JP2015162634A - Device of pasting protective tape to wafer and method of manufacturing wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device of pasting a protective tape to a wafer so as to efficiently seal the peripheral end of the wafer, and to provide a method of manufacturing a wafer to which a protective tape is pasted.SOLUTION: A device of pasting a protective tape to a wafer includes a protective tape pasting section (d) for pasting a protective tape A, having an external diameter larger than that of a wafer W, to the rear surface of the wafer W so as to project from the peripheral end of the wafer W, and an end sealing section (i) for pasting a protective tape B, having an external diameter larger than that of the wafer W, to the surface of the wafer W to which the protective tape A is pasted in the protective tape A pasting section, so as to project from the peripheral end of the wafer W, integrating the peripheral end of the protective tape A and the peripheral end of the protective tape B, and sealing the peripheral end of the wafer W.

Description

  The present invention relates to a device for applying a protective tape to a wafer. More specifically, the present invention relates to a device for applying a protective tape to a wafer that can efficiently seal the peripheral edge of the wafer and a method for manufacturing a wafer having a protective tape attached thereto.

  In the process of manufacturing a semiconductor, etching is performed to form a circuit on the surface of a semiconductor wafer (hereinafter simply referred to as a wafer), or plating for wiring or the like is performed on the back surface of the wafer. There is. When performing these steps, it is necessary to mask the portions that are not treated to prevent the adhesion of an etching solution, a plating solution, or the like. In order to prevent an etching solution, a plating solution, or the like from adhering, a protective tape may be attached to the wafer.

  An apparatus for adhering a protective tape to a wafer is formed by a wafer positioning unit, a protective tape adhering unit, a wafer conveying means, a protective tape cutting unit, and a tape conveying / adhering mechanism. It has a mounting table and a lifting platform, and the protective tape cutting part is formed by a pasting table, a circumferential cutter, an orientation flat cutter, a pasting roller and a peeling roller, and the tape transport pasting mechanism is a vacuum upper chamber. A device for applying a protective tape to a semiconductor wafer formed by a porous adsorption table has been proposed (for example, see Patent Document 1).

  In addition, when a protective tape that is approximately the same as or smaller than the outer diameter of the wafer is applied to the wafer, bubbles and wrinkles are not generated at the interface between the protective tape and the wafer, and the end of the protective tape does not peel off. As a protective tape affixing device that can be configured, a lower chamber that holds and holds a wafer such as a wafer on a mounting table, and a protective tape that is cut in the same shape as the wafer are sucked and held. The suction table is provided, and includes an upper chamber that forms a vacuum chamber integrally with the lower chamber, and a press ring that is externally fitted so as to be movable up and down is provided over the entire outer periphery of the suction table. Protection to a wafer configured such that the outer peripheral edge exposed from the adsorption table of the protective tape attached on the wafer is attached to the wafer Applier of-loop has been proposed (e.g., see Patent Document 2).

  The apparatus for attaching the protective tape to the wafer can attach the protective tape between the surface of the wafer and the protective tape adsorption surface of the adsorption table, and it is not necessary to press the wafer with an adhesion roller. Has the advantage that it is difficult to break.

  As described above, several apparatuses have been proposed as apparatuses for attaching a protective tape having an outer diameter that fits on the front or back surface of a wafer. However, when the apparatus is used, when the wafer is masked with the protective tape, when bubbles or wrinkles enter the part where the protective tape is applied, the etching solution, the plating solution, etc. enter from the part, There is a possibility that portions other than the necessary portion of the wafer are etched or plated. As described above, when a portion other than the necessary portion of the wafer is etched or plated, a circuit failure may occur and the quality of the wafer may be deteriorated.

  In general, a silicon wafer used for a wiring substrate is formed by applying a liquid resist such as a photosensitive resist on the silicon wafer, exposing the formed resist film through a mask having a predetermined shape, and performing dry etching. After the unexposed resist is removed, a plating film is formed on the surface by electroless plating (see, for example, claim 1 and paragraph [0037] of Patent Document 3).

  However, when a liquid resist is applied to a silicon wafer, the liquid resist may not adhere uniformly to the edge of the silicon wafer. In particular, under the recent thinning of the silicon wafer, the end portion of the silicon wafer has a knife edge shape, so that the liquid resist hardly adheres to the end portion of the knife edge shape. As described above, when the silicon wafer is exposed without the liquid resist uniformly adhering to the edge of the silicon wafer, when the electroless plating is performed on the silicon wafer, a plating film is formed on the exposed silicon wafer. Since the plating film is formed and easily peeled and detached, the device surface may be contaminated by peeling off and adhering to the device surface in a subsequent process such as dicing.

  Therefore, in recent years, development of a device for applying a protective tape to a wafer that can efficiently seal the peripheral edge of the wafer and a method for manufacturing a wafer having a protective tape attached thereto is awaited.

Japanese Patent No. 3607143 Japanese Patent No. 5273791 JP 2012-243897 A

  The present invention has been made in view of the above-described prior art, and a protective tape affixing device to a wafer capable of efficiently sealing a peripheral end portion of a wafer and a method for producing a wafer having a protective tape affixed thereto It is an issue to provide. Further, the present invention relates to a device for applying a protective tape to a wafer and a protective tape capable of preventing a plating film from being formed at the edge of the wafer when electroless plating is performed on a wafer such as a silicon wafer. It is an object of the present invention to provide a method for manufacturing a wafer to which is attached.

The present invention
(1) A protective tape applying apparatus for attaching a protective tape to a wafer,
An attaching portion of the protective tape A for attaching a protective tape A having an outer diameter larger than the outer diameter of the wafer to the back surface of the wafer so that the protective tape A protrudes from the peripheral end portion of the wafer;
A protective tape B having an outer diameter larger than the outer diameter of the wafer is attached to the surface of the wafer to which the protective tape A is applied at the application portion of the protective tape A by protruding from the peripheral edge portion of the wafer to protect it. A protection to a wafer, characterized by comprising an end sealing portion for integrating the peripheral end of the tape A and the peripheral end of the protective tape B and sealing the peripheral end of the wafer. Tape applicator,
(2) The protective tape sticking device according to (1), wherein the protective tape B is a ring-shaped protective tape having an outer diameter larger than the outer diameter of the wafer and an inner diameter smaller than the outer diameter of the wafer,
(3) A method of manufacturing a wafer to which a protective tape is attached, wherein the protective tape A having an outer diameter larger than the outer diameter of the wafer is applied so that the protective tape A protrudes from the peripheral edge of the wafer. The protective tape B is affixed to the back surface of the wafer, and the protective tape B having an outer diameter larger than the outer diameter of the wafer is applied to the front surface of the wafer to which the protective tape A is adhered so that the protective tape B protrudes from the peripheral edge of the wafer. After the affixing to the surface of the wafer, the peripheral end of the protective tape A protruding from the wafer and the peripheral end of the protective tape B are integrated to seal the peripheral end of the wafer (4) The method for producing a wafer having a tape attached thereto, and (4) the protective tape B is a ring-shaped protective tape having an outer diameter larger than the outer diameter of the wafer and an inner diameter smaller than the outer diameter of the wafer. Recorded in The method of manufacturing a protective wafer tape is affixed.

  According to the apparatus for applying a protective tape to a wafer and a method for producing a wafer having a protective tape attached thereto according to the present invention, an excellent effect is achieved in that the peripheral edge of the wafer can be efficiently sealed. In addition, according to the apparatus for applying a protective tape to a wafer and a method for manufacturing a wafer having a protective tape attached thereto according to the present invention, for example, when electroless plating is applied to a wafer such as a silicon wafer, It is possible to prevent the plating film from being formed.

