by the suction table, the pressing ring is lowered, and the adhesive tape is sandwiched between the outer edges of the circular holes of the sticking table. By raising the suction table by a predetermined amount, the cutting means acts on the gap between the suction table and the adhesive tape formed by melting the suction of the suction table, so that the suction table is slightly larger than the outer diameter of the suction table. A method of attaching the adhesive tape to a substrate, which comprises cutting the adhesive tape in a range of a large diameter to a range slightly smaller than the outer diameter.

Images