It is a schematic plan view of the surface side which shows one embodiment of the wafer used for the sticking device of the protective tape to the wafer of this invention. It is a schematic plan view which shows one embodiment of the sticking device of the protective tape to the wafer of this invention. It is a schematic longitudinal cross-sectional view in CC section of the sticking device of the protective tape to the wafer of this invention shown by FIG. It is a schematic longitudinal cross-sectional view in the DD section of the sticking device of the protective tape to the wafer of this invention shown by FIG. It is a schematic left side view when a part of the upper chamber is cut away. FIG. 6 is a schematic plan view when a part of the upper chamber shown in FIG. 5 is cut away. It is explanatory drawing of the operation | movement which affixes a protective tape on an affixing table with the affixing apparatus of this invention. It is a schematic longitudinal cross-sectional view in the EE part shown by FIG. 6 at the time of sticking the protective tape A on a wafer with the sticking apparatus of this invention. It is a schematic longitudinal cross-sectional view in the EE part shown by FIG. 6 at the time of sticking the protective tape B on a wafer with the sticking apparatus of this invention. (A) And (b) is a schematic explanatory drawing at the time of affixing the protective tape A on a wafer with the sticking device of the protective tape to the wafer of this invention, respectively. (C) And (d) is a schematic explanatory drawing at the time of affixing the protective tape A to a wafer with the sticking device of the protective tape to the wafer of this invention, respectively. (E) And (f) is a schematic explanatory drawing at the time of affixing the protective tape A on a wafer with the sticking device of the protective tape to the wafer of this invention, respectively. (A)-(c) is a schematic explanatory drawing at the time of affixing the protection tape B on a wafer with the sticking device of the protection tape to the wafer of this invention, respectively. (D) And (e) is a schematic explanatory drawing at the time of affixing the protective tape B on a wafer, respectively, with the apparatus for applying a protective tape to a wafer of the present invention. (F) And (g) is a schematic explanatory drawing at the time of affixing the protective tape B on a wafer with the sticking device of the protective tape to the wafer of this invention, respectively. It is a schematic perspective view which shows one embodiment of the wafer by which the peripheral edge part of the wafer obtained by the manufacturing method of the wafer of this invention was sealed.

  As described above, the device for applying a protective tape to a wafer according to the present invention is a device for applying a protective tape for attaching a protective tape to a wafer, and has a protective tape A having an outer diameter larger than the outer diameter of the wafer. Is attached to the back surface of the wafer so that the protective tape A protrudes from the peripheral edge of the wafer, and the wafer to which the protective tape A is attached at the attaching portion of the protective tape A A protective tape B having an outer diameter larger than the outer diameter of the wafer is stuck on the surface of the wafer so as to protrude from the peripheral end of the wafer, and the peripheral end of the protective tape A and the peripheral end of the protective tape B are integrated. And having an end sealing portion for sealing the peripheral end portion of the wafer.

  Using the apparatus for applying a protective tape to a wafer of the present invention, the protective tape A having an outer diameter larger than the outer diameter of the wafer is applied to the back surface of the wafer so that the protective tape A protrudes from the peripheral edge of the wafer. Then, a protective tape B having an outer diameter larger than the outer diameter of the wafer is applied to the surface of the wafer on which the protective tape A is stuck so that the protective tape B protrudes from the peripheral edge of the wafer. After pasting, the peripheral end portion of the protective tape A protruding from the wafer and the peripheral end portion of the protective tape B are integrated, whereby the peripheral end portion of the wafer can be efficiently sealed.

  An apparatus for applying a protective tape to a wafer according to the present invention will be described in detail with reference to the following drawings. However, the present invention is not limited only to the embodiments described in the drawings. In each of the drawings, the thickness of the wafer, the thickness of the outer peripheral rib, and the width of the outer peripheral rib are all exaggerated for better understanding of the present invention, and do not necessarily indicate the actual thickness or width. It is not a thing.

  As a wafer used in the apparatus for applying a protective tape to a wafer of the present invention, for example, a wafer W having a disk shape can be used as shown in the schematic plan view on the surface side of the wafer in FIG. A notch Wa for positioning the wafer W is formed in a part of the outer periphery of the wafer W. On the outer peripheral edge of the back surface of the wafer W, for example, as shown in one embodiment of the wafer in FIG. 16, a convex portion (hereinafter referred to as an outer peripheral rib 91) is formed. For example, the outer peripheral rib 91 is ground on the back surface of the wafer W inside the portion where the outer peripheral rib 91 is provided, or the wafer W is formed such that the outer peripheral rib 91 is formed at the outer peripheral end of the wafer W. It can be formed by etching the back surface of.

  FIG. 2 is a schematic plan view showing an embodiment of a device for applying a protective tape to a wafer of the present invention. FIG. 3 is a schematic longitudinal sectional view taken along the line CC of the apparatus for applying a protective tape to a wafer of the present invention shown in FIG. FIG. 4 is a schematic longitudinal sectional view taken along the line DD of the apparatus for applying a protective tape to a wafer of the present invention shown in FIG.

  In the apparatus for applying the protective tape to the wafer, the attaching portion of the protective tape A includes the wafer supply / storage portion a, the positioning portion b, and the wafer W in the wafer supply / storage portion a one by one, and the positioning portion b. A wafer transport mechanism c for transporting the wafer W, a sticking portion d for the protective tape A for receiving and supporting the wafer W positioned by the positioning portion b, and a wafer W on the positioning portion b for the support tape A. A wafer transport mechanism e for transferring to the attaching part d and a protective tape cutting for cutting the protective tape A into a shape larger than the outer shape of the wafer W, located adjacent to the attaching part d of the protective tape A The protective tape A is moved between the part f, the attaching part d of the protective tape A and the protective tape cutting part f, and is held by adsorbing the protective tape A cut by the protective tape cutting part f. While transporting the only part d, having a tape transport applying mechanism g for adhering a protective tape A on the wafer W by the pasting part d of the protective tape A. These components may be provided on one machine base 1 as shown in the drawing, or may be provided on a plurality of machine bases (not shown).

  As the protective tape A that is attached to the wafer W, a protective tape that is slightly wider than the outer shape of the wafer W and formed in a roll shape can be used. The protective tape A is usually attached to the back surface of the wafer W, but may be attached to the front surface of the wafer W depending on circumstances.

  In the wafer supply / storage unit a, for example, the wafers W are stacked and stored in a storage cassette 2 that can be moved up and down so that the surfaces of the plurality of wafers W face upward. The wafer supply / storage unit a may be provided with a lifting mechanism (not shown) such as an elevator mechanism, for example, so that the wafer W can be lifted and lowered.

  The positioning part b is located close to the wafer supply / storage part a. The wafer transfer mechanism c has a transfer robot 3 that attracts the wafer W to the outer periphery thereof. The transfer robot 3 is configured to be able to move back and forth, up and down, upside down, and turn. By the transfer robot 3, the wafers W in the wafer supply / storage unit a can be taken out one by one and turned upside down, and then transferred to the positioning unit b.

  The transfer robot 3 transfers the wafer W by sucking the lower surface of the wafer W. Note that the transfer robot 3 may suck the upper surface of the wafer W. The transfer robot 3 is configured to suck the outer peripheral rib 91 on the back surface of the wafer W. Moreover, it is preferable that the transfer robot 3 is configured to be rotated by a driving source (not shown) such as a motor, for example, so that the suction hand portion at the tip is turned upside down. As the transfer robot 3, a non-contact type hand that can transfer the wafer W in a non-contact manner may be used.

  The positioning part b, the attaching part d of the protective tape A, and the protective tape cutting part f are all arranged in a straight line at the central part on the machine base 1.

  The positioning part b has a positioning table 4 for horizontally supporting the wafer W on the machine base 1. Above the positioning table 4, a holding frame 4 a that grips the outer peripheral portion of the wafer W from both sides and rotates the wafer W is formed. A rotary motor 6 is provided below the positioning table 4.

  The positioning table 4 is rotated by a rotary motor 6. After the wafer W is placed on the positioning table 4, the wafer W is sandwiched from both sides of the outer periphery by the holding frame 4 a, the wafer W is rotated together with the positioning table 4, and is provided above the vicinity of the positioning table 4. By detecting the notch Wa of the wafer W by the positioning sensor 5, the wafer W is placed on the positioning table 4 by positioning so that the notch Wa is arranged at a predetermined position and releasing the holding of the wafer W. The

  The attaching part d of the protective tape A for receiving the wafer W positioned by the positioning part b and attaching the protective tape A to the wafer W is placed in the lower chamber 7 fixed on the machine base 1. A mounting table 8 is provided for holding and adsorbing the wafer W horizontally. A plurality of lifting guides 12 are provided below the mounting table 8. The support plate 14 that supports the elevating guide 12 is connected to an elevating cylinder 13 that is fixed to a lower fixed frame outside the lower chamber 7, and the mounting table 8 is arranged so that it can move up and down. It is installed. In addition, it is preferable that each part of the movable part is sealed so as to maintain airtightness.

  The mounting table 8 is provided with suction pads 9 for sucking outer peripheral ribs 91 provided on the outer periphery of the back surface of the wafer W. The suction pad 9 communicates with the suction pipe 11. The suction pipe 11 is connected to a decompression pump (not shown) such as a vacuum pump. Thereby, the suction force can be generated in the suction pad 9.

  A plurality of through holes 83 are provided near the center of the mounting table 8. The through-hole 83 is configured so that the internal pressure of the lower vacuum chamber 7 and the pressure of the space existing in the inner peripheral portion of the back surface of the wafer W are the same.

  Further, the plurality of vent holes 10 are provided so as to communicate with each other through a line different from the through hole 83. The vent hole 10 is connected to an air line (not shown) outside the lower chamber 7 through a vent pipe (not shown). A valve (not shown) is connected to the air line so that outside air can be introduced or stopped via the air line.

  In order to transfer the wafer W in the positioning portion b to the attaching portion d of the protective tape A, a wafer transfer mechanism e is disposed on the machine base 1.

  The wafer transfer mechanism e is provided with an up-and-down suction hand 15 on the machine base 1 for sucking the upper surface (portion where the circuit pattern is not formed) of the outer peripheral rib 91 provided on the back surface of the wafer W. The guide rails 16 are disposed along the guide rails 16. The suction hand 15 is arranged so as to move between the positioning part b and the attaching part d of the protective tape A. The suction hand 15 can be disposed so as to be movable in the vertical direction by the cylinder 82.

  A motor 81 is connected to the suction hand 15. By driving the motor 81, the suction hand 15 can be reversed. The suction hand 15 sucks the wafer W positioned on the positioning table 4 disposed in the positioning portion b, and then moves the wafer W along the guide rail 16 to attach the wafer W to the adhesive tape A. It can be moved onto the placement table 8 of the part d. As the suction hand 15 for holding the wafer W, a non-contact type hand can be used.

  The protective tape cutting part f is disposed on the opposite side of the positioning part b with the attaching part d of the protective tape A interposed therebetween. The protective tape cutting part f has a pair of side plates 17 and 17 facing each other. At the center between the two side plates 17, 17, a sticking table 18 is horizontally provided at a height substantially equal to the upper end of the lower chamber 7. A cutting mechanism 19 is provided below the pasting table 18. The cutting mechanism 19 can freely move up and down and turn. The protective tape A attached to the attaching table 18 is cut out along the inner periphery of the circular hole 27 by the cutting mechanism 19.

  As shown in FIG. 4, between the two side plates 17, 17, a tape supply roll 20 around which a roll-shaped protective tape A is wound, a separator take-up roll 21, and excess protection after cutting out. A tape take-up roll 22 for winding the tape, a guide roller 23 for guiding the protective tape A drawn from the tape supply roll 20 downward, and a pair of guides for peeling the separator Ta from the protective tape A A roller 24, a guide roller 25, and a pair of guide rollers 26 for guiding the protective tape A to the tape take-up roll 22 are provided.

  The protective tape A from which the separator Ta has been peeled is close to the upper surface of the affixing table 18 in a substantially horizontal state with the adhesive surface of the protective tape A facing downward between the pair of guide rollers 24 and the guide roller 25. To do.

  The pasting table 18 is formed in a shape larger than the outer shape of the wafer W, as shown in FIGS. A circular hole 27 that is slightly larger than the outer diameter of the wafer W is formed in the center of the pasting table 18. Further, as shown in FIGS. 5 and 6, in order to prevent the support frame 49 and the support frame 50 provided in the upper chamber 44 of the tape conveying and pasting mechanism g from interfering with the upper surface of the pasting table 18. As shown in FIG. 7, notch portions 68 and 69 are provided in the pasting table 18.

  Above the affixing table 18, an adhering roller 28 above the protective tape A existing between the pair of guide rollers 24 and the guide roller 25, and a peeling roller 29 below the protective tape A, respectively. It is arranged so as to be rotatable along the moving direction of the protective tape A.

  As shown in FIG. 3, the cutting mechanism 19 is provided with a rotating shaft 93 having the same axis as the circular hole 27. A support plate 30 is attached to the rotating shaft 93 so as to be rotated by the motor 34. In the outer peripheral direction of the support plate 30, there is provided a movable table 32 that can move along the rail 35 and can be fixed at an appropriate position. A circumferential cutter 33 is attached to the movable table 32 and can be moved in the vertical direction by a cylinder or the like.

  When the circumferential cutter 33 rises upward, the circumferential cutter 33 breaks through a portion of the protective tape A on the attaching table 18 located in the circular hole 27 and turns by the rotational motion of the motor 34. Thereby, the protective tape A is cut out circularly.

  The diameter of the protective tape A is set to be larger than the outer diameter of the wafer W so that the sealing margin protrudes from the peripheral end of the wafer W. Accordingly, the diameter of the circumferential cutter 33 when turning is set to be larger than the outer diameter of the wafer W. The turning diameter of the circumferential cutter 33 can be easily adjusted by the movable table 32.

  The affixing roller 28 is installed on a bearing member 37 that can move in the front-rear direction. The affixing roller 28 can press and adhere the protective tape A onto the affixing table 18 by being driven using, for example, a driving device (not shown).

  The peeling roller 29 shown in FIG. 4 is installed on a bearing member 38 that can move in the front-rear direction. The peeling roller 29 is driven by using, for example, a driving device (not shown), so that the excess protective tape A adhered on the pasting table 18 after the protective tape A is cut out by the circumferential cutter 33 is removed. It can be peeled off from the upper surface of the affixing table 18.

  Frames 40 and 40 are horizontally provided on the opposing surfaces of the side plates 17 and 17. In addition, rails 41 and 41 are provided along the frame bodies 40 and 40. Sliders 66 and 67 are slidably fitted to the rails 41 and 41. A moving member 42 is provided between the sliders 66 and 67. The moving member 42 is disposed so as to be movable between a portion directly above the attaching portion d of the protective tape A and a portion directly above the protective tape cutting portion f by a driving means (not shown) such as a motor.

  An upper chamber 44 having an open lower surface is attached to the lower portion of the moving member 42 so as to move in the vertical direction via the elevating cylinder 43. A suction table 45 is provided in the upper chamber 44. The suction table 45 is formed by fitting a porous suction member into the table frame 46. A support plate 47 is fixed on the table frame 46. One end of the support plate 47 is provided with a spring 48 for biasing elasticity so that the suction table 45 is always inclined upward. A support frame 50 extends downward from the other end of the support plate 47. The support frame 50 is pivotally supported by a shaft 51 so as to be swingable on a support frame 49 that extends downward in the upper chamber 44.

  A rail 52 is laid on the support plate 47 along the support plate 47. On the rail 52, a swing roller 53 that can be driven in the horizontal direction by a driving device (not shown) such as a motor along the rail 54 attached to the upper surface of the inner surface of the upper chamber 44 is attached to the support frame 55. It is provided. The swing roller 53 is configured to move on the rail 52 in the horizontal direction.

  By moving the swing roller 53 in the horizontal direction from the lower tilt side of the suction table 45 toward the upper tilt side, the suction table 45 can be swung around the shaft 51 as a fulcrum. The shaft 51 holds the protective tape A of the suction table 45 in order to prevent the protective tape A and the wafer W from shifting in the horizontal direction when the protective tape A is attached to the wafer W by swinging the protective tape A. It is preferable to set so that the lower end of the slope of the surface becomes a fulcrum.

  In the adsorption table 45, as described above, the porous adsorbent is held in the table frame 46. The table frame 46 is configured to generate a suction force on the table surface of the suction table 45 via a suction pipe 65 connected to a decompression means (not shown) such as a vacuum pump, for example.

  The suction table 45 is a circular table having a diameter slightly smaller than the diameter of the inner peripheral grinding portion on the back surface side of the wafer W. When the upper chamber 44 descends immediately above the protective tape cutting part f, the suction table 45 is arranged coaxially with the circular hole 27 and is positioned on the circular hole 27 of the protective tape A, and the protective tape A is not adhered. Adsorbed from the surface side.

  When the upper chamber 44 descends directly above the lower chamber 7 of the attaching portion d of the protective tape A, the protective tape A held by the suction table 45 moves onto the wafer W placed on the placement table 8. To do. When the lower edge of the upper chamber 44 overlaps with the upper edge of the lower chamber 7, a sealed chamber (not shown) is formed by the upper chamber 44 and the lower chamber 7. The air in the sealed chamber that is formed is sucked from a vacuum adapter 58 that communicates with the decompression device by, for example, operating a decompression device (not shown) such as a vacuum pump. As a result, the atmosphere around the wafer W and the protective tape A is depressurized.

  The suction table 45 is formed in a circular shape having a diameter slightly smaller than the diameter of the inner peripheral grinding portion on the back surface side of the wafer W. On the other hand, the circular hole 27 of the attaching table 18 has a diameter slightly larger than the outer diameter of the wafer W. Accordingly, an annular gap is formed between the inner periphery of the circular hole 27 and the outer periphery of the suction table 45. The protective tape A is cut out in a circular shape by inserting a circumferential cutter 33 along the inner periphery of the circular hole 27. The cut-out protective tape A is held by suction on the lower surface of the suction table 45 with its outer peripheral portion protruding from the suction table 45.

  The suction table 45 can be formed by, for example, porous ceramics having open cells. The suction table 45 is configured so that a suction force to the protective tape A is generated on the entire surface thereof.

  The mounting table 8 is formed with a recess 8a having a diameter substantially the same as the inner diameter of the inner peripheral grinding portion of the wafer W. The mounting table 8 sucks the surface side corresponding to the outer peripheral rib 91 formed on the outer periphery of the mounted wafer W with the suction pad 9. A suction pad 9 is used for the mounting table 8. Instead of the suction pad 9, for example, a chuck mechanism that can be clamped from the outside to the inside of the outer periphery of the wafer W can be used.

  A plurality of vent holes 10 are provided radially on the inner peripheral surface of the recess 8a. Each vent hole 10 is in communication. The vent hole 10 communicates with the outside of the lower chamber 7 and communication means such as a hose and a vent pipe, and is connected to an air valve (not shown). The ventilation hole 10 can freely stop ventilation and ventilation by opening and closing a valve. Further, a plurality of through holes 83 are provided adjacent to the vent hole 10 and communicate with the inside of the lower chamber 7.

  The surface portion corresponding to the inner peripheral grinding surface of the wafer W sucked and held on the mounting table 8 is supported in a non-contact state with the concave portion 8a (see FIGS. 8 and 10). Since the through-hole 83 communicates with the inside of the vacuum chamber when the vacuum chamber is formed, the wafer W can be prevented from being deformed even when the inside of the vacuum chamber is in a reduced pressure state. Therefore, when the back surface side of the wafer W is held, the mounting table 8 can be prevented from coming into contact with the inner peripheral grinding surface of the wafer W. Further, when the front surface side of the wafer W is held, it is possible to prevent the mounting table 8 from coming into contact with the pattern forming surface.

  When a wafer W having a flat surface is used as the wafer W instead of the wafer W having a concave shape, an adsorbent such as porous ceramics is used for the mounting table 8 and the surface is not provided with the recess 8a. By using an adsorbent, the wafer W may be adsorbed on the entire surface of the mounting table 8.

  On the outer periphery of the suction table 45, an outer peripheral ring 63 is disposed so as to be slidable with the suction table 45. As shown in FIGS. 4, 5, 6, and 8, the outer peripheral ring 63 is fixed to the support frame 64 by bolts (not shown). Further, as shown in FIG. 8, the outer peripheral ring 63 has an outer diameter larger than the outer diameter of the protective tape A protruding from the peripheral end portion of the wafer W.

  As shown in FIG. 8, the support frame 64 is interposed via an elevating guide 72 disposed around a fixing pin 71 fixed to a notch portion formed at four positions of the table frame body 46. It is slidably provided. The support frame 64 is urged upward by a spring 73 inserted into the fixing pin 71 in the gap between the support frame 64 and the table frame body 46.

  The outer peripheral ring 63 and the support frame 64 are integrated and fixed. The outer ring 63 is urged upward by a spring 73 together with the support frame 64. When the support frame 64 is pressed, the outer peripheral ring 63 descends to a predetermined position together with the support frame 64 and presses the protective tape A protruding from the outer periphery of the suction table 45 against the outer peripheral rib 91 of the wafer W. At this time, the protective tape A is affixed to the wafer W in a state where the protective tape A protrudes from the peripheral end of the wafer W by the sealing margin of the peripheral end.

  Immediately above the outer ring 63 and the support frame 64, a pressing pin 62 for pushing down the support frame 64 is provided. The pressing pin 62 is provided at a position corresponding to the support frame 64 on the lower surface of the two support plates 61 and 61 that are suspended in the upper chamber 44 so as to be movable in the vertical direction.

  The support plate 61 is fixed to the lower ends of the guide shafts 60, 60 of the guides 57, 57 provided on the outer upper part of the upper chamber 44. The upper end of the guide shaft 60 is connected to an elevating plate 59 provided horizontally above the upper chamber 44. The elevating plate 59 is provided so as to be movable in the vertical direction by the action of a cylinder 56 fixed above the outside of the upper chamber 44. When the elevating plate 59 moves in the vertical direction, the pressing pin 62 moves in the vertical direction, and the outer peripheral ring 63 is pushed down.

  A support plate 70 is provided on the outer peripheral wall surface of the upper chamber 44 so as to protrude toward the attaching portion d of the protective tape A. A motor 84 is provided on the upper end of the support plate 70 facing downward. A support frame 74 is connected to the motor shaft of the motor 84. At both ends of the support frame 74, press rollers 75 are supported on the shaft. By driving the motor 84, the support frame 74 rotates, and the pressing rollers 75 and 75 press and roll on the outer peripheral rib 91 surface of the wafer W in the circumferential direction via the protective tape A.

  Next, an operation when the protective tape A is attached to the wafer W will be described with a focus on the embodiment shown in FIGS.

  In the embodiment described in FIGS. 3 and 4, the tape conveying and pasting mechanism g is initially waiting at the raised position immediately above the protective tape cutting portion f. The suction table 45 in the upper chamber 44 is held in an inclined posture. In the cutting mechanism 19 of the protective tape cutting section f, the circumferential cutter 33 is waiting at the lowered position. The protective tape A drawn out from the tape supply roll 20 is maintained in a predetermined stretched state such that the separator Ta is peeled off and the adhesive surface is directed downward between the guide roller 24 and the guide roller 25. The affixing roller 28 reciprocates as indicated by an arrow k in FIG. 4, and adheres the protective tape A to the upper surface of the affixing table 18 as shown in FIG. At this time, the peeling roller 29 is located behind the protective tape A on the collection side.

  In the state described above, the wafers W are taken out from the wafer supply / storage unit a one by one by the wafer transfer mechanism c. The wafer W is transferred to the positioning portion b so that the inner peripheral grinding surface on the back surface becomes the upper surface. The wafer W positioned by the positioning part b is supplied onto the mounting table 8 of the attaching part d of the protective tape A by the wafer transport mechanism e as shown in FIG. The mounting table 8 sucks and holds the positioned wafer W by the suction pad 9.

  The wafer W is supplied onto the mounting table 8 such that the inner peripheral grinding surface on the back surface faces upward. In the tape conveying and pasting mechanism g, after the swing roller 53 moves, the upper chamber 44 descends, whereby the suction table 45 is overlapped with the protective tape A, and the non-adhesive surface of the protective tape A is adsorbed on the lower surface thereof. .

  As shown in the embodiment of FIG. 10A, when the suction table 45 sucks the protective tape A, the circumferential cutter 33 of the cutter mechanism 19 rises, and the protective tape A extends along the inner periphery of the circular hole 27. The protective tape A is cut out in a circular shape by turning through and turning.

  The protective tape A cut out in a circular shape can be formed from the peripheral edge of the wafer W with an amount of protrusion of, for example, about 1 to 20 mm, but the present invention is limited by the amount of protrusion. Instead, the amount of protrusion can be changed as appropriate. The protective tape A protruding from the peripheral end portion of the wafer W in this way is sealed with the protective tape B and the peripheral end portion of the wafer W which are attached to the surface side of the wafer W in the subsequent process.

  The cut-off protective tape A is sucked and held on the lower surface of the suction table 45 and is prevented from falling off the suction table 45.

  The wafer W positioned by the positioning unit b is sucked by the outer peripheral rib 91 by the transfer robot 3 and transferred onto the mounting table 8. The wafer W transferred onto the mounting table 8 is held on the mounting table 8 by adsorbing the outer peripheral portion of the surface pattern forming surface by the suction pad 9. Since the recess 8a is formed on the table surface of the mounting table 8, it is possible to prevent the table surface and the pattern forming surface of the wafer W from coming into contact with each other.

  Next, as shown in the embodiment of FIG. 10B, when the circumferential cutter 33 moves to a predetermined lowered position, the upper chamber 44 rises. The upper chamber 44 moves onto the lower chamber 7 of the attaching portion d of the protective tape A. When the upper chamber 44 is moving, the swing roller 53 moves to the shaft 51 side. The suction table 45 holding the circular protective tape A by suction is in an inclined posture, and in this state, the upper chamber 44 moves downward and overlaps the lower chamber 7 to form a vacuum chamber.

  After the vacuum chamber is formed, the inside of the vacuum chamber is decompressed by a decompression device (not shown) such as a vacuum pump through the vacuum adapter 58. Thereafter, by raising the mounting table 8, the lower end portion of the inclined protective tape A comes into contact with the end portion of the wafer W in a state where it protrudes from the end portion of the attaching portion of the wafer W by the sealing margin. To do.

  The mounting table 8 is formed with a recess 8a in the inner peripheral portion so as not to contact the pattern forming surface of the wafer W. Further, the vent hole 10 provided in the recess 8a of the mounting table 8 communicates with the outside of the vacuum chamber, and air can be introduced from the outside by a valve (not shown). Since the through hole 83 is formed in the mounting table 8 so that the space in the concave portion of the wafer W is maintained at a pressure equivalent to the degree of pressure reduction in the vacuum chamber when the pressure in the vacuum chamber is reduced, suction by pressure reduction is performed. Therefore, the wafer W can be prevented from being deformed. Since there is a difference between the degree of decompression in the chamber and the adsorption pressure for imparting adsorptivity to the placement table 8 and the adsorption table 45, the placement table even when the chamber is in a reduced pressure state. The wafer W is held by 8, and the protective tape A is held by the suction table 45.

  Next, as shown in the embodiment of FIG. 11 (c), the adhesive tape 45 is held on the lower surface of the suction table 45 by swinging the suction table 45 in the horizontal direction. It is pressure bonded to the upper surface of the wafer W. Subsequently, the outer peripheral ring 63 is lowered, and the protective tape A protruding from the suction table 45 is attached to the outer peripheral rib 91 of the wafer W. The outer periphery of the portion of the mounting table 8 that holds the wafer W is subjected to a non-adhesive process (not shown) so that the portion protruding as the sealing margin of the protective tape A does not adhere. It is preferable.

  FIG. 8 is an enlarged schematic explanatory view of the main part in the embodiment shown in FIG. 11 (c), and corresponds to a vertical cross-section at the EE part of FIG.

  In FIG. 11C, after the suction table 45 swings and becomes horizontal, the pressing pin 62 is lowered by the action of the cylinder 56, whereby the outer peripheral ring 63 is pushed down against the spring 73. The outer peripheral ring 63 presses the portion of the protective tape A that protrudes from the suction table 45 against the outer peripheral rib 91 of the wafer W. At this time, since the protruding portion of the protective tape A is pressed against the wafer W under a reduced pressure atmosphere, air bubbles can be prevented from entering between the protective tape A and the wafer W, and wrinkles are generated in the protective tape A. Can be prevented. In order to prevent the adhesive of the protective tape A from adhering to the lower surface of the outer peripheral ring 63, a non-adhesive treatment part 63a is preferably formed.

  Next, as shown in the embodiment of FIG. 11D, the atmosphere is introduced into the vacuum chamber via the vacuum adapter 58, and the protective tape A and the wafer W are bonded. At this time, air is introduced into the concave portion 8a through the vent hole 10 and the pressure in the space of the concave portion 8a is increased, so that the wafer W is pressed against the suction table 45 side, and the protective tape A and the wafer W are bonded. Furthermore, it is stuck with good adhesion. At this time, since the amount of air introduced from the vent hole 10 is larger than the amount of air released from the through hole 83 to the outside of the recess 8a, the pressure in the space of the recess 8a is increased.

  Next, as shown in the embodiment of FIG. 12 (e), the upper chamber 44 is raised and the upper chamber 44 is retracted in the direction of the tape cutting portion f. As the upper chamber 44 moves backward, the presser roller 75 provided on the side of the upper chamber 44 is positioned above the outer peripheral rib 91 of the wafer W, in other words, the pivot center is positioned coaxially with the wafer W. By lowering the upper chamber 44 and driving a motor (not shown) to turn the pressing roller 75, the pressing roller 75 presses and rolls on the outer peripheral rib 91 of the wafer W via the protective tape A. As a result, the protective tape A is attached to the outer peripheral rib 91 of the wafer W with good adhesion. Further, the protective tape A is in a state of protruding outward from the peripheral edge of the wafer W by a sealing margin.

  Next, as shown in the embodiment of FIG. 12 (f), after the upper chamber 44 is positioned again on the attaching portion d of the protective tape A, the upper chamber 44 descends and overlaps with the lower chamber 7. A vacuum chamber (not shown) is formed.

  The wafer W on which the protective tape A has been attached is sucked and held on the suction table 45 as indicated by the two-dot chain line in FIG. Subsequently, the wafer W of the transfer robot 15 of the wafer transfer mechanism e shown in FIG. 2 is turned upside down by the operation of the motor 81 so that the suction surface becomes the upper surface, and then the transfer robot 15 is placed below the suction table 45. enter in. The transfer robot 15 receives the wafer W from the suction table 45 by moving up and down by the action of the cylinder 82. Thereafter, the transport robot 15 leaves the attaching part d of the protective tape A.

  Next, as shown by a two-dot chain line in FIG. 10A, the upper chamber 44 returns to the tape cutting portion f at the initial position and the pressing of the support frame 64 by the pressing pin 62 is released, thereby 73 causes the outer ring 63 to rise.

  The process of attaching the protective tape A to the wafer W is performed under reduced pressure (for example, 250 Pa). After the suction table 45 is stacked on the wafer W in an inclined state, the suction table 45 is swung horizontally. Thus, the air existing between the wafer W and the protective tape A can be discharged. Accordingly, it is possible to prevent bubbles from being generated between the wafer W and the surface to which the protective tape A is attached, and the protective tape A is sucked and held by the suction table 44 in a stretched state. It is possible to prevent wrinkles from appearing on A.

  After the protective tape A is cut out by the circumferential cutter 33, the peeling roller 29 moves toward the position when the application of the protective tape A shown in FIG. 4 is started, and the excess of the cut off protective tape A The portion is pulled away from the upper surface of the pasting table 18. Thereafter, the peeling roller 29 returns to the initial position. Further, the tape take-up roll 22 rotates, the protective tape A can be taken up by a predetermined length, and a new part of the protective tape A can be pulled out to the upper surface of the affixing table 18.

  The end sealing portion i for sealing the peripheral end portion of the wafer W is an outer portion larger than the outer diameter of the wafer W on the surface of the wafer W to which the protective tape A is attached at the attaching portion of the protective tape A. A protective tape B having a diameter protrudes from the peripheral end portion of the wafer W and is pasted, and the peripheral end portion of the protective tape A and the peripheral end portion of the protective tape B are integrated to seal the peripheral end portion of the wafer W. It is arranged to stop.

  The protective tape B is a ring-shaped protective tape having an outer diameter larger than the outer diameter of the wafer W and an inner diameter smaller than the outer diameter of the wafer W from the viewpoint of forming a region for mounting a semiconductor chip or the like on the surface of the wafer W. It is preferable that Therefore, in the following, the description will focus on the ring-shaped protective tape B having an outer diameter larger than the outer diameter of the wafer W and an inner diameter smaller than the outer diameter of the wafer W.

  When applying the protective tape B to the wafer W, a device for applying the protective tape B to the wafer W can be used. The apparatus for applying the protective tape B to the wafer W can be provided adjacent to the apparatus for applying the protective tape A to the wafer W.

  The device for applying the protective tape B to the wafer W adsorbs the protective tape cutting portion h for cutting the protective tape B into a shape larger than the outer shape of the wafer W and the protective tape B cut by the protective tape cutting portion h. The protective tape A has an attaching portion d for holding and attaching the protective tape B on the wafer W. In addition, in the said embodiment, the affixing part d of the protective tape A is shared with the affixing of the protective tape A. As shown in the drawing, these components may be provided on one machine base 1 or may be provided separately on a plurality of machine bases (not shown).

  As the protective tape B attached to the wafer W, a protective tape formed in a roll shape that is slightly wider than the outer shape of the wafer W can be used.

  Since the protective tape cutting portion h has substantially the same configuration as the protective tape cutting portion f shown in FIGS. 2 to 7, the same reference numerals are used for the common parts, and the common description is omitted.

  Note that the difference between the protective tape cutting part f and the protective tape cutting part h is that the diameter of the pressing part of the outer peripheral ring 63 in the tape transport and pasting mechanism g is different, and the suction table 79 in the protective tape cutting part h. The point which the porous body of the adsorption table 45 is not provided is mentioned. Another difference is that the presser roller 75 provided on the side of the upper chamber 44 is double in the upper chamber 80.

  As described above, the protective tape cutting portion h has substantially the same configuration as that of the protective tape cutting portion f. Therefore, the difference will be described, and the description regarding the portion having the same configuration will be omitted.

  A protective tape B is wound around the tape supply roll 20 in place of the protective tape A at the protective tape cutting portion h.

  A support plate 70 is provided on the outer peripheral wall surface of the upper chamber 80 so as to protrude toward the positioning portion b. A motor 84 is provided at the top of the tip of the support plate 70 facing downward. The motor shaft of the motor 84 is connected to the support frame 74. Two presser rollers 76 and 76 are pivotally supported at both ends of the support frame 74, respectively. By driving the motor 84, the support frame 74 rotates, and the pressing rollers 76, 76, 76, 76 are moved from the surface corresponding to the outer peripheral rib 91 of the wafer W and the peripheral end of the wafer W via the protective tape B. Press and roll in the circumferential direction on the sealing margin of the protruding protective tape B.

  Next, a description will be given of the end sealing portion i for attaching the protective tape B to the wafer W and sealing the protective tape A and the protective tape B at the peripheral end of the wafer W.

  Similar to the embodiment shown in FIG. 7, the affixing roller 28 in the protective tape cutting portion h presses and rolls on the affixing table 94 via the protective tape B. As a result, the protective tape B is affixed to the affixing table 94.

  As shown in the embodiment of FIG. 13A, the tape adsorbent 102 enters the protective tape cutting portion h, and the tape adsorbent 102 is placed on the circular hole 95 so as to be coaxial with the circular hole 95. To position.

  In the embodiment shown in FIG. 13A, the protective tape B is cut along the outer shape of the tape adsorbing body 102 and a circular hole is formed in the protective tape B. However, the circular hole is not necessarily formed. May be. However, from the viewpoint of forming a region for forming a pattern in advance on the surface of the wafer W, the protective tape B is cut along the outer shape of the tape adsorbent 102 as shown in the embodiment of FIG. It is preferable that a circular hole is formed in the protective tape B. The diameter of the circular hole 95 is formed to be larger than the sealing margin for sealing the peripheral end portion of the wafer W, but may be larger than the outer diameter of the sealing margin for sealing the peripheral end portion of the wafer W. .

  Thereafter, the tape adsorber 102 descends and adsorbs the protective tape B located in the circular hole 95 from the back surface of the affixing surface. Subsequently, the circumferential cutter 33 ascends upward, breaks through the outer peripheral portion of the tape adsorbing body 102 of the protective tape B adhered on the attaching table 94, and turns by the rotational motion of the motor 34. As a result, the protective tape B is cut into a circle having the same diameter as that of the tape adsorbent 102.

  Since the tape adsorber 102 is set to be smaller than the outer diameter of the wafer W, the diameter of the protective tape B is formed to be smaller than the outer diameter of the wafer W by about 1 to 10 mm, for example. . Therefore, the diameter of the circumferential cutter 33 when turning is set to be smaller than the outer diameter of the wafer W. Note that the diameter of the circumferential cutter 33 during turning can be easily adjusted by the movable table 32.

  Next, as shown in the embodiment of FIG. 13B, the tape adsorbent 102 moves from the protective tape cutting part h onto the unnecessary tape discarding part 105. At this time, the tape adsorber 102 holds the unnecessary tape 106 formed in a circular shape by suction. When the tape adsorbing body 102 is positioned on the unnecessary tape discarding section 105, the unnecessary tape 106 can be dropped into the unnecessary tape discarding section 105 by releasing the adsorption of the tape adsorbing body 102.

  An upper chamber 80 having an open lower surface is attached to the lower portion of the moving member 42 so as to move in the vertical direction via the elevating cylinder 43. A suction table 79 is provided in the upper chamber 80. The suction table 79 has an inner peripheral portion formed in a concave shape, and a suction pad 79a is provided on the outer peripheral portion of the concave portion. The suction pad 79a of the suction table 79 is configured such that a suction force is generated at the outer peripheral portion of the suction table 79 via a suction pipe 65 connected to a decompression means (not shown) such as a vacuum pump. ing.

  As shown in the embodiment of the end sealing portion i in FIG. 13C, the suction table 79 is a circular table having a diameter substantially the same as the outer diameter of the wafer W. When the upper chamber 80 descends just above the protective tape cutting portion h, the suction table 79 is arranged coaxially with the circular hole 95 and is positioned on the circular hole of the protective tape B, and the protective tape B is placed on its non-adhesive surface. Adsorb from the side. After the suction table 79 sucks the protective tape B, the circumferential cutter 33 rises and pierces the outer peripheral portion of the circular hole 95. Thereafter, the circumferential cutter 33 turns along the circular hole 95, whereby the protective tape B having a ring shape is formed. In the embodiment shown in FIG. 13C, a ring-shaped protective tape B having an outer diameter larger than the outer diameter of the wafer W by about 1 to 20 mm and having a circular hole is formed. If the protective tape B is not a circular hole, the suction table 79 may have the same structure as the suction table 45 used when the protective tape A is attached, in other words, the entire suction table.

  In parallel with the cutting of the protective tape B, as shown in the embodiment of FIG. 12 (f), the wafer W to which the protective tape A is attached is held on the back surface of the tape adsorbing body 102 and drives the motor 81. As a result, the transfer robot 15 is reversed so that the pattern formation surface of the wafer W becomes the upper surface. Thereafter, the tape adsorbing body 102 is moved onto the mounting table 8, and as shown in the embodiment of FIG. 13C, the wafer W is placed on the mounting table 8 so that the pattern forming surface is the upper surface. Placed.

  The suction table 79 is formed in a disk shape having a slightly smaller diameter than the outer diameter of the wafer W. The circular hole 95 of the attaching table 94 has a diameter slightly larger than the outer diameter of the wafer W so as to protrude from the peripheral end of the wafer W. An annular gap is formed between the inner periphery of the circular hole 95 and the outer periphery of the suction table 79. The protective tape B is cut into a circular shape by inserting a circumferential cutter 33 into the gap. The cut-out protective tape B is sucked and held by the suction pad 79a on the lower surface of the outer periphery of the suction table 79 with its outer peripheral portion protruding from the suction table 79. The suction table 79 is configured such that a circular concave portion is formed on the surface, and a suction force to the protective tape B is generated by a plurality of suction pads 79a formed on the outer peripheral wall surface of the concave portion. Further, the recess of the suction table 79 may be formed with a through hole (not shown) so that the same pressure as that in the vacuum chamber is obtained when the vacuum chamber is formed. The through hole communicates with the vacuum chamber.

  Next, as shown in the embodiment of FIG. 13 (c), the upper chamber 80 moves onto the pasting table 94. When the upper chamber 80 is moving, the swing roller 53 is moved to the side opposite to the shaft 51, whereby the suction table 79 is held in a horizontal state. The upper chamber 80 moves onto the protective tape cutting portion h and descends, whereby the suction table 79 is overlaid on the protective tape B in which a circular hole is formed. The suction table 79 sucks and holds the outer portion along the circular hole of the protective tape B by the suction pad 79a. Subsequently, the circumferential cutter 33 moves to the peripheral end portion of the circular hole 95 and rises to pierce the protective tape B. When the circumferential cutter 33 is rotated by the motor 34, the protective tape B is cut.

  By the above operation, the cut protective tape B is formed into a ring-shaped protective tape B having an outer diameter larger than the outer diameter of the wafer W and, if desired, an inner diameter smaller than the outer diameter of the wafer W.

  As shown in the embodiment of FIG. 14D, the upper chamber 80 is moved onto the attaching portion d of the protective tape A while returning the suction table 79 holding the protective tape B to the inclined posture. By moving in the direction, the upper chamber 80 and the lower chamber 7 are overlapped. The lower end portion of the inclined protective tape B comes into contact with the end portion of the bonded portion of the wafer W, and the atmosphere surrounded by the lower chamber 7 and the upper chamber 80 is sealed, so that a vacuum chamber is formed. . Thereafter, the inside of the vacuum chamber can be decompressed by a decompression device (not shown) such as a vacuum pump via the vacuum adapter 58. Since the through-hole 83 provided in the mounting table 8 communicates with the inside of the vacuum chamber, the wafer W in which a concave portion is formed on the inner peripheral surface by grinding the inner peripheral portion. Since the space in the recess is kept equal to the degree of decompression in the vacuum chamber, the wafer W can be prevented from being deformed by suction.

  Next, the mounting table 8 is raised in the vacuum chamber that is decompressed to raise the wafer W, and the wafer W is brought into contact with the inclined lower end of the protective tape B held on the suction table 79. Can do.

  Thereafter, as shown in the embodiment of FIG. 14 (e), the adhesive tape 79 is held on the lower surface of the suction table 79 by swinging the suction table 79 in the horizontal direction. Pressure bonded to the upper surface of W. Further, when the pressing ring 78 is lowered by the action of the cylinder 56, the sealing margins of the protective tape A and the protective tape B protruding from the outer periphery of the wafer W are pressed, and the peripheral end portion of the wafer W is sealed. . Since there is a difference between the degree of decompression in the chamber and the adsorption pressure for imparting adsorptivity to the adsorption table 45, the wafer W is held by the adsorption table 79 even when the chamber is in a reduced pressure state. Then, the protective tape B is sucked by the suction table 79.

  FIG. 9 is an enlarged explanatory view of a main part of the embodiment shown in FIG. 14 (e), and corresponds to a vertical cross section at the EE part of FIG. 6.

  After the suction table 79 swings and becomes horizontal, the pressing pin 62 is lowered by the action of the cylinder 56, whereby the pressing ring 78 is pressed down against the spring 73. The pressing ring 78 presses the portion of the protective tape B that protrudes from the suction table 79 against the protective tape A that protrudes from the peripheral end of the wafer W. At this time, since the protruding portion of the protective tape B is pressed against the protective tape A under a reduced pressure atmosphere, air bubbles can be prevented from entering between the protective tape B and the wafer W, and the protective tape A and Wrinkles can be prevented from occurring in the sealing portion of the protective tape B. In addition, in order to prevent the adhesive of the protective tape A and the protective tape B from adhering to the lower surface of the pressing ring 78, it is preferable that a non-adhesive treatment 78a is performed.

  Next, as shown in the embodiment of FIG. 15 (f), by introducing the atmosphere into the vacuum chamber, the protective tape B is pressed against the wafer W and also passes through the recess 8 a of the mounting table 8. By introducing the atmosphere from the pores 10, the pressure in the vacuum chamber and the pressure in the recess 8a are made equal. Further, since the vacuum chamber and a through hole (not shown) are also provided in the concave portion of the suction table 79, the pressure in the concave portion of the suction table 79 and the pressure in the vacuum chamber are kept equal. Thereby, the protective tape B can be adhered and adhered to the wafer W. Further, since the spaces formed on the front surface side and the back surface side of the wafer W are maintained at the same pressure, the wafer W is not damaged.

  Next, as shown in the embodiment of FIG. 15G, the upper chamber 80 rises, opens the vacuum chamber, and moves the upper chamber 80 toward the protective tape cutting portion h. When the center of rotation of the presser roller 76 provided on the side of the upper chamber 80 is coaxial with the wafer W, the upper chamber 80 is lowered and the presser roller 76 on the inner peripheral side moves over the peripheral end of the wafer W. The protective tape B is pressed. By pressing the sealing margin of the protective tape B protruding from the peripheral end portion of the wafer W by the pressing roller 76 on the outer peripheral side, the sealing portion 92 of the protective tape A and the protective tape B is formed at the peripheral end portion of the wafer W. Can be formed. In this state, by driving the motor 84, each press roller 76 is pressed and swiveled so that the protective tape B is brought into close contact with the surface of the wafer W and the protective tape A and the protective tape protruding from the peripheral edge of the wafer W are protected. The sealing portion 92 with the tape B is brought into close contact.

  The step of attaching the protective tape B to the wafer W can be performed under reduced pressure (for example, 250 Pa). After the suction table 79 is tilted and stacked on the wafer W, the air existing between the wafer W and the protective tape B can be discharged by swinging the suction table 79 in the horizontal direction. . Accordingly, it is possible to prevent bubbles from being generated between the wafer W and the attachment surface of the protective tape B, and the protective tape B is adsorbed and held by the adsorption table 79 in a stretched state. B can be prevented from wrinkling. In addition, since the sealing portion 92 at the peripheral end portion of the wafer W can be sealed by preventing generation of bubbles and wrinkles, the invasion of the plating solution and the etching solution can be prevented.

  Note that the unnecessary tape obtained by cutting the protective tape B is, for example, an unnecessary tape by a tape adsorbent 102 disposed in the elevating cylinder 100 via a guide 101 as shown in FIGS. The slider 103 connected to the elevating cylinder 100 is attached so as to be able to run on the rail 104, and the slider 103 is run on the rail 104, so that the tape adsorber 102 is placed on the upper portion of the unnecessary tape discarding unit 105. The unnecessary tape 106 can be dropped and collected in the unnecessary tape discarding unit 105 by moving and stopping the adsorption of the unnecessary tape 106 by the tape adsorbing body 102.

  As described above, the protective tape B is affixed to the surface of the wafer W to which the protective tape A is not adhered, and the end of the protective tape A and the end of the protective tape B protruding from the end of the wafer W By overlapping and integrating the wafers W, the wafer W in which the protective tape A and the protective tape B are adhered to both surfaces of the wafer W can be obtained.

  FIG. 16 shows an example of the wafer W in which the peripheral end of the protective tape A protruding from the wafer W and the peripheral end of the protective tape B are integrated as described above and the peripheral end of the wafer W is sealed. It is a schematic perspective view which shows an embodiment.

  Since the peripheral edge of the wafer W is completely covered with the protective tape A and the protective tape B, the wafer W has, for example, the outer peripheral edge of the protective tape A or the protective tape B when grinding the back surface of the wafer W. It is possible to prevent the sealing portion 92 and the wafer W from adhering surfaces of the protective tape A or the protective tape B from being peeled off and prevent the plating solution, the etching solution or the like from entering, and, for example, there is no problem with the wafer W such as a silicon wafer. It is possible to prevent a plating film from being formed at the edge of the wafer W when electrolytic plating is performed.

  In the present invention, instead of the protective tape, a tape such as a die bond tape or a dry film resist can be used as long as the object of the present invention is not impaired. In addition, when using a protective tape that requires heating, a heating means such as a heater may be appropriately installed on the mounting table.

  Further, in the wafer W, protrusions (peripheral ribs) are provided at the outer peripheral edge of the back surface, but the back surface may be flat.

  Further, in the present invention, the embodiment when the protective tape is automatically pasted on both surfaces of the wafer W has been described. However, in the embodiment in which the front surface and the back surface of the wafer W can be pasted by separate pasting apparatuses. There may be.

W Wafer Wa Wafer notch A Adhesive tape A
B Adhesive tape B
a Wafer supply / storage part b Positioning part c Wafer transfer mechanism d Affixing part of protective tape A e Wafer transfer mechanism f Protective tape cutting part g Tape transfer affixing mechanism h Protective tape cutting part i End sealing part 1 Machine base DESCRIPTION OF SYMBOLS 2 Storage cassette 3 Transfer robot 4 Positioning table 4a Holding frame 5 Positioning sensor 6 Rotating motor 7 Lower chamber 8 Mounting table 8a Recess 9 Adsorption pad 10 Vent hole 11 Suction pipe 12 Lifting guide 13 Lifting cylinder 14 Support plate 15 Transfer robot 16 Guide Rail 17 Side plate 18 Attaching table 19 Cutting mechanism 20 Tape supply roll 21 Separator take-up roll 22 Tape take-up roll 23 Guide roller 24 Guide roller 25 Guide roller 26 Guide roller 27 Circular hole 28 Attaching roller 29 Peeling roller 29 Rail 30 Support plate 32 Movable stand 33 Circumferential cutter 34 Motor 35 Rail 37 Bearing member 38 Bearing member 40 Frame body 41 Rail 42 Moving member 43 Lifting cylinder 44 Upper chamber 45 Adsorption table 46 Table frame body 47 Support plate 48 Spring 49 Support frame DESCRIPTION OF SYMBOLS 50 Support frame 51 Axis 52 Rail 53 Swing roller 54 Rail 55 Support frame 56 Cylinder 57 Guide 58 Vacuum adapter 59 Lifting plate 60 Guide shaft 61 Support plate 62 Pressing pin (pressing member)
63 Peripheral ring 63a Non-adhesive treatment part 64 Support frame 65 Suction pipe 66 Slider 67 Slider 68 Notch part 69 Notch part 70 Support plate 71 Fixing pin 72 Lifting guide 73 Spring 74 Support frame 75 Press roller 76 Press roller 78 Press ring 79 Suction table 79a Suction pad 80 Upper chamber 81 Motor 82 Cylinder 83 Through hole 84 Motor 91 Outer peripheral rib 92 Sealing portion 93 Rotating shaft 94 Sticking table 95 Circular hole 100 Lifting cylinder 101 Guide 102 Tape adsorber 103 Slider 104 Rail 105 Unnecessary tape Waste section 106 Unnecessary tape

Claims (4)

A protective tape application device for attaching a protective tape to a wafer,
An attaching portion of the protective tape A for attaching a protective tape A having an outer diameter larger than the outer diameter of the wafer to the back surface of the wafer so that the protective tape A protrudes from the peripheral end portion of the wafer;
A protective tape B having an outer diameter larger than the outer diameter of the wafer is attached to the surface of the wafer to which the protective tape A is applied at the application portion of the protective tape A by protruding from the peripheral edge portion of the wafer to protect it. A protection to a wafer, characterized by comprising an end sealing portion for integrating the peripheral end of the tape A and the peripheral end of the protective tape B and sealing the peripheral end of the wafer. Tape applicator.   2. The protective tape sticking apparatus according to claim 1, wherein the protective tape B is a ring-shaped protective tape having an outer diameter larger than an outer diameter of the wafer and an inner diameter smaller than the outer diameter of the wafer.   A method of manufacturing a wafer having a protective tape attached thereto, wherein the protective tape A having an outer diameter larger than the outer diameter of the wafer is placed on the back surface of the wafer such that the protective tape A protrudes from the peripheral edge of the wafer. A protective tape B having an outer diameter larger than the outer diameter of the wafer is applied to the surface of the wafer to which the protective tape A is attached so that the protective tape B protrudes from the peripheral edge of the wafer. After affixing on the surface, the peripheral end of the protective tape A protruding from the wafer and the peripheral end of the protective tape B are integrated to seal the peripheral end of the wafer. Method for manufacturing a manufactured wafer.   The method for producing a wafer having a protective tape attached thereto according to claim 3, wherein the protective tape B is a ring-shaped protective tape having an outer diameter larger than the outer diameter of the wafer and an inner diameter smaller than the outer diameter of the wafer.

